Abstract: Mixture for the production of acid-resistant sealing materials or acid-resistant impregnating materials based on epoxy resins, resols, hardening catalysts and further customary additives, which are in the form of a cement or impregnating solution and contain, as essential constituents, (A) at least one bifunctional, low-molecular epoxy resin having an epoxide equivalent weight between 87 and 1,000, (B) at least one resol formed from at least one trifunctional phenol and formaldehyde in a molar ratio of 1:1 to 1:3, having a viscosity between 50 and 2,500 mPa.s at 20.degree. C. and having a solids content of at least 50% by weight, and (C) hardening catalysts, cements also containing (D) fillers, in addition, and a process for the preparation of hardening products from the compounds. Thus, for example, cements or impervious, initially porous shaped articles which are resistant to solvents and weak acids and which have a low shrinkage after processing, are obtained.

Abstract: Relatively high molecular weight epoxy resins cured with conventional curing agents are disclosed wherein the relatively high molecular weight epoxy resin is prepared in the presence of the curing agents. The resultant cured epoxy resin has an improvement in Tg or toughness and the mixture prior to reaction and curing is much easier to apply as a coating or in the preparation of castings, laminates and the like as compared to applications of mixtures of relatively high molecular weight epoxy resins and the curing agents.

Abstract: Storage stable, heat curable mixtures obtained from epoxy resins as a binder system containing latent hardening agents as well as fillers and additive materials which have outstanding mechanical and electrical properties and which are obtained as epoxy resin components of an adduct of a high molecular solid epoxy resin and 4,4'-diaminodiarylalkane in a molecular ratio of 1:0.01 to 0.05. The preferred economical curing agent is a phenol formaldehyde condensation product.

Abstract: A heat curable water dispersible film-forming synthetic resin useful in aqueous coating compositions for coating metal substrates, particularly cans used for food and beverages, comprises the reaction product of a water insoluble phenolic resin or a water insoluble amino resin with an epoxy resin and a phosphoric acid.

Abstract: Solid epoxy resin systems comprising the reaction products of a polyepoxide compound with a functionality greater than two, a diglycidyl ether of a polyhydric phenol and a polyhydric phenol; said systems being applicable for use in a variety of applications and particularly in combination with phenolic novolac hardeners for molding applications.

Abstract: This invention relates to a heat curable composition comprising(a) a liquid, ethylenically unsaturated monomer, oligomer or prepolymer of the formula: ##STR1## wherein R is H or CH.sub.3, R.sub.1 is an organic moiety and n is at least 2,(b) an epoxy resin containing at least two ##STR2## groups, and (c) a thermal initiator member of the group consisting of(1) a substituted or unsubstituted diaryliodonium salt in combination with a free radical initiator,(2) a BF.sub.3 adduct,(3) a BF.sub.3 adduct in combination with a free radical initiator, and(4) dicyandiamide in combination with a free radical initiator.The system is stable at ordinary temperatures, but on heating the thermal initiator catalyzes the curing of the acrylate and the epoxy resin.

Abstract: A four-component composition is disclosed comprising a hydroxyl-bearing polymer; a liquid, amino- or hydroxyaromatic diluent having an atmospheric boiling point of about 150.degree. C. or greater; an aminoplast or phenolic resin capable of curing the hydroxyl-bearing polymer and a strong acid catalyst for the reaction between the first and third components. Optionally, a pigment may be added to the composition.

Abstract: The high temperature stability of devices encapsulated with a flame retardant epoxy molding compound is improved by including in the encapsulant as synergistic flame retardant a halogen-containing organic compound (preferably of the reactive type) and antimony pentoxide. The encapsulant may be prepared from an epoxy, a hardener preferably of the novolac or anhydride type, a catalyst, a mold release agent, preferably a filler, preferably a colorant, preferably a coupling agent, the halogen-containing organic compound (which may be part of the resin or the hardener) and antimony pentoxide. Such encapsulants, when used to encapsulate semiconductor devices, have improved high temperature compatability compared to similar molding compounds with antimony trioxide or antimony tetraoxide.

Abstract: A process for the preparation of resol resins by reacting bisphenol A with 1.2 to 1.8 moles of formaldehyde in the presence of n-butanol or isobutanol and in the presence of a tri-alkali metal phosphate as a catalyst, and their use, optionally combined with epoxy resins, for the preparation of deep-drawable, sterilizable and chemically resistant lacquer films.

Abstract: A four-component composition is disclosed comprising 100 parts of a non-aminoplast hydroxyl-bearing polymer; about 5-100 parts of a (poly)glycol monoether having an atmospheric boiling point of about 300.degree. C. or greater; an aminoplast or phenolic resin capable of curing the hydroxyl-bearing polymer and a strong acid catalyst for the reaction between the first and third components. Optionally, a pigment may be added to the composition.

Abstract: A process for producing a furan-epoxy powder-like binder comprising reaction of an epoxy diane resin (100 parts by weight) with a ketone of the furan series (40 to 500 parts by weight) and a modifying agent (60 to 500 parts by weight). As the ketone of the furan series use is made of monofurfurylideneacetone, difurfurylideneacetone, difurfurylidenecyclohexanone, a mixture of monofurfurylidenacetone with difurfurylidenacetone, 1,9-di-(.alpha.-furyl)-nonanetetraene-1,3,6,8-one-5, or 1,5-di-(.alpha.-furyl)-2,4-dimethylpentadiene-1,4-one-3. As the modifying agent use is made of a phenolformaldehyde resin or anhydrides of dibasic carboxylic acids. The reaction is carried out at a temperature within the range of from 130.degree. to 180.degree. C. in the presence, when required, of trifurylborate (10 to 30 parts by weight). The resulting product is cooled to a temperature of at most 30.degree. C. and disintegrated to a powder-like condition.