Abstract: A hybrid polyurethane/polyurea polymer suitable for forming a coating on a structure which is in contact with water includes the reaction product of a polyol component consisting of one or more polyols, a polyamine, and a curing agent, such as a polyisocyanate. The polyol component includes a Novolac-type polyether polyol.

Abstract: A semiconductor adhesive used for sealing connection portions of a semiconductor device, wherein: in the semiconductor device, the connection portion of a semiconductor chip and the connection portion of a wiring circuit substrate are electrically connected to each other or the connection portions of a plurality of semiconductor chips are electrically connected to each other; the semiconductor adhesive comprises a (meth)acrylic compound and a curing agent; and when the semiconductor adhesive is kept at 200° C. for 5 seconds, a curing reaction rate thereof is 80% or more.

Abstract: A cyclic compound having a molecular weight of 500 to 5000 is represented by the following formula (1), wherein at least one of R0 is a monovalent group containing an iodine atom. Also disclosed are a method for producing the cyclic compound, a composition containing the cyclic compound, and a method for forming a resist pattern using the composition.

Abstract: A polyester polymer is provided that includes at least one pendant phenolic-containing group. In one embodiment, the polyester polymer is combined with an optional crosslinker and an optional carrier to form a coating composition suitable for use in coating articles such as packaging articles. The coating composition typically includes a resole phenolic crosslinker. In one embodiment, the polyester polymer has at least one phenolic-containing group that comprises an adduct of cardanol.

Abstract: The invention relates to an antireflective coating composition comprising a crosslinkable polymer, where the crosslinkable polymer comprises at least one unit of fused aromatic moiety, at least one unit with a phenylene moiety in the backbone of the polymer, and at least one hydroxybiphenyl unit, furthermore where the polymer comprises a crosslinking moiety of structure (4), where R?3, R?3 and R??3 are independently hydrogen or a C1-C4alkyl. The invention further relates to a process for forming an image using the composition.

Abstract: The present invention provides a resin composition for a fiber-reinforced composite material, which has excellent fluidity at low temperature and which produces a cured product having excellent mechanical strength, and also provides a cured product thereof, a fiber-reinforced composite material, a fiber-reinforced resin molding having excellent heat resistance, and a process for producing a fiber-reinforced resin molding with good productivity. A resin composition for a fiber-reinforced composite material contains, as essential components, an epoxy resin (A), an acid group-containing radical polymerizable monomer (B), a radical polymerization initiator (C), and an amine-based curing agent (D) for an epoxy resin, and has a viscosity of 500 mPa·s or less at 50° C. measured with an E-type viscometer. The composition is impregnated into reinforcing fibers and cured.

Abstract: A cyclic compound represented by formula (1): wherein L, R1, R?, and m are as defined in the specification. The cyclic compound of formula (1) is highly soluble to a safety solvent, highly sensitive, and capable of forming resist patterns with good profile. Therefore, the cyclic compound is useful as a component of a radiation-sensitive composition.

Abstract: A resist underlayer film-forming composition includes a polymer including a repeating unit shown by a formula (1), and having a polystyrene-reduced weight average molecular weight of 3000 to 10,000, and a solvent. Each of R3 to R8 individually represent a group shown by the following formula (2) or the like. R1 represents a single bond or the like. R2 represents a hydrogen atom or the like.

Abstract: An abrasive product includes a plurality of abrasive particles and a resin cured with a polythiol group. A method of preparing the abrasive product includes contacting the plurality of abrasive particles with a curable composition that includes a resin and a polythiol group, and curing the curable composition to produce the abrasive product. A method of abrading a work surface includes applying an abrasive product to a work surface in an abrading motion to remove a portion of the work surface. A curable composition includes a formaldehyde resin and a polythiol group. A formaldehyde resin is crosslinked by a polythiol group. A method of crosslinking the formaldehyde resin includes reacting the polythiol group with the formaldehyde resin.

Abstract: The present disclosure provides a polyester toner resin comprising a polyhydroxylated thymol derivative that may be used in manufacturing an emulsion aggregation (EA) toner for imaging devices.

Abstract: The invention relates to a process for preparing a reinforced and reactive thermoplastic composition having a continuous phase which is based on at least one thermoplastic polymer and dispersed in which is a discontinuous phase based on at least one reactive reinforcing agent that may be immiscible with said at least one thermoplastic polymer, and also to a composition obtained by this process.

Abstract: The present disclosure provides a polyester toner resin comprising a polyhydroxylated cardanol derivative, that may be used in manufacturing an emulsion aggregation (EA) toner for imaging devices.

Abstract: A curing resin composition that cures in two stages: photo cure and thermal cure, hardly contaminates a liquid or liquid crystals when in contact with, and provides high adhesive strength, particularly a curing composition that photocures sufficiently even when shadowed by TFT wires, a black matrix, etc. in photocuring; and a sealant, a sealant for ODF (one-drop-fill), and an LCD containing the curing resin composition.

Abstract: A solder resist having both adequate sensitivity at photo-irradiation and alkali developability, and the solder resist forming a cured product which is excellent in dimensional stability against temperature change, does not exhibit brittleness, and further, is excellent in water resistance, electrical insulation, thermal cycle test resistance (TCT resistance) and the like is provided, and further, a dry film having a solder resist layer, a cured product and a printed wiring board are provided. The solder resist comprising an acid-modified vinyl ester synthesized from an epoxy compound, a phenol compound, an unsaturated monobasic acid and a polybasic acid anhydride, wherein the epoxy compound contains a crystalline epoxy resin having a melting point of 90° C. or more, and the phenol compound contains a compound having a bisphenol S structure.

Abstract: The present invention provides a rubber composition capable of forming an inner tube and/or an outer cover having high adhesion to a brass-plated wire and having excellent heat resistance, and oil resistance in a hose using a brass-plated wire as a reinforcing layer. The rubber composition includes 100 parts by mass of a rubber component (A) that includes ethylene-(meth)acrylate copolymer rubber and/or hydrogenated acrylonitrile-diene copolymer rubber, 1 to 30 parts by mass of a phenol resin (B), 1 to 30 parts by mass of silica (C), 0.1 to 5 parts by mass of a triazine compound (D) represented by the following formula (I), and 1 to 15 parts by mass of an organic peroxide (E) (in the formula (I), R represents a mercapto group, alkoxy group, monoalkylamino group, dialkylamino group, monocycloalkylamino group, dicycloalkylamino group, or N-alkyl-N-arylamino group).

Abstract: The present disclosure provides for polycyclopentadiene compounds that useful as an epoxide resin and/or as an adduct for a curable composition.

Abstract: Embodiments include vinylbenzyl ethers of polycyclopentadiene polyphenol that can be obtained by reacting a polycyclopentadiene polyphenol with a vinylbenzyl halide. Embodiments also include thermosettable compositions including the vinylbenzyl ethers of a polycyclopentadiene polyphenol and products obtained by curing the thermosettable compositions. Formula (I).

Abstract: A carboxyl group-containing photosensitive resin is obtained by reacting an ?,?-ethylenically unsaturated group-containing monocarboxylic acid (c) with a phenolic compound (a) containing the structure represented by the following general formula (I) and having at least two phenolic hydroxyl groups in its molecule, wherein part or the whole of the phenolic hydroxyl groups being modified into an oxyalkyl group, and further reacting a polybasic acid anhydride (d) with the resultant reaction product; wherein R1 represents either one of a hydrocarbon radical of 1 to 11 carbon atoms, a SO2 group, an oxygen atom and sulfur atom, R2 represents a hydrocarbon radical of 1 to 11 carbon atoms, “a” represents an integer of 0 to 3, “n” represents an integer of 1 to 2, and “m” represents an integer of 1 to 10.

Abstract: The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.

Abstract: Embodiments of the present disclosure include polycyclopentadiene compounds represented by Formula (I): in which each X is either a hydrogen or a cyano group (N?C—), n has an average value from zero to 20; each m independently has a value of zero to 3; p has a value of zero to 20; each R is independently a halogen, a nitrile group, a nitro group, an alkyl group, an alkoxy group, an alkenyl group, or an alkenyloxy group, where the alkyl group, the alkoxy group, the alkenyl group, and the alkenyloxy group each independently contain 1 to 6 carbon atoms; and each Q is independently hydrogen or an alkyl group containing 1 to 6 carbon atoms. Embodiments of the present disclosure also include a curable composition that includes the polycyclopentadiene compound(s) of Formula (I) and a curing amount of a resin or a catalyst amount of a catalyst and/or a cure accelerating amount of an accelerating agent.

Abstract: The present invention concerns a monovinylaromatic polymer composition comprising a bio-sourced polymer dispersed phase and optionally a rubber dispersed phase wherein said bio-sourced polymer dispersed phase is predominantly made of particles having a size of less than 10 ?m. The present invention also relates to a process (hereunder referred as the first process) to make said monovinylaromatic polymer composition, said process comprising admixing: a monovinylaromatic monomer, at least one bio-sourced polymer, optionally a rubber, at conditions effective to polymerize at least a part of the monovinylaromatic monomer and generate a compatibilizer of the bio-sourced polymer and monovinylaromatic polymer.

Abstract: Embodiments include poly(allyl ether)s of polycyclopentadiene polyphenol that can be obtained by allylation of a polycyclopentadiene polyphenol, where the aromatic hydroxyl group(s) (—OH) are converted to HR1C?CR1—CH2—O— and/or H2R1C—CR1?HC—O—, where R1 is as described herein. Embodiments also include thermosettable compositions including the poly(allyl ether)s of polycyclopentadiene polyphenol and products obtained by curing the thermosettable compositions.

Abstract: A resist underlayer film-forming composition includes (A) a polymer that includes a repeating unit shown by a formula (1), and has a polystyrene-reduced weight average molecular weight of 3000 to 10,000, and (B) a solvent, wherein R3 to R8 individually represent a group shown by the following formula (2) or the like, —O—R1?R2??(2) wherein R1 represents a single bond or the like, and R2 represents a hydrogen atom or the like.

Abstract: The present invention provides a resin composition for a fiber-reinforced composite material, which has excellent fluidity and impregnation into a fiber base material and which produces a cured product having excellent heat resistance. A resin composition for a fiber-reinforced composite material contains, as essential components, a poly(glycidyloxyaryl) compound (A), a polymerizable monomer (B) which is an unsaturated carboxylic acid or an anhydride thereof and has a molecular weight of 160 or less, an aromatic vinyl compound or a (meth)acrylate (C), and a radical polymerization initiator (D), wherein an equivalent ratio [glycidyloxy group/acid group] of a glycidyloxy group in the component (A) to an acid group in the component (B) is 1/1 to 1/0.48, and a molar ratio [(B)/(C)] of the component (B) to the component (C) is in the range of 1/0.55 to 1/2.

Abstract: A curing agent for epoxy resins that is comprised of the reaction product of an amine, an epoxy resin, and an elastomer-epoxy adduct; compositions containing the curing agent and an epoxy resin; the compositions are useful in electronic displays, circuit boards, semi conductor devices, flip chips and other applications.

Abstract: A resin composition that can allow allowing a drying step after impregnation coating of a prepreg and lamination pressing performed at low temperatures in a short time and, at the same time, can maintain storage stability of the prepreg, comprises (A) an imidazole compound represented by formula (I), (B) an epoxy compound, and (C1) a cyanate compound or (C2) a BT resin. R1 and R2 represent an alkyl group, an alkenyl group an alkoxyl group, or a substituted or unsubstituted aromatic substituent; and R3 represents hydrogen, an alkyl group, an alkenyl group, an alkoxy group, a substituted or unsubstituted aromatic substituent, or a halogen group.

Abstract: A meta crosslinked polar benzyl polymer is made by combining a transition metal crosslinker, or one or more source compounds capable of reacting to form such a transition metal crosslinker, with a polar benzyl polymer which has been activated for meta crosslinking

Abstract: There is provided a material that after the formation of a cured film, exhibits high solvent resistance, liquid crystal-alignment properties, heat resistance, and high transparency. A composition for forming thermoset film having photo-alignment properties and containing a component (A) that is a compound having a photo-aligning group and a hydroxy group, a component (B) that is a polymer having any one of or both of a hydroxy group and a carboxy group, and a component (C) that is a crosslinker.

Abstract: Production of a composition based on silanes for the scratch-resistant, hydrophobic, aqueous coating of metals, plastics, chemical products, ceramic materials, concrete and glass.

Abstract: The present invention provides hydrolytically resistant monomers prepared by the reaction of an epoxy compound and a reactive ester and methods for producing the monomers. Also provided are adhesive compositions containing the hydrolytically resistant monomers and methods for use thereof.

Abstract: A multi-component curable composition which is reactive upon admixing of the components and wherein the composition comprises: A. a first component which comprises: (i) a first amine functional adduct which comprises the reaction product of a stoichiometric excess of a diamine and a compound having an epoxide group and an alpha, beta unsaturated carbonyl group; B. a second component which comprises: (i) at least one compound having an average of more than 2.0 groups per molecule which are reactive with amines.

Abstract: A multi-component curable composition which is reactive upon admixing of the components and wherein the composition comprises a first component which comprises a first amine functional adduct and a second amine functional adduct; and a second component which comprises at least one compound having an average of more than 2.0 groups per molecule which are reactive with amines.

Abstract: A resist underlayer film-forming composition includes (A) a polymer that includes a repeating unit shown by a formula (1), and has a polystyrene-reduced weight average molecular weight of 3000 to 10,000, and (B) a solvent, wherein R3 to R8 individually represent a group shown by the following formula (2) or the like, —O—R1?R2 ??(2) wherein R1 represents a single bond or the like, and R2 represents a hydrogen atom or the like.

Abstract: A process for applying a coating to a substrate and broadcasting solid decorative or protective materials onto the liquid surface of the coating before it completely cures or dries, wherein the coating is a multi-component curable composition which is reactive upon admixing of the components and wherein the composition comprises at least a first amine functional adduct and at least one compound reactive with amines.

Abstract: A prepreg composite material that includes a fiber layer and a resin comprising a thermoset resin component, a curing agent and a fibrous micropulp. The micropulp component is an aramid fiber having a volume average length of from 0.01 to 100 micrometers. The prepreg is useful in composite panel construction for minimizing fluid permeation into the cured structure. This prepreg is particularly suitable for making honeycomb sandwich panels. Film adhesives, liquid and paste resins containing aramid fiber micropulp are also disclosed.

Abstract: A carboxyl group-containing photosensitive resin is obtained by reacting an ?,?-ethylenically unsaturated group-containing monocarboxylic acid (c) with a phenolic compound (a) containing the structure represented by the following general formula (I) and having at least two phenolic hydroxyl groups in its molecule, wherein part or the whole of the phenolic hydroxyl groups being modified into an oxyalkyl group, and further reacting a polybasic acid anhydride (d) with the resultant reaction product; wherein R1 represents either one of a hydrocarbon radical of 1 to 11 carbon atoms, a SO2 group, an oxygen atom and sulfur atom, R2 represents a hydrocarbon radical of 1 to 11 carbon atoms, “a” represents an integer of 0 to 3, “n” represents an integer of 1 to 2, and “m” represents an integer of 1 to 10.

Abstract: An amine functional adduct is obtained by admixing a stoichiometric excess of a cycloaliphatic diamine and a compound having an epoxide group and an alpha, beta unsaturated carbonyl group.

Abstract: A curing agent for epoxy resins that is comprised of the reaction product of an amine, an epoxy resin, and an elastomer-epoxy adduct; compositions containing the curing agent and an epoxy resin; the compositions are useful in electronic displays, circuit boards, semi conductor devices, flip chips and other applications.

Abstract: Adhesive compositions comprising epoxy resins, including epoxy novalac resin, and at least one reactive multi-functional acrylate. In preferred embodiments, the compositions also include amine-curing agent having at least one a cyclic group. The adhesive compositions according to the present invention are capable of enhancing the bonding strength of the adhesive, particularly at relatively high temperatures, such as at about 80° C.

Abstract: The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.

Abstract: The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.

Abstract: A redispersible polymer powder including: a polymer to be redispersed; and an ortho-cresol based condensation product or salt thereof; wherein the ortho-cresol based condensation product or salt thereof includes N-containing units derived from a N-based component incorporated into the ortho-cresol based condensation product or salt thereof during polymerization.

Abstract: This invention relates to cationically curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition consists essentially of an electrophoretic device containing an oxetane compound and a photoinitiating system comprising and photoinitiator and optionally a photosensitizer.

Abstract: The invention relates to a liquid resin composition intended for manufacturing abrasives that comprises at least one novolac resin having a glass transition temperature less than or equal to 60° C., at least one reactive diluent and optionally at least one crosslinking agent. Application of the resin composition for producing abrasive articles, especially bonded abrasives and coated abrasives. It also relates to the abrasive articles comprising abrasive grains connected by such a liquid resin composition.

Abstract: The invention provides epoxy and oxetane compositions including the novel acyloxy and N-acyl curing agents described herein. Use of invention curing agents result in cured adhesive compositions with remarkably increased adhesion and reduced hydrophilicity when compared to resins cured with other types of curing agents. Furthermore, the curatives of this invention do not interfere with free-radical cure and are thus suited for use in hybrid cure thermoset compositions.

Abstract: An activated carbon comprising a carbonized and activated compound represented by the formula (1): (wherein, R represents a hydrocarbon group having 1 to 12 carbon atoms, said hydrocarbon group may be optionally substituted with hydroxyl group, alkyl group, alkoxy group, aryl group, aryloxy group, sulfonyl group, halogen atoms, nitro group, thioalkyl group, cyano group, carboxyl group, amino group or amide group, R? represents hydrogen atom or methyl group, and n represents an integer of 4, 6, or 8).

Abstract: An epoxy resin composition which comprises an epoxy resin (A), a curing agent (B), a curing accelerator (C) and a component retarding curing of the epoxy resin (D) which is at least one component selected from components (a), (b) and (c) represented by general formulae [1], [2] and [3], respectively, a semiconductor device having a semiconductor element encapsulated by using the composition, and a process for providing latency to an epoxy resin composition. The epoxy resin exhibits excellent storage stability, excellent fluidity and curing property during encapsulating by molding and excellent resistance to soldering without forming cleavages or cracks by the soldering treatment at high temperatures in accordance with the lead-free soldering. An epoxy resin composition can be provided with latency by adjusting the amounts of the curing accelerator and the component for retarding curing.

Abstract: By heating, allowing to stand at normal temperature, or irradiating in the presence of a photo-polymerization initiator, a curable resin composition which contains (A) a resin material having a radical polymerizable unsaturated group and an epoxy group, (C) a radical polymerization initiator, (D) an amine compound and/or a mercaptan compound containing one or more of active hydrogen in one molecule, and (E) a compound, which is an adduct in which the (D) amine compound and/or a mercaptan compound, is reacted with the radical polymerizable unsaturated group of the (A) resin material, thereby a cured product can be obtained.

Abstract: Special amine compositions comprising a) 30-70% by weight of a polyetherdiamine of the general formula (I) in which n is from 10 to 70, b) 3-30% by weight of a monoamine of the general formula R1—NH2, in which R1 is the straight-chain or branched, saturated or preferably unsaturated radical of a hydrocarbon having 5 to 22 carbon atoms or of a monofunctional polyetheramine having a molecular weight of up to 400 g/mol and c) 3-30% by weight of a di- or triamine and d) 5-40% by weight of an alkylphenol of the general formula (II) in which R2 is the straight-chain, branched or cyclic, saturated or unsaturated radical of a hydrocarbon having 5 to 14 carbon atoms, and curable epoxy resin compositions comprising these special amine compositions, the use of which results in thermosets which have a low degree of crosslinking, are resilient even at low temperatures and are resistant to chemical compositions, and the production of shaped articles and coatings using these curable compositions.

Abstract: The disclosure relates to using metal acrylate compounds such as zinc diacrylate (ZDA), zinc dimethacrylate (ZDMA), among others for curing epoxy functional (and other cross-linking compounds), and to compositions containing such compounds for use in powder coat, film, adhesive, among other applications. ZDA and ZDMA containing compounds can cure the epoxy component of the compositions while being substantially free of conventional curing agents.