Abstract: An epoxy composition for application to the surface of a marine vessel. The epoxy composition comprises an epoxy resin and an iron particulate combined with one or more materials, preferably dry materials, which are piped into a feeder and then into a mixer. The dry materials are selected from a group of one or more additives comprising a ceramic material, an amorphous fumed silica such as Cab-O-Sil®, a silicone and a color pigment. The combined mixture is then submitted to a polarizing process so that the iron particulate is magnetized to create a polarized, electromagnetic field. A second mixture comprising an epoxy hardener, a ceramic material and an amorphous fumed silica is produced for ultimately combining with the epoxy resin mixture at the point of application to the marine vessel.

Abstract: A molding compound for use in encapsulating electronic packages which include an optoelectronic component, such as an LED, is provided. The molding compound of the present invention includes a partially cured epoxy composition having a phosphor material substantially uniformly distributed throughout the epoxy composition. The phosphor material may be suspended within the epoxy composition by pre-reacting a portion of the epoxy composition prior to B-staging of the molding compound. As such, the phosphor material is suspended within the epoxy composition, thereby preventing settling of the phosphor material during B-staging, as well as during curing of the molding compound in the encapsulation process.

Abstract: The invention provides a method for adhering two substrates comprising: providing an adhesive film having a first surface and a second surface; irradiating the adhesive film with ultraviolet radiation to provide an activated adhesive film having a first activated surface and a second activated surface; cooling the activated adhesive film either while irradiating or immediately after irradiating the film; contacting the first activated surface with a first substrate; contacting the second activated surface with a second substrate; and applying heat and pressure to the first and second substrates to cure the activated adhesive film and to bond the substrates to one another.

Abstract: The present invention relates to an anti-friction and anti-wear liquid coating composition for use with parts made of materials that have softening points below about 300° F. and articles so coated. The present invention also relates to a method of coating parts made from a low softening point materials with an anti-friction and anti-wear hard coating composition. The coating composition comprises a mixture of (i) solid lubricants comprising boron nitride, graphite and molybdenum disulfide, (ii) a thermoset resin system, (iii) catalyst for curing the resin system and (iv) a solvent system comprising highly volatile solvents. The coating composition is applied to the part and cured to form a coating on the part.

Abstract: A coating solution for producing a cured coating, particularly for metallic surfaces, includes (1) a binder containing organic polymers with optional organic or inorganic addictions and (2) at least one of a melamine resin, an epoxy resin, a polyurethane resin, an alkyd resin, or mixtures thereof. The coating solution, in the liquid state, contains water. The binder contains 50-100% phenolic resin, preferably based on phenol and/or resorcinol.

Abstract: Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) a curing agent comprising hexahydro-4-methylphthalic anhydride, (C) at least one a boron containing catalyst that is essentially free of halogen, and (D) at least one cure modifier. The encapsulant (11) may also optionally comprise at least one of ancillary curing catalysts, thermal stabilizers, UV stabilizers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip (4), and an encapsulant (11) comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.

Abstract: A flip-chip type semiconductor device sealed with a light transmissive epoxy resin composition comprising (A) an epoxy resin having the following general formula (i):  wherein n is 0 or a positive number, (B) a curing accelerator, and (C) an amorphous silica-titania co-melt as at least one of inorganic fillers, said composition satisfying the relationship of the following formula (1): [ { 2 ⁢ ( n A 2 + n C 2

Abstract: A composition that can be used to prepare a thermal interface material includes: A) a curable matrix having a curing temperature, B) a metal filler having a low melting point, optionally C) a spacer, and optionally D) a conductive filler. The temperature at which component B) commences softening is less than the curing temperature of component A). A thermal interface material is prepared by: 1) interposing the composition between an electronic component and a heat spreader to form a bondline, 2) heating the composition to a temperature higher than the temperature at which component B) commences softening but less than the curing temperature of component A) and optionally applying pressure to the composition, and 3) heating the composition to a temperature greater than or equal to the curing temperature of component A). The average particle size of component B) is greater than or equal to the bondline thickness.

Abstract: A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating free radicals upon heating, (2) hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) a radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material.

Abstract: A curable coating composition is disclosed comprising a resinous binder comprising (a) a reaction product of an epoxy-containing polymer with a compound containing phosphorus acid groups, the reaction product having reactive functional groups, and (b) a curing agent having functional groups reactive with the functional groups of (a). An electroconductive pigment is dispersed in (a) such that the weight ratio of the electroconductive pigment to (a) plus (b) is within the range of 0.5 to 9.0:1. When the curable coating composition is deposited and cured on a metal substrate, the cured coating is weldable.

Abstract: A process for producing a MC-type conductive filler includes treating minute metallic particles with a coupling agent, preparing an oil phase of the coupling agent-treated minute metallic particles and a reactive substance A, the reactive substance A directly contacting the metallic particles. Then, an aqueous phase is prepared having a reactive substance B, which is capable of reacting with the reactive substance A, dissolved in water. Thereafter, the oil phase is dispersed in the aqueous phase to form a suspension. In situ reaction of the reactive substances A and B is then caused by applying heat to the suspension or adding a catalyst to the suspension. This forms a coating of a thermosetting insulating resin on the surface of the minute metallic particles. Alternatively, the reactive substance B may not be used.

Abstract: The invention relates to a noble metal preparation for the production of noble metal decorations on firable decoration substrates by direct printing and indirect printing (decalcomania method).

Abstract: To provide an anisotropically conductive adhesive composition that can be rapidly cured at a low temperature during thermocompression bonding and has a sufficiently long working life, while also exhibiting excellent mutual connection stability after connection between substrates. The anisotropically conductive adhesive composition comprises an epoxy resin comprising a cycloaliphatic epoxy resin and a glycidyl group-containing epoxy resin, an ultraviolet activatable cationic polymerization catalyst and a cationic polymerization retarder, and conductive particles.

Abstract: An improved aqueous cathodic electrocoating composition having a binder of an epoxy-amine adduct which is an epoxy resin that has been reacted with an amine, a blocked polyisocyanate crosslinking agent and an organic or inorganic acid as the neutralizing agent for the epoxy amine adduct; where the improvement is a catalyst of an alkyl tin oxide that has been dissolved with an organic or inorganic acid to provide a clear cathodic electrocoating composition.

Abstract: An adhesive for semiconductor chips contains a first resin component which is polymerizable, a first hardener for inducing a self-polymerization reaction of the first resin component and a second hardener which is addition-polymerized with the first resin component. When the adhesive is applied on a wiring board and a semiconductor chip is applied thereon and heat is applied, the second hardener is addition-polymerized with the backbone of the three-dimensional network formed by the self-polymerization reaction of the first resin component. The first temperature at which the addition polymerization zone becomes a rubbery structure is lower than the second temperature at which the backbone becomes a rubbery structure, so that the elastic modulus loss sharply increases at the first temperature to reduce the stress between the semiconductor chip and the wiring board.

Abstract: A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, (D-i) an organopolysiloxane, (D-ii) an organopolysiloxane cured product, or (D-iii) a block copolymer obtained by reacting an epoxy resin or alkenyl group-bearing epoxy resin with an organohydrogenpolysiloxane, and (E) an inorganic filler. The composition has improved moldability and solder crack resistance while exhibiting high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.

Abstract: An epoxy resin composition comprising (A) an epoxy resin, (B) a curing accelerator, and (C) an inorganic filler is light transmissive when it satisfies formulae (1) and (2): [{2(nA2+nC2)−(nA+nC)2}/2]½<3.0×10−3  (1) [{2(fA2+fC2)−(fA+fC)2}/2]½<1.0×10−5  (2) wherein nA is the refractive index at T1° C. of the cured unfilled composition, nC is the refractive index at T1° C. of the inorganic filler, fA is a temperature coefficient of the refractive index of the cured unfilled composition, and fC is a temperature coefficient of the refractive index of the inorganic filler. The cured composition has improved heat resistance, humidity resistance and low stress as well as high transparency over a wide temperature range. The composition is suited for the sealing of optical semiconductor devices.

Abstract: Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) a curing agent comprising hexahydro-4-methylphthalic anhydride, (C) at least one a boron containing catalyst that is essentially free of halogen, and (D) at least one cure modifier. The encapsulant may also optionally comprise at least one of ancillary curing catalysts, thermal stabilizers, UV stabilizers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip, and an encapsulant comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.

Abstract: Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) at least one anhydride curing agent, (C) at least one a boron containing catalyst that is essentially free of halogen, (D) at least one cure modifier, and, optionally (E) at least one ancillary curing catalyst. The encapsulant may also optionally comprise at least one of thermal stabilizers, UV stabilizers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip, and an encapsulant comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.

Abstract: Flame retardant molding compositions that are substantially free of halogen, phosphorus, and antimony are disclosed. Also disclosed is the use of these flame retardant molding compositions to coat electronic devices such as integrated circuits. The flame retardant molding compositions include an epoxy resin; a first transition metal oxide containing a refractory metal, such as tungsten trioxide; and a second transition metal oxide containing an oxyanion of a Group VIA element and a cation of a Group IIA element, such as calcium molybdate.

Abstract: A method for treating a fastening part made from an iron-based alloy comprising the steps of degreasing and blasting the part; coating the part with an epoxy resin undercoating; and applying another coating thereon as a finish coat. The epoxy resin undercoating comprises a mixture of a first composition comprising, in parts by weight, about 20-200 parts of a zinc dust, about 0.05-0.5 parts of a thermally expanding powder having micro capsules adapted to explode when heated to form voids in the coating, and provide limited porosity, and about 10 parts of a vehicle mainly composed of an epoxy resin and a second composition comprising, in parts by weight, about 0.2-2.5 parts of an epoxy type silane coupling agent and about 100 parts of the zinc dust.

Abstract: An aqueous coating agent comprising a hydrophilic resin; a solid lubricating agent comprising MoS2, antimony oxide, and at least one antimony sulfide selected from the group consisting of Sb2S3 and Sb2S5; and water; wherein the weight ratio of MoS2 to antimony sulfide is from 1:0.05 to 1:1.2 and the weight ratio of the solid lubricating agent to the hydrophilic resin is from 0.7:1 to 3:1.

Abstract: An composition with improved electrical stability for use in microelectronic applications comprises a polymeric resin, a conductive filler, a curing agent, optionally either a reactive or a nonreactive diluent and a corrosion inhibitor to provide the electrical stability.

Abstract: The present invention is directed to polymer-ceramic composites having high dielectric constants formed using polymers containing a metal acetylacetonate (acacs) curing catalyst. In particular, it has been discovered that 5 weight percent Co(III) acac can increase the dielectric constant of DER661 epoxy by about 60%. The high dielectric polymers are combined with fillers, preferably ceramic fillers, to form two phase composites having high dielectric constants. Composites having about 30 to about 90% volume ceramic loading and a high dielectric base polymer, preferably epoxy, have been discovered to have a dielectric constants greater than about 60. Composites having dielectric constants greater than about 74 to about 150 are also disclosed. Also disclosed are embedded capacitors with capacitance densities of at least 25 nF/cm2, preferably at least 35 nF/cm2, most preferably 50 nF/cm2. Methods to increase the dielectric constant of the two phase composites having high dielectric constants are also provided.

Abstract: A resist composition for permanent protective coating of a printed wiring board, which resist composition is excellent in flame resistance and is obtained by incorporating as essential components a flame retardant containing 100 to 140 parts by weight of (a) aluminum hydroxide, 0.1 to 15 parts by weight of (b) a molybdenum compound and 0.1 to 10 parts by weight of (c) a zinc stannate type compound into 100 parts by weight of a resin.

Abstract: The present invention relates to a method of making an aqueous dispersion of particles comprising epoxy-functional and acid-functional materials. Coating compositions made from such a dispersion can be used to protect various substrates, including imaging layers, so that the coated product resists fingerprints, common stains, and spills.

Abstract: A connecting material that can be used in the mounting of semiconductor devices on a circuit substrate for semiconductor devices, contains the following components A to C: (A) an epoxy resin; (B) a phenol compound having two or more phenolic hydroxyl groups; and (C) a latent curing agent, where it is preferred that if the ratio of the number of phenolic hydroxyl group equivalents of the phenol compound of component B to the number of epoxy equivalents of the epoxy resin in the connecting material is 0.2 to 1.0.

Abstract: Disclosed is a liquid epoxy resin composition for sealing a semiconductor device which comprises (A) a cyanic acid ester, (B) an epoxy resin, (C) an inorganic filler, (D) a metal chelate and/or a metal salt, and at least one of (E1) an acid anhydride, (E2) a dihydrazide compound and (F) a silicone resin gel, wherein at least one of components A and B is liquid at room temperature, component E1 is liquid at room temperature, and the weight ratio of component C to the total weight of the composition, the weight ratio of component A to component B, and the weight ratio of component E1, E2 or F to the total weight of the composition except component C each ranges a specific ratio.

Abstract: Polymerizable composition that include: (a) a cationically active functional group; (b) an initiation system capable of initiating cationic polymerization of the cationically active functional group; and (c) a filler composition that includes various radiopacifying fillers in an amount sufficient to render the polymerizable composition radiopaque. Components (a), (b), and (c) are selected such that the polymerizable composition polymerizes to form a polymerized composition having a Barcol hardness, measured using a GYZJ-935 meter, of at least 10 within 30 minutes following initiation of the cationically active functional group are a reaction temperature of 25° C.

Abstract: A liquid epoxy-based potting composition has a glass transition temperature equal to or greater than 200° C. and comprises a cyclo-aliphatic epoxy, present in an amount of 50 to 80 parts by weight; a multi-functional aromatic epoxy (having more than two epoxy groups per molecule), present in an amount of 20 to 50 parts by weight; a liquid anhydride, present in an amount of 80 to 150 parts by weight; a basic latent accelerator, present in an amount of 1 to 5 parts by weight; and a filler, present in an amount of 100 to 500 parts by weight.

Abstract: Flame retardant molding compositions that are substantially free of halogen, phosphorus, and antimony are disclosed. Also disclosed are the use of these flame retardant molding compositions to coat electronic devices such as integrated circuits.

Abstract: A process for producing a MC-type conductive filler includes treating minute metallic particles with a coupling agent, preparing an oil phase of the coupling agent-treated minute metallic particles and a reactive substance A, the reactive substance A directly contacting the metallic particles. Then, an aqueous phase is prepared having a reactive substance B, which is capable of reacting with the reactive substance A, dissolved in water. Thereafter, the oil phase is dispersed in the aqueous phase to form a suspension. In situ reaction of the reactive substances A and B is then caused by applying heat to the suspension or adding a catalyst to the suspension. This forms a coating of a thermosetting insulating resin on the surface of the minute metallic particles. Alternatively, the reactive substance B may not be used.

Abstract: The present invention is directed to a corrosion barrier coating composition, comprising an admixture of: (1) about 60 to about 95 wt % of a one-component epoxy resin composition comprising (a) about 10-30% by weight of 4-glycidyloxy, n,n-diglycidyl aniline; (b) about 30-60% by weight of an epoxy resin, wherein the epoxy resin is epichlorohydrin ether of bisphenol A; and (c) about 3-7% by weight of strontium chromate; (2) about 1 to about 30 wt % of polytetrafluoroethylene; and (3) about 1 to about 20 wt % of glass powder, all weight percents being based on the total weight of the composition. The present invention is also directed to a substrate coated with the above corrosion barrier coating composition, and a method of coating a substrate with the above composition.

Abstract: A thermoset conductive ink for use in through hole interconnections or similar electric and electronic applications to provide stable electrical connections. The conductive ink of this invention comprises a thermal curable resin system having an admixing of an epoxy resin, a cross-linking agent and a catalyst, an electrically conductive material such as silver, copper or silver-coated copper and an organic solvent.

Abstract: The present invention relates to a semiconductor encapsulating resin composition which is safe and superior in moisture resistance, flame retardance and moldability, and to a highly reliable semiconductor device which is fabricated by encapsulating a semiconductor element with such a semiconductor encapsulating resin composition. The resin composition according to the present invention comprises a thermosetting resin, a hardening agent and a compound metal hydroxide of polyhedral crystal form represented by the following general formula (1): m(MaOb).n(QdOe).cH2O  (1) [wherein M and Q are different metal elements; Q is a metal element which belongs to a group selected from IVa, Va, VIa, VIIa, VIII, Ib and IIb groups in the periodic table; m, n, a, b, c, d and e, which may be the same or different, each represents a positive number].

Abstract: The invention relates to a two-component coating agent on an epoxy resin base, comprising a resin component A and a hardener component B, characterized in that the resin component A consists of between (15 and 18) weight percent, in relation to component A, of an epoxy resin and at least one additional component, chosen from among a reactive diluent, a filler, and other ingredients such as pigments, additives and extenders, that the hardener component B consists of between 20 and 50 weight percent, in relation to component B, of m-xylyl endiamine and at least one other component, chosen from among an adductor resin, an extender and an accelerator, and in that components A and B are present at a molar ratio of 1:0.8 to 1.2. The coating agent, which in addition to the two main components can also contain as much as 15 times their weight in aggregates having a particle size of up to 3.

Abstract: The present invention provides a cationic electrodeposition paint capable of forming a coating film with uniform coating surface and small film thickness difference and excellent in gloss and levelling property, characterized by containing a cationizable resin having crosslinkable functional group (A), a blocked polyisocyanate compound (B) and benzoic acid and/or salicylic acid (C).

Abstract: Polymerizable compositions that include: (a) a cationically active functional group; (b) an initiation system capable of initiating cationic polymerization of the cationically active functional group; and (c) a filler composition that includes various radiopacifying fillers in an amount sufficient to render the polymerizable composition radiopaque. Components (a), (b), and (c) are selected such that the polymerizable composition polymerizes to form a polymerized composition having a Barcol hardness, measured using a GYZJ-935 meter, of at least 10 within 30 minutes following initiation of the cationically active functional group at a reaction temperature of 25° C.

Abstract: An apparatus separates a substantially metallic portion from a substantially non-metallic portion or constituent components of at least one electrical product, comprising a plurality of crushing machines, such as a first crushing machine and a second crushing machine and a separating machine. The first crushing machine crushes the at least one electrical product to create at least one crushed electrical product. The first crushing machine has a first screen affixed thereto to regulate a first flow of the at least one first crushed electrical product from the first crushing machine. The second crushing machine crushes the at least one first crushed electrical product to create at least one second crushed electrical product. The second crushing machine has a second screen affixed thereto to regulate a second flow of the at least one second crushed electrical product from the second crushing machine.

Abstract: The present invention is directed to a low friction coating composition, comprising (1) about 60 wt% to about 95 wt % of a high temperature epoxy; (2) about 1 wt % to about 30 wt % of molybdenum disulfide; and (3) about 1 wt % to about 20 wt % of polyimide powder, all based on the total weight of the coating composition. The present invention is also directed to a substrate coated with the low friction coating composition of the invention, and a method of coating a substrate with the low-friction coating composition of the invention.

Abstract: A paste for filling through-holes of a printed wiring board contains 100 parts by weight of an epoxy resin composition containing 90 to 99.5 parts by weight of an epoxy resin and 0.5 to 10 parts by weight of a curing agent; and (B) 500 to 1000 parts by weight of a metallic filler having an average particle size of 0.5 to 20 &mgr;m. The paste has a viscosity of not higher than 20,000 poise at 25° C. and a volatile content of not more than 1.0% when heated in a filling step. The paste exhibits such shrink-resistance properties that when a first cured resin obtained by heating in a filling step is re-heated and cooled in a solder reflow step to obtain a second cured resin, the shrinkage percentage of the first cured resin to the second cured resin in the longitudinal direction of the through-hole is not greater than 0.1%.

Abstract: An epoxy resin composition for sealing semiconductors which does not contain any halogen compounds or antimony compounds, has an excellent flame retarding property and shows excellent high temperatures storage life and reliability in a humid condition, and a semiconductor device are provided. The epoxy resin composition for sealing semiconductors comprises (A) an epoxy resin, (B) a phenol resin curing agents, (C) a curing accelerator, (D) an inorganic filler and (E) zinc molybdate as the essential components and the semiconductor device is sealed with this epoxy resin composition.

Abstract: A liquid thermosetting filling composition comprising (A) an epoxy resin assuming a liquid state at room temperature, (B) a phenolic resin assuming a liquid state at room temperature, (C) a curing catalyst, and (D) an inorganic filler is useful as an ink for permanently filling such holes as via holes and through holes in printed circuit boards of a multilayer board or a double-sided board, a sealing compound for IC packages, and the like. This composition is a two-stage thermally curing type. In a method for permanently filling holes in a printed circuit board, the composition is applied to the board so as to fill the holes in the printed circuit board and precured by application of heat. The parts of the precured composition protruding from a surface defining the holes is removed by polishing and then the precured composition is further heated to cause final curing thereof.

Abstract: A halogenated flame retardant for a thermoplastic resin with carbonyl linkages in the main chain such as polyethylene terephthalate or polybutylene terephthalate is obtained by the modification of a brominated bisphenol A epoxy resin optionally advanced with brominated bisphenol A by reaction of the epoxy groups with a C1-C8 alcohol such as methanol or butanol to the extent that the ratio of unmodified epoxy groups to alcohol-modified epoxy groups is from 2/1 to 1/2.

Abstract: The present invention is a weld bonding method providing adhesion by both an adhesive and resistance spot welding, and includes application of an adhesive including a thermosetting epoxy resin, a latent curing agent and 1 to 15 vol % of one or more additives selected from the group consisting of conductive metals, metal oxides, metal carbides, metal nitrides, metal borides, and metal silicides, which are in the from of powder having a particle size of 10 .mu.m or less, or in the form of fragments or flakes having a thickness of 0.5 .mu.m or more and a size of 30 .mu.m or less.

Abstract: A composition for use as an electrical stress controlling layer (12) for use with cable joints and terminations has a non-linear V-I characteristic. The composition comprises a polymeric matrix filled with doped zinc oxide varistor powder. The particulate filler is sieved at 125 micrometers, calcined at 1100.degree. C., and lightly ground to maintain the spherical shape of the particles. More than 50% by weight of the particles have a maximum dimension between 5 and 100 micrometers.

Abstract: Provided is a black sealant for liquid crystal cell comprising (a) an epoxy resin, (b) a novolac resin, (c) a curing accelerator and (d) a titanium-type black pigment. The use of the black sealant for liquid crystal cell of the present invention can provide a liquid crystal cell which prevents light leakage of the liquid crystal cell from the sealed portion, which has a high electrical insulation property and which is excellent in an adhesion strength and a humidity resistance.

Abstract: A process for producing a MC-type conductive filler includes treating minute metallic particles with a coupling agent, preparing an oil phase of the coupling agent-treated minute metallic particles and a reactive substance A, the reactive substance A directly contacting the metallic particles. Then, an aqueous phase is prepared having a reactive substance B, which is capable of reacting with the reactive substance A, dissolved in water. Thereafter, the oil phase is dispersed in the aqueous phase to form a suspension. In situ reaction of the reactive substances A and B is then caused by applying heat to the suspension or adding a catalyst to the suspension. This forms a coating of a thermosetting insulating resin on the surface of the minute metallic particles. Alternatively, the reactive substance B may not be used.

Abstract: The invention provides chromate-free coating mixtures, and coatings formed from these mixtures, that protect an underlying aluminum or aluminum alloy substrate from corrosion. The coating mixtures include a continuous phase selected from organic polymeric compositions, or sol-gels, and a distributed phase, dispersed or dissolved throughout the continuous phase. The distributed phase includes the corrosion-inhibiting chromate-free salts. In accordance with the invention, the mixture of salts includes (1) a first salt selected from (a) the esters of rare earth metals, such as cerium and lanthanum oxalates and acetates, and (b) the vanadate salts of alkali and alkali earth metals, such as sodium metavanadate and calcium metavanadate; and (2) a second salt that is a borate salt of alkali earth metals, such as barium metaborate. In certain embodiments, the coatings of the invention include both (a), and (b), in conjunction with the borate salt (2).

Abstract: Powder compositions comprising about 5-15 wt % of PVdF-compatible thermoplastic resin, about 50-90 wt % of a thermosetting binder system, about 0-35 wt % of pigments and about 0-3 wt % of leveling agent are disclosed which are particularly suitable for use as primers with a later application of a pigmented PVdF-based top coating. Preferred compositions are based on an epoxy system containing about 8 wt % of PVdF or acrylic thermoplastic resin, 5-25 wt % of pigments and 0.7-1 wt % of leveling agent.