Wherein At Least One Of Said 1,2-epoxy Reactants Or Polymer Derived Therefrom Contains Atoms Other Than C, H, Or O Patents (Class 525/525)
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Patent number: 7521120Abstract: Provided are a non-halogen flame retardant epoxy resin composition comprising (A) a silicon-containing, phosphorus-modified epoxy resin, (B) a multifunctional epoxy resin, (C) a mixed curing agent of an amine curing agent and a phenolic curing agent and (D) a metal hydrate inorganic flame retardant, and a prepreg and copper-clad laminate using the same. The epoxy resin composition in accordance with the present invention exhibits excellent flame retardancy without use of a halogen flame retardant, and also advantageously provides well-balanced various physical properties which are to be required in copper-clad laminates, such as higher heat resistance and copper peel strength, and lead heat-resistant characteristics after moisture absorption.Type: GrantFiled: November 22, 2005Date of Patent: April 21, 2009Assignee: LG Chem, Ltd.Inventors: Mok Yong Jung, Eunhae Koo
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Patent number: 7491774Abstract: A production method of granular epoxy resin includes an epoxy resin preparing step of preparing an epoxy resin which is solid at ordinary temperature by reaction between a phenol compound and epihalohydrin; a purifying processing step of refining the prepared epoxy resin which is solid at ordinary temperature so that the total content of compounds having a molecular weight of 200 or less is 0.28% by mass or less of the entire epoxy resin; and a pulverizing step of pulverizing the refined epoxy resin obtained by the purifying processing step under conditions so as not to make the total content of compounds having a molecular weight of 200 or less exceeding 0.3% by mass, wherein the epoxy resin which is solid at ordinary temperature prepared by the epoxy resin preparing step is mainly composed of at least one selected from oligomers represented by the following general formula (1) and oligomers represented by the following general formula (2).Type: GrantFiled: February 12, 2007Date of Patent: February 17, 2009Assignee: Japan Epoxy Resins Co., Ltd.Inventors: Yasuyuki Murata, Atsuhito Hayakawa, Akihiro Itou
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Patent number: 7470755Abstract: Multi-component epoxy-amine primer systems are disclosed, which include an epoxy component and an amine component that includes a mercaptan terminated material. At least one of the epoxy component and the amine component includes a sulfur-containing polymer. Also disclosed are substrates coated with such primer systems as well as methods for coating substrates with such primer systems.Type: GrantFiled: November 29, 2005Date of Patent: December 30, 2008Assignee: PRC-DeSoto International, Inc.Inventors: Siamanto Abrami, Jorge Camargo
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Patent number: 7410673Abstract: The thermosetting resin composition which is valuable for an undercoat of a printed wiring board, and does not leave an air bubble in a cured film, and makes the surface polishing easy and can form a smooth printed wiring board comprises (I) an adduct of epoxy resin with unsaturated aliphatic acid, (II) a (meth) acrylate, (III) a radical polymerization initiator, (IV) a crystallizable epoxy resin, and (V) a latent curing agent.Type: GrantFiled: August 18, 2004Date of Patent: August 12, 2008Assignee: San-ei Kagaku Co., Ltd.Inventors: Kiyoshi Sato, Kazunori Kitamura
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Patent number: 7381359Abstract: An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavelength in the range of 400 to 900 nm, at an encapsulant thickness of about 1 mm. The encapsulant includes a filler consisting essentially of glass particles having diameters smaller than 500 ?m, being essentially free of titania and lead oxide, and having a refractive index in the range of 1.48 to 1.60, with a variance of less than about 0.001.Type: GrantFiled: October 14, 2004Date of Patent: June 3, 2008Assignee: Yazaki CorporationInventors: Yongan Yan, Douglas Meyers, Mark Morris, D. Laurence Meixner, Satyabrata Raychaudhuri
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Patent number: 7311972Abstract: An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavelength in the range of 400 to 900 nm, at an encapsulant thickness of about 1 mm. The encapsulant includes a filler consisting essentially of glass particles having diameters smaller than 500 ?m, being essentially free of titania and lead oxide, and having a refractive index in the range of 1.48 to 1.60, with a variance of less than about 0.001.Type: GrantFiled: October 14, 2004Date of Patent: December 25, 2007Assignee: Yazaki CorporationInventors: Yongan Yan, Douglas Meyers, Mark Morris, D. Laurence Meixner, Satyabrata Raychaudhuri
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Patent number: 7304102Abstract: An encapsulant for use with opto-electronic devices and optical components incorporates a filler made from a glass that has been processed into particle form and heated to a predetermined temperature for a predetermined time, along with an epoxy having an index of refraction matched to that of the glass and heated to a predetermined temperature for a predetermined time, to prevent settling of the filler particles after mixing the filler particles with the epoxy, and thereby obtaining uniform dispersion of the particles within the epoxy. The encapsulant provides for high light transmittance, and its coefficient of thermal expansion can be varied by varying the amount of filler without substantially altering the optical properties of the encapsulant. The coefficient of thermal expansion variation within the encapsulant preferably is less than 30%, due to uniform dispersion of the filler particles within the epoxy.Type: GrantFiled: December 7, 2004Date of Patent: December 4, 2007Assignee: Yazaki CorporationInventors: Yongan Yan, Douglas Evan Meyers, Mark Allen Morris, D. Laurence Meixner, Satyabrata Raychaudhuri
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Patent number: 7285602Abstract: A granular epoxy resin is made by pulverizing an epoxy resin which is solid at ordinary temperature and can exhibit excellent fluidity during molding because of its low melt viscosity in which the total content of components having a molecular weight of 500 or less among components of n1=0 in the following general formula (1) and/or components of n2=0 in the following general formula (2) is 50% by mass or more of the entire epoxy resin, or, the total content of components having a molecular weight 400 or less among components of n1=0 in the following general formula (1) and/or components of n2=0 in the following general formula (2) is 20% by mass or more of the entire epoxy resin. The content of low molecular weight compounds having a molecular weight 200 or less in the granular epoxy resin is 0.3% by mass or less.Type: GrantFiled: March 5, 2004Date of Patent: October 23, 2007Assignee: Japan Epoxy Resins Co., Ltd.Inventors: Yasuyuki Murata, Atsuhito Hayakawa, Akihiro Itou
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Patent number: 7196151Abstract: A non crosslinked, covalently crosslinked and/or ionically crosslinked polymer, having repeating units of the general formula (1) —K—R—??(1) In which K is a bond, oxygen, sulphur, the radical R is a divalent radical of an aromatic or heteroaromatic compound.Type: GrantFiled: May 24, 2004Date of Patent: March 27, 2007Inventor: Thomas Häring
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Patent number: 7150902Abstract: Articles are coated by applying a coating composition of a high Tg phenoxy-type material having a Tg of at least about 75° C. to at least a portion of a surface of an article, and forming a dried/cured coating of the high Tg phenoxy-type material on the article surface, where the coating has the high Tg phenoxy-type material and a PHAE; or the article surface comprises a coating includes a PHAE; or the coating has the high Tg phenoxy-type material and a PHAE, and the article surface includes a coating layer of a PHAE.Type: GrantFiled: April 7, 2004Date of Patent: December 19, 2006Assignee: Pepsico, Inc.Inventor: Said Farha
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Patent number: 7108920Abstract: This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”), and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), on a carrier substrate, as well as compounds useful in such compositions. The compositions include compounds having a thermally cleavable linkage, and include an episulfide group within the compound. The compositions of this invention are reworkable when subjected to appropriate conditions.Type: GrantFiled: September 15, 2000Date of Patent: September 19, 2006Assignees: Henkel Corporation, Loctite (R&D) LimitedInventors: Lawrence N. Crane, Mark M. Konarski, Brendan J. Kneafsey, Afranio Torres-Filho, Z. Andrew Szczepaniak
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Patent number: 7087304Abstract: In accordance with the present invention, there are provided toughening agents which are useful for improving the performance properties of epoxy-based adhesive formulations. For example, epoxidized polysulfides have been found to be useful toughening agents of component level underfill adhesive compositions. Invention materials are liquid rubbers which provide improved fracture toughness while maintaining satisfactory capillary flow properties. Invention materials can be synthesized in neat (solventless) reactions from readily available low-cost raw materials and isolated in high yields. They have linear and branched telechelic structures with terminal epoxide functional groups, and are prepared without substantially increasing the molecular weight of the starting polysulfide materials. Invention materials are compatible with common epoxy formulations and may be used without purification. At low levels of incorporation, they provide adhesives that meet the minimum fracture toughness (Gq>2.Type: GrantFiled: February 19, 2003Date of Patent: August 8, 2006Assignee: Henkel CorporationInventors: John G. Woods, Yuhshi Luh, Mark M. Konarski
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Patent number: 7087663Abstract: Adducts ABC of epoxy resins A and reaction products BC of epoxy resins B with phosphorus-derived acids C, and mixtures of such adducts, containing a mass fraction of not more than 5% of unreacted acid C, the reaction products BC containing at least one acidic phosphoric ester group or phosphonic ester group per molecule, process for preparing them, and their use for preparing physically drying and also one-component and two-component coating materials.Type: GrantFiled: October 10, 2003Date of Patent: August 8, 2006Assignee: Surface Specialties Austria GmbHInventors: Roland Feola, Johann Gmoser
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Patent number: 7064157Abstract: The present invention relates to a phosphorus-containing epoxy resin, which is an epoxy resin modified with a side chain having a reactive phosphorus-containing compound. Also, the present invention relates to a flame-retardant resin composition, which comprises: (1) the phosphorus-containing epoxy resin, (2) a halogen-free hardener having a reactive hydrogen capable of reacting with the epoxy group in epoxy resin, and (3) a hardener promoter. The flame-retardant resin composition described above has improved excellent heat resistance and flame retardant property, and is especially suitable for adhesive laminates, composite materials, printed circuit boards, adhesive material for copper foils, and is suitable for IC packaging materials.Type: GrantFiled: February 27, 2001Date of Patent: June 20, 2006Assignee: Chang Chun Plastics Co., Ltd.Inventors: Kuen Yuan Hwang, Hong-Hsing Chen, An Pang Tu, Huan-Chang Chao
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Patent number: 7019086Abstract: A process for producing a modified polymer having, in the molecule thereof, an organic group(s) introduced thereinto and derived from a compound(s) having a free radical comprising reacting a polymer such as an elastomer with a compound having the free radical stable at an ordinary temperature in the presence of oxygen, after or while a carbon radical(s) is generated in the polymer, whereby the modified polymer having an improved bondability and processability is formed.Type: GrantFiled: December 1, 2003Date of Patent: March 28, 2006Assignee: The Yokohama Rubber Co., Ltd.Inventors: Hidekazu Onoi, Tetsuji Kawazura, Keisuke Chino
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Patent number: 6977279Abstract: The present invention relates to novel solventless reactive systems curable at room temperature, based on blocked polyisocyanates, primary amines, compounds with oxirane groups, and 2,3-dimethyl-3,4,5,6-tetrahydropyrimidine, and to processes for the preparation of these solventless reactive systems curable at room temperature.Type: GrantFiled: July 17, 2000Date of Patent: December 20, 2005Assignee: Bayer AktiengesellschaftInventors: Jörg Tillack, Wolfgang Puetz, Lutz Schmalstieg
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Patent number: 6955851Abstract: The invention provides new compositions of matter that are capable of forming cross-linked polymeric materials upon reaction with various known epoxy-containing compositions. Thus, the compositions of this invention are useful in the manufacturing of prepregs and laminates for PWB applications among many other uses. Preferred compositions of this invention include substituted hydroxyarylphosphine oxide mixtures, the glycidyl ether derivatives, or the epoxy resin oligomer adducts derived therefrom. The materials provide for laminates that have higher glass transition temperatures, improved thermal stability, and that are free of halogen.Type: GrantFiled: December 10, 2003Date of Patent: October 18, 2005Assignee: PABU Services, Inc.Inventors: Mark V. Hanson, Larry D. Timberlake
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Patent number: 6908963Abstract: The invention provides reagents and methods for conjugating polymers specifically to the ?-amine of polypeptides in high yield. The invention provides monofunctional, bifunctional, and multifunctional PEGs and related polymers having a thioester moiety capable of specifically conjugating to the ?-amine of a polypeptide having a cysteine or histidine at the N-terminus. The invention provides active thioester derivatives of PEG that have suitable reactivity with an N-terminal cysteine or histidine residue of a polypeptide to produce an amide bond between the PEG and polypeptide. Use of these active esters to prepare PEG-proteins and PEG-peptides is described.Type: GrantFiled: October 9, 2001Date of Patent: June 21, 2005Assignee: Nektar Therapeutics AL, CorporationInventors: Michael J. Roberts, Zhihao Fang
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Patent number: 6894116Abstract: A toughener comprising a trithiocarbonate polymer having an epoxy end group is described which is utilized with various thermosettable polymers such as epoxy, polyurethane, and the like. A toughened composition is made by curing the thermosettable polymer and the toughener utilizing various curing agents.Type: GrantFiled: August 15, 2002Date of Patent: May 17, 2005Assignee: Noveon IP Holdings Corp.Inventors: John Ta-Yuan Lai, Carole Angele Lepilleur, Carl Duane Weber, David Richard Egan, Deborah Susan Filla
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Patent number: 6855738Abstract: A process of making a nanoporous substrate, such as the matrix in an electrical laminate, by grafting onto an organic resin backbone a thermolabile functionality by reacting hydrogen active groups of the organic resin with a compound containing thermolabile groups; then thermally degrading the thermolabile groups grafted on the organic resin to form a nanoporous laminate. Advantageously, the nanoporous electrical laminate has a low dielectric constant (Dk) because of the nanopores present in the laminate matrix.Type: GrantFiled: June 6, 2003Date of Patent: February 15, 2005Assignee: Dow Global Technologies Inc.Inventors: Ludovic L. Valette, Catherine Marestin, Regis Mercier
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Patent number: 6849337Abstract: A powder coating composition contains solid particulates of a mixture of a solid material having at least two epoxide groups, each beta to a urethane or urea group, and a solid crosslinker reactive with epoxide groups.Type: GrantFiled: October 4, 2002Date of Patent: February 1, 2005Assignee: BASF CorporationInventors: Walter H. Ohrbom, Timothy S. December
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Publication number: 20040236037Abstract: The invention provides powder coatings having at least 25% by weight of an epoxy functional particulate component (a) having a Tg of at least 50° C.Type: ApplicationFiled: May 19, 2003Publication date: November 25, 2004Inventors: Timothy S. December, Lawrence Sacharski, Cynthia A. Stants
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Patent number: 6818702Abstract: A thermosetting resin composition that is useful as an epoxy resin-based overcoating agent for flexible circuit boards or for film carriers for the TAB method, and the like, providing basic properties required of general insulation protective films, since the cured coated films are excellent in adhesiveness, electric insulation property, chemical resistance, thermal resistance, and the like, reduced in warp caused by cure shrinkage, and excellent in flexibility.Type: GrantFiled: December 28, 2001Date of Patent: November 16, 2004Assignee: Ajinomoto Co., Inc.Inventors: Hiroshi Orikabe, Hiroshi Sakamoto, Tadahiko Yokota
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Patent number: 6815491Abstract: A reinforced thermoplastic composition includes a poly(arylene ether), a poly(alkenyl aromatic) compound, a polyolefin, a hydrogenated block copolymer with a high alkenyl aromatic content, a polyolefin-graft-cyclic anhydride copolymer, and a reinforcing filler. The composition exhibits high stiffness while maintaining high impact strength.Type: GrantFiled: November 1, 2001Date of Patent: November 9, 2004Assignee: General ElectricInventors: Adeyinka Adedeji, Thomas J. Hartle, John C. Haylock
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Patent number: 6814881Abstract: Semi-bleached to bleached sulfonated aromatic condensation resin alone or in combination with a semi-soluble methacrylic polymer of high molecular weight provides improved resistance to staining by acid colorants in a fibrous polyamide or wool substrate.Type: GrantFiled: March 19, 2002Date of Patent: November 9, 2004Assignee: Trichromatic Carpet Inc.Inventor: Yassin M. Elgarhy
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Patent number: 6812299Abstract: The thermosetting resin composition which is valuable for an undercoat of a printed wiring board, and does not leave an air bubble in a cured film, and makes the surface polishing easy and can form a smooth printed wiring board comprises (I) an adduct of epoxy resin with unsaturated aliphatic acid, (II) a (meth) arcylate, (III) a radical polymerization initiator, (IV) a crystallizable epoxy resin, and (V) a latent curing agent.Type: GrantFiled: July 8, 2002Date of Patent: November 2, 2004Assignee: San-ei Kagaku Co., Ltd.Inventors: Kiyoshi Sato, Kazunori Kitamura
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Patent number: 6809160Abstract: A resin composition comprises a resin (A) and a resin (B) as constituents, said resin (A) having a number average molecular weight of 1,000 to 35,000 and being at least one member selected from the group consisting of following (A1) and (A2): (A1) a polyester polyol, a polyether polyol, a polycarbonate polyol, a polyurethane polyol, a polyolefin polyol and an acrylic polyol, (A2) a polymer obtained by reacting said (A1) with a compound having at least one functional group selected from the group consisting of isocyanato, carboxyl and epoxy groups within a molecule thereof, a dialkyl carbonate, a cyclic carbonate, an alcohol, or a mixture of these, and said resin (B) having a sulfonium group and a propargyl group within the molecule thereof.Type: GrantFiled: November 26, 2001Date of Patent: October 26, 2004Assignee: Nippon Paint Co., Ltd.Inventors: Noriyuki Tsuboniwa, Motoki Fujii, Ichiro Kawakami, Takayuki Kokubun, Hiroyuki Sakamoto
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Patent number: 6805958Abstract: The present invention provides an epoxy resin composition containing (A) an epoxy resin having two or more epoxy groups in one molecule, (B) a phenolic curing agent, (C) a phenoxy resin containing a bisphenol S skeleton and having a weight average molecular weight of 5,000 to 100,000, and (D) a curing accelerator, wherein the epoxy resin (A) contains a phosphorus atom, and wherein 5 to 50 parts by weight of the phenoxy resin (C) and 0.05 to 10 parts by weight of the curing accelerator (D) are mixed with 100 parts by weight in total of the epoxy resin (A) and the phenolic curing agent (B).Type: GrantFiled: June 10, 2002Date of Patent: October 19, 2004Assignee: Ajinomoto Co., Inc.Inventors: Shigeo Nakamura, Tadahiko Yokota
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Publication number: 20040198925Abstract: A curable epoxy resin composition comprising at least: (A) a crystalline epoxy resin, (B) a phenol resin, and (C) a silicone resin composed of epoxy-containing organic groups and phenyl groups that define an average unit formula of this component. Component (C) is used in an amount of 0.1 to 500 parts by weight for 100 parts by weight of the sum of weights of components (A) and (B). The composition of the invention is suitable for transfer and injection molding and may find use as a curable epoxy resin composition for sealing parts of electrical and electronic devices.Type: ApplicationFiled: March 1, 2004Publication date: October 7, 2004Inventors: Yoshitsugu Morita, Hiroshi Ueki, Koji Nakanishi, Haruhiko Furukawa
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Patent number: 6800371Abstract: In one aspect, the invention provides a curable composition comprising a mixture of epoxy resin, catalyst and an epoxy reactive thioether-containing compound and the resulting adhesives. The resulting adhesives are water and/or solvent resistant and bond to plastics such as ABS, polycarbonate, and PMMA; polyimide; noble metals such as gold and palladium; and silicon-containing materials such as silicon wafer die and silicon dioxide.Type: GrantFiled: March 7, 2001Date of Patent: October 5, 2004Assignee: 3M Innovative Properties CompanyInventors: Kathleen B. Gross, Susan C. Noe, Alphonsus V. Pocius, William J. Schultz, Wendy L. Thompson
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Publication number: 20040171769Abstract: Novel phosphorus element-containing vinyl ester resin compositions and process for preparing epoxy vinyl ester resin compositions include non-halogenated, ignition resistant epoxy vinyl ester resin formulations. The ignition resistant epoxy vinyl ester resin formulations are advantageously used for making laminates for printed wiring boards and composite materials.Type: ApplicationFiled: March 9, 2004Publication date: September 2, 2004Inventors: David J. Brennan, John P. Everett, Bassam S. Nader
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Patent number: 6779656Abstract: The invention relates to polymerizable preparations which contain: (a) 3 to 80 wt. % of an epoxy or of a mixture of epoxies of general formula (I), whereby n and m, independent of one another, represent 0, 1, 2 or 3, and n+m ranges from 2 to 6, and whereby the molar mass of the epoxy or the average molar mass of the mixture of epoxies ranges from 250 to 1000 g/mol; (b) 0 to 80 wt. % of an epoxy or of a mixture of epoxies that differ from (a); (c) 3 to 85 wt. % of fillers; (d) 0.001 to 25 wt. % of initiators, retarders and/or accelerators, and; (e) 0 to 25 wt. % of auxiliary agents, whereby the specified percentages refer to the total weight of the preparation.Type: GrantFiled: July 11, 2002Date of Patent: August 24, 2004Assignee: 3M Espe AGInventors: Thomas Klettke, Wolfgang Weinmann
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Patent number: 6765071Abstract: This invention relates to a resin composition containing an aromatic episulfide which exhibits excellent moldability, heat resistance and optical properties. The composition comprises an aromatic episulfide compound (A) having two or more reactive groups represented by the following formula (1) (wherein X is O or S with S accounting for 50 mol % or more of X on the average and R1-R4 are independently hydrogen, halogen or an alkyl group with 1-4 carbon atoms) in its molecule, a glycidyl compound (B) composed of an aromatic glycidyl ether compound having two or more glycidyl groups in its molecule or a glycidyl ester compound having two or more glycidyl groups in its molecule, an acid anhydride (C) and a curing catalyst (D) as essential components and shows the following molar ratios of &bgr;-epithiopropyl group (a), glycidyl group (b) and acid anhdyride group (c); [(b)+(a)]/(c)=1.35-3.5, (a)/(c)=0.5-2.2 and (b)/(c)=0.5-1.9.Type: GrantFiled: April 26, 2002Date of Patent: July 20, 2004Assignee: Nippon Steel Chemical Co., Ltd.Inventors: Koichi Fujishiro, Hiroshi Ogata, Fumihiro Ohmori
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Patent number: 6740732Abstract: Novel phosphorus element-containing epoxy resin compositions and novel phosphorus-element containing epoxy resin compositions based on an isomeric mixture of tris(2-hydroxyphenyl)-phosphine oxide compounds including non-halogenated, ignition resistant epoxy resin formulations. The ignition resistant epoxy resin formulations are advantageously used for making laminates for printed wiring boards and composite materials.Type: GrantFiled: April 11, 2002Date of Patent: May 25, 2004Assignee: Dow Global Technologies Inc.Inventors: David J. Brennan, John P. Everett, Bassam S. Nader
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Patent number: 6737474Abstract: Disclosed are a modified polyvinyl acetal resin consisting essentially of repeating units represented by the following formula (I), and a modifier for curable resins which comprises the modified polyvinyl acetal resin: wherein R1 represents an optionally substituted aryl group, an optionally substituted aralkyl group, or an optionally substituted alkenyl group having an optionally substituted aryl group; R2 represents a hydrogen atom or an alkyl group having 1 to 10 carbon atoms; R3 represents an optionally substituted, bivalent hydrocarbon group having 1 to 20 carbon atoms; and a, b, c, d, and e indicate the proportions in mol % of the respective structural units in the formula and satisfy 0<a≦85, 0≦b≦80, 0≦c≦50, 0≦d≦30, and 0<e≦50; a curable resin composition comprising a curable resin (A), a curing agent (B), and a modified polyvinyl acetal resin (C) consisting essentially of repeating units represented by (I′); and a laminated product comprising a layeType: GrantFiled: November 8, 2002Date of Patent: May 18, 2004Assignee: Mitsubishi Chemical CorporationInventors: Toshiyuki Tanaka, Jun Enda, Hiroo Katayama
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Patent number: 6709753Abstract: A resin composition is provided comprising a silicone-modified epoxy or phenolic resin obtained by reacting an epoxy or phenolic resin having specific structural units with an organopolysiloxane. The modified epoxy or phenolic resin is such that after the modified epoxy or phenolic resin is cured alone or together with another epoxy resin and/or phenolic resin to form a cured product, the organopolysiloxane component does not form a phase separation structure in the cured product. The composition cures into a product having both the adherence, heat resistance and humidity resistance characteristic of epoxy or phenolic resins and the flexibility and impact resistance characteristic of silicone resins.Type: GrantFiled: February 22, 2002Date of Patent: March 23, 2004Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Tsuyoshi Honda, Toshio Shiobara, Tatsuya Kanamaru
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Patent number: 6670425Abstract: Anti-reflective compositions and methods of using those compositions with low dielectric constant materials are provided. In one embodiment, the compositions include polymers comprising recurring monomers having unreacted epoxide groups. In another embodiment, the polymers further comprise recurring monomers comprising epoxide rings reacted with a light attenuating compound so as to open the ring. The compositions can be applied to dielectric layers so as to minimize or prevent reflection during the dual damascene process while simultaneously blocking via or photoresist poisoning which commonly occurs when organic anti-reflective coatings are applied to low dielectric constant layers.Type: GrantFiled: June 5, 2001Date of Patent: December 30, 2003Assignee: Brewer Science, Inc.Inventors: Rama Puligadda, James E. Lamb, III, Tony D. Flaim, Runhui Huang, Xie Shao
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Patent number: 6663916Abstract: Anti-reflective compositions and methods of using those compositions with low dielectric constant materials are provided. In one embodiment, the compositions include polymers comprising recurring monomers having unreacted epoxide groups. In another embodiment, the polymers further comprise recurring monomers comprising epoxide rings reacted with a light attenuating compound so as to open the ring. The compositions can be applied to dielectric layers so as to minimize or prevent reflection during the dual damascene process while simultaneously blocking via or photoresist poisoning which commonly occurs when organic anti-reflective coatings are applied to low dielectric constant layers.Type: GrantFiled: June 18, 2002Date of Patent: December 16, 2003Assignee: Brewer Science, Inc.Inventors: Rama Puligadda, James E. Lamb, III, Tony D. Flaim, Runhui Huang, Xie Shao
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Patent number: 6616979Abstract: Provided are low temperature curing thermosetting epoxy powder coating compositions comprising at least one non-crystalline epoxy resin, at least one crystalline epoxy resin, a curing agent, and a cure catalyst. Coatings made from such powder compositions exhibit a substantial reduction in bubble entrapment, enough to prevent a visible haze from forming in the coating, when cured at low temperatures demanded by brass substrates.Type: GrantFiled: August 13, 2001Date of Patent: September 9, 2003Assignee: Rohm and Haas CompanyInventors: William G. Ruth, Stacy L. Greth, Carryll A. Seelig, Dean A. Schreffler
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Patent number: 6613438Abstract: The invention relates to a one-component epoxy resin adhesive which is elasticated with silicone rubber and whose open joint time is adaptable to whichever production process it is being used in by the concentration of UV initiator and/or the duration and/or intensity of UV activation and which is therefore particularly suitable for automatable manufacturing processes, since the workpieces after initial fixing require no additional mounts even during thermal aftercuring. This adhesive is preferentially suitable for the extensive adhesive bonding of permanent magnets, such as in the assembly of a permasyn motor, for example.Type: GrantFiled: July 26, 2001Date of Patent: September 2, 2003Assignee: Siemens AktiengesellschaftInventors: Peter Hein, Winfried Plundrich, Ralf Wilcke, Ernst Wipfelder
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Patent number: 6576690Abstract: The present invention relates to a phosphorous-containing flame retarding epoxy resin and their composition comprising the nitrogen-containing flame retarding epoxy resin. More specifically, the present invention relates to a flame retarding epoxy resin having a pendent phosphorous-containing functional group and their composition comprising the nitrogen-containing flame retarding epoxy resin. The flame retarding phosphorous-containing epoxy resin and the epoxy resin composition containing the same of the present invention possess excellent flame retarding property and heat resistance without containing halogen and diantimony trioxide. Therefore they are useful as an encapsulating material in the semiconductor industry and the cured article prepared from the composition exhibits excellent molding ability and excellent reliance.Type: GrantFiled: March 22, 2002Date of Patent: June 10, 2003Assignee: Chang Chung Plastics Co., Ltd.Inventors: Kuen-Yuan Hwang, Hong-Hsing Chen, Chih-Fu Chen
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Patent number: 6555601Abstract: A process for impregnating an electrical coil which comprises a winding comprising two or more layers consisting of more than one turn of an electrically conducting wire-form material with a polymer material which electrically insulates the individual turns of the wire-form material from one another with the aid of a thermally curable epoxy resin composition, which composition is solid at room temperature and comprises the following constituents: (a) an epoxy resin which is solid at room temperature, selected from (a1) polyglycidyl ethers based on novolaks; (a2) diglycidyl ethers based on bisphenols, and (a3) mixtures of more than one of components (a1) and (a2); (b) a crosslinking agent for component (a); (c) a suitable accelerator for the reaction of component (a) and component (b); (d) from 15 to 70 percent by weight, based on the overall weight of the composition, of filler selected from (d1) calcium carbonate, (d2) quartz flour, (d3) wollastonite whose particles have an average ratio of lengthType: GrantFiled: December 16, 1999Date of Patent: April 29, 2003Assignee: Vantico Inc.Inventors: Dean Tallak Behm, Ulrich Weidmann, Philip David Willis, Felix Bleuel, Hans-Fred Buchmann, Dieter Glauch
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Patent number: 6555617Abstract: Disclosed are a modified polyvinyl acetal resin consisting essentially of repeating units represented by the following formula (I), and a modifier for curable resins which comprises the modified polyvinyl acetal resin: wherein R1 represents an optionally substituted aryl group, an optionally substituted aralkyl group, or an optionally substituted alkenyl group having an optionally substituted aryl group; R2 represents a hydrogen atom or an alkyl group having 1 to 10 carbon atoms; R3 represents an optionally substituted, bivalent hydrocarbon group having 1 to 20 carbon atoms; and a, b, c, d, and e indicate the proportions in mol % of the respective structural units in the formula and satisfy 0<a≦85, 0≦b≦80, 0≦c≦50, 0≦d≦30, and 0<e≦50; a curable resin composition comprising a curable resin (A), a curing agent (B), and a modified polyvinyl acetal resin (C) consisting essentially of repeating units represented by (I′); and a laminated product comprising a layeType: GrantFiled: July 28, 2000Date of Patent: April 29, 2003Assignee: Mitsubishi Chemical CorporationInventors: Toshiyuki Tanaka, Jun Enda, Hiroo Katayama
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Patent number: 6552135Abstract: The present invention pertains to a process for the cross-linking of modified engineering thermoplastics, in particular, of polymeric sulfinic acids or sulfinic acid salts. In particular, the invention pertains to a process for the preparation of cross-linked polymers, characterized in that solutions of polymeric sulfinic acids or sulfinic acid salts (—SO2Me), optionally in the presence of organic di- or oligohalogeno compounds [R(Hal)x], are freed from solvent and cross-linked to polymers, wherein Me stands for a monovalent or polyvalent metal cation; R stands for an optionally substituted alkyl or aryl residue containing from 1 to 20 carbon atoms; and Hal stands for F, Cl, Br or I.Type: GrantFiled: January 16, 2001Date of Patent: April 22, 2003Inventors: Werner Schnurnberger, Jochen Kerres, Wei Cui
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Patent number: 6528595Abstract: A composition useful as a sealant, coating, a potting agent for a printed circuit board, a prepreg or an adhesive comprises a compound (A) wherein all or a part of the oxirane rings in an epoxy compound is replaced with thiirane rings represented by the following formula (1): or compound (A) and compound (B) which contains oxirane rings and no thiirane ring in the molecule, wherein the ratio of oxirane ring/thiirane ring is from 90/10 to 10/90.Type: GrantFiled: October 6, 2000Date of Patent: March 4, 2003Assignee: The Yokohama Rubber Co., Ltd.Inventors: Masahiro Ikawa, Hiroyuki Okuhira, Keisuke Chino
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Patent number: 6518331Abstract: A multilayer printed circuit board having resinous insulating layers and conductor layers alternately superposed on a circuit board with ample adhesive strength, a method for the production thereof, and a curable resin composition useful for the formation of resinous insulating layers are disclosed. The manufacture of the multilayer printed circuit board is accomplished by applying the curable resin composition to the surface of conductor layer of the circuit board, thermally curing the applied layer thereby forming resinous insulating layer, then boring a through-hole in the circuit board, treating the resinous insulating layer with a coarsening agent thereby imparting undulating coarsened surface thereto, subsequently coating the surface of resinous insulating layer and the inner surface of the through-hole with a conductor layer as by electroless plating, and thereafter forming a prescribed circuit pattern in the conductor layer.Type: GrantFiled: December 5, 2000Date of Patent: February 11, 2003Assignee: Taiyo Ink Manufacturing Co., Ltd.Inventors: Akio Sekimoto, Shinichi Yamada
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Patent number: 6403220Abstract: Novel phosphorus element-containing crosslinking agents for epoxy resin compositions based on an isomeric mixture of tris(2-hydroxyphenyl)-phosphine oxide compounds. Epoxy resins cured or crosslinked with the crosslinking agents of this invention yield non-halogenated, ignition resistant epoxy resin formulations. The ignition resistant epoxy resin formulations are advantageously used for making laminates for printed wiring boards and composite materials.Type: GrantFiled: December 11, 2000Date of Patent: June 11, 2002Assignee: The Dow Chemical CompanyInventors: David J. Brennan, John P. Everett, Bassam S. Nader
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Patent number: 6361879Abstract: A sealed semiconductor chip having a surface film of a sealed resin composition, wherein the resin composition has a linear expansion coefficient of 60×10−6/K or less at a temperature equal to or less than its glass transition point and 140×10−6/K or less at a temperature equal to or higher than its glass transition point; a semiconductor-sealing resin composition for sealing a semiconductor chip, which has a linear expansion coefficient of 60×10−6/K or less at a temperature equal to or less than its glass transition point and 140×10−6/K or less at a temperature equal to or higher than its glass transition point; the sealed semiconductor chip is chip size and has high reliability; the semiconductor-sealing resin composition creates a good seal on chip wafers and has high reliability; and the chip wafers sealed with a surface film of the resin composition warp little.Type: GrantFiled: September 23, 1999Date of Patent: March 26, 2002Assignees: Toray Industries, Inc., Fujitsu LimitedInventors: Yasuaki Tsutsumi, Masayuki Tanaka, Toshimi Kawahara, Yukio Takigawa
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Patent number: 6359029Abstract: Binders for road-marking paints, comprising a (meth)acrylate copolymer A and one or more olefinincally unsaturated monomers B which can be cured by adding free-radical initiators C, wherein the binders have mass fractions of from 20 to 80% of the (meth)acrylate copolymer A and from 80 to 20% of the olefinically unsaturated monomers B, where the (meth)acrylate copolymers A are obtainable by reacting, mass fractions of, from 10 to 50% of compounds A1 selected from the group consisting of from 10 to 50% of compounds A1 selected from the group consisting of monoexpoxides, lactones and lactams having from 4 to 18 carbon atoms, from 1 to 25% of olefinically unsaturated monomers A2 which contain at least one acid group selected from the group consisting of carboxyl groups, sulfonic acid groups and phosphonic acid groups, from 5 to 70% of methacylates A3 of linear, branched or cyclic alchohols having from 1 to 20 carbon atoms, from 2 to 84% of acrylates A4 of linear, branched or cyclic alcohols having from 2 to 2Type: GrantFiled: June 21, 2000Date of Patent: March 19, 2002Assignee: Solutia Resins GmbHInventors: Ingo Kriessmann, Gerfried Klintschar, Ulrich Epple, Adolf Labenbacher
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Patent number: 6309751Abstract: To a substrate such as brass is applied a powder coating comprising a) at least one non-crystalline epoxy resin, b) at least one crystalline epoxy resin such as tetramethylbisphenol diglycidyl ether in an amount sufficient to reduce or eliminate bubble entrapment within the cured coating when cured at a temperature of below about 350° F. (about 177° C.), and c) a curing agent such as dicyandiamide.Type: GrantFiled: June 28, 2000Date of Patent: October 30, 2001Assignee: Rohm and Haas CompanyInventors: William G. Ruth, Stacy L. Greth, Carryll A. Seelig, Dean A. Schreffler