Abstract: A novel adhesive exhibiting low outgassing upon exposure to high temperatures is disclosed. The instant adhesive comprises: (a) a soluble polyimide resin, (b) a solvent for said polyimide resin, (c) an epoxy resin, (d) a cross-linking agent reactive with the polyimide solvent of (b), and (e) a catalyst which accelerates the reaction between (b) and (d). Optionally, the adhesive may also contain a conductive material. A process for making the adhesive is also disclosed.

Abstract: The present invention relates to a resin molding compound for sealing electronic parts.In general, electronic parts are sealed in ceramic packages or synthetic resin molding compounds in order to protect them from an external circumstance in the use thereof.In many cases, materials consisting of synthetic resins and inorganic fillers mainly comprising silicon oxide have been used as sealing materials for synthetic resin molding compounds.However, a defect has occurred in that since an infinitesimal quantity of radioactive elements such as uranium and thorium is contained in inorganic fillers, a memory element in electronic parts produces misactions by alpha-rays radiated from radioactive elements according to circumstances and thereby the fidelity of electronic parts is greatly influenced.

Abstract: A two-component structural adhesive comprising a first epoxy component composed of an epoxy resin containing from 0.5 to 8% by weight based on the weight of the epoxy resin of fumed silica and a second hardener component composed of an amido amine, primary and secondary amines having tertiary amine groups or alkylene ether groups in the backbone, and a phenolic compound is disclosed.

Abstract: An adhesive composition comprising, by weight, (1) 100 parts of triglycidyl ether of trisphenol, (2) 0-40 parts of a polyfunctional epoxy resin, (3) a diamine type curing agent selected from (a) an aromatic diamine compound and (b) a reaction product having an amino group at each terminal thereof, prepared by reacting together an aromatic diamine compound, divinylsilane compound and bismaleimide compound, and, if desired, (4) a powdery inorganic filler.

Abstract: An epoxy resin composition for cast molding which comprises:(A) an epoxy resin;(B) a curing agent;(C) cut fibers having distributions of 3 to 20 .mu.m in diameter and 3 to 1500 .mu.m in length;(D) inorganic powder having a size distribution of particles with 90% by weight or more of particles with particle sizes of 10 .mu.m or less and 50% by weight or more of particles with particle sizes of 5 .mu.m or less,the total amount of the components (C) and (D) formulated being 40 to 225 parts by volume per 100 parts by volume of the total amount of the components (A) and (B) formulated displays excellent crack resistance, strength as well as a low shrinkage characteristic and, good fluidity.

Abstract: According to the invention, a filler for an electronic element encapsulation resin composition is provided. The filler comprises 5 to 95 parts by weight of fused silica beads of generally spherical form and 95 to 5 parts by weight of crushed particles of fused silica of rugged form. The resin composition admixed with the filler has excellent fluidity without the formation of burs when molded.

Abstract: A novel adhesive exhibiting low outgassing upon exposure to high temperature is disclosed. The instant adhesive comprises: (a) a soluble polyimide resin, (b) a solvent for said polyimide resin, (c) a tackifier, (d) an epoxy resin, (e) a hardener for said epoxy resin, (f) a catalyst which catalyzes the reaction between the epoxy and hardener, (g) a cross-linking agent reactive with the polyimide solvent of (b), (h) a catalyst which accelerates the reaction between (b) and (g), and (i) a filler material. Optionally, the adhesive may also contain a conductive material. A process for making the adhesive is also disclosed.

Abstract: Disclosed is an epoxy rubber made by reacting about 5 to about 50% of an epoxy terminated acrylonitrilebutadiene copolymer with about 50 to about 95% of a solid epoxy resin. A coating powder is prepared with about 30 to about 70% of a solid epoxy resin, about 2 to about 25% of the epoxy rubber, about 5 to about 25% of an anhydride curing agent, about 5 to about 40% mica filler, and about 10 to about 50% glass fiber. Electrical apparatus, such as coils made of served wire, can be coated with the powder by heating the apparatus above the melting point of the powder and dipping it in the fluidized powder, followed by curing the melted powder on the apparatus.

Abstract: The present invention provides a rapid, low-temperature curing epoxy resin adhesive composition comprising (1) a polyepoxide, (2) a catalytic amount of HBF.sub.4, (3) a finely divided filler, preferably an acidic filler, and, optionally, (4) a polyalkylene ether glycol.

Abstract: Incorporation in a thermoplastic resin of a mass of mica flakes having a median shape factor of not less than 0.76, an average particle size of not more than 2,000 .mu.m and an average aspect ratio of not less than 10 followed by molding gives moldings which are high not only in mechanical strength but also in strength at weld parts. Incorporation of said mica flake mass in a thermosetting resin followed by molding affords moldings very high in strength as well as in modulus of elasticity.

Abstract: An epoxy resin composition containing as a latent hardener a diaminotriazine-modified imidazole compound and dicyandiamide is improved in the usable life of an solder resist ink composition and can give a solder resist also excellent in resistance to an electroless plating bath.

Abstract: A bonding assistant for a support material consists of an organic binder ch comprises a mixture of a saturated polyester and an isophorone diisocyanate containing masked isocyanate groups apart from OH groups, said mixture being present in a proportion of from 50 to 80 percent by weight of the total mixture, the binder having filler particles of a particle size less than 15 .mu.m dispersed therein in a proportion of from 10 to 50 percent by weight.

Abstract: A composition for molding and casting machine parts, comprising a filler of aggregate rock material or the like, a resin-based binder system, and between 2 to 15% by weight of the total composition of inorganic or organic fibers.

Abstract: This invention relates to radiation hardenable primers based on prepolymers containing (meth) acryloyl groups and conventional auxiliary agents. The primers are characterized in that they contain organic and/or inorganic fibres having a fibre length distribution curve reaching its maximum in the region of from 50 to 600 .mu.m. These primers are suitable for coating articles which have absorbent surfaces, in particular for the continuous coating of wood-concrete articles such as wood-concrete boards.

Abstract: A soft vinyl chloride resin composition having a light weight and a superior abrasion resistance and lusterless surface is provided, which composition is obtained by blending 100 parts by weight of a vinyl chloride copolymer consisting of 99.0 to 99.95% by weight of vinyl chloride and 1.0 to 0.05% by weight of a polyethylene glycol diacrylate or a polyethylene glycol dimethacrylate both having 4 to 50 polymerization units of ethylene glycol, mainly with (a) 5 to 100 parts by weight of a filler having a specific gravity of 0.7 or less and a compressive strength of 70 Kg/cm.sup.2 or higher and (b) 30 to 150 parts by weight of a plasticizer.

Abstract: Disclosed is an essentially solvent-based, organic, high-solids coating composition containing (A) a film-forming binder system containing a crosslinkable resin having a weight average molecular weight of from about 500 to about 10,000; (B) substantially colorless, substantially inorganic microparticles stably dispersed in the coating composition; and (C) a solvent system for the crosslinkable resin. The substantially inorganic microparticles prior to incorporation in the coating composition range in size from about 1 to about 150 nanometers and are in the form of a sol of the microparticles in which the surface of the inorganic microparticles is essentially free of carbon-containing molecules chemically bonded to the inorganic microparticles.

Abstract: Crystalline, synthetic calcium silicate, which can be in diverse stages of hydration and has a high length/width ratio and a width dimension of less than 1 .mu.m, is outstandingly suitable as a sedimentation inhibitor for finely divided fillers in liquid substances.

Abstract: An epoxy resin composition comprising an epoxide compound, a guanidine compound, a filler, a thixotropic agent and an organic solvent and having a thixotropy index of 5 to 40 and a viscosity of 800 to 10,000 poises (at 20.degree. C.) is suitable for forming a resist film which is used in electroless metal plating with excellent heat resistance, solder resistance and corrosion resistance, and the like.

Abstract: Polymerizable liquid synthetic resins, liquid reactive constituents of synthetic resins or liquid additives for plastics, in each case containing mineral fillers, are converted to dry, pourable mixtures by mixing with 0.25-5% by weight of a crystalline synthetic calcium silicate, which can be in diverse stages of hydration and has a high length/width ratio and width dimensions of less than 1 .mu.m, it being possible, by this means, to employ the resins not only as casting resins but also as compression moulding resins and adhesives. In addition, handling and processability are improved.

Abstract: An epoxy grout suitable for use in mounting and positioning bearing runner plates used in hydrostatic bearing assemblies for rotatably mounting large radio telescope structures to stationary support pedestals. The epoxy grout may be used in original mountings or may be used as part of a replacement system for repairing cavities in existing grout resulting from grout deterioration. The epoxy grout has a relatively short work life and cure time even in the presence of hydraulic oil. The epoxy grout cures without shrinking or sagging to form a grout which is sufficiently strong and durable to provide a grout especially well-suited for use under the high pressure loading and close tolerance requirements of large hydrostatic bearing assemblies.

Abstract: An aqueous sizing composition for glass fibers and the resultant sized glass fiber strands are provided, where the sized glass fiber strands have an improved slip/flow property and resultant thermosetting articles reinforced with the sized glass fiber strands have improved impact properties. The aqueous sizing composition has a poly(vinyl acetate) silane copolymer, epoxy polymer, one or more lubricants, an organo silane coupling agent, which may be an amino-silane coupling agent, lubricant modified-amino-organo silane coupling agent, epoxy-containing silane coupling agent or a mixture of one or more of these coupling agents, one or more nonionic surfactants, a polyethylene-containing polymer, a wax, a hydrocarbon acid and water. The aqueous sizing composition is applied to glass fibers which are then produced into wet chopped glass fiber strands or continuous sized glass fiber strands.

Abstract: A novel adhesive has been developed that is particularly adapted for use in bonding automotive components made of sheet molding compound. It is comprised of suitable amounts of cross-linkable epoxy novolac resin; an epoxy flexibilizer; natural and colloidal silica; and an imidazole curing agent substituted in the one position with a short chain hydroxyalkyl group. The adhesive cures to a high bond strength in three minutes at 150.degree. C. It is resistant to degradation due to temperatures up to 200.degree. C., salt spray, humidity and water soak.

Abstract: Dispersions of colloidal siliceous particles, preferably silica, may be prepared in organic liquids by means of a synergistic mixture of dispersing agents comprising a phosphorus oxy-acid derivatives and a long-chain amine. Dispersions containing a high weight fraction of siliceous solids are possible having a lower viscosity than is normally achieved.

Abstract: A thermally conductive composition comprises an essentially homogeneous mixture of sand or sand-like particulate material with a binder, wherein the binder comprises an organic adhesive having an inorganic fine particle filler therein. The binder is present in at least an amount sufficient to begin to form a binder meniscus between adjacent sand particles, while the filler is present in the binder in an amount which significantly increases the effective thermal conductivity of the composition as compared to the same composition without filler.

Abstract: An improved epoxy molding composition for encapsulating microelectronic devices wherein the molding composition, after conversion to a thermoset condition, i.e., infusible state, by the application of heat and pressure, displays a low coefficient of thermal expansion and a high thermal conductivity. The dual properties of low coefficient of thermal expansion and high thermal conductivity are imparted to the molding composition by the incorporation therein of a specific anisotropic, polycrystalline, sintered ceramic product which is relatively non-abrasive and free of ionic contaminants and which has cordierite as its primary phase, consisting essentially on an analytical oxide basis of 11.5 to 16.5% RO, 33 to 41% Al.sub.2 O.sub.3 and 46.6 to 53% SiO.sub.2.

Abstract: This invention provides a two-component coating composition wherein:Component A contains a polyglycidyl ether of a bisphenol having an epoxy equivalent weight between about 170 and about 200 diluted with between about 10 weight percent and about 20 weight percent of butyl glycidyl ether; an organic thixotropic agent; a liquid polyglycidyl ether of a bisphenol having an epoxy equivalent weight between about 170 and about 210; a coumarone-indene resin having a softening point between about 40.degree. F. and about 60.degree. F.; a urea-formaldehyde resin; leafing aluminum paste; and 2-nitropropane; andComponent B contains a polyamide having a base number between about 300 and about 360; N-oleyl-1,3-propylenediamine oleate; a coumarone-indene resin having a softening point between about 40.degree. F. and about 60.degree. F.; microcrystalline silica; and 2,4,6-tris-(dimethylaminomethyl) phenol.