Mixed With Unsaturated Reactant Or Polymer Derived Therefrom Patents (Class 525/502)
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Patent number: 5908943Abstract: Epoxy-containing compounds which are essentially free of organic halides are prepared by (I) reacting an allyl derivative of an active hydrogen-containing compound with (II) a peroxygen-containing compound. The epoxy-containing compounds are useful in coatings, castings, laminates etc.Type: GrantFiled: October 8, 1996Date of Patent: June 1, 1999Assignee: The Dow Chemical CompanyInventors: Andrew T. Au, J. Lowell Nafziger
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Patent number: 5907015Abstract: An adhesive composition based on a combination of a water soluble amino silane and a normally water-immiscible alkenyl-functional silane wherein the latter is hydrolyzed in the presence of the former under specified conditions to form a stable, water-dilutable aqueous composition having marked bonding affinity between polymers and solid substrates.Type: GrantFiled: May 19, 1997Date of Patent: May 25, 1999Assignee: Lord CorporationInventor: Frederick H. Sexsmith
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Patent number: 5895800Abstract: A resin composition comprising an epoxy group-containing cycloolefin resin and a crosslinking agent is provided. More specifically, a resin composition comprising an epoxy group-containing thermoplastic norbornene resin obtained by introducing epoxy groups into a thermoplastic norbornene resin, and as the crosslinking agent, a curing agent for epoxy resins or a photoreactive substance is provided. The resin composition is suitable for use as an insulating material.Type: GrantFiled: June 29, 1998Date of Patent: April 20, 1999Assignees: Nippon Zeon Co., Ltd., Fujitsu LimitedInventors: Hideaki Kataoka, Eiko Yuda, Shigemitsu Kamiya, Masahide Yamamoto, Yoshikatsu Ishizuki, Yasuhiro Yoneda, Daisuke Mizutani, Kishio Yokouchi
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Patent number: 5859155Abstract: There is provided an adhesive composition for use in a flexible printed circuit board, comprising:(a) an epoxy resin having substantially at least two epoxy groups per molecule;(b) at least one selected from carboxyl group-containing nitrile rubber and carboxyl group-containing hydrogenated nitrile rubber; and(c) a curing agent which comprises aromatic amine having substantially at least two primary amino groups per molecule (c1) and dicyandiamide (c2), the molar ratio of the aromatic amine (c1) to the dicyandiamide (c2) being 35/65.ltoreq.(c1)/(c2).ltoreq.99/1.Type: GrantFiled: May 19, 1997Date of Patent: January 12, 1999Assignee: Mitsui Chemicals, Inc.Inventors: Toshikazu Furihata, Akio Ikeda, Wataru Soejima
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Patent number: 5840814Abstract: The synthesis of star polymers having well-defined arms emanating from well-defined and readily controllable calix?n!arene (n=4 to 16) cores are described. The synthesis is particularly suitable for polyisobutylene and/or polysiloxane star polymers. The synthesis has been achieved using carbocationic and/or anionic ring-opening polymerization techniques to form polymer arms of desired molecular weights, then separately preparing the calixarene derivative core, and finally, linking the arms to the core by transesterification or hydrosilation.Type: GrantFiled: August 7, 1996Date of Patent: November 24, 1998Assignee: The University of AkronInventors: Istvan J. Majoros, Timea M. Marsalko, Joseph P. Kennedy
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Patent number: 5824415Abstract: The present invention relates to a decorative material which is excellent in surface properties such as scratch resistance and soil resistance and, at the same time, environmentally friendly. The decorative material meludes: a substrate of a thermoplastic resin; and a resin layer 3 provided on one side of the substrate through a heat-sensitive adhesive layer 2, the resin layer being formed of a resin of a copolymer, of ethylene with an .alpha.,.beta.-unsaturated carboxylic acid, which has been partially or completely neutralized with a metal ion.Type: GrantFiled: April 25, 1996Date of Patent: October 20, 1998Assignee: Dai Nippon Printing Co., Ltd.Inventors: Masahiro Kanki, Masaki Tsukada, Tadamichi Ishii
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Patent number: 5817736Abstract: Epoxy resin mixtures to produce prepregs and composites contain the following components:a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, made up of structural units derived from(a) polyepoxy compounds with at least two epoxy groups per molecule and(b) phosphinic acid anhydrides, phosphonic acid anhydrides or phosphonic acid half-esters;dicyandiamide and/or an aminobenzoic acid derivative as the hardener;an amino hardening accelerator.Type: GrantFiled: March 10, 1997Date of Patent: October 6, 1998Assignee: Siemens AktiengesellschaftInventors: Wolfgang von Gentzkow, Jurgen Huber
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Patent number: 5804664Abstract: The synthesis and characterization of novel linear polymers and multi-arm star polymers comprising polyisobutylene arms connected to a well-defined calixarene core are described. The synthesis has been achieved using the "core first" method wherein multifunctional calix?n!arene (where n=4 to 16) derivatives or their monofunctional analogues are used as initiators which, in conjunction with certain Freidel-Crafts acids as co-initiators, induce the living polymerization of isobutylene or a similar carbocationic polymerizable monomer to form star polymers or block copolymers. Novel initiators suitable for inducing the polymerization are also described.Type: GrantFiled: May 23, 1997Date of Patent: September 8, 1998Inventors: Joseph P. Kennedy, Istvan J. Majoros, Sunny Jacob
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Patent number: 5804680Abstract: A flame-resistant, UV-curable single-component reactive resin system comprises a phosphorus-containing acrylate, another unsaturated compound which can undergo free radical copolymerization with acrylates and a free radical initiator system.Type: GrantFiled: March 5, 1997Date of Patent: September 8, 1998Assignee: Siemens AktiengesellschaftInventors: Winfried Plundrich, Ernst Wipfelder
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Patent number: 5789482Abstract: Epoxy resin compositions which containa) at least one epoxy resin containing, on average, more than one 1,2-epoxy group per molecule,b) an anhydride hardener for the epoxy resin a),c) a toughener, andd) a compound containing two active hydrogen atoms which is capable of reacting with the epoxy resin a) have an outstanding toughness and are suitable as casting resins, laminating resins, moulding compounds, coating compounds and encapsulation systems for electrical and electronic components.Type: GrantFiled: September 28, 1992Date of Patent: August 4, 1998Assignee: Ciba Specialty Chemicals CorporationInventors: Sameer H. Eldin, Jurg Maurer, Robert Peter Peyer, Peter Grieshaber, Fran.cedilla.ois Rime
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Patent number: 5773509Abstract: A heat resistant resin composition comprising, as the main components,(A) 100 parts by weight of an organic solvent-soluble polyimide resin having a glass transition temperature of 350.degree. C. or less,(B) 5 to 100 parts by weight of an epoxy compound having at least two epoxy groups in one molecule, and(C) 0.1 to 20 parts by weight of a compound having an active hydrogen group which can react with the epoxy compound (B),a heat resistant film adhesive comprising, as the main components, the above components (A), (B) and (C), and a process for producing a heat resistant film adhesive by casting a solution of the above heat resistant resin composition on one side or both sides of a support.Type: GrantFiled: March 7, 1995Date of Patent: June 30, 1998Assignee: Sumitomo Bakelite Company LimitedInventors: Tatsuhiro Yoshida, Keizo Takahama, Syusaku Okamyo
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Patent number: 5759690Abstract: Epoxy resin mixtures for the production of prepregs and composites contain the following components:a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, made up of structural units derived from(a) polyepoxy compounds with at least two epoxy groups per molecule, and(b) phosphinic acid anhydrides, phosphonic acid anhydrides, or phosphonic acid half-esters;an amine-substituted aromatic sulfonic acid amide or hydrazide as a hardener;an amino hardening accelerator.Type: GrantFiled: March 10, 1997Date of Patent: June 2, 1998Assignee: Siemens AktiengesellschaftInventors: Wolfgang von Gentzkow, Jurgen Huber, Heinrich Kapitza, Wolfgang Rogler
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Patent number: 5756600Abstract: A composition useful as a sheet or bulk molding compound comprises a urethane-modified vinyl ester resin (A), or acid-addition vinyl ester resn (A') obtained by reacting the hydroxyl groups in (A) with a polybasic acid anhydride (B), and a double bond(s)-containing monomer (C), wherein (A) is prepared by reacting a vinyl ester resin (F) derived from the reaction of an epoxy resin (D) and an unsaturated monobasic acid (E), with a polyisocyanate (H) and, optionally, a hydroxyl group(s)-containing (meth)acrylate (G) in an isocyanate:hydroxyl groups equivalent ratio of from 0.01-1.2:1.Type: GrantFiled: August 9, 1996Date of Patent: May 26, 1998Assignee: Takeda Chemical Industries, Ltd.Inventors: Hiroya Okumura, Toshiaki Uchida, Koichi Akiyama, Kenichi Morita, Takashi Shibata
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Patent number: 5739185Abstract: The present invention provides a cationic electrodepositable coating composition comprising:?I! a polyurethane-modified epoxy resin-amine adduct obtained by a reaction of:(A) a polyurethane compound having one terminal isocyanate group in the molecule, obtained by a reaction of (a) a polyhydroxy compound having a number-average molecular weight of 50-8,000, (b) a polyisocyanate compound, and (c) a compound having one active hydrogen atom in the molecule,(B) a bisphenol type epoxy resin having at least two epoxy groups in the molecule, and(C) an active-hydrogen-containing amine compound, and ?II! a nonionic film-forming resin.Type: GrantFiled: August 16, 1995Date of Patent: April 14, 1998Assignee: Kansai Paint Co., Ltd.Inventors: Hidehiko Haneishi, Masanobu Kudoh, Koji Kamikado
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Patent number: 5728468Abstract: The invention relates to an organic phosphorus compound-containing which comprises an interpenetrating polymer network (IPN) produced by polymerizing free-radically polymerizable monomers comprising at least an allyl group-containing monomer and an epoxy resin.Type: GrantFiled: August 3, 1994Date of Patent: March 17, 1998Assignee: Akzo Nobel N.V.Inventors: Jan Andre Jozef Schutyser, Antonius Johannes Wilhelmus Buser, Andre Steenbergen
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Patent number: 5723262Abstract: An alkali soluble resin and a resin composition thereof useful as a solder resist, having good adhesive properties, solder heat resistance, and plating resistance are provided. Particular resistance to plating under alkaline conditions is provided by the invention.Type: GrantFiled: July 9, 1996Date of Patent: March 3, 1998Assignee: Ajinomoto Co., Inc.Inventors: Shigeo Nakamura, Masahiko Oshimura, Kenichi Mori, Tadahiko Yokota, Hiroyasu Koto
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Patent number: 5712345Abstract: A polymeric binder system useful for a magnetic recording medium, the polymeric binder system and comprising a hard resin component comprising a nonhalogenated vinyl copolymer and a soft resin component comprising a polyurethane having a phosphonate diester group. The binder system is useful for preparing the magnetic layer and/or backside coating of magnetic recording media, in order to provide media that demonstrate an improved combination of such as modulus, Tg, and smoothness.Type: GrantFiled: November 12, 1996Date of Patent: January 27, 1998Assignee: Minnesota Mining and Manufacturing CompanyInventors: Ruth M. Erkkila, James G. Carlson, Christopher M. Evans, James A. Greczyna, Ramesh C. Kumar, Colin F. Norman, Nelson T. Rotto
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Patent number: 5698641Abstract: A coating composition applied to a substrate wherein the composition contains a solids content of at least about 65 percent by weight and includes a polyanhydride having more than one non-cyclic anhydride moiety, a glycidyl groups-containing oligomer, a catalyst and a surfactant or flow-control agent.Type: GrantFiled: January 29, 1997Date of Patent: December 16, 1997Assignee: The Dow Chemical CompanyInventors: Michael L. Gould, Marvin L. Dettloff, David A. Grilli, Richard A. Hickner, James A. Rabon
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Patent number: 5698332Abstract: A coating composition applied to a substrate, the composition containing a solids content of at least about 65 percent by weight and including a polyanhydride having more than one non-cyclic moiety, a co-reactant resin such as a glycidyl (meth)acrylate-containing polymer, and a latent catalyst, wherein the equivalent ratio of epoxy to anhydride groups is from about 0.8:1 to 1.3:1.Type: GrantFiled: January 29, 1997Date of Patent: December 16, 1997Assignee: The Dow Chemical CompanyInventors: Michael L. Gould, David A. Grilli, Marvin L. Dettloff, Richard A. Hickner, James A. Rabon
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Patent number: 5677380Abstract: A planarizing material comprising a resin capable of having its practical temperature for a planarizing step set at a level lower than 200.degree. C., and a melamine-type heat-curing agent and/or an epoxy-type heat-curing agent.Type: GrantFiled: March 24, 1995Date of Patent: October 14, 1997Assignee: Tosoh CorporationInventors: Kosaburo Matsumura, Mitsumasa Akashi, Yoshitaka Tsutsumi, Masazumi Hasegawa
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Patent number: 5670585Abstract: A process for preparing binder-coated fiber-glass products employs as a binder aqueous polymer systems comprising a nitrogenous formaldehyde resin such as a urea-extended alkaline phenol/formaldehyde resole together with an acidic polyacrylate which cocure to form a thermoset polymer while synergistically reducing ammonia emissions which normally occur during cure of the nitrogenous formaldehyde resin. The polymer system may be used in applications other than fiberglass where reduced emissions are desired.Type: GrantFiled: June 13, 1995Date of Patent: September 23, 1997Assignee: Schuller International, Inc.Inventors: Thomas J. Taylor, Paul Nedwick
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Patent number: 5663247Abstract: A hyperbranched macromolecule of polyester type comprising a central monomeric or polymeric nucleus and at least one generation of a branching chain extender having at least three reactive sites of which at least one is a hydroxyl or hydroxyalkyl substituted hydroxyl group and at least one is a carboxyl or terminal epoxide group. The nucleus is an epoxide compound having at least one reactive epoxide group. Optionally, the macromolecule comprises at least one generation consisting of at least one spacing chain extender having two reactive sites of which one is a hydroxyl or hydroxyalkyl substituted hydroxyl group and one is a carboxyl or terminal epoxide group. The macromolecule may be terminated by means of at least one chain stopper.Type: GrantFiled: October 24, 1995Date of Patent: September 2, 1997Assignee: Perstorp ABInventors: Kent Sorensen, Bo Pettersson
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Patent number: 5659004Abstract: An epoxy resin composition contains an epoxy resin as a substratal resin and incorporates therein a polyallylphenol curing agent. The composition may also contain a polyphenol compound. The epoxy resin may have a naphthalene skeleton. The epoxy resin composition may also include a blend of two or more epoxy resins.Type: GrantFiled: February 16, 1995Date of Patent: August 19, 1997Assignee: Fujitsu LimitedInventors: Yukio Takigawa, Yoshihiro Nakata, Shigeaki Yagi, Norio Sawatari, Nobuo Kamehara
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Patent number: 5648435Abstract: A process of preparing multicyanate esters by: a) reacting an adduct of a tertiary amine and a phenol-formaldehyde oligomer or derivative thereof with cyanogen halide in a solvent reaction medium under conditions to form a reaction product stream containing at least one of the following compounds selected from the group consisting of tertiary amine-hydrohalide salt, solvent, and impurities, and, based upon the total weight of the reaction product stream excluding the weight of said tertiary amine-hydrohalide salt, from about 10 percent to about 40 percent of a multicyanate ester; b) recycling a portion of said reaction product stream into the mixture of step a; and c) separating and recovering said solvent and tertiary amine from said reaction product stream. The multicyanate ester products produced are useful as bonding agents in friction materials, molding materials, coatings, and adhesives.Type: GrantFiled: November 17, 1995Date of Patent: July 15, 1997Assignee: AlliedSignal Inc.Inventors: David W. H. Roth, Jr., Sajal Das
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Patent number: 5648171Abstract: Epoxy resin mixtures for producing prepregs and composites that are available at low cost and can be processed well yield flame-retardant molding materials even without the addition of flame retardants, and these molding materials have a high glass transition temperature and also have an improved interlaminar adhesion and adhesion to copper when they contain the following components:a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, composed of structural units derived from(A) polyepoxy compounds with at least two epoxy groups per molecule and(B) at least one compound from the group consisting of phosphinic acids, phosphonic acids, pyrophosphonic acids and phosphonic acid half-esters, andan aromatic polyamine as the hardener.Type: GrantFiled: September 14, 1995Date of Patent: July 15, 1997Assignee: Siemens AktiengesellschaftInventors: Wolfgang von Gentzkow, Jurgen Huber, Heinrich Kapitza, Wolfgang Rogler, Hans-Jerg Kleiner
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Patent number: 5644006Abstract: The present invention provides novel thermoset copolymers, and methods for preparing same, having both the strength and the thermo-oxidative stability required for high performance, high temperature applications. The copolymers comprise (a) a thermoplastic resin having unreacted phenolic OH groups, and (b) bis-oxazoline monomers which have been modified to have at least one substituent on the oxazoline ring selected from the group consisting of a methyl group, a group having at least a substituent capable of undergoing addition polymerization, and a cyclic group capable of undergoing ring opening polymerization.Type: GrantFiled: July 13, 1995Date of Patent: July 1, 1997Assignee: Southwest Research InstituteInventors: Marvin L. Deviney, Joel J. Kampa
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Patent number: 5633310Abstract: Novel water-soluble linear copolymers of vinylacetate with monomeric addition products of amines, amino acids, amino groups containing aromatic sulfonic acids, amino alcohols of maleic anthydride. The copolymers are useful as fluidizers in water containing solid matter suspensions.Type: GrantFiled: December 28, 1993Date of Patent: May 27, 1997Assignee: Sika AG, vorm. Kaspar Winkler & Co.Inventors: Ueli Sulser, Anna Huber, J urg Widmer
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Patent number: 5633330Abstract: A coating composition with a solids content of at least about 65% by weight comprises a polyanhydride having more than one non-cyclic anhydride moiety, a glycidyl groups-containing oligomer, a catalyst and a surfactant or flow-control agent.Type: GrantFiled: October 4, 1995Date of Patent: May 27, 1997Assignee: The Dow Chemical CompanyInventors: Michael L. Gould, David A. Grilli, Marvin L. Dettloff, Richard A. Hickner, James A. Rabon
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Patent number: 5633020Abstract: A coating composition with a solids content of at least about 65% by weight comprises a polyanhydride having more than one non-cyclic anhydride moiety, a co-reactant resin such as a glycidyl (meth)acrylate-containing polymer and a latent catalyst wherein the equivalent ratio of epoxy to anhydride is from about 0.8:1 to 1.3:1.Type: GrantFiled: October 4, 1995Date of Patent: May 27, 1997Assignee: The Dow Chemical CompanyInventors: Michael L. Gould, David A. Grilli, Marvin L. Dettloff, Richard A. Hickner, James A. Rabon
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Patent number: 5621071Abstract: The present invention discloses novolacs and thermosets thereof containing mesogenic moieties. Certain of said novolacs and thermosets thereof exhibit nonlinear optical properties upon orientation.Type: GrantFiled: August 4, 1995Date of Patent: April 15, 1997Assignee: The Dow Chemical CompanyInventors: Mark D. Newsham, Robert E. Hefner, Jr., Jimmy D. Earls
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Patent number: 5597868Abstract: Anti-reflective coatings and methods for forming these anti-reflective coatings are disclosed that have a polymer chemistry and optical characteristics suitable for suppressing the light that reflects off a circuit substrate during a photolithographic process. These anti-reflective coatings include a phenolic polymer material and an epoxide-containing polymer material that can be combined in a select proportion to form a thermally curable polymeric anti-reflective coating. The select proportions of the combined materials tailors the optical characteristic of the anti-reflective coating to attenuate energy about a select range of wavelengths.Type: GrantFiled: March 4, 1994Date of Patent: January 28, 1997Assignee: Massachusetts Institute of TechnologyInventor: Roderick R. Kunz
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Patent number: 5587243Abstract: Epoxy resin mixtures for producing prepregs and composites that are available at low cost and can be processed well yield flame-retardant molding materials even without the addition of flame retardants, and these molding materials have a high glass transition temperature and also have an improved interlaminar adhesion and adhesion to copper when they contain the following components:a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, composed of structural units derived from(A) polyepoxy compounds with at least two epoxy groups per molecule and(B) phosphinic acid anhydrides and/or phosphonic acid anhydrides, andan aromatic polyamine as the hardener.Type: GrantFiled: September 14, 1995Date of Patent: December 24, 1996Assignees: Siemens Aktiengesellschaft, Hoechst AktiengesellschaftInventors: Wolfgang von Gentzkow, J urgen Huber, Heinrich Kapitza, Wolfgang Rogler, Hans-Jerg Kleiner, Dieter Wilhelm
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Patent number: 5578657Abstract: Disclosed herein are adhesive compositions for use in cathode ray tubes comprising a specified epoxy (meth)acrylate, hydroxyl-containing mono (meth)acrylate, a photopolymerization initiator and optionally an urethane (meth)acrylate, the cured products thereof as well as cathode ray tubes obtained by the use thereof. The adhesive compositions of the present invention are excellent in spreadability and the resulting cured products have a good adhesion to glass. Cathode ray tubes in which a sheet of film is bonded to panel-glass by using an adhesive of the present invention exhibit satisfactory screen states comparable to those exhibited by cathode ray tubes subjected to a polishing process.Type: GrantFiled: May 11, 1995Date of Patent: November 26, 1996Assignees: Sony Corporation, Nippon Kayaku Kabushiki KaishaInventors: Takuji Inoue, Tsunenari Saito, Kenji Nakayama, Hiroe Ito, Minoru Yokoshima
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Patent number: 5561194Abstract: A polyalkylmethacrylate co-polymer of polyhydroxystyrene has been found to be an ideal blending partner in a novolak photoresist composition. The preferred co-polymer is poly(p-hydroxystyrene)-co-(methyl methacrylate). The co-polymer is fully miscible with novolaks and has a high thermal stability (>150.degree. C.).Type: GrantFiled: March 29, 1995Date of Patent: October 1, 1996Assignee: International Business Machines CorporationInventors: Kathleen M. Cornett, Judy B. Dorn, Margaret C. Lawson, Leo L. Linehan, Wayne M. Moreau, Randolph J. Smith, Gary T. Spinillo
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Patent number: 5552486Abstract: Propoxylated allyl alcohol homopolymers and copolymers of allyl alcohol and propoxylated allyl alcohol are disclosed. The polymers are soluble in many organic solvents, making them useful in a variety of applications, including polyesters, polyurethanes, alkyds, uralkyds, polyamines, acrylates, crosslinked polymeric resins, and polymer blends.Type: GrantFiled: May 25, 1995Date of Patent: September 3, 1996Assignee: ARCO Chemical Technology, L.P.Inventors: Shao-Hua Guo, Robert G. Gastinger
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Patent number: 5541000Abstract: A thermally-curable aromatic amine-epoxy composition comprises(a) at least one polyepoxy compound;(b) a curing amount of at least one aromatic polyamine compound; and(c) a catalytically effective amount of at least one cure accelerator compound which is a .pi.-electron acceptor, and which lowers the cure exotherm peak temperature (as measured by differential scanning calorimetry (DSC) at 10.degree. C. per minute) of the composition by at least about 8 percent relative to the corresponding composition without the cure accelerator. Such accelerator compounds moderate and/or accelerate the thermal curing of aromatic amine-epoxy resins, enabling cure to occur at lower temperatures and/or in shorter time periods than those required for the unaccelerated composition.Type: GrantFiled: July 1, 1994Date of Patent: July 30, 1996Assignee: Minnesota Mining and Manufacturing CompanyInventors: Leslie C. Hardy, Wendy L. Thompson
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Patent number: 5536791Abstract: The present invention relates to wire coatings which containa) 20 to 50% by weight of a tris-2-hydroxyethyl isocyanurate-modified polyester,b) 2 to 35% by weight of a bismaleimide resin,c) 0.1 to 3% by weight of a catalyst, preferably a titanate catalyst, andd) 35 to 77% by weight of organic solvents, with respect to the total weight of the wire coating, which is 100% by weight. The invention also relates to processes for the preparation of the wire coatings according to the invention.Type: GrantFiled: June 29, 1994Date of Patent: July 16, 1996Assignee: BASF Lacke + Farben, AGInventors: Michael Schink, Gerold Schmidt, Klaus W. Lienert, Roland Peter
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Patent number: 5532314Abstract: A stable aqueous adhesive composition based on a combination of a normally water-immiscible organo-functional silane and a phenolic resole wherein the silane is dispersed in a stabilized aqueous dispersion of a phenolic resole.Type: GrantFiled: May 3, 1995Date of Patent: July 2, 1996Assignee: Lord CorporationInventor: Frederick H. Sexsmith
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Patent number: 5521260Abstract: A thermosetting resin composition comprising compounds (A) an alkenyl-substituted nadimide, (B) a compound having at least one vinyl group or cyclic olefin, or both and (C) a phenol resin, and optionally (D) at least one polymerization catalyst selected from the group consisting of organic peroxides, onium salts, and cationic catalysts is disclosed. The components contained in the composition exhibit excellent compatibility among them. The cured product obtained from the thermosetting resin composition has superior anti-hygroscopicity and toughness, without impairing excellent heat resistance, electrical characteristics, mechanical strength, and small molding shrinkage inherently possessed by alkenyl-substituted nadimide resin. The composition is useful not only as a laminating material, a casting material, a molding material, a coating material, a paint, an adhesive, a sealing material, etc., but also as a matrix resin for composite materials.Type: GrantFiled: November 30, 1994Date of Patent: May 28, 1996Assignee: Maruzen Petrochemical Co., Ltd.Inventors: Norio Futaesaku, Hideo Fukuda, Yoshie Ito, Isao Maruyama
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Patent number: 5512607Abstract: This invention provides a photosensitive resin composition which can be developed using water and can form a resist layer having superior hardness, adhesion and water resistance.The photosensitive resin composition of the present invention is characterized by containing an unsaturated epoxyester compound prepared by esterifying some of the epoxy side groups of an unsaturated epoxyester compound, and then reacting the remained epoxy groups of the epoxyester compound with a tertiary amine and acid component, such as phosphoric acid, a monoester of phosphoric acid or a diester of phosphoric acid or combination thereof, to convert the epoxy groups into quaternary ammonium salt groups having phosphate anions.Type: GrantFiled: June 6, 1995Date of Patent: April 30, 1996Assignee: W. R. Grace & Co.-Conn.Inventors: Keiichi Kinashi, Hiroshi Samukawa, Reiko Chiba
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Patent number: 5495051Abstract: A phenolic allyl ether is provided which can be prepared by reacting a polyphenol with an allyl halide, said polyphenol described by the formula ##STR1## in which Ar is an aromatic moiety, L is a divalent cyclohexanenorbornane linking moiety, L' is a divalent cycloaliphatic moiety, Allyl is a phenolic allyl ether group, and each of m and n is a number within the range of 0 to about 10. Such phenolic allyl ethers include the reaction product of allyl halide with the product of the addition reaction of a phenol and a cyclohexenenorbornene compound such as 5-(3-cyclohexen-1-yl)bicyclo[2.2.1]hept-2-ene. The resulting phenolic allyl ether resins are useful as processing agents for polymaleimides.Type: GrantFiled: August 22, 1994Date of Patent: February 27, 1996Assignee: Shell Oil CompanyInventors: Pen-Chung Wang, Donald R. Kelsey
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Patent number: 5464911Abstract: Novel polymeric compositions are provided for polyamide fibers or fibers having terminal amino groups that impart stain resistance and are resistant to discoloration.Type: GrantFiled: April 21, 1994Date of Patent: November 7, 1995Assignee: Peach State Labs, Inc.Inventors: Michael S. Williams, Thomas H. Moss, III
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Patent number: 5457159Abstract: Process for the preparation of plastoelastomeric preparations comprising an elastomeric phase of an EPDM elastomer and a plastomeric phase of a thermoplastic olefinic polymer, wherein the elastomeric phase is dynamically vulcanized with a vulcanizing binary agent consisting of an alkylphenol-formaldehydic resin and sodium bisulphite.Type: GrantFiled: December 9, 1993Date of Patent: October 10, 1995Assignee: Paranova Articoli Tecnici S.r.l.Inventors: Roberto Fassina, Alessandro Fassina
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Patent number: 5445854Abstract: The present invention discloses oriented optical epoxy compositions comprising a reaction product of arylhydrazones with a monomer copolymerizable therewith and to oriented crosslinked polymeric composition comprising the reaction product of an epoxy arylhydrazone or the epoxy composition of the invention with a curing agent. The present invention also discloses processes for making the said compositions.Type: GrantFiled: November 29, 1993Date of Patent: August 29, 1995Assignee: The Dow Chemical CompanyInventors: Mark D. Newsham, Muthiah N. Inbasekaran, Michael N. Mang
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Patent number: 5439989Abstract: Macrocyclic epoxy resins comprising at least one compound of the formula (I) ##STR1## wherein n is an integer from 3 to 10.R.sup.1 and R.sup.3 are either the same or different and are selected from hydrogen, hydroxyl, alkoxy, allyloxy and epoxypropyloxy (glycidyloxy);R.sup.2 is selected from hydrogen, arylakalkyl optionally substituted with halogen, alkyl optionally substituted with halogen, and aryl optionally substituted with halogen;R.sup.4 is selected from hydrogen, alkyl optionally substituted with halogen, arylalkyl optionally substituted with alkyl or halogen, and aryl optionally substituted with halogen;R.sup.5 is selected from hydrogen, aryl and alkyl; with the proviso that the resin contains on average at least one epoxy group per molecule.Type: GrantFiled: May 3, 1993Date of Patent: August 8, 1995Assignee: Commonwealth Scientific & Industrial Research OrganisationInventors: Trevor C. Morton, Jonathan H. Hodgkin, Buu N. Dao
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Patent number: 5436049Abstract: A process for the manufacture of a stain resistant carpet by melt mixing a fiber forming synthetic polyamide with a compound, being capable to react with an amino group, to form a homogeneous polymer melt into fibers, tufting the fibers into a backing to form a carpet and treating the carpet with polymethacrylic acid, copolymers of polymethacrylic acid, a mixture of polymethacrylic acid and a sulfonated aromatic formaldehyde condensation product, and a reaction product of the polymerization or copolymerization of methacrylic acid in the presence of a sulfonated aromatic formaldehyde condensation product.Type: GrantFiled: December 21, 1993Date of Patent: July 25, 1995Assignee: BASF CorporationInventor: Harry Y. Hu
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Patent number: 5428057Abstract: The present invention relates to a modified epoxy resin, a method for the preparation thereof and an epoxy resin composition using the modified epoxy resin. In particular, it relates to a modified epoxy resin of the general formula (I) which is prepared by incorporating a monomaleimide having a carboxy group useful as a heat resistance-improving agent of a resin composition containing an epoxy resin and maleimides into an epoxy resin, and an epoxy resin composition for sealing a semiconductor element having the improved heat resistance and moldability by the modified epoxy resin. ##STR1## wherein, R represents a hydrogen atom or an alkyl group having from 1 to 10 carbon atoms (C.sub.1 to C.sub.10), andn is 0 to 100, and m is 1 to 100.Type: GrantFiled: April 30, 1991Date of Patent: June 27, 1995Assignee: Cheil Industries, Inc.Inventors: Whan G. Kim, Tai Y. Nam
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Patent number: 5426161Abstract: The present invention is a cyanato group containing phenolic resin, and method to prepare the resin. The resin of the present invention is stable and has a long shelf life. This is indicated by the gel time of greater than 1 minute, preferably greater than 2 minutes, more preferably greater than 10 minutes. The resin has substantially no smoke generation during gel time measurement at 155.degree. C.Type: GrantFiled: May 2, 1994Date of Patent: June 20, 1995Assignee: AlliedSignal Inc.Inventors: Sajal Das, Dusan C. Prevorsek
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Patent number: 5426150Abstract: A storage-stable suspension of an epoxy resin hardener and a toughener useful as a molding composition is prepared via a) the addition of an organic solvent to an aqueous emulsion of the toughener when using a water-sensitive hardener, such as a polycarboxylic anhydride, removing the water as an azeotrope by vacuum distillation, then adding the epoxy resin hardener and removing the residual solvent by vacuum distillation, or b) the addition of an aqueous emulsion of the toughener with or without an organic solvent to the epoxy resin hardener when using a water-insensitive hardener such as a polyamine, and removing the water and any organic solvent by vacuum distillation.Type: GrantFiled: May 10, 1994Date of Patent: June 20, 1995Assignee: Ciba-Geigy CorporationInventors: Sameer H. Eldin, Robert P. Peyer, Frans Setiabudi
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Patent number: 5418262Abstract: A dispersion for producing an adhesive, waterproof and hydrolysis-resistant bonding layer for bonding metal, ceramics, glass and for polymer-plastic bonds, including a phenol resin-methacrylate dispersion containing phenol with free methylol groups, one or more mono- or multifunctional methacrylate compounds, dispersed acrylate, water and acetone.Type: GrantFiled: August 20, 1993Date of Patent: May 23, 1995Assignee: Heraeus Kulzer GmbHInventor: Roland Gobel