Abstract: The invention relates to novolac alkylphenol resins having a low level of free alkylphenol, a method for the production thereof, and the use thereof as tackifying resins and reinforcing resins for rubbers. The resins may be used advantageously in the production of tires.

Abstract: Compositions containing (a) a liquid epoxy resin, (b) an aliphatic or cycloaliphatic primary monoamine and/or an aliphatic or cycloaliphatic disecondary diamine, (c) a latent curing agent for the epoxy resin (a) which does not react until temperatures above 70° C. (measured by means of DSC at a heating rate of 10° C./min), (d) a photopolymerizable compound and (e) a photoinitiator, the ratio of the number of equivalents of epoxy groups to that of polymerizable groups being 1:0.01 to 1:0.7, are suitable as impregnating resins.

Abstract: Low-cure powder coating compositions are disclosed, comprising at least one epoxy-containing resin and/or at least one siloxane-containing resin, and at least one material having the structure wherein R1 is an organic radical having 6 to 25 carbon atoms; each R2 is independently a multivalent hydrocarbon group having 1 to 20 carbon atoms; Y is each R3 and R4 are independently alkyl or aryl groups having 1 to 8 carbon atoms; each Z is independently oxygen or nitrogen; R5 is absent when Z is oxygen and R5 is hydrogen, an alkyl or aryl group having 1 to 20 carbon atoms, or (Y)a—R2— when Z is nitrogen; a and b are integers; a is at least 1; b is 1 to 3; and (b) at least one epoxy-containing resin and/or at least one siloxane-containing resin. The material can optionally be reacted with an acidic hydrogen-containing compound. Some compositions are curable without using crosslinking agents or accelerators.

Abstract: The disclosure relates to using metallic acrylate compounds such as zinc diacrylate (ZDA), zinc dimethacrylate (ZDMA), among others for curing epoxy functional (and other cross-linking compounds), and to compositions containing such compounds for use in powder coat, film, adhesive, among other applications. ZDA and ZDMA containing compounds can also be supplied as an intermediate product that can cure the epoxy component of the compositions while being substantially free of conventional curing agents.

Abstract: Adhesive compositions comprising epoxy resins, including epoxy novalac resin, and at least one reactive multi-functional acrylate. In preferred embodiments, the compositions also include amine-curing agent having at least one a cyclic group. The adhesive compositions according to the present invention are capable of enhancing the bonding strength of the adhesive, particularly at relatively high temperatures, such as at about 80° C.

Abstract: Compositions containing: (a) a liquid epoxy resin; (b) an aliphatic or cycloaliphatic primary monoamine and/or an aliphatic or cycloaliphatic disecondary diamine; (c) a latent curing agent for the epoxy resin (a) which does not react until temperatures above 70° C. (measured by means of DSC at a heating rate of 10° C./min); (d) a photopolymerizable compound; and (e) a photoinitiator; the ratio of the number of equivalents of epoxy groups to that of photopolymerizable groups being 1:0.01 to 1:0.7, are suitable as impregnating resins.

Abstract: The disclosure relates to using metal acrylate compounds such as zinc diacrylate (ZDA), zinc dimethacrylate (ZDMA), among others for curing epoxy functional (and other cross-linking compounds), and to compositions containing such compounds. ZDA and ZDMA containing compounds can cure the epoxy component of the compositions while being substantially free of conventional epoxy curing agents.

Abstract: Low-cure powder coating compositions are disclosed, comprising at least one epoxy-containing resin and/or at least one siloxane-containing resin, and at least one material having the structure wherein R1 is an organic radical having 6 to 25 carbon atoms; each R2 is independently a multivalent hydrocarbon group having 1 to 20 carbon atoms; Y is each R3 and R4 are independently alkyl or aryl groups having 1 to 8 carbon atoms; each Z is independently oxygen or nitrogen; R5 is absent when Z is oxygen and R5 is hydrogen, an alkyl or aryl group having 1 to 20 carbon atoms, or (Y)a —R2— when Z is nitrogen; a and b are integers; a is at least 1; b is 1 to 3; and (b) at least one epoxy-containing resin and/or at least one siloxane-containing resin. The material can optionally be reacted with an acidic hydrogen-containing compound. Some compositions are curable without using crosslinking agents or accelerators.

Abstract: A resin film comprising (A) an epoxy resin having two or more glycidyl groups in a molecule, (B) an epoxy resin curing agent, (C) a thermoplastic resin, and (D) a filler, wherein the filler content in at least either one of the surface regions on the cross-section of the film is less than the filler concentration in the central region. The resin film has not only toughness but also fire retardancy, high interlayer adhesion strength and good processability of metal plating.

Abstract: Self-dispersing, hardenable epoxy resins produced by reacting one or more ?,?-unsaturated carboxylic acid esters with one or more aminopolyalkylene oxide compounds, and reacting the thus formed intermediate with one or more polyepoxide compounds, are described. Processes for their production, aqueous dispersions containing the same and methods for their use are also described.

Abstract: A modified resorcinol resin is prepared by reacting a phenolic compound (e.g., resorcinol) with an olefinically unsaturated compound (e.g., styrene) and two types of aldehyde: a formaldehyde and an alkyl aldehyde (e.g., butyraldehyde). The reaction is typically carried out in the presence of an acid catalyst. The resulting resin has a lower softening point and can be used as a methylene acceptor compound in a vulcanizable rubber composition.

Abstract: A one-pack moisture-curing epoxy resin composition which can be cured at ordinary temperatures and is improved in storage stability without impairing the quickness of curing, i.e., is excellent in two properties incompatible with each other. This composition includes one ore more members selected from the group consisting of vinyl carboxylates of the general formula (1) and epoxy-containing silyl compounds of the general formula (2), one or more members selected from the group consisting of ketimines and oxazolidines, and an epoxy resin.

Abstract: A latent fluxing agent comprising a material which liberates phenol or a carboxylic acid containing compound when heated above 140° C. The latent fluxing agent may be incorporated into a thermoset resin, which includes an epoxy resin. The uncured epoxy resin, which includes the epoxy resin, the latent fluxing agent and an epoxy curing agent are useful as an underfill composition in a method for applying a chip die, having one or more solder balls, to a substrate. The method is used to produce an integrated circuit chip that includes a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical engagement with a carrier substrate.

Abstract: The present invention relates to novel solventless reactive systems curable at room temperature, based on blocked polyisocyanates, primary amines, compounds with oxirane groups, and 2,3-dimethyl-3,4,5,6-tetrahydropyrimidine, and to processes for the preparation of these solventless reactive systems curable at room temperature.

Abstract: A carboxyl group-containing photosensitive resin is obtained by reacting an unsaturated group-containing monocarboxylic acid (d) with a reaction product (c) of a phenolic novolak resin (a) and an alkylene oxide (b) and further reacting a polybasic acid anhydride (f) with the resultant reaction product (e). A photocurable and thermosetting composition comprising (A) the carboxyl group-containing photosensitive resin mentioned above, (C) a photopolymerization initiator, and (D) an epoxy resin, or further comprising (B) a photosensitive (meth)acrylate compound, preferably further comprising (E) an organic solvent and/or (F) a curing catalyst is useful as an ultraviolet-curable type printing ink, various resists and interlaminar insulating materials to be used in the manufacture of printed circuit boards, or the like.

Abstract: A laminating resin composition is disclosed which comprises an unsaturated polyester resin, a vinyl ester resin, a polyfunctional acrylate, and up to about 15 percent by weight of a vinyl monomer. Preferably, the vinyl ester resin has a molecular weight ranging from about 450 to 1500.

Abstract: Use, as modifier resin for rubber mixtures, of novolaks ABC plastified with terpene-type olefinically unsaturated natural substances C, where the ratio of the molar amount of the phenol or phenol derivative B and the molar amount of the natural substance C in the modified novolak is from 1:6 to 6:1, process for increasing the tear propagation resistance and reducing the compression set of rubber vulcanizates by adding these modifier resins to rubber mixtures, and components molded from vulcanizates thus prepared.

Abstract: A resin composition comprises a resin (A) and a resin (B) as constituents, said resin (A) having a number average molecular weight of 1,000 to 35,000 and being at least one member selected from the group consisting of following (A1) and (A2): (A1) a polyester polyol, a polyether polyol, a polycarbonate polyol, a polyurethane polyol, a polyolefin polyol and an acrylic polyol, (A2) a polymer obtained by reacting said (A1) with a compound having at least one functional group selected from the group consisting of isocyanato, carboxyl and epoxy groups within a molecule thereof, a dialkyl carbonate, a cyclic carbonate, an alcohol, or a mixture of these, and said resin (B) having a sulfonium group and a propargyl group within the molecule thereof.

Abstract: A damping resin composition is provided which includes bifunctional diacrylate or bifunctional dimethacrylate (A) expressed by the formula (1) below, and an unsaturated polyester resin (B+C) containing an unsaturated polyester (B) and a cross-linking monomer (C), and/or an epoxy acrylate resin (B′+C) containing an epoxy acrylate (B′) and a cross-linking monomer (C), wherein the bifunctional diacrylate or bifunctional dimethacrylate (A) is contained in an amount of 15 to 85% by weight, and the unsaturated polyester resin (B+C) or the epoxy acrylate resin (B′+C) or a mixture (B″+C) thereof that contains the unsaturated polyester resin (B+C) in an amount of 5 to 95% by weight and the epoxy acrylate resin (B′+C) in an amount of 95 to 5% by weight is contained in an amount of 85 to 15% by weight, the bifunctional diacrylate or bifunctional dimethacrylate (A) being expressed by: CH2=CR2CO−(R1O)n−OCOCR2=CH2  (1) wh

Abstract: The present invention provides a resin of the formula: where R1, R2, R3, x and y are those defined herein. The present invention also provides methods for using the above described resin to inhibit reflection of light from the lower layer of a wafer substrate during a photoresist pattern formation process.

Abstract: A resin composition useful in the fabrication of circuit boards comprises (i) 1˜15 W % of bismaleimide modified by barbituric acid (BTA) and its derivatives; and (ii) 20˜50 wt % of polyphenylene ether (PPE) chain-broken in a phenol resin; wherein the phenol resin is terpene phenol resin or dicyclopentadiene phenol resin. Other additives, such as curing agent, catalyst or inorganic particle additive can be added as well, based on requirements. According to the invention, terpene novolac resin and initiator (peroxide) are added in polyphenylene ether so that molecules are rearranged to form a PPE resin having lower molecular weight and higher crosslinking density. Furthermore, BMI/epoxy resin/PPE are combined in different weight percentages. Semi-interpenetrating polymer network structures are thus formed. Consequently, Tg and resistances both to heat and solvent of the resin are increased.

Abstract: A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating free radicals upon heating, (2) hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) a radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material.

Abstract: A curable coating composition is disclosed comprising a resinous binder comprising (a) a reaction product of an epoxy-containing polymer with a compound containing phosphorus acid groups, the reaction product having reactive functional groups, and (b) a curing agent having functional groups reactive with the functional groups of (a). An electroconductive pigment is dispersed in (a) such that the weight ratio of the electroconductive pigment to (a) plus (b) is within the range of 0.5 to 9.0:1. When the curable coating composition is deposited and cured on a metal substrate, the cured coating is weldable.

Abstract: A method of preparing a capped poly(arylene ether) resin includes reacting a capping agent with a blend of two or more poly(arylene ether) resins having different intrinsic viscosities. Cured compositions prepared from these capped poly(arylene ether) resins exhibit improved balances of stiffness, toughness, and dielectric properties compared to compositions with two or more separately capped and isolated poly(arylene ether) resins.

Abstract: This invention relates to an aromatic oligomer represented by the following formula (1): (A—F)n—A   (1) wherein A is a unit comprising (a) 30-90 wt % of a bicyclic or tricyclic aromatic compound and (b) 10-70 wt % of a phenol, F is methylene or a mixture of methylene and —CH2OCH2— and n is a number of 1-100. The aromatic oligomer is obtained by and reaction of a polycyclic aromatic compound such as naphthalene and benzothiophene, a phenol and formaldehyde compound in the presence of an acid catalyst. The aromatic oligomer is odorless and useful for various applications. In particular, when incorporated in rubber or resin, the aromatic oligomer can perform execellently as a tackifier in a wide temperature range or perform excellently as a vibration damping agent.

Abstract: The present invention relates to novel novolac resins obtained by coupling at least one aromatic compound (A) comprising at least two hydroxyl groups and at least one aldehyde (B) in the presence of an acid catalyst and in the presence of water and/or an organic solvent, followed by a step of alkylating the coupling resin thus obtained with at least one unconjugated diene (C), preferably containing no indene. These novolac resins are advantageously used in vulcanized and crosslinked elastomeric compositions since their viscosity, which is lower than that of the resins of the prior art, allows them to be handled easily. They are also used as adhesion promoters for improving the adhesion of rubber to reinforcing materials such as organic fibres made in particular of rayon, polyesters, polyamides or aramids, and metal cords made of steel, in particular brass steel or galvanized steel.

Abstract: A crosslinking agent having reactive benzoxazine groups is provided. The crosslinking agent is an ungelled reaction product of aminoplast resin, a polyhydric aromatic compound, and at least one compound having active hydrogen groups reactive with aminoplast resin which is selected from at least one of: (i) compounds having the structure (I): where X is aromatic; R1, R2, and R3 each independently represents H, (cyclo)alkyl having from 1 to 12 carbon atoms, aryl, alkaryl, aralkyl, or an active hydrogen-containing group; (ii) compounds having structure (II) or (III): where R′ and R″ each independently represents an aromatic group or an alkyl group having 1 to 12 carbon atoms; and (iii) compounds different from (i) and (ii) and having a melting point of at least 80° C. Curable powder coating composition and multilayer composite coating compositions are also provided, as well as coated substrates.

Abstract: The flameproof thermoplastic resin composition of the present invention comprises (A) 40 to 95 parts by weight of a rubber modified styrene-containing resin composed of (a1) 20 to 100% by weight of a styrene-containing graft copolymer resin including 18 to 50% by weight of acrylonitrile in the copolymer excluding rubber; and (a2) 0 to 80% by weight of a styrene-containing copolymer resin containing 18 to 50% by weight of acrylonitrile; (B) 5 to 60 parts by weight of polyphenylene ether resin; (C) 2 to 40 parts by weight of a styrene-containing copolymer or styrene-containing graft copolymer resin containing 5 to 18% by weight of acrylonitrile per 100 parts by weight of the sum of (A) and (B); and (D) 5 to 30 parts by weight of an aromatic phosphoric acid ester compound per 100 parts by weight of the sum of (A) and (B).

Abstract: The use of methylpropane-1,3-diol mono(meth)-acrylate to prepare oxidatively and/or thermally curable coating compositions, adhesives, and sealing compounds.

Abstract: An epoxy resin composition comprises a) a polyepoxide, b) a cure inhibitor of boric acid, a Lewis acid derivative of boron, an alkyl borane, a mineral acid having a nucleophilicity value “n” of greater than zero and less than 2.5, or an organic acid having a pKa value of 1 or more, a catalyst which can be complexed with the cure inhibitor, and c) more than 30 parts by weight per 100 parts by weight of polyepoxide of a cross-linker such as a polycarboxylic acid or anhydride including a copolymer of an ethylenically unsaturated anhydride and a vinyl compound, or a hydroxy-functional compound such as a copolymer of styrene and hydroxystyrene.

Abstract: A thermosetting resin composition for carbon fiber reinforced composite materials of the present invention chiefly comprises (A)2 thermosetting resin such as epoxy resin and a curing agent, and (B)2 compound containing one functional group which can react with thermosetting resin (A) or its curing agent, and a moiety selected from the following formulae (1) to (4) Furthermore, the present invention also relates to a prepreg formed by impregnating reinforcing fiber with the aforesaid resin composition and to carbon fiber reinforced composite materials comprising reinforcing fiber and a cured aforesaid thermosetting resin composition.

Abstract: A polymer in the form of a novolac resin is provided wherein the novolac resin has a weight average molecular weight of 1,000-30,000, some of the hydrogen atoms of hydroxyl groups are replaced by 1,2-naphthoquinonediazidosulfonyl ester groups, and some of the hydrogen atoms of the remaining hydroxyl groups are replaced by substituted acetal groups and/or crosslinked within a molecule or between molecules with crosslinking groups having C—O—C linkages. The polymer is formulated into a positive resist composition having improved uniformity, sensitivity, resolution and pattern profile as well as improved heat resistance, film retention, substrate adhesion and storage stability.

Abstract: The present invention relates to thermoset epoxy resin waterproofing membranes for structures such as roofs comprising: (a) one or more epoxy resin(s) having an average of at least 1.5 epoxy groups per molecule; (b) a liquid amine terminated polyamide prepared by reacting at least one C18-50 dicarboxylic acid and an aminoalkylpiperazine in a ratio of moles of aminoalkylpiperazine to equivalents of carboxyl group in the acid of greater than 0.75:1; (c) one or more optional polyamine(s); (d) one or more optional filler(s); and (e) one or more optional modifying resin(s) wherein the tensile modulus of the thermoset epoxy waterproofing membranes is less than 200,000 psi and the tensile elongation of the thermoset epoxy waterproofing membranes is greater than 20%.

Abstract: The present invention provides a flame retardant phenol resin material which includes a phenol condensate, wherein a poly-aromatic compound obtained by a reaction of phenols (A) to aromatics (B) except for phenols and a heterocyclic compound (C) including nitrogen as heteroatom are condensed via aldehydes (D), and also provides a flame retardant epoxy resin material which includes an epoxy resin obtained by glycidyl-etherification of at least a part of phenolic hydroxyl groups of a poly-aromatic compound obtained by a reaction of phenols (A) to aromatics (B) except for phenols and a heterocyclic compound (C) including nitrogen as heteroatom are condensed via aldehydes (D).

Abstract: An acetylide-form propargyl-containing resin composition for cationic electrocoating, which comprises a resin having a skeleton of epoxy resin and has a number average molecular weight of 500 to 20,000, and which contains, per 100 grams of the resin composition solids, 5 to 400 millimoles of sulfonium group and 10 to 495 millimoles of propargyl group, the total content of the sulfonium and propargyl groups being not more than 500 millimoles per 100 grams of the resin composition solids, said propargyl group being partly in the form of an acetylide. This resin composition may further contain unsaturated double bond.

Abstract: A crosslinking agent having reactive benzoxazine groups is provided. The crosslinking agent is the ungelled reaction product of a polyhydric aromatic compound and an aminotriazine compound having one or less non-alkylated NH bond per triazine ring. The crosslinking agent is essentially free of hydroxyl functionality and has a glass transition temperature of at least 10° C. Additionally provided is a method for preparing the crosslinking agent. Also provided is a curable powder coating composition including a solid particulate, film-forming mixture of a polymer having functional groups reactive with benzoxazine groups and the crosslinking agent. Further provided is a multilayer composite coating composition having a base coat layer deposited from a film-forming base coating composition and a topcoat layer deposited from the curable powder coating composition. Coated substrates are also provided.

Abstract: Disclosed is a method of inhibiting the formation of scale on reactor surfaces in contact with a polymerizing vinyl monomer comprising contacting said monomer with a terpolymer which comprises the condensation reaction product of (A) an aromatic compound that contains the group where Q is OR or SR and R is hydrogen, alkyl from C1 to C15, or aryl, alkaryl, or aralkyl from C6 to C15: (B) about 0.1 to about 10 moles of a carbonyl compound per mole of said aromatic compound; and (C) about 0.1 to about 10 moles of a thiourea per mole of said aromatic compound.

Abstract: A polymer in the form of a novolac resin is provided wherein the novolac resin has a weight average molecular weight of 1,000-30,000, some of the hydrogen atoms of hydroxyl groups are replaced by 1,2-naphthoquinonediazidosulfonyl ester groups, and some of the hydrogen atoms of the remaining hydroxyl groups are replaced by substituted acetal groups and/or crosslinked within a molecule or between molecules with crosslinking groups having C—O—C linkages. The polymer is formulated into a positive resist composition having improved uniformity, sensitivity, resolution and pattern profile as well as improved heat resistance, film retention, substrate adhesion and storage stability.

Abstract: An acetylide-form propargyl-containing resin composition for cationic electrocoating, which comprises a resin having a skeleton of epoxy resin and has a number average molecular weight of 500 to 20,000, and which contains, per 100 grams of the resin composition solids, 5 to 400 millimoles of sulfonium group and 10 to 495 millimoles of propargyl group, the total content of the sulfonium and propargyl groups being not more than 500 millimoles per 100 grams of the resin composition solids, said propargyl group being partly in the form of an acetylide. This resin composition may further contain unsaturated double bond.

Abstract: A method of making a thermally-removable encapsulant by heating a mixture of at least one bis(maleimide) compound and at least one monomeric tris(furan) or tetrakis(furan) compound at temperatures from above room temperature to less than approximately 90° C. to form a gel and cooling the gel to form the thermally-removable encapsulant. The encapsulant can be easily removed within approximately an hour by heating to temperatures greater than approximately 90° C., preferably in a polar solvent. The encapsulant can be used in protecting electronic components that may require subsequent removal of the encapsulant for component repair, modification or quality control.

Abstract: A resin matrix with resistances to alkali and acid such as a fluorene-containing epoxy acrylate and/or a benzocyclobutene resin includes at least any one of insulative organic particles and insulative composite particles having an organic component and an inorganic component with the total amount of these particles being in the range of 5-50% by volume, wherein the insulative organic particles and the organic component of the insulative composite particles are allowed to be corroded by either alkali or acid, and wherein not less than 90% by volume of the insulative organic particles and insulative composite particles have a particle diameter in the range of 1-20 micrometers.

Abstract: An acetylide-form propargyl-containing resin composition for cationic electrocoating, which comprises a resin having a skeleton of epoxy resin and has a number average molecular weight of 500 to 20,000, and which contains, per 100 grams of the resin composition solids, 5 to 400 millimoles of sulfonium group and 10 to 495 millimoles of propargyl group, the total content of the sulfonium and propargyl groups being not more than 500 millimoles per 100 grams of the resin composition solids, said propargyl group being partly in the form of an acetylide. This resin composition may further contain unsaturated double bonds.

Abstract: There are provided a resin composition for copper-clad laminates which comprises the following ingredients: (a) an epoxy resin mixture comprising an epoxy resin and a hardener therefor, (b) a maleimide compound, and (c) at least one solvent-soluble aromatic polymer having at least one functional group polymerizable with the epoxy resin or the maleimide compound, and also provided a resin-coated copper foil, a multilayered copper-clad laminate and a multilayered printed circuit board each using the resin composition.

Abstract: A multilayer coating film which comprises: a cationic electrodeposition coat formed from an epoxy-based cationic electrocoating composition containing 5 to 300 millimoles of sulfonium group and 50 to 2,000 millimoles of carbon-carbon unsaturated bond per 100 g of the resin solid content, with carbon-carbon triple bond accounting for at least 15% of said carbon-carbon unsaturated bond; and a top coat formed thereon.

Abstract: A formulation which contains:(1) the nucleophilic addition adduct of an imidazole and an unsaturated compound, which contains more than one imidazole moiety per molecule; and(2) an epoxy resin,is characterized in that fewer than 50 equivalent percent of the imidazole moieties in the adduct are neutralized with acid. The adduct may serve as a curing catalyst in high or low-temperature curing. The formulation is made and applied as a powder coating for coatings or as a matrix resin in laminates. It may be used in solvent-borne or liquid systems.

Abstract: A thermally curable adhesive composition that includes a fluxing agent that also acts as an adhesive is provided. The composition includes: (a) a fluxing agent represented by the formula RCOOH, wherein R comprises a moiety having two or more carbon-carbon double bonds wherein in one embodiment, at least one is within an acrylate or methacrylate group, and which may further contain at least one aromatic moiety; (b) a carboxylic acid neutralizing agent; (c) optionally, a crosslinkable diluent; (d) optionally, a source of free radical initiators; and (e) optionally, a resin. The composition can be applied directly onto the surface(s) of devices that are to be joined electrically and mechanically. These devices include, printed circuit substrates, connectors, components, cables, and other electrical devices having metallization patterns to be soldered together by means of a solder-bumped pattern on one or both surfaces.

Abstract: There are described a self-adhesive prepreg on the basis of a resin-impregnated fibrous supporting material carrying on at least one surface a layer with an increased ratio of resin to supporting material, and the use thereof for the production of sandwich structures.

Abstract: The present invention relates to binder compositions containingA) 40 to 95 parts by weight of OH-functional graft copolymer resins prepared by copolymerizinga) 0.1 to 10 parts by weight of polybutadienes containing at least 20% of 1,2-vinyl groups,b) 5 to 30 parts by weight of aliphatic .alpha.-olefins,c) 0.1 to 35 parts by weight of glycidyl esters of .alpha.-alkylalkane-monocarboxylic acids,d) 10 to 70 parts by weight of unsaturated, aromatic monomers,e) 5 to 60 parts by weight of hydroxyalkyl esters of acrylic and/or methacrylic acid having primary hydroxyl groups,f) 0 to 50 parts by weight of (cyclo)aliphatic esters of acrylic and/or methacrylic acid,g) 0.1 to 20 parts by weight of .alpha.,.beta.

Abstract: Disclosed is a phenol resin composition containing a specific triazines-modified novolak phenol resin comprising phenols, triazines and aldehydes, and a method for producing the triazines-modified novolak phenol resin comprising the steps of as a first step reaction, successively effecting processes (i), (ii) and (iii), wherein said process (i) is a process for adjusting a pH of a system of a mixture of phenols, triazines and aldehydes in a range of 5 to 10, said process (ii) is a process for reacting said mixture under the condition that the aldehydes are not volatilized and said process (iii) is a process for removing a reaction water in the system; then as a second step reaction, successively effecting said processes (ii) and (iii) at a higher temperature than that of the first step reaction; thereafter as a third step reaction, successively effecting said processes (ii) and (iii) at a higher temperature than that of the second step reaction; and further, depending upon a necessity, repeating the second st

Abstract: A substantially ester-free, acid-functional thiol-functional resin is prepared via the reaction of an epoxy compound with a thiolacetic acid in the presence of an amine catalyst and heat to form a thioacetate derivative which is hydrolyzed to yield an ester-free, .beta.-hydroxy thiol-functional resin. The .beta.-hydroxy thiol-functional resin can then be reacted with a material capable of insert a group conferring aqueous-base developability such as a cyclic anhydride.