Abstract: An epoxy resin having a propenyl group conjugated with an aromatic ring is heat resistant and is easily molded and cured into products having high strength and Tg. It is thus useful as a resin component or modifier.

Abstract: An epoxy resin composition comprising (A) a specific epoxy resin, (B) a phenolic resin having at least one naphthalene ring in a molecule, and (C) an inorganic filler has improved flow and cures into products having a low coefficient of expansion, high Tg, and low moisture absorption. The composition is suitable for encapsulating semiconductor devices.

Abstract: A photocurable ink composition for forming patterns resistive to electroless plating is disclosed which includes (a) an epoxy resin, (b) an aliphatic polyol polyglycidyl ether as a reactive, viscosity controlling agent, (c) a photopolymerization catalyst, and (d) hydrophobic silica particles as a thixotropic agent.

Abstract: A semiconductor encapsulating epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler is improved in melt flow and moldability when the filler comprises spherical silica having a mean particle size of 5 to 35 .mu.m and a specific surface area of up to 1.4 m.sup.2 /g. A mixture of (A) spherical silica having a mean particle size of 0.1 to 2 .mu.m, and (C) ground silica having a mean particle size of 2 to 15 .mu.m is also useful as the filler. A cured product thereof has a low coefficient of expansion and improved crack resistance upon soldering after moisture absorption.

Abstract: Disclosed are micronized synthetic calcium silicates in the form of fluffy particles of needle-like calcium silicate crystals having a particle size of about 0.5 to 50 microns and an average particle size d.sub.50 of from 5 to 25 microns, and preferably of from 7 to 15 microns, obtainable from micronized, approximately spherical synthetic calcium silicate hydrate aggregates having a diameter of from 10 to 150 microns. They are preferably used in filled and unfilled liquid resin systems.

Abstract: An epoxy resin composition suitable for encapsulating electric parts is disclosed which includes a mixed epoxy resin composed of a bisphenol epoxy resin and a novolac epoxy resin, and a curing agent selected from the group consisting of (a) aliphatic dicarboxylic acids of the formula:HO--CO--R--CO--OHwherein R represents a divalent, aliphatic hydrocarbyl group containing a divalent, linear skeletal structure having at least 8 carbon atoms, (b) diphenylol derivatives of the formula:HO--C.sub.6 H.sub.4 --C(CH.sub.3).sub.2 --C.sub.6 H.sub.4 --O--CH(OH)--CH.sub.2 --O--C.sub.6 H.sub.4 --C(CH.sub.3).sub.2 --C.sub.6 H.sub.4 --.sub.m OHwherein m is an integer of 0-8, and (c) mixtures thereof.

Abstract: A coating composition for the protection of substrates against environmental attack comprising, in weight percent based on the solvent-free weight of the composition, from about 8% to about 35% of at least one film forming polymer; from 0 to about 60% of a corrosion inhibiting agent such as metal chromates, metal phosphates, metal molybdates, particulate metallic zinc and/or particulate metallic aluminum; from 3% to about 6% of mixture of pyrogenic amorphous silicas of different particle sizes having average particle sizes ranging from about 0.007 to about 0.04 micron; from about 15% to about 55% of at least one crystalline silica having an oil absorption value of less than 20 measured by ASTM Standard Test D281-84; and 0 to 35% based on the total weight of the composition, of at least one solvent compatible with the polymer.

Abstract: A thermosetting resin composition suitable for forming an insulating layer to be interposed between two adjacent wiring patterns of a multilayer printed wiring board is disclosed which includes a bisphenol AD epoxy resin, an aromatic polyamine, mica having an average particle size of 50 .mu.m or less, and silica having an average particle size of 20 .mu.m or less, the average particle size of the silica being smaller than that of the mica, and the amount of the silica being 20-80% based on the total weight of the silica and the mica.

Abstract: An alumina-silica-sulfate of the formulaxR:Al.sub.2 O.sub.3 :ySiO.sub.2 :zSO.sub.4.pH.sub.2 Owherein R is an alkali or alkaline earth metal oxide, a transition metal capable of forming a sulfate salt or mixtures thereof, x is about 0.001 to 0.5, y is about 0.01 to 3.00, z is about 0.00 to 3.00, and p is about 0 to 100.00, and wherein the sulfate is present as a bound network. Compositions comprising the alumina-silica-sulfate of the invention and a carrier, articles of manufacture comprising the alumina-silica-sulfates of the invention in the form of a catalyst, rubber, plastics, paint and paper, among others. Hollow microspheres are formed by spray drying a gelled composition. Hollow microspheres containing a porous network are formed by calcining the spray-dried hollow microspheres to eliminate the sulfate network.

Abstract: Disclosed is an epoxy resin composition comprising, as basic components, (A) an epoxy resin, (B) a phenol-novolak resin, (C) a curing promotor and (D) a filler. Pulverized or spherical silica having specific particle size characteristics is used as the filler (D). Preferably, a halogenated epoxy resin and antimony oxide are further incorporated in this epoxy resin. This epoxy resin composition shows a very small molding shrinkage. If a dialkylurea derivative is used as the curing promotor (C), the stability of the composition at about 100.degree. C. is drastically improved and the flowability of the composition is improved. Accordingly, precision injection molding becomes possible, and the effect of sealing a semiconductor is enhanced.

Abstract: A heat curable composition is provided which is useful for encapsulating microelectronic devices using a heat curable epoxy composition having a diaryliodonium hexafluoroantimonate salt as a catalyst in combination with an effective amount of a free radical generating aromatic compound as a cocatalyst.

Abstract: An epoxy resin composition suitable for use as a casting resin for the potting of an ignition coil is disclosed which comprises:(A) a mixture containing(a.sub.1) a liquid, Bisphenol-type epoxy resin, and(a.sub.2) an inorganic filler,(a.sub.3) a polyether polyol; and(B) a liquid curing agent including(b.sub.1) an acid anhydride, and(b.sub.2) an imidazole compound.

Abstract: A conductive coating composition containing a binder and pigment in a pigment to binder weight ratio of about 15:100 to 100:100; wherein the binder contains(A) a multifunctional amine, a polyamide resin, polyamidoamine resin or any mixtures thereof; and(B) a multifunctional epoxy resin;wherein the electrically conductive pigment is a silica which is either amorphous silica, a silica containing material or a silica coated pigment, the silica is in association with a two-dimensional network of antimony-containing tin oxide crystallites in which the antimony content ranges from about 1-30% by weight of the tin oxide and the composition forms a coating on a substrate that has a surface conductivity of at least 100 Ransburg units. The coating can be used on metal or plastic substrates or previously coated substrates of either plastic or metal to render the substrate conductive and easily grounded for electrostatic spraying.

Abstract: An epoxy resin based powder coating composition which comprises: (A) 100 parts by weight of a mixed epoxy resin having a softening point of 60.degree.-80.degree. C. which consists of 50 to 70 wt. % of a bisphenol A expoxy resin having a number-average molecular weight of 800 to 1,800 and 30 to 50 wt. % of a cresol novolak epoxy resin; (B) 5 to 80 parts by weight of a novolak resin; (C) 0.5 to 5 parts by weight of triphenylphosphine; (D) 60 to 200 parts by weight of an inorganic powder having an average particle size of 0.5 to 75 um; and (E) 0.01 to 2 parts by weight of a microfine silica powder having an average particle size of 1 to 100 nm.The epoxy resin based powder coating composition can be coated on electrical and electronic components at 90.degree.-100.degree. C. with retaining the high moisture resistance, storage stability and free-flowing properties.

Abstract: A size for insulating type glass fibers, comprising an epoxy resin of a glycidyl ether dispersable in water, an amino setting agent having a flash point over 180.degree. C. and, as additives, 0.1 to 2% of silane and 0 to 15% of a mineral oil, each calculated per 100 parts of dry resin.

Abstract: A thermosetting resin composition formed of a polyaminobismaleimide resin, which is composed of a bismaleimide compound and a diamine compound, and a powdery inorganic filler. The composition has excellent heat resistance as well as superb mechanical properties at high temperature not to mention room temperature, and is expected to find wide-spread commercial utility in electric and electronic components such as sealing materials, sockets and connectors and other applications.

Abstract: A heat curable composition is provided which is useful for encapsulating microelectronic devices using a heat curable epoxy composition having a diaryliodonium hexafluoroantimonate salt as a catalyst in combination with an effective amount of a free radical generating aromatic compound as a cocatalyst.

Abstract: A thermal conductive polymer composition comprising a mixture of a polymer and a thermally conductive filler material, said filler material having a median particle size of between about 130 to 260 microns and a size distribution characterized by the formula: ##EQU1## where % represents the wt. % of the particles below or above the median particle size and M represents the median particle size in microns.

Abstract: A balancing putty for use in balancing rotation of a rotary part including:(a) an epoxy resin;(b) a curing agent capable of curing the epoxy resin when heated at a temperature of 60.degree. C. or more,(c) a first, finely divided inorganic filler having a specific gravity of 4.0 g/cm.sup.3 or more; and(d) a second, finely divided inorganic filler having a specific gravity of less than 4.0 g/cm.sup.3, the balancing putty having a density of at least 2.0 g/cm.sup.3 and a consistency of 1-12 mm in terms of penetration.

Abstract: A curable epoxy resin is blended with (a) an alkenyl group-containing epoxidized novolak resin/organopolysiloxane copolymer and (b) a polyimide resin in addition to a curing agent and an inorganic filler. The resulting epoxy resin composition can be cured both under moisture-free conditions and even under moist conditions without inducing a crack. It is suitable for the encapsulation of semiconductor devices as well as for molding and powder coating.

Abstract: An epoxy resin composition for semiconductor sealing which comprises, as essential components,(A) an epoxy resin comprising 50-100% by weight, based on total epoxy resin amount, of a polyfunctional epoxy resin represented by the formula (I) ##STR1## wherein n and m are each an integer of 0 or more, n+m=1-10, and R.sub.1, R.sub.2 and R.sub.3 which may be the same or different, are each selected from hydrogen atom, an alkyl group and a halogen atom, with the proviso that all of R.sub.1, R.sub.2 and R.sub.3 must not be hydrogen atom simultaneously,(B) a phenolic resin curing agent,(C) a silica filler, and(D) a curing accelerator.

Abstract: A filled resin composition is provided which is particularly adapted for the formation of wear-resistant, lubricious surfaces. The compositions when formed into integral threads with the bodies of plastic-reinforced pipe provide superior thread action and extended thread life.The compositions comprise a thermosetting resin such as epoxy resin and hardener, in combination with a filler which in turn comprises ceramic powder, graphite and short fiber lengths. The compositions may vary widely as will hereinafter become apparent.

Abstract: A thermosetting resin composition suitable for forming an insulating layer to be interposed between two adjacent wiring patterns of a multilayer printed circuit board is disclosed which includes an aromatic epoxy resin having at least two epoxy groups, an aromatic polyamine mica having an average particle size of 50 .mu.m or less, and silica having an average particle size of 20 .mu.m or less, the average particle size of the silica being smaller than that of the mica, and the amount of the silica being 20-80% based on the total weight of the silica and the mica.

Abstract: A fine polishing composition for wafers, comprising water, particulate amorphous silica and a polysaccharide polymer graft-polymerized with acrylamide alone or together with at least one vinyl monomer selected from the group consisting of acrylic acid, methacrylic acid and styrenesulfonic acid, and adjusted with an alkaline substance to a pH of from 8 to 12.

Abstract: A trowelable, epoxy-based flooring material exhibits high impact strength, high chemical resistance and a closed exposed surface after curing, and has a hardener component including aliphatic amine and amino silane, a resin component including bisphenol formaldehyde epoxy and monoepoxide and an aggregate component, with the hardener and the resin being present in stoichiometric proportion.

Abstract: New epoxy resin binder compositions which have outstanding pot life but can be cured to form products having excellent physical properties are obtained by mixing the epoxy resin with a new curing agent comprising a reaction product of methylene chloride and monoethanol amine in special proportions. The new binders are particularly suited for use in combination with Portland cement, sand and water to form improved overlay coatings for already form concrete or asphalt surfaces.

Abstract: A process is disclosed for preparing an aqueous paint composition including the steps of(a) mixing a pigment powder having a particle size less than about 20 micrometers, a cross-linking agent and an epoxy resin to form a liquid, solvent-free paste;(b) reacting the resultant paste with a secondary amine to provide at least one N-H function per epoxy group of the epoxy resin; and(c) neutralizing the resulting suspension of particles coated with an epoxy-amine adduct and a cross-linking agent.Also provided is a coating process employing the invention aqueous paint composition containing a transesterification-promoting metal compound.

Abstract: A coating composition for the protection of substrates against environmental attack, comprising, in weight percent, from about 10% to about 30% of a film-forming polymer which is liquid at room temperature in the presence of not more than 25% solvents; up to about 20% of a corrosion inhibiting agent such as metal chromates, metal phosphates and/or metal molybdates; from 2% to about 5.5% of an amorphous pyrogenic silica having an average particle size less than 0.01 micron; from about 20% to about 50% of a crystalline silica having an oil absorption value of less than 20 measured by ASTM standard test D281-84; not greater than 25% of at least one solvent compatible with the polymer. The composition has a viscosity suitable for application by conventional equipment while also having a low volatile organic content.

Abstract: A tough, durable, high temperature epoxy tooling composition for making cast-to-size forming tools. The composition comprises a bisphenol-A epoxy, a trifunctional aromatic epoxy, an anhydride catalyst, and an imidazole catalyst. The composition may optionally contain a filler system comprising filler particles having different diameters that are interstitially-matched.

Abstract: An epoxy resin composition, especially useful as an encapsulant and exhibiting a low dissipation factor, is prepared from a first component comprising an epoxy of a polyglycidal ether of a polyhydroxyl phenol and filler, and a second component comprising a cycloaliphatic acid anhydride curing agent, filler and catalyst. Each component is mixed separately under high shear, and the filler for each component comprises at least about 50 percent by weight. The two components are admixed, applied as an encapsulant, and cured at an elevated temperature.

Abstract: A high strength, room temperature curable epoxy tooling compositions containing interstitially-matched filler systems for making cast-to-size forming tools for metal sheet stamping. The composition can be fully cured by at least one aliphatic amine catalyst in twelve hours producing a rigid article having a tensile strength of at least 40 MPa and a compressive strength of at least 100 MPa.

Abstract: A curable resin composition comprises an epoxy compound and a propargyl aromatic ether.

Abstract: A coating composition for the protection of metallic and non-metallic substrates against corrosion, comprising a film-forming polymer; at least one particulate metallic pigment in an amount ranging from about 30% to about 60% by weight based on the total weight of the composition; an agent for control of electrical conductive characteristics having an oil absorption value of less than 20 (determined by ASTM standard D 281-84), the volumetric ratio of the control agent to the metallic pigment ranging from 0.7:1 to 1.25:1; an agent for control of rheological characteristics; and at least one solvent compatible with the polymer.

Abstract: High-strength magnesium aluminosilicate glass fibers coated with the dried residue of a dilute aqueous sizing composition containing emulsified epoxy resin or emulsified epoxy resin solution, both 3-methacryloxypropyltrimethoxysilane and 3-aminopropyltriethoxysilane, and at least one lubricant, are compatible as reinforcing elements with unsaturated polyester, vinylester and epoxy resin matrixes.

Abstract: A cavitation resistant polymer and coating are provided by curing a composition containing from about 24 to 48 wt. % of a liquid epoxy resin, from about 24 to 48 wt. % of a blocked isocyanate prepolymer, from about 4.2 to 12 wt. % of a rheological additive at least 65% of which is an amorphous silica flatting agent, from about 10 to 14 wt. % of a curing agent, from about 1 to 4 wt. % of a plasticizer, and from about 0.1 to 0.6 wt. % of a silane. The composition can contain pigments, fillers and other auxillary agents.

Abstract: Corrosion inhibiting calcium-containing amorphous precipitated silica is described. The silica is prepared by admixing simultaneously in a reactor aqueous alkali metal silicate, e.g., sodium silicate, acidifying agent, e.g., hydrochloric acid, and a water-soluble source of calcium, e.g., calcium chloride. The product contains from 6 to 9 weight percent calcium (as CaO). The silica product may be incorporated into a coating composition used for corrodible metallic surfaces.

Abstract: The paint composition for under coating of the present invention comprises 60 to 90% by weight of an epoxy polyol resin optionally together with a hardener therefor and 10 to 40% by weight of silica particles. Said epoxy polyol resin is obtained by reacting an optionally substituted glycidyl-etherified product of an alkylene oxide adduct of a dihydric phenol with a phosphorus acid having at least one P--OH bond, an ester or a salt thereof to thereby give a precondensate, reacting said precondensate with a dihydric phenol to give an epoxy resin of a high molecular weight, and further reacting said epoxy resin with a compound having an amino group capable of reacting with an epoxy group. Said silica particles comprise a primary particle having an average particle size of 1 to 10 m.mu., a surface area of 270 m.sup.2 /g or above and a concentration of silanol groups on the particle surface of 0.25 mM/100 m.sup.2 or above.

Abstract: Encapsulating an electronic component with an encapsulating resin having a filler that includes silicon carbide to form a composite with improved thermal conductivity (e.g., greater than 25.times.10.sup.-4 cal/cm-sec-.degree.C.) and improved stress characteristics (e.g. a thermal shock cycle number of at least 30).

Abstract: Compositions for encapsulating electronic components are provided which comprise a blend of a curable resin and an ultra-pure silica filler. The filler is composed of fused silica granules which are prepared from a gel of a silicon-containing organic compound, such as TEOS, and which have a uranium content of less than about 0.1 parts per billion and a thorium content of less than about 0.5 parts per billion. The compositions can be readily manufactured in commercial quantities at reasonable costs and are particular well-suite for encapsulating components, such as, high density RAMs, which are sensitive to alpha particles.

Abstract: Molding compounds for encapsulating semiconductor components comprise filler-containing polyepoxy resins and a 1,3,5-tris(3-amino-4-alkylphenyl)-2,4,6-trioxohexahydrotriazine with a C.sub.1 to C.sub.4 alkyl radical as a hardener. The molding compounds are storage-stable and moldings manufactured therefrom meet the requirements for these materials.

Abstract: There is provided a method for increasing the bulk density of low bulk density materials by intimately admixing a low bulk density material and an organic or organopolysiloxane liquid and thereafter removing substantially all of said organic or organopolysiloxane liquid, for example, by evaporation.

Abstract: While high-performance semiconductor devices encapsulated with a resin composition are subject to the problem of wrong operation due to the alpha-particles emitted from the trace amounts of radioactive impurities, e.g. uranium and thorium, contained in the silica filler incorporated in the resin composition, a means for solving this problem is provided by use of a silicon dioxide powder obtained by the pyrolysis of a volatilizable silicon compound free from radioactive impurities in an oxidizing condition and having an average particle diameter in the range from 0.5 to 100 .mu.m in place of the conventional silica fillers.

Abstract: Epoxy resin composition comprising a uniform mixture of an epoxy resin and fine particles of a rubber adhered uniformly on the surface thereof with fine particles of an inorganic material, said composition having improved peel strength and toughness when cured and being useful as an adhesive or a molding material.

Abstract: A tough, durable, high temperature epoxy tooling composition for making cast-to-size forming tools. The composition comprises a bisphenol-A epoxy, a trifunctional aromatic epoxy, an anhydride catalyst, and an imidazole catalyst. The composition may optionally contain a filler system comprising filler particles having different diameters that are interstitially-matched.

Abstract: The invention relates to inorganic-organic compound substances useful for biomedical purposes. The object of the invention is to develop inorganic-organic compound materials which overcome the disadvantages of the state of art, wherein inorganic-organic compound substances for biomedical purposes possess to a large extent specifically adjustable characteristics. Inorganic initial substances form a new solid chemical compound with organic initial substances. The inorganic initial component consists of a biocompatible silicate glass and/or a silicate glass ceramic of the system SiO.sub.2 -Al.sub.2 O.sub.3 -MgO-Na.sub.2 O/K.sub.2 O-F.sup.-, and/or a bioactive phosphate silicate glass and/or a phosphate silicate glass ceramic of the system SiO.sub.2 -Al.sub.2 O.sub.3 -MgO-Na.sub.2 O/K.sub.2 O-CaO-P.sub.2 O.sub.5 F.sup.- and/or of the system SiO.sub.2 -MgO-K.sub.2 O-F.sup.- -CaO-P.sub.2 O.sub.5, and/or a bioactive phosphate glass and/or a phosphate glass ceramic of the system P.sub.2 O.sub.5 -Al.sub.2 O.sub.

Abstract: A method of cationic electrodeposition, electrocoated articles and novel electrocoating compositions are disclosed. The compositions comprise a cationic resin containing blocked isocyanate functionality and are capable of being electrodeposited over rough steel and producing extremely smooth films upon curing.

Abstract: An inorganic filler dispersed-resin composition comprising a resin matrix and fused and spherical inorganic particles, such as ceramic particles produced by flame jet melting added in the resin matrix. The ceramic particles are selected from the group consisting of alumina, silica, magnesia, zircon, zirconia, and calcia, and the resin is selected from the group consisting of epoxy, phenol, acrylic polyester, silicone and ABS resins.

Abstract: An epoxy resin-based composition suitable for encapsulation of semiconductor devices is proposed. The resin composition is capable of giving a cured resin encapsulation highly resistant against crack formation by virtue of the unique ingredient therein, in addition to the thermally curable epoxy resin and an inorganic filler, which is a combination of an organopolysiloxane having a hydrocarbon group substituted by certain functional groups, e.g. glycidyl, amino, mercapto and the like, and a block copolymer composed of the segments of a polymeric aromatic moiety and segments of an organopolysiloxane moiety.

Abstract: The inorganic filler in the inventive epoxy resin-based composition is a combination of two kinds of quartz powder of which one is a quartz powder having a spherical particle form and the other is a pulverized quartz powder in a specified proportion. The resin composition is highly flowable and capable of giving encapsulation of semiconductor devices with little fins having outstandingly small thermal expansion coefficient and highly resistant against crack formation.

Abstract: An asbestos-free intumescent thermal protection coating consisting essently of from 0.5 to 1.5 weight percent of a ceramic fiber that comprises from 40 to 50 weight percent of Al.sub.2 O.sub.3, 50 to 60 weight percent of SiO.sub.2, from 0.5 to 1 weight percent of Fe.sub.2 O.sub.3, and from 1.2 to 2 weight percent of TiO.sub.2, the fiber having the dimensions of less than 3.2 millimeters in length and from 0.8 to 1.2 micrometers in diameter and from 98.5 to 99.5 weight percent of a polysulfide-epoxide binder. The binder may include a filler.