Abstract: A resin composition for composites which comprises as essential components(A) a three-bismaleimide mixture of N,N'-diphenyl-methanebismaleimide, N,N'-tolylenebismaleimide, and N,N'-trimethylhexamethylenebismaleimide and(B) an allyl etherified substituted phenol novolak resin and/or allyl phenyl ether compound represented by the following general formula (I): ##STR1## wherein, X denotes a direct bond or the divalent radical ##STR2## and R.sub.1 through R.sub.4 are the same or different in a molecule and denote each --CH.sub.3, --C.sub.2 H.sub.5, --CH(CH.sub.3).sub.2, --nC.sub.3 H.sub.7, --nC.sub.4 H.sub.9, --C(CH.sub.3).sub.3, ##STR3## --CH.sub.2 CH(CH.sub.3).sub.2, or --Br.

Abstract: A miscible polymer blend comprising polyketone and phenolic-based novolac polymers is provided. These blends have and exhibit improved water vapor transport properties. A process for producing these blends and articles of manufacture produced therefrom are also disclosed.

Abstract: In an adhesive for printed circuit boards, whose main components are an epoxy resin and a polymer rubber, the improvement wherein the polymer rubber is a hydrogenated conjugated diene polymer rubber having not more than 100 ppm of metal content, not more than 100 ppm of ion content as determined by ion chromatography, and an iodine value of not more than 120.

Abstract: In an adhesive for printed circuit boards, whose main components are an epoxy resin and a polymer rubber, the improvement wherein the polymer rubber is a hydrogenated conjugated diene polymer rubber having not more than 100 ppm of metal content, not more than 100 ppm of ion content as determined by ion chromatography, and an iodine value of not more than 120, the ratio by weight of the hydrogenated conjugated diene polymer rubber to the epoxy resin in the adhesive being 35-75 weight % to 65-25 weight %.

Abstract: Compounds containing at least one alkenyl group, at least one maleimide group and at least one rodlike mesogenic moiety are prepared by reacting one or more aminophenols containing one or more rodlike mesogenic moieties with a stoichiometric quantity of a maleic anhydride per amine group of said aminophenol and then alkenylating the resulting phenolic functional maleimide.

Abstract: An adhesive composition for adhering an organic synthetic fiber to a nitrile group-containing highly saturated copolymer rubber, said composition comprising a nitrile group-containing highly saturated copolymer rubber latex having an iodine value of not more than 120 and a resorcinol-formaldehyde resin, characterized in that the nitrile group-containing highly saturated copolymer rubber latex is obtained by treating a nitrile group-containing unsaturated copolymer rubber latex resulting from emulsion polymerization with hydrogen in the presence of a hydrogenation catalyst to selectively hydrogenate a carbon-carbon double bond of the nitrile group-containing unsaturated copolymer constituting said latex.

Abstract: A crosslinker composition comprising an etherified phenol-formaldehyde resin modified by addition of a styrene (meth)-allyl alcohol copolymer is used to provide epoxy and polyester-alkoxymethylmelamine coil coating compositions of enhanced gloss, hardness, chemical resistance, adhesion and flexibility.

Abstract: A resin composition useful as a matrix resin for a composite material comprises (A) from 30-80% by weight of an amino group-containing unsaturated ester compound obtained by ring-opening addition reacting an epoxy group-containing unsaturated compound (c) with an aromatic polyamine (a) or diamine (b) in an equivalent weight ratio of compound (c) to amino hydrogen atom of polyamine (a) or diamine (b) of from 0.25-0.9:1, (B) from 10-60% by weight of a polyepoxy compound, and (C) from 5-60% by weight of a radically polymerizable cross-linking agent such as p-methyl styrene.

Abstract: Curable epoxy resins are toughened with statistical monofunctional carboxyl, amine or epoxy terminated reactive polymers and have low viscosities before cure thereby making them useful in a wide range of applications. The cured epoxy resin systems which are modified by the statistical monofunctional reactive polymers have physical properties, such as adhesion and elongation, generally equal to or better than those of cured epoxy resin systems modified with statistical difunctional reactive polymers. A process of preparation for the modified epoxy resin systems of the present invention includes admixing an epoxy resin with a statistical monofunctional carboxyl, amine, or epoxy-terminated reactive polymer in the presence of a curing agent and reaction therewith to form the toughened, cured epoxy resin system.

Abstract: The present invention is directed to a heat-curable composition comprising (1) a polyepoxide, (2) a polyacrylate or polymethyacrylate ester of a polyol, (3) an unsaturated aromatic monomer, (4) an aromatic amine, (5) a free-radical initiator, and optionally (6) an accelerator for the epoxy curing reaction.

Abstract: A method for the formulation and preparation of a heterochromatic paint comprises reacting one or more base mediums containing an anionic cellulose thickener in emulsion with an inorganic salt of a heavy or trivalent metal contained in a reactive medium emulsion. The heterochromatic paint comprises an emulsion containing non-soluble precipitated color particles, and each of the base mediums are of a different color. The inorganic salt is used in an amount sufficient to form dispersed phase reaction products contained in a dispersing phase emulsion and consisting essentially of a non-soluble precipitated color particles. The weight ratio of the dispersed phase to the dispersing phase in the heterochromatic paint is not greater than 0.4:1.

Abstract: A method for the formulation and preparation of a heterochromatic paint comprises reacting one or more base mediums containing an anionic cellulose thickener in emulsion with an inorganic salt of a heavy or trivalent metal contained in a reactive medium emulsion. The heterochromatic paint comprises an emulsion containing non-soluble precipitated color particles, and each of the base mediums are of a different color. The inorganic salt is used in an amount sufficient to form dispersed phase reaction products contained in a dispersing phase emulsion and consisting essentially of non-soluble precipitated color particles. The ratio of the dispersed phase to the dispersing phase in the heterochromatic paint is not greater than 0.4:1.

Abstract: Disclosed is a process for producing a phenolic resin composition characterized in that a novolak type phenolic resin modified with an unsaturated oil or an aromatic hydrocarbon resin, and hexamine are used as essential components, and these are kneaded by an open roll or a kneading extruder, whereby 30-90% of the hexamine used is converted into the adduct thereof. A rubber composition containing the phenolic resin composition produced by the above process is also disclosed.

Abstract: This invention relates to epoxy vinyl ethers having the formula: ##STR1## wherein R is a polyvalent linear, branched or cyclic hydrocarbon radical having from 2 to 20 carbon atoms, optionally substituted with alkyleneoxy; n has a value of from 1 to 20; p has a value of from 1 to 6; and at least one of Y and Y' is ##STR2## while any remaining Y and Y' can be ##STR3## The invention also relates to the synthesis and uses of the above polyphenyl vinyl ethers.

Abstract: Disclosed are novel dry, non-tacky photopolymer precursors or isocyanate-free urethane oligomers which are the reaction products of heat reactive phenolic resins and unsaturated monoisocyanates, e.g. a methylol containing resole and isocyantoethyl methacrylate. The reaction product combined with a haloalkyl triazine photosensitizer and an inert organic solvent provides an excellent coating for a variety of substrates used in the printing and publishing industry, e.g. grained, anodized aluminum lithoplates. The presensitized lithographic plates can be used in aqueous alkaline based development processes and exhibit an increased resistance to solvent attack during the development and printing processes.

Abstract: An ink composition as a steam sterilizing indicator for use in ink jet printing which comprises a salt of a cyanine dyestuff with phenol resins in amounts of 0.1-5% by weight as the cyanine dyestuff and in amounts of 0.2-30% by weight as the phenol resins, dissolved in organic solvents in amounts of 70-96% by weight based on the ink composition.The ink composition may further contain at least one of alkali metal salts, resins containing carboxyl groups therein, aliphatic carboxylic acids, anticorrosion agents, nonionic surfactants and dyestuffs which are unchanged in color under sterilizing conditions.The ink composition is discolored or changes in color under steam sterilization conditions.

Abstract: An anaerobic adhesive formulation is provided comprised of a monomeric acrylic phase consisting of 50 to 100 wt.% of one or more pluriacrylic esters and 50 to 0 wt.% of at least one unsaturated monomer chosen from the acrylic monomers and the non-acrylic unsaturated monomers and a system which produces free radicals and is inhibited in the presence of oxygen. The formulation also contains an additive for improving the impact strength and shear strength, consisting of a polyurethane performed or formed in situ and/or a heat stabilizing additive consisting of at least one epoxide resin associated with a latent hardener of said resin. The formulation is useful in anaerobic bonding.

Abstract: New aromatic compounds containing at least one cyanate ester and at least one propargyl ether group, each independently directly attached to a ring carbon atom(s), are useful in the preparation of resins having a low dielectric constant.

Abstract: Heat-resistant epoxy resin composition obtained by incorporation of 2-(4-hydroxyphenyl)-2-(4-maleimidophenyl)propane in a resin composition consisting esssentially of epoxy resin and an epoxy hardener is disclosed.

Abstract: Addition compounds which are suitable as dispersants for solids in organic media are obtained from polyepoxides based on novolaks having 3 to 11 nuclei and a mixture of aliphatic, aromatic and/or heterocyclic amines.

Abstract: A thermosetting resin composition comprising a maleimide compound having in the molecule thereof, at least one N-substituted maleimide group and an epoxy resin having a double bond conjugated with an aromatic ring is easily workable and which yields cured products having improved heat resistance.

Abstract: A stain resistant composition for fibers having polyamide linkages prepared by polymerizing an .alpha.-substituted acrylic acid or ester in the presence of a sulfonated aromatic formaldehyde condensation plymer, or by polymerization of a sulfonated hydroxyaromatic ester of an .alpha.-substituted acrylic acid or acrylic acid, and methods for making and applying the composition.

Abstract: Vinylized epoxy resins, such as vinyl ester resins, comprise polymerizable ethylenic unsaturation and an in situ polymerized polymer, such as a polyalkyl acrylate. The vinylized epoxy resins can form stable dispersions and are useful in thermoset applications.

Abstract: The present invention relates to an unsaturated group-containing polycarboxylic acid resin produced by reacting an epoxidized compound of a condensate of a phenolic compound and an aromatic aldehyde having a phenolic hydroxyl group with (meth)acrylic acid, and further reacting the reaction product with polybasic carboxylic acid or an anhydride thereof; a composition comprising the resin and a cured product of the resin or the composition.The composition according to the present invention is developable with an aqueous alkaline solution and suitable for a solder resist composition which is excellent in heat resistance, solvent resistance, adhesion, electric insulation property and storage stability.

Abstract: A method for bonding a rubber substrate to a metal substrate wherein a primer composition is first applied to the surface of said metal substrate and the rubber substrate is then bonded to the primer composition-containing metal substrate surface using a rubber-to-metal bonding adhesive, the improvement comprising employing as the primer composition a mixture comprising an epoxidized diene polymer having a molecular weight of about 500 to 30,000 and a resole type phenolic resin, in a weight ratio of about 2 to 100 parts of said diene polymer per 100 parts of said resole type phenolic resin.

Abstract: This invention provides an adduct of an epoxy resin and a hydroxy free acrylate resin. The novel adduct contains vinyl unsaturation and hence may be copolymerized with an ethylenically unsaturated monomer to provide a tough thermoset resin.

Abstract: Epoxy resins and vinyl ester resins are prepared which contain a polymeric domain containing mesogenic or rigid rodlike moieties.

Abstract: Curable thiol/ene compositions comprise:(1) a multifunctional styryloxy monomer having one or more of the following structures ##STR1## wherein R.sup.1, R.sup.2 and R.sup.3 are selected from vinyl (--CH.dbd.CH.sub.2), 1-propenyl (--CH.dbd.CH--CH.sub.3), isopropenyl ##STR2## hydrogen, lower alkyl or alkoxy, provided that at least one of R.sup.1, R.sup.2 and R.sup.3 must be vinyl, 1-propenyl or isopropenyl;n is an integer .gtoreq.1;if n=1, then R.sup.4 is a monovalent hydrocarbon radical containing one free-radically copolymerizable alkenyl or cycloalkenyl group,if n.gtoreq.2, R.sup.4 is a multivalent hydrocarbon radical which may contain a maximum of one free-radically copolymerizable alkenyl or cycloalkenyl group;R.sup.5 is a divalent hydrocarbon radical; or a carbon atom which is part of a cyclic group in the radical G; or a radical of formula ##STR3## where R.sup.

Abstract: An improved vulcanizable rubber composition of the type comprising (I) a rubber component selected from natural rubber, synthetic rubber or combinations thereof, and (II) a methylene donor compound which generates formaldehyde upon heating, and (III) a phenolic novolak resin type methylene acceptor compound is disclosed. The improvement comprises having at least ten mole percent of the phenolic groups of the phenolic novolak resin aralkylated with one or more compounds selected from the group consisting of styrene, alpha methyl styrene, beta methyl styrene, p-methyl styrene, alpha chloro styrene and vinyl naphthalenes.

Abstract: A process for the production of porous phenolic resin fibers is disclosed, which process comprises graft-polymerizing to phenolic resin fibers a vinyl group-containing monomer capable of forming a thermally decomposable polymer, and thereafter subjecting the fibers to a heat treatment at a temperature high enough to cause thermal decomposition of the graft polymer. The product thus obtained is excellent in heat-resistance and adiabatic property in addition to useful properties inherent to phenolic resin fibers.

Abstract: A method for curing a 1,2-epoxy resin by mixing the resin with an effective amount of an amine curing agent under epoxy resin curing conditions and accelerating the cure with acetoacetoxyethyl methacrylate (AAEM).

Abstract: A stain resistant composition for fibers having polyamide linkages prepared by polymerizing an .alpha.-substituted acrylic acid or ester in the presence of a sulfonated aromatic formaldehyde condensation polymer, and methods for making and applying the composition.

Abstract: A resin composition for sealing semiconductors which comprises (a) an epoxy resin, (b) a hardening agent, (c) an inorganic filler and (d) a polymaleimide having a specific structure is herein provided. Preferably, the resin composition comprises, as all of or a part of the epoxy resin, a modified epoxy resin composed of (i) a graft polymer of an epoxy resin and a vinyl polymer and (ii) a silicone polymer in an oily state or as particles having an average particle size of not more than 1.0 micron, which are uniformly dispersed in the graft polymer. The resin composition for sealing semiconductors exhibits a low thermal expansion coefficient and a low elastic modulus, generates low stress when thermal shock is applied thereto and exhibits high heat resistance during soldering even after moisture absorption.

Abstract: Thermally stable bisimido polymers, devoid of diamine component and well adapted for the production of laminates, are prepared by copolymerizing (a) an N,N'-bismaleimide with (b) an acrylate comonomer, e.g., a novolak epoxy (meth)acrylate, in the presence of a catalytically effective amount of (c) an imidazole compound, and, optionally, (d) a chlorinated or brominated epoxy resin, or admixture thereof with a non-chlorinated or non-brominated epoxy resin.

Abstract: This invention relates to epoxy vinyl ethers having the formula: ##STR1## wherein R is a polyvalent linear, branched or cyclic hydrocarbon radical having from 2 to 20 carbon atoms, optionally substituted with alkylenoxy; n has a value of from 1 to 20; p has a value of from 1 to 6; and at least one of Y and Y' is ##STR2## which any remaining Y and Y' can be ##STR3## The invention also relates to the synthesis and uses of the above polyphenyl vinyl ethers.

Abstract: The present invention is a cyanato group containing phenolic resin, and method to prepare the resin. The resin of the present invention is stable and has a long shelf life. This is indicated by the gel time of greater than 1 minute, preferably greater than 2 minutes, more preferably greater than 10 minutes. The resin has substantially no smoke generation during gel time measurement at 155.degree. C.

Abstract: Compounds of the formula I ##STR1## in which a is 1, 2 or 3, m is an integer from 2 to 20, R.sup.1, R.sup.2 and R.sup.3 independently of one another are hydrogen or methyl and R.sup.4 is an m-valent radical of a polyol after removal of m hydroxyl groups, can be thermally reacted to give cross-linked polymers having outstanding physical properties.The polymers are suitable especially as casting resins, matrix resins, adhesives, encapsulating resins, insulating materials for electronics an electrical engineering and in surface protection.

Abstract: The resin composition which contains thermosetting resin as Component (A), a thermoplastic resin as Component (B), and at least one compound selected from the group consisting of an epoxy resin capable of dissolving the thermoplastic resin and a reactive diluent possessing at least one epoxy group as Component (C) in a ratio such that the proportions of Components (A), (B), and (C) fall respectively in the ranges of 30 to 96% by weight, 2 to 50% by weight, and 2 to 49% by weight, based on the total weight of the resin composition. The resin composition is capable of producing a molded article combining the highly satisfactory mechanical and thermal properties of a thermosetting resin and the highly satisfactory toughness of a thermoplastic resin.

Abstract: The invention relates to benzyloxy vinyl ethers having the structure ##STR1## wherein R.sub.1 is lower alkyl;p is an integer having a value of from 0 to 2;q is an integer having a value of from 1 to 20;r is an integer having a value of from 1 to 6;n is an integer having a value of from 0 to 20;m is an integer having a value of from 0 to 1;Y is sulfur or oxygen;X is hydrogen or methyl andR and R.sub.2 are each independently a radical having from 2 to 20 carbon atoms and are selected from the group of alkylene, arylene, aralkenylene and alkarylene optionally substituted with lower alkyl.The invention also relates to the process for preparing the above multifunctional benzyloxy vinyl ethers.

Abstract: The invention relates to an unsaturated-epoxy moiety R--NHCO.sub.2 --E wherein R is unsaturated and free of isocyanate functionality and E has an oxirane ring. The moiety may be dissolved in a liquid epoxy compound. The invention also relates to a mixture obtained by vinyl polymerization of the moiety and an added unsaturated compound in the liquid epoxy compound solution. Epoxy cross-linking then leads to a polymeric reaction product. Vinyl polymerization and epoxy curing can also be simultaneous. A polymeric material is formed by reacting an isocyanate compound having the formula R--NCO with an epoxy compound having the formula E--OH, where R and E are as defined above, to form the moiety R--NHCO.sub.2 --E and polymerizing this moiety, along with an additional unsaturated compound under vinyl polymerization conditions and in the presence of a liquid epoxy compound, to form a copolymer of R--NHCO.sub.2 --E with the additional unsaturated compound.

Abstract: Vinyl ester resins of substituted epoxidized hydroxystyrylaza compounds are disclosed. These vinyl esters may be combined with various reactive monomers, prepolymers or polymers and cured to give a combination of high mechanical strength and glass transition temperature.

Abstract: An end dam nosing material useful for expansion joints and having high levels of bonding strength, tensile strength, compressive strength, flexural capabilities, resiliency, and resistance to chemical action is disclosed. The end dam nosing material of the present invention does not require the addition of external heat for curing. The end dam nosing material of the present invention comprises a mixture of a dipolymerized elastomer, an epoxy resin, a filler material and an amount of a curing agent effective to cure the epoxy resin and generate sufficient heat to cure the dipolymerized elastomer.

Abstract: A heat-hardenable binder comprising (a) a phenolic resin of a phenolic compound and formaldehyde in a molar ratio of 1:1 to 1:2 and (b) an effective amount of a hardener mixture of hexamethylenetetramine and an acidic latent hardening agent with reduced emission problems and curing rapidly.

Abstract: A stain resistant composition for fibers having polyamide linkages prepared by polymerizing an .alpha.-substituted acrylic acid or ester in the presence of a sulfonated aromatic formaldehyde condensation polymer, and methods for making and applying the composition.

Abstract: Rapid-setting epoxy resins comprise a polyepoxide, a metal tetrafluoroborate, and at least one boron ester selected from the group of triesters of boric acid and diesters of boronic acid.

Abstract: A composition useful as an alkaline developable liquid photoimageable solder resist ink comprising a photocurable resin, a photopolymerization initiator, a reactive diluent, a solvent and optionally, a thermosetting material as main components wherein the photocurable resin comprises a reaction product of: (A) an epoxy vinyl ester resin obtained by reacting a cresol novolak epoxy resin and an unsaturated monobasic acid, (B) a polybasic acid anhydride and (C) an alkyl ketene dimer, wherein the hydroxyl value of the photocurable resin is not more than 10 carbons. Coating films formed from the subject composition have excellent adhesion, heat resistance, moisture insulation resistance and alkaline developable properties.

Abstract: Epoxide compounds and phenolic compounds are reacted in the presence of phosphonium compounds represented by the formula .crclbar.Z'R.sup.1 R.sup.2 R.sup.3 P.sym.-Z-P.sym.R.sup.1 R.sup.2 R.sup.3 Z'.crclbar. wherein each R.sup.1, R.sup.2 and R.sup.3 is independently an aromatic group or an inertly substituted aromatic group; Z is --(C(R.sup.4).sub.2).sub.a --; each R.sup.4 is independently hydrogen or a hydrocarbyl group containing from 1 to about 20 carbon atoms; Z' is any suitable anion and a has a value of at least 4.

Abstract: An activation energy-curable resin composition comprising as an essential ingredient a resin obtained by reacting (a) a reaction product of a novolak-epoxy compound and an unsaturated monocarboxylic acid, (b) a reaction product of a diisocyanate and a poly(meth)acrylate having a hydroxyl group per moleucle and (c) at least one of an aromatic, aliphatic or alicyclic polybasic acid (or an anhydride thereof).

Abstract: A curable resin composition comprises an epoxy compound and a propargyl aromatic ether.

Abstract: Novel thermosetting resin compositions comprise (1) a polyalcohol produced by reduction of a low molecular weight linear alternating polymer of carbon monoxide and at least one ethylenically unsaturated hydrocarbon and (2) a polyfunctional curing agent. The compositions are cured upon application of heat to cured, crosslinked compositions useful as coatings.