Abstract: A colored macromolecular polymer is produced by a method which comprises dissolving a soluble salt of a noble metal in a liquid monomer, polymerizing the monomer having the soluble salt of the noble metal dissolved therein, and subjecting the resultant solid polymer to a heat treatment at a temperature equal to or exceeding the colloid-forming temperature of the noble metal.

Abstract: This invention presents improved epoxy-based die attach adhesives which are of low viscosity, high ionic purity, and stable toward thermal cycling. This improvement is obtained by including in the formulation carboxy terminated polymers which are the reaction products of polyether diols with cyclic dianhydrides.

Abstract: An electrically conductive coating composition is useful for a primer or a surfacer paint for a plastic article, in particular one having a small polarity on the surface, and comprises (A) a polyurethane, (B) a spiro-ortho-ester resin of the ring-opening expansive property, (C) a cellulose derivative, (D) a hydroxy-containing surfactant and (E) an electrically conductive material.

Abstract: The invention relates to an electrically conductive, polymer based material with electrical resistivity having a positive temperature coefficient. The material comprises a matrix of thermosetting polymer having conductive particles in the form of fibers distributed through the polymer. The polymer can be an epoxy resin, polyimide, unsaturated polyester, silicone, polyurethane or phenolic resin, and the fibers can be carbon fibers, carbon fibers coated with metal or metal alloy, graphite fibers, graphite fibers coated with metal or metal alloy, graphite intercalation compound fibers, metal fibers, ceramic fibers, or ceramic fibers coated with a metal or metal alloy.

Abstract: Filler blends of electroconductive particles with electrically non-conductive particles are provided which are useful in making electromagnetic shielding resins for encapsulating electronic devices.

Abstract: 2 to 15 wt % of a resin is added to a mixture of a refractory aggregate and a metal having a melting point of not higher than 1,000.degree. C., the resin being obtained by added 10 to 90 wt % of a silicon resin to at least one kind of thermosetting resin which easily exhibits a higher mechanical strength when heated to about 150.degree. to 250.degree. C. The resultant mixture is molded and heated to a temperature of not higher than 1,000.degree. C., thereby producing a high-durability plate brick for a sliding gate nozzle apparatus.

Abstract: A thermosetting insulating resin paste including 100 parts by weight of an epoxy resin containing a diglycidyl type liquid epoxy resin as a main component and based on the parts by weight of the epoxy resin, 0.5 to 10 parts by weight of dicyandiamide as a setting agent. It further contains 1 to 15 parts by weight of a phenoxy resin, 0.1 to 8 parts by weight of 2-phenyl-4-methyl-5-hydroxymethylimidazole and/or 2-phenyl-4,5-dihydroxymethylimidazole as a setting accelerator as well as 50 to 200 parts by weight of a thermally conductive filler. This insulating resin paste exhibits a long pot life and can be set in a short time at a low temperature without generating any voids during the setting, so that it enables the die bonding process in the production of semiconductor devices to be performed as part of the production line. It also allows a smaller device to be used in this process.

Abstract: A copper-type conductive coating composition which comprises:(A) a copper powder,(B) a coating binder resin, and(C) at least one number selected from the group consisting of salicylic acid, its specific derivatives, and benzotriazolecarboxylic acid hydrazides.The copper-type conductive coating composition provides a conductive coating layer having excellent initial conductivity and capable of maintaining the level of it stable over a long period of the time.

Abstract: A cross-linked resin produced by heating a mixture of (a) a bis(2-oxazoline) compound, (b) an aromatic polyamine compound which has at least two amino groups in the molecule and (c) a polyepoxy compound which has at least two epoxy groups in the molecule at elevated temperatures, preferably in the presence of an oxazoline ring-opening polymerization catalyst. The resin shows a high mechanical strength and toughness, a very small water absorption and a very high resistance to heat.

Abstract: An electrically conductive epoxy-based adhesive. The epoxy is selected from the amine curing modified epoxy family consisting of a resin that is a combination of polygylcidylaminophenyl resin and polygylcidylether of phenylformaldehyde novalac resin family and a catalyst that is a combination of one member from the aliphatic amide family plus one member from the aliphatic polyamine family. In one embodiment includes 17 parts by weight of the resin and 10 parts by weight of the catalyst. 73 parts by weight of a mixture of properly shaped silver flake particles are added. The resulting adhesive is curable at room temperature to provide a high-temperature, high-strength, electrically conductive adhesive.

Abstract: A paint composition for cation electrodeposition painting, used for painting automotive vehicle body etc. The paint composition comprises basic unsaturated modified epoxy ester expressed by the general formula: ##STR1## where R.sub.1 and R.sub.2 are functional groups at least one of which is .alpha., .beta.-ethylenic double bond containing groups and the remainder is an unsaturated fatty acid chain; R.sub.3 is a group expressed by the formula: ##STR2## and X and Y are functional groups whose total number is n+1 in which not less than one functional group is a group containing both a tertiary amine function and a urethane function, and the remainder are hydroxyl groups (--OH), n being an integer ranging from 1 to 20.

Abstract: An adhesive composition which is curable by electromagnetic induction heating when it is applied to various substrates, said adhesive comprising a mixture of(I) An epoxy resin component and(II) A hardener component and(III) From 2 to 60% by weight of (I) and (II) of an electromagnetic energy absorbing material is described.

Abstract: An electrically conductive composition containing a photosensitive epoxy polymer, a reactive plasticizer, and electrically conductive spherical particles wherein the outer surfaces are of a material selected from the group of platinum, palladium and gold. The compositions are used to provide a flexible electrically conductive bond between a supporting substrate and a semiconductor.

Abstract: A one-component heat stable, adhesive for metal surfaces such as iron, zinc, copper, cadmium and their alloy will cure upon contact with the metal surface. The adhesive composition includes olefinically unsaturated monomer; at least one phenoxy resin together with other reactive or non-reactive polymers; an acidic material; a compound containing sulfonyl halide group; and a compound containing a transition metal, in particular TiO.sub.2. The adhesive composition cures rapidly upon contact with a metal surface to form an adhesive bond between the surfaces. The adhesive composition is especially useful as an adhesive for galvanized steel parts subjected to elevated paint curing temperatures.

Abstract: Pigmented, abrasion and corrosion resistant, thermosetting organic solvent solution coating composition comprise: (A) from about 50 percent to about 85 percent of total resin solids of a triol-based blocked polyurethane polyisocyanate having a number average molecular weight in the range of 600 to 4000; (B) from about 15 percent to about 50 percent of total resin solids of an epoxy-phosphate provided by reacting a resinous polyepoxide with at least 0.05 mole of orthophosphoric acid per equivalent of oxirane in the polyepoxide; and (C) a corrosion-inhibiting pigment, preferably a chromium-containing pigment, providing resistance to corrosion. These coatings may be applied to the metal surface to be protected, or the metal surface may be protected with another primer which is overcoated with the subject coatings. The subject coatings are then topcoated, especially with pigmented fluorocarbon coatings.

Abstract: An electrically conductive resin composition comprising:(i) a resin;(ii) a metallic powder;(iii) a diphosphonic acid derivative; and(iv) a hydroxyl-containing compound; wherein the weight ratio of the compound (i)/the component (ii) is 30/70 to 85/15 and the amounts of the components (iii) and (iv) are 0.5 parts by weight or more and 0.08 parts by weight, respectively, based on 100 parts by weight of the components (i) and (ii).

Abstract: A piezoelectric pressure-sensitive element comprising a dispersion of a dipolarly oriented ferroelectric ceramic powder in a cured product of a composition comprised of an epoxy resin having at least two epoxy groups in the molecules, a compound having defined numbers of amino groups, benzene rings, carbonyl groups and methylene groups, and a crosslinking agent. A methd for making such a piezoelectric pressure-sensitive element is also described, in which the resin composition comprising a ferroelectric ceramic powder is thermally cured and applied with an electric field at a high temperature to cause dipolar orientation of at least the ceramic powder.

Abstract: Encapsulating an electronic component with an encapsulating resin having a filler that includes silicon carbide to form a composite with improved thermal conductivity (e.g., greater than 25.times.10.sup.-4 cal/cm-sec-.degree.C.) and improved stress characteristics (e.g. a thermal shock cycle number of at least 30).

Abstract: Described are novel thermosetting epoxy resin compositions suitable for making cured resins, prepregs and stiff, tough thermoset composites. The thermosetting compositions comprise a polyepoxide component, an amine hardner and a specified amount of certain aromatic oligomers containing functional groups which are reactive with the polyepoxide and/or hardener under curing conditions for the composition. The cured resins have a multiphase morphology which comprises at least one glassy continuous phase and at least one glassy discontinuous phase and have a fracture toughness, K.sub.IC, of at least 1.0 MPam.sup.1/2.

Abstract: Disclosed are improved compositions useful in providing a conductive layer or coating on or within a conductor. The compositions contain elemental carbon and a polymeric matrix or binder. The improvement comprises employing a unique ground calcined, coal-based coke which approaches graphite in terms of its performance as a conductive additive or pigment but does not possess the disadvantages associated with the use of graphite.The unique coke employed in the compositions and methods of the present invention has a significant level of graphitic structure. This level of graphitization can be most easily recognized by utilizing x-ray powder diffraction. More specifically, when the value of E.sub.c or the inverse peak width (using the 002 peak) is measured for this material using Mo K.alpha. radiation (.lambda.=0.71 .ANG.), the value is in the range of about 27 to about 80, and preferably about 28 to about 75.

Abstract: An adhesive composition comprising 10 to 80% by weight of a binder composed of an aminoalkyl ester group-containing acrylic copolymer shown ##STR1## wherein R denotes an alkylene possessing 2 to 3 carbon atoms, as a pendant group and an epoxy resin, and if desired a rust-proofing pigment and a silane coupling agent.

Abstract: A molding resin composition for preparing molded pieces which are suited to laser masking. The composition comprises a thermosetting resin, a curing agent, an inorganic white filler and 0.1 to 3% by weight of a coloring agent represented by the formula (I) ##STR1## wherein R.sub.1 and R.sub.2 are each hydrogen, halogen, C.sub.1 -C.sub.8 alkyl, substituted or unsubstituted sulfonamido or SO.sub.2 CH.sub.3 ; R.sub.3 and R.sub.4 are each hydrogen, C.sub.1 -C.sub.8 alkyl, or substituted or unsubstituted carbonamido; M is Cr, Fe or Co; and A is H, NH.sub.4, ammonium ion of a primary, secondary or tertiary amine or quaternary ammonium ion.

Abstract: Unfavorable interaction is prevented between (a) electroconductive particle fillers and (b) organic resin binders of the type which are normally instable with respect to viscosity when aged in contact with said fillers. Moreover, electroconductivity degradation is also avoided. In a preferred mode of the invention, the particle surface is treated with a coating of an interfacial pacifying agent such as a tetravalent tin compound which both enhances the electroconductive performance of the particles and also is sufficiently compatible with the resin binder to migrate into the binder sufficiently to avoid undue gelling of the binder by particle-borne contamination or residues of such contamination.

Abstract: An electrically conductive composition containing a photosensitive epoxy polymer, a reactive plasticizer, and electrically conductive spherical particles wherein the outer surfaces are of a material selected from the group of platinum, palladium and gold. The compositions are used to provide a flexible electically conductive bond between a supporting substrate and a semiconductor.

Abstract: A metal powder-containing polymer composition selected from the group consisting of[A] polymer compositions each containing a metal powder having an amino compound and a silane coupling agent compound deposited thereon; and[B] compositions each consisting essentially of:(a) powder of a metal having an amino compound or a mixture of an amino compound and a silane coupling agent compound deposited thereon and(b) a thermoplastic resin comprising a carboxyl group-containing thermoplastic resin.The amine compound is exemplified by diamine compounds; the silane coupling agent by aminosilane compounds and vinyl silane compounds; and the polymer by a blend of a maleic anhydride-graftpolymerized polypropylene and polyester, polyamide or polypropylene.

Abstract: Disclosed are compositions useful in fabricating blocks or inserts for inductors comprising:(a) about 98 percent to about 99.5 percent by weight of a high purity, annealed electrolytically prepared iron powder; and(b) about 0.5 percent to about 2 percent of an insulating polymer binder selected from the group consisting of epoxies, flourocarbon, hot melt adhesives, and mixtures thereof;wherein said iron powder has a specific surface area of less than about 0.25 m.sup.2 /g and a carbon content of less than about 0.01 percent; andwherein said composition after pressing at at least about 30 Tsi demonstrates a maximum of 5 percent regression in permeability and a total core loss of less than about 0.8 to about 1.2 ohms between 10 KHz and 500 KHz. Blocks and inserts made from such compositions, as well as methods of manufacturing such inserts, are also disclosed.

Abstract: A hybrid fiber-reinforced plastic composite material comprising a matrix of a plastic and hybrid fibers consisting of inorganic fibers and at least one kind of fibers selected from the group consisting of carbon fibers, glass fibers, boron fibers, aramide fibers and silicon carbide fibers having a carbon core, wherein(a) the inorganic fibers are inorganic fibers containing silicon, either titanium or zirconium, carbon and oxygen and being composed of(i) an amorphous material consisting substantially of Si, M, C and O where M represents Ti or Zr, or(ii) an aggregate consisting substantially of ultrafine crystalline particles with a particle diameter of not more than 500 .ANG. of .beta.-SiC, MC, a solid solution of .beta.-SiC and MC and MC.sub.1-x, and amorphous SiO.sub.2 and MO.sub.2, where M is as defined and x is a number represented by 0<x<1, or(iii) a mixture of the amorphous material (i) and the aggregate (ii),(b) the composite material has an interlayer shear strength of at least about 9 kg/mm.sup.

Abstract: An adhesive composition which is curable by electromagnetic induction heating when it is applied to various substrates, said adhesive comprising a mixture of(I) An epoxy resin component and(II) A hardener component and(III) From 2 to 60% by weight of (I) and (II) of an electromagnetic energy absorbing material is described.

Abstract: A nonskid coating formulation comprising, by weight, 3 to 8% amine resins, to 13% epoxy resins, 17 to 22% pigments, fillers, and thickeners, 10 to 20% solvents and 39 to 56% aggregates.

Abstract: Homogeneous, nonporous ceramic fibers containing at least one magnetically-unaligned, microcrystaline transition metal oxide spinel phase. The ceramic fibers may be used in polymeric, ceramic and metallic composites. Said ceramic spinel is produced by dispersing soluble inorganic and transition metal compounds in an aqueous mixture, concentrating to produce a viscous concentrate, shaping into the desired article, gelling the shaped article, and heating to produce the transition metal spinel article. Beads, bubbles, flakes, microspheres, films and granules may be made as well as fibers.

Abstract: A corrosion resistant coating for application to a metal substrate including powdered metal selected from the group consisting essentially of zinc, cadmium, stainless steel, aluminum and alloys and blends thereof; a linear epoxy or phenoxy resin having a molecular weight of less than 15,000 and essentially no highly reactive terminal epoxy group; a cross-linking urethane resin; an active organic solvent selected from the group consisting essentially of acetone, methyl ethyl ketone, methyl isobutyl ketone, dimethylformamide, and blends thereof; and an inactive organic solvent selected from the group consisting essentially of aromatic hydrocarbons, alcohols, and blends thereof.

Abstract: An electrically conductive thermoplastic resin and coating composition comprising a diphosphonic acid derivative having the formula: ##STR1## wherein R represents an alkyl or aryl group and M.sup.1 to M.sup.4 independently represent hydrogen or a cation.The electrically conductive thermoplastic resin composition has excellent electrical conductivity and retains the electrical conductivity for extended periods without using expensive noble metals. Furthermore, the electrically conductive coating composition provides an excellent electrical conductivity and shielding property retention without using expensive noble metals.

Abstract: The invention relates to inorganic-organic compound substances useful for biomedical purposes. The object of the invention is to develop inorganic-organic compound materials which overcome the disadvantages of the state of art, wherein inorganic-organic compound substances for biomedical purposes possess to a large extent specifically adjustable characteristics. Inorganic initial substances form a new solid chemical compound with organic initial substances. The inorganic initial component consists of a biocompatible silicate glass and/or a silicate glass ceramic of the system SiO.sub.2 -Al.sub.2 O.sub.3 -MgO-Na.sub.2 O/K.sub.2 O-F.sup.-, and/or a bioactive phosphate silicate glass and/or a phosphate silicate glass ceramic of the system SiO.sub.2 -Al.sub.2 O.sub.3 -MgO-Na.sub.2 O/K.sub.2 O-CaO-P.sub.2 O.sub.5 F.sup.- and/or of the system SiO.sub.2 -MgO-K.sub.2 O-F.sup.- -CaO-P.sub.2 O.sub.5, and/or a bioactive phosphate glass and/or a phosphate glass ceramic of the system P.sub.2 O.sub.5 -Al.sub.2 O.sub.

Abstract: A primer coating system is disclosed that is resistant to abrasion and corrosion and includes a basecoat or first layer comprising a resinous polyepoxide, an aminoplast, phenoplast or blocked isocyanate curing agent, an epoxy-phosphate, a chromium-containing pigment and a clay that has the capacity to fix phosphate. The system may further include an overcoat or second layer comprising a resinous polyhydric alcohol, a polyisocyanate, a chromium-containing pigment and the foregoing clay, and a third layer of a finish coating preferably based on a fluorine-containing polymer.

Abstract: A copper-type conductive coating composition which comprises:(A) a copper powder with hydrogen loss of at most 0.2% by weight or a copper powder with its oxidized surface layer removed by treatment with an organic carboxylic acid,(B) a coating binder resin, and(C) an antioxidant selected from triazoles represented by the formula: ##STR1## wherein Y is a hydroxyl group, a hydrogen atom, a C.sub.1 -C.sub.18 alkyl group or a halogen atom, and a is an integer of 1 to 3, and trithiophosphites represented by the formula: ##STR2## wherein each of R.sub.1 to R.sub.3 is a C.sub.1 -C.sub.30 alkyl group or an allyl group.

Abstract: A novel adhesive exhibiting low outgassing upon exposure to high temperatures is disclosed. The instant adhesive comprises: (a) a soluble polyimide resin, (b) a solvent for said polyimide resin, (c) an epoxy resin, (d) a cross-linking agent reactive with the polyimide solvent of (b), and (e) a catalyst which accelerates the reaction between (b) and (d). Optionally, the adhesive may also contain a conductive material. A process for making the adhesive is also disclosed.

Abstract: A vibration damping material having an improved mechanical strength and excellent vibration damping characteristic is disclosed.The material is made by usage of composition of 40 to 90 weight percent of iron oxide particles 0.1 to 100 .mu.m in size and 60 to 10 weight percent of resin.

Abstract: Curable thermosetting resin compositions comprising at least one cycloaliphatic epoxy resin having at least two 1,2-epoxy groups per molecule, and certain aromatic diamines having three aromatic rings in the molecule are disclosed. Resin compositions comprised of, for example, bis(2,3-epoxycyclopentyl)ether and 1,3-bis(4-aminophenoxy)benzene exhibit a highly desirable balance of physical and chemical properties which renders such compositions ideally suited for use in the fabrication of wet winding composites. The resin compositions prepared in accordance with the invention have unexpectedly low viscosity, high glass transition temperatures, high tensile properties and unexpectedly low water uptake. Accordingly, the resin compositions find particular application in the preparation of composites by wet winding procedures.

Abstract: Rapid air drying thermosetting solvent solution primer compositions are disclosed which comprise volatile polar organic solvent having dissolved therein a fluorocarbon polymer in an amount of from 20% to 45% of total resin solids, a solvent-soluble, hydroxy-functional copolymer of monoethylenically unsaturated monomers containing from 5% to 30% of hydroxy-functional monoethylenic monomer in an amount of from 0.7 to 1.5 parts of hydroxy-functional copolymer per part of fluorocarbon resin, a resinous polyepoxide in an amount providing from 0.1 to 0.6 part of polyepoxide per part of hydroxy-functional copolymer, and a curing agent reactive with hydroxy functionality, preferably an aminoplast resin, for curing the hydroxy-functional acrylic copolymer and the polyepoxide. The primer is pigmented with inorganic pigment in a weight ratio with respect to the resin solids of from 0.2:1 to 0.8:1.

Abstract: High molecular weight organic material is effectively colored by the incorporation therein of a copper or nickel complex of the ligand compound of formula I ##STR1## wherein A is an isocyclic or heterocyclic aromatic moiety, R is H, halogen, lower alkyl or alkoxy, R.sub.1 is H, lower alkyl, phenyl or substituted phenyl, and B is H, lower alkyl, ureido or substituted ureido, guanidino, anilino, benzamido or a heterocyclic aromatic moiety.

Abstract: This invention provides an insulating protective material effective for protection of electronic and electric devices such as electronics elements. This insulating protective material contains at least one hydrous oxide of a metal which has ion exchange properties together with a fusion bonding component such as low-melting glass, epoxy resin, phenolic resin, silicone resin, etc. and a filler such as fused silica, .beta.-eucryptite, glass fiber, glass beads, etc.Said specific hydrous oxide can be used together with a sulfur-containing organic high molecular weight compound.The hydrous oxides used in protective materials as a sealing material for electronic and electric devices can capture an ionic impurity eluted from the components of the protective material and fix it therein thereby to provide stable electronic materials excellent in performance.

Abstract: A copper-type conductive coating composition which comprises:(A) a copper powder with hydrogen loss of at most 0.2% by weight or a copper powder with its oxidized surface layer removed by treatment with an organic carboxylic acid,(B) a coating binder resin, and(C) an antioxidant selected from triazoles represented by the formula: ##STR1## wherein Y is a hydroxyl group, a hydrogen atom, a C.sub.1 -C.sub.18 alkyl group or a halogen atom, and a is an integer of 1 to 3, and trithiophosphites represented by the formula: ##STR2## wherein each of R.sub.1 to R.sub.3 is a C.sub.1 -C.sub.30 alkyl group or an allyl group.

Abstract: Disclosed is a stiff, tough thermoset composite, the composite comprising a crosslinked epoxy resin matrix and high strength filaments. The resin matrix comprises a glassy discontinuous phase dispersed in a glassy continuous phase that continues throughout the resin matrix. Volume fractions of the discontinuous phase are at least about 35% of the total volume of the continuous and discontinuous phases combined in exceptionally tough composites.Also disclosed are novel resin compositions suitable for making these thermosets.

Abstract: Described are novel thermosetting epoxy resin compositions suitable for making cured resins, prepregs and stiff, tough thermoset composites. The thermosetting compositions comprise a polyepoxide component, an amine hardener and a specified amount of certain aromatic oligomers containing functional groups which are reactive with the polyepoxide and/or hardener under curing conditions for the composition. The cured resins have a multiphase morphology which comprises at least one glassy continuous phase and at least one glassy discontinuous phase and have a fracture toughness, K.sub.IC, of at least 1.0 MPam.sup.1/2.

Abstract: An adhesive composition comprising, by weight, (1) 100 parts of triglycidyl ether of trisphenol, (2) 0-40 parts of a polyfunctional epoxy resin, (3) a diamine type curing agent selected from (a) an aromatic diamine compound and (b) a reaction product having an amino group at each terminal thereof, prepared by reacting together an aromatic diamine compound, divinylsilane compound and bismaleimide compound, and, if desired, (4) a powdery inorganic filler.

Abstract: A novel adhesive exhibiting low outgassing upon exposure to high temperatures is disclosed. The instant adhesive comprises: (a) an epoxy resin, (b) a soluble polyimide resin, (c) a reactive solvent; and (d) an alkenylphenol crosslinker which preferably contains polyhydroxy and polyalkenyl substituents. Optionally, the adhesive may also contain a conductive material.

Abstract: An electro-optic display device in which a conductive paste is disposed between opposed electrodes is characterized in that said conductive paste contains silane coupling agents. A process for making an electro-optic display device in which a conductive paste is disposed between opposed electrodes is characterized in that said conductive paste is applied onto films which are formed by applying a silane coupling agent onto at least one of the electrodes.

Abstract: Described herein are compositions which contain a specific group of oligomeric diamine hardeners and epoxy compounds which when combined with structural fibers produce composites which have improved tensile properties, high compressive strengths, and improved impact resistance. These compositions also exhibit low moisture absorption.

Abstract: A radar attenuating composition is described for which incident microwave diation is absorbed and/or scattered, causing a significant decrease in retroreflectance of the object to which the composition is applied, that is, a reduction in the radar cross-section of the object. The radar attenuating composition or paint is prepared by uniformly mixing thin conducting fibers such as stainless steel fibers or carbon or graphite into a standard camouflage-type paint. The fibers act as electric dipole segments. The purpose of the countermeasure paint of the present invention is to reduce the amount of microwave radiation reflected back by a target to the receiver, i.e. reducing the amount of retroreflection.

Abstract: An epoxyester linear block oligomer made with n-1 moles fatty acid units terminated with carboxylic acid groups and n moles of epoxy oligomer is particularly suited for chip-resistant paints made with a low pigment volume concentration.