Abstract: The invention relates to the use of tripotassium citrate monohydrate and other alkali metal salts of polybasic acid as bench life extenders in heat curable hot box foundry mixtures comprising sand, thermosetting binder resin, and a latent acid catalyst composition. In one embodiment, the thermosetting binder resin is a phenolic resole resin modified with urea formaldehyde resin. In another embodiment, the thermosetting binder resin is a furfuryl alcohol resin modified with urea formaldehyde resin.

Abstract: This invention relates to a semiconductor encapsulating novolac type epoxy resin with the reduced stress, which is obtained by an addition reaction 1 to 15% of a novolac type epoxy resin of the following formula with a monohydric or dihydric aliphatic alcohol: ##STR1## (wherein R.sub.1 is hydrogen, halogen, alkyl, or aryl; R.sub.2 is selected from the group consisting of hydrogen, alkyl, aryl, or aryl having a substituent which may be glycidylether; and n is an integer not less than 0.

Abstract: A resin composition is provided that is suitable for impregnating sheet material, including fabrics, films, paper and tapes of the type employed to form prepregs, such as tapes used to form electrical insulation layers on electrical components. The resin composition includes a solid or semi-solid epoxy resin having an epoxide functionality of at least 2.5, a metal acetylacetonate for catalyzing the epoxy resin, and an accelerator of bisphenol A-formaldehyde novolac catalyzed by an acidic catalyst and having a hydroxyl equivalent weight of 120. The resin composition is essentially unreactive at room temperature and at elevated temperatures sufficient to enable permeation of the sheet material by the resin in its manufacture, is essentially unreactive at temperatures required to remove moisture and volatiles during processing of articles wrapped or taped with the sheet material, and cures at a higher temperature without adversely affecting the cure characteristics of the resin composition.

Abstract: Sand compositions containing a binder composition and a curing agent, in which the binder composition comprises (a) a binder comprising an acid-curable resin and (b) from 0.5 to 63.0% by weight, based on the binder composition, of at least one curing accelerator selected from compounds represented by formula (1): ##STR1## wherein X.sub.1, X.sub.2 each represent a hydrogen atom, a methyl group or an ethyl group;exhibit an increased curing rate to provide a casting mold having an increased initial strength.

Abstract: A fiber-reinforced resin plate comprising a fibrous base material and a matrix bonding the fibers contained in the fibrous base material, the matrix being formed by curing a resin composition comprising a highly reactive modified phenolic resin (A) prepared by polycondensing a petroleum heavy oil or pitch, a formaldehyde polymer and a phenol in the presence of an acid catalyst to thereby prepare a modified phenolic resin and-reacting the resultant modified phenolic resin with a phenol in the presence of an acid catalyst to thereby lower the molecular weight of the modified phenolic resin, and an epoxy resin (B). Also, a prepreg and a process for producing the fiber-reinforced resin plate.

Abstract: In the method described, one or more halogen-free phosphorus compounds are incorporated in the precondensed resins before the final resin-curing stage. During final curing, the phosphorus compounds are bound by covalent bonds into the resin structure and/or are trapped in the resin structure as such or in the form of aggregates or condensates.

Abstract: Polymer compositions comprising phenol/formaldehyde systems and polyarylsulphones having epoxy pendent or end groups are disclosed together with novel epoxy-ended polyarylsulphones and novel cross-linked epoxy-ended polyarylsulphones. The compositions can be both unreinforced and reinforced with fibres and/or other fillers.

Abstract: The present invention is directed to a phenolic resin composition useful for preparing a binder for reinforced composites, to a binder for reinforced composites made using the phenolic resin composition, and to a reinforced composite made using the binder. The phenolic resin composition of the present invention contains an aqueous mixture of: (a) a resole formed by reacting phenol with formaldehyde at a mole ratio of formaldehyde to phenol ranging from about 0.6:1 to about 4:1 and (b) a sulfite or bisulfite, wherein the resole has a pH at least about 7 and less than 9.5 and the composition contains from about 0.007 to about 0.4 mole equivalent of sulfur per mole of phenol.

Abstract: A curable composition which comprises:(1) a compound which contains on average more than 1 epoxy group per molecule;(2) a compound which contains on average more than 1 phenolic hydroxyl group per molecule; and(3) a catalytic amount of a catalyst compound which contains:(a) a cation containing at least one heterocyclic nitrogen-containing ring, and(b) an anion which is a conjugate base of fluoroarsenic acid, fluoroantimonic acid, fluorophosphoric acid, chloroarsenic acid, chloroantimonic acid, chlorophosphoric acid, nitric acid, hydrofluoric acid, trifluoroacetic acid, trifluoromethane sulfonic acid, picric acid, fluoboric acid, or an acid represented by the Formula:HBR.sub.3 R'wherein each R is independently a hydrocarbyl or substituted hydrocarbyl group and R' is a halogen, a hydrocarbonoxy group, a hydrocarbonamino group, or a hydrocarbonphosphino group.

Abstract: Thermoplastic polyblend compositions, well suited for the production of mechanically strong and chemical-resistant shaped articles having a wide variety of chemical engineering and other applications, e.g., for the production of electrical cable for high-frequency electrical transmissions, comprise (i) a fluoropolymer, (ii) an aromatic polyester and (iii) a copolymeric compatibilizing agent therefor, the compatibilizing copolymer (iii) comprising the copolymerizate of ethylene, a glycidyl acrylate, an acrylic comonomer and, optionally, a peroxy comonomer.

Abstract: A molding material useful in the fabrication of an electrical or electronic part comprises a modified phenolic resin (A), an epoxy resin (B) and a curing agent (C), said modified phenolic resin prepared by heating heavy oil or pitch and a formaldehyde in a molar ratio of formaldehyde: (oil or pitch) of from 1-15:1 in the presence of an acid catalyst, adding phenol in a molar ratio of phenol: (oil or pitch) of from 0.5-5:1 to form a modified phenolic resin, and purifying by performing in optional sequence (i) a treatment with an aliphatic or alicyclic hydrocarbon and (ii) an extraction with an aromatic hydrocarbon solvent wherein the catalyst has a solubility of 0.1 or less to remove the catalyst.

Abstract: Thermoplastic polyblend compositions, well suited for the production of mechanically strong and chemical-resistant shaped articles having a wide variety of chemical engineering and other applications, e.g., for the production of electrical cable for high-frequency electrical transmissions, comprise (i) a fluoropolymer, (ii) an aromatic polyester and (iii) a copolymeric compatibilizing agent therefor, the compatibilizing copolymer (iii) comprising the copolymerizate of ethylene, a glycidyl acrylate, an acrylic comonomer and, optionally, a peroxy comonomer.

Abstract: An epoxy resin composition contains an epoxy resin represented by the formula (I) and a curing accelerator: ##STR1## wherein R.sup.1 stands for ##STR2## where G stands for a glycidyl group, R.sup.2 stands for an alkyl group having 1 to 4 carbon atoms, R.sup.3 and R.sup.4 stand for the same or different groups and each denote a hydrogen atom or a glycidyl group, m and x each denote an integer of 0 to 10, n denotes an integer of 0 to 2, provided that m.gtoreq.x and, if m=0, then x=0, in which case at least one of R.sup.3 and R.sup.4 denotes a glycidyl group on the condition that when m.gtoreq.1 and m>x, R.sup.1 may each stand for different groups.

Abstract: An epoxy resin composition comprising (i) an epoxy resin, (ii) a phenolic curing agent, (iii) an organophosphorous curing agent, (iv) alumina, and (v) a separating means for separating the organophosphorous curing agent and the alumina, which may be a coating over the surfaces of the organophosphorous curing agent.

Abstract: Compositions containing an aryl phosphite and water to hydrolyze the aryl phosphite provide controlled and extended work time when used as hardening agents for the ambient temperature hardening of phenolic resins and for rapid hardening of such resins at modestly elevated temperatures. Pre-solvolysis with small quantities of water, alkanols of 1 to 4 carbon atoms or alkylene glycols of 2 to 4 carbon atoms improve compatibility of trisubstituted phosphites with the resin. Pre-hydrolysis of the phosphites as well as addition of furfuryl alcohol or alkylene glycols of 2 to 4 carbon atoms accelerate the hardening (curing) of the resin. Various compounds such as: carboxylic acid amides, urea, dicyandiamide, N-methylolated amides, N-alkyl 2-pyrrolidinones having 1 to 4 carbon atoms in the alkyl group, those having an internal epoxide group, alkanols, and Schiff bases retard the ambient temperature hardening of the resin with the aryl phosphite hardening agents.

Abstract: Copolycondensation of a hydroxyl group-containing naphthalene and xylene with an aldehyde compound gives a polyhydroxy aromatic compound. The hydroxyl group-containing naphthalene comprises at least one of naphthols and dihydroxynaphthalenes. In the polyhydroxy aromatic compound, the proportions of the naphthalene unit and xylene unit are 95 to 50:5 to 50 (mole percent), and each molecule contains 2 to 20 naphthalene units. The polyhydroxy aromatic compound is useful as an epoxy resin curing agent. Reaction of the polyhydroxy aromatic compound with an epihalohydrin gives an epoxy resin. An epoxy resin composition can be prepared from the epoxy resin and a curing agent.

Abstract: The present invention provides an epoxy resin composition which is obtained by melt-mixing 100 parts by weight of an epoxy resin with 3 to 33 parts by weight of a thermoplastic resin alone or in combination with other components and additives than a hardener in the first mixing step and then with a hardener alone or in combination with other components and additives in the second mixing step, said epoxy resin having a number-average molecular weight of at least 200 and lower than 5000 and said thermoplastic resin having a number-average molecular weight of at least 5000; an adhesive epoxy resin molded article which is obtained by molding said epoxy resin composition; a process for producing an adhesive epoxy resin molded article which comprises molding said epoxy resin composition into a 0.01 to 10 mm thick film or sheet in a substantially uncured state and subsequently punching the film or sheet at temperatures higher than 15.degree. C. and lower than 70.degree. C.

Abstract: A 1,1-bis(2,7-diglycidyloxy-1-naphthyl)alkane as an epoxy resin; a 1,1-bis(2,7-dihydroxy-1-naphthyl)alkane as an intermediate for said epoxy resin; a process for producing said intermediate comprising reacting 2,7-dihydroxy-1-naphthalene and an aldehyde; a process for producing said epoxy resin comprising reacting said intermediate and an epihalohydrin; and an epoxy resin composition comprising said epoxy resin and a curing agent. The epoxy resin has a low melt viscosity while exhibiting excellent heat resistance.

Abstract: A resin composition for fiber reinforced plastic comprising the following components A, B, C, D and E as essential components:A: a bisphenol A epoxy resin having an epoxy equivalent of at most 250 and being liquid at room temperature,B: a bisphenol A epoxy resin having an epoxy equivalent within a range of from 400 to 5,000 and softening point of from 60.degree. to 200.degree. C.,C: a phenol novolak type epoxy resin,D: a nitrile rubber, andE: a curing agent.

Abstract: Copolycondensation of .alpha.-naphthol and .beta.-naphthol with an aldehyde compound gives a poly-hydroxynaphthalene compound having an average molecular weight of 300 to 2,000. This compound is useful as a curing agent for epoxy resins and as a precursor of epoxy resins. Epoxy resin compositions include (1) compositions comprising an epoxy resin and the poly-hydroxynaphthalene compound as a curing agent and (2) compositions comprising an epoxy resin obtained by reacting the poly-hydroxynaphthalene compound with an epihalohydrin and a curing agent. The epoxy resin compositions of the invention are characterized in that the cured resins have a high glass transition temperature and high heat stability and high moisture resistance, scarcely allowing package cracking even in soldering treatment. Therefore the compositions are suited for use in encapsulating semiconductors.

Abstract: Compositions containing aryl phosphites and water to hydrolyze the aryl phosphite provide controlled and extended work time when used as hardening agents for the ambient temperature hardening of phenolic resins and for rapid hardening of such resins at modestly elevated temperatures. Pre-solvolysis with small quantities of water, alkanols of 1 to 4 carbon atoms or alkylene glycols of 2 to 4 carbon atoms improve compatibility of trisubstituted phosphites with the resin. Pre-hydrolysis of the phosphites as well as addition of furfuryl alcohol or alkylene glycols of 2 to 4 carbon atoms accelerate the hardening (curing) of the resin. Various compounds such as: carboxylic acid amides, urea, dicyandiamide, N-methylolated amides, N-alkyl 2-pyrrolidinones having 1 to 4 carbon atoms in the alkyl group, those having an internal epoxide group, alkanols, and Schiff bases retard the ambient temperature hardening of the resin with the aryl phosphite hardening agents.

Abstract: A room temperature setting carbonaceous cement comprising a solid carbonaceous material, a catalyst and a liquid carbonizable component which when treated with the catalyst will provide a carbon yield of at least 40% at an elevated baking temperature and possess a flexural strength which is above at least 750 psi at room temperature and at said elevated temperature.

Abstract: An epoxy resin composition for sealing semiconductor elements comprising o-cresol-novolak type epoxy resins, curing agents, curing accelerators, inorganic fillers, plasticizers and imide-epoxy resins having the formula (I) is disclosed. Use of the imide-epoxy resin in an amount of 0.1 to 20.0% by weight improves the heat and moisture resistant properties of the epoxy resin composition. ##STR1## wherein, R.sub.1 and R.sub.2 denote independently H or (CH.sub.2)nCH.sub.3 radical,n denotes 0 or an integer of 1 above.

Abstract: A rodlike mesogenic moiety-containing polythiirane resin is blended with an epoxy resin and when cured with a curing agent is useable in molding applications.

Abstract: Latent, heat-curable epoxy resin compositions containing metal carboxylate curing systems provide exceptional latency, particularly at elevated temperature, as well as facile curing, high T.sub.g and adhesive strength, and other attractive properties. The metal carboxylates comprise alkali metals and alkaline earth metals, aromatic and aliphatic metal carboxylates. The preferred curing systems comprise synergistic combinations of the metal carboxylates with cure modifiers.

Abstract: A rodlike mesogenic moiety-containing polythiirane resin is blended with an epoxy resin, is curable with a curing agent and can be employed in molding applications.

Abstract: A two-step process for the preparation of a silicone resin-modified phenolic resin is disclosed wherein an alkoxysilane-modified phenolic resin is first prepared by reacting an alkoxysilane with a phenolic resin. In a subsequent step, the alkoxysilane-modified phenolic resin is hydrolyzed and condensed by heating and stirring it with water. The resulting silicone resin-modified phenolic resin, which is free of diorganopolysiloxane units, has excellent heat resistance and excellent electrical insulating properties.

Abstract: An electrical encapsulation formulation is provided comprising a diglycidyl ether of a 4,4'-dihydroxybiphenyl, a trisphenolic curing agent, a cure accelerator and an inorganic filler. The composition cures rapidly and exhibits excellent resistance to cracking under high-temperature operation.

Abstract: An epoxy resin powder coating composition comprises 100 parts by weight of bisphenol A mixed epoxy resin having number average molecular weight from 1,700 to 4,500 comprising a bisphenol A epoxy resin (A) having a number average molecular weight from 2,500 to 8,000 and a bisphenol A epoxy resin (B) having a number average molecular weight from 300 to 1,000 (C) a novolak epoxy resin 5 to 20 parts by weight of polyvinyl butyral resin or polyviny formal resin, a hardener, and a filler.

Abstract: A film-forming resin composition comprising(A) from 1 to 10 weight percent of a phenolic resin,(B) from 10 to 89 weight percent of an epoxy resin and(C) from 10 to 89 weight percent of a reaction product between a epoxy resin and a phosphoric or phosphonic acid or monoalkyl orthophosphate,based on the total weight of (A), (B) and (C), is very useful for coating metallic substrates. The cross-linked composition gives colorless coatings of high toughness, flexibility, adhesion and chemical resistance.

Abstract: A composition is disclosed which comprises the reaction product of a diglycidyl ether of a 4,4'-dihydroxybiphenyl and a polyhydric phenol having an average of 2.3 to 10 hydroxyl groups per molecule. The described epoxy resin is particularly useful in phenolic-cured electrical encapsulation formulations.

Abstract: The products resulting from contacting an organic phosphine or arsine with an inorganic acid having a weak nucleophilic anion provide for relatively stable compositions when admixed with a compound containing an average of more than one vicinal epoxide group per molecule and which optionally contains a compound containing an average of more than one phenolic hydroxyl group per molecule.

Abstract: A method for encapsulating microelectronic devices is provided using a heat curable epoxy composition having a monomeric or polymeric diaryliodonium hexafluoroantimonate salt. Curable compositions are also provided as well as encapsulated microelectronic devices.

Abstract: Phenolic molding compositions, particularly useful as sheet molding compositions comprise: 1) a resole phenole resin, 2) a thickening agent selected from the group consisting of alkaline earth metal oxides or hydroxides and silanes, 3) a filler selected from the group consisting of clay, talc, and mixtures thereof, and 4) an epoxy resin.

Abstract: A heat curable composition is provided which is useful for encapsulating microelectronic devices using a heat curable epoxy composition having a diaryliodonium hexafluoroantimonate salt as a catalyst in combination with an effective amount of a free radical generating aromatic compound as a cocatalyst.

Abstract: An epoxy resin based powder coating composition which comprises: (A) 100 parts by weight of a mixed epoxy resin having a softening point of 60.degree.-80.degree. C. which consists of 50 to 70 wt. % of a bisphenol A expoxy resin having a number-average molecular weight of 800 to 1,800 and 30 to 50 wt. % of a cresol novolak epoxy resin; (B) 5 to 80 parts by weight of a novolak resin; (C) 0.5 to 5 parts by weight of triphenylphosphine; (D) 60 to 200 parts by weight of an inorganic powder having an average particle size of 0.5 to 75 um; and (E) 0.01 to 2 parts by weight of a microfine silica powder having an average particle size of 1 to 100 nm.The epoxy resin based powder coating composition can be coated on electrical and electronic components at 90.degree.-100.degree. C. with retaining the high moisture resistance, storage stability and free-flowing properties.

Abstract: A heat curable composition is provided which is useful for encapsulating microelectronic devices using a heat curable epoxy composition having a diaryliodonium hexafluoroantimonate salt as a catalyst in combination with an effective amount of a free radical generating aromatic compound as a cocatalyst.

Abstract: An epoxy resin composition for semiconductor sealing which comprises, as essential components,(A) an epoxy resin comprising 50-100% by weight, based on total epoxy resin amount, of a polyfunctional epoxy resin represented by the formula (I) ##STR1## wherein n and m are each an integer of 0 or more, n+m=1-10, and R.sub.1, R.sub.2 and R.sub.3 which may be the same or different, are each selected from hydrogen atom, an alkyl group and a halogen atom, with the proviso that all of R.sub.1, R.sub.2 and R.sub.3 must not be hydrogen atom simultaneously,(B) a phenolic resin curing agent,(C) a silica filler, and(D) a curing accelerator.

Abstract: An epoxy resin composition having exceptional stability which is useful in the preparation of electrical laminates comprises an epoxy resin such as the diglycidyl ether of bisphenol A, an organic solvent, a polyhydric phenolic hardener and an acid having a pKa at 25.degree. C. of less than 2.5 or an ester or anhydride of such acid. The epoxy resin composition can also contain a bishenol or bisphenol derivative such as bisphenol A. In addition, an accelerator such as an alkyl substituted imidazole can also be added to the composition prior to its use as in the preparation of electrical laminates.

Abstract: Epoxide compounds and phenolic compounds are reacted in the presence of phosphonium compounds represented by the formula .crclbar.Z'R.sup.1 R.sup.2 R.sup.3 P.sym.-Z-P.sym.R.sup.1 R.sup.2 R.sup.3 Z'.crclbar. wherein each R.sup.1, R.sup.2 and R.sup.3 is independently an aromatic group or an inertly substituted aromatic group; Z is --(C(R.sup.4).sub.2).sub.a --; each R.sup.4 is independently hydrogen or a hydrocarbyl group containing from 1 to about 20 carbon atoms; Z' is any suitable anion and a has a value of at least 4.

Abstract: Storage stable compositions are disclosed which comprise an epoxide containing compound, a phenolic hydroxyl containing compound, and a catalyst compound for catalyzing the reaction between epoxide groups and aromatic hydroxyl groups which catalyst comprises the product resulting from contacting an onium salt, amine, or amine salt with an acid or a salt of an acid having a weak nucleophilic anion.

Abstract: An epoxy resin composition consisting essentially of(A) an epoxy resin,(B) a curing agent,(C) a curing promoter,(D) an organic silicon compound having at least one phenolic hydroxyl group per molecule, and(E) a filler.

Abstract: A process for preparing a water soluble phenol-formaldehyde resole resin having improved storage stability employs a calcium compound to catalyze the condensation reaction which occurs under basic conditions. Sulfamic acid is used to neutralize the resole solution, yielding a soluble calcium salt which will not settle out of the solution or clog transfer lines or spray nozzles as may a calcium salt precipitated during the neutralization. Glass fiber insulation produced using a binder prepared with the aqueous resole solution shows enhanced thickness recovery and lower odor potential.

Abstract: According to the present invention there is provided a coating composition comprising from 30% to 70% by weight of a novolac-type phenolic resin having a melting point in the range of 70.degree.-130.degree. C. or resol-type phenolic resin having a gel time of at least 45 to 180 sec. at 180.degree.C.; and 70-30% by weight of a multi-epoxide group containing compound having at least 2 epoxide groups and having an epoxide equivalent weight of 100 to 1200.

Abstract: A curable composition for a fiber-reinforced resin, comprises (A) 60-90 weight % of an epoxy-containing (meth)acrylate resin which contains an epoxy group and an unsaturated-monobasic acid ester group in its molecules and which is formed by the reaction of an epoxy resin containing at least two epoxy groups per molecule and having an epoxy equivalent of 100-1000 with an unsaturated-monobasic acid in an amount such that there are 0.2-0.7 equivalents of carboxyl groups per 1 equivalent of epoxy groups, (B) 40-10 weight % of a radical polymerizable monomer, (C) an organic peroxide, (D) a curing agent for the epoxy resin, and (E) one or more reinforcing materials selected from continuous fiber and fiber cloth.

Abstract: Latent catalysts for epoxy reactions are prepared by reacting a tetrasubstituted onium compound such as tetrabutylphosphonium acetate.acetic acid complex or an amine compound with an acid having a weak-nucleophilic anion such as fluoboric acid. These catalysts provide stable latent catalysts for epoxy resins for advancement or curing reactions.

Abstract: An epoxy resin composition for sealing, and a resin-sealed type semiconductor device in which this composition is used, of outstanding heat cycle resistance, humidity resistance and laser marking characteristics, can be obtained by using a combination of an organic phosphine compound and a metal complex dye. The epoxy resin composition, characterized in that it consists of epoxy resin, a curing agent having at least 2 phenolic hydroxyl groups per molecule, an organic phosphine compound and a metal complex dye; and to a resin-sealed type semiconductor device characterized in that it is sealed with this composition.

Abstract: A curing agent for an epoxy resin comprises a cyclodextrin clathrate compound of a compound which is reactive with an epoxy group, a curing agent for an epoxy resin comprising a mixture of a cyclodextrin clathrate compound of a compound which is reactive with an epoxy group with a trace amount of amylase, and methods for the preparation of these curing agents. The curing agents are stable at room temperature, and the curing reaction is initiated under remarkably simple conditions.

Abstract: There is disclosed a highly reliable resin encapsulation type semiconductor device excellent humidity resistance as well as high temperature electric characteristics. The specific feature consists in the epoxy resin composition employed for encapsulation. This composition comprises a novolac type epoxy resin, a novolac type phenol resin, an organic phosphine compound and an organic phosphorus acid compound.The resin encapsulation type semiconductor device is markedly small in leak current under hot an humid conditions and has a prolonged life due to difficult deterioration through corrosion of electrodes and aluminum wiring, as compared with those of prior art.

Abstract: An epoxy resin composition having excellent handling properties, solvent resistance and heat resistance and particularly excellent low-temperature curability is provided which comprises (A) a polyfunctional epoxy resin having an epoxy equivalent of 160 to 2,000 obtained by reacting an epoxy resin having an epoxy equivalent of 100 to 800 with a molecular weight increasing agent containing 2.1 to 10 functional groups (phenolic hydroxyl groups) on an average per molecule and (B) a curing agent for the epoxy resin) as essential ingredients.