Abstract: A process for crosslinking a polymer containing hydroxyl groups which process comprises:(a) forming a mixture of said polymer and crosslinking amount of a poly(alpha, beta-alkenylcarboxylate), and(b) maintaining the mixture at conditions under which the polymer cures by reaction of the hydroxyl groups of the polymer with the poly(alpha, beta-alkenylcarboxylate) to produce a crosslinked polymer.

Abstract: Anhydride compounds which contain at least one rodlike mesogenic moiety and at least two anhydride groups per molecule, wherein each of said aromatic anhydride groups is linked to the mesogen via an ester linkage are prepared. These anhydride compounds are useful in curing epoxy resins to provide the cured products with one or more improved properties.

Abstract: A thermal resistance resin dust obtained by a process which comprisesa step of preparing a composition comprising(I) an aromatic hydrocarbon-formaldehyde resin-modified novolak type epoxy resin and(II) a cyanate ester resin composition comprising (a) polyfunctional cyanate esters, prepolymers of said cyanate ester, or prepolymers of said cyanate ester and an amine; or (a) in combination with (b) a monofunctional or polyfunctional maleimide, a prepolymer of said maleimide or a prepolymer of said maleimide and an amine, andoptionally (III) an inorganic filler with cleavage property,a step of curing the composition at a final curing temperature of not less than 200.degree. C. anda step of grinding the cured product, is disclosed.

Abstract: The invention provides epoxy resin compounds for manufacturing prepregs and composite materials, which can be obtained inexpensively and have good processibility, and provide--without having to add flameproofing agents--virtually inflammable molded materials with a high glass transition temperature. The epoxy resin compounds contain the following constituents:(A) an aromatic and/or heterocyclic polyepoxide resin that is free of phosphorous, optionally in a mixture with an aliphatic epoxy resin;(B) an epoxy-group-containing phosphorous compound and(C) an aromatic polyamine as a curing agent.

Abstract: A poly(ethylene 2,6-naphthalate) film obtained by stretching a poly(ethylene 2,6-naphthalate) sheet containing cross-linked polymer particles which have at least one ethylene glycol unit and have an average particle size of from 0.05 to 3 .mu.m and a spherical ratio of from 1.0 to 1.1, wherein a deformation ratio of the cross-linked polymer particles in the stretching is from 1.2 to 3.0, has excellent runnability, abrasive resistance and strength.

Abstract: Sulfonium compounds of formula 1 or 2 ##STR1## wherein R is a mononuclear cycloalkyl radical containing 3 to 8 ring carbon atoms or a mononuclear cycloalkyl radical which contains 3 to 8 ring carbon atoms and to which at least one further ring containing carbon atoms is fused,X is a non-nucleophilic anion, andZ is a single bond, an oxygen or sulfur atom, a group of formula >S.sup..sym. --R X.sup..crclbar., wherein R and X are as defined above, or is >C.dbd.O or a methylene bridge,which sulfonium compounds are either unsubstituted or carry one or more than substituent selected from the group consisting of halogen, nitro, C.sub.1 -C.sub.8 alkyl, phenyl, hydroxyl, C.sub.1 -C.sub.8 alkoxy, phenoxy, benzyloxy, alkoxycarbonyl containing 1 to 4 carbon atoms in the alkoxy moiety or acyl of 1 to 12 carbon atoms.

Abstract: A binder mixture containing lignin or lignins with reactive groups and phenol-novolac in a weight ratio of 95:5 to 50:50 useful for the production of non-woven fabrics and wood fiber materials.

Abstract: Modified cyclopentadiene resins comprising essentiallya) 20 to 80% by weight of cyclopentadiene compounds,b) 1 to 40% by weight of natural resin acids andc) 31 to 70% by weight of phenol resins.These compounds are suitable as binder resins for printing inks. They are distinguished by excellent compatibility with aromatics-free mineral oils and with vegetable oils.

Abstract: Epoxy resin compositions for sealing semiconductor elements are disclosed and include an epoxy resin, a maleimide-modified siloxane compound represented by the formula (1) and an allylphenol-novolac resin represented by the formula (2) as a curing agent, and demonstrate low stress, high heat resistance and moldability. ##STR1## wherein, R.sub.1 denotes a methylene group a phenylene group or a substituted phenylene group,R.sub.2 denotes a methyl group, a phenyl group or a substituted phenyl group,n denotes 1 when R.sub.1 denotes phenylene or substituted phenylene groups, or 3 or 4 when R.sub.1 denotes a methylene group,m denotes an integer of from 1 to 100,l denotes an integer of from 1 to 100, and.kappa. denotes an integer of from 1 to 100.

Abstract: Polymer modified adducts are prepared by (A) reacting (1) an epoxy resin having an average of more than one vicinal epoxide group with (2) a compound containing an average of two or more hydrogen atoms reactive with an epoxide group; and (B) partially vinylizing reacting the product from step (A); and (C) polymerizing the partially vinylized product from step (B) with (3) a polymerizable ethylenically unsaturated monomer; with the proviso that at least one of the components (1), (2) or (3) contain one or more mesogenic or rodlike moieties. These adducts are useful as epoxy resin curing agents.

Abstract: The present invention is directed to a phenolic resin composition suitable for use in bonding refractory materials, such as sand, in the production of foundry moulds and cores and also in treating subterranean formations. The phenolic resin composition comprises an esterified phenolic compound, a phenolic novolak resin and a base, which will react to provide final cure in the presence of water or other polar solvent. The composition, once reacted, will bond granular refractory materials. The esterified phenolic compound contains at least one esterified methylol group positioned ortho or para to a phenolic hydroxyl group or an esterified phenolic hydroxyl group. Included within the invention are anhydrous precursors to the reactive phenolic resin composition and also foundry moulding compositions which incorporate the reactive phenolic resin compositions. Other embodiments of the invention include methods for making foundry moulds and cores and methods for curing the reactive phenolic resin composition.

Abstract: A thermosetting resin composition contains (A) a mixture of an imide compound having an allyl-free maleimide group and an imide compound having an allyl-containing imide group, (B) an epoxy resin, (C) a phenolic resin, and optionally, (D) an aromatic polymer/organo-polysiloxane copolymer. Component (B) and/or (C) includes a compound containing a naphthalene ring having a double bond conjugated with an aromatic ring. The composition is easily workable and well adhesive and cures to products having improved mechanical strength, hot-water resistance, low thermal expansion, and minimized water absorption.

Abstract: A composition comprising a 1,2-dialkylidenecyclobutane such as 1,2-dimethylenecyclobutane, a polyimide such as a bismaleimide, an epoxy resin and a curing agent for the epoxy resin can be thermally cured to a tough polymer blend having a high glass transition temperature.

Abstract: A phenolic resin molding compound comprising (1) a resol type phenolic resin, (2) a thermoplastic resin and (3) a resin forcing fiber can be compression molded into a shaped article with attractive appearance and high dimensional accuracy.

Abstract: Disclosed is a phenolic resin molding material which is mainly composed of (1) 25-55 parts by weight of a phenolic resin containing 60% by weight or more of a resol-type phenolic resin, (2) 2-10 parts by weight of a partially crosslinked NBR, and (3) 35-70 parts by weight of an inorganic filler, on the basis of 100 parts by weight in total of these components.

Abstract: Storage-stable suspension comprised of a solid or liquid epoxy resin hardener and a solid or liquid toughener suspended therein is distinguished by excellent homogeneous dispersion of the toughener in the epoxy resin hardener and are suitable for preparing suspensions of curable epoxy resin compositions.

Abstract: A process for manufacturing a high glass transition temperature printed circuit board comprising blending a modified bismaleimide resin into a modified epoxy resin is disclosed. Particularly the material is manufactured by blending a bismaleimide resin reacted with barbituric acid and its derivative thereof and an epoxy resin with an oxazolidone ring resulting from the reaction of a polyisocyanate and an epoxy resin modified with a secondary diamine and followed by curing. The resultant product has a high glass transition temperature, a good adhesion, flame retardancy, and a low bromine content.

Abstract: Disclosed is a heat-resistant resin composition prepared by mixing a resin composition (A) and polyamine (B), followed by heating the mixture for the hardening, said composition (A) being prepared by heating a mixture of (a) polymaleimide resin represented by a general formula: ##STR1## where R.sub.1 is an organic group having a valency of n, Xa and Xb are the same or different monovalent atoms or groups selected from the group consisting of hydrogen atom, halogen atom and organic group, and n is an integer of 1 to 4, (b) an epoxy resin having at least two epoxy groups in the molecule, and (c) a compound having one alcoholic or phenolic OH group and at least one epoxy group in the molecule.

Abstract: Novel polymeric compositions are provided for polyamide fibers or fibers having terminal amino groups that impart stain resistance and are resistant to discoloration.

Abstract: A thermosetting resin composition contains (A) an imide compound having a maleimide group, (B) an epoxy resin, (C) a phenolic resin, and optionally, (D) an aromatic polymer/organopolysiloxane copolymer wherein component (B) and/or (C) has a double bond conjugated with an aromatic group and component (B) and/or (C) has a naphthalene ring. The composition is easily workable and cures to products having improved adhesion, heat resistance, low thermal expansion, and low water absorption.

Abstract: A resin composition comprising a polymeleimide compound having two or more maleimide groups in one molecule, a phenol novolac resin of which phenolic hydroxyl groups are epoxidized and allyl-etherified and, as an optional ingredient, a curing agent, or a resin composition comprising a polymaleimide compound having two or more maleimide groups in one molecule, a phenol novolac resin of which phenolic hydroxyl groups are allyl-etherified and an epoxy resin; and a heat resistant composite material comprising cured product of said resin composition as its matrix phase and containing a fiber as its reinforcing material.

Abstract: bis(Aminophenoxy)-alpha-substituted stilbenes are prepared by reacting a dihydroxy-alpha-substituted stilbene with a halonitrobenzene in the presence of a basic acting substance such as potassium carbonate and hydrogenating the resulting bis(nitrophenoxy)-alpha-substituted stilbene to convert the nitro groups to amino groups. These compounds are useful as curing agents for epoxy resins.

Abstract: This invention relates to a composition suitable for use in friction elements and comprises a frictional material and a binder, the latter being a blend of a polyvinyl alkyl ether with a phenolic resin and optionally a rubber.Compared with conventional friction elements based on organic polymers, the elements produced using the compositions of the present invention shows increases in flexural strength of up to 50% with no loss in wear or friction performance.

Abstract: Adhesive compositions of a selected class of epoxy resins combined with a selected class of carboxylic group-containing acrylonitrile-butadiene and methacrylonitrile-butadiene copolymers, maleimide derivatives and an imidazole compound. The resultant compositions are electrically insulative, thermally resistant, highly capable of fabrication at low pressure and storage stable.

Abstract: A thermosetting resin composition contains (A) an imide compound having a maleimide group, (B) an epoxy resin, (C) a phenolic resin, and optionally, (D) an aromatic polymer/organopolysiloxane copolymer. Component (B) and/or (C) includes a compound containing a naphthalene ring having an allyl group and preferably, a compound containing a naphthalene ring and a double bond conjugated with an aromatic ring. The composition is easily workable and cures to products having improved heat resistance, low thermal expansion, and low water absorption.

Abstract: The present invention relates to nonlinear optical materials comprising aminoaryl hydrazones and to nonlinear optical polymeric compositions containing recurring covalently bonded moieties derived from the aminoaryl hydrazones of the invention. The polymeric compositions of the present invention have high glass transition temperatures and exhibit stable nonlinear optical activity at high temperatures over a period of time.

Abstract: Curable coating compositions are provided containing an amine group containing polyepoxide resin, an acetoacetate containing polyester having a weight average molecular weight of at least 1000, and a polyacrylate containing material. The amine group containing polyepoxide can be modified with a ketone and/or an aldehyde to form a ketimine and/or an aldimine containing polyepoxide. The compositions are useful as coatings, particularly as ambient or low temperature curable automotive refinish primer coatings having good corrosion resistance, adhesion to both substrate and other organic coatings, sandability and pot-life.

Abstract: Novel cyclic imino ether compositions containing one or more mesogenic moieties, when polymerized, result in products having improved properties.

Abstract: Curable epoxy resins are toughened with statistical monofunctional carboxyl, amine or epoxy terminated reactive polymers and have low viscosities before cure thereby making them useful in a wide range of applications. The cured epoxy resin systems which are modified by the statistical monofunctional reactive polymers have physical properties, such as adhesion and elongation, generally equal to or better than those of cured epoxy resin systems modified with statistical difunctional reactive polymers. A process of preparation for the modified epoxy resin systems of the present invention includes admixing an epoxy resin with a statistical monofunctional carboxyl, amine, or epoxy-terminated reactive polymer in the presence of a curing agent and reaction therewith to form the toughened, cured epoxy resin system.

Abstract: Reinforced polymer blends with improved mechanical properties are produced from a blend of a polyketone polymer and an uncured phenolic-based novolac resin, reinforced with glass fibers.

Abstract: An epoxy resin composition useful as a molded article is curable with a combination of curing agents including diamino-alpha-alkylstilbenes and other curing agents wherein the epoxy resin and/or the other curing agents can contain rodlike mesogenic moieties.

Abstract: The present invention is directed to an epoxy-containing polymeric material having nonlinear optical properties, particularly a glycidyl amine polymer, and a process for making the nonlinear optical (NLO) epoxy-containing polymeric material including poling the polymeric material under high voltage at elevated temperature for a period of time to bring about orientation of the nonlinear optical functionalities in the polymer. The polymers have enhanced thermal stability and good NLO properties.

Abstract: An elastomer-modified phenolic composition is provided which is an reaction product of a phenolic compound and about 5 to about 35 weight percent, based on the total weight of the elastomer-modified phenolic compound, of a functionalized elastomer. Further, there is provided a composition comprising an epoxy resin and a curing agent for the epoxy resin comprising the elastomer-modified phenolic composition. The use of the elastomer-modified phenolic curing agent permits the preparation of low-viscosity powder coating formulations for impact-resistant coatings.

Abstract: A thermosetting resin designated a "APT" resin is produced by a two-step procedure in which a substituted aromatic compound, preferably diphenyl ether is reacted with formaldehyde to produce an oligomeric backbone, followed by further reaction with a phenol to provide pendant phenolic groups. Finally, the resulting polymer is cyanated with a cyanogen halide.

Abstract: A radiation sensitive material suitable for the production of radiation sensitive plates for lithographic printing plate manufacture comprises a polymer having appendent azide-substituted aromatic ester groups and sulphonyl urethane groups. The radiation sensitive compound is produced by a process in which some hydroxyl and/or epoxide groups of a polymer are reacted with an azide substituted carboxylic acid or ester forming derivative thereof, and some hydroxyl groups are reacted with a sulphonyl isocyanate.

Abstract: A thermosetting resin composition is provide, which contains a compound of ##STR1## wherein substituents R.sub.1 -R.sub.6 each represents a hydrogen atom or a saturated alkyl group having 1-6 carbon atoms, substituents R.sup.7 -R.sup.12 each represents a hydrogen atom, a saturated alkyl group having 1-4 carbon atoms or an alkoxy group having 1-4 carbon atoms, X.sub.a -X.sub.e each represents a hydrogen atom, a chlorine atom or a bromine atome, and the average repeating unit number n denotes a numeral from 0 to 5, and a polyamide compound having two or more maleimide groups and, if desired, a compound of ##STR2## wherein R.sub.1 and R.sub.2 each represents a methyl group or a phenyl group, and R.sub.3 represents a hydrogen atom or a functional group containing an amino group, a glycidyl group or an alicylic epoxy group, l denotes a numeral in the range of 0-500, and m denotes a numeral in the range of 1-500, or ##STR3## wherein R.sub.1 and R.sub.2 each represents a methyl group or a phenyl group, and R.sub.

Abstract: A modified epoxy resin or compound of the formula: ##STR1## wherein A is the backbone reside of a glycidyl ether epoxy resin with removal of the glycidyloxy groups; R.sup.1 and R.sup.2 are independently a hydrogen atom or C.sub.1 -C.sub.12 alkyl; R.sup.3 is a glycidyl group; and n is an integer of greater than 1. A method for producing the modified epoxy resin is also disclosed.

Abstract: A curable polyimide resin is blended with (a) an organic silicon compound having a functional group selected from an epoxy group and an amino group or (b) a copolymer of an aromatic polymer and an organic silicon compound. The resulting polyimide resin composition can be cured without inducing a crack. It is suitable for the encapsulation of semiconductor devices as well as for molding and powder coating.

Abstract: A stain resistant composition for fibers having polyamide linkages prepared by polymerizing an .alpha.-substituted acrylic acid or ester in the presence of a sulfonated aromatic formaldehyde condensation polymer, or by polymerization of a sulfonated hydroxyaromatic ester of an .alpha.-substituted acrylic acid or acrylic acid, and methods for making and applying the composition.

Abstract: Thermally stable bisimido polymers, devoid of diamine component and well adapted for the production of laminates, are prepared by copolymerizing (a) an N,N'-bismaleimide with (b) an acrylate comonomer, e.g., a novolak epoxy (meth)acrylate, in the presence of a catalytically effective amount of (c) an imidazole compound, and, optionally, (d) a chlorinated or brominated epoxy resin, or admixture thereof with a non-chlorinated or non-brominated epoxy resin.

Abstract: A miscible polymer blend comprising polyketone and phenolic-based novolac polymers is provided. These blends have as a primary advantage a Tg which can be manipulated so as to produce desirable properties. A process for producing these blends and articles of manufacture produced therefrom are also disclosed.

Abstract: An epoxide resin having the formula I: ##STR1## in which R.sup.1 to R.sup.4 are the same or different and each is hydrogen or C.sub.1 -C.sub.12 alkyl; R.sup.5 to R.sup.12 are the same or different and each is C.sub.1 -C.sub.12 alkyl or alkenyl or the glycidyl residue such that at least two R.sup.5 to R.sup.12 groups are glycidyl residues; and R.sup.13 to R.sup.20 are the same or different and are hydrogen, halogen C.sub.1 -C.sub.12 alkyl or alkenyl.

Abstract: The present invention provides a curable resin coating composition consisting essentially of:(i) a resin (A) containing .alpha.,.beta.-unsaturated carbonyl group and primary and/or secondary hydroxyl group, or(ii) a mixture of a resin (B) containing .alpha.,.beta.-unsaturated carbonyl group and a resin (C) containing primary and/or secondary hydroxyl group, and(iii) at least one curing catalyst selected from the group consisting of alkali metal alkoxides, metal hydroxides, organic acid salts of metals, quaternary ammonium hydroxides, quaternary phosphonium hydroxides, tertiary sulfonium hydroxides and organic acid salts of these onium hydroxides.

Abstract: A polymeric material used in laminates with metal-comprises an interpenetrating polymer network composed of a cyclic moiety-containing pollyallyl compound optionally with an aromatic difunctional compound (co)polymerized and cross-linked in the presence of a free radical initiator, and an epoxy resin cross-linked with a polyhydric phenol.

Abstract: A modified epoxy resin of the general formula (I) is prepared by dissolving an epoxy resin in a solvent, adding the mixture to allyl magnesium halide at -70.degree. C. under a nitrogen atmosphere, and removing the solvent and salts from the resultant product. The modified epoxy resin is useful for epoxy maleimide resin compositions as a heat resistance enhancer. An epoxy resin composition for sealing semiconductor elements comprising the modified epoxy resin as a heat resistance enhancer is an amount of from 0.1 to 30% by weight, based on the total weight of the composition, is also provided. ##STR1## wherein, R represents H or C.sub.1 to C.sub.10 -alkyl group and m represents an integer of 0 to 100 and n represents an integer of 1 to 100.

Abstract: An epoxy resin having a propenyl group conjugated with an aromatic ring is heat resistant and is easily molded and cured into products having high strength and Tg. It is thus useful as a resin component or modifier.

Abstract: The invention relates to a process for manufacturing fiber-reinforced boards for the electrical industry by the use of epoxy resins and latent curing agents based on imidazole/acrylic acid reaction products based on the general formula ##STR1## wherein R, R.sup.1 and R.sup.2 are, independently of one another, H or a short-chain alkyl group having from 1 to 3 carbon atoms, R.sup.3 is a group of the formula--O--(CH.sub.2)m--R.sub.4 (II)wherein m is an integer between 2 and 6, R.sup.4 is H, --OH or --O--, and n is equal to the valence of R.sup.3.

Abstract: The invention relates to new compounds of the general formula ##STR1## where R is a divalent, optionally branched aliphatic, cyclic or alicyclic hydrocarbon group having from 2 to 10 carbon atoms; R.sup.1 and R.sup.2 are, independently of one another, hydrogen, or aliphatic or aromatic hydrocarbon groups; R.sup.3 is --COOH, --CN, --COOC.sub.2 H.sub.4 --OH, --CONH--NH.sub.2 or --COOR.sup.4 ; R.sup.4 is an aliphatic hydrocarbon group having from 1 to 4 carbon atoms; and n is 2 or 3.

Abstract: The invention relates to new compounds of the general formulas ##STR1## where R is a divalent, optionally branched aliphatic, cyclic or alicyclic hydrocarbon group having from 2 to 10 carbon atoms; R.sup.1 and R.sup.2 are, independently of one another, hydrogen, or aliphatic or aromatic hydrocarbon groups; R.sup.3 is --COOH, --CN, --COOC.sub.2 H.sub.4 --OH, --CONH--NH.sub.2 or --COOR.sup.4 ; R.sup.4 is an aliphatic hydrocarbon group having from 1 to 4 carbon atoms; and n is 2 or 3.

Abstract: A resin composition for composites which comprises as essential components(A) a three-bismaleimide mixture of N,N'-diphenylmethanebismaleimide, N,N'-tolylenebismaleimide, and N,N'-trimethylhexamethylenebismaleimide and(B) an allyl etherified substituted phenol novolak resin and/or allyl phenyl ether compound represented by the following general formula (I): ##STR1## wherein, X denotes a direct bond or the divalent radical --CH.sub.2 --, ##STR2## --O--, --S--, --SO.sub.2 --, ##STR3## or ##STR4## and R.sub.1 through R.sub.4 are the same or different in a molecule and denote each --CH.sub.3, --C.sub.2 H.sub.5, --CH(CH.sub.3).sub.2, --nC.sub.3 H.sub.7, --nC.sub.4 H.sub.9, --C(CH.sub.3).sub.3, ##STR5## --CH.sub.2 CH(CH.sub.3).sub.2, or --Br.