Inorganic Si-o Bond Dnrm Patents (Class 523/466)
Polymer derived from ethylenic reactants only (Class 523/467)
  • RESIN COMPOSITION, RESIN SHEET, PREPREG, LAMINATE, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE
    Publication number: 20110205721
    Abstract: Disclosed is a resin composition having a low thermal expansion coefficient and a high glass transition temperature used for the insulating layer of a multilayer printed wiring board, capable of forming an insulating layer having fine roughened shapes and imparting sufficient plating peel strength. Also disclosed are a resin sheet, a prepreg, a laminate, a multilayer printed wiring board and a semiconductor device, all of which comprising the resin composition. The resin composition is a resin composition comprising (A) an epoxy resin, (B) a cyanate ester resin, (C) an aromatic polyamide resin containing at least one hydroxyl group and (D) an inorganic filler, as essential components.
    Type: Application
    Filed: October 27, 2009
    Publication date: August 25, 2011
    Inventor: Tadasuke Endo
  • CURABLE POLYMER MIXTURES
    Publication number: 20110190420
    Abstract: Curable polymer mixtures comprising at least one oligomeric addition product with hydrolyzable silane groups and additional functional groups as the mediator additive, and a curable polymer system having epoxy group-carrying polymers and curing agents, fillers and optionally addditives; polymer concrete mixtures and molded bodies produced therefrom
    Type: Application
    Filed: August 19, 2009
    Publication date: August 4, 2011
    Applicant: BYK-CHEMIE GMBH
    Inventors: René Nagelsdiek, Bernd Göbelt, Wolfgang Pritschins, Dorothée Greefrath, Stephan Remme, Andrea Esser
  • ADHESIVE COMPOSITION FOR PRODUCING SEMICONDUCTOR DEVICE, AND ADHESIVE SHEET FOR PRODUCING SEMICONDUCTOR DEVICE
    Publication number: 20110190421
    Abstract: Provided is an adhesive composition into which an additive for capturing a cation is incorporated, thereby making it possible to form a semiconductor-device-producing adhesive sheet capable of preventing deterioration of the electrical characteristic of a produced semiconductor device so as to improve the product reliability of the device. An adhesive composition, for producing a semiconductor device, which contains at least an additive for capturing a cation.
    Type: Application
    Filed: February 1, 2011
    Publication date: August 4, 2011
    Inventors: Yuta KIMURA, Yasushi INOUE, Takeshi MATSUMURA, Kenji OONISHI, Yuichiro SHISHIDO
  • DECORATIVE COLORED PARTICLE DISPERSION FOR USE IN SURFACE COATING COMPOSITIONS AND METHOD FOR MAKING SAME
    Publication number: 20110189391
    Abstract: The present disclosure generally relates to various composite slurries for use in seamless surface coverings and various methods for making the same. In particular, the present disclosure teaches various composite slurry compositions comprising, for example, a clear hardening material, a plurality of particles, a stabilizing filler, and an aggregate. Additionally, the present disclosure teaches various methods of forming composite slurry compositions for use in seamless surface coverings.
    Type: Application
    Filed: January 27, 2011
    Publication date: August 4, 2011
    Applicant: CHIPS UNLIMITED, INC.
    Inventors: Michael Matt, Luis Hernandez, Darrell Sharon
  • EPOXY RESIN COMPOSITION
    Publication number: 20110184092
    Abstract: Curable epoxy resin composition, which is suitable for the production of electrical insulation systems for low, medium and high voltage applications, including at least an epoxy resin, a hardener, a mineral filler material, and optionally further additives, wherein (i) the epoxy resin component is a diglycidylether of bisphenol A (DGEBA); (ii) the hardener includes methyltetrahydrophthalic anhydride (MTHPA) and polypropylene glycol (PPG), wherein (iii) the average molecular weight of the polypropylene glycol (PPG) is within the range of about 300 to about 510 Dalton; and (iv) the molar ratio of methyltetrahydrophthalic anhydride (MTHPA) to polypropylene glycol (PPG) is within the range of about 9:1 to 19:1. A method of making the epoxy resin composition and electrical articles made therefrom are also provided.
    Type: Application
    Filed: March 18, 2011
    Publication date: July 28, 2011
    Applicant: ABB RESEARCH LTD
    Inventors: Stéphane SCHAAL, Cherif Ghoul, Patricia Gonzalez
  • Particle-stabilised emulsions
    Publication number: 20110178207
    Abstract: The invention relates to water-in-oil (W/O) or oil-in-water (O/W) emulsions containing an oil phase of at least one water-insoluble constituent; an aqueous phase; pyrogenic silica at the oil-water interface, the pyrogenic silica partially silylated such that non-silylated surface silanol groups remaining are between 95% and 5% of initial silanol groups, the equivalent of 1.7 to 0.1 surface SiOH groups per nm2, a surface energy gamma-s-D of 30 to 80 mJ/m2, and a specific BET surface area between 30 and 500 m2/g; and optionally other substances, such as pigments or preservatives. The inventive emulsions have a mean particle size of the dispersed phase, of between 0.5 ?m and 500 ?m, and are of low viscosity.
    Type: Application
    Filed: February 28, 2011
    Publication date: July 21, 2011
    Applicant: Wacker Chemie AG
    Inventors: Torsten Gottschalk-Gaudig, Herbert Barthel, Bernard Paul Binks, Tommy S. Horozov
  • Sealant for electronics of epoxy resin, aromatic amine, accelerator and inorganic filler
    Patent number: 7981977
    Abstract: The invention relates to a liquid resin composition for electronic components which is used in sealing of electronic components, comprising a liquid epoxy resin, a curing agent containing a liquid aromatic amine, and an inorganic filler, and further comprising at least one member selected from a hardening accelerator, silicone polymer particles, and a nonionic surfactant. There is thereby provided a liquid resin composition for electronic components, which is excellent in fluidity in narrow gaps, is free of void generation, is excellent in adhesiveness and low-stress characteristic and is excellent in fillet formation, as well as an electronic component device having high reliability (moisture resistance, thermal shock resistance), which is sealed therewith.
    Type: Grant
    Filed: December 8, 2006
    Date of Patent: July 19, 2011
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Kazuyoshi Tendou, Satoru Tsuchida, Shinsuke Hagiwara
  • ELECTRONIC PACKAGING
    Publication number: 20110163461
    Abstract: Provided is an epoxy resin composition comprising: (A) an epoxy compound represented by the general formula (1): wherein R1 to R9 represent each independently a hydrogen atom, an acyclic or cyclic alkyl group having 1 to 6 carbon atoms, a substituted or unsubstituted phenyl group or a halogen atom, (B) a polyfunctional epoxy compound having a functional group number of two or more, and (C) an epoxy curing agent containing a phenolic hydroxyl group, wherein the proportion of the epoxy compound (A) is from 1 to 99% by weight based on the total weight of the epoxy compounds (A) and (B), whereas the epoxy resin composition contains a pyrogenically produced silica, which has been surface modified with Hexamethyldisilazane (HMDS) and structurally modified by a ball mill.
    Type: Application
    Filed: April 14, 2009
    Publication date: July 7, 2011
    Applicant: EVONIK DEGUSSA GMBH
    Inventors: Ruediger Nowak, Thomas Schlosser, Reiner Wartusch
  • POLYMERIC COMPOSITE INCLUDING NANOPARTICLE FILLER
    Publication number: 20110160345
    Abstract: Disclosed is a novel polymeric composite including a nanoparticle filler and method for the production thereof. More particularly, the present invention provides a novel halloysite nanoparticle filler which has the generally cylindrical or tubular (e.g. rolled scroll-like shape), in which the mean outer diameter of the filler particle is typically less than about 500 nm. The filler is effectively employed in a polymer composite in which the advantages of the tubular nanoparticle filler are provided (e.g., reinforcement, flame retardant, chemical agent elution, etc.) with improved or equivalent mechanical performance of the composite (e.g., strength and ductility).
    Type: Application
    Filed: January 10, 2011
    Publication date: June 30, 2011
    Applicant: NaturalNano, Inc.
    Inventors: Sarah M. Cooper, Cathy Fleischer, Michael Duffy, Aaron Wagner
  • ATTACH FILM COMPOSITION FOR SEMICONDUCTOR ASSEMBLY AND ATTACH FILM USING THE SAME
    Publication number: 20110159294
    Abstract: An attach film composition for semiconductor assembly includes a polymer binder, an epoxy resin, a phenolic epoxy curing agent, a curing accelerator, a silane coupling agent, and an inorganic filler. The attach film composition may have an exothermic peak start temperature of about 300° C. or more in curing, and a melt viscosity of about 1.0×105 to about 5.0×106 Poise at 175° C. after curing at 150° C. for 1 hour and a melt viscosity of about 1.0×105 to about 5.0×106 Poise at 175° C. after curing at 175° C. for 2 hours.
    Type: Application
    Filed: December 29, 2010
    Publication date: June 30, 2011
    Inventors: Gyu Seok Song, Jong Pil Ho, Jae Won Choi, Su Mi Im, Ki Tae Song
  • Dicing tape laminated with adhesive sheet of polymer, epoxy resin and filler
    Patent number: 7968195
    Abstract: The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.
    Type: Grant
    Filed: July 17, 2008
    Date of Patent: June 28, 2011
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Teiichi Inada, Michio Mashino, Michio Uruno
  • Semiconductor device encapsulated with resin composition
    Patent number: 7969027
    Abstract: A semiconductor device comprising an organic substrate, at least one semiconductor chip provided on a surface of the substrate, and a cured resin composition encapsulating the semiconductor chip provided on the surface of the substrate, characterized in that an absolute value of a distance between an imaginary line connecting two diagonally opposite corners of the substrate and a highest or lowest position on the surface of the substrate between the corners is smaller than 600 ?m, as measured with a laser three-dimensional measuring instrument, a total volume ratio of the semiconductor chip to the semiconductor device ranges from 18 to 50%, and the cured resin composition comprises an inorganic filler (C) in such an amount that a weight ratio of the inorganic filler (C) to a total weight of the cured resin composition ranges from 80 to 90%.
    Type: Grant
    Filed: May 30, 2007
    Date of Patent: June 28, 2011
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventor: Shoichi Osada
  • Dicing tape laminated with adhesive sheet of polymer, thermosetting resin and filler
    Patent number: 7968194
    Abstract: The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.
    Type: Grant
    Filed: July 17, 2008
    Date of Patent: June 28, 2011
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Teiichi Inada, Michio Mashino, Michio Uruno
  • EPOXY RESIN COMPOUND, PREPARATION METHOD THEREOF, PREPREG MADE THEREFROM, AND COPPER CLADDED LAMINATE MADE THEREFROM
    Publication number: 20110143618
    Abstract: The present invention relates to an epoxy resin compound, a preparation method thereof, a prepreg made therefrom, and a copper cladded laminate made therefrom. The epoxy resin compound comprises: 30-80 parts by weight of epoxy resin; 20-50 parts by weight of polyphenylene ether resin of new structure with the number average molecular weight thereof being 1000-5000, which is prepared via the redistribution reaction of polyphenylene ether and phenolic resin with the existing of initiator agent; 0-50 parts by weight of filler; 1-20 parts by weight of ingredient. The epoxy resin compound of the present invention, has good heat resistance and dielectric property, and has a simple preparation process, which is good for batch production.
    Type: Application
    Filed: June 22, 2010
    Publication date: June 16, 2011
    Applicant: GUANGDONG SHENGYI SCI.TECH CO., LTD.
    Inventors: DONG WEI, Ke Hong Fang
  • Fibre-Reinforced Plastic Material
    Publication number: 20110129349
    Abstract: A fibre-reinforced plastic material with a matrix material and fibres embedded in the matrix material is provided. Fibre spacers are embedded in the matrix material between the fibres to avoid direct fibre-to-fibre contacts.
    Type: Application
    Filed: December 1, 2010
    Publication date: June 2, 2011
    Inventors: Erik Grove-Nielsen, Martin Winther-Jensen
  • FIBER REINFORCED POLYMERS, EPOXY-BASED POLYMERIC COMPOSITIONS AND USE THEREOF
    Publication number: 20110112222
    Abstract: A composition including an epoxy resin having at least a difunctional epoxy resin and at least one cross-linking agent for epoxy resin. The difunctional epoxy resin has a viscosity of from 1000 to 5000 mPa·s. The composition may include a low viscosity diluent for modulating the composition viscosity in an amount not higher than 10% by weight.
    Type: Application
    Filed: November 10, 2010
    Publication date: May 12, 2011
    Inventors: Giuseppina Barra, Marino Lavorgna, Giuseppe Mensitieri, Filomena Piscitelli
  • DIELECTRIC MATERIAL WITH NON-HALOGENATED CURING AGENT
    Publication number: 20110108309
    Abstract: Provided is a dielectric material having a non-halogenated diaminodiphenylsulfone curing agent.
    Type: Application
    Filed: October 21, 2010
    Publication date: May 12, 2011
    Inventor: Joel S. Peiffer
  • VARNISH, PREPREG, AND SUBSTRATE THEREOF
    Publication number: 20110097587
    Abstract: A halogen-free varnish includes (A) resin, (B) curing agent, (C) flame inhibitor (flame-retarding agent), (D) accelerator and (E) additives. Resin of (A) has novolac epoxy resin, DOPO-CNE and DOPO-HQ-CNE. Curing agent of (B) includes Benzoxazine resin and phenol novolac resin. Glass fabric cloth is dipped into the halogen-free varnish so as to form a prepreg with better thermal stability, anti-flammability, low absorbent ability and higher curing rate. Furthermore, the prepreg has more toughness.
    Type: Application
    Filed: October 25, 2009
    Publication date: April 28, 2011
    Applicant: ITEQ CORPORATION
    Inventor: Li-Chun Chen
  • STRUCTURAL ADHESIVES
    Publication number: 20110098382
    Abstract: An adhesive formulation comprising i) an adduct of an epoxy resin and an elastomer, ii) a phenoxy resin; a core/shell polymer; iv) a curing agent which provides a structural adhesive with improved low temperature impact strength particularly useful for bonding metal especially in the automotive industry.
    Type: Application
    Filed: April 7, 2009
    Publication date: April 28, 2011
    Applicant: ZEPHYROS INC
    Inventor: Michael Czaplicki
  • THERMOSETTING EPOXY COMPOSITION WITH LOW EXPANSIBILITY
    Publication number: 20110082239
    Abstract: A thermosetting epoxy composition contains a modified silicon dioxide and is suitable for use in preparing an epoxy laminate having a low coefficient of thermal expansion and good drilling workability, which modified silicon dioxide contains no crystal water, has low expansibility, and contains 40% to 80% by weight of silicon dioxide and 60% to 20% by weight of an inorganic additive, and the modified silicon dioxide is obtained by a high-temperature (above 1000° C.) sintering process followed by a crushing process.
    Type: Application
    Filed: September 29, 2010
    Publication date: April 7, 2011
    Applicant: NAN YA PLASTICS CORPORATION
    Inventor: Ming-Jen TZOU
  • Resin Composition for Pre-Coated Steel Sheet and Steel Sheet Having Excellent Processibility, Heat Resistance and Corrosion Resistance Properties
    Publication number: 20110076488
    Abstract: A resin composition for a pre-coated steel sheet having good processibility, heat resistance, and corrosion resistance, and a pre-coated steel sheet fabricated by using the resin composition are disclosed. The resin composition includes a 10 to 40 parts by weight of a hardener comprising end-capped blocked polyisocyanate and a melamine resin by 2:1 to 3:1 by parts by weight and 0. 1 to 10 parts by weight of organized layered nano-clay, based on a 100 parts by weight of a base resin. The pre-coated steel sheet obtained by the method exhibits good processibility, heat resistance, and corrosion resistance.
    Type: Application
    Filed: May 14, 2009
    Publication date: March 31, 2011
    Applicant: POSCO
    Inventors: Jae-Soon Lee, Jae-Dong Cho, Jae-Ryung Lee, Yong-Kyun Cho
  • PHOTO-CURING TYPE ADHESIVE, OPTICAL PICKUP UNIT AND MANUFACTURING METHOD THEREOF
    Publication number: 20110051588
    Abstract: An adhesive agent, which contains a light starting agent and is cured by light, is added with fillers in which the difference in refractive indices between the adhesive agent and the fillers is not larger than ±0.02. Even if the adhesive agent is added with functional fillers, this addition method allows the suppression of a lowering in the light penetrability of the adhesive agent. As a result, it becomes possible to suppress the uncuring and shrinkage of the photo-curing type adhesive agent and to perform the bonding of components with high accuracy.
    Type: Application
    Filed: April 22, 2010
    Publication date: March 3, 2011
    Inventors: Masayuki Okamura, Seiichi Kato
  • Epoxy resin composition for encapsulating semiconductor devices and semiconductor devices encapsulated therewith
    Patent number: 7898094
    Abstract: An epoxy resin composition comprising: (A) an epoxy resin having at least three epoxy groups per molecule and an epoxy equivalent of 170 or lower; (B) an epoxy resin having a phenolic nucleus and two epoxy groups in such an amount that a weight ratio of the epoxy resin (B) to the epoxy resin (A) ranges from 35/65 to 65/35; (C) a phenolic curing agent in such an amount that a molar ratio of phenolic hydroxyl groups to the whole epoxy groups in the composition ranges from 0.5 to 1.5; and (D) an inorganic filler in an amount of from 86 to 92 wt %, based on a total weight of the composition. The composition provides encapsulated semiconductor devices much less warped than those encapsulated with a conventional composition.
    Type: Grant
    Filed: January 30, 2007
    Date of Patent: March 1, 2011
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Shoichi Osada, Takayuki Aoki
  • Epoxy resin and 4,4?-diaminobenzanilide powder
    Patent number: 7897703
    Abstract: Epoxy resin compositions that include an epoxy resin component and a curative powder comprising particles of 4,4?-diaminobenzanilide (DABA) wherein the size of the DABA particles is less than 100 microns and wherein the median particle size is below 20 microns.
    Type: Grant
    Filed: May 20, 2009
    Date of Patent: March 1, 2011
    Assignee: Hexcel Corporation
    Inventor: Yen-Seine Wang
  • Self-Filleting Die Attach Paste
    Publication number: 20110046268
    Abstract: A composition that will automatically flow (auto-flow) and form a fillet (self-fillet) will have a yield stress within the range of 1.8 Pa to 10 Pa (20 dynes/cm2 to 100 dynes/cm2). Such a composition can be designed by using an appropriate choice of filler, regardless of the resin system used in the composition.
    Type: Application
    Filed: August 23, 2010
    Publication date: February 24, 2011
    Inventor: Minghai Wang
  • SURFACE MODIFIED SILICON DIOXIDE PARTICLES
    Publication number: 20110039983
    Abstract: Surface-modified silicon dioxide particles or silica sol preparable by reacting aqueous silica sol with at least one first modifier comprising at least one alkoxysilane and with at least one second modifier selected from the group consisting of halosilane, siloxane, and mixtures thereof, with water being removed before the reaction with the first or second modifier.
    Type: Application
    Filed: April 20, 2009
    Publication date: February 17, 2011
    Applicant: nanoresins AG
    Inventor: Uwe Dietrich Kuehner
  • Barrier sealant of phenylene oxetane and cationic initiator
    Patent number: 7887716
    Abstract: This invention relates to cationically curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition consists essentially of an electrophoretic device containing an oxetane compound and a photoinitiating system comprising and photoinitiator and optionally a photosensitizer.
    Type: Grant
    Filed: July 25, 2008
    Date of Patent: February 15, 2011
    Assignee: Henkel AG & Co. KGaA
    Inventors: Shengqian Kong, Stijn Gillissen
  • Epoxy/modified silicon dioxide corrosion resistant nanocomposite material and preparation method thereof
    Patent number: 7884176
    Abstract: An epoxy/modified silicon dioxide corrosion resistant nanocomposite material and a preparation method thereof are disclosed. The method includes the steps of: dispersing TS(TEOS-SiO2) or APTES/TEOS-SiO2 (TAS) in solvent so as to form TS solution or TAS solution; adding triphenylolmethane triglycidyl ether and 1,4-butanediol diglycidyl ether into the TS solution or TAS solution to produce glycidyl ether/TS solution or glycidyl ether/TAS solution. Add a curing agent into the glycidyl ether/TS solution or glycidyl ether/TAS solution to generate epoxy/TS solution or epoxy/TAS solution. After curing, obtain epoxy/modified silicon dioxide nanocomposite corrosion resistant material. The material is applied to optoelectronics or other fields for corrosion prevention.
    Type: Grant
    Filed: October 5, 2007
    Date of Patent: February 8, 2011
    Assignee: Chung Shan Institute of Science and Technology, Armaments Bureau, M.N.D.
    Inventors: Cheng-Chien Yang, Jui-Ming Yeh, Wang Tsae Gu, Chin Yeh Chen, Kung-Chin Chang
  • COATING FOR ELASTOMERIC SUBSTRATES
    Publication number: 20110027574
    Abstract: A coating for elastomers is provided comprising, a rubber modified epoxy resin, an epoxy reactive diluent, and an epoxy curative. The epoxy resin is modified with a carboxyl terminated butadiene acrylonitrile rubber, and the coating is capable of co-extrusion with an elastomeric substrate, such as a weatherstrip.
    Type: Application
    Filed: March 26, 2009
    Publication date: February 3, 2011
    Applicant: LORD CORPORATION
    Inventor: Patrick A. Warren
  • EPOXY RESIN COMPOSITION, RESIN SHEET, PREPREG, MULTILAYER PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE
    Publication number: 20110007489
    Abstract: An object of the present invention is to provide an epoxy resin composition that provides, when used for an insulation layer of a multilayer printed wiring board, a multilayer printed wiring board which is excellent in plating adhesion, heat resistance and moisture resistance reliability and capable of forming fine wiring. Another object of the present invention is to provide a resin sheet, a prepreg, a method for producing a multilayer printed wiring board, a multilayer printed wiring board and a semiconductor device. These objects are achieved by an epoxy resin composition comprising (A) an epoxy resin, (B) a phenoxy resin having a specific bisphenol acetophenone structure and (C) a curing agent, wherein the content of the phenoxy resin (B) is 10 to 30% by weight of the total solid content of the resin composition.
    Type: Application
    Filed: March 24, 2009
    Publication date: January 13, 2011
    Applicant: SUMITOMO BAKELITE COMPANY, LTD
    Inventors: Noriyuki Ohigashi, Michio Kimura, Haruo Murakami
  • Liquid crystalline epoxy nanicomposite material and application thereof
    Publication number: 20110009521
    Abstract: The invention provides an epoxy nanocomposite material for dental therapy, which can be applied to direct or indirect clinical restoration, dental core-post system, and dental brace etc. The epoxy nanocomposite filling material provided by the invention can be polymerized with various curing agents to form the polymer with low shrinkage.
    Type: Application
    Filed: February 5, 2010
    Publication date: January 13, 2011
    Applicant: National Taiwan University
    Inventors: Wei-Fang Su, Sheng-Hao Hsu, Yun-Yuan Tai, Min-Huey Chen
  • ROPE FOR A HOISTING DEVICE, ELEVATOR AND USE
    Publication number: 20110000746
    Abstract: A hoisting device rope has a width larger than a thickness thereof in a transverse direction of the rope. The rope includes a load-bearing part made of a composite material, said composite material comprising non-metallic reinforcing fibers, which include carbon fiber or glass fiber, in a polymer matrix. An elevator includes a drive sheave, an elevator car and a rope system for moving the elevator car by means of the drive sheave. The rope system includes at least one rope that has a width that is larger than a thickness thereof in a transverse direction of the rope. The rope includes a load-bearing part made of a composite material. The composite material includes reinforcing fibers in a polymer matrix.
    Type: Application
    Filed: July 16, 2010
    Publication date: January 6, 2011
    Applicant: KONE Corporation
    Inventors: Raimo Pelto-Huikko, Petteri Valjus, Juha Honkanen, Kim Sjödahl
  • Thermosetting epoxy resin composition
    Patent number: 7851520
    Abstract: The thermosetting epoxy resin composition of the present invention includes an aluminum chelate/silanol curing catalyst system, an epoxy resin, and an anion-trapping agent. The anion-trapping agent is preferably an aromatic phenol derivative or an acid anhydride. Examples include bisphenol S, bisphenol A, bisphenol F, and 4,4?-dihydroxyphenol ether, and acetic anhydride, propionic anhydride, maleic anhydride and phthalic anhydride. The aluminum chelate/silanol curing catalyst system is composed of an aluminum chelator and a silane-coupling agent. The aluminum chelator is preferably a latent aluminum chelate curing agent carried by a porous resin obtained through interfacial polymerization of a polyfunctional isocyanate compound.
    Type: Grant
    Filed: July 10, 2006
    Date of Patent: December 14, 2010
    Assignees: Sony Corporation, Sony Chemical & Information Device Corporation
    Inventor: Kazunobu Kamiya
  • Sealant epoxy-resin molding material, and electronic component device
    Patent number: 7846998
    Abstract: Disclosed is an encapsulation epoxy resin material containing an epoxy resin (A) and a curing agent (B). The epoxy resin (A) contains a compound represented by the general formula (I) below. The encapsulation epoxy resin material has excellent reliability in flame retardance, formability, reflow resistance, moisture resistance, high-temperature shelf characteristics and the like, and is suitably used for encapsulation of a VLSI. Also disclosed is an electronic component comprising an element encapsulated with such a material.
    Type: Grant
    Filed: March 3, 2005
    Date of Patent: December 7, 2010
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Seiichi Akagi, Mitsuo Katayose, Takatoshi Ikeuchi, Yoshinori Endou, Ryouichi Ikezawa
  • POWDER COATING COMPOSITIONS HAVING A SUBSTANTIALLY NON-ZINC CONTAINING PRIMER
    Publication number: 20100297422
    Abstract: Corrosion and chip-resistant coatings for high tensile steel components, such as automotive coil springs, are formed from a coating composition comprising a substantially non-zinc containing primer and a topcoat. The primer includes an epoxy resin having an epoxy equivalent weight of about 860 to about 930, a polyhydroxyl functional phenolic curing agent having a hydroxyl equivalent weight of about 200 to about 500, and a filler material. The topcoat includes an epoxy resin having an epoxy equivalent weight of about 520 to about 930, an elastomer-modified epoxy resin having an epoxy equivalent weight of about 1000 to about 1600, a carboxyl functional polyester with an acid number of about 45 to about 75 mg KOH/g, a foaming agent and a reinforcing fiber.
    Type: Application
    Filed: January 23, 2009
    Publication date: November 25, 2010
    Applicant: Akzo Nobel Coatings International B.V.
    Inventor: Chad Lucas
  • SILICA AND ALSO EPOXY RESINS
    Publication number: 20100286311
    Abstract: Fumed silicon dioxide powder in the form of aggregated primary particles having a BET surface area of 175±15 m2/g and a thickening effect, based on the BET surface area, of greater than 18 mPas g/m2 is hydrophobicized with polydimethylsiloxane. This hydrophobic fumed silica has a BET surface area of 110±25 m2/g. It can be used in epoxy resins. These epoxy resins in turn can be used as adhesives.
    Type: Application
    Filed: February 10, 2009
    Publication date: November 11, 2010
    Applicant: EVONIK DEGUSSA GmbH
    Inventors: Juergen Meyer, Mario Scholz, Pia Buckel, Andreas Hille
  • Filled epoxy compositions
    Patent number: 7829188
    Abstract: Epoxy compositions exhibiting low viscosity in the uncured state and low coefficient of thermal expansion in the cured state are provided. Also provided are processes for making the epoxy compositions. The low dielectric constant compositions are well-suited for use in multi-layer printed circuit boards. The desired properties are achieved by employment of a bimodal distribution of nano-scale fillers in the epoxy compositions.
    Type: Grant
    Filed: April 3, 2007
    Date of Patent: November 9, 2010
    Assignee: E.I. du Pont de Nemours and Company
    Inventors: Pui-Yan Lin, Govindasamy Paramasivam Rajendran, George Elias Zahr
  • Epoxy resin composition for encapsulating semiconductor device and semiconductor device using the same
    Publication number: 20100270664
    Abstract: An epoxy resin composition for encapsulating a semiconductor device, the epoxy resin composition including an epoxy resin, a curing agent, and one or more inorganic fillers, the one or more inorganic fillers including prismatic cristobalite, the prismatic cristobalite being present in the epoxy resin composition in an amount of about 1 to about 50% by weight, based on the total weight of the epoxy resin composition.
    Type: Application
    Filed: June 29, 2010
    Publication date: October 28, 2010
    Inventors: Young Kyun Lee, Eun Jung Lee, Yoon Kok Park
  • Adhesive exhibiting maximum melt viscosity of 10,000 Pa s at 40 to 80 degrees C
    Patent number: 7820742
    Abstract: Provided is an adhesive composition, which exhibits a melt viscosity at 40 to 80° C. of not more than 10,000 Pa·s, and which after heating for a period of 1 minute to 2 hours at a temperature within a range from 80° C. to (T+50)° C., exhibits a melt viscosity at a temperature of 100° C. to (T+30)° C. that is within a range from 100 to 10,000 Pa·s (wherein, T represents the curing start temperature for the composition). The adhesive composition is capable of forming a cured product that exhibits excellent filling of substrates with finely patterned circuits, excellent lamination performance at low temperatures, a low elastic modulus, and excellent levels of adhesion and heat resistance. The adhesive composition is useful for providing an adhesive film and for producing a semiconductor device.
    Type: Grant
    Filed: February 15, 2007
    Date of Patent: October 26, 2010
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Nobuhiro Ichiroku, Shouhei Kozakai
  • THERMALLY CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF
    Publication number: 20100249279
    Abstract: A thermally curable resin composition includes a linear thermally curable resin and amorphous silica fine particles having pore portions.
    Type: Application
    Filed: March 19, 2010
    Publication date: September 30, 2010
    Applicant: TAIYO INK MFG. CO., LTD.,
    Inventors: Yuta OGAWA, Shinichiro Fukuda, Katsuto Murata
  • COMPOSITE MATERIALS WITH BLEND OF THERMOPLASTIC PARTICLES
    Publication number: 20100239755
    Abstract: Pre-impregnated composite material (prepreg) is provided that can be cured to form composite parts that have high levels of damage tolerance. The matrix resin includes a thermoplastic particle component that is a blend of particles that have a melting point above the curing temperature and particles that have a melting point at or below the curing temperature.
    Type: Application
    Filed: June 2, 2010
    Publication date: September 23, 2010
    Applicants: Hexcel Corporation, Hexcel Composites Ltd.
    Inventors: David Tilbrook, Dana Blair, Maureen Boyle, Paul Mackenzie
  • Composition of biphenyl epoxy resin, phenolbiphenylaralkyl resin and filler
    Patent number: 7799852
    Abstract: An epoxy resin composition which can be used as a semiconductor encapsulating resin and in which the improvement of flame retardancy can be attained by suitably adapting a crosslinked structure itself of a cured article without using any flame retardant material and without particularly highly filling an inorganic filler. The epoxy resin composition includes an epoxy resin (A), a phenolic resin (B), an inorganic filler (C) and a curing accelerator (D), wherein a flexural modulus E (kgf/mm2) at 240±20% C of a cured article obtained by curing the composition is a value satisfying 0.015 W+4.1?E?0.27 W+21.8 in the case of 30?W<60, or a value satisfying 0.30 W?13?E?3.7 W?184 in the case of 60?W?95 wherein W (wt %) is a content of the inorganic filler (C) in the cured article. The cured article of this composition forms a foamed layer during thermal decomposition or at ignition to exert flame retardancy.
    Type: Grant
    Filed: June 30, 2006
    Date of Patent: September 21, 2010
    Assignees: NEC Corporation, Sumitomo Bakelite Company Limited
    Inventors: Yukihiro Kiuchi, Masatoshi Iji, Katsushi Terajima, Isao Katayama, Yasuo Matsui, Ken Oota
  • Composition of epoxy resin, epoxy adduct, urea derivative thixotropic agent and curing agent
    Patent number: 7786214
    Abstract: Disclosed are compositions containing at least one epoxy resin A with on average more than one epoxy group per molecule; at least one epoxy adduct B with on average one epoxy group per molecule; at least one thixotropic agent C, based on a urea derivative in a non-diffusing support material; and at least one curing agent D for epoxy resins, which is activated by an increased temperature. Also disclosed are compositions containing at least one core-shell polymer E and/or filler F and/or reactive diluent G.
    Type: Grant
    Filed: October 30, 2007
    Date of Patent: August 31, 2010
    Assignee: Sika Technology AG
    Inventor: Andreas Kramer
  • TRANSPARENT HYBRID SHEET
    Publication number: 20100216912
    Abstract: There is provided a transparent hybrid sheet having superior transparency and thermal resistance and having smaller linear expansion coefficient and optical anisotropy and higher degree of flatness. In a transparent hybrid sheet obtained by curing a hybrid composition including an epoxy resin composition containing alicyclic epoxy compound and a curing agent and curing a glass filler together, the alicyclic epoxy compound contains, as a principal component thereof, a diepoxybicyclohexyl compound represented by Formula (1) below, with amounts of isomers of the diepoxybicyclohexyl compound being 20% or less, of a sum of the diepoxybicyclohexyl compound and the isomers, in terms of a ratio of its peak area determined by a gas chromatography.
    Type: Application
    Filed: May 8, 2008
    Publication date: August 26, 2010
    Inventor: Wataru Oka
  • Curable Epoxy Resin Composition and Cured Product Thereof
    Publication number: 20100216913
    Abstract: A curable epoxy resin composition comprising: (I) a curable epoxy resin; (II) an epoxy-resin curing agent; and (III) a silicone rubber powder obtained by curing a condensation-curable silicone rubber composition in a dispersed state in water, the powder having an epoxy equivalent measured by titration equal to or lower than 3,000 and an average particle size in the range of 0.1 to 100 ?m, possesses excellent flowability and which, when cured, forms a cured product that in spite of low modulus of elasticity possesses high strength.
    Type: Application
    Filed: August 19, 2008
    Publication date: August 26, 2010
    Inventors: Yoshitsugu Morita, Hiroshi Ueki
  • Adhesive Compositions, Micro-fluid Ejection Devices and Methods for Attaching Mirco-Fluid Ejection Heads
    Publication number: 20100210759
    Abstract: Adhesive compositions, micro-fluid ejection devices, and methods for attaching micro-fluid ejection heads to devices. One such adhesive composition is provided for use in attaching a micro-fluid ejection head to a device, such as to reduce chip bowing and/or to decrease chip fragility upon curing of the adhesive. Such an exemplary composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin selected from the group consisting of epoxy resins, siloxane resins, urethane resins, and functionalized olefin resins; from about 0.1 to about 25.0 percent by weight of at least one thermal curative agent; and from about 0.0 to about 30.0 percent by weight filler, and exhibit a relatively low shear modulus upon curing (e.g., less than about 10.0 MPa at 25° C.).
    Type: Application
    Filed: April 27, 2010
    Publication date: August 19, 2010
    Inventors: David Christopher Graham, Gary Anthony Holt, JR., Jonathan Harold Laurer, Johnny Dale Massie, II, Melissa Marie Waldeck, Sean Terrence Weaver, Rich Wells
  • METHOD FOR MANUFACTURING TRANSPARENT PLASTIC FILM AND TRANSPARENT PLASTIC FILM MANUFACTURED BY THE METHOD
    Publication number: 20100209701
    Abstract: The present invention provides a method for producing a transparent plastic film, which comprises the steps of (a) preparing a glass flake particle; (b) preparing a curable epoxy resin in which a difference between a refractive index after the curable epoxy resin is cured and a refractive index of the glass flake particle is not more than 0.01; (c) mixing the curable epoxy resin and the glass flake particle with each other; and (d) curing a mixture of the curable epoxy resin and the glass flake particle to form an epoxy curing substance that includes the glass flake particle, and a transparent plastic film that is produced by using the same.
    Type: Application
    Filed: June 27, 2008
    Publication date: August 19, 2010
    Applicant: LG CHEM, LTD.
    Inventors: Gi-Cheul Kim, Dong-Ryul Kim, Hee-Jung Kim, Ju-Eun Cha
  • Underfilling with acid-cleavable acetal and ketal epoxy oligomers
    Patent number: 7776993
    Abstract: A reworkable thermoset epoxy-containing material that allows for a reworkable assembly such as a reworkable waferlevel underfilled microelectronic package. A method for using the reworkable thermoset material in the formation of a microelectronic package using this material.
    Type: Grant
    Filed: June 15, 2005
    Date of Patent: August 17, 2010
    Assignee: International Business Machines Corporation
    Inventors: Stephen Leslie Buchwalter, Claudius Feger, Gareth Hougham, Nancy LaBianca, Hosadurga Shobha
  • THERMOSET RESIN FIBRES
    Publication number: 20100203787
    Abstract: The present invention relates to thermoset resin fibre components, composite materials comprising thermoset resin fibre components, composite articles manufactured using such composite materials and methodologies for manufacturing same. The thermoset resin fibre components may comprise a single fibre of thermoset resin or a plurality of fibres commingled together. There properties and characteristics of the thermoset resin used are chosen according to the material to be produced therefrom. The thermoset fibre components may be woven into reinforcement fibres to form prepregs. Thermoplastic fibres may be commingled and co-woven with the thermoset fibre components.
    Type: Application
    Filed: July 10, 2008
    Publication date: August 12, 2010
    Applicant: ADVANCED COMPOSITES GROUP LIMITED
    Inventors: Mark Raymond Steele, Andrew Gibbs, Amy Grace Atkinson
  • POLYSACCHARIDE-BASED IMPREGNATED SOLID MATERIAL WITH IMPROVED STABILITY, PROCESSES FOR THE PREPARATION THEREOF AND IMPREGNATING SOLUTIONS USED
    Publication number: 20100178358
    Abstract: A polysaccharide-based solid material including, in its mass, at least one active agent having bactericidal, fungal, insecticidal and/or flame-retardant properties, and at least one complexing agent and/or at least one polymeric matrix having a complexing agent. The active agent includes at least one compound selected from the group including boron, silica, aluminum, phosphorus, iodine, derivatives thereof, aluminosilicate derivatives, and mixtures thereof. The solid material is characterized by an improved stability and by reduced environmental impact, and makes it possible to prepare materials based on wood particles and woods having a particular resistance against environmental attacks such as moisture.
    Type: Application
    Filed: March 28, 2007
    Publication date: July 15, 2010
    Inventors: Louis Gastonguay, Michel Perrier, Paul-Étienne Harvey, Jean-Francois Labrecque, Michel Robitaille, André Besner