Abstract: A semiconductor encapsulating epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, and (D) 300-900 parts by weight per 100 parts by weight of components (A) and (B) combined of an inorganic filler contains nitrogen atoms in an amount of 1.5-20% by weight based on the weight of components (A) and (B) combined. Cured parts of the composition exhibit high-temperature capabilities and flame retardance despite the absence of halogenated epoxy resins and antimony trioxide.

Abstract: The present invention relates to a powder coating composition containing a low temperature curable epoxy resin, and more particularly to a powder coating composition containing a low temperature curable epoxy resin, which can be readily cured at a low temperature, thereby capable of being applied to coating objects that are noneconomic al in terms of workability at an elevated temperature, or are thermally sensitive. The present invention provides a powder coating composition comprising 100 parts by weight of a low temperature curable epoxy resin; 30 to 500 parts by weight of curing.

Abstract: The invention is directed thermal interfaced die assemblies and 1-component, 96-100% solids, thermosetting, silver-filled thermal interface based on epoxy resins useful for integrated circuit packages enabling conducting heat generated by the die. The adhesive is placed between the die and lid, lid and heat sink and/or die and the heat sink. The interface adhesive composition comprises an inorganic component and an organic component. The inorganic component comprising thermally conductive filler is present at from 70% 85% by weight, and organic component comprises from 60 to 70 wt. % of a diglycidal ether of a bis-phenol compound, 4 to 30 wt. % of an acyclic aliphatic or cycloaliphatic or mononuclear aromatic diglycidal ether, 3 to 30% of a monofunctional epoxy compound, and 20-30% of a polyamine anhydride adduct.

Abstract: An epoxy resin composition for encapsulation of semiconductors which contains substantially no halogen-based flame retarding agents or antimony compounds having properties of moldability, flame retardance, high-temperature storage characteristics, reliability for moisture resistance, and solder cracking resistance. The epoxy resin composition for encapsulating semiconductors contains (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler and (E) a phosphazene compound as essential components, the total weight of phosphate ion and phosphite ion contained in the phosphazene compound being not more than 500 ppm. Further, the epoxy resin composition may optionally contain a flame-retarding assistant or an ion scavenger.

Abstract: Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) a curing agent comprising hexahydro-4-methylphthalic anhydride, (C) at least one a boron containing catalyst that is essentially free of halogen, and (D) at least one cure modifier. The encapsulant (11) may also optionally comprise at least one of ancillary curing catalysts, thermal stabilizers, UV stabilizers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip (4), and an encapsulant (11) comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.

Abstract: A halogen-free, phosphorus-free poly-cyclic compound is used a flame retardant. This compound has amide and hydroxy groups, and thus it is able to react with an epoxy resin to form a reactive type flame-retardant advanced epoxy resin. The advanced epoxy resin together with an inorganic additive are mixed with an epoxy resin to form a halogen-free, phosphorus-free flame-retardant epoxy composition, which can be used in the manufacture of a printed circuit board and as an encapsulation material for a semi-conductor device.

Abstract: A flip-chip type semiconductor device sealed with a light transmissive epoxy resin composition comprising (A) an epoxy resin having the following general formula (i):  wherein n is 0 or a positive number, (B) a curing accelerator, and (C) an amorphous silica-titania co-melt as at least one of inorganic fillers, said composition satisfying the relationship of the following formula (1): [ { 2 ⁢ ( n A 2 + n C 2

Abstract: Liquid coating compositions having improved mar and scratch resistance are disclosed. The coatings generally comprise one or more particles that have been modified to render the particles more surface active. The improved resistance is achieved without affecting the appearance or mechanical performance of the coatings. Methods for using the coatings, and the substrates coated therewith, are also disclosed.

Abstract: An epoxy resin composition comprising an epoxy resin, a phenolic resin curing agent, an inorganic filler, zinc molybdate on an inorganic support, and a complementary combination of two phosphazene compounds is effectively moldable, flame retardant and suitable for semiconductor encapsulation. A semiconductor device encapsulated with the cured epoxy resin composition is improved in flame retardance and moisture-proof reliability.

Abstract: Powder coating composition for automotive exterior coatings with compatibility with other coatings and resistance to yellowing include a film-forming material such as a polyepoxide and an acid-functional crosslinker that is a reaction product of 1,3,5-tris(2-hdyroxyethyl)isocyanurate and a cyclic anhydride.

Abstract: A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating free radicals upon heating, (2) hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) a radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material.

Abstract: An oil resistant, elastomeric rubber composite, particularly suited for use as an elastic tape for garments requiring a high degree of oil resistance due to conditions of its use. The rubber composite is made from a unique blend of nitrile rubber, polychloroprene (neoprene), epoxidised natural rubber and natural rubber. The elastomeric composite has excellent compatibility between two rubbers of different polarity when properly compounded and processed. The composite formed as an elastic tape has a low modulus of elasticity, good needle tear strength when sewn inside a garment, and it provides a comfortable fit for long use in addition to having reduced oil swell and oil abosorption characteristics. Elastic tapes made from the elastomeric rubber composite are particularly suitable for swimwear, shower caps, head bands, face masks and other garments with direct skin contact.

Abstract: An epoxy resin molding material which comprises as essential components thereof (A) a compound having at least two epoxy groups in one molecule, (B) a compound having at least two phenolic hydroxyl groups in one molecule, (C) a molecular compound represented by any one of general formulae (1) and (2) and (D) an inorganic filler. The material exhibits an increased curing rate and an excellent storage stability. (P represents phosphorus atom, R1, R2, R3 and R4 each represent a substituted or unsubstituted aromatic group or an alkyl group, A1 and A2 each represent a divalent aromatic group, B1 represents a single bond, a divalent group selected from ether groups, sulfone groups, sulfide groups and carbonyl groups or a divaient organic group having 1 to 13 carbon atoms and 0≦m≦0.75.

Abstract: A curable coating composition is disclosed comprising a resinous binder comprising (a) a reaction product of an epoxy-containing polymer with a compound containing phosphorus acid groups, the reaction product having reactive functional groups, and (b) a curing agent having functional groups reactive with the functional groups of (a). An electroconductive pigment is dispersed in (a) such that the weight ratio of the electroconductive pigment to (a) plus (b) is within the range of 0.5 to 9.0:1. When the curable coating composition is deposited and cured on a metal substrate, the cured coating is weldable.

Abstract: A composition having sealing and sound dampening properties is disclosed which comprises one or more polyepoxides comprising at least two epoxide groups per molecule; a thermoplastic polyester polymer; a curing agent adapted to react with the polyepoxides; inorganic particles having an oil absorption value of less than 70; and inorganic microparticles different from the previously mentioned inorganic particles, the inorganic microparticles having an average particle size prior to incorporation into the composition ranging from 0.5 to 200 microns. Multilayer composites, coated substrates, and methods for forming sound dampening coatings on a metallic substrate are also provided.

Abstract: A halogen-free, phosphorus-free poly-cyclic compound is used a flame retardant. This compound has amide and hydroxy groups, and thus it is able to react with an epoxy resin to form a reactive type flame-retardant advanced epoxy resin. The advanced epoxy resin together with an inorganic additive are mixed with an epoxy resin to form a halogen-free, phosphorus-free flame-retardant epoxy composition, which can be used in the manufacture of a printed circuit board and as an encapsulation material for a semi-conductor device.

Abstract: Disclosed are a resin dispersion and a cationic electrodeposition coating composition including the same, in which the dried coating film of the electrodeposition paint is lead-free and has an epoxy-acrylic double-layered structure for displaying excellent properties, and in which an organic solvent content can be minimized. A resin dispersion of a cationic electrodeposition includes an aqueous dispersion prepared by the following processes. The resin dispersion includes a cationic electrodeposition resin, deionized water, an acid for neutralization, a reaction product of manganese phosphate and an acid diluted in an deionized water to 10%, and a cationic surfactant.

Abstract: A method of joining electrically conductive materials comprises: Applying an electrically conductive adhesive to at least one electrically conductive material(s), wherein the electrically conductive adhesive is prepared from an epoxide-modified polyurethane, a cross-linking agent, an adhesion promotor and a conductive filler; and joining the electrically conductive material(s) with the applied adhesive to a substrate and curing the adhesive.

Abstract: The present invention provides a polymeric material and a process for making the polymeric material. The polymeric material has adhesive and noise abatement properties over a broad temperature range. Further, the material is chip and corrosion resistant and provides metal panel reinforcement.

Abstract: A flame-retardant epoxy resin composition includes an epoxy resin, a curing agent, and a metal hydroxide, wherein the curing agent as a phenolic resin (C) containing, in the molecular chain, structural units derived from a phenol (A) and structural units derived from an aromatic compound (B) other than the phenol (A), or the epoxy resin is a novolac epoxy resin CD) obtained by subjecting the phenolic hydroxyl groups of the phenolic resin (C) to etherification with glycidyl. The composition has a high degree of flame retardancy.

Abstract: Epoxy resin compositions comprising (A) an epoxy resin having an epoxy equivalent of at least 185 and possessing a structure in which two benzene rings can be directly conjugated, carbon atoms having an sp2 type atomic orbital accounting for at least 50% of all the carbon atoms, (B) a &bgr;-naphthol type phenolic resin curing agent, (C) a curing accelerator, and (D) an inorganic filler cure into products having satisfactory solder crack resistance on use of lead-free solder and improved flame retardance despite the absence of halogenated epoxy resins and antimony compounds and are thus suited for semiconductor encapsulation.

Abstract: The present invention is a pigmented coating composition, including a film-forming polymer comprising an epoxide polymer. The coating contains a mixture of crosslinking agents wherein at least one crosslinking agent is a polyamide functional compound and at least one crosslinking agent is a phenalkamine compound. The mixture of crosslinking agents is useful in stabilizing the pigment in the coating composition.

Abstract: To provide an anisotropically conductive adhesive composition that can be rapidly cured at a low temperature during thermocompression bonding and has a sufficiently long working life, while also exhibiting excellent mutual connection stability after connection between substrates. The anisotropically conductive adhesive composition comprises an epoxy resin comprising a cycloaliphatic epoxy resin and a glycidyl group-containing epoxy resin, an ultraviolet activatable cationic polymerization catalyst and a cationic polymerization retarder, and conductive particles.

Abstract: A conductive via filler for printed wiring boards capable of reducing copper oxides and thereby eliminating a cleaning step in printed wiring board construction, the conductive via filler consisting essentially of silver flake, a resin, a hardener, and a titanate coupling compound. The filler or paste may further include one or more of a flexibilizer, a solvent, and/or an accelerator. It is a feature of the invention that extensive pre-cleaning of copper substrates is obviated.

Abstract: An adhesive for semiconductor chips contains a first resin component which is polymerizable, a first hardener for inducing a self-polymerization reaction of the first resin component and a second hardener which is addition-polymerized with the first resin component. When the adhesive is applied on a wiring board and a semiconductor chip is applied thereon and heat is applied, the second hardener is addition-polymerized with the backbone of the three-dimensional network formed by the self-polymerization reaction of the first resin component. The first temperature at which the addition polymerization zone becomes a rubbery structure is lower than the second temperature at which the backbone becomes a rubbery structure, so that the elastic modulus loss sharply increases at the first temperature to reduce the stress between the semiconductor chip and the wiring board.

Abstract: A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, (D-i) an organopolysiloxane, (D-ii) an organopolysiloxane cured product, or (D-iii) a block copolymer obtained by reacting an epoxy resin or alkenyl group-bearing epoxy resin with an organohydrogenpolysiloxane, and (E) an inorganic filler. The composition has improved moldability and solder crack resistance while exhibiting high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.

Abstract: The present invention discloses a dielectric composition having two steps of laminating temperatures. The composition is comprised of: a diamine curing agent containing asymmetrical chemical structures with different reactivity; an epoxy resin compound, containing at least two epoxy groups; and inorganic powder. In addition, flame retardant and toughener are added dependent on the requirements.

Abstract: An epoxy resin composition comprising (A) an epoxy resin, (B) a curing accelerator, and (C) an inorganic filler is light transmissive when it satisfies formulae (1) and (2): [{2(nA2+nC2)−(nA+nC)2}/2]½<3.0×10−3  (1) [{2(fA2+fC2)−(fA+fC)2}/2]½<1.0×10−5  (2) wherein nA is the refractive index at T1° C. of the cured unfilled composition, nC is the refractive index at T1° C. of the inorganic filler, fA is a temperature coefficient of the refractive index of the cured unfilled composition, and fC is a temperature coefficient of the refractive index of the inorganic filler. The cured composition has improved heat resistance, humidity resistance and low stress as well as high transparency over a wide temperature range. The composition is suited for the sealing of optical semiconductor devices.

Abstract: Curable compositions, reaction products of which are reworkable through thermal decomposition, are provided. Specific compounds useful in such curable compositions, as well as curable compositions and thermosets incorporating such compounds, are provided in the present invention. The compounds include a cyclic hydrocarbon moiety including an oxirane or thiirane group and an aromatic ether moiety including an oxirane or thiirane group. The cyclic hydrocarbon moiety and the aromatic ether moiety are joined to each other through an oxycarbonyl-containing linkage or a thiocarbonyl-containing linkage, preferably a secondary or tertiary linkage. Compositions incorporating such compounds are capable of curing by exposure to a specific temperature, and are decomposable at a temperature in excess of the curing temperature, thus providing a composition which is reworkable.

Abstract: A damage resistant and tolerant optical element is disclosed. Prior art solid or liquid host matrices are replaced by a soft crosslinked polymer or similar host material. The viscoelastic properties of the matrix host material are controlled during formation so that there are regions of different softness, of stiffness, within the matrix, to form a stiffness gradient. Preferably, the matrix will be softest at a preselected focal plane where maximum electromagnetic radiation or energy output may be expected. The host matrix is doped with a light altering dopant having a concentration distribution, preferably such that the concentration of light limiting dopant is highest in the region where the host matrix material is most soft. Two important disclosed example embodiments are an optical limiter and a solid state dye laser.

Abstract: A composition suitable for use in dental medicine and/or dentistry polymerizable by cationic polymerization consists of one or more epoxy compounds, a plasticizer, a catalyst for hardening by ring opening, a catalyst for hardening by light and an accelerator consisting of a non alkaline tertiary amine. At radiation with a light having a wavelength of 340-500 nm the composition hardens practically free of contraction and adhesiveness.

Abstract: This invention relates to an article comprising a bio-supportive matrix comprising at least one bio-limiting agent and at least one nutritional source on a substrate. The invention also relates to the bio-supportive matrix and methods of using the matrix. The present invention can be used as a biological barrier to unwanted organisms, such as animals and plants, by producing allelochemicals that either kill or repel those organisms. The invention could be used as a coating on a vessel to prevent fouling of vessels. The invention may also be used to manufacture specific allelochemicals such as drugs or pharmaceuticals. The invention also relates to a method of preparing a bio-limiting ecological substrate useful as a means for producing allelochemicals, comprising the steps of providing a bio-supportive matrix as described above, and exposing the matrix to the environment, wherein the matrix is prepared to provide a biomass that produces the desired allelochemicals.

Abstract: The present invention relates to a powder coating composition containing a low temperature curable epoxy resin, and more particularly to a powder coating composition containing a low temperature curable epoxy resin, which can be readily cured at a low temperature, thereby capable of being applied to coating objects that are noneconomical in terms of workability at an elevated temperature, or are thermally sensitive. The present invention provides a powder coating composition comprising 100 parts by weight of a low temperature curable epoxy resin; 30 to 500 parts by weight of a bisphenol-A curing agent or a polyester curing agent; 0.1 to 20 parts by weight of a defoaming agent; and 0.1 to 20 parts by weight of a leveling agent.

Abstract: An composition with improved electrical stability for use in microelectronic applications comprises a polymeric resin, a conductive filler, a curing agent, optionally either a reactive or a nonreactive diluent and a corrosion inhibitor to provide the electrical stability.

Abstract: Novel cold-curing mixtures comprising epoxide compounds, curing agents, additives and optionally further auxiliary and filler materials, which have low irritant potential, which are free of solvents and are self-levelling and which, in the cured state, are colorfast and have a surface which, in terms of optical and tactile properties, is faultless.

Abstract: The invention is directed to gassing stabilized aqueous coating compositions comprising A) a metallic pigment and at least one reaction product of: (a) 5 to 95 weight percent of a at least one phosphonic acid derivative selected form compound I and II wherein R1 is H or O═P(OH)2; R2 and R3 are independently H, OH or an aliphatic, cycloaliphatic and aromatic substituent having 1 to 25 carbon atoms and optionally up to 10 heteroatoms of at least one of oxygen and phosphorus; and R′ is an aliphatic, cycloaliphatic and aromatic substituent having 1 to 25 carbon atoms and optionally up to 10 heteroatoms of at least one of oxygen and phosphorus; (b) 5 to 95 weight percent of a at least one compound having at least two epoxy groups and a number average molecular weight Mn of 300 to 5000 g/mol; and (c) 0 to 90 weight percent of a compound having one epoxy-functional group, wherein the proportions by weight of components (a), (b) and (c) total 100 weight percent.

Abstract: A one part, several-months-useful-shelf-life epoxy material suitable for potting and sealing electronic components, and which is compatible with the high, approximately 255° C. to 275° C. temperatures required for soldering modem lead-free solders comprises an intimate mixture of the following components: approximately 2 to 13 per cent by weight of diglycidyl ether bisphenol A resin; approximately 40 to 70% phenol formaldehyde resin and the following further components [(2-methylphenoxy)methyl]-oxirane or o-cresol glycidyl ether) 0.5-8% by weight; polypropyleneglycol-glycidyl ether resin (plasticizer) 2-10% by weight; cycloaliphatic polyamine (catalyst) 4-15% by weight; kaolin clay (filler) 2-20% by weight; magnesium alumino silicate (filler) 2-15% by weight; Sb2O3 (filler) 4-5% by weight, and hydrated Al2O3 (filler) 0-15% by weight.

Abstract: The present invention is directed to polymer-ceramic composites having high dielectric constants formed using polymers containing a metal acetylacetonate (acacs) curing catalyst. In particular, it has been discovered that 5 weight percent Co(III) acac can increase the dielectric constant of DER661 epoxy by about 60%. The high dielectric polymers are combined with fillers, preferably ceramic fillers, to form two phase composites having high dielectric constants. Composites having about 30 to about 90% volume ceramic loading and a high dielectric base polymer, preferably epoxy, have been discovered to have a dielectric constants greater than about 60. Composites having dielectric constants greater than about 74 to about 150 are also disclosed. Also disclosed are embedded capacitors with capacitance densities of at least 25 nF/cm2, preferably at least 35 nF/cm2, most preferably 50 nF/cm2. Methods to increase the dielectric constant of the two phase composites having high dielectric constants are also provided.

Abstract: A resist composition for permanent protective coating of a printed wiring board, which resist composition is excellent in flame resistance and is obtained by incorporating as essential components a flame retardant containing 100 to 140 parts by weight of (a) aluminum hydroxide, 0.1 to 15 parts by weight of (b) a molybdenum compound and 0.1 to 10 parts by weight of (c) a zinc stannate type compound into 100 parts by weight of a resin.

Abstract: A method of restoring a damaged surface of a substrate to a functional condition through a filler material consisting essentially of tungsten disulfide and epoxy resin having a 10:1 ratio by weight. The filler material is cured after being applied to the damaged surface by uniformly raising the temperature to a cure temperature of the epoxy to allow any volatiles to evaporate without the creation of voids in the surface such that the resulting porosity prevents corrosion of the substrate when exposed to aromatic fuels at temperatures of 350 degrees F. The filler material consists of tungsten disulfide and a two part epoxy such as Hysol EA 9394/C-2.

Abstract: Semiconductor encapsulating epoxy resin compositions comprising an epoxy resin, a phenolic resin curing agent, a fire retardant comprising zinc molybdate carried on spherical silica having a mean particle diameter of 0.2-20 &mgr;m and a specific surface of 1-20 m2/g, and an inorganic filler are able to provide cured products having excellent fire retardance. The compositions have good flow and curing properties and excellent reliability and do not pose a hazard to human health or the environment.

Abstract: An composition with improved electrical stability for use in microelectronic applications comprises a polymeric resin, a conductive filler, a curing agent, optionally either a reactive or a nonreactive diluent and a corrosion inhibitor to provide the electrical stability.

Abstract: The present invention provides a method of accelerating hardening of thermosetting resin and a device therefor such that hardening time is rendered far shorter than in the case of the prior art. By way of a pertinent means, when unhardened thermosetting resin is to be disposed in an atmosphere having a specified temperature for the purpose of hardening, a ceramic plasma spraying plane is formed in at least one portion, or preferably in as large an area as possible, in the above-mentioned atmosphere whose temperature is maintained at a specified level and in which the above-mentioned resin is disposed, thereby causing convective heat existing in the hot air to be thermally converted into far infrared radiant heat radiation from the ceramic plasma spraying plane mentioned above.

Abstract: A connecting material that can be used in the mounting of semiconductor devices on a circuit substrate for semiconductor devices, contains the following components A to C: (A) an epoxy resin; (B) a phenol compound having two or more phenolic hydroxyl groups; and (C) a latent curing agent, where it is preferred that if the ratio of the number of phenolic hydroxyl group equivalents of the phenol compound of component B to the number of epoxy equivalents of the epoxy resin in the connecting material is 0.2 to 1.0.

Abstract: Disclosed are a resin dispersion and a low-temperature curable cationic electrodeposition coating composition including the same, in which the dried coating film of the electrodeposition paint is lead-free and has an epoxy-acrylic double-layered structure for displaying excellent properties, and in which an organic solvent content can be minimized. The resin dispersion includes a cationic electrodeposition resin, deionized water, an acid for a neutralization, a reaction product of manganese phosphate and an acid diluted to a concentration of 10% in deionized water and a cationic surfactant.

Abstract: A liquid epoxy-based potting composition has a glass transition temperature equal to or greater than 200° C. and comprises a cyclo-aliphatic epoxy, present in an amount of 50 to 80 parts by weight; a multi-functional aromatic epoxy (having more than two epoxy groups per molecule), present in an amount of 20 to 50 parts by weight; a liquid anhydride, present in an amount of 80 to 150 parts by weight; a basic latent accelerator, present in an amount of 1 to 5 parts by weight; and a filler, present in an amount of 100 to 500 parts by weight.

Abstract: A current limiting PTC device (10) has two electrodes (14) with a thin film of electric conducting polymer material (20) disposed between the electrodes, the polymer material (20) having superior flexibility and short circuit performance, where the polymer material contains short chain aliphatic diepoxide, conductive filler particles, curing agent, and, preferably, a minor amount of bisphenol A epoxy resin.

Abstract: A process for producing a phenolic resin of good hue, characterized by reacting a hydroxylated aromatic compound with an unsaturated cyclic hydrocarbon compound in the presence of both active hydrogen and a reducing metal compound with the aid of an acid catalyst, subsequently deactivating the catalyst, and then removing the catalyst, the metal compound, and the starting materials remaining unreacted; and a process for producing an epoxy resin which comprises a step of reacting the phenolic resin with an epihalohydrin. By these processes, a phenolic resin and an epoxy resin are obtained which each is colored little and has an excellent hue. These resins are useful as resins for electrically insulating materials, especially as resins for semiconductor encapsulation materials and for laminated plates.

Abstract: The invention is directed to novel epoxy molding compounds for the encapsulation of microchips in the electronics industry. Known epoxy molding encapsulants are generally prepared from a blend epoxy resins, phenol hardeners, silica fillers, catalysts, flame retardant materials, processing aids and colorants. The addition of polybenzoxazines as a co-reactant with one or several epoxy resins provides a product with reduced moisture adsorption while maintaining a high glass transition temperature.

Abstract: A method of restoring a damaged surface of a substrate to a functional condition through a filler material consisting essentially of tungsten disulfide and epoxy resin having a 10:1 ratio by weight. The filler material is cured after being applied to the damaged surface by uniformly raising the temperature to a cure temperature of the epoxy to allow any volatiles to evaporate without the creation of voids in the surface such that the resulting porosity prevents corrosion of the substrate when exposed to aromatic fuels at temperatures of 350 degrees F. The filler material consists of tungsten disulfide and a two part epoxy such as Hysol EA 9394/C-2.