Abstract: An antireflection coating film for an optical element is provided on a surface of a substrate of an optical material and includes first particles having a refractive index (nd) of at least 2.2 or more for the d-line and an average particle size of 10 to 70 nm, second particles of at least one of silica and sericite and having an average particle size of 1 to 11 ?m, a colorant of an organic substance and soluble in an organic solvent, and a resin, in which the first particle content is in the range of 10% to 35% by weight, and second particle content is in the range of 1% to 11% by weight. The antireflection coating film has a high effect of preventing surface reflection, a high effect of preventing inner-surface reflection, satisfactory absorption of visible light, and low levels of reflection and scattering in the film.

Abstract: There is provided a colloidal particle of an oxide of at least one metal selected from the group consisting of Ti, Fe, Zr, Sn, Ta, Nb, Y, Mo, W, Pb, In, Bi, and Sr, which is capable of being dispersed in a hydrophobic organic solvent, and a hydrophilic organic solvent dispersed sol thereof or a sol thereof dispersed in a hydrophobic organic solvent having a solubility of water of 0.05 to 12% by mass, and further, a fine powder of a metal oxide colloidal particle capable of being redispersed in various organic solvents. A silane treated modified metal oxide colloidal particle on the surface of which an amine compound and 1 to 4 silyl group(s) per 1 nm2 of the surface area are bonded, and which is produced by coating a metal oxide colloidal particle as a core with a complex oxide colloidal particle.

Abstract: An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): wherein R1 and R2 are independently hydrogen or alkyl having 1 to 4 carbon atoms and two or more R1s or two or more R2s are the same or different; a is integer of 0 to 4; b is integer of 0 to 4; c is integer of 0 to 3; and n is average and is number of 0 to 10, (C) a (co)polymer containing butadiene-derived structural unit or its derivative, and (D) an inorganic filler in the amount of 80 wt % to 95 wt % both inclusive in the total epoxy resin composition.

Abstract: Disclosed herein is a semiconductor sealing material composition, including: 9.0˜13 wt % of an epoxy resin; 6˜7 wt % of a hardener; 0.2˜0.3 wt % of a curing catalyst; 0.60˜0.68 wt % of at least one additive selected from the group consisting of a coupling agent, a release agent and a coloring agent; and 79˜84 wt % of a filler, wherein the filler is nano-graphene plate powder. The semiconductor sealing material composition has excellent crack resistance at a high temperature of 270° C. or more and has high thermal conductivity and excellent flame retardancy.

Abstract: An object of the present invention is to provide an adhesive composition that can form an adhesive sheet for producing a semiconductor device capable of suppressing deterioration in ion scavengeability after the adhesive sheet goes through thermal history. It is an adhesive composition for producing a semiconductor device containing at least an organic complex-forming compound that forms a complex with cations, and the 5% weight loss temperature of the organic complex-forming compound measured by thermogravimetry is 180° C. or more.

Abstract: A coating for a substrate is a cured coating composition which includes binder and particles, wherein the particles are inorganic, organic or organo-metallic; have diameters between about 1 and 500 nm; may be treated with a surface modifer; and wherein the cured coating composition is in direct or indirect contact with the substrate.

Abstract: The present invention provides an ink jet printable phosphor ink composition for LED packaging that enables precision control of the amount and position of phosphor layers on the LED device or the LED device packaging. The ink includes both a UV-curable resin component and a thermally curable resin component. A phase-separation component prevents phase separation of the UV-curable resin component and the thermally curable resin component. Phosphor particles on the order of less than approximately 2 microns are uniformly dispersed throughout the ink composition. The phosphor ink composition is deposited through either thermal or piezoelectric ink jet printing; a thin layer is deposited in a desired pattern. UV curing (and, optionally, thermal curing) is used to fix each layer followed by subsequent deposition and curing. In this manner, undesirable phosphor settling does not occur and layers are selectively built up to form precise phosphor distributions.

Abstract: The invention provides an epoxy nanocomposite material for dental therapy, which can be applied to direct or indirect clinical restoration, dental core-post system, and dental brace etc. The epoxy nanocomposite filling material provided by the invention can be polymerized with various curing agents to form the polymer with low shrinkage.

Abstract: Disclosed are coatings comprising a matrix material and nanoscale bodies disposed within the matrix material. Also provided are methods of forming such coatings.

Abstract: This invention relates to curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition comprises an aromatic compound having meta-substituted reactive groups and a cationic or radical initiator.

Abstract: A polymer adhesive includes a polymeric binder, optional reinforcing fibers dispersed through the polymer binder and solids dispersed in the polymeric binder. The solids are effective to cause decomposition of the polymer adhesive at a temperature between 200° F. and 500° F. with a generation of gaseous products at a predetermined temperature. One suitable composition includes siloxirane, graphite, glass beads, potassium nitrate, silver nitrate and lactose and decomposes at a temperature of about 318° F. The polymer adhesive may be used in the assembly of a housing for rocket motor or a warhead. Decomposition of the polymer adhesive when the housing is exposed to sufficient external heat to cause a rocket propellant or warhead explosive to decompose, referred to as cook-off, enables venting of the rocket propellant or warhead without uncontrolled destructive rupture of the housing.

Abstract: Methods and compositions for forming a transparent clear coat characterized by a desired property, such as a color effect, resistance to UV light-induced degradation and/or scratch resistance, on a substrate are detailed according to embodiments of the present invention. Particular compositions and methods for producing a transparent clear coat layer include nanoparticles formed in-situ during curing of a transparent clear coat. Curable clear coat compositions are described according to embodiments of the present invention which include one or more substantially dissolved nanoparticle precursors.

Abstract: The present invention relates to a resin composition for forming an insulating resin layer for optical semiconductor element housing package having a concave portion in which a metal lead frame and an optical semiconductor element mounted thereon are housed, in which the resin composition includes the following ingredients (A) to (D), and the ingredients (C) and (D) are contained in a blend ratio (C)/(D) of 0.26 to 3.0 as a weight ratio thereof: (A) an epoxy resin; (B) an acid anhydride curing agent; (C) a white pigment; and (D) an inorganic filler.

Abstract: The present invention relates to a process for the production of a ready-to-use epoxy composition having a filler content of at least 55 vol.-%, relative to the complete ready-to-use epoxy composition, which comprises: providing a liquid A, which comprises at least one epoxy resin, providing a liquid B, which comprises at least one curing agent, providing a solid component C, which comprises at least one filler, wherein in a first step one of the liquids A or B is filled in a mixing container, in a second step the solid component C is deposited on top of the liquid in the mixing container, in a third step the remaining liquid A or B is deposited on top of the solid component C, and in a fourth step the components are mixed to obtain the ready-to-use epoxy composition.

Abstract: Method of preparing a particle dispersion within a polymer is disclosed. The dispersion may include core shell rubber particles and the polymer may include epoxies. The particles are capable of being substantially dispersed within the polymer so as to substantially inhibit agglomeration of the particles. Mechanical properties, such as toughness are improved while glass transition temperature and viscosity are not substantially impaired by the presence of the particles.

Abstract: A thermosetting resins composite, composed of: epoxy resin which can have a total polymerization with bismaleimide, occupying 1.75%-18.0% solids weight of the composite; bismaleimide compounds, occupying 0.15%-12.5% solids weight of the composite; free radical initiator, its mole fraction of which its addition accounts for reaction monomer total is 0.01%-0.15%; inhibitor, whose amount is the half to double of the initiator; styrene-maleic anhydride copolymers, occupying 17.5%-47.0% solids weight of the composite; filler, occupying 20%-60% solids weight of the composite; solvent, occupying 30%-50% solids weight of the composite; flame retardant which can be used in CCL industries.

Abstract: A high thermal-conductive, halogen-free and flame-retardant resin composition used as a dielectric layer of a printed circuit board comprises 5% to 70% of phosphorus-containing epoxy resin, at most 50% of multifunctional or bifunctional epoxy resin, 1% to 20% of curing agent, 0.01% to 10% of accelerant, at most 20% of inorganic powder, 5% to 85% of high thermal conductivity powder and 0.

Abstract: A method of making a nanoparticle filled dielectric material. The method includes mixing nanoparticle precursors with a polymer material and reacting the nanoparticle precursors mixed with the polymer material to form nanoparticles dispersed within the polymer material to form a dielectric composite.

Abstract: In various embodiments, the invention provides an in-situ adduct formed by reacting liquid, solid, and/or semi-solid epoxy resins with a di-carboxylic acid functionalized polymer. The adducting process at least doubles the viscosity of the mixture. A hot melt thermosetting surfacing film and composite formed using the adduct are also disclosed. Methods of preparing and using are also disclosed.

Abstract: Polymer composite roofing materials are provided which contain resin, and about 20-75 wt. % fillers and additives, in which the fillers contain at least one bulk filler for reducing the amount of resin needed to make the roofing material, and at least one aesthetically functional filler for providing the roofing material with an aesthetic appearance. The bulk filler and the aesthetically functional filler of this embodiment are non-toxic, resistant to microbial attack, and have a Mohs hardness of less than about 5.

Abstract: The present invention relates to an epoxy resin composition for an optical semiconductor device having an optical semiconductor element mounting region and having a reflector that surrounds at least a part of the region, the epoxy resin composition being an epoxy resin composition for forming the reflector, the epoxy resin composition including the following ingredients (A) to (D): (A) an epoxy resin; (B) a curing agent; (C) a white pigment; and (D) at least one antioxidant selected from the group consisting of hindered-phenol antioxidants, sulfide antioxidants and hindered-amine antioxidants.

Abstract: The invention relates to a halogen free flame retardant polyester composition suitable for use as a molding composition for making lampholders, comprising (A) a polymeric material consisting for at least 50 wt. %, relative to the total weight of the polymeric material, of a thermoplastic polyester; (B) a flame retardant system in an amount of 11-35 wt. %, relative to the total weight of (A), (B) and (C), and consists of: melamine cyanurate, and optionally one or more of the following flame retardant components: another phosphorus-free nitrogen based organic flame retardant compound, a phosphorus containing flame retardant excluding elementary phosphorus, in an amount of less than 1 wt. %, relative to the total weight of (A), (B) and (C); an inorganic flame retardant synergist, and an organic flame retardant synergist (C) a fibrous reinforcing agent in an amount of 5-35 wt. %, relative to the total weight of (A), (B) and (C); and (D) a mould release agent in an amount of at least 0.01 wt.

Abstract: Disclosed is a curable system comprising at least two compositions (A) and (B), a method for the manufacturing of a cured product as well as cured products obtainable by the method.

Abstract: The present invention relates to fabrics, composites, prepregs, laminates, and other products incorporating glass fibers formed from glass compositions. The glass fibers, in some embodiments, are incorporated into composites that can be adapted for use in high energy impact applications such as ballistic or blast resistance applications. Glass fibers formed from some embodiments of the glass compositions can have certain desirable properties that can include, for example, desirable electrical properties (e.g. low Dk) or desirable mechanical properties (e.g., specific strength).

Abstract: The subject of the present invention is the use of at least one element chosen from among yttrium, zirconium, lanthanum, cerium, praseodymium and neodymium, in the form of oxides or salts, as reinforcing agent for the anticorrosion properties of an anticorrosion coating composition containing a particulate metal, in aqueous or organic phase, for metal parts.

Abstract: The present invention relates to a novel epoxy resin having improved heat-resistance, thermal expansion properties and processability, and to a thermosetting resin composition comprising the same. To this end, the present invention provides an epoxy resin of Chemical Formula 1 as disclosed in the Description, an epoxy resin composition comprising the same, and a packaging, substrate and transistor formed thereof. When a composition that contains an epoxy resin with a specific side functional group according to the present invention and/or an epoxy resin with a specific core structure is cured, a filler forms a strong chemical bond with the epoxy resin, thereby maximizing filling effects of the filler for the epoxy resin. Moreover, with the specific core structure, heat resistance and heat expansion properties of a cured product are substantially improved (CTE is reduced), and enhanced glass transition properties, strength and processability are demonstrated.

Abstract: Curable epoxy resin composition including an epoxy resin component and a filler component and optionally a hardener component and further additives, wherein (a) the curable epoxy resin composition has been produced by separately mixing together at least a part of the epoxy resin component and at least a part of the filler component and optionally some or all of the optional additives, prior to mixing theses components with the optional hardener component and with any remaining optional additives present in the curable epoxy resin composition, and that (b) the mixing together of at least a part of the epoxy resin component and at least a part of the filler component and optionally some or all of the optional additives has been carried out at a temperature higher than the casting temperature of the curable epoxy resin composition, and electrical insulation systems made therefrom.

Abstract: A composite structure includes at least one resin matrix layer having a resin material and a plurality of fiber elements and a plurality of titanium particles provided in the resin material. A method of toughening a resin matrix layer is also disclosed.

Abstract: Manganese vanadium tantalum oxide that can be represented by the formula MnxVyTazOw, where 1?x?3, 0.001?y?3, 0.001?z?2, and w=7, and alternately, x=1.25?x?2.45, 0.1?y?2.39, 0.2?z?1.9, and w=7, methods of producing MnxVyTazOw, a pigment coated with MnxVyTazOw and a chalcogenide glass layer, and a method of producing the coated pigment are described. The disclosed manganese vanadium tantalum oxide has superior near-infrared reflective properties. The disclosed methods of producing the manganese vanadium tantalum oxide provide products with superior phase purity, appearance and performance and take health and safety into consideration. The construction of the disclosed coated pigment combines the reflective properties of the substrate with the near-infrared reflective properties of MnxVyTazOw, while the chalcogenide glass layer provides aesthetic appeal. The disclosed method of producing the coated pigment involves physical vapor deposition of MnxVyTazOw, and the chalcogenide glass layer.

Abstract: The present invention relates to heat-resistant paint which is capable of forming paint film that inhibits whitening even in high-temperature environments on the order of 350-650° C. The heat-resistant paint of the present invention contains silicone resin and/or epoxy resin as well as black pigment, wherein, said black pigment contains manganese and copper, the content of manganese in said black pigment is 25-45 mass % by MnO conversion, the content of copper in said black pigment is 5-25 mass % by CuO conversion, and the content of silicon in said black pigment is 3 mass % or less by SiO2 conversion.

Abstract: A masterbatch composition, a method for the preparation of a masterbatch composition, a method for the preparation of a powder coating composition, a powder coating composition obtainable by said method as well as the use of a masterbatch composition for a powder coating composition or for increasing the opacity of a cured powder coating is disclosed.

Abstract: Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin; (B) a curing agent; (C) an inorganic filler including manganese oxide; and (D) a curing accelerator.

Abstract: The coating agent of the invention is a coating agent to be used between conductor members, comprising a thermosetting resin, a white pigment, a curing agent and a curing catalyst, the coating agent to be used between conductor members having a white pigment content of 10-85 vol % based on the total solid volume of the coating agent, and a whiteness of at least 75 when the cured product of the coating agent has been allowed to stand at 200° C. for 24 hours.

Abstract: An insulating material and the method of applying the insulating material to products and systems. The material, method and system may be applied to tubulars used in deep water projects. The insulating material is composed of ceramic particles, epoxy and an acrylate monomer that is a precurser to an acrylic resin, and additives. Equal volumes of a epoxy component mixtures and a curing agent component mixture when heated and mixed together create a liquid insulating material that can be applied to the outer surface of pipe involving a repetitive series of steps controlled by an operator at a main control panel. Pipe unrolled from a pipe reel is straightened and heated. In a heated retort, liquid insulating material is applied to the surface of pipe and cured to the final insulation coating. The final coated pipe can be replaced on the reel for shipment to the job site.

Abstract: A composition comprising: a) an epoxy resin; b) a hardener; and c) a stabilizer comprising a metal-containing compound, the metal-containing compound comprising a metal selected from the group consisting of Group 11-13 metals and combinations thereof, wherein the composition is prepared from a halogen-containing compound is disclosed.

Abstract: Disclosed herein is a resin composition including 100 parts by weight of an organic resin and 50 to 1,000 parts by weight of an inorganic filler, wherein 10 to 100% of the inorganic filler is composed of an oxide of a rare earth element.

Abstract: A heat-conductive dielectric polymer material having an inter-penetrating-network (IPN) structure includes a polymer component, a curing agent, and a heat-conductive filler uniformly dispersed in the polymer component. The polymer component includes a thermoplastic plastic and a thermosetting epoxy resin. The curing agent is used to cure the thermosetting epoxy resin at a curing temperature. The heat conductivity of the heat-conductive dielectric polymer material is larger than 0.5 W/mK. A heat dissipation substrate including the heat-conductive dielectric polymer material in the present invention has a thickness of less than 0.5 mm and bears a voltage of over 1000 volts.

Abstract: A resin mortar composition suitable for construction purposes is disclosed. The composition includes a resin component (A) curable with an aliphatic amine and a peroxide and a hardener component (H) with at least one peroxide (B) and at least one amine (C). At least one of the resin component (A) and the hardener component (H) contains at least one inorganic filler and the resin component (A) and the hardener component (H) or the resin composition (A) and the at least one peroxide (B) and the at least one amine (C) of the hardener component (H) are spatially separated from one another. The resin component (A) includes a compound (a) capable of undergoing a radical polymerization, a compound (b) capable of reacting with an amine, a transition metal compound (c), at least one inhibitor (d) to adjust the gel time and a bridging compound (e) having at least two reactive functionalities.

Abstract: The invention relates to a liquid resin composition for electronic components which is used in sealing of electronic components, comprising a liquid epoxy resin, a curing agent containing a liquid aromatic amine, and an inorganic filler, and further comprising at least one member selected from a hardening accelerator, silicone polymer particles, and a nonionic surfactant. There is thereby provided a liquid resin composition for electronic components, which is excellent in fluidity in narrow gaps, is free of void generation, is excellent in adhesiveness and low-stress characteristic and is excellent in fillet formation, as well as an electronic component device having high reliability (moisture resistance, thermal shock resistance), which is sealed therewith.

Abstract: A composite structure includes at least one resin matrix layer having a resin material and a plurality of fiber elements and a plurality of titanium particles provided in the resin material. A method of toughening a resin matrix layer is also disclosed.

Abstract: The present invention inhibits the occurrence of the foreign matters attributable to an adhesive for bonding an injection needle to a needle-base member so as to enhance the yield of a syringe when producing the same. A front-assembly (3) additionally provided at a leading end of an injection cylinder (2) comprises an injection needle (4), a needle-base member (5), a connection hub (6) and a protector cap (7). The injection needle (4) and the needle-base member (5) are fixed to each other with an epoxy adhesive (19). This adhesive (19) contains denatured aliphatic epoxy resin in the amount set to about 10 to about 25 wt % and its viscosity is set to about 20000 to about 40000 mPa·s. This adhesive (19) is heated at a temperature of at least 130 degrees C. for about 20 minutes to cure it. After the front-assembly (3) and the injection cylinder (2) have been sterilized with vapor, the connection hub (6) has a connection portion (17) external fitted and secured to the leading end of the injection cylinder (2).

Abstract: A thermally conductive adhesive comprises a mixture of at least two types of silver particles including a first type having a surface area to mass ratio in the range of 0.59 m2/g to 2.19 m2/g and a tap density in the range of 3.2 to 6.9 g/cm3 and a second type having a surface area to mass ratio of 0.04 to 0.17 m2/g and a tap density in the range of about 4.7 to 8.2 g/cm3. According to certain embodiments of the invention the first type of silver particles includes oblong silver particles. The thermally conductive adhesive further comprises a binder, and optionally a solvent.

Abstract: Provided is a dielectric material having a non-halogenated diaminodiphenylsulfone curing agent.

Abstract: A method for selecting materials and processing conditions to prepare a heterogeneous structure in situ via the reaction of a homogeneous mixture of a reactive organic compound and a filler, which may then optionally be sintered. The method is employed to provide a heterogeneous composite possessing exceptionally high thermal and/or electrically conductivities for a given concentration of conductive filler. The choice of materials as well as processing conditions employed, as will be described below, have a strong effect on the rate domain formation/heterogeneity of the structure formed, the extent of filler particle-particle interactions within filler-rich domains, and ultimately the thermal and/or electrical conductivity. Proper choice of these conditions can lead to composites having enhanced properties at a reduced bulk filler concentration.

Abstract: A composition that will automatically flow (auto-flow) and form a fillet (self-fillet) will have a yield stress within the range of 1.8 Pa to 10 Pa (20 dynes/cm2 to 100 dynes/cm2). Such a composition can be designed by using an appropriate choice of filler, regardless of the resin system used in the composition.

Abstract: A method of making metal nanoparticles and carbon nanotubes is disclosed. A mixture of a transition metal compound and an aromatic polymer, a precursor of an aromatic polymer, or an aromatic monomer is heated to form a metal nanoparticle composition, optionally containing carbon nanotubes.

Abstract: The epoxy resin molding material of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the (B) curing agent contains a polyvalent carboxylic acid condensate. The thermosetting resin composition of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the viscosity of the (B) curing agent is 1.0-1000 mPa·s at 150° C., as measured with an ICI cone-plate Brookfield viscometer.

Abstract: A thermally conductive adhesive composition includes a powder of a high melting point metal or metal alloy, a powder of a low melting point metal or metal alloy, and a polymerizable fluxing polymer matrix composition having a polyepoxide polymer resin and a low-melting solid or liquid acid-anhydride and a polymer diluent or diluents with carbon carbon double bonds and/or functional hydroxyl groups. The ratio by weight of the low melting point powder to high melting point powder ranges from about 0.50 to about 0.80, and may range from about 0.64 to about 0.75, and may be 0.665. Heretofore unpredicted substantially higher thermal conductivity improvements in performance have been found using these ratios of low melting point powder to high melting point powder.

Abstract: The epoxy resin molding material of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the (B) curing agent contains a polyvalent carboxylic acid condensate. The thermosetting resin composition of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the viscosity of the (B) curing agent is 1.0-1000 mPa·s at 150° C., as measured with an ICI cone-plate Brookfield viscometer.

Abstract: A powder coating composition comprising an intimate mixture of at least one film forming resin binder and from 0.1 to 50 wt. %, based on the total weight of the powder coating composition, of at least one modified encapsulated titanium dioxide.