Abstract: The invention relates to an anti-corrosion system for metals consisting of at least one finish or coating that can be applied to a metal, said finish or coating comprising an organic matrix. The organic matrix also contains anti-corrosion pigments, which are finely distributed throughout the organic matrix. The anti-corrosion pigments are formed from a metal alloy of at least two metals and optionally from inevitable impurities. The invention also relates to a corresponding anti-corrosion pigment.

Abstract: A composition for controlling a temperature elevation of an electronic component when soldering the electronic component on a substrate, includes a first resin for providing the composition with adhesion to the electronic component, a curing agent for curing the first resin by heat treatment for soldering, and a second resin for facilitating removal of the composition from the electronic component.

Abstract: Provided is an adhesive composition, which exhibits a melt viscosity at 40 to 80° C. of not more than 10,000 Pa·s, and which after heating for a period of 1 minute to 2 hours at a temperature within a range from 80° C. to (T+50)° C., exhibits a melt viscosity at a temperature of 100° C. to (T+30)° C. that is within a range from 100 to 10,000 Pa·s (wherein, T represents the curing start temperature for the composition). The adhesive composition is capable of forming a cured product that exhibits excellent filling of substrates with finely patterned circuits, excellent lamination performance at low temperatures, a low elastic modulus, and excellent levels of adhesion and heat resistance. The adhesive composition is useful for providing an adhesive film and for producing a semiconductor device.

Abstract: The disclosure relates to an X-ray opaque coating containing an epoxy resin including an iodinated phenol covalently bonded to a glycidyl ether. Iodinated phenol covalently bonded to a glycidyl ether may include iodinated bisphenol A, such as tetraiodobisphenol A, a glycidyl ether of mono-iodophenol, bis-iodophenol, tri-iodophenol, or combinations thereof. The coating may include an X-ray opaque inorganic filler. The disclosure also relates to an electronic component including a substrate and at least one device coupled to the substrate with an obfuscation layer disposed over the substrate for obscuring the device from an X-ray source. The obfuscation layer may include an X-ray opaque coating. The disclosure additionally relates to a method of obscuring at least a portion of an electronic component by depositing an obfuscation layer that may include an X-ray opaque coating and a method of forming an X-ray opaque coating.

Abstract: A reworkable thermoset epoxy-containing material that allows for a reworkable assembly such as a reworkable waferlevel underfilled microelectronic package. A method for using the reworkable thermoset material in the formation of a microelectronic package using this material.

Abstract: Film-forming materials include resins and/or crosslinkers having a —Si(OR)3 group. Film-forming resins can include epoxy, acrylic, polyurethane, polycarbonate, polysiloxane, polyvinyl, polyether, aminoplast, and polyester resins. A process to produce a film-forming resin includes reacting various polymers to incorporate a pendent group comprising a —Si(OR)3 group. Film-forming resins can be used in methods of producing coating compositions. Coating compositions can be used to coat a substrate, such as a metal substrate, by electrodeposition. Applied coatings containing the film-forming resins can be cured to form crosslinked films on substrates.

Abstract: Film-forming materials include nonionic metal coordinating structures. Nonionic metal coordinating structures can coordinate metals, such as metal catalysts and metal substrates. Example film-forming materials can be the product of a poly-functional epoxide and a nucleophilic ligand having a nonionic metal coordinating structure, or the product of a poly-functional alcohol and an electrophilic ligand having a nonionic metal coordinating structure.

Abstract: Water absorption resistant polyimide/epoxy-based compositions, like pastes (or solutions), are particularly useful to make electronic screen-printable materials and electronic components. A group of hydrophobic epoxies (and soluble polyimides) was discovered to be particularly resistant to moisture absorption. The polyimide/epoxy pastes made with these epoxies (and these polyimides) may optionally contain thermal crosslinking agents, adhesion promoting agents, blocked isocyanates, and other inorganic fillers. The polyimide/epoxy pastes of the present invention can have a glass transition temperature greater than 250° C., a water absorption factor of less than 2%, and a positive solubility measurement.

Abstract: An epoxy adhesive composition of an epoxy resin, an epoxy terminated liquid rubber, filler, and an amine curing package for said epoxy resin is disclosed. Advantageously, a short chain diol will be incorporated into the adhesive in order to enhance reactivity and strength build. Advantageously, a mixture of amines will be used in the curative including multifunctional aliphatic amines that improve adhesion and strength build; tertiary amines which are used to enhance adhesion and strength build, polyamides which can be used to provide flexibility; and amine-terminated rubbers (ATBN) which can improve toughness and impact resistance to the cured system. The preferred short chain diol is glycerin. Surfaces of adherends are joined with the dried residue of the epoxy adhesive composition by applying the epoxy resin composition to one or both surfaces, joining the surfaces, and applying pressure, optionally with heating.

Abstract: This invention provides a heat curable resin composition for light reflection, which, after curing, can realize high reflectance in a range of visible light to near ultraviolet light, has excellent heat deterioration resistance and tablet moldability, and is less likely to cause burrs during transfer molding, and a process for producing the resin composition, and an optical semiconductor element mounting substrate and an optical semiconductor device using the resin composition. The heat curable resin composition for light reflection comprises a heat curable component and a white pigment and is characterized in that the length of burrs caused upon transfer molding under conditions of molding temperature 100° C. to 200° C., molding pressure not more than 20 MPa, and molding time 60 to 120 sec is not more than 5 mm and the light reflectance after heat curing at a wavelength of 350 nm to 800 nm is not less than 80%.

Abstract: This invention concerns a thermosetting resin system that is useful in the manufacture of high performance prepreg, laminate and composite materials as well as, prepregs, laminates and composites made from the thermosetting resin composition.

Abstract: A thermosetting epoxy resin composition characterized by containing as a resin ingredient a product of pulverization of a solid matter obtained by reacting a triazine derivative/epoxy resin with an acid anhydride in such a proportion that the amount of the epoxy groups is 0.6-2.0 equivalents to the acid anhydride groups.

Abstract: The present invention relates to a lead-free, non-toxic and arc resistant composite material having a thermosetting polymer, at least one heavy particulate filler, at least one light particulate filler and, optionally, at least one arc resistant filler. The composite material may be utilized in manufacturing articles used in radiation shielding and other applications where arc resistant and dielectric strength are desired.

Abstract: As a paint composition of cationic electrodeposition and a method preparing thereof, the paint composition of cationic electrodeposition comprises about 42 to about 47 percent by weight of a cationic electrodeposition resin composition, about 6 to about 13 percent by weight of a pigment paste composition, and about 40 to about 48 percent by weight of ion exchange water. An electronic part film coated by utilizing the paint composition of cationic electrodeposition on alloy such as an iron, an aluminum, etc. does not include a lead and a tin. In addition, when assembling electronic parts, an error rate is minimized by inhibiting frictional static electricity through anti-static capacity, and the probability of a fire is dirninished by inhibiting static electricity.

Abstract: In accordance with the present invention, it has now been found that glycidyl epoxy resins containing substitution on the epoxide ring can be used with conventional epoxy curing agents and fluxing agents to produce underfill adhesives that are suitable for use with silver-based alloys. Owing to the structural similarity of the new materials to conventional epoxy resins, physical and material properties of the invention formulations are altered little, if at all, relative to products currently in use, and so are highly compatible with existing processes.

Abstract: There are described compositions and methods for the laser marking of products or their packaging. The compositions comprise transition metal oxides, saccharides and/or flame-retardant agents, optionally with other additives, dispersed in a carrier.

Abstract: A molding compound is provided for use in encapsulating electronic packages which include an optoelectronic component, such as an LED. The molding compound includes a partially cured epoxy composition, an antioxidant, and, optionally, a phosphor material substantially uniformly distributed throughout the epoxy composition. The optional phosphor material may be suspended within the epoxy composition by pre-reacting a portion of the epoxy composition prior to B-staging of the molding compound. As such, the optional phosphor material is suspended within the epoxy composition, thereby preventing settling of the phosphor material during B-staging, as well as during curing of the molding compound in the encapsulation process.

Abstract: A solid surface material suitable for use as a countertop contains a resin and a filler which includes clean dry glass powder produced from unsorted post-consumer waste glass, including a substantial fraction of non-glass items. The powdered glass is used as at least a portion of the filler and/or gelling agent in lieu of or in addition to other fillers and gelling agents known in the art.

Abstract: A resin coated metal plate having excellent formability comprises, on a metal plate, a resin coating layer containing a conductive filler and a corrosion inhibitor, a matrix resin constituting the resin coating layer is made mainly of a flexible epoxy resin and has a modulus of elasticity of not less than 3 GPa. When secondarily cured, the resin coated metal plate is imparted with excellent weldability and corrosion resistance.

Abstract: There is provided an epoxy resin composition for encapsulating a semiconductor essentially comprising (A) a phenolaralkyl type epoxy resin having a phenylene structure, (B) a phenolaralkyl resin having a biphenylene structure, (C) a curing accelerator containing an adduct of a phosphine compound and a quinone compound, (D) a compound in which hydroxyl groups are attached to each of two or more adjacent carbon atoms of an aromatic ring, (E) a silane coupling agent and (F) an inorganic filler, wherein the inorganic filler (F) is contained in 84 wt % to 92 wt % both inclusive in the total amount of the epoxy resin composition.

Abstract: The invention relates to an epoxy resin molding material for sealing, comprising an epoxy resin (A), a curing agent (B), and a colorant resin mixture (C) wherein a resin (C1) and a colorant (D) having an electric resistivity of 1×105?·cm or more are beforehand mixed with each other. This can provide an epoxy resin molding material for sealing which is good in moldabilities such as fluidity and curability, and colorability, and which does not cause a short circuit failure based on an electroconductive material even when the material is used in a package wherein the distance between pads or wires is small; and an electronic component device equipped with an element sealed therewith.

Abstract: A high-solids anticorrosive coating composition which comprises a main ingredient (A) comprising an epoxy resin (a1) and a hardener ingredient (B) comprising an alicyclic amine hardener (b1) and/or a Mannich type hardener (b2), the ingredient (A) and/or the ingredient (B) containing at least either of an additive (a2) selected among epoxidized reactive diluents and modified epoxy resins and a coating film modifier (ab) selected among petroleum resins, xylene resins, coumarone resins, terpene phenol resins and vinyl chloride copolymers. The high-solids anticorrosive coating composition especially of the rapidly curable type is characterized by containing a high-boiling organic solvent having a boiling point exceeding 150° C. and containing substantially no organic solvent having a boiling point of 150° C. or lower.

Abstract: A flame-retardant epoxy resin composition, as well as an electronic device, a laminated circuit board, a multilayered circuit board and a printed circuit board employing the flame-retardant epoxy resin composition are disclosed. The flame-retardant epoxy resin composition contains: an epoxy resin; an epoxy resin curing agent; and flame-retardant particles containing a metal hydrate. The flame-retardant particles are provided with a coating layer on the surfaces thereof and have a volume average particle diameter in a range from 1 to 500 nm.

Abstract: An encapsulating epoxy resin molding material comprising (A) an epoxy resin, (B) a curing agent, and (C) a silane coupling agent having a secondary amino group or (D) a phosphate, and semiconductor devices encapsulated therein. The encapsulating epoxy resin molding material for thin semiconductor devices according to this invention is excellent in fluidity, and the semiconductor device encapsulated therein, which is a semiconductor device having a semiconductor chip arranged on a thin, multi-pin, long wire, narrow-pad-pitch, or on a mounted substrate such as organic substrate or organic film, is free of molding defects such as wire sweep, voids etc. as shown in the Examples, and thus its industrial value is significant.

Abstract: Provided are a non-halogen flame retardant epoxy resin composition comprising (A) a silicon-containing, phosphorus-modified epoxy resin, (B) a multifunctional epoxy resin, (C) a mixed curing agent of an amine curing agent and a phenolic curing agent and (D) a metal hydrate inorganic flame retardant, and a prepreg and copper-clad laminate using the same. The epoxy resin composition in accordance with the present invention exhibits excellent flame retardancy without use of a halogen flame retardant, and also advantageously provides well-balanced various physical properties which are to be required in copper-clad laminates, such as higher heat resistance and copper peel strength, and lead heat-resistant characteristics after moisture absorption.

Abstract: This invention concerns a thermosetting resin system that is useful in the manufacture of high performance prepreg, laminate and composite materials as well as, prepregs, laminates and composites made from the thermosetting resin composition.

Abstract: Polymer-ceramic composite materials for use in the formation of capacitors, which materials exhibit very low changes in temperature coefficient of capacitance (TCC) in response to changes in temperature within the range of from about ?55° C. to about 125° C. Specifically, these capacitor materials have a change in TCC ranging from about ?5 % to about +5 %, in response to changes in temperature within the desired temperature range. The inventive composite materials comprise a blend of a polymer component and ferroelectric ceramic particles, wherein the polymer component includes at least one epoxy-containing polymer, and at least one polymer having epoxy-reactive groups. The inventive polymer-ceramic composite materials have excellent mechanical properties such as improved peel strength and lack of brittleness, electrical properties such as high dielectric constant, and improved processing characteristics.

Abstract: Multi-component epoxy-amine primer systems are disclosed, which comprise an amine component that comprises a polythioether. Also disclosed are substrates coated with such primer systems as well as methods for coating substrates with such primer systems.

Abstract: The present invention relates to a method for producing a flat article comprising a material that contains the products of several reactions. The method comprises the following steps: carrying out a pre-cross-linking of a mixture comprising an epoxydation product of a carboxylic acid ester using at least one cross-linking agent in order to form a mouldable material; moulding the mouldable material in the shape of a flat article; and curing the moulded material in order to produce a flat article, wherein the pre-cross-linking reaction is separate from the curing reaction. This invention also relates to a mouldable material that can be stored and to a flat article that can be obtained from the same.

Abstract: A corrosion resistant, alkali resistant coating composition is disclosed. The composition comprises a binder comprising a reaction product of an epoxy-containing material and a phosphorus-containing material together with a curing agent. Aminoplasts, especially melamine-based aminoplasts, are particularly suitable curing agents. A source of silicon can optionally be included. The compositions also provide excellent adhesion and can be used with or without a weldable primer. The compositions are applied to and cured on a metal substrate.

Abstract: Multi-component epoxy-amine primer systems are disclosed, which include an epoxy component and an amine component that includes a mercaptan terminated material. At least one of the epoxy component and the amine component includes a sulfur-containing polymer. Also disclosed are substrates coated with such primer systems as well as methods for coating substrates with such primer systems.

Abstract: The present invention is directed to a passivating material suitable for passivating a metal surface. The passivating material comprises a polymer which comprises (a) at least one nitro group, and/or pyridine group, and/or phenolic hydroxyl group; and (b) at least one group selected from a phosphorous-containing group and/or a carboxylic acid group, wherein the at least one phosphorous-containing group is selected from a phosphate, a phosphite, or a non-nitrogen substituted phosphonate.

Abstract: In an epoxy resin composition comprising (A) an epoxy resin, (B) a curing agent, (C) an inorganic compound, and (D) an inorganic filler, the inorganic compound (C) is an oxide of metal elements at least one of which is a metal element of Group II in the Periodic Table having a second ionization potential of up to 20 eV, typically Zn2SiO4, ZnCrO4, ZnFeO4 or ZnMoO4. When used for semiconductor encapsulation, the epoxy resin composition is highly reliable and cures into a product which is effective for minimizing electrical failure such as defective insulation due to a copper migration phenomenon.

Abstract: A resin composition usable for encapsulating a semiconductor, comprising (A) an epoxy resin having two or more epoxy groups in one molecule; (B) a curing agent; and (C) inorganic composite oxide particles constituted by silicon dioxide and at least one metal oxide selected from the group consisting of oxides of metal atoms belonging to Group III and Group IV of the Periodic Table excluding silicon; a semiconductor device comprising a wiring circuit board, a semiconductor element, and the above resin composition; and a method for manufacturing a semiconductor device comprising the steps of adhering a resin sheet comprising the resin composition of claim 1 and a stripping sheet to a semiconductor circuit side of a bump-mounting wafer, removing the stripping sheet leaving only the resin composition to the wafer, and cutting the wafer into individual chips.

Abstract: Provided is a coating composition containing (a) a resinous binder composition including an epoxy-functional polymer; and (b) a solid particulate composition dispersed in the resinous binder composition including (i) an electrically conductive material and (ii) a corrosion inhibitive material. The electrically conductive material (i) and the corrosion inhibitive material (ii) are present in a weight ratio of the conductive material (i) to the corrosion inhibitive material (ii) ranging from 1:8 to 12:1. The composition is characterized in that when applied to a conductive substrate to form a coating thereon, the coating is weldable. Coated substrates and related methods are further provided.

Abstract: Elastomers are formed from castor oil and/or ricinoleic acid estolides and a polyester formed from an epoxidized vegetable oil such as ESO and a polycarboxylic acid such as sebacic acid, optionally in the presence of a peroxide initiator, or include crosslinked reaction products derived from ricinoleic acid or castor oil estolides, epoxy group-containing compounds such as epoxy resins and/or epoxidized vegetable oil, epoxy hardeners such as polyamine and polycarboxylic acid hardeners, thermally activated free radical initiators such as peroxides, and optionally but preferably include fillers such as limestone or wood flour. The elastomers can be prepared using a two-step, solvent-less procedure at elevated or ambient temperatures. These predominantly “all-natural” elastomers have physical properties comparable to conventional petroleum-based elastomers and composites and exhibit good flexibility, resiliency, abrasion resistance and inertness to hydrolysis.

Abstract: A weldable coating composition is disclosed. The composition comprises a binder in which is dispersed a conductive pigment and a source of silicon. Enhanced corrosion protection is offered, without sacrificing weldability of the coating layer. The composition is applied to and cured on a metal substrate.

Abstract: A molding compound is provided for use in encapsulating electronic packages which include an optoelectronic component, such as an LED. The molding compound includes a partially cured epoxy composition, an antioxidant, and, optionally, a phosphor material substantially uniformly distributed throughout the epoxy composition. The optional phosphor material may be suspended within the epoxy composition by pre-reacting a portion of the epoxy composition prior to B-staging of the molding compound. As such, the optional phosphor material is suspended within the epoxy composition, thereby preventing settling of the phosphor material during B-staging, as well as during curing of the molding compound in the encapsulation process.

Abstract: A flame retardant epoxy resin composition for semiconductor encapsulation includes as essential components, (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a phosphazene compound of the average compositional formula (1) having a melting point of 110–130° C., wherein a, b and n are numbers satisfying 0<a?0.05n, 1.90n?b<2n, 2a+b=2n, and 3?n?6, the composition being substantially free of bromides and antimony compounds.

Abstract: The thermoplastic molding composition comprises components A, C, D, E and, where appropriate, B, F and G, the total weight of which is 100% by weight, and also component H: a) as component A, from 5 to 94.8% by weight of at least one polyaryl ether sulfone, b) as component B, from 0 to 20% by weight of at least one functionalized polyaryl ether sulfone, c) as component C, from 5 to 94.8% by weight of at least one polyamide, d) as component D, from 0.1 to 10% by weight of at least one epoxy resin, e) as component E, from 0.1 to 60% by weight of fibrous or particulate fillers or a mixture of these, f) as component F, from 0 to 40% by weight of impact-modifying rubbers which have functional groups, g) as component G, from 0 to 40% by weight of other conventional additives and processing aids, h) as component H, from 100 ppm to 0.5% by weight, based on the amounts of components A to G, of copper bromide and/or copper iodide.

Abstract: A curable epoxy resin composition comprising at least: (A) a crystalline epoxy resin, (B) a phenol resin, and (C) a silicone resin composed of epoxy-containing organic groups and phenyl groups that define an average unit formula of this component. Component (C) is used in an amount of 0.1 to 500 parts by weight for 100 parts by weight of the sum of weights of components (A) and (B). The composition of the invention is suitable for transfer and injection molding and may find use as a curable epoxy resin composition for sealing parts of electrical and electronic devices.

Abstract: A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, (D-i) an organopolysiloxane, (D-ii) an organopolysiloxane cured product, or (D-iii) a block copolymer obtained by reacting an epoxy resin or alkenyl group-bearing epoxy resin with an organohydrogenpolysiloxane, and (E) an inorganic filler. The composition has improved moldability and solder crack resistance while exhibiting high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.

Abstract: The present invention discloses an organic-inorganic hybrid composition with a high dielectric constant, which can be used as a bonding layer having a high thermal stability and a high dielectric constant. The composition includes a) a high Tg epoxy resin system; b) ferroelectric ceramic particles having two particle size distributions, with one of them pertaining to a nano level; c) at least one macromolecular flexibilizer; d) a macromolecular dispersant; and e) additives such as a diluent, an adhesive promoter, a catalyst, and an organic solvent.

Abstract: A new damage resistant and tolerant optical element is disclosed. Prior art solid or liquid host matrices are replaced by a soft crosslinked polymer or similar host material. The viscoelastic properties of the matrix host material are controlled during formation so that there are regions of different softness, of stiffness, within the matrix, to form a stiffness gradient. Preferably, the matrix will be softest at a preselected focal plane where maximum electromagnetic radiation or energy output may be expected. The host matrix is doped with an appropriate dopant having a concentration distribution, preferably such that the concentration of dopant is highest in the region where the host matrix material is most soft. Two important disclosed example embodiments are an optical limiter and a solid state dye laser.

Abstract: A molding compound for use in encapsulating electronic packages which include an optoelectronic component, such as an LED, is provided. The molding compound of the present invention includes a partially cured epoxy composition having a phosphor material substantially uniformly distributed throughout the epoxy composition. The phosphor material may be suspended within the epoxy composition by pre-reacting a portion of the epoxy composition prior to B-staging of the molding compound. As such, the phosphor material is suspended within the epoxy composition, thereby preventing settling of the phosphor material during B-staging, as well as during curing of the molding compound in the encapsulation process.

Abstract: Described is a coating composition adapted to enhance the adhesion of a polymeric coating or film applied to a substrate. The coating composition is interposed between the substrate and the polymeric coating and comprises (a) at least one coupling agent, partial hydrolysates thereof or mixtures thereof in a concentration greater than 25 weight percent, based on the weight of the total composition, and (b) an adhesion enhancing amount of an epoxy-containing material having at least two epoxy groups. The coating composition is substantially free of photochromic materials and colloidal particles chosen from silica, alumina or mixtures thereof. Also described is a process for using the coating composition and articles coated with the composition and additional coatings and films which can be photochromic.

Abstract: Anti-fouling coating composition containing high amounts of zinc, and novel methods of applying melt compounded anti-fouling coating compositions to components by heat fusion techniques. The components that can be treated include fresh water or salt water exposed components that are prone to biomass and fouling buildup. The marine exposed components can include running gear components, such as but not limited to, propellers, rudders, struts, shafts, bow thrusters, boat hulls (fiberglass or metallic) and the like.

Abstract: The invention provides a method for adhering two substrates comprising: providing an adhesive film having a first surface and a second surface; irradiating the adhesive film with ultraviolet radiation to provide an activated adhesive film having a first activated surface and a second activated surface; cooling the activated adhesive film either while irradiating or immediately after irradiating the film; contacting the first activated surface with a first substrate; contacting the second activated surface with a second substrate; and applying heat and pressure to the first and second substrates to cure the activated adhesive film and to bond the substrates to one another.

Abstract: Reworkable thermoset acid-cleavable acetal and ketal based epoxy oligomers can be B-staged into a tack free state. Compositions containing the epoxy oligomers are employed in a reworkable assembly such as a wafer-level underfilled microelectronic package.

Abstract: The present invention provides a thermosetting resin composition useful as a highly filled low CTE underfilling sealant composition which completely fills the underfill space in a semiconductor device, such as a flip chip assembly which includes a semiconductor chip mounted on a carrier substrate, enables the semi-conductor to be securely connected to a circuit board by heat curing and with good productivity, and demonstrates acceptable heat shock properties (or thermal cycle properties). The thermosetting resin composition which is used as an underfilling sealant between such a semiconductor device and a circuit board to which the semiconductor device is electrically connected, includes an epoxy resin component, a latent hardener component, and a polysulfide-based toughening component. The latent hardener component includes a modified amide component and a latent catalyst therefor.