Abstract: The invention relates to compounds of the formula I or II ##STR1## in which A is a radical ##STR2## R.sup.1 is hydrogen or methyl, R.sup.2 is the radical of an aliphatic, cycloaliphatic, aromatic or araliphatic diol after both of the hydroxyl groups have been removed, R.sup.3, R.sup.4, R.sup.5 and R.sup.6 independently of one another are hydrogen, C.sub.1 -C.sub.6 alkyl, chlorine or bromine, R.sup.7 is a radical of the formula III, IV, V or VI ##STR3## R.sup.8, R.sup.10, R.sup.12 and R.sup.14 are hydrogen, C.sub.1 -C.sub.6 alkyl or phenyl, R.sup.9, R.sup.11, R.sup.13 and R.sup.15 are hydrogen or C.sub.1 -C.sub.6 alkyl and the average value of n (number average) is a number from 1 to 20, it being possible for the radicals R.sup.1 to R.sup.15, within a given molecule, to assume different meanings within the scope of the definitions given.These compounds or also the epoxidized intermediates of the formula X ##STR4## in which R.sup.1 to R.sup.3 are as defined above and R.sup.

Abstract: A thermosetting resin composition is prepared by mixing(A) a phenol novolak resin having hydroxy groups and allyl-etherified hydroxy groups,(B) a polymaleimide compound having two or more maleimide groups in the molecule, and(C) at least one silicone resin having the following formula (I); ##STR1## wherein R.sub.1 and R.sub.2, which may be the same or different, are methyl or phenyl; R.sub.3 and R.sub.4, which may be the same or different, are methyl, phenyl, hydrogen or a group having an amino group or an epoxy group but at least one of R.sub.3 and R.sub.4 is hydrogen or a group having an amino group or an epoxy group; and l and m, which may be the same or different, are a number of 0-400. The thermosetting resin composition of the present invention can be suitably used for encapsulating electric devices, for example, and gives, by curing, a cured resin product of high quality.

Abstract: The invention relates to a blend of divinyl ethers and their use as diluents for irradiation curable resins, which blend comprises between about 65 wt. % and about 35 wt. % of a hydrophobic divinyl ether containing from 6 to 30 carbon atoms and having a Tg of from about 20.degree. C. to about 150.degree. C. and between about 35 wt. % and about 65 wt. % of a hydrophilic polyethylene glycol divinyl ether.

Abstract: Stain-resistant compositions comprising sulfonated phenol-formaldehyde condensation products and polymers of ethylenically unsaturated monomers, polyamide textile substrates treated with the same, and processes for their preparation. The stain-resistant compositions and substrates possess improved stain resistance but do not suffer from yellowing to the extent that previously known materials do.

Abstract: The present invention provides a fluroine-containing novolak resin or its derivative having a repeating unit of the formula ##STR1## wherein R.sup.1 is hydrogen atom, OH or ##STR2## R.sup.2 is hydrogen atom or alkyl group having 1 to 4 carbon atoms, X is fluorine-containing monovalent organic group having 2 to 20 carbon atoms.The present invention also provides a perfluoroalkenyloxphenol or its derivative of the formula ##STR3## wherein R.sup.10 is OH or ##STR4## R.sup.11 is H, OH, alkyl group having 1 to 4 carbon atoms or ##STR5## Y is perfluoroalkenyl group having 6 to 14 carbon atoms.

Abstract: A lubricating oil contains a carbon-carbon backbone polymer containing residual unsaturation and bearing graft moieties derived from graft monomers containing ethylenic unsaturation and an epoxide moiety, and bonded to at least one of said graft moieties through an opened epoxide moiety, a Mannich base, prepared by reaction of an amine, an aldehyde, and a hindered phenol containing an active hydrogen atom.

Abstract: An epoxy resin composition which is adapted for use as an encapsulator of electronic or electric parts and which comprises an epoxy resin and a curing agent for the epoxy resin. A modified polymer obtained by reaction between an aromatic polymer and a fluorine-containing material is added to the epoxy resin, so that good characteristic properties are imparted to the resultant cured product.

Abstract: A method is presented to prepare totally functionalized ether-capped oligomeric polyphenols without molecular weight fractionation. The products generally are very low in inorganic salts and are characterized by the absence of volatiles leading to void formation in their subsequent curing. The success of the method rests upon conducting the reaction under totally homogeneous conditions throughout.

Abstract: Disclosed herein are thermosetting coating compositions comprising high Tg acrylic polymers which are substantially free of crosslinking groups, in combination with melamine resins in small but effective amounts to produce drawable cured coatings. These coating compositions are particularly useful in can coating where stringent fabricating properties and high film integrity are conjointly required.

Abstract: Thermoset resinous molding compositions are provided by essentially instantaneously combining and reacting three basic resin forming components. The latter include an oligomeric ester or polyester containing polymerizable unsaturation and free hydroxyl group(s); a polyisocyanate; and an aromatic polyamine. The indicated thermosetting resin systems are especially adapted for use in a reaction injection molding (RIM) operation.

Abstract: Vinyl ester resins of substituted epoxidized hydroxystyrylaza compounds are disclosed. These vinyl esters may be combined with various reactive monomers, prepolymers or polymers and cured to give a combination of high mechanical strength and glass transition temperature.

Abstract: Compounds of the formula I ##STR1## in which a is 1, 2 or 3, m is an integer from 2 to 20, R.sup.1, R.sup.2 and R.sup.3 independently of one another are hydrogen or methyl and R.sup.4 is an m-valent radical of a polyol after removal of m hydroxyl groups, can be thermally reacted to give crosslinked polymers having outstanding physical properties.The polymers are suitable especially as casting resins, matrix resins, adhesives, encapsulating resins, insulating materials for electronics and electrical engineering and in surface protection.

Abstract: Iodonation of novolak resin or polyphenylene ether followed by the metatheses of the resulting iodonated product with a polyhalometal or metalloid salt can provide a photoactive cure catalyst or thermally active cure catalyst for cationically polymerizable organic materials. A copper cocatalyst has been found useful in thermal curing.

Abstract: A curing agent is made by admixing (a) an irradiated mixture of carboxylic acid anhydride and carbon containing cyclic compound and (b) a polyhhydric alcohol, where the curing agent can be added to a resin such as an epoxy resin, applied to the surface of an article, and cured.

Abstract: A thermosetting resin composition of highly satisfactory storage stability comprises 100 parts by weight of a thermosetting resin composition, 0.0001 to 2.0 parts by weight of a thiuram compound possessing at least one atomic group represented by the following formula: ##STR1## wherein p stands for an integer in the range of 1 to 8, and 0.00001 to 0.1 part by weight (as copper metal) of a copper-containing compound.

Abstract: Curable mixtures based on(A) compounds containing hydroxyl groups,(B) curable compounds,(C) catalysts and(D) if appropriate a diluent and if appropriate further additives,in which compounds which are used as the curing compounds(B) are those which contain at least two enol ether groups of the formula (I) ##STR1## The mixtures according to the invention already cure rapidly at low temperatures and are particularly suitable for the production of shaped articles or coatings or as a constituent in lacquers.

Abstract: Vinyl ester/styrene mixtures are flexibilized by addition thereto of minor amounts of urethanes which (1) comprise at least one polyglycol moiety and two urethane groups and are terminated by vinyl-reactive end groups, and (2) form a dispersed second phase in the cured mixture. The flexibilized compositions otherwise largely retain the characteristic properties of the unflexibilized mixtures.

Abstract: A curable composition is provided comprising a bismaleimide resin, an epoxy resin, and a phenolic resin curing agent. The composition can also contain an accelerator for enhanced low-temperature cure. The composition is useful for high-performance applications such as electrical lamination and filament-wound parts.

Abstract: The resins resulting from converting the phenol-formaldehyde type condensation products of dicyclopentadiene-phenol adducts with selected aldehydes and ketones to their corresponding vinylbenzyl ethers are an excellent matrix in which to embed fibers to produce a composite. Such resins, especially as a blend of materials with varying molecular weight distribution, are amorphous materials whose glass transition temperature is well under the curing temperature, and whose solubility permits solutions with high solids content so as to afford coatings with high resin content. The extensively crosslinked polymer resulting from thermal, photochemical, or free radical initiated polymerization has excellent thermal and electrical properties for use in multilayer circuit boards.

Abstract: A process for the preparation of a thermoset polymer having good adhesive properties comprising reacting a compound containing a plurality of oxazoline groups with an alkenyl phosphonic acid at a temperature of from about room temperature to about 300.degree. C. is described.

Abstract: Modified phenolic resins and cured resins prepared therefrom.

Abstract: Thermoset polymers are prepared by reacting an ethylenically unsaturated resin monomer and a bicyclic amide acetal with a polyisocyanate in the absence or presence of a vinyl monomer. Reaction rates are suitable for effecting RIM processing. The resultant polymers exhibit improved impact resistance. Further variation in physical properties can be achieved through the use of a diol chain extender for the polyisocyanate.

Abstract: Modified phenolic resins and cured resins prepared therefrom.

Abstract: A thermosetting resin composition comprising (A) a phenol novolac resin, some of the hydroxyl groups of which have been allyl-etherified and the other hydroxyl groups having added thereto a compound having one or more epoxy groups and (B) a polymaleimide compound having two or more maleimide groups in the molecule.

Abstract: Described herein is an improved process for rapidly fabricating fiber reinforced thermoset resin articles comprising: (a) providing in a heatable matched metal die mold a bonded web of one or more fibers with a melting point or a glass transition temperature above about 130.degree. C., (b) providing in an accumulator zone a liquid body of a thermosettable organic material having a viscosity determined at 120.degree. C.

Abstract: A high solids coating composition comprises a low molecular weight polymeric blend of acrylic polymer, polyester polymer, and amine cross-linking resin. The acrylic and polyester polymers contain primary hydroxyl groups adapted to coreact and cross-link with active amine cross-linking resin such as aminoplast resins. All of the polymers have a number average molecular weight below about 3000.

Abstract: Positive acting electron beam resist materials are described. The material comprises a polymer having fundamental units of the general formula ##STR1## in which R.sub.1, R.sub.2 and R.sub.3 independently represent hydrogen or a hydrocarbon group having from 1 to 6 carbon atoms, and R.sub.4 represents an organic residue having from 1 to 20 carbon atoms. The polymer may be used, as the resist material, as it is or by mixing with other type of resin.

Abstract: Compositions comprising an oligomer which (a) on average comprises at least one in-chain residue of the general formula ##STR1## wherein Ar.sup.1 is an aromatic group, R.sup.1 is hydrogen or a hydrocarbyl group, X is a group which activates Ar.sup.1 to electrophilic attack, and Y.sup.1 is an organic residue bearing a carboxyl substituent; and (b) has one or more pendant and/or terminal acyloxymethyl groups are described. They may be used in dental, electronic and electrical applications.

Abstract: Polymer modified vinyl ester resin compositions are disclosed which comprise (I) a polymer modified epoxy resin which comprises (A) an epoxy resin wherein a portion of the epoxide groups have been reacted to provide groups containing polymerizable ethylenic unsaturation; (B) at least one vinyl terminated urethane oligomer and optionally (C) at least one polymerizable ethylenically unsaturated compound and (II) a monounsaturated monocarboxylic acid or mixture of such acids.

Abstract: Water-insoluble proton-conducting polymers which may be formed into membranes which are used in gas separation or gas sensing processes comprise an interpenetrating polymer network. This IPN is formed from the interaction between a host polymer and a guest polymer which is subsequently cross-linked or cured. The host polymer blend is formed from a phosphoric acid or sulfuric acid and a polymer or copolymer of a compound which possesses repeat units such as, for example, hydroxy ethylene, vinyl sulfonic acid, ethylene imine, etc, while the guest polymer is formed from a monofunctional monomer such as methacrylic acid and a difunctional cross-linking agent such as methylenebisacrylamide.

Abstract: Curable compositions having at least one ethylenically unsaturated monoene, a polyene and a curing initiator are disclosed for use with optical fibers. The monoene and polyene components may be substituted with organo functional compounds to selectively vary the properties of the cured compositions.

Abstract: Vinylized epoxy resins, such as vinyl ester resins, comprise polymerizable ethylenic unsaturation and an in situ polymerized polymer, such as a polyalkyl acrylate. The vinylized epoxy resins can form stable dispersions and are useful in thermoset applications.

Abstract: An activation energy-curable resin composition comprising as an essential ingredient a resin obtained by reacting (a) the reaction product of a novolac epoxy compound and an unsaturated monocarboxylic acid with (b) the reaction product of a diisocyanate and a poly(meth)acrylate having one hydroxyl group for each molecule.

Abstract: A crosslinkable composition of matter is provided, which comprises first and second chain extended diepoxide resins, one or both of which are modified by reaction with hydroxy functional secondary amine and one or both of which are modified by reaction with certain secondary amine terminated or carboxy terminated butadiene acrylonitrile copolymer resin. The first resin, diene functional aminoepoxy resin, and the second resin, blocked dieneophile functional aminoepoxy resin, are co-reactive at elevated cure temperature. The diene functional aminoepoxy resin comprises the reaction product of diepoxide with amine functional diene chain extending reactant and, optionally, monofunctional end-capping reactant such as monohydroxy functional diene, and certain modifying agents.

Abstract: Novel compositions are prepared by reacting sulfur dioxide with the reaction product of a material having an average of more than one 1,2-epoxide group per molecule such as a diglycidyl ether of bisphenol A with a monoethylenically unsaturated monocarboxylic acid such as methacrylic acid in the presence of an oxidizing agent such as cumene hydroperoxide.

Abstract: Heat-curable mixtures comprising(a) 10-90% by weight of at least one compound of formula I ##STR1## (b) 90-10% by weight of at least one compound of formula II ##STR2## and, based on the sum of (a)+(b), (c) 0-30% by weight of at least one compound which is able to react with component (b),in which formulae above n, m, R, R', R.sub.1, R.sub.2 and R.sub.3 are as defined in claim 1, are suitable for the preparation of moulded articles such as prepregs and composites, coatings and bonds.

Abstract: An adhesive composition comprising, by weight, (1) 100 parts of triglycidyl ether of trisphenol, (2) 0-40 parts of a polyfunctional epoxy resin, (3) a diamine type curing agent selected from (a) an aromatic diamine compound and (b) a reaction product having an amino group at each terminal thereof, prepared by reacting together an aromatic diamine compound, divinylsilane compound and bismaleimide compound, and, if desired, (4) a powdery inorganic filler.

Abstract: Materials made of polyhydroxylated or polyaminated polymers can be rendered bacteriostatic or fungistatic by treating the materials with a solution of certain N-oxiranemethane N,N,N-trialkylammonium compounds in a base, and either spin drying the treated material and storing it protected from air for at least three hours, or drying the treated material and holding it at a temperature higher than 80.degree. C.

Abstract: An epoxy impregnating resin composition comprising 100 parts by weight of a compound having at least two epoxy groups in one molecule, from 0.1 to 100 parts by weight of an allyl epoxy compound having both allyl and epoxy groups in one molecule and represented by the general formula: ##STR1## where R is hydrogen, halogen or a monovalent organic group, from 30 to 300 parts by weight of a liquid cyclic acid anhydride, and from 5 to 300 parts by weight of a compound having a polymerizable double bond.

Abstract: The disclosure is directed to thermoset resinous compositions having utility in the area of surface coating and molding applications, the latter including the preparation of high performance composites and the use in reaction injection molding processes. The contemplated compositions are obtained by polymerizing a reaction mixture comprising a polyfunctional 2-oxazoline compound, a compound or oligomer containing a plurality of aromatic hydroxyl groups and a polyfunctional epoxide.

Abstract: Modified phenolic resins and cured resins prepared therefrom.

Abstract: Polyimido-ester compounds having the formula RO-C(O)-R.sub.1 -C(O)-OR are disclosed wherein R is an alkylene N-dicarboximido radical containing cycloolefinic unsaturation and R.sub.1 is the divalent residue of an unsaturated polycarboxylic acid such as fumaric, itaconic, aconitic, mesaconic, or glutaconic acid. These compounds are blended with unsaturated resins such as unsaturated polyester resin or vinyl ester resin, and polymerizable unsaturated monomers such as styrene to provide thermosettable resin compositions which can be cured to provide castings or laminates with improved resistance to thermal aging.

Abstract: Diene functional modified aminoepoxy resins are disclosed, which resins are the reaction product of (i) diepoxide reactant, (ii) amine functional conjugated diene chain extending reactant, (iii) optionally, end-capping reactant such as monohydroxy functional diene, (iv) hydroxy functional secondary amine modifying agent, and (v) certain secondary amine terminated or carboxy terminated butadiene acrylonitrile copolymer modifying agent.

Abstract: A thermosetting resin composition having an improved crack resistance comprising 100 weight parts of a curable epoxy resin and 30 to 300 weight parts of a phenol compound-added conjugated diolefin polymer, which is prepared in the presence of aluminum phenoxide as the catalyst. The composition is suitable for resin encapsulation of electronic components.

Abstract: A thermosetting resin composition comprising an N,N'-bismaleimide compound and an allylated phenol novolak resin having partially or wholly allyl-etherified phenolic hydroxyl groups and substantially no nucleous-substituted allyl group.

Abstract: A self-crosslinkable resin and a composition of matter comprising same are provided, which resin comprises certain diene functional blocked dieneophile functional aminopoxy resin, which resin is self-crosslinkable at elevated cure temperature. The diene functional blocked dieneophile functional aminoepoxy resin comprises the reaction product of diepoxide with amine functional diene chain extending reactant, amine functional blocked dieneophile chain extending reactant, optionally, monofunctional end-capping reactant such as mono-secondary amine functional diene and mono-secondary amine functional blocked dieneophile, and modifying agent comprising hydroxy functional secondary amine. Compositions comprising the aforesaid self-crosslinkable resin may further comprise crosslinking agent reactive with hydroxy functionality of the resin.

Abstract: Polymer modified epoxy resin compositions are disclosed which comprise (A) an epoxy resin wherein a portion of the epoxide groups have been reacted to provide groups containing polymerizable ethylenic unsaturation; (B) at least one vinyl terminated urethane oligomer and optionally (C) at least one polymerizable ethylenically unsaturated compound. These compositions are useful as intermediates to novel polymer modified vinyl esters and thermoset (cured) products.

Abstract: A crosslinkable composition of matter is provided, which comprises first and second chain extended diepoxide resins, one or both of which are modified by reaction with hydroxy functional secondary amine and one or both of which are modified by reaction with certain secondary amine terminated or carboxy terminated butadiene acrylonitrile copolymer resin. The first resin, diene functional aminoepoxy resin, and the second resin, blocked dieneophile functional aminoepoxy resin, are co-reactive at elevated cure temperature. The diene functional aminoepoxy resin comprises the reaction product of diepoxide with amine functional diene chain extending reactant and, optionally, monofunctional end-capping reactant such as monohydroxy functional diene, and certain modifying agents.

Abstract: A resin having a monomer unit structure represented by the formula: ##STR1## can be cured by an actinic irradiation such as electron beam, ultraviolet ray or infrared ray to give a heat-resistant, moisture-resistant, acid- and alkali-resistant and solvent-resistant film which is especially suitable for a paint vehicle resin for use in resistor element or magnetic recording medium. A composition comprising said resin modified by incorporating at least of one monomer or oligomer containing at least one acryl, methacryl or allyl group therein for facilitating the control of the characteristics of a resistor element obtained by using said composition is also disclosed.

Abstract: An impact-resistant phenolic resin composition comprising 99 to 25% by weight of a phenolic resin and 1 to 75% by weight of a nitrile group-containing highly saturated polymer rubber whose amount of bound nitrile ranges from 10 to 60% by weight and having an iodine value not exceeding 120.