Abstract: This invention is a barrier composition comprising a resin or resin/filler system that is capable of being cured at low temperature while still maintaining superior barrier performance. This composition comprises (a) an aromatic compound having meta-substituted epoxy functionalities; (b) a multifunctional aliphatic amine; (c) optionally, one or more fillers; (d) optionally one or more adhesion promoters; (c) optionally, a phenolic cure accelerator.

Abstract: Water absorption resistant polyimide/epoxy-based compositions, like pastes (or solutions), are particularly useful to make electronic screen-printable materials and electronic components. A group of hydrophobic epoxies (and soluble polyimides) was discovered to be particularly resistant to moisture absorption. The polyimide/epoxy pastes made with these epoxies (and these polyimides) may optionally contain thermal crosslinking agents, adhesion promoting agents, blocked isocyanates, and other inorganic fillers. The polyimide/epoxy pastes of the present invention can have a glass transition temperature greater than 250° C., a water absorption factor of less than 2%, and a positive solubility measurement.

Abstract: The present invention is to provide an epoxy resin composition for encapsulating a semiconductor having a high flame resistance without using a flame retarder and having an excellent solder reflow resistance, and a semiconductor device using the same for encapsulating a semiconductor element. An epoxy resin composition for encapsulating a semiconductor of each of the first, second and third aspects essentially comprises (A) a phenol aralkyl type epoxy resin having a phenylene structure, (B) a phenol aralkyl type phenolic resin having a biphenylene structure and (D) an inorganic filler as common components, wherein (D) the inorganic filler is contained at the rate of 84 wt % or more and 92 wt % or less of the total amount of the epoxy resin composition.

Abstract: Compositions containing at least one liquid epoxy resin, at least one solid epoxy resin, at least one propellant, at least one curing agent and at least one mica-containing filler produce expandable, thermally curable binder systems which may be used without the addition of hollow glass beads for the production of stiffening and reinforcing laminates and for the production of stiffening and reinforcing moldings. Said laminates according to the invention are suitable for the stiffening and reinforcing of components, in particular in the automotive industry, such as car body frames, doors, boot lids, engine bonnets and/or roof parts. In addition, the mouldings that may be produced from said binders are suitable for the stiffening and reinforcing of hollow metal structures, in particular of hollow car body parts such as body frames, body supports and posts or doors in the automotive industry.

Abstract: This invention provides a heat curable resin composition for light reflection, which, after curing, can realize high reflectance in a range of visible light to near ultraviolet light, has excellent heat deterioration resistance and tablet moldability, and is less likely to cause burrs during transfer molding, and a process for producing the resin composition, and an optical semiconductor element mounting substrate and an optical semiconductor device using the resin composition. The heat curable resin composition for light reflection comprises a heat curable component and a white pigment and is characterized in that the length of burrs caused upon transfer molding under conditions of molding temperature 100° C. to 200° C., molding pressure not more than 20 MPa, and molding time 60 to 120 sec is not more than 5 mm and the light reflectance after heat curing at a wavelength of 350 nm to 800 nm is not less than 80%.

Abstract: The invention disclosed a composite permeable brick comprising a permeable surface layer and a permeable base layer. The surface layer and the permeable base layer, which respectively comprise an aggregate and a binder adhering to the aggregate, are closely combined together. The binder in the permeable surface layer at least comprises a hydrophilic binder. The permeable brick according to the invention has a good permeability and is of low cost, because of the compact and permeable surface of the brick. The invention also discloses a mixture for preparing the composite permeable brick, comprising an aggregate and a binder adhering to the aggregate. The binder at least comprises a hydrophilic binder, and the binder/aggregate ratio is from 1:100 to 20:100 by mass.

Abstract: A resin composition for semiconductor encapsulation contains an epoxy resin (A); a phenolic compound (B) containing two or more phenolic hydroxyl groups; an inorganic filler (C); and a curing accelerator (D). The epoxy resin (A) contains an epoxy resin (a1) represented by the formula (1) wherein Ar is a C6-C20 aryl group, R1 is a C1-C6 hydrocarbon group, R2 is a C1-C4 hydrocarbon group, W1 is oxygen or sulfur, RO is a C1-C6 hydrocarbon group, a=0-10, g=0-3, 0<m<1, 0<n<1, m+n=1 and m:n=1:10 to 1:1, and the resin composition has a moisture absorption rate of 0.22 weight % or less when the composition is humidified at 85° C. and 85% R.H.

Abstract: A method for producing random form of nanosilicate platelets comprises mixing and acidifying an exfoliating agent with an inorganic acid to form an acidified exfoliating agent; intercalating layered inorganic silicate clay with the acidified exfoliating agent to form a mixture; and dissolving the mixture in a solvent and reacting it with a hydroxide or chloride of alkali metal or alkaline-earth metal. The hyperbranched polyamines serving as the exfoliating agent are prepared by polymerizing poly(oxypropylene)-triamine and diglycidyl ether of bisphenol-A (DGEBA). Hydrophilic amine groups of the exfoliating agent are acidified and then reacted with the layered inorganic silicate clay through cation exchange reaction and physical clay exfoliation to give random form of nanosilicate platelets.

Abstract: A dielectric paste having low dielectric loss is disclosed. The dielectric paste includes (A) a thermosetting resin; (B) an acid anhydride-based curing agent; (C) high dielectric constant particles; (D) an amine-based catalyst; and (E) a material for forming a salt with the amine-based catalyst (D). In the dielectric paste, the material (E) for forming a salt with the amine-based catalyst (D) is used so that the catalyst may be introduced in the form of a salt thus preventing the catalyst from binding with the high dielectric constant particles, thereby prohibiting the poisoning of the catalyst.

Abstract: Provided are a resin composition whose storability is not reduced, a prepreg which uses the resin composition and which is uniformly colored, a laminated board, a multilayer printed wiring board having excellent results in reliability tests such as a thermal shock test and the like, and a semiconductor device. The resin composition is a resin composition for a multilayer printed wiring board, comprising (A) a novolac type epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a colorant, wherein the exothermic peak temperature of the resin composition, as measured by DSC, is within ±5° C. of the exothermic peak temperature of a resin composition composed of (A) a novolac type epoxy resin, (B) a curing agent, and (C) an inorganic filler.

Abstract: An epoxy resin composition for semiconductor encapsulation includes at least one epoxy resin, at least one curing agent, at least one filler, and at least one first curing accelerator, the first curing accelerator having a tetracyanoethylene, a 7,7,8,8-tetracyanoquinodimethane, a compound having the chemical structure of Formula 1, or a mixture thereof, wherein each of R1 through R7, independently, represents a hydrogen atom or a C1-C12 hydrocarbon group, provided that when R1 through R7 are C1-C12 hydrocarbon groups, R1 and R2, R2 and R3, R3 and R4, R4 and R5, R5 and R6, and R6 and R7 can be joined to each other to form a cyclic structure.

Abstract: The invention relates to a curing accelerator for a curing resin obtained by reacting a phosphine compound (a) with a compound (b) having at least one halogen atom substituted on an aromatic ring and at least one proton atom which can be discharged, and subjecting the reaction product to dehydrohalogenation, a curing resin composition containing the curing accelerator, and an electronic component device having a device component encapsulated with the curing resin composition. The curing accelerator exhibits superior curability under moisture absorption, flow properties, reflow cracking resistance and high-temperature storage characteristics.

Abstract: A resin composition excellent in heat resistance after moisture absorption, lead-free solder reflow properties, dimensional stability and electrical characteristics for high-multilayer and high-frequency-capable printed wiring boards, which composition comprises a bisphenol A type epoxy resin (a) having at least two epoxy groups per molecule and a secondary hydroxyl group amount of 0.4 meq/g or less, a novolak type epoxy resin (b) at least two epoxy groups per molecule, a cyanate ester resin (c) having at least two cyanate groups per molecule and spherical silica having an average particle diameter of 4 ?m or less, wherein the equivalent ratio of cyanate groups/epoxy groups in the resin composition is in the range of 0.7 to 1.45, and a prepreg and a metal-foil-clad laminate each of which comprises the resin composition.

Abstract: A curable epoxy resin composition is provided. The composition includes at least one diglycidyl ether of bisphenol A (DGEBA) and at least one diglycidyl ether of bisphenol F (DGEBF) as epoxy resins, in which the weight ratio of DGEBA:DGEBF is within the range of about 15:85 to 45:55; (ii) an anhydride hardener; (iii) and at least one plasticizer. The composition can additionally include a catalyst, at least one filler material and/or further additives. The dynamic complex viscosity value (?*) of the composition is within the range of 0.1 to 20 Pa·s. The present disclosure also provides a process for making the composition and electrical articles including an electrical insulation system made from the composition.

Abstract: A transparent composite sheet that has a small linear expansion coefficient, excellent transparency/heat resistance, minimal optical anisotropy, and a high degree of flatness, and that also has excellent impact resistance and flexibility; and a substrate for a display element. A transparent composite sheet obtained by curing a composite composition comprising a glass filler and a transparent resin composition that includes an alicyclic epoxy resin indicated by Chemical Formula (1) below and/or an alicyclic epoxy resin indicated by Chemical Formula (2) below; at least one type of compound other than the alicyclic epoxy resin having a cationic-polymerizable functional group; and a curing agent; wherein the admixture ratio of the alicyclic epoxy resin and the compound having a cationic-polymerizable functional group is preferably 99:1 to 70:30.

Abstract: Expandable sealant and baffle compositions and methods of forming and using such compositions are provided wherein the compositions comprise a first thermoplastic resin, an epoxy resin, preferably a second thermoplastic resin different from the first thermoplastic resin, and optionally a compound selected from the group consisting of pigments, blowing agents, catalysts, curing agents, reinforcers, and mixtures thereof. The resulting compositions are formed as self-sustaining bodies which can be heat-expanded into a lightweight, high strength product for sealing hollow structural members of vehicles, substantially decreasing the noise which travels along the length of those members as well as strengthening those members with minimal increases in their weights. In a preferred embodiment, the first thermoplastic resin is an SBS block co-polymer, the epoxy resin is a bisphenol A-based liquid epoxy resin, the second thermoplastic resin is a polystyrene, and the reinforcer is hydrated amorphous silica.

Abstract: The object of the present invention is to provide an epoxy resin composition which is excellent in flash characteristics and thermal conductivity, and gives an area mounting type semiconductor apparatus having little warpage and excellent temperature cycle properties. According to the present invention, there is provided an epoxy resin composition for semiconductor encapsulation which comprises, as essential components, (A) a spherical alumina, (B) an ultrafine silica having a specific surface area of 120-280 m2/g, (C) a silicone compound, (D) an epoxy resin, (E) a phenolic resin as a curing agent, and (F) a curing accelerator, in which said ultrafine silica is contained in an amount of 0.2-0.8% by weight based on the total weight of the resin composition, and said silicone compound is a polyorganosiloxane and is contained in an amount of 0.3-2.0% by weight based on the total weight of the resin composition.

Abstract: A solid surface material suitable for use as a countertop contains a resin and a filler which includes clean dry glass powder produced from unsorted post-consumer waste glass, including a substantial fraction of non-glass items. The powdered glass is used as at least a portion of the filler and/or gelling agent in lieu of or in addition to other fillers and gelling agents known in the art.

Abstract: A resin coated metal plate having excellent formability comprises, on a metal plate, a resin coating layer containing a conductive filler and a corrosion inhibitor, a matrix resin constituting the resin coating layer is made mainly of a flexible epoxy resin and has a modulus of elasticity of not less than 3 GPa. When secondarily cured, the resin coated metal plate is imparted with excellent weldability and corrosion resistance.

Abstract: There is provided an epoxy resin composition for semiconductor encapsulating use comprising: an epoxy resin (A); a phenol resin (B); a curing accelerator (C); and an inorganic filler (D), wherein the inorganic filler (D) contains a spherical fused silica (d1) which contains: metal or semimetal other than silicon; and/or an inorganic compound comprising the metal or semimetal other than silicon.

Abstract: There is provided an epoxy resin composition for encapsulating a semiconductor essentially comprising (A) a phenolaralkyl type epoxy resin having a phenylene structure, (B) a phenolaralkyl resin having a biphenylene structure, (C) a curing accelerator containing an adduct of a phosphine compound and a quinone compound, (D) a compound in which hydroxyl groups are attached to each of two or more adjacent carbon atoms of an aromatic ring, (E) a silane coupling agent and (F) an inorganic filler, wherein the inorganic filler (F) is contained in 84 wt % to 92 wt % both inclusive in the total amount of the epoxy resin composition.

Abstract: An intumescent coating in the form of an initially liquid coating which cures to a solid and adheres to a substrate. The coating includes a flexible thermosetting epoxy, such as diglycidyl ether of bisphenol-A (DGEBA), with an aliphatic amine curing agent, expandable graphite flakes with reagent chemicals that react upon heating and decompose into gaseous products, and fumed silica. In the presence of heat or flame, an intumescent layer develops at the coating surface, insulating the substrate. The coating is found to add intumescent characteristics which provide heat resistant and fire retardant qualities.

Abstract: A resin composition is provided that makes it possible to prevent low-heat resistant components from being damaged when heated in a process of mounting electronic components on a circuit board. There are also provided a method for easily repairing circuit boards that are determined to be off-specification products in the mounting process, and a method for separating and recovering useful circuit boards and/or electronic components from the circuit boards that are determined to be off-specification products in the mounting process. The resin composition comprises (A) 100 parts by weight of an epoxy resin, (B) 30 to 200 parts by weight of a thiol-based curing agent, (C) 5 to 200 parts by weight of an organic-inorganic composite insulating filler and (D) 0.5 to 20 parts by weight of an imidazole-based curing accelerator.

Abstract: The present invention provides a resin composition for sealing a semiconductor device. The resin composition is in liquid state at room temperature, and can be supplied from a dispenser. The composition is advantageous in regard to molding time, viscosity, moldability and adhesion. This resin composition indispensably comprises a bisphenol type epoxy resin having a polymerization degree of 3 or less, a particular phenol resin or a particular acid anhydride, a catalyst (A) such as 1-cyanoethyl-2-undecylimidazolium trimellitate, a catalyst (B) such as 1-cyanoethyl-2-ethyl-4-methylimidazol, and spherical fused silica particles. The weight ratio (A/B) between the catalysts (A) and (B) is in the range of 9/1 to 4/6.

Abstract: A high-solids anticorrosive coating composition which comprises a main ingredient (A) comprising an epoxy resin (a1) and a hardener ingredient (B) comprising an alicyclic amine hardener (b1) and/or a Mannich type hardener (b2), the ingredient (A) and/or the ingredient (B) containing at least either of an additive (a2) selected among epoxidized reactive diluents and modified epoxy resins and a coating film modifier (ab) selected among petroleum resins, xylene resins, coumarone resins, terpene phenol resins and vinyl chloride copolymers. The high-solids anticorrosive coating composition especially of the rapidly curable type is characterized by containing a high-boiling organic solvent having a boiling point exceeding 150° C. and containing substantially no organic solvent having a boiling point of 150° C. or lower.

Abstract: An epoxy resin composition for printed wiring boards which comprises an epoxy resin, a phenolic novolak, a curing accelerator, and a silica filler, characterized in that the silica filler has a shape having at least two planes and has an average particle diameter of 0.3 to 10 ?m and a specific surface area of 8 to 30 m2/g. The epoxy resin composition has a higher apparent viscosity than the resins and can hence be inhibited from sagging in a drying oven. This composition retains the intact property of infiltration into reinforcements because the viscosity of the resins themselves has not increased locally. The composition hence produces the effect of improving the appearance of a prepreg.

Abstract: The invention is a composition comprising applying to a substrate a stream of an adhesive comprising: one or more epoxy resins; one or more rubber modified epoxy resins; one or more toughening compositions comprising the reaction product of one or more isocyanate terminated prepolymers and one or more capping compounds having one or more phenolic, benzyl alcohol, aminophenyl, or, benzylamino groups wherein the reaction product is terminated with the capping compounds; one or more curing agents for epoxy resins and one or more catalysts which initiate cure at a temperature of about 100° C. or greater; and optionally; fillers adhesion promoters, wetting agents or rheological additives useful in epoxy adhesive compositions; wherein the adhesive composition has a viscosity at 45° C. of about 20 Pa·s to about 400 Pa.s. The composition can be used as an adhesive and applied as a stream using a high speed streaming process.

Abstract: An encapsulating epoxy resin molding material comprising (A) an epoxy resin, (B) a curing agent, and (C) a silane coupling agent having a secondary amino group or (D) a phosphate, and semiconductor devices encapsulated therein. The encapsulating epoxy resin molding material for thin semiconductor devices according to this invention is excellent in fluidity, and the semiconductor device encapsulated therein, which is a semiconductor device having a semiconductor chip arranged on a thin, multi-pin, long wire, narrow-pad-pitch, or on a mounted substrate such as organic substrate or organic film, is free of molding defects such as wire sweep, voids etc. as shown in the Examples, and thus its industrial value is significant.

Abstract: An alicyclic diepoxy compound (A) represented by formula (I) is produced in high purity and high yield at low cost, by epoxidizing the corresponding alicyclic diolefin compound with an organic percarboxylic acid. The curable epoxy resin composition has high reactivity for various curing agents, low viscosity, and excellent workability. A cured product thereof shows useful physical properties for uses in coatings, inks, adhesives, sealants, and encapsulants, etc. It is of extremely high quality as an epoxy resin composition for the encapsulation of electronic parts. A stabilizer for an electrical insulating oil (the alicyclic diepoxy compound or an electrical insulting oil containing the compound) is low in acid value, and the stabilizer improves the properties of the insulating oil. A cured product obtained by curing a casting epoxy resin composition for electrical insulation has excellent properties such as high bending strength, high Tg, and low permittivity.

Abstract: One aspect of the current invention is a halogen containing epoxy composition and a method of producing the same. A functional halogen group, fluorine in one case, is incorporated into an epoxy coating by using a functionalized amine curing agent in small amounts. Functionalized amine curing agents are cheaper and easier to produce from small amine precursors when compared to the cost and complexity of functionalizing bulky epoxy resins. Amine curing agents are incorporated into a cured epoxy network. However, many functional groups will affect the reactivity of the curing reaction due to electronegativity effects. By using small amounts of functionalized amines with a large amount of non-functionalized agent, the effect is small and in the case of migration, it can be advantageous for tribological, mechanical and other properties of epoxies and epoxy-containing materials.

Abstract: Multi-component epoxy-amine primer systems are disclosed, which comprise an amine component that comprises a polythioether. Also disclosed are substrates coated with such primer systems as well as methods for coating substrates with such primer systems.

Abstract: A waterproofing membrane composition is provided which is strong, easy to use, trowelable, flexible, passes negative hydrostatic test ASTM D4068 and which can be flood tested after 24 hours @70° F. of application. The waterproofing membrane composition contains a flexible polymer, preferably an epoxy containing polyether chains formed from a glycol, a flexible curing agent, sand, and an aramid fiber. The epoxy component also preferably includes an epoxy flexibilizer and a reactive diluent for epoxy chain termination. A p-aramid fiber is preferred and it is highly preferred to use the polymer fiber in a pulp form which has a fibrillated structure.

Abstract: The present invention relates to a method for producing a flat article comprising a material that contains the products of several reactions. The method comprises the following steps: carrying out a pre-cross-linking of a mixture comprising an epoxydation product of a carboxylic acid ester using at least one cross-linking agent in order to form a mouldable material; moulding the mouldable material in the shape of a flat article; and curing the moulded material in order to produce a flat article, wherein the pre-cross-linking reaction is separate from the curing reaction. This invention also relates to a mouldable material that can be stored and to a flat article that can be obtained from the same.

Abstract: A corrosion resistant, alkali resistant coating composition is disclosed. The composition comprises a binder comprising a reaction product of an epoxy-containing material and a phosphorus-containing material together with a curing agent. Aminoplasts, especially melamine-based aminoplasts, are particularly suitable curing agents. A source of silicon can optionally be included. The compositions also provide excellent adhesion and can be used with or without a weldable primer. The compositions are applied to and cured on a metal substrate.

Abstract: Multi-component epoxy-amine primer systems are disclosed, which include an epoxy component and an amine component that includes a mercaptan terminated material. At least one of the epoxy component and the amine component includes a sulfur-containing polymer. Also disclosed are substrates coated with such primer systems as well as methods for coating substrates with such primer systems.

Abstract: The present invention provides a cationically photocurable epoxy resin composition, which contains (a) an epoxy resin component comprising an alicyclic epoxy resin and an aromatic-ring containing epoxy resin, (b) a cationic photoinitiator component, and (c) a filler selected from oxides, hydroxides and carbonates containing a Group II element. This composition exhibits improved adhesive strength to a glass such as an alkali glass, particularly a sodium-containing glass, or a metal.

Abstract: A cure system including a compatiblized and passivated refectory solid dispersed within a low temperature liquid curing agent is provided. An adhesive system including the cure system is provided, and an associated method. A device including the cured adhesive system is provided.

Abstract: A curing accelerator which is suitable for various curable resin compositions, an epoxy resin composition having excellent curability, storage stability and fluidity, and a semiconductor device having excellent solder cracking resistance and moisture resistance reliability are provided. The epoxy resin composition includes a compound (A) having two or more epoxy groups in one molecule, a compound (B) having two or more phenolic hydroxyl groups in one molecule, trisubstituted phosphoniophenolate or a salt thereof as a curing accelerator (C), and an inorganic filler (D).

Abstract: A casting compound based on a resin which cures by a chemical reaction. The casting compound is suitable for insulation of electric components and contains an epoxy resin component, a silicone-containing component, a filler, and a thermal initiator. This casting compound is processible as a single-component system.

Abstract: A molding composition suitable for encapsulating solid state devices includes an epoxy resin, a hardener, a poly(arylene ether) resin comprising less than 5 weight percent of particles greater than 100 micrometers, and about 70 to about 95 weight percent of a silica filler, based on the total weight of the composition. After curing, the composition exhibits improved increased copper adhesion and reduced shrinkage compared to conventional molding compositions.

Abstract: A cure system including a compatiblized and passivated refectory solid dispersed within a low temperature liquid curing agent is provided. An adhesive system including the cure system is provided, and an associated method. A device including the cured adhesive system is provided.

Abstract: Disclosed are a varnish for laminate or prepreg, comprising a heat treatment product which is obtained by mixing together (a) an epoxy resin, (b) dicyandiamide, and (c) a compound having an imidazole ring so that the component (c) is present in an amount of 0.001 to 0.03% by weight, based on the weight of the component (a), and subjecting the resultant mixture to reaction for heat treatment in an organic solvent at a temperature of 70° C. to less than 140° C. so that all of the components are compatible with one another in the absence of a solvent; and (d) inorganic filler, a laminate or prepreg prepared using the varnish and a printed wiring board prepared using the laminate and/or prepreg.

Abstract: A chemical anchoring adhesive includes a first part having a viscosity of about 200,000 to about 4,000,000 centipoise and a second part having a viscosity of about 200,000 to about 4,000,000 centipoise. The chemical anchoring adhesive can be in the form of a slug or rope. The first and second parts are directly joined along an interface, which may extend the length of the slug or rope. The first part includes a resin and a particulate filler of a type and amount required to achieve the desired viscosity. The second part includes a curing agent and a particulate filler of a type and amount required to achieve the desired viscosity.

Abstract: One of major objects of the invention is to provide an epoxy resin composition and a semiconductor device exhibiting good soldering resistance when being formed on a non-copper frame. Thus, this invention provides an epoxy resin composition for encapsulating a semiconductor comprising (A) an epoxy resin, (B) a phenolic resin, (C) a hardening accelerator, (D) an inorganic filler and (E) a triazole compound, preferably an epoxy resin composition for encapsulating a semiconductor wherein the triazole compound is a compound represented by general formula (1): wherein R1 represents hydrogen atom, or mercapto group, amino group, hydroxyl group or a hydrocarbon chain with 1 to 8 carbon atoms containing one or more of the functional groups as an end group.

Abstract: A method for making a lubricating fast-setting epoxy compound comprising: mixing under vacuum dispersion a first micro-crystalline filler, a first talc, and a titanium oxide into a hardenable epoxide containing liquid forming an epoxy base. A second micro-crystalline filler, a second talc, and a hydrocarbon resin are mixed forming an accelerator mixture. A methylamino accelerator is mixed into the accelerator mixture forming an epoxy accelerator. Substantially equal amounts of the epoxy base and the epoxy accelerator are mixed to form the lubricating fast-setting epoxy compound having a high lubricity and a curing time ranging from two minutes to twelve minutes. Adjusting the mixing speed and temperature of the epoxy base, the accelerator mixture, and the epoxy accelerator is contemplated to promote homogeneity. The epoxy base can also include a flatting agent. The epoxy accelerator can also include a modified aliphatic amine, an acrylic resin, a coloring agent, or combinations thereof.

Abstract: The present invention relates to a flame-retarding thermosetting resin composition, which comprises at least one silicate-copolymerized composite as filler and can be used as mechanical, electrical and electronic parts, molded and/or packaging resin for semiconductor and so on, etc. By adding such silicate-copolymerized composite, the resin composition of the present invention has improved flam retardance and heat resistance and has an excellent moldability and reliance under circumstances without adding any other flame-retarding material.

Abstract: The present invention relates to molding compositions comprising A) from 40 to 99% by weight of at least one epoxy resin, B) from 1 to 60% by weight of at least one polyarylene ether sulfone containing side- or end-groups selected from the group consisting of carboxy groups and anhydride groups, C) from 0 to 60% by weight of at least one polyarylene ether sulfone containing essentially no side- or end-groups selected from the group consisting of carboxy and anhydride groups, D) from 0 to 60% by weight of at least one filler, and E) from 0 to 40% by weight of one or more various additives, where the percentages by weight of components A to E together give 100%, and also to a process for preparing these molding compositions, and to their use, and to moldings obtainable therefrom.

Abstract: An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavelength in the range of 400 to 900 nm, at an encapsulant thickness of about 1 mm. The encapsulant includes a filler consisting essentially of glass particles having diameters smaller than 500 ?m, being essentially free of titania and lead oxide, and having a refractive index in the range of 1.48 to 1.60, with a variance of less than about 0.001.

Abstract: A resin composition usable for encapsulating a semiconductor, comprising (A) an epoxy resin having two or more epoxy groups in one molecule; (B) a curing agent; and (C) inorganic composite oxide particles constituted by silicon dioxide and at least one metal oxide selected from the group consisting of oxides of metal atoms belonging to Group III and Group IV of the Periodic Table excluding silicon; a semiconductor device comprising a wiring circuit board, a semiconductor element, and the above resin composition; and a method for manufacturing a semiconductor device comprising the steps of adhering a resin sheet comprising the resin composition of claim 1 and a stripping sheet to a semiconductor circuit side of a bump-mounting wafer, removing the stripping sheet leaving only the resin composition to the wafer, and cutting the wafer into individual chips.

Abstract: A low viscosity capillary flow underfill composition having improved filler dispersion and cure rate. One embodiment of the composition comprises one or more epoxy resins, such as cycloaliphatic epoxy resins, one or more catalysts, such as super acid catalysts and one or more inert components, which may comprise diluents such as non-electrically conductive fillers. Further embodiments of the invention include compositions further comprising low viscosity non-epoxy reactive diluents, such as vinyl ether, and polyols such as polyester polyols. A further embodiment is a method of assembling an electronic component utilizing the low viscosity underfill composition of the present invention. A still further embodiment is an electronic device or component containing the underfill composition of the present invention.

Abstract: A battery operated hand-held dispenser which operates efficiently at lower power levels than prior art devices. The dispenser as included therein has spray, foam or stream, dispensing capabilities coupled with pump mechanisms, vent mechanisms and positive closures.