Abstract: The invention comprises a curable composition comprising: (i) a blocked reactive component wherein the blocked reactive component is a blocked isocyanate or a blocked isothiocyanate; (ii) a functional compound reactive with the blocked reactive component, the functional compound containing reactive hydrogen; (iii) a catalyst for promoting the reaction of the reactive component with the blocked functional compound, wherein said catalyst is based on the reaction product of manganese, cobalt, nickel, copper, zinc, germanium, antimony, or bismuth, or the oxides thereof with a mercaptan, or an organic acid, wherein said organic acid is hexanoic, oxalic, adipic, lactic, tartaric, salicylic, thioglycolic, succinic, or mercapto succinic acid, or the reaction product of copper or germanium, or the oxides thereof with a lower aliphatic acid.

Abstract: This invention relates to low pressure sheet molding compounds and, more particularly, to a composition that is moldable at pressures below about 100 psi, said composition being made by combining: (A) an unsaturated prepolymer resin; (B) a monomeric unsaturated polymerizable material containing a terminal ethylene group; (C) a hydroxy-terminated polyester having a molecular weight in the range of about 500 to about 3000; (D) a polyisocyanate; and (E) a polymerization initiator; the mole ratio of NCO groups from (D) to OH groups from (C) being in the range of about 0.1 to about 10.

Abstract: The present invention relates to a method for crosslinking an isoprene-isobutylene rubber with resins, and a crosslinked rubber product obtained by said method. According to the present invention, there are provided:a method for crosslinking an isoprene-isobutylene rubber, which comprises adding, to 100 parts by weight of an isoprene-isobutylene rubber, 8-25 parts by weight of an alkylphenol-formaldehyde resin and 0.3-10 parts by weight of an epoxy resin such as bisphenol A epoxy resin, anda crosslinked rubber product obtained by the above method.

Abstract: A corrosion preventive material contains zinc and is applied to the surface of a metal product for preventing corrosion of the product. The material consists essentially of a base material of synthetic resin and 65% or more zinc powder by weight dispersed in the base material, the zinc powder containing 25% or more zinc powder by weight having a grain diameter of or above 150 .mu.m. Alternatively, the corrosion preventive material consists essentially of a base material of synthetic resin and 45% or more zinc powder by weight dispersed in the base material, the zinc powder containing 90% or more zinc powder by weight having a grain diameter of or above 150 .mu.m.

Abstract: There are provided a resin composition and hardened products thereof for use in resistors, phosphors, conductors, patterns and the like, which can be developed with water or a dilute alkaline aqueous solution, show good pattern accuracy, give small residual organic matter after baking and have excellent adhesiveness. The resin composition which comprises (A) an unsaturated group-containing resin which is an epoxy methacrylate resulting from the reaction of (a) an epoxy resin having at least two epoxy groups in its molecule with (b) a compound having one unsaturated double bond and one carboxyl group in one molecule and (c) a saturated monocarboxylic acid as an optional component, the reaction product epoxy (meth)acrylate being allowed to react with (d) a polybasic acid anhydride as occasion demands, (B) a diluent, (C) a photopolymerization initiator and (D) one or more substances selected from metal powders, metal oxides, metal sulfides or glass.

Abstract: Powder compositions comprising about 5-15 wt % of PVdF-compatible thermoplastic resin, about 50-90 wt % of a thermosetting binder system, about 0-35 wt % of pigments and about 0-3 wt % of leveling agent are disclosed which are particularly suitable for use as primers with a later application of a pigmented PVdF-based top coating. Preferred compositions are based on an epoxy system containing about 8 wt % of PVdF or acrylic thermoplastic resin, 5-25 wt % of pigments and 0.7-1 wt % of leveling agent.

Abstract: A conductive paste compound for via hole filling includes a conductive filler at 80 to 92 weight percent with an average particle size of from 0.5 to 20 .mu.m and specific surface of from 0.1 to 1.5 m.sup.2 /g, a liquid epoxy resin at 4.5 to 20 weight percent containing 2 or more epoxy groups with room temperature viscosity of 15 Pa.multidot.sec or less, and a hardener at 0.5 to 5 weight percent, wherein the viscosity is 2,000 Pa.multidot.sec or less and the volatile amount is 2.0 weight percent or less. A filling paste and a printed circuit board with use thereof are provided which can conduct an inner-via-hole connection between electrode layers without using a through-hole plating technique.The conductive paste comprises a metallic particle such as copper, an epoxy resin, a hardener, and if necessary, a dispersant. The paste having low viscosity and low volatility under high shear is used to fill holes disposed in a laminated substrate.

Abstract: The invention concerns a process for preparing a polymer composition, that is free-radical/photochemical and thermal curing epoxide-methacrylate and/or isocyanate-methacrylate adhesives in broadest terms, dental/medical adhesives, and dental restoratives. Furthermore the dual curing epoxide-methacrylate and/or isocyanate-methacrylate adhesives can be used in the optical industry, in optoelectronics and microelectronics, for example for the adhesion of complicated optical components in the combination glass/glass, glass/metal. Advantageous is the small shrinkage during polymerization and the good mechanical properties in combination with the possibility of step-wise or one-step polymerization.

Abstract: This invention relates to adhesive formulations, which can be snap-cured without loss of adhesive strength (as measured by die shear strength) and flexibility (as measured by radius of curvature), comprising 20-80 parts by weight of a flexible epoxy resin comprising an oligomeric backbone of alkylene or alkyleneoxy repeat units, terminated with an aromatic moiety bearing one or more epoxy functionalities, and 80-20 parts by weight of an aromatic O-glycidyl ether (to a total 100 parts), a curing catalyst, and optionally one or more fillers, and a phenolic hardener.

Abstract: This invention relates to adhesive formulations, which can be snap-cured without loss of adhesive strength (as measured by die shear strength) and flexibility (as measured by radius of curvature), comprising 20-80 parts by weight of a flexible epoxy resin and 80-20 parts by weight of an aromatic O-glycidyl ether (to a total 100 parts), a curing catalyst, and optionally one or more fillers.

Abstract: The invention relates to a colored pigment comprising a plurality of metallic or mica flakes with a plurality of polymer encapsulated pigment particles adhered to the individual flakes. The colored pigments are useful for imparting color and metallic luster to surface coatings.

Abstract: An adhesive for a flexible printed circuit board and the method of preparing the same where the adhesive displays excellent migration inhibition, moisture adsorption resistance, and superior peeling strength, heat resistance, solvent resistance, chemical resistance, flexibility, and electrical properties. The adhesive is prepared by pre-polymerizing an epoxy resin, a COOH-containing rubber, a filler, and a primary catalyst in a solvent using a tertiary amine as a primary catalyst to form a prepolymer, followed by curing the prepolymer using a curing agent and a curing catalyst. The adhesive is coated on a plastic film, dried and laminated with a copper foil and then cured at an elevated temperature to form a substrate.

Abstract: This invention relates to adhesive formulations, which can be snap-cured without loss of adhesive strength (as measured by die shear strength) and flexibility (as measured by radius of curvature), comprising 20-80 parts by weight of a flexible epoxy resin and 80-20 parts by weight of an aromatic O-glycidyl ether (to a total 100 parts), a curing catalyst, and optionally one or more fillers.

Abstract: The present invention relates to thermosetting resin compositions which may be used in the automotive industry as sealants to coat steel substrates. The thermosetting resin composition contains an epoxy resin, a rosin, an organometallic compound and, optionally, an elastomeric and/or thermoplastic polymeric binder.

Abstract: Disclosed herein is a precursor powder composition comprising a resin, a combination of zinc dust, zinc powder and zinc-coated microspheres and graphite, said powder being soluble in a solvent blend at a facility remote from the powder manufacturing facility, thereby, decoupling the powder manufacturing process from the end use of the powder which could be in a traditional solvent-based paint. Also disclosed are coating compositions for use in protecting metallic substrates from corrosion, comprising necessary additives and film forming substances including alkyl silicate, epoxy resins, powder and non-powder, and polyester resins, all the compositions being modified with about 4 to about 20 weight percent graphite powder based on total weight of the composition.

Abstract: A curable coating composition comprises a composition containing an epoxy resin and a poly(meth)arylate wherein an adhesive improving amount of a metal di(meth)acrylate such as zinc diacrylate and a polyamine curing agent is added.

Abstract: Disclosed is a thermoplastic resin composition comprising (A) an amorphous resin and further comprising, per 100 parts by weight of the amorphous resin,0.01 to 20 parts by weight of (B) an epoxy group-containing ethylene copolymer, and0.01 to 20 parts by weight of at least one member selected from the group consisting of (C) a polyfunctional compound and (D) a carboxylic acid metal salt, wherein the polyfunctional compound contains, per molecule, at least two identical or different functional groups selected from the group consisting of carboxyl group, amino group, carboxylic acid anhydride group and a unit represented by the formula (1) ##STR1## wherein X and Y are identical and each represents oxygen atom or sulfur atom, or one of X and Y is an oxygen atom and the other is a sulfur atom, or wherein the polyfunctional compound contains, per molecule, at least one unit represented by the formula (2) ##STR2## wherein Z represents oxygen atom or sulfur atom.

Abstract: A newly-blended one part system heat-resistant epoxy resin composition which exhibits excellent stability at room temperature, quickly undergoes the curing reaction, molded within short periods of time, and, after cured, exhibits excellent Tg, resistance against the water, resistance against degradation by heat, and a variety of excellent properties in combination. The heat-resistant epoxy resin composition having excellent stability at room temperature comprises an epoxy compound having two or more epoxy groups, a curing agent which comprises a naphthalenedicarboxylic dihydrazide as a main component, and a ceramic whisker as a filler.

Abstract: A coating composition for use in protecting metallic substrates from corrosion, comprising in weight percent, based on the total weight of the composition: from about 10% to 20% of a film forming substance; from about 45% to 55% of zinc powder; from about 25% to 35% of zinc dust; from about 1.5% to 2.5% of hollow glass microspheres having diameters ranging from 1 to about 150 microns and a true density of 0.3 to 1.1; from about 2% to 15 % by weight of the film forming substance, of a hardener; about 1% to 2% by weight of the film forming substance, of an amorphous silica; and about 0.3% to 1% of a flow control agent.

Abstract: A multi-component waterborne corrosion resistant coating composition used as an organic zinc rich primer for protecting metal substrate from corrosion. The composition includes zinc dust, a crosslinking component and a polymeric component produced from a low Tg polymer and an amine functional curing agent. These components of the composition are stored separately and then mixed prior to applying the coat of the composition over metal substrate.The coating composition of the present invention has longer pot life than conventional waterborne corrosion resistant coating composition.

Abstract: A semiconductor-encapsulating composition comprised of (i) an epoxy resin preferably containing a bifunctional biphenyl-skeletal epoxy resin and/or a bifunctional naphthalene-skeletal epoxy resin, (ii) a curing agent containing 4,4'-dihydroxybiphenyl, and (iii) 70 to 95% by weight, based on the total epoxy resin composition, of a filler.

Abstract: Hydroxy-terminated telechelic rubber polymers and block copolymers of flexible polymers with unsaturated polyester resins improve the elongation and flexural elongation of in-mold coating compositions for fiber reinforced plastics (FRP). An FRP in-mold coating composition based upon vinyl ester resin, ethylenically unsaturated monomers, and at least one of telechelic hydroxy terminated flexible polymers and the block copolymers of functionally terminated flexible polymers with unsaturated polyester polymers are described.

Abstract: The present invention provides polyhydric phenols which are starting materials for glycidyl ether compounds which can provide cured products having low moisture absorption, high heat resistance and improved crack resistance and can be used for encapsulating semiconductor devices. The polyhydric phenols are represented by the following formula: ##STR1## wherein R.sup.1 independently represents a halogen atom, an alkyl or cycloalkyl group of 1-9 carbon atoms, an alkoxy group of 4 or less carbon atoms or an aryl group and R.sup.1 may be identical or different when l is 2 or more, R.sup.2 independently represents a halogen atom, an alkoxy group of 4 or less carbon atoms or an alkyl group of 6 or less carbon atoms and R.sup.2 may be identical or different when m is 2 or more, R.sup.

Abstract: A vibration-isolating composite material consists essentially of powder of an inorganic elastic material and a synthetic polymer mixed thereto. The inorganic elastic material is at least one material selected from the group consisting of NdP.sub.5 O.sub.4, BiVO.sub.3, Gd.sub.2 (MoO.sub.4).sub.3, GdNbO.sub.4 and KH.sub.2 PO.sub.4 and the synthetic polymer is at least one material selected from the group consisting of thermoplastic resins, thermosetting resins and rubber materials.

Abstract: In order to obtain a two-component epoxy resin/zinc dust priming coat which for ecological reasons requires little or no solvent, the powdery or flaky zinc, reactive in water, is dispersed in a water-free, water emulsible epoxy resin binder (component A). Component A is mixed immediately before being applied with a water-diluted or water-dissolved polyamine hardener (component B).

Abstract: A stable coating composition for use in protecting metallic substrates from corrosion, comprising in weight percent, based on the total weight of the composition: from about 7% to 35% of alkyl silicate as a film forming substance; from about 35% to 55% of zinc powder; from about 5% to 25% of zinc flakes; from about 0.2 to 5% of at least one amorphous silica; and up to about 30% particulate ferrophosphate; wherein the alkyl silicate comprises, in weight percent, based on the weight of the alkyl silicate: from about 5% to 20% of tetraethyl orthosilicate.

Abstract: A coating composition for use in protecting metallic substrates from corrosion, comprising in weight percent, based on the total weight of the composition: from about 7% to 35% of film-forming substance; from about 35% to 55% of zinc powder; from about 5% to 25% of zinc flakes; from about 1% to 5% at least one kind of amorphous silica; and up to about 30% particulate ferrophosphate.

Abstract: An improved flame retardant epoxy molding compound comprises an epoxy, a hardener preferably of the novolac or anhydride type, a catalyst, a mold release agent, preferably a filler, preferably a colorant, preferably a coupling agent, an organic compound containing a higher percent of halogen (which can be part of the resin or the hardener), preferably the polyglycidyl ether of the bromophenol-formaldehyde novolac type, preferably containing at least about 1.0% of bromine by weight of the molding compound, a lower percent of sodium, preferably in the range of 0.03-0.06% by weight of the antimony pentoxide, a lower percent of antimony pentoxide, preferably in the range of .ltoreq. about 0.8% by weight of the molding compound, and an amount of bismuth trioxide .ltoreq. about 4.0% by weight of the molding compound.

Abstract: The present invention relates to an improved powder coating composition comprising (a) a resin, (b) a curing agent and (c) zinc, wherein the zinc is a mixture of (c1) lamellar zinc and (c2) zinc dust.

Abstract: A polysiloxane-modified epoxy-based encapsulation composition comprising an epoxy resin, a curing agent for the epoxy resin, a polylactone-polysiloxane block copolymer, and a filler is described. The powder molding compositions provide a low internal stress epoxy composition without significantly sacrificing T.sub.g.

Abstract: Metallic fillers are provided which are stabilized against corrosion. The metallic fillers are stabilized by treating the surface of the filler particles wtih a triazole, preferably an aromatic triazole. This may be accomplished either by pretreating the filler with a solution of the triazole, or by adding the triazole to a polymeric composition containing a metallic filler.Polymeric compositions are further provided, e.g. compositions for microwave absorption, comprising a polymeric binder, a metallic filler and a triazole.

Abstract: Disclosed are curable compositions based on a combination of polyphenylene oxide, monomeric epoxy resin, a compatibilizing metal salt of tin, and suitable curing agents. The monomeric epoxy resin comprises a polyepoxide composition comprising at least one bisphenol polyglycidyl ether having an average of at most one aliphatic hydroxy group per molecule. The composition may be used in the preparation of laminates useful as printed circuit boards.

Abstract: Matrix resin formulations comprising cyanate esters of phenol adducts of dicyclopentadiene, epoxy resins and particular thermoplastics, provide fiber reinforced composites with excellent toughness and hot/wet properties.

Abstract: The present invention discloses a weld-through adhesive sealant comprising a heat deformable reactive resin matrix containing randomly oriented, electrically conductive fibers throughout the matrix. In addition, a method of joining two metal members using said adhesive sealant is also disclosed.

Abstract: An electrical insulator including a thermosetting matrix and a filler composed primarily of powdered material embedded in the thermosetting matrix. The insulator has a high service life in spite of severe mechanical stressing at temperatures of up to 105.degree. C. This is achieved as a result of the thermosetting matrix having a glass transition temperature exceeding 140.degree. C. and the inclusion of a powdered filler, which has a reduced rigidity compared with the thermosetting matrix, embedded in the thermosetting matrix.

Abstract: Nonlinear optical composites with large third-order optical response compd of metal clusters uniformly dispersed in polymers are prepared by vapor deposition of a metal onto a cold support while simultaneously cocondensing a vapor of an organic material. Where the organic material is a monomer, it polymerizes either when it comes in contact of the metal and/or when the cold surface is warmed. The unpolymerized monomer is removed to yield a processable composite. When the organic material is a diluent, it deposits as a solid on the cold surface forming a dispersion of the solid metal clusters in the liquid diluent. A polymer solution is then mixed with the dispersion and the composite is formed after removal of the diluent and the solvent for the polymer.

Abstract: A conductive paste composition is described, which comprises an epoxy resin having a diglycidylamino group, a resol type phenol curing agent, and copper powder. The paste composition exhibits excellent moisture resistance and adhesion and provides a cured film of high conductivity level.

Abstract: An electroconductive adhesive comprising an epoxy-novolak resin, a phenol-aralkyl resin, a glycidyl group-containing silane coupling agent, an organic borate and an electro-conductive metal power is excellent in reliability in moisture and hydrolytic resistance and useful for semiconductor devices.

Abstract: An electrically conductive paste composition comprises an electric conductive powder, an organic binder comprising (A) a polyhydroxystyrene derivative and (B) a thermosetting resin at a weight ratio of (A) to (B) in the range between 5/95 and 95/5 and a solvent. The paste is used for an electric circuit printed on a substrate and improved in view of migration resistance, flexibility and reliability.

Abstract: An electrically conductive paste composition comprises an electrically conductive powder, an organic binder comprising a polymer of a hydroxystyrene having the formula (A) or a copolymer of hydroxystyrene having the formula (B), said polymer and copolymer each having a weight-average molecular weight of 1,000 to 2,000,000, and a solvent. In the formula, Y and Z are an amine group and others.

Abstract: A coating composition capable of substantial deformation without loss of continuity, adhesion or protective properties. The coating composition comprises a phenoxy resin mixed with a relatively soft modifier resin having certain specific properties. In a preferred embodiment, a particulate material, such as a zinc pigment, may also be included. A crosslinker may also be included.

Abstract: A tray for an integrated circuit comprising a thermosetting resin compound comprising 20 to 180 parts by weight of a filler with a water absorption of 0.45% or less and 15 to 45 parts by weight of electroconductive carbon black added to 100 parts by weight of a thermosetting resin with a water adsorption of 0.45% or less, desirably with 5 to 15 parts by weight of an acrylonitrile-butadiene type rubber, said tray having a surface resistance of 10.sup.2 to 10.sup.6 .OMEGA., a water absorption of 0.45% or less than a glass transition temperature of 150.degree. C. or higher.

Abstract: Conductive metal powders having high conductivity with minimized silver migration are characterized in that an average composition is represented by Ag.sub.x M.sub.1-x (wherein M is at least one metal selected from Ni, Co, Cu and Fe; 0.01.ltoreq.x.ltoreq.0.4) and has a region wherein a silver concentration progressively increases on moving from the inner part toward the surface. The conductive metal powders, which are useful as leads, electrodes and shielding from electromagnetic interference are prepared by solidifying rapidly a molten metal having the specific composition.

Abstract: A two component adhesive composition which is curable by induction heating is provided. The presence of an effective amount of conductive carbon black along with an effective amount of an electromagnetic energy absorbing material such as iron oxide in the adhesive composition allows one to reduce the time for induction curing and/or allow the use of low frequency induction generators (less than or equal to 10 KHz) in the bonding of fiber reinforced engineering thermoset, thermoplastic materials and other plastics.

Abstract: An electrochromic resin composition comprising (A) 100 parts by weight of a network comprising a crosslinked polymer containing 4,4'-diaminodiphenylmethane units in a form in which the amino groups in the formula are quaternized, and (B) 5 to 150 parts by weight of an electrolytic material uniformly dispersed in the network (A). The crosslinked polymer containing the units with the amino groups therein being in the quaternized state is useful as an electrochromic or photochromic material.

Abstract: This invention relates to a corrosion-resistant coating capable of being lied to various substrates, e.g., particularly metal and plastic surfaces, as a single coat characterized as having a high-gloss, good adhesion and a high degree of flexibility. The corrosion inhibiting composition comprises an epoxide resin containing an effective amount of a corrosion-inhibiting pigment system consisting essentially of critical amounts of at least one zinc phosphate, zinc molybdate and at least one zinc salt of a benzoic acid.

Abstract: A thermally curable conductive polymer thick film composition comprising an uncured admixture of:(a) a resin system comprising an admixture of:(i) about 4.50 parts to about 12 parts by weight of at least one phenoxy resin; and(ii) about 6 parts to about 15.5 parts by weight of at least one blocked polyisocyanate resin; and(b) a particulated electrically conductive material selected from the group consisting of:(i) about 50 parts to about 70 parts by weight silver flake; and(ii) a mixture of about 15 parts to about 25 parts by weight graphite and about 3 parts to about 6 parts by weight carbon black.

Abstract: A conductive die attach composition containing no solvent and substantially no ionic impurities which comprises:(a) an epoxy resin system comprising (i) at least one low viscosity epoxy resin; and (ii) at least one epoxy resin hardener;(b) at least one unsaturated monomer which, when polymerized, is not capable of reacting with said epoxy resin system;(c) at least one free radical initiator for polymericing said unsaturated monomer; and(d) finely divided silver particles.

Abstract: A polysiloxane-modified epoxy-based encapsulation composition comprising an epoxy resin, a curing agent for the epoxy resin, a polylactone-polysiloxane block copolymer, and a filler is described. The powder molding compositions provide a low internal stress epoxy composition without significantly sacrificing T.sub.g.

Abstract: Membrane keyboards are manufactured using screen-printable, electrically conductive pastes consisting of 40 to 75% by weight of metal powder (silver, aluminum, copper and their mixtures), 5 to 55% by weight of an organic solvent and 5-20% by weight of and synthetic resin based on a thermoplastic epoxy or phenoxy resin with an average molecular weight of 10,000 to 250,000 and an epoxide content of 0 to 1.