With Reactant Nitrogen Or Sulfur Compound Patents (Class 523/428)
  • Patent number: 10626307
    Abstract: The present invention relates to an adhesive composition, an adhesive film, a method of manufacturing the adhesive film and an organic electronic device (OED) that are used to encapsulate an organic electronic element. The adhesive composition can form an encapsulant layer having an excellent adhesive property, impact resistance, heat-protecting property and moisture blocking property, so that an OED that includes an element encapsulated with the adhesive composition can exhibit an excellent lifespan property and durability.
    Type: Grant
    Filed: March 6, 2018
    Date of Patent: April 21, 2020
    Assignee: LG CHEM, LTD.
    Inventors: Hyun Jee Yoo, Yoon Gyung Cho, Suk Ky Chang, Jung-Sup Shim
  • Patent number: 10501618
    Abstract: Provided are an epoxy resin composition which contains an epoxy resin and a curing agent, and satisfies the following (1), (2), and (3): (1) the bending elastic modulus of a cured product of the epoxy resin composition is 3.3 GPa or higher; (2) the bending strain at break of the cured product of the epoxy resin composition is 9% or higher; and (3) the fiber-reinforced plastic ? formed of the cured product of the epoxy resin composition and a reinforcing fiber substrate in which carbon fibers, which are continuous fibers, are evenly aligned in one direction has 90° bending strength of 95 MPa or higher, and a film, a prepreg, and fiber-reinforced plastic that are produced by using the epoxy resin composition.
    Type: Grant
    Filed: December 2, 2014
    Date of Patent: December 10, 2019
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Tomoko Ishimoto, Manabu Kaneko, Tetsuya Atsumi, Kenichi Watanabe
  • Patent number: 10479858
    Abstract: A two-component curable epoxy resin system including a dye solution. The resin system includes an epoxy resin component containing at least 80% by weight of a polyglycidyl ether of a polyphenol. The system also includes a hardener mixture containing mainly polyethylene tetraamines. The system includes triethylene diamine in specific amounts as a catalyst. The system has beneficial curing characteristics with desired color that make it useful for producing fiber-reinforced composites in a resin transfer molding process.
    Type: Grant
    Filed: June 22, 2016
    Date of Patent: November 19, 2019
    Assignee: Dow Global Technologies LLC
    Inventors: Timothy A. Morley, Rainer Koeniger, Martin Reimers, Peter J. Cate, Nebojsa Jelic, Zeljko Sikman
  • Patent number: 10329464
    Abstract: A two-part adhesive is provided comprising: A) a curative part comprising: i) an epoxy curative; and ii) a reaction intermediate which is the reaction product of a suspension of core/shell rubber nanoparticles in a liquid epoxy resin and an excess of the epoxy curative; wherein the curative part comprises greater than 1.1 wt % core/shell rubber nanoparticles; and B) an epoxy part comprising: iii) a liquid epoxy resin; and iv) greater than 9.1 wt % core/shell rubber nanoparticles. In some embodiments, the epoxy part additionally comprises greater than 5.1 wt % solid epoxy resin, such as, e.g., triglycidyl ether of trisphenol-methane. In some embodiments, the sum of the wt % solid epoxy resin and the wt % core/shell rubber nanoparticles in the epoxy part is greater than 41.0%. In some embodiments, the sum of the wt % solid epoxy resin and the wt % core/shell rubber nanoparticles in the mixed adhesive is greater than 26.0%.
    Type: Grant
    Filed: February 1, 2016
    Date of Patent: June 25, 2019
    Assignee: 3M Innovative Properties Company
    Inventors: Lianzhou Chen, Jay S. Schlechte, George S. Stout, Rachel J. Squires
  • Patent number: 10227514
    Abstract: The present invention relates to an adhesive composition, an adhesive film, a method of manufacturing the adhesive film and an organic electronic device (OED) that are used to encapsulate an organic electronic element. The adhesive composition can form an encapsulant layer having an excellent adhesive property, impact resistance, heat-protecting property and moisture blocking property, so that an OED that includes an element encapsulated with the adhesive composition can exhibit an excellent lifespan property and durability.
    Type: Grant
    Filed: May 21, 2013
    Date of Patent: March 12, 2019
    Assignee: LG Chem, Ltd.
    Inventors: Hyun Jee Yoo, Yoon Gyung Cho, Suk Ky Chang, Jung Sup Shim
  • Patent number: 10176926
    Abstract: A composite electronic component includes a composite body in which a capacitor and an inductor are coupled to each other, the capacitor including a ceramic body in which a plurality of dielectric layers and first and second internal electrodes disposed to face each other with at least one among the plurality of dielectric layers interposed therebetween are stacked, and the inductor including a magnetic body including a coil part. The inductor and the capacitor are coupled to each other by an adhesive containing a first epoxy resin including a urethane modified epoxy (UME) resin, a second epoxy resin including a bisphenol A type resin, and a latent curing agent.
    Type: Grant
    Filed: April 20, 2016
    Date of Patent: January 8, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seong Min Chin, Je Ik Moon, Ye Eun Jung
  • Patent number: 10047205
    Abstract: The present invention relates to a prepreg which is manufactured by impregnating thermosetting resin composition and at least one thermoplastic additive into unidirectional carbon fiber, and to a resin composition for high speed curing prepreg for car body parts through press method and a prepreg product containing the same by differentiating a resin constituent, a resin equivalent weight, viscosity, gel time and glass transition temperature differing from those described in the prior art.
    Type: Grant
    Filed: May 25, 2016
    Date of Patent: August 14, 2018
    Assignee: Hankuk Carbon Co., Ltd.
    Inventors: Jeong Cheol Kim, Suk Won Kang, Dal Saem Jin, Il Seong, Seok Ju Park
  • Patent number: 9969909
    Abstract: There is provided an adhesive sheet for a semiconductor and a dicing tape integrated adhesive sheet for a semiconductor that are each good in cuttability when the sheets are each cut into individual pieces by expansion and are each good in embeddability into irregularities in a wiring board when the sheets are each molded thereto. An adhesive sheet for a semiconductor includes a resin composition containing a high-molecular-weight component and a filler, the breaking elongation of the adhesive sheet before curing is 40% or less at 0° C., and the elastic modulus of the adhesive sheet after curing is from 0.1 to 10 MPa at 175° C.
    Type: Grant
    Filed: November 7, 2008
    Date of Patent: May 15, 2018
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Masaki Yamada, Michio Mashino
  • Patent number: 9884959
    Abstract: A curable, epoxy-based resin composition that can be combined with reinforcement fibers and then cured to form a cured product that is excellent in toughness and exhibits high Open-Hole Tensile (OHT) strength. According to one embodiment, the resin composition contains a Bisphenol F difunctional epoxy, an anthracyl compound, a tri-functional epoxy, a thermoplastic polymer, and an amine-containing curing agent.
    Type: Grant
    Filed: December 15, 2015
    Date of Patent: February 6, 2018
    Assignee: Cytec Industries Inc.
    Inventors: Mark Richard Bonneau, Claude Billaud
  • Patent number: 9856354
    Abstract: By completing curing in a short period of time even at low temperatures and using an epoxy resin composition as a matrix resin of a prepreg, it is possible to obtain a fiber-reinforced composite plastic product such as a fiber-reinforced tubular composite with excellent mechanical properties and, more particularly, excellent impact resistance. The epoxy resin composition includes A component, B component, C component, D component and E component, where the content rate of sulfur atoms is equal to or more than 0.2 wt % and equal to or less than 7 wt %, and the content rate of the C component is equal to or more than 1 wt % and equal to or less than 15 wt %. A component: epoxy resins, B component: reactive products of the epoxy resins and an amine compounds including the sulfur atom in a molecule (the unreacted epoxy resins and/or the amine compounds may be included), C component: polyamide compounds soluble in the A component, D component: urea compounds, and E component: dicyandiamide.
    Type: Grant
    Filed: August 27, 2009
    Date of Patent: January 2, 2018
    Assignees: MITSUBISHI CHEMICAL CORPORATION, MRC COMPOSITE PRODUCTS CO., LTD.
    Inventors: Youhei Miwa, Tadayoshi Saitou, Masato Taguchi, Mikihiro Uchizono, Tetsuya Atsumi, Tsutomu Ibuki
  • Patent number: 9783681
    Abstract: Methods of compounding nanoparticles with a resin, e.g., a curable resin and one or more surface modifying agents are described. The methods use wet milling technology, including both continuous and batch milling processes, and can be used to functionalize the nanoparticles and disperse the functionalized nanoparticles into the resin system in a single process. Methods of compounding curable resin systems containing reactive diluents are also disclosed.
    Type: Grant
    Filed: October 21, 2010
    Date of Patent: October 10, 2017
    Assignee: 3M Innovative Properties Company
    Inventors: Peter D. Condo, Jung-Sheng Wu, Chad A. Haraldson, William J. Schultz, Emily S. Goenner, James E. Thorson, Wendy L. Thompson
  • Patent number: 9717963
    Abstract: An object of the present invention is to provide a golf club shaft having excellent strength. The present invention provides a golf club shaft made of a fiber-reinforced epoxy resin material comprising a cured product of an epoxy resin composition and a reinforcing fiber, wherein the epoxy resin composition comprises at least one selected from the group consisting of a bisphenol A type epoxy resin, a bisphenol F type epoxy resin and a novolac type epoxy resin, and a tetraglycidyl type epoxy resin as an epoxy resin component, and the cured product of the epoxy resin composition has a swelling ratio in a range from 20 mass % to 44 mass % in methyl ethyl ketone.
    Type: Grant
    Filed: June 6, 2014
    Date of Patent: August 1, 2017
    Assignee: DUNLOP SPORTS CO. LTD.
    Inventors: Yasuo Naito, Takehiko Hyodo, Kazuyoshi Shiga, Hiroshi Hasegawa
  • Patent number: 9701811
    Abstract: A composition comprising: (a) an epoxy resin composition comprising: (i) a first epoxy component comprising an epoxy resin having at least one oxazolidone ring structure; and (ii) a second epoxy component selected from the group consisting of a liquid epoxy resin, a divinylarene dioxide, and combinations thereof; (b) a core-shell rubber comprising a rubber particle core and a shell layer, and (c) a hardener, is disclosed.
    Type: Grant
    Filed: October 10, 2013
    Date of Patent: July 11, 2017
    Assignee: BLUE CUBE IP LLC
    Inventors: Yi L. Liang, Lameck Banda, Rui Xie
  • Patent number: 9683067
    Abstract: A nitrile group-containing copolymer rubber which has a hydroxyl group, carboxyl group, or carbon-carbon double bond at an end carbon atom or on a carbon atom which bonds with the end carbon atom is provided. The nitrile group-containing copolymer rubber is preferably obtained by a metathesis reaction. A nitrile group-containing copolymer rubber which is excellent in cross-linkability can be provided.
    Type: Grant
    Filed: March 20, 2014
    Date of Patent: June 20, 2017
    Assignee: ZEON CORPORATION
    Inventors: Arinobu Katada, Masato Sakamoto
  • Patent number: 9631046
    Abstract: A hardener composition comprising a) an accelerator comprising a first amine at least partially neutralized by salicylic acid and a first modifier; b) a non-isolated adduct of i) a difunctional epoxy; and ii) a second amine; and c) a second modifier, and a process for making the hardener composition, are disclosed. The hardener can be used with an epoxy resin to form a curable composition.
    Type: Grant
    Filed: July 17, 2013
    Date of Patent: April 25, 2017
    Assignee: BLUE CUBE IP LLC
    Inventor: Markus Schroetz
  • Patent number: 9617451
    Abstract: The present invention provides an adhesive composition having excellent strength in a cracked state, and is an adhesive composition characterized by containing a polyimide (A),a polyfunctional epoxy compound (B), an epoxy curing agent (C), and inorganic particles (D), the ratio of the polyimide (A) in a nonvolatile organic component being 3.0 wt % or more and 30 wt % or less, the ratio of the epoxy curing agent (C) in the nonvolatile organic component being 0.5 wt % or more and 10 wt % or less, and T/M being 400 or more and 8000 or less, where T is the total number of grams of the nonvolatile organic component, and M is the number of moles of epoxy groups in the nonvolatile organic component.
    Type: Grant
    Filed: January 9, 2015
    Date of Patent: April 11, 2017
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Takuro Oda, Daisuke Kanamori, Toshihisa Nonaka
  • Patent number: 9534157
    Abstract: A composition for an adhesive material, comprising at least one epoxide resin mixture and a hardening accelerator, in which the epoxide resin mixture has 25 to 80% by weight of a first epoxide resin—whereby the first epoxide resin is a bifunctional aliphatic, cycloaliphatic or aromatic epoxide resin—and 12.5 to 40% by weight of a second epoxide resin—whereby the second epoxide resin is a polyfunctional aliphatic or aromatic epoxide resin—and in which the hardening accelerator is an imidazole derivative, which is not soluble in the epoxide resin mixture at temperatures of below 50° C.
    Type: Grant
    Filed: February 4, 2014
    Date of Patent: January 3, 2017
    Assignee: VACUUMSCHMELZE GMBH & CO. KG
    Inventors: Lothar Zapf, Markus Brunner
  • Patent number: 9335212
    Abstract: A method of evaluating dispersion degrees of mixed epoxy resins includes, first, obtaining a resin mixture by mixing a plurality of aromatic epoxy resins, and taking a plurality of measurement samples from a plurality of sites of the resin mixture. The measurement samples are spectroscopically analyzed to obtain the spectra, and a plurality of common functional group peaks in the spectra are selected. The absorbances of the selected peaks are standardized to obtain absorbance ratios, based on the absorbance of a standard peak, in each of the spectra. Then, the standard deviations of the absorbance ratios of the selected peaks are calculated between the measurement samples. The maximum value of the obtained standard deviations is compared with a predetermined threshold value to evaluate the dispersion degrees of the aromatic epoxy resins.
    Type: Grant
    Filed: December 2, 2013
    Date of Patent: May 10, 2016
    Assignee: HONDA MOTOR CO., LTD.
    Inventor: Shuichiro Yoshida
  • Patent number: 9221955
    Abstract: A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2). (1) a thermoplastic resin particle or fiber [C] and a conductive particle or fiber [D] are contained, and weight ratio expressed by [compounding amount of [C] (parts by weight)]/[compounding amount of [D] (parts by weight)] is 1 to 1000. (2) a conductive particle or fiber of which thermoplastic resin nucleus or core is coated with a conductive substance [E] is contained.
    Type: Grant
    Filed: August 1, 2011
    Date of Patent: December 29, 2015
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Nobuyuki Arai, Norimitsu Natsume, Kenichi Yoshioka, Junko Kawasaki, Hiroshi Takezaki
  • Patent number: 9040607
    Abstract: An adhesive composition includes a first part comprising about 15 to about 60 wt % of an epoxy compound, about 35 to about 80 wt % of an epoxy novolac, and about 5 to about 25 wt % of an epoxy-based reactive diluent based on the total weight of epoxy compound, epoxy novolac, and reactive diluent; and a second part comprising less than about 20 wt % of a hydroxyaromatic solvent, about 80 to about 99 wt % of a Mannich base, and about 1 to about 20 wt % of a tertiary amine, based on the total weight of hydroxyaromatic solvent, Mannich base, and tertiary amine, the first and second parts being present in a volume ratio of about 0.8:1 to about 1.2:1. Additives to further enhance the properties may be included. A method of forming an adhesive layer includes applying the adhesive composition to a surface.
    Type: Grant
    Filed: March 13, 2012
    Date of Patent: May 26, 2015
    Assignee: BLACK & DECKER INC.
    Inventor: James E. Surjan
  • Patent number: 9012020
    Abstract: The present invention provides a blend comprising one or more epoxy resins and a mixture which comprises 0.3 to 0.9 amine equivalent, per equivalent of epoxide of the epoxy resin used, of a hardener component a) and as hardener component b) a compound of the formula I, a process for preparing this blend, the use of the blend of the invention for producing cured epoxy resin, and an epoxy resin cured with the blend of the invention.
    Type: Grant
    Filed: December 26, 2013
    Date of Patent: April 21, 2015
    Assignee: BASF SE
    Inventors: Lars Wittenbecher, Michael Henningsen, Gregor Daun, Dieter Flick, Joerg-Peter Geisler, Juergen Schillgalies, Erhard Jacobi
  • Patent number: 9012009
    Abstract: The present invention provides an epoxy resin adhesive composition and a perforated floor panel for a clean room including the same. The epoxy resin adhesive composition is a two-component epoxy resin adhesive composition comprising a main material including graphite having conductivity and a curing agent including a amide compound, wherein the main material and the curing agent are mixed at a weight ratio of 2:1. When this epoxy resin adhesive composition is disposed between a base panel and a resin tile constituting the perforated floor panel for a clean room, the adhesion between the base panel and the resin tile becomes high, heat is easily discharged to the outside by graphite, and the generation of static electricity can be reduced.
    Type: Grant
    Filed: November 29, 2012
    Date of Patent: April 21, 2015
    Assignee: Hae Kwang Co., Ltd.
    Inventor: Myun Soo Kim
  • Publication number: 20150099832
    Abstract: The present invention relates to an epoxy resin composition which comprises a phosphorus-containing modified epoxy resin (A) consisting of a compound (a) represented by Formula (a); a novolak epoxy resin (B); a hardener (C) for epoxy resins; and a metal hydroxide (D), wherein the content in mass % of the phosphorus-containing modified epoxy resin (A), CA, and the content in mass % of the metal hydroxide (D), CD, relative to the total amount of the epoxy resin composition, satisfy the following Formulas (1), (2), and (3): (1) 2.5CA+CD?45; (2) 6?CA?40; and (3) 3?CD?30. This epoxy resin composition can give a composite material which has excellent flame retardancy even when neither a halogenated flame retardant, nor red phosphorus, nor a phosphoric acid ester is contained therein. According to the invention, it is also possible to provide a prepreg and a fiber-reinforced composite material obtained using the prepreg.
    Type: Application
    Filed: December 15, 2014
    Publication date: April 9, 2015
    Applicant: Mitsubishi Rayon Co., Ltd.
    Inventors: Masao Tomioka, Manabu Kaneko, Kazutami Mitani
  • Patent number: 8986825
    Abstract: The invention relates to a resin curing agent having the formula (I), wherein R1 to R4 are each individually selected from linear or branched C1 to C5 alkyl, a process for its manufacture, blends of the reaction products, and two-component curable resin systems.
    Type: Grant
    Filed: March 1, 2011
    Date of Patent: March 24, 2015
    Assignee: Hexcel Composites Limited
    Inventors: Steve Mortimer, Neal Patel, John Cawse
  • Patent number: 8986799
    Abstract: The invention relates to compositions that can be used as coatings for the inner lining of cargo tanks. The compositions comprise a mixture of epoxy resins, a curing agent, an accelerator or mixture of accelerator(s), and one or more filler(s) or pigment(s), wherein the mixture of epoxy resins comprises 60-80 wt. % of an RDGE epoxy resin and 20-40 wt. % of an epoxy novolac resin, wherein the wt. % is based upon the total weight of the mixture of epoxy resins.
    Type: Grant
    Filed: March 5, 2012
    Date of Patent: March 24, 2015
    Assignee: Akzo Nobel Coatings International B.V.
    Inventors: Paul Anthony Jackson, Peter Robert Jones
  • Patent number: 8974905
    Abstract: A structural adhesive composition that is suitable for high-strength bonding of metals and aerospace structural materials. In one embodiment, the structural adhesive composition based on a two-part system, which is curable at or below 200° F. (93° C.). The two-part system is composed of a resinous part (A) and a catalyst part (B), which may be stored separately at room temperature until they are ready to be used. The resinous part (A) includes at least two different multifunctional epoxy resins with different functionality selected from difunctional, trifunctional, and tetrafunctional epoxy resins, certain toughening components, and inorganic filler particles as a rheology/thixotrophy modifying component. The toughening components include core-shell rubber particles with different particle sizes and at least one of an elastomeric polymer and a polyethersulfone polymer.
    Type: Grant
    Filed: October 13, 2014
    Date of Patent: March 10, 2015
    Assignee: Cytec Technology Corp.
    Inventors: Junjie Jeffrey Sang, Dalip Kumar Kohli, Kunal Gaurang Shah
  • Patent number: 8937116
    Abstract: The present invention relates to a sheet for forming a hard coating and a method of formation thereof. The present invention can provide a transfer material or a surface protection sheet having a high refractive index and superior physical properties, such as hardness, friction resistance, abrasion resistance, chemical resistance, transparency, luster, and the like, for forming a hard coating on the surface of various molded products, including resin molded products or wood products, and a method for forming a hard coating from such transfer material or surface protection sheets.
    Type: Grant
    Filed: February 9, 2011
    Date of Patent: January 20, 2015
    Assignee: LG Hausys, Ltd.
    Inventors: Yun-Bong Kim, Won-Kook Kim, Dong-Joo Gwon, Yang-Gu Kang, Jin-Woo Kim, Mu-Seon Ryu
  • Publication number: 20150017450
    Abstract: A resin composition which contains at least constituent elements (A)-(E) described below and wherein the epoxy resin (A) contains 80-100% by mass of a bifunctional epoxy resin and component (D) is contained in an amount of 60-85% by mass relative to 100% by mass of the total mass of the resin composition. This resin composition does not substantially contain a solvent and is in a liquid state at room temperature. (A) an epoxy rein (B) an amine-based curing agent (C) an accelerator that has at least one functional group selected from among a dimethylureide group, an imidazole group and a tertiary amino group (D) silica particles (E) a silane coupling agent Provided is a resin composition which has excellent curability at low temperatures and a sufficiently low linear expansion coefficient after curing. This resin composition does not suffer from warping in cases where applied to a copper thin film and molded, and does not suffer from separation or cracks even if a substrate obtained therefrom is bent.
    Type: Application
    Filed: January 21, 2013
    Publication date: January 15, 2015
    Inventors: Hideki Oka, Nobuyuki Tomioka, Shiro Honda
  • Publication number: 20150017449
    Abstract: A resin composition has high flame retardancy and excellent heat resistance, peel strength with copper foil, thermal expansion coefficient, heat resistance property upon moisture absorption, and electrical properties, a prepreg and single-layer or laminated sheet, a metal foil-clad laminate using the prepreg, and the like. The resin composition has polyphenylene ether (A) having a number average molecular weight of 500 to 5000, a phosphorus-containing cyanate ester compound (B) represented by formula (13), a cyclophosphazene compound (C), a halogen-free epoxy resin (D), a cyanate ester compound (E) other than the phosphorus-containing cyanate ester compound (B), an oligomer (F) of styrene and/or substituted styrene, and a filler (G), wherein a content of the phosphorus-containing cyanate ester compound (B) is 1 to 10 parts by mass based on 100 parts by mass of a total of the (A) to (F) components. wherein m represents an integer of 1 to 3.
    Type: Application
    Filed: March 14, 2013
    Publication date: January 15, 2015
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Syouichi Itoh, Emi Fukasawa, Yoshitaka Ueno, Michio Yaginuma
  • Patent number: 8928158
    Abstract: An epoxy resin composition for encapsulating a semiconductor device includes a curing agent, a curing accelerator, inorganic fillers, and an epoxy resin, the epoxy resin including a first resin represented by Formula 1: wherein R1 and R2 are each independently hydrogen or a C1 to C4 linear or branched alkyl group, and n is a value from 1 to 9 on average.
    Type: Grant
    Filed: May 23, 2012
    Date of Patent: January 6, 2015
    Assignee: Cheil Industries Inc.
    Inventors: Seung Han, Ju Mi Kim, Sung Su Park, Eun Jung Lee
  • Publication number: 20150001281
    Abstract: A heat-curable structural adhesive includes a non-rubber-modified epoxy resin, a reaction product of a carboxyl- or amine-terminated butadiene polymer or copolymer and a bisphenol F-based epoxy resin, a elastomeric toughener containing capped isocyanate groups, one or more epoxy curing agents a moisture scavenger and a heat activatable catalyst comprising a mixture of a solid or liquid tertiary amine compound that has a boiling temperature of at least 130° C. and a novolac resin. The structural adhesive develops excellent bonding properties when cured at moderate temperatures, especially from 120 to 170° C., and in addition performs very well in environmental aging stress testing. The adhesive is particularly good for bonding aluminum to another metal, or bonding aluminum to aluminum.
    Type: Application
    Filed: March 22, 2013
    Publication date: January 1, 2015
    Inventors: Gary L. Jialanella, Glenn G. Eagle, Dakai Ren, Andreas Lutz
  • Patent number: 8916656
    Abstract: A glass printing ink and a glass printing lacquer comprising at least one pigment, at least one photoinitiator, at least two resins and radicial photoinitiators. One resin is an epoxy resin having an average molecular weight based on bisphenol A, diluted in a UV hardening monomer. The other resin is a resin which contains free functional amino, hydroxy, epoxy, acid, acid anhydride and/or acrylate groups. Also, the use of the glass printing ink and glass printing lacquer when printing a glass substrate and to a method for printing a glass substrate.
    Type: Grant
    Filed: July 1, 2013
    Date of Patent: December 23, 2014
    Assignee: Marabu GmbH & Co., KG
    Inventors: Saskia Lehmann, Wolfgang Schaefer
  • Patent number: 8912254
    Abstract: A masterbatch composition, a method for the preparation of a masterbatch composition, a method for the preparation of a powder coating composition, a powder coating composition obtainable by said method as well as the use of a masterbatch composition for a powder coating composition or for increasing the opacity of a cured powder coating is disclosed.
    Type: Grant
    Filed: January 28, 2010
    Date of Patent: December 16, 2014
    Assignee: Huntsman International LLC
    Inventor: Philippe Gottis
  • Publication number: 20140357763
    Abstract: An epoxy system having a Part A and a Part B, where the Part A has an epoxy resin component present in a range of 20 weight percent (wt %) to 70 wt %, based on the total weight of the Part A; a flexibilizer present in a range from 20 wt % to 60 wt %, based on the total weight of the Part A; and a catalyst present in the range of 3 wt % to 7 wt % based on the total weight of the Part A, where the wt % of the components of the Part A of the epoxy system totals 100 wt %; and a Part B having a Mannich base hardener. Embodiments of the present disclosure also include a concrete structure that includes a reaction product of the epoxy system.
    Type: Application
    Filed: December 21, 2012
    Publication date: December 4, 2014
    Applicant: Dow Global Technologies LLC
    Inventors: Bharati Balijepalli, Rajesh H. Turakhia, Hemant A. Naik
  • Patent number: 8901207
    Abstract: It is an object of the present invention to provide an adhesive for electronic components that prevents warpage of electronic components and reflow cracks even in the case of bonding thin electronic components. The present invention relates to an adhesive for electronic components, comprising: an epoxy compound having an aliphatic polyether backbone and a glycidyl ether group; an epoxy group-containing acrylic polymer; an episulfide compound; and a curing agent, wherein the amount of the episulfide compound is 1 parts by weight or more, and less than 30 parts by weight relative to 100 parts by weight of the epoxy compound having an aliphatic polyether backbone and a glycidyl ether group.
    Type: Grant
    Filed: January 29, 2010
    Date of Patent: December 2, 2014
    Assignee: Sekisui Chemical Co., Ltd.
    Inventors: Akinobu Hayakawa, Hideaki Ishizawa, Kohei Takeda, Ryohei Masui
  • Patent number: 8895148
    Abstract: A structural adhesive composition that is suitable for high-strength bonding of metals and aerospace structural materials. In one embodiment, the structural adhesive composition based on a two-part system, which is curable at or below 200° F. (93° C.). The two-part system is composed of a resinous part (A) and a catalyst part (B), which may be stored separately at room temperature until they are ready to be used. The resinous part (A) includes at least two different multifunctional epoxy resins, toughening components, and inorganic filler particles. The catalyst part (B) includes an aliphatic or cyclic amine compound as a curing agent and inorganic filler. In another embodiment, the structural adhesive composition is based on a one-part system, which includes the components of the resinous part (A) mixed with a latent amine curing agent. The one-part system may further include an imidazole and/or an aliphatic amine.
    Type: Grant
    Filed: October 16, 2012
    Date of Patent: November 25, 2014
    Assignee: Cytec Technology Corp.
    Inventors: Junjie Jeffrey Sang, Dalip Kumar Kohli, Kunal Gaurang Shah
  • Patent number: 8877330
    Abstract: The present invention provides a light-weight fiber-reinforced composite material that has excellent flame retardance and mechanical properties and never emits a halogen gas. The present invention also provides a prepreg and en epoxy resin composition suited to obtain the above described fiber-reinforced composite material. The present invention also provides an integrated molding which is produced using the above described fiber-reinforced composite material, thereby suitable for use in electric/electronic casings. The epoxy resin composition is such that it contains the following components [A], [B] and [C]: [A] epoxy resin, [B] amine curing agent, and [C] phosphorus compound, wherein the concentration of the component [C] is 0.2 to 15% by weight in terms of phosphorus atom concentration.
    Type: Grant
    Filed: August 16, 2011
    Date of Patent: November 4, 2014
    Assignee: Toray Industries, Inc.
    Inventors: Masato Honma, Atsuki Tsuchiya, Ryuji Sawaoka
  • Publication number: 20140322541
    Abstract: A halogen-free resin composition, a copper clad laminate using the same, and a printed circuit board using the same are introduced. The halogen-free resin composition comprising (A) 100 parts by weight of epoxy resin; (B) 3 to 15 parts by weight of diaminodiphenyl sulfone (DDS); and (C) 5 to 70 parts by weight of phenolic co-hardener. The halogen-free resin composition features specific ingredients and proportion to thereby achieve satisfactory maximum preservation period of the prepreg manufactured from the halogen-free resin composition, control the related manufacturing process better, and attain satisfactory laminate properties, such as a high degree of water resistance, a high degree of heat resistance, and satisfactory dielectric properties, and thus is suitable for producing a prepreg or a resin film to thereby be applicable to copper clad laminates and printed circuit boards.
    Type: Application
    Filed: August 10, 2013
    Publication date: October 30, 2014
    Applicant: Elite Electronic Material (Kunshan) Co., Ltd
    Inventors: RONG-TAO WANG, LI-CHIH YU, YU-TE LIN, YI-JEN CHEN, WENJUN TIAN, ZIQIAN MA, WENFENG LU
  • Publication number: 20140309337
    Abstract: Provided are: a fiber-reinforced composite material which is suppressed in morphology variation due to the molding conditions, while having excellent mode I interlaminar fracture toughness and excellent wet heat resistance; an epoxy resin composition for obtaining the fiber-reinforced composite material; and a prepreg which is obtained using the epoxy resin composition. An epoxy resin composition for fiber-reinforced composite materials, which contains at least the following constituent elements [A]-[F], and which is characterized by containing 5-25 parts by mass of constituent element [C] and 2-15 parts by mass of constituent element [E] per 100 parts by mass of the total epoxy resin blended therein. [A] A bifunctional amine type epoxy resin. [B] A tetrafunctional amine type epoxy resin. [C] A bisphenol F type epoxy resin having an epoxy equivalent weight of 450-4,500. [D] An aromatic amine curing agent. [E] A block copolymer having a reactive group that can be reacted with as epoxy resin.
    Type: Application
    Filed: December 25, 2012
    Publication date: October 16, 2014
    Inventors: Maki Nagano, Yuko Shimizu, Nobuyuki Tomioka
  • Patent number: 8779036
    Abstract: The present invention relates to epoxy resin formulations comprising a specific catalyst mixture for enhancing the reactivity thereof.
    Type: Grant
    Filed: March 16, 2010
    Date of Patent: July 15, 2014
    Assignee: Evonik Degussa GmbH
    Inventors: Emmanouil Spyrou, Holger Loesch, Marion Ebbing-Ewald, Andrea Diesveld
  • Publication number: 20140186536
    Abstract: A curable epoxy resin composition including (a) at least one epoxy resin; and (b) at least one hardener; wherein the curable epoxy resin composition has at least two exotherm peaks representing at least two distinct chemical reactions and wherein the exothermic peak difference of the two exotherm peaks is sufficient to allow the curable epoxy resin composition of being B-staged.
    Type: Application
    Filed: July 18, 2012
    Publication date: July 3, 2014
    Inventors: Angela I. Padilla-Acevedo, Ludovic Valette, Michael J. Mullins, Kandathil E. Verghese, Mark B. Wilson
  • Patent number: 8758549
    Abstract: The present invention relates to heat-curable compositions containing a mixture of reactive epoxy resins that contains, based on the mass of all epoxy resins, a) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with polypropylene glycol which has an epoxy equivalent weight of at least 250 g/eq, and b) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with a novolac resin which has an epoxy equivalent weight of at least 175 g/eq, and at least one latent hardener.
    Type: Grant
    Filed: November 5, 2012
    Date of Patent: June 24, 2014
    Assignee: Henkel AG & Co. KGaA
    Inventors: Pablo Walter, Mustapha Benomar, Stefan Kreiling, Angelika Troll, Rainer Schoenfeld
  • Patent number: 8741426
    Abstract: The present invention provides a blend comprising one or more epoxy resins and a mixture which comprises 0.3 to 0.9 amine equivalent, per equivalent of epoxide of the epoxy resin used, of a hardener component a) and as hardener component b) a compound of the formula I, a process for preparing this blend, the use of the blend of the invention for producing cured epoxy resin, and an epoxy resin cured with the blend of the invention.
    Type: Grant
    Filed: July 17, 2009
    Date of Patent: June 3, 2014
    Assignee: BASF SE
    Inventors: Lars Wittenbecher, Michael Henningsen, Gregor Daun, Dieter Flick, Joerg-Peter Geisler, Juergen Schillgalies, Erhard Jacobi
  • Patent number: 8686069
    Abstract: The solvent resistance of epoxy resins toughened with polyethersulfone is improved by using low molecular weight polyethersulfone. The resulting thermoplastic toughened epoxy resins are useful for making prepreg for aerospace applications.
    Type: Grant
    Filed: October 12, 2010
    Date of Patent: April 1, 2014
    Assignee: Hexcel Corporation
    Inventor: Yen-Seine Wang
  • Publication number: 20140069583
    Abstract: Epoxy resin compositions contain (i) a polyepoxide resin; (ii) a benzofuran diol component, a benzofuran di-epoxide component, or mixture thereof; and (iii) a curing agent, which upon curing, provides a cured resin exhibiting improved chemical and physical characteristics. The epoxy resin composition may also contain a toughening agent to further enhance the cured resin's physical characteristics.
    Type: Application
    Filed: May 4, 2012
    Publication date: March 13, 2014
    Inventors: Derek Scott Kincaid, Dong Le, David Lanham Johnson
  • Patent number: 8668983
    Abstract: The present invention provides an epoxy resin composition for a fiber reinforced composite material comprising an epoxy resin (A) comprising an epoxy resin (a1) having a weight average molecular weight of up to 1,000 and an epoxy resin (a2) having a weight average molecular weight of 10,000 to 100,000 which contains at least 20% by weight of the basic skeleton of the epoxy resin (a1), a thermoplastic resin (B), and a curing agent (C). The cured composition has a co-continuous phase of the epoxy resin (A) and the thermoplastic resin (B) and/or a continuous phase of the thermoplastic resin (B). A cured product having a high toughness can be obtained from this epoxy resin composition.
    Type: Grant
    Filed: December 12, 2007
    Date of Patent: March 11, 2014
    Assignee: The Yokohama Rubber Co., Ltd.
    Inventors: Masayuki Kawazoe, Hiroyuki Okuhira, Koichiro Miyoshi, Tomohiro Ito, Takashi Kousaka, Mitsuhiro Iwata
  • Patent number: 8663803
    Abstract: A varnish composition includes composition (A): an epoxy resin, composition (B): a hardener, composition (C): an accelerator, composition (D): phosphor-containing flame retardant, and composition (E): fillers, wherein composition (A) includes composition (A-1): phosphor-containing epoxy resin, phosphor-containing and silicon-containing epoxy resin, or a mixture thereof; composition (A-2): dicyclopentadiene epoxy resin; and composition (A-3): oxazolidone epoxy resin.
    Type: Grant
    Filed: November 29, 2010
    Date of Patent: March 4, 2014
    Assignee: ITEQ Corporation
    Inventors: Li-Chun Chen, Chun-Chieh Huang
  • Patent number: 8657413
    Abstract: A die attach composition is used for bonding a silicon chip on a flat substrate. The die attach composition includes a cross-linkable epoxy resin having a rigid backbone, an epoxy siloxane resin, a fumed silica filler, an amine curing agent, and a silane coupling agent. The die attach composition is particularly useful in bonding silicon heater chips on flat ceramic substrate in forming an inkjet printhead assembly. The die attach composition allows accurate placement of silicon heater chips on flat ceramic substrate and exhibits good ink resistance.
    Type: Grant
    Filed: January 18, 2011
    Date of Patent: February 25, 2014
    Assignee: Funai Electric Co., Ltd.
    Inventors: David Graham, Jeanne Marie Saldanha Singh, Richard D. Wells, Joel Provence
  • Patent number: 8642709
    Abstract: The subject matter of the present Application is two-component compositions whose first component is a mixture of reactive epoxy resins and optionally further formulation constituents which contains, based on the mass of all epoxy resins, a) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with polypropylene glycol which has an epoxy equivalent weight of at least 250 g/eq, and b) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with a novolac resin which has an epoxy equivalent weight of at least 175 g/eq, and whose second component contains at least one thiol group-containing hardener for epoxy resins.
    Type: Grant
    Filed: September 21, 2012
    Date of Patent: February 4, 2014
    Assignees: Henkel AG & Co. KGaA, Henkel US IP LLC
    Inventors: Pablo Walter, Mustapha Benomar, Stefen Kreiling, Angelika Troll, Rainer Schoenfeld, Timothy Walsh
  • Publication number: 20140011918
    Abstract: A polymeric formulation comprising at least one first epoxy resin having a density between 100 and 10,000 Pa·s, a blocked isocyanate, a polymer comprising hydroxy functional groups, a thermoplastic resin and a cross-linking agent, the polymer comprising hydroxyl functional groups with a hydroxyl content in the range 0.65 to 0.95 meq/g, the isocyanate-equivalents-to-polymer-OH-equivalents rate being in the range 0.60 to 1.1. The first epoxy resin is substantially semisolid at room temperature, the formulation comprising at least one second epoxy resin substantially liquid at room temperature, the first and second epoxy resins being present in a weight ratio from 60:40 to 80:20. These formulations are advantageously used for manufacturing prepregs and articles of composite material according to a dry winding process. By virtue of improved stability, a higher glass transition temperature, and a rheological profile result which can be chemically tailored to the needs of the impregnation/dry winding process.
    Type: Application
    Filed: March 29, 2012
    Publication date: January 9, 2014
    Inventors: Bruno D'Andrea, Anna DiCosmo, Valeria Vinti