Abstract: A &agr;,&ohgr;-methacrylate terminated epoxide-carboxylic acid macromonomer compound formed by reaction of at least one diepoxide, at least one dicarboxylic acid and at least one unsaturated mono-carboxylic acid and having the general formula 1: wherein R is an aromatic moiety formed from a diepoxide R′ is a substituted or unsubstituted aliphatic, araliphatic, cycloaliphatic or aromatic moiety formed from a dicarboxylic acid, R″ is hydrogen, a substituted or unsubstituted aliphatic, araliphatic, aromatic or cycloaliphatic moiety formed from a mono-carboxylic acid, and n is an integer from 1 to 20.

Abstract: A polymeric composition for making semiconductor device packaging includes at least one epoxy resin, at least one curing agent in an amount between 30 and 110 parts by weight per 100 parts by weight of the epoxy resin, at least one silica-based reinforcing filler in an amount between 300 and 2300 parts by weight per 100 parts of the epoxy resin, and at least one control agent for a rheology of the polymeric composition. The at least one control agent may be substantially free from polar groups and present in an amount between 0.1 and 50 parts by weight per 100 parts by weight of the epoxy resin. The invention also relates to a plastic packaging material for microelectronic applications which may be obtained from the above polymeric composition, and to a semiconductor electronic device including such packaging material.

Abstract: There is provided an epoxy resin composition, which has superior resistant property to SF6 gas, mechanical strength and cracking resistance in a well balanced manner and which can provide an insulating molded article having a low dielectric constant. The epoxy resin composition for an SF6-gas insulating device of the present invention is obtained by adding a silicate compound powder to an epoxy resin.

Abstract: A conductive via filler for printed wiring boards capable of reducing copper oxides and thereby eliminating a cleaning step in printed wiring board construction, the conductive via filler consisting essentially of silver flake, a resin, a hardener, and a titanate coupling compound. The filler or paste may further include one or more of a flexibilizer, a solvent, and/or an accelerator. It is a feature of the invention that extensive pre-cleaning of copper substrates is obviated.

Abstract: The invention provides polyamide resin compositions with good mechanical properties and dimensional stability during water absorption. Polyamide resin composition, comprising 100 parts by weight of resin contents composed of (A) 60 to 98% by weight of polyamide resin, (B) 40 to 2% by weight of polyolefine resin having dicarboxylic acid anhydride groups, as well as (C) 0.3 to 30 parts by weight of triazine-containing layered silicate with intercalated triazine compound derivatives with at least one positive charge.

Abstract: In a semiconductor-sealing liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) a curing agent, and (C) an inorganic filler, the inorganic filler has such a controlled particle size distribution that the composition provides improved interstitial infiltration and has a low modulus of elasticity in the cured state.

Abstract: In a liquid epoxy resin composition comprising a liquid epoxy resin and an inorganic filler, a specific imidazole compound having a solubility of up to 1% by weight in the epoxy resin, a melting point of at least 170° C., a mean particle diameter of 1-5 &mgr;m, and a maximum particle diameter of up to 20 &mgr;m is used as a curing accelerator. The resulting composition is suited as a sealing material for flip-chip type semiconductor devices since it has improved thin-film infiltration and storage stability.

Abstract: A chemical anchoring adhesive includes first and second parts each having a highly viscous, putty-like consistency. The first and second parts are joined directly to each other along an interface. The first part includes a resin, and the second part includes a curing agent. The anchoring adhesive does not require separate encapsulation of one or both parts, and can be formed and cut to desired sizes and quantities at any stage before insertion into a borehole.

Abstract: In an epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler, the filler is porous silica having a specific surface area of 6-200 m2/g, a true specific gravity of 2.0-2.2, and a mean particle size of 2-50 &mgr;m. The epoxy resin composition is readily moldable, has a low moisture permeability and reliability in the cured state, and is suitable for forming a premolded hollow semiconductor package.

Abstract: Mold compounds for encapsulating semiconductors are disclosed. The compounds achieve high levels of adhesion to uncleaned printed wiring board substrates by minimizing the level of silicone fluid in the compound. Methods for encapsulating semiconductor dies and processes for encapsulating the dies also are disclosed.

Abstract: An adhesive composition, which comprises either an A- or B-side epoxy, and further includes a plurality of microspheres blended into either the A-side epoxy alone, the B-side epoxy alone, or into both. The microspheres of the invention are preferably made of a thermoplastic shell. As a result of the use of this adhesive between two substrates, a thin, strong bond may be formed between those two substrates. The bond is formed by a combination of an epoxy and a plurality of the microspheres. This epoxy and microsphere combination substantially inhibits seepage of the epoxy through the holes in a first, porous substrate.

Abstract: By removing a fraction of fine particles having a particle size of less than 2 &mgr;m from starting inorganic filler particles having a mean particle size of 10-50 mm and adding thereto particles having a mean particle size of 0.1-2 &mgr;m and a specific surface area of 3-10 m2/g (BET), there is obtained a particulate inorganic filler having a mean particle size of 5-40 &mgr;m. When a large amount of the inorganic filler is loaded in an epoxy resin composition, the composition maintains a low melt viscosity enough to mold and is effective for encapsulating a semiconductor device without causing die pad deformation and wire deformation. The encapsulated semiconductor device is highly reliable.

Abstract: A composition, which comprises (a) a compound containing at least one epoxy group in inner position per molecule, obtained by epoxidation of a natural unsaturated oil or of its derivative; (b) an epoxy compound selected from the group consisting of glycidyl ethers, glycidyl esters and cycloaliphatic epoxides; (c) a polycarboxylic acid anhydride; (d) a compound of formula I, I, III or IV or an acid adduct of a compound of formula I, II, III or IV  wherein R1 to R4 are each independently of one another hydrogen; C1-C18alkyl which is unsubstituted or substituted by one or more than one hydroxyl group amino group, halogen atom, cyano group, C1-C6alkoxy group or C1-C6cyanalkoxy group; C5-C14aryl, C6-C24aralkyl, C3-C14heteroaryl or C4-C14heteroaralkyl which are unsubstituted or substituted by one or more than one C1-C6alkyl group, C1-C6alkoxy group or halogen atom,  n is an integer from 1 to 3, and  R5 and R6 are each independently of the other C1-C6alkyl or, together with the

Abstract: A liquid epoxy resin potting material comprising four components: component A, a liquid epoxy resin; component B, a liquid alkylated diaminodiphenylmethane; component C, an epoxidized polybutadiene elastomer; and component D, an inorganic filler, wherein the weight ratios of components A, B, C and D are:A/(A+B)=about 0.65 to about 0.80C/(A+B)=about 0.01 to about 0.05 andD/(A+B+C+D)=about 0.50 to about 0.80.

Abstract: The present invention provides an epoxy resin composition, comprising:(A) a phenol epoxy resin represented by the following formula (I) ##STR1## wherein each R.sup.1 is the same or different and is independently selected from the group consisting of hydrogen, C.sub.1 to C.sub.6 hydrocarbyl groups, C.sub.6 to C.sub.10 aromatic groups, and C.sub.1 to C.sub.6 hydrocarbyl-substituted C.sub.6 to C.sub.10 aromatic groups,each R.sup.2 is the same or different and is independently selected from the group consisting of hydrogen, C.sub.1 to C.sub.6 hydrocarbyl groups, C.sub.6 to C.sub.10 aromatic groups, and C.sub.1 to C.sub.6 hydrocarbyl-substituted C.sub.6 to C.sub.10 aromatic groups, ##STR2## wherein R.sup.3 is selected from the group consisting of hydrogen, C.sub.1 to C.sub.6 hydrocarbyl groups, C.sub.6 to C.sub.10 aromatic groups, and C.sub.1 to C.sub.6 hydrocarbyl-substituted C.sub.6 to C.sub.10 aromatic groups, each R.sup.

Abstract: In an epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler, there are blended a salt of trimellitic anhydride with 1,8-diazabicyclo(5.4.0)undecene-7 as a curing accelerator and a mercapto-containing silane coupling agent. The composition is shelf stable and smoothly flowing and cures into a product having improved adhesion, moisture resistance and electrical properties. The composition is suitable for the encapsulation of semiconductor devices.

Abstract: A curable epoxy resin composition comprising (A) an epoxy resin, (B) a thixotropic agent in an amount sufficient to induce thixotropic properties, and a hardener comprising (C) at least one polyethyleneimine and (D) at least one other amine having at least 2 amino hydrogen atoms, the combined amounts of (C) and (D) being sufficient to effect cure of the epoxy resin.

Abstract: The present invention provides pourable curable composition which comprises the product obtained by mixing (a) a liquid epoxy resin containing a sufficient amount of a thixotropic agent to induce thixotropic properties with (b) a hardener composition which contains a tertiary amine compound in an amount sufficient to at least cause the mixture to become pourable after mixing.

Abstract: Epoxy resin casting compositions comprising(a) a liquid aromatic glycidyl or .beta.-methylglycidyl ether or a liquid mixture of several aromatic glycidyl or .beta.-methylglycidyl ethers containing on average more than one glycidyl ether group per molecule,(b) one or more than one acid hardener for the glycidyl ether,(c) a curing accelerator,(d) a filler mixture containing calcite and wollastonite in an amount from 40 to 60% by weight, based on components (a), (b) and (d), and as optional components,(e) customary additives for epoxy resin casting compositions are suitable in particular for coating or encapsulating electrical or electronic components and, more particularly, electrical ignition coils.

Abstract: The disclosure relates to improved formulations for paints and coatings. The improved paints and coatings can impart improved corrosion resistance in comparison to conventional paints. In addition to providing an environmental barrier, an alkali silicate component of the paint interacts or reacts with the surface of an underlying metal surface and forms a corrosion resistant mineral like product.

Abstract: An epoxy resin composition for semiconductor sealing, which comprises an epoxy resin, a curing agent and an inorganic filler, and has a J-value of 10 to 50, which is a maximum jetting flow value determined according to a method of evaluating jetting flow of epoxy resin composition.

Abstract: An epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler has a melt viscosity of at most 150 poise at 175.degree. C. The inorganic filler has a BET specific surface area of 1.5-6 m.sup.2 /g and is such that when a 75/25 mixture of the inorganic filler and a bisphenol F type liquid epoxy resin is measured for viscosity at shear rates of 0.6/sec. and 10/sec. at a temperature of 25.+-.0.05.degree. C. by an E type viscometer, the ratio of the viscosity at 0.6/sec. to the viscosity at 10/sec. is at least 3.5/1. The amount of the inorganic filler loaded is 80-90% by weight of the composition. The composition is suitable for the encapsulation of matrix frames.

Abstract: Disclosed herein is an epoxy resin compound including an epoxy resin (A), a hardener (B), and an inorganic filler, characterized in that said inorganic filler contains silica (C) as an essential component, said hardener (B) is one which contains at least two phenolic hydroxyl groups and/or naphtholic hydroxyl groups in the molecule, and said silica (C) contains 1-99 wt % of synthetic silica and 99-1 wt % of natural fused silica. Disclosed also herein is a semiconductor device having a semiconductor element sealed therein with said epoxy resin compound. The epoxy resin compound does not cause such troubles as short shot, resin peeling, wire breakage, stage shift, and vent clogging at the time of molding. In addition, when used as a sealing material, it yields semiconductor devices which have good reliability at high temperature and high humidity and good resistance to soldering heat.

Abstract: Compounds containing two cyclic hydrocarbon moieties which are substituted to provide crosslinking functionality and which are linked to each other by secondary or tertiary oxycarbonyl containing moiety are basis for compositions which are cured to provide cured thermosets for encapsulation and underfill for electronic components that are thermally decomposable to allow repair, replacement, recovery or recycling of operative electronic components from assemblies that are inoperative.

Abstract: A golf ball having a dimpled surface is coated with a paint layer having a constant film thickness even at the edges of the dimples wherein the paint layer comprises a polyurethane and/or epoxy resin, and 0.1 to 3% by weight based on the paint resin solids content of silica, clay, calcium carbonate or a mixture thereof optionally surface-treated with a silane coupling agent, silicone oil, fatty acid, organic acid salt or ammonium salt.

Abstract: The use of a thermosetting epoxy resin blend as a casting compound for electronic or electrotechnical components. The blend contains a silicone-modified epoxy resin in which organic components containing epoxy groups are chemically bonded to silicone components, and a mineral filler, optionally silanized, that regulates the thermal expansion behavior, in an amount of 40 wt % to 75 wt %, based on the thermosetting epoxy resin blend. The thermosetting epoxy resin blends are used to particular advantage for casting diodes.

Abstract: In an epoxy resin composition comprising an epoxy resin, a curing agent, and 80-90 wt % of a particulate inorganic filler, fine particles having a particle size of less than 3 .mu.m account for 10-40 wt % of the inorganic filler, and the inorganic filler has a specific surface area of less than 2.5 m.sup.2 /g as measured by a nitrogen adsorption BET method. The inorganic filler satisfies that when a blend of a bisphenol F type liquid epoxy resin having a viscosity of 30-45 poises at 25.degree. C. as measured by Gardner-Holdt method with 75 wt % of the inorganic filler is measured for viscosity at 25.degree. C. by means of an E type viscometer, the viscosity at a shear rate of 0.6 s.sub.-1 is less than 50,000 poises and the ratio of the viscosity at a shear rate of 0.6 s.sup.-1 to the viscosity at a share rate of 10 s.sup.-1 is less than 2.5/1. The epoxy resin composition has a low melt viscosity enough to mold on semiconductor devices without die pad and wire deformation.

Abstract: The stilbene epoxy resin having two different aryl groups and an epoxy resin mixture including this stilbene epoxy resin have lower melting points than those of the stilbene epoxy resin having two identical aryl groups and the epoxy resin mixture of the latter stilbene epoxy resin. Compared with the conventional resins, the present resin or resin mixture has improved working and molding properties, which shortens the time required for the molding and working process, resulting in economic advantages and a preferred affect on productivity. The present epoxy resin or resin mixture is preferably used as an adhesive, a coating, an insulating material, an electrical or electronic material for laminated sheets or the like. It is especially suited for use as material for encapsulating electronic parts.

Abstract: Epoxy resin composition for molding comprising epoxy resin (A), acid anhydride (B), curing accelerator (C), coupling agent (D) and filler (E), process for preparing molded product used for apparatus for high voltage made of the epoxy resin composition for molding and molded product produced by the process for preparing the molded product. The epoxy resin composition has excellent mechanical properties such as high mechanical strength and high toughness and excellent thermal resistance, the process for preparing the molded product can provide molded product made of the epoxy resin composition, and the produced molded product has excellent crack resistance and high reliability.

Abstract: A matrix board coating composition for use in the formation of a mold in which flexographic printing plates are produced, the coating is a water-based, latex emulsion having a two step phenolic component to increase shelf life, reduce volatiles and improved flow properties of the coating.

Abstract: A system for protecting surfaces and facilitating the removal of unwanted substances therefrom is disclosed, the system including a polymeric coating having a low volatile organics content (VOC) which is safe for the environment, and a cleaner for application to the coating to remove material from the coating, such as graffiti. The coating may be either a water-based epoxy comprising a bisphenol A resin and polyamide resin, or an aliphatic urethane comprising a polymer having reactive sites which react with a isocyanate and an aliphatic isocyanate. The cleaner is suitable for removing all manner of epoxy and urethane based spray paints, indelible inks, industrial chemicals, and the like. The cleaner comprises N-methyl pyrrolidone in a concentration of fifty percent by weight or greater and a surfactant.

Abstract: Disclosed is an epoxy resin composition which is excellent in thermal stability without being cured in a cylinder of an injection molding machine and is extremely suppressed in the formation of flux on molding.This epoxy resin composition has an important feature residing in the use of a specific silica of the following characteristics as an inorganic filler to be incorporated thereinto whereby excellent technical effects can be achieved such as the composition being injection-moldable and the formation of flux on molding being suppressed extremely:(a) an average particle diameter of not more than 30 .mu.m,(b) 5-30% by weight of a molten or crystalline silica powder having an average particle diameter of not more than 7 .mu.m and a specific surface area of at least 5 m.sup.2 /g in the total silica content,(c) 15-45% by weight of silica having an average particle diameter of not more than 5 .mu.m in the total silica content,(d) the maximum particle diameter of the total silica content of not more than 150 .mu.

Abstract: A water-permeable material having good chemical resistance, water resistance and weatherability and in which cracks do not form in the material. The composition for forming a water-permeable material includes aggregate grains, a polysulfide-modified epoxy resin and a curing agent for the polysulfide-modified epoxy resin.

Abstract: Disclosed is a multilayer packaging material which is suitable for use as a container for malt beverages and which is tinted so as to block at least 90% of light with wavelengths of electromagnetic radiation ranging from 300 nm to 500 nm. The tinted multilayer packaging materials of the present invention includes: (a) at least one layer of a carbon dioxide (CO.sub.2)-permeable polymeric packaging material, and (b) at least one layer of a CO.sub.2 -treated gas barrier coating, which has an oxygen permeability constant not more than 0.05 cubic centimeter-mil/100 square inches/atmosphere/day. The CO.sub.2 -permeable packaging material can be any polymeric material through which CO.sub.2 can pass and which can be used as a packaging material for food or beverages. The gas barrier coating has an oxygen permeability constant, before CO.sub.2 treatment, of less than 0.3. This gas barrier coating includes the reaction product of a polyamine (A) and a polyepoxide (B).

Abstract: "Molded products for high voltage apparatus comprising an" epoxy resin composition for molding comprising an epoxy resin (A), an acid anhydride (B), a curing accelerator (C), at least one coupling agent (D) and a filler (E). The epoxy resin (A) is a bifunctional brominated bisphenol A or a brominated bisphenol F, "epoxy resin and at least one bisphenol A, bisphenol F or bisphenol epoxy resin". The coupling agent (D) is selected from the group consisting of epoxysilane type coupling agents, phenylaminosilane type coupling agents, mercaptosilane type coupling agents and titanate type coupling agents, which has an average particle diameter of not more than 60 .mu.m and in which the content of particles having a diameter of not more than 5 .mu.m is not less than 5% by weight. The filler (E) comprises at least one of silica fillers or alumina fillers. The ratio of the number of acid anhydride groups of the acid anhydride (B) to the number of epoxy groups of the epoxy resin (A) is 0.5 to 1.

Abstract: Epoxy resin casting compositions comprising(a) a liquid aromatic glycidyl or .beta.-methylglycidyl ether or a liquid mixture of several aromatic glycidyl or .beta.-methylglycidyl ethers containing on average more than one glycidyl ether group per molecule,(b) one or more than one acid hardener for the glycidyl ether,(c) a curing accelerator,(d) a filler mixture containing calcite and wollastonite in an amount from 40 to 60% by weight, based on components (a), (b) and (d), and as optional components,(e) customary additives for epoxy resin casting compositions are suitable in particular for coating or encapsulating electrical or electronic components and, more particularly, electrical ignition coils.

Abstract: An epoxy resin composition composed of an epoxy resin (A), a hardener (B), and an inorganic filler (C), characterized in that the content of the inorganic filler (C) is 70-97 wt % and the inorganic filler (C) contains 0.1-50 wt % of alumina. When used to seal semiconductor devices, it exhibits good moldability and imparts to the sealed semiconductors good flame retardance, solder heat resistance, and reliability at high temperatures.

Abstract: A coarse particle kaolin clay is provided having an average Stokes equivalent particle diameter of about 4.5-6.0 microns, a BET surface area of about 8-11 m.sup.2 /g, and preferably having a median Malvern particle size of about 9.0-10.5 microns as determined by laser light-scattering measurement and a high aspect ratio preferably of about 12-14 as determined by Sphericity Model calculations. The coarse particle kaolin clay provides low viscosity build, good reinforcement properties and excellent surface finish qualities as a filler in thermoset composite materials, such as polyester molding compounds, and also provides excellent pigmenting properties in paints and industrial coatings.

Abstract: An object is to provide hardened products having excellent water resistance and mechanical strength, and an epoxy resin and an epoxy resin composition for use in the production thereof. An epoxy resin obtained by the glycidylation of a novolak type resin which is prepared by the condensation of biphenyls with phenols and naphthols, and a resin composition containing said epoxy resin and hardened products thereof.

Abstract: A silica filler containing from 30 to 90 wt % of particles having a particle size of at least 30 .mu.m, wherein the roundness of the particles having a particle size of at least 30 .mu.m, is from 0.83 to 0.94.

Abstract: An epoxy resin composition is provided that mainly comprises an epoxy resin, a curing agent, and an inorganic filler, and that cures into a product having a coefficient of water diffusion of up to 1.times.10.sup.-4 cm.sup.2 /hr. at a thickness of 3 mm under humid conditions at 85.degree. C. and RH 85%, wherein 1-50% by weight of an inorganic water absorbing agent such as molecular sieve, silica gel and porous silica is added to the epoxy resin composition. The composition offers cured products having fully low moisture permeability and is thus suitable as a pre-molded hollow package-forming material.

Abstract: A clay-resin composition of a cured epoxy resin and a layered clay with the cured epoxy resin in the galleries of the clay by intercalation or exfoliation. The preferred epoxy resins are flexible and usually elastic because of the epoxy resin and/or curing agent which is used. The result is a composite which can have superior tensile strength and/or solvent resistance as compared to the cured epoxy resin without the clay or with the clay but without the intercalation or exfoliation. The flexible composites are particularly useful for seals and other thin layer applications.

Abstract: Disclosed herein is an epoxy resin compound including an epoxy resin (A), a hardener (B), and an inorganic filler, characterized in that said inorganic filler contains silica (C) as an essential component, said hardener (B) is one which contains at least two phenolic hydroxyl groups and/or naphtholic hydroxyl groups in the molecule, and said silica (C) contains 1-99 wt % of synthetic silica and 99-1 wt % of natural fused silica. Disclosed also herein is a semiconductor device having a semiconductor element sealed therein with said epoxy resin compound. The epoxy resin compound does not cause such troubles as short shot, resin peeling, wire breakage, stage shift, and vent clogging at the time of molding. In addition, when used as a sealing material, it yields semiconductor devices which have good reliability at high temperature and high humidity and good resistance to soldering heat.

Abstract: This invention provides resins and resin compositions which afford cured products with high heat resistance, low water absorption and high adhesion which are useful as electric and electronic materials. Resins obtained by condensation reaction between 4,4'-di(.omega.-substituted methyl)biphenyl or the like and naphthols; epoxy resins obtained by glycidyleterifying said resins; epoxy resin compositions containing these resins; and cured products thereof are disclosed.

Abstract: Disclosed is a coated golf ball having a constant film thickness even at the edge part of the dimple.The coated golf ball is obtained by coating a paint on a golf ball having dimples on the surface. The paint is an polyurethane paint and/or epoxy resin paint and contains silica, clay, calcium carbonate or a mixture thereof in an amount of 0.1 to 3% by weight based on 100 parts by weight of the paint resin solid content.

Abstract: A clay-resin composition of a cured epoxy resin and a layered clay with the cured epoxy resin in the galleries of the clay by intercalation or exfoliation. The preferred epoxy resins are flexible and usually elastic because of the epoxy resin and/or curing agent which is used. The result is a composite which can have superior tensile strength and/or solvent resistance as compared to the cured epoxy resin without the clay or with the clay but without the intercalation or exfoliation. The flexible composites are particularly useful for seals and other thin layer applications.

Abstract: The present invention relates to an epoxy composition represented by the formula (I) below, wherein G is a glycidyl group or a halogen atom. It is produced by reacting a halogenated polyhydric phenol compound with epihalohydrin in the presence of an alkali metal hydroxide. It is incorporated into a resin to render it flame retardant.

Abstract: A method of manufacturing a castable epoxy resin composition which comprises as components an epoxy resin, an acid anhydride in an amount sufficient for hardening, an inorganic filler, and acrylic rubber particles having a thermoplastic resin skin, said thermoplastic resin skin being 1 to 50 wt % of said acrylic rubber particles, wherein each of said acrylic rubber particles has epoxy groups on a surface thereof, and said acrylic rubber particles are present in an amount ranging between 2 and 40 parts by weight based on 100 parts by weight of said epoxy resin, wherein said inorganic filler is an alumina powder having a mean particle size by volume of 6 to 16 .mu.m, and a particle size of at least 10 volume % of said alumina powder particles is 20 .mu.m or greater, and wherein at least 90 volume % of said rubber particles are dispersed as discrete particles with a particle size by volume of 1 .mu.

Abstract: A powder coating composition is disclosed which includes (a) 100 parts by weight of a mixed epoxy resin having an epoxy equivalent of 800-2000 and containing (a-1) a diglycidyl ether of bisphenol A having an epoxy equivalent of 180-2500 and (a-2) a rubber-modified epoxy resin having an epoxy equivalent of 180-2500 and obtained by reaction of a diglycidyl ether of bisphenol A with a carboxyl terminated acrylonitrile-butadiene copolymer; (b) a mixed curing agent consisting of (b-1) 0.05-5 parts by weight of an imidazole compound, (b-2) 0.5-10 parts by weight of dicyanodiamide and (b-3) 1-10 parts by weight of a dihydrazide of a dibasic carboxylic acid; and (c) 50-100 parts by weight of silica.

Abstract: A low gloss coating composition having a 60.degree. gloss of less than about 60 which contains:a) a glycidyl group-containing acrylic copolymer;b) an aromatic polyester; andc) an isocyanurate curing agent having the formula: ##STR1## wherein R.sub.1 -R.sub.3 are independently selected from the group consisting of divalent alkylene groups of 1 to 18 carbon atoms and divalent groups of 3 to 21 carbon atoms and containing an ester linkage, and R.sub.4 -R.sub.6 are independently selected from the group consisting of H, organic salt groups, alkyl groups of 1 to 20 carbon atoms and C(O)R.sub.7 wherein R.sub.7 is an alkyl group of 1 to 22 carbon atoms.