Abstract: A semiconductor-encapsulating composition comprised of (i) an epoxy resin preferably containing a bifunctional biphenyl-skeletal epoxy resin and/or a bifunctional naphthalene-skeletal epoxy resin, (ii) a curing agent containing 4,4'-dihydroxybiphenyl, and (iii) 70 to 95% by weight, based on the total epoxy resin composition, of a filler.

Abstract: In a process for producing a prepolymer epoxy resin mixture with oxazolidinone structures, an insoluble reaction resin powder which has no isocyanate groups and consists of an epoxy resin mixture containing a reaction accelerator and filler and having isocyanurate structures, is fed to a continuously working reactor and reacted at temperatures up to 200.degree. C., with reactor temperature at 140.degree.-190.degree. C., and then the extruded material is cooled down to a temperature of <50.degree. C. with the aid of a cooling device mounted at the outlet die of the reactor.

Abstract: A process for making a cured plastics moulding by introducing a pre-heated curable resin composition to a hotter mould which is at a temperature high enough to initiate curing of the resin, and supplying further resin under pressure to compensate for shrinkage of the composition wherein the curable resin is a formulation comprising an aromatic glycidyl ether epoxy resin, an inert filler, a quaternary ammonium or phosphonium salt as accelerator, 0.5-1.2 mol per mol epoxy of a saturated cycloaliphatic anhydride and a polycarboxylic acid preferably derived from the reaction of a polyol, this acid being present at a level of 0.05-0.5 mol carboxyl per mol epoxy.

Abstract: The present invention provides polyhydric phenols which are starting materials for glycidyl ether compounds which can provide cured products having low moisture absorption, high heat resistance and improved crack resistance and can be used for encapsulating semiconductor devices. The polyhydric phenols are represented by the following formula: ##STR1## wherein R.sup.1 independently represents a halogen atom, an alkyl or cycloalkyl group of 1-9 carbon atoms, an alkoxy group of 4 or less carbon atoms or an aryl group and R.sup.1 may be identical or different when l is 2 or more, R.sup.2 independently represents a halogen atom, an alkoxy group of 4 or less carbon atoms or an alkyl group of 6 or less carbon atoms and R.sup.2 may be identical or different when m is 2 or more, R.sup.

Abstract: A flame retardant epoxy molding compound comprises an epoxy, a hardener preferably of the novolac or anhydride type, a catalyst, a mold release agent, preferably a filler, preferably a colorant, preferably a coupling agent, an organic compound containing a halogen (which can be part of the resin or the hardener), and an oxidizing refractory metal oxide, preferably on oxidizing metal oxide of an element selected from the Group VIA of the Periodic Table. The flame retardant epoxy molding compounds when used to encapsulated semiconductor devices have synergistic flame retardant properties.

Abstract: An anticorrosive primer composition comprises (1) 100 parts by weight of an epoxy resin having a number-average molecular weight of from 500 to 10,000, (2) from 10 to 60 parts by weight of an aromatic polyamine containing from 2% to 30% by weight, based on the aromatic polyamine, of a promoter selected from the group consisting of phenol compounds and cresol compounds, (3) from 10 to 60 parts by weight of a polyisocyanate, (4) from 10 to 40 phr, based on the sum of components (1), (2), and (3), of silica particles of colloidal silica or fumed silica or a mixture of these, (5) from 0.5 to 5 phr of a lubricant, and (6) an organic solvent. The composition is particularly suitable for use to apply onto the chromate coating of a chromated, zinc-plated steel sheet.

Abstract: The invention relates to an abrasive article comprising:(a) a plurality of abrasive grains; and(b) at least one binder for the abrasive grains,wherein the binder comprises a cured epoxy resin containing a polycyclic aryl, polycyclic alkyl, or cycloalkyl structure. The abrasive articles can comprise bonded, non-woven or coated abrasive articles.

Abstract: A coating composition and method of use thereof for coating metal substrates, especially galvanically active metals, containing a resinous organic polymer, a corrosion inhibiting leachable pigment and an ion reactive pigment generally in the form of metallic spheroid particles. Coated materials have improved corrosion resistance.

Abstract: An advanced thermosetting epoxy powder composition comprising from about 95 epoxide equivalent percent to about 99 epoxide equivalent percent of a diglycidyl ether of an aromatic bisphenol, from about 1 to about 5 epoxide equivalent percent of at least one trifunctional polyglycidyl ether of an aliphatic polyol, a curing agent selected from the group consisting of dihydric bisphenol such as bisphenol-A and mixtures of bisphenol-A and bisphenol A endcapped diglycidyl ether of bisphenol A, and a curing accelerator selected from the group consisting of imidazoles and imidazole adducts with polyglycidyl ether of aliphatic polyol.

Abstract: An adhesive composition comprising (a) an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane dianhydride with an alcohol or alcohol derivative, followed by reaction with an epoxy compound having two or more epoxy groups, or an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane with an epoxy compound having two or more epoxy groups and (b) a curing agent is suitable for bonding semiconductor chips to a copper frame with a small warpage of the chips.

Abstract: A two-pack type curable composition comprising:A. a first composition containing (A-1) an organic elastomeric polymer having at least one silicon-containing group to the silicon atom of which a hydroxyl group and/or a hydrolyzable group are bonded and which is cross linkable through formation of a siloxane linkage in a molecule and (A-2) a curing agent for an epoxy resin, andB. a second composition containing (B-1) an epoxy resin, (B-2) a curing catalyst for the organic elastomeric polymer having at least one silicon-containing reactive group and (B-3) at least one member selected from the group consisting of acidic fillers and carboxylic acids, which has good storage stability.

Abstract: An epoxy resin composition comprising (a) a low-viscosity epoxy resin having a viscosity of not more than 100 poise at 25.degree. C. which contains a tri- or tetrafunctional liquid aromatic epoxy resin, (b) a liquid curing agent selected from the group consisting of an imidazole compound, the combination of a liquid alicyclic acid anhydride and an imidazole compound, the combination of a liquid alicyclic amine and an imidazole compound, (c) a metal powder having an average particle size of not more than 125 .mu.m or an inorganic powder consisted of 50 parts or more by weight of a metal powder having an average particle size of not more than 125 3/4m and less than 50 parts by weight of an inorganic filler other than a metal powder, whose average particle size is smaller than that of the metal powder, based on the total amount of the metal powder and the inorganic filler.

Abstract: A polysiloxane-modified epoxy-based encapsulation composition comprising an epoxy resin, a curing agent for the epoxy resin, a polylactone-polysiloxane block copolymer, and a filler is described. The powder molding compositions provide a low internal stress epoxy composition without significantly sacrificing T.sub.g.

Abstract: A machinable, high strength epoxy tool which is the polymeric reaction product of a mixture containing 5 to 12 weight percent of a bisphenol A epoxy, 3 to 8 weight percent of at least one polyoxypropylene amine catalyst, 60 to 85 weight percent of a mixture of no less than three different sized particulate fillers, the major portion of which is iron powder, 5 to 15 weight percent of short (<250 .mu.m) glass fibers, and 0.02 to 1 weight percent of a surface active agent.

Abstract: Metallic fillers are provided which are stabilized against corrosion. The metallic fillers are stabilized by treating the surface of the filler particles wtih a triazole, preferably an aromatic triazole. This may be accomplished either by pretreating the filler with a solution of the triazole, or by adding the triazole to a polymeric composition containing a metallic filler.Polymeric compositions are further provided, e.g. compositions for microwave absorption, comprising a polymeric binder, a metallic filler and a triazole.

Abstract: A halogen free casting resin suitable for covering electron devices with a fire retardant material contains an acidic ester of an hydroxy-functional phosphor compound and an organic anhydride. A stable mixture can be generated from the acidic ester and the hardener component of the casting resin, and further used for the hardening of epoxides resins. The acidic ester is chemically integrated in the epoxide resin matrix in a stable mixture, thereby improving the long term fire-retardancy of the casting resin molding compound without increasing the volatility of the mixture.

Abstract: An adhesive composition comprising (a) an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubustituted disiloxane dianhydride with an alcohol or alcohol derivative, followed by reaction with an epoxy compound having two or more epoxy groups, or an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane with an epoxy compound having two or more epoxy groups and (b) a curing agent is suitable for bonding semiconductor chips to a copper frame with a small warpage of the chips.

Abstract: A casting resin composition curable with an epoxy resin curing agent is described, which comprises at least one kind of an epoxy resin selected from bisphenol A diglycidyl ether and bisphenol F diglycidyl ether, a tri-functional or tetra-functional liquid epoxy resin, and an iron powder, the ratio of the iron powder being from 60 to 80% by weight to the amount of the whole resin composition. The casting resin composition can give a cured product having a high hardness and an excellent abrasion resistance.

Abstract: The present invention discloses a weld-through adhesive sealant comprising a heat deformable reactive resin matrix containing randomly oriented, electrically conductive fibers throughout the matrix. In addition, a method of joining two metal members using said adhesive sealant is also disclosed.

Abstract: An electrical insulator including a thermosetting matrix and a filler composed primarily of powdered material embedded in the thermosetting matrix. The insulator has a high service life in spite of severe mechanical stressing at temperatures of up to 105.degree. C. This is achieved as a result of the thermosetting matrix having a glass transition temperature exceeding 140.degree. C. and the inclusion of a powdered filler, which has a reduced rigidity compared with the thermosetting matrix, embedded in the thermosetting matrix.

Abstract: Nonlinear optical composites with large third-order optical response compd of metal clusters uniformly dispersed in polymers are prepared by vapor deposition of a metal onto a cold support while simultaneously cocondensing a vapor of an organic material. Where the organic material is a monomer, it polymerizes either when it comes in contact of the metal and/or when the cold surface is warmed. The unpolymerized monomer is removed to yield a processable composite. When the organic material is a diluent, it deposits as a solid on the cold surface forming a dispersion of the solid metal clusters in the liquid diluent. A polymer solution is then mixed with the dispersion and the composite is formed after removal of the diluent and the solvent for the polymer.

Abstract: A conductive paste composition is described, which comprises an epoxy resin having a diglycidylamino group, a resol type phenol curing agent, and copper powder. The paste composition exhibits excellent moisture resistance and adhesion and provides a cured film of high conductivity level.

Abstract: An electroconductive adhesive comprising an epoxy-novolak resin, a phenol-aralkyl resin, a glycidyl group-containing silane coupling agent, an organic borate and an electro-conductive metal power is excellent in reliability in moisture and hydrolytic resistance and useful for semiconductor devices.

Abstract: A coating composition for the protection of metallic substrates against environmental attack comprising, in weight percent, from about 10% to about 30% of at least one film-forming polymer such as epoxy resins having an epoxide value of about 250 to about 2500, vinyl chloride resins copolymerized with polyisocyanates, polyurethane resins, and polyester resins; from about 40% to about 55% particulate metallic zinc; from about 4.75% to about 7% zinc-coated hollow glass-like microspheres having diameters ranging from about 2.5 to about 60 microns, the volumetric ratio of the metallic zinc to the microspheres ranging from about 0.8:1 to 1.2:1; from about 1.5 to about 3% of at least one particle size grade of pyrogenic amorphous silica having an average particle size ranging from about 0.007 to about 0.04 micron; and not more than 30% solvents compatible with the film-forming polymer.

Abstract: A method of manufacturing a resin bound magnet comprising, mixing and kneading a powdered magnetic material and a rubber modified epoxy resin obtained from the addition polymerization of an epoxy resin and a butadiene or nitrile rubber and thereafter molding and setting the kneading mixture into a desired shape. The magnets prepared by the present invention exhibit permanent deformation under low compressive force, are soft and heat resistant and yet highly elastic and possess low dynamic exothermic properties and excellent low temperature characteristics. In addition, the inventive magnets exhibit excellent radial compression strength and other mechanical properties.

Abstract: A composition suitable for use as a primer coating for a substrate which comprises a halopolymer, an epoxy resin, and an oxide of titanium. The epoxy resin and oxide of titanium are present in amounts effective to provide a primer coating of the composition over a substrate. Preferred halopolymers are ethylene/chlorotrifluoroethylene copolymers and ethylene/tetrafluoroethylene copolymers. Preferred epoxy resins include bisphenol A based epoxy resins and epoxy cresol novolac resins. A preferred oxide of titanium is titanium dioxide. Such compositions are particularly useful as primer coatings for metal substrates.

Abstract: Layered, fiber-reinforced composites toughened by the use of thermosetting matrix resins including rigid particles are improved in toughness when the particles are porous and have a spheroidal spongy structure, are formed of a polyamide. The method of the invention is particularly effective in improving the toughness of composites based on thermoset matrix resins, and particularly epoxy resins.

Abstract: Epoxy resin composition containing an epoxy resin and an organic gelling agent selected from a polyamide wax, a castor oil wax, a sorbitol derivative and an amino acid derivative, which is in the gel form and is optionally further incorporated with a latent curing agent and an electrically conductive material. Said epoxy resin composition has excellent adhesion strength even under heating and excellent shower resistance and wiping properties and is useful as an adhesive, particularly as a structural adhesive in an assembly line of automobiles.

Abstract: An electrically conductive paste composition comprises an electric conductive powder, an organic binder comprising (A) a polyhydroxystyrene derivative and (B) a thermosetting resin at a weight ratio of (A) to (B) in the range between 5/95 and 95/5 and a solvent. The paste is used for an electric circuit printed on a substrate and improved in view of migration resistance, flexibility and reliability.

Abstract: An electrically conductive paste composition comprises an electrically conductive powder, an organic binder comprising a polymer of a hydroxystyrene having the formula (A) or a copolymer of hydroxystyrene having the formula (B), said polymer and copolymer each having a weight-average molecular weight of 1,000 to 2,000,000, and a solvent. In the formula, Y and Z are an amine group and others.

Abstract: A method for producing a circuit board involves printing a U.V. curable ink onto a substrate in a desired circuit pattern and curing the ink by exposing it to a pulsed U.V. source or subjecting the circuit pattern prepared from a U.V. curable ink containing magnetite particles to a magnetic field to move the magnetite particles to the upper surface of the U.V. curable ink. Other embodiments include circuit boards made in accordance with these methods and the use of the U.V. curable ink as a shielding composition for enclosures housing electronic equipment.

Abstract: Conductive metal powders having high conductivity with minimized silver migration are characterized in that an average composition is represented by Ag.sub.x M.sub.1-x (wherein M is at least one metal selected from Ni, Co, Cu and Fe; 0.01.ltoreq.x.ltoreq.0.4) and has a region wherein a silver concentration progressively increases on moving from the inner part toward the surface. The conductive metal powders, which are useful as leads, electrodes and shielding from electromagnetic interference are prepared by solidifying rapidly a molten metal having the specific composition.

Abstract: Described is a liquid sprayable epoxy composition comprising a liquid epoxy resin, an effective reinforcing amount of a fiber, an elastomeric component and an amine containing epoxy curing agent capable of curing the composition at equal or greater than 40.degree. F. temperatures wherein the cured product is light stable and has a hardness on the Shore D scale. Further described is a method of forming in situ a cured product such as a truck bed liner by spraying, brushing or troweling the epoxy composition onto the substrate such as the trunk bed, curing and forming the product on the substrate at a temperature of at least 40.degree. F. temperature. The ratio of epoxy reactive groups to amine reactive groups ranges from 0.9 to 1.1:1. Further described is a technique of modifying the coating coefficient of friction by sand embedment between the induction period and cure set time of applied epoxy composition.

Abstract: A two component adhesive composition which is curable by induction heating is provided. The presence of an effective amount of conductive carbon black along with an effective amount of an electromagnetic energy absorbing material such as iron oxide in the adhesive composition allows one to reduce the time for induction curing and/or allow the use of low frequency induction generators (less than or equal to 10 KHz) in the bonding of fiber reinforced engineering thermoset, thermoplastic materials and other plastics.

Abstract: An electrochromic resin composition comprising (A) 100 parts by weight of a network comprising a crosslinked polymer containing 4,4'-diaminodiphenylmethane units in a form in which the amino groups in the formula are quaternized, and (B) 5 to 150 parts by weight of an electrolytic material uniformly dispersed in the network (A). The crosslinked polymer containing the units with the amino groups therein being in the quaternized state is useful as an electrochromic or photochromic material.

Abstract: An electromagnetic wave shielding circuit and the production method thereof is described, wherein the circuit comprises a base board, an electric circuit formed on the base board, an electrically isolating coating coated over the electric circuit, a layer of coating having copper particles contained therein coated over the electrically isolating coating and hardened by heating, a copper plating layer attached to the surface of the copper particle containing coating for discharging out of the electric circuit an electromagnetic wave current which may be produced in the electric circuit, said copper particle containing coating having contained therein 100% by weight of copper particles and 12%-25% by weight of epoxy resin for a binder.

Abstract: Coating compositions which do not contain metal powders and which contain, as coloring component, 0.001 to 30% by weight of at least one organic pigment and/or of a polymer-soluble dye and/or of a pearlescent pigment and 0.001 to 30% by weight of molybdenum disulfide, based on the coating produced therewith, are suitable, for example, for coloring surfaces, especially metal surfaces.

Abstract: A corrosive resistant coating composition with improved weldability characteristics which is applied to a metal substrate as a wet film and then heated to dry and initiate curing to provide a protective coating tenaciously bonded to the substrate. The composition has corrosion inhibiting finely divided aluminum or stainless steel, a weldability agent of finely divided nickel, a primary bonding resin, and a vehicle of solvents. Preferably, the composition also has a secondary organic resin and thixotropic, metal suspension and hydroscopic agents.

Abstract: A method of improving the flowability and reducing voids in liquid synthetic thermosetting resins precursor compositions used to pot structures such as a honeycomb core or electronic parts and assemblies. Up to about 0.50 weight percent of a suitable titanate coupling agent is mixed with the liquid resin precursor, preferably in a vacuum or an inert atmosphere, any necessary hardener is added later to the premixed resin with the agent, then the resin is poured into a mold holding the structure to be potted. The titanate coupling agents have the general formula: ##STR1## where: R is an alkoxy, alkyl, alkenyl, alkynyl or aralkyl group having from 1 to about 30 carbon atoms or a substituted derivative thereof;M is zirconium or titanium; andR is independently an aryl, aralkyl, alkaryl, alkyl or alkeno group having from 1 to about 30 carbon atoms.

Abstract: A polysiloxane-modified epoxy-based encapsulation composition comprising an epoxy resin, a curing agent for the epoxy resin, a polylactone-polysiloxane block copolymer, and a filler is described. The powder molding compositions provide a low internal stress epoxy composition without significantly sacrificing T.sub.g.

Abstract: A solid lubricated resistive ink includes solid lubricants which provide self-lubrication of the resistive ink under high vacuum and low moisture conditions. The resistive inks include a polymer-based binder and an electrically conductive solid lubricant which remains electrically conductive and lubricative under low moisture and high vacuum. Effective lubricants include MoSe.sub.2, NbSe.sub.2 graphite intercalated with bromine and graphite intercalated with a metal chloride. The resistive ink may additionally include carbon.

Abstract: Membrane keyboards are manufactured using screen-printable, electrically conductive pastes consisting of 40 to 75% by weight of metal powder (silver, aluminum, copper and their mixtures), 5 to 55% by weight of an organic solvent and 5-20% by weight of and synthetic resin based on a thermoplastic epoxy or phenoxy resin with an average molecular weight of 10,000 to 250,000 and an epoxide content of 0 to 1.

Abstract: A balancing putty for use in balancing rotation of a rotary part including:(a) an epoxy resin;(b) a curing agent capable of curing the epoxy resin when heated at a temperature of 60.degree. C. or more,(c) a first, finely divided inorganic filler having a specific gravity of 4.0 g/cm.sup.3 or more; and(d) a second, finely divided inorganic filler having a specific gravity of less than 4.0 g/cm.sup.3, the balancing putty having a density of at least 2.0 g/cm.sup.3 and a consistency of 1-12 mm in terms of penetration.

Abstract: A solid adhesive composition which is suitable for the very rapid attachment of IC chips to high surface energy substrates comprising flake silver particles dispersed in solid matrix consisting essentially of a thermoplastic phenoxy resin and a small amount of thermally crosslinkable resin.

Abstract: A composition for a vibration damper, which comprises:100 parts by weight of a resin-forming component comprising (a) a compound containing an epoxy group, and (b) a curing component comprising (i) a polyhydric phenol as a first curing compound and (ii) a second curing compound selected from the group consisting of an acid hydrazide, a urea derivative and an imidazole;50 to 500 parts by weight of a scaly filler;200 parts by weight or less of powdery filler; and100 parts by weight or less of a fibrous filler. A process for the manufacture of the composition, and a vibration damper, also are disclosed.

Abstract: This invention relates to aqueous epoxy resin-containing compositions and to such compositions which are particularly useful for depositing coatings on metallic substrates in order to protect substrates against corrosion. The aqueous compositions generally comprise (A) an organic resin component consisting essentially of at least one water-dispersible or emulsifiable epoxy resin or a mixture of resins containing more than 50% by weight of at least one water-dispersible or emulsifiable epoxy resin, (B) chromium trioxide, and (C) water, said composition further characterized as being substantially free of strontium chromate. The aqueous compositions may also contain other ingredients including zinc and/or ferro alloys.These aqueous compositions are useful as pretreatment coatings on metal surfaces, and in particular, on steel and on galvanized and aluminized metal substrates.

Abstract: A rust-proof sealing composition contains 30 to 90 parts by weight of an epoxy resin, 8 to 30 parts by weight of a curing agent containing a carboxylic acid derivative selected from the group consisting of aminocarboxylic acid, polycarboxylic acid hydrazide having not less than 8 carbon atoms and mixtures thereof, 1 to 20 parts by weight of an electrically conductive carbon and a balance of a filler such that the total amounts make up 100 parts by weight. The epoxy resin contains 100 to 30 wt. % of a modified epoxy resin selected from the group consisting of a butadiene/acrylonitrile-modified epoxy resin, an urethane-modified epoxy resin and mixtures thereof, and 0 to 70 wt. % of an epoxy other than the modified epoxy resin.

Abstract: Mechanical devices having relatively moving parts subject to galling or scoring by contact of the parts are effectively repaired by coating the surfaces to be treated with a composition comprising a hardenable epoxy resin, a reinforcing filler, and an amount of an agent such as graphite or molybdenum disulfide capable of reducing the coefficient of friction of the said composition.

Abstract: A conductive composition comprising conductive particles made of a mechanical composite powder of copper or nickel covered with silver and a binder mainly containing bis-phenol A type epoxy resin (diglycidyl ether of bisphenol A) having 1600 to 5500 of molecular weight method for manufacturing a printed circuit substrate comprising the steps of printing the conductive composition on an insulating substrate and partially curing it in a range of 20 to 70% of completion as determined from DTA reactivity data. Thus, the conductive composition can manufacture an inexpensive circuit in simple steps as a whole with good solderability using low melting point solder and having high bonding strength. The method can manufacture the circuit by using the same conductive composition.

Abstract: Epoxy resin systems readily available for curing by the application of an induction heat energy source comprising a silica-filled, low viscosity epoxy resin in combination with an iron oxide or a steel powder.