Wherein Unsaturated Reactant Is A Carboxylic Acid Or Derivative Or Polymer Derived Therefrom Patents (Class 525/530)
  • Patent number: 10184034
    Abstract: The carbon fiber forming raw material is a carbon fiber forming raw material (Z) as a prepreg including sizing agent-coated carbon fibers and a thermosetting resin or a carbon fiber forming raw material (Y) as a forming material that includes sizing agent-coated carbon fibers and has a woven fabric form or a braid form. The sizing agent includes components (A) and (B). The component (A) is an epoxy compound having two or more epoxy groups or two or more types of functional groups. The component (B) is one or more compounds selected from the group consisting of a tertiary amine compound, a tertiary amine salt, a quaternary ammonium salt, a quaternary phosphonium salt, and a phosphine compound. The component (B) is contained in an amount of 0.1 to 25 parts by mass relative to 100 parts by mass of the component (A).
    Type: Grant
    Filed: November 12, 2012
    Date of Patent: January 22, 2019
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Yoshifumi Nakayama, Toshiya Kamae, Daigo Kobayashi, Makoto Endo
  • Patent number: 9908953
    Abstract: Controlled thermal crosslinking in a polyacrylate-based composition is accomplished by a crosslinker-accelerator system for the thermal crosslinking of polyacrylates having functional groups suitable for entering into linking reactions with epoxide groups, comprising at least one substance comprising at least one epoxide group (crosslinker) and at least one substance of the general formula (I) R1R2N—CR3R4—CR5R6—(CR7R8)n—NR9R10??(I) wherein the radicals R1, R2, R9 and R10 independently of one another are a hydrogen atom or a substituted or unsubstituted alkyl or cycloalkyl radical having 1 to 8 carbon atoms or an alkylene group bonded to the main chain and having 1 to 8 carbon atoms, where at least one of the radicals R1, R2, R9 and R10 is not a hydrogen atom; the radicals R3, R4, R5, R6, R7 and R8 independently of one another are a hydrogen atom or an alkyl group having 1 to 8 carbon atoms or form a 5-7-membered cycloalkylene group; and n is an integer from 0 to 4 (accelerator).
    Type: Grant
    Filed: January 18, 2013
    Date of Patent: March 6, 2018
    Assignee: TESA SE
    Inventors: Alexander Prenzel, Sarah Bamberg, Jennifer Beschmann, Marten Papenbroock
  • Patent number: 9593444
    Abstract: Disclosed is a method for producing a sizing agent-coated carbon fibers, wherein at least one kind of sizing agent that is selected from the group consisting of sizing agents (a), (b) and (c) is used for coating, in each of the sizing agents a bi- or higher functional epoxy compound (A1) and/or an epoxy compound (A2) being used as a component (A), and the epoxy compound (A2) having a mono- or higher functional epoxy group and at least one functional group that is selected from among a hydroxyl group, an amide group, an imide group, a urethane group, a urea group, a sulfonyl group and a sulfo group. The sizing agent is applied to carbon fibers and the resulting is subjected to a heat treatment within the temperature range of 160-260° C. for 30-600 seconds.
    Type: Grant
    Filed: June 24, 2011
    Date of Patent: March 14, 2017
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Yoshifumi Nakayama, Toshiya Kamae, Daigo Kobayashi, Makoto Endo
  • Patent number: 9206301
    Abstract: Structural, radically curable resin compositions suitable for (re)lining contain: a. 30-70 wt. % of a resin characterized by (i) a molecular weight Mn between 500 and 3000 and (ii) an acid value between 0 and 30 mg KOH/g resin, and wherein at least 80% of the total amount of resin is vinyl ester resin, b. 30-70 wt. % of at least one reactive diluent, characterized in that at least 25% of the reactive diluent is a difunctional diluent having a molecular weight Mn between 200 and 500 and the optional monofunctional diluent having a molecular weight Mn between 100 and 200, c. 0.00001-5 wt. % initiator, d. 0.00001-5 wt. % inhibitor. wherein the average molecular weight per reactive unsaturation (WPU) of the components (a) and (b) is equal or greater than 190 Dalton and that the amount of styrene in the resin composition is less than 5 wt. % (calculated as wt. % of the total weight of the components (a), (b), (c) and (d)).
    Type: Grant
    Filed: May 9, 2013
    Date of Patent: December 8, 2015
    Assignee: DSM IP ASSETS B.V.
    Inventors: Joanna Klein Nagelvoort, Cornelis Den Besten, Johan Franz Gradus Antonius Jansen
  • Patent number: 9162431
    Abstract: Provided is a gas-barrier laminate film that has a layer containing a one-pack adhesive coating material layer having good adhesiveness to various substrates and containing a polyamine resin. The laminate film has at least a substrate, an adhesive coating material layer and a sealant layer laminated in this order, wherein the adhesive coating material to form the adhesive coating material layer contains a polyamine resin, the polyamine resin contains a skeletal structure represented by the following formula (1) in an amount of at least 40% by mass, and the polyamine resin contains a metal atom in an amount of from 2.
    Type: Grant
    Filed: July 26, 2011
    Date of Patent: October 20, 2015
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Nobuhiko Matsumoto, Eiichi Honda, Kana Okada
  • Patent number: 9028970
    Abstract: Provided are an adhesive composition with good storage stability, heat resistance, moisture resistance reliability, and adhesion properties; and a curl- and heat-resistant adhesive film and a wiring film using the adhesive composition. The adhesive composition contains 100 parts by weight of a phenoxy resin (A) having plural alcoholic hydroxyl groups in a side chain of the molecule thereof; 2 to 60 parts by weight of a polyfunctional isocyanate compound (B) having an isocyanate group and at least one functional group selected from vinyl, acrylate, and methacrylate groups in the molecule thereof; and 5 to 30 parts by weight of a maleimide compound (C) having plural maleimide groups in the molecule thereof or/and reaction product thereof, in which a total amount of the components (B) and (C) is from 7 to 60 parts by weight.
    Type: Grant
    Filed: February 20, 2013
    Date of Patent: May 12, 2015
    Assignee: Hitachi Metals, Ltd.
    Inventors: Satoru Amou, Tomiya Abe, Daisuke Shanai, Hiroaki Komatsu, Kenichi Murakami
  • Publication number: 20150126691
    Abstract: Methods are generally provided for preparing a polymeric composition that includes a grafted block copolymer. Methods are also generally provided for preparing a polymeric composition that includes a star block copolymer prepared from a central core molecule that includes a plurality of attachment moieties. Methods are also generally provided for preparing a polymeric composition that includes a linear block copolymer. Block copolymers are also generally provided. Multi-segmented linear block copolymers are also generally provided.
    Type: Application
    Filed: October 17, 2014
    Publication date: May 7, 2015
    Inventors: Chuanbing Tang, Christopher G. Hardy, Alper Nese, Jeffery Hayat
  • Patent number: 9005761
    Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 1 to 100 parts by weight of benzoxazine resin per 100 parts by weight of (A); (C) 1 to 100 parts by weight of styrene-maleic anhydride per 100 parts by weight of (A); (D) 0.5 to 30 parts by weight of amine curing agent per 100 parts by weight of (A); and (E) 5 to 150 parts by weight of halogen-free flame retardant per 100 parts by weight of (A). The composition obtains properties of low dielectric constant, low dissipation factor, high heat resistance and flame retardancy by specific composition and ratio. Thus, a prepreg or a resin film, which can be applied to a copper clad laminate and a printed circuit board, is formed.
    Type: Grant
    Filed: December 22, 2011
    Date of Patent: April 14, 2015
    Assignee: Elite Material Co., Ltd.
    Inventor: Yu-Te Lin
  • Publication number: 20150080535
    Abstract: The present invention relates to a process for the preparation of a hydroxy-amino polymer, comprising the steps: a) reacting an H-functional starter compound carrying at least one Zerewitinoff-active H atom with an unsaturated cyclic carboxylic acid anhydride to give a carboxyl-group-carrying prepolymer, b) reacting the carboxyl-group-carrying prepolymer with at least one epoxide compound to give a hydroxyl-group-carrying prepolymer, c) adding a primary amine and/or ammonia to the double bond of the hydroxyl-group-carrying prepolymer obtained according to step b) to give the hydroxy-amino polymer, wherein the ratio of the amount of carboxylic acid anhydride to the number of Zerewitinoff-active H atoms of the H-functional starter compound is so chosen that almost all the Zerewitinoff-active H atoms of the H-functional starter compound are reacted.
    Type: Application
    Filed: December 17, 2012
    Publication date: March 19, 2015
    Inventors: Jörg Hofmann, Klaus Lorenz, Hartmut Nefzger
  • Patent number: 8927677
    Abstract: A curable epoxy resin composition comprising (a) at least one epoxy resin; (b) at least one curing agent; and (c) at least one high molecular weight poly(propylene oxide) poiyol toughening agent; and a process for preparing the curable epoxy resin composition.
    Type: Grant
    Filed: March 22, 2011
    Date of Patent: January 6, 2015
    Assignee: Dow Global Technologies LLC
    Inventors: Radhakrishnan Karunakaran, Rajesh Turakhia
  • Patent number: 8895148
    Abstract: A structural adhesive composition that is suitable for high-strength bonding of metals and aerospace structural materials. In one embodiment, the structural adhesive composition based on a two-part system, which is curable at or below 200° F. (93° C.). The two-part system is composed of a resinous part (A) and a catalyst part (B), which may be stored separately at room temperature until they are ready to be used. The resinous part (A) includes at least two different multifunctional epoxy resins, toughening components, and inorganic filler particles. The catalyst part (B) includes an aliphatic or cyclic amine compound as a curing agent and inorganic filler. In another embodiment, the structural adhesive composition is based on a one-part system, which includes the components of the resinous part (A) mixed with a latent amine curing agent. The one-part system may further include an imidazole and/or an aliphatic amine.
    Type: Grant
    Filed: October 16, 2012
    Date of Patent: November 25, 2014
    Assignee: Cytec Technology Corp.
    Inventors: Junjie Jeffrey Sang, Dalip Kumar Kohli, Kunal Gaurang Shah
  • Publication number: 20140336301
    Abstract: The invention provides highly functional epoxy resins that may be used themselves in coating formulations and applications but which may be further functionalized via ring-opening reactions of the epoxy groups yielding derivative resins with other useful functionalities. The highly functional epoxy resins are synthesized from the epoxidation of vegetable or seed oil esters of polyols having 4 or more hydroxyl groups/molecule. In one embodiment, the polyol is sucrose and the vegetable or seed oil is selected from corn oil, castor oil, soybean oil, safflower oil, sunflower oil, linseed oil, tall oil fatty acid, tung oil, vernonia oil, and mixtures thereof. Methods of making of the epoxy resin and each of its derivative resins are disclosed as are coating compositions and coated objects using each of the resins.
    Type: Application
    Filed: February 4, 2011
    Publication date: November 13, 2014
    Inventors: Dean C. Webster, Partha Pratim Sengupta, Zhigang Chen, Xiao Pan, Adlina Paramarta
  • Patent number: 8883938
    Abstract: The present invention provides a resin composition for a fiber-reinforced composite material, which has excellent fluidity at low temperature and which produces a cured product having excellent mechanical strength, and also provides a cured product thereof, a fiber-reinforced composite material, a fiber-reinforced resin molding having excellent heat resistance, and a process for producing a fiber-reinforced resin molding with good productivity. A resin composition for a fiber-reinforced composite material contains, as essential components, an epoxy resin (A), an acid group-containing radical polymerizable monomer (B), a radical polymerization initiator (C), and an amine-based curing agent (D) for an epoxy resin, and has a viscosity of 500 mPa·s or less at 50° C. measured with an E-type viscometer. The composition is impregnated into reinforcing fibers and cured.
    Type: Grant
    Filed: September 14, 2010
    Date of Patent: November 11, 2014
    Assignee: DIC Corporation
    Inventors: Atsuko Kobayashi, Ichirou Ogura
  • Patent number: 8790779
    Abstract: A thermally curable adhesive in strip or film form, having a thickness in the range of 0.1 to 5 mm, containing: a) at least one reactive epoxy prepolymer, b) at least one latent hardener for epoxies, and c) one or more elastomers that are selected from: c1) thermoplastic polyurethanes, c2) thermoplastic isocyanates, and c3) block copolymers having thermoplastic polymer blocks. Further components can additionally be contained, for example a blowing agent for foaming. The adhesive in the uncured state at 22° C. is bendable or wrappable and can be extended at least 100% before tearing. It can be laid onto a foil. It can be used, for example, for adhesive bonding of planar, tubular, or cylindrical components, preferably components made of metal, wood, ceramic, or ferrites.
    Type: Grant
    Filed: November 16, 2011
    Date of Patent: July 29, 2014
    Assignee: Henkel AG & Co. KGaA
    Inventors: Eugen Bilcai, Emilie Barriau, Martin Renkel, Sven Wucherpfennig
  • Patent number: 8759422
    Abstract: An adhesive composition comprising elastomeric polymer, epoxy resin, reactive diluent, and filler, is suitable for use within the electronics industry, and in particular for wafer back side coating adhesives. The elastomeric polymer is a mixture of a vinyl elastomer and an epoxy elastomer; the reactive diluent is a combination of two or more diluents, one of which must have carbon to carbon unsaturation, providing cross-linking within the composition after cure; and the filler is a non-conductive filler.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: June 24, 2014
    Assignee: Henkel IP & Holding GmbH
    Inventors: Eric C. Wang, Kevin Harris Becker, Qizhuo Zhuo
  • Patent number: 8748536
    Abstract: Multi-piece, solid golf balls containing an inner core, an intermediate layer surrounding the core, and an outer cover are provided. At least one layer is made from an epoxy composition comprising a curing agent such as zinc diacrylate or zinc dimethacrylate. The epoxy composition is produced by reacting an epoxy prepolymer with a curing agent. Preferably, the epoxy composition is used to form an intermediate and/or cover layer resulting in a golf ball having high resiliency, good impact durability, and soft feel.
    Type: Grant
    Filed: October 5, 2009
    Date of Patent: June 10, 2014
    Assignee: Acushnet Company
    Inventors: Brian Comeau, David A. Bulpett
  • Patent number: 8716413
    Abstract: A method for the preparation of a photocurable resin by a reaction comprising the following steps i) reacting a mixture of a novolak type epoxy resin (A) and a dicyclopentadiene-phenol glycidylether resin (B) with ii) an advancement component (C) containing at least 2 phenolic hydroxyl groups per molecule; iii) reacting with an unsaturated monocarboxylic acid (D); and iv) esterification of the unsaturated group containing resin obtained from the steps of i) to iii) with a polycarboxylic acid anhydride or a carboxylic acid anhydride (E) is disclosed.
    Type: Grant
    Filed: June 12, 2009
    Date of Patent: May 6, 2014
    Assignee: Huntsman Advanced Materials Americas LLC
    Inventors: Kai Dudde, Sabine Pierau, Martin Roth
  • Patent number: 8618231
    Abstract: A reactive component suitable for use in a radiation-curable composition, which comprises an acrylated epoxy-amine oligomer represented by the formula (I): C-B-[A-B]n-A-B-C wherein: n is from 2 to 500; each A is individually a unit derived from a diglycidyl ether; each B is individually a unit derived from a difunctional secondary amine or a monofunctional primary amine; and each C is individually a unit derived from a multifunctional acrylate monomer, radiation-curable compositions, such as inks, coatings and adhesives, comprising said reactive component and methods of making said reactive component.
    Type: Grant
    Filed: October 19, 2009
    Date of Patent: December 31, 2013
    Assignee: Sun Chemical B.V.
    Inventors: Shaun Herlihy, Luisa Fuertes
  • Patent number: 8618194
    Abstract: A resin mortar composition suitable for construction purposes is disclosed. The composition includes a resin component (A) curable with an aliphatic amine and a peroxide and a hardener component (H) with at least one peroxide (B) and at least one amine (C). At least one of the resin component (A) and the hardener component (H) contains at least one inorganic filler and the resin component (A) and the hardener component (H) or the resin composition (A) and the at least one peroxide (B) and the at least one amine (C) of the hardener component (H) are spatially separated from one another. The resin component (A) includes a compound (a) capable of undergoing a radical polymerization, a compound (b) capable of reacting with an amine, a transition metal compound (c), at least one inhibitor (d) to adjust the gel time and a bridging compound (e) having at least two reactive functionalities.
    Type: Grant
    Filed: February 10, 2011
    Date of Patent: December 31, 2013
    Assignee: Hilti Aktiengesellschaft
    Inventor: Armin Pfeil
  • Patent number: 8597785
    Abstract: The present invention provides an adhesive tape comprising a flux-active compound having a carboxyl group and/or a phenolic hydroxyl group, a thermosetting resin and a film-forming resin. In the adhesive tape of the present invention, the thermosetting resin may be an epoxy resin and may contain a curing agent. The curing agent may be an imidazole compound and/or a phosphorous compound. The adhesive tape of the present invention can be used as an interlayer material for a circuit board and a multilayered flexible printed circuit board.
    Type: Grant
    Filed: September 28, 2007
    Date of Patent: December 3, 2013
    Assignee: Sumitomo Bakelite Co., Ltd.
    Inventors: Toshio Komiyatani, Takashi Hirano, Kenzou Maejima, Satoru Katsurayama, Tomoe Yamashiro
  • Publication number: 20130299747
    Abstract: The invention provides epoxy and oxetane compositions including the novel acyloxy and N-acyl curing agents described herein. Use of invention curing agents result in cured adhesive compositions with remarkably increased adhesion and reduced hydrophilicity when compared to resins cured with other types of curing agents. Furthermore, the curatives of this invention do not interfere with free-radical cure and are thus suited for use in hybrid cure thermoset compositions.
    Type: Application
    Filed: March 11, 2013
    Publication date: November 14, 2013
    Inventor: Stephen M. Dershem
  • Patent number: 8575280
    Abstract: Disclosed is a thermosetting resin composition including; (A) a carboxyl group-containing polyurethane prepared by using (a) a polyisocyanate compound (b) polyol compounds (c) a carboxyl group-containing dihydroxy compound as raw materials, (B) a curing agent, wherein the polyol compounds (b) are one or more kinds of polyol compound(s) selected from Group (I) and one or more kinds of polyol compound(s) selected from Group (II); Group I: polycarbonate polyol, polyether polyol, polyester polyol, and polylactone polyol, Group II: polybutadiene polyol, polysilicone having terminal hydroxyl groups, and such a polyol that has 18 to 72 carbon atoms and oxygen atoms present only in hydroxyl groups. The thermosetting resin composition can give a protection film for flexible printed circuits that has excellent long-term reliability of electric insulation, flexibility, and low warpage from curing shrinkage, and particularly low tackiness.
    Type: Grant
    Filed: December 7, 2006
    Date of Patent: November 5, 2013
    Assignee: Showa Denko K.K.
    Inventors: Hiroshi Uchida, Ritsuko Azuma
  • Publication number: 20130230676
    Abstract: Compositions are disclosed that comprise at least one compound of formula IV: wherein the variable are as defined in the specification. The compositions are antimicrobial and optionally curable, and useful, inter alia, in dental, medical, and industrial applications for reinforcement and/or adhering two surfaces together.
    Type: Application
    Filed: August 24, 2012
    Publication date: September 5, 2013
    Inventors: John D. Blizzard, Kirk Kimmerling, Joseph P. Rapp
  • Publication number: 20130187095
    Abstract: The invention is based on the discovery that adhesive compositions containing certain low-viscosity, mono-ethylenically unsaturated monomers have surprisingly good cure parameters, resulting in very little weight loss upon cure. Many of these monofunctional monomers used alone or in combination with other monofunctional monomers described herein have high glass transition temperatures when cured. Moreover, since these monomers are monofunctional the crosslink density of the adhesive composition does not increase (relative to multi-functional monomers), which in turns results in lower stress, lower modulus adhesive compositions. As such, these monomers are useful in a variety of thermoset adhesive compositions, such as for example, die attach adhesive compositions.
    Type: Application
    Filed: February 16, 2013
    Publication date: July 25, 2013
    Applicant: DESIGNER MOLECULES, INC.
    Inventor: Designer Molecules, Inc.
  • Patent number: 8491749
    Abstract: A two-part structural adhesive composition comprising a curable epoxy resin, an amine curing agent, a toughening agent, and a reactive liquid modifier. The structural adhesive may also include secondary curatives, initiators, reactive diluents and combinations thereof. The structural adhesives may be used to replace or augment conventional joining means such as welds or mechanical fasteners in bonding parts together.
    Type: Grant
    Filed: July 22, 2009
    Date of Patent: July 23, 2013
    Assignee: 3M Innovative Properties Company
    Inventors: Ilya Gorodisher, Alphonsus V. Pocius, Babu N. Gaddam
  • Patent number: 8487052
    Abstract: The present invention provides a resin composition for a fiber-reinforced composite material, which has excellent fluidity and impregnation into a fiber base material and which produces a cured product having excellent heat resistance. A resin composition for a fiber-reinforced composite material contains, as essential components, a poly(glycidyloxyaryl) compound (A), a polymerizable monomer (B) which is an unsaturated carboxylic acid or an anhydride thereof and has a molecular weight of 160 or less, an aromatic vinyl compound or a (meth)acrylate (C), and a radical polymerization initiator (D), wherein an equivalent ratio [glycidyloxy group/acid group] of a glycidyloxy group in the component (A) to an acid group in the component (B) is 1/1 to 1/0.48, and a molar ratio [(B)/(C)] of the component (B) to the component (C) is in the range of 1/0.55 to 1/2.
    Type: Grant
    Filed: August 6, 2010
    Date of Patent: July 16, 2013
    Assignee: DIC Corporation
    Inventors: Atsuko Kobayashi, Ichirou Ogura
  • Publication number: 20130178590
    Abstract: An epoxy resin composition of the following chemical structure (I), where n is a number from 1 to about 3000; each m independently has a value of 0 or 1; each R0 is independently —H or —CH3; each R1 is independently —H or a C1 to C6 alkylene radical (saturated divalent aliphatic hydrocarbon radical), Ar is a divalent aryl group or heteroarylene group; and X is a cycloalkylene group, including a substituted cycloalkylene group, where the substituent group include an alkyl, cycloalkyl, an aryl or an aralkyl group or other substituent group, for example, a halogen, a nitro, or a blocked isocyanate, an alkyloxy group; the combination of cycloalkylene and alkylene groups and the combination of alkylene and cycloalkylene group with a bridging moiety in between.
    Type: Application
    Filed: September 14, 2011
    Publication date: July 11, 2013
    Applicant: DOW GLOBAL TECHNOLOGIES LLC
    Inventors: Xin Jin, Ray E. Drumright, Bernhard Kainz, Jerry W. White, Robert E. Hefner, JR.
  • Publication number: 20130082547
    Abstract: There are provided a sealing resin composition for a hard disk drive (HDD) motor and a HDD motor fabricated by using the same. The sealing resin composition includes 40 to 80 parts by weight of epichlorohydrin-4,4-isopropylidene diphenol resin; 5 to 20 parts by weight of acrylated ester; and 5 to 15 parts by weight of acrylated epoxy. The sealing resin composition containing a UV curable epoxy resin is used as a sealing material of the adhering part of the FPC of the HDD motor, whereby generation of outgas in the adhering part may be reduced.
    Type: Application
    Filed: December 20, 2011
    Publication date: April 4, 2013
    Inventors: Kun Kim, Myung Hwa Choi, Sang Hyun Kwon, Hyung Kyu Kim
  • Patent number: 8409669
    Abstract: A method and system for the spray application of epoxy materials is provided. The system includes a dual walled tank structure as a reservoir for containing and preheating the epoxy materials in preparation for mixing and spray application. Each component of the epoxy material is preheated before the components are mixed. After preheating, the components are then mixed together and spray applied. The method and system of the present invention provides a high quality spray applied epoxy coating while reducing equipment down time and cleaning.
    Type: Grant
    Filed: November 7, 2008
    Date of Patent: April 2, 2013
    Inventors: Danny R. Warren, David Allan Smith
  • Patent number: 8389653
    Abstract: A urethane coating is formed by a reaction of a hydroxy-functional resin and a blocked isocyanate crosslinker. A method of catalyzing this reaction includes forming a polymeric ligand from the resin and/or the crosslinker. The method also includes incorporating a metal catalyst with the polymeric ligand to complex the metal catalyst with the polymeric ligand. The method further includes reacting resin and the crosslinker to form the urethane coating.
    Type: Grant
    Filed: March 30, 2006
    Date of Patent: March 5, 2013
    Assignee: BASF Corporation
    Inventors: Timothy S. December, Cesar G. Ortiz, Hardy Reuter, Karl-Heinz Grosse-Brinkhaus, Guenter Ott
  • Patent number: 8389630
    Abstract: Provided is a curable composition excellent in curability and mechanical properties as well as a cured product thereof. Specially provided is a curable composition containing a vinyl-based polymer (I) having one or more crosslinkable functional groups at a terminus on average and a nucleophilic agent (II) and a cured product obtained by curing the curable composition. Preferably, the curable composition of the invention further contains an epoxy resin (III).
    Type: Grant
    Filed: December 27, 2006
    Date of Patent: March 5, 2013
    Assignee: Kaneka Corporation
    Inventors: Hitoshi Tamai, Kohei Ogawa, Yoshiki Nakagawa
  • Patent number: 8389652
    Abstract: An epoxy resin hardener composition including a reaction product of (i) a compound having at least one vicinal epoxy group, and (ii) an amino alcohol; an epoxy resin composition including the epoxy resin hardener composition and a compound having at least one vicinal epoxy group; and a powder coating composition including particles of the epoxy resin hardener composition and particles of a compound having at least one vicinal epoxy group.
    Type: Grant
    Filed: January 6, 2009
    Date of Patent: March 5, 2013
    Assignee: Dow Global Technologies LLC
    Inventors: Joseph Gan, Matthieu M. Eckert, Carola Rosenthal, Bernhard Kainz, Emile C. Trottier
  • Patent number: 8304034
    Abstract: The present invention relates to one-solution type thermosetting resin composition for a protective film of a color filter, and a color filter including the same. The one-solution type thermosetting resin composition includes a copolymer (A) including (meth)acrylate with an epoxy cyclic structure at the side chain, (meth)acrylate with a hydroxyl terminal, acid anhydride, and maleimide with a substituent; an epoxy resin (B); a base-generating agent (C); and an organic solvent (D). When a protective film of a color filter is prepared by using the one-solution type thermosetting resin composition according to the present invention, it has excellent storage stability as well as excellent flatness, close-contacting property, transmission properties, heat resistance, and chemical resistance.
    Type: Grant
    Filed: December 31, 2007
    Date of Patent: November 6, 2012
    Assignee: Cheil Industries Inc.
    Inventors: Hyun-Moo Choi, O-Bum Kwon, Sun-Yul Lee
  • Publication number: 20120259039
    Abstract: The present invention provides a resin composition for a fiber-reinforced composite material, which has excellent fluidity at low temperature and which produces a cured product having excellent mechanical strength, and also provides a cured product thereof, a fiber-reinforced composite material, a fiber-reinforced resin molding having excellent heat resistance, and a process for producing a fiber-reinforced resin molding with good productivity. A resin composition for a fiber-reinforced composite material contains, as essential components, an epoxy resin (A), an acid group-containing radical polymerizable monomer (B), a radical polymerization initiator (C), and an amine-based curing agent (D) for an epoxy resin, and has a viscosity of 500 mPa·s or less at 50° C. measured with an E-type viscometer. The composition is impregnated into reinforcing fibers and cured.
    Type: Application
    Filed: September 14, 2010
    Publication date: October 11, 2012
    Applicant: DIC Corporation
    Inventors: Atsuko Kobayashi, Ichirou Ogura
  • Publication number: 20120259042
    Abstract: A low viscosity toughened epoxy resin formulation including a divinylbenzene dioxide as a component in the formulation; wherein the formulation is useful for the manufacture of thermoset polymers.
    Type: Application
    Filed: November 22, 2010
    Publication date: October 11, 2012
    Inventors: Stephanie L. Potisek, Mark B. Wilson
  • Patent number: 8278401
    Abstract: This invention relates to curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition comprises an aromatic compound having meta-substituted reactive groups and a cationic or radical initiator.
    Type: Grant
    Filed: March 29, 2006
    Date of Patent: October 2, 2012
    Assignee: Henkel AG & Co. KGaA
    Inventors: Shengqian Kong, Sarah E. Grieshaber
  • Patent number: 8268200
    Abstract: Provided is a pigment dispersing composition for a color filter including a color material, a resin, and an organic solvent which may dissolve the resin, wherein a modified pigment (D) is contained as the color material which includes, on the surface of a pigment (A), a polymer (P) obtained by polymerizing a polymer (B) containing a polymerizable unsaturated group soluble in a non-aqueous solvent and at least one type of polymerizable unsaturated monomer (C) which is soluble in the non-aqueous solvent and becomes either insoluble or poorly soluble following polymerization, alternatively wherein a modified pigment (D) is contained as the color material which is obtained, under the presence of a pigment (A), a non-aqueous solvent, and a polymer (B) containing a polymerizable unsaturated group soluble in the non-aqueous solvent, by polymerizing at least one type of polymerizable unsaturated monomer (C).
    Type: Grant
    Filed: March 23, 2009
    Date of Patent: September 18, 2012
    Assignee: DIC Corporation
    Inventors: Hiroshi Kinoshita, Seiji Funakura, Eiichi Kiuchi, Yoshinori Katayama
  • Patent number: 8268932
    Abstract: This invention relates to the use of resin compositions for chemical anchoring, wherein the resin composition comprises at least: a. a thiol-containing component, and b. a resin containing one or more reactive moieties selected from the group of: i. non-aromatic carbon double bond moieties, and ii. epoxide moieties, and an initiator. Preferably, the resin composition further comprises a diluent, more preferably a reactive diluent. Furthermore, the present invention also relates to the use of a multi-component, preferably a 2-component system of which one component contains a thiol group(s) containing component for chemical anchoring by means of cold curing.
    Type: Grant
    Filed: October 5, 2006
    Date of Patent: September 18, 2012
    Assignee: DSM IP Assets B.V.
    Inventors: Johan Franz Gradus Antonius Jansen, Michael Alphonsus Cornelis Johannes Van Dijck, Marco Marcus Matheus Driessen
  • Publication number: 20120232228
    Abstract: Compounds are provided according to structure 1: in which R?H or methyl and R2=optionally substituted C1-C20 alkyl, optionally substituted C6-C20 aryl, part of a oligomeric or polymeric residue (>C20), which can be optionally substituted.
    Type: Application
    Filed: March 13, 2012
    Publication date: September 13, 2012
    Applicant: DSM IP ASSETS B.V.
    Inventors: Joanna KLEIN NAGELVOORT, Cornelis DEN BESTEN, Johan Franz Gradus JANSEN
  • Patent number: 8236157
    Abstract: A pigment dispersing resin is disclosed along with pigment dispersion, electrodepositable coating compositions using the pigment dispersing resin, and methods for applying the electrodepositable coating composition. The pigment dispersing resin consists essentially of the carboxylic acid salt of an aminated bisphenol epoxy resin and an alkoxylated styrenated phenol. Pigment dispersions made from the dispersing resin are especially useful for forming low or no volatile organic content electrocoating baths.
    Type: Grant
    Filed: December 12, 2008
    Date of Patent: August 7, 2012
    Assignee: E I du Pont de Nemours and Company
    Inventor: Taddesse Gebregiorgis
  • Patent number: 8217099
    Abstract: A thermosetting resins composite, composed of: epoxy resin which can have a total polymerization with bismaleimide, occupying 1.75%-18.0% solids weight of the composite; bismaleimide compounds, occupying 0.15%-12.5% solids weight of the composite; free radical initiator, its mole fraction of which its addition accounts for reaction monomer total is 0.01%-0.15%; inhibitor, whose amount is the half to double of the initiator; styrene-maleic anhydride copolymers, occupying 17.5%-47.0% solids weight of the composite; filler, occupying 20%-60% solids weight of the composite; solvent, occupying 30%-50% solids weight of the composite; flame retardant which can be used in CCL industries.
    Type: Grant
    Filed: May 22, 2008
    Date of Patent: July 10, 2012
    Assignees: ITEQ (Dongguan) Corporation, ITEQ Corporation
    Inventors: Yufang He, Lijun Su
  • Patent number: 8173726
    Abstract: A process including the polymerization of a reactive diluent, which is present in an aqueous dispersion that further includes an epoxy-amine material, is disclosed. The resulting composition is useful as a coating composition.
    Type: Grant
    Filed: October 7, 2010
    Date of Patent: May 8, 2012
    Assignee: Valspar Sourcing, Inc.
    Inventors: Martin Peter Joseph Heuts, Lonnie Jones
  • Patent number: 8163155
    Abstract: A coating layer prepared from an aqueous electrodeposition coating composition comprising an electrodepositable binder, the binder comprising a sulfo or sulfamyl group-containing resin, provides corrosion protection to a metallic substrate.
    Type: Grant
    Filed: December 29, 2008
    Date of Patent: April 24, 2012
    Assignee: BASF Coatings GmbH
    Inventors: Abdellatif Chouai, Timothy S December
  • Patent number: 8158728
    Abstract: Materials and Methods are provided for fabricating microfluidic devices. The materials include low surface energy fluoropolymer compositions having multiple cure functional groups. The materials can include multiple photocurable and/or thermal-curable functional groups such that laminate devices can be fabricated. The materials also substantially do not swell in the presence of hydrocarbon solvents.
    Type: Grant
    Filed: August 9, 2006
    Date of Patent: April 17, 2012
    Assignee: The University of North Carolina at Chapel Hill
    Inventors: Joseph M. DeSimone, Jason P. Rolland, Ginger M. Denison Rothrock, Paul Resnick
  • Publication number: 20120041102
    Abstract: The present invention relates to a novel epoxy resin having improved heat-resistance, thermal expansion properties and processability, and to a thermosetting resin composition comprising the same. To this end, the present invention provides an epoxy resin of Chemical Formula 1 as disclosed in the Description, an epoxy resin composition comprising the same, and a packaging, substrate and transistor formed thereof. When a composition that contains an epoxy resin with a specific side functional group according to the present invention and/or an epoxy resin with a specific core structure is cured, a filler forms a strong chemical bond with the epoxy resin, thereby maximizing filling effects of the filler for the epoxy resin. Moreover, with the specific core structure, heat resistance and heat expansion properties of a cured product are substantially improved (CTE is reduced), and enhanced glass transition properties, strength and processability are demonstrated.
    Type: Application
    Filed: April 23, 2010
    Publication date: February 16, 2012
    Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: Hyun-Aee Chun, Seung-Han Shin, Hyun-Ah Kim, Chang-Ho Oh, Yun-Ju Kim, Sang-Yong Tak, Myong-Hoon Lee, Tae-Yun Kang
  • Patent number: 8114508
    Abstract: The present invention provides a composition of the modified maleic anhydride and the epoxy resins, including (A) one or more of the epoxy resin mixtures, (B) a modified maleic anhydride copolymer, (C) additives and (D) inorganic filler materials, wherein component (A) the epoxy resin mixture accounts for 35%˜56% by weight of the composition solids, component (B) the modified maleic anhydride copolymer accounts for 44%˜65% by weight of the composition solids, based on 100% by weight of total components (A), (B) and (C).
    Type: Grant
    Filed: October 20, 2009
    Date of Patent: February 14, 2012
    Assignee: Nan Ya Plastics Corporation
    Inventor: Ming Jen Tzou
  • Publication number: 20120022183
    Abstract: The disclosure relates to a composition having at least one radically polymerisable monomer M; at least one radical former, at least one epoxide resin A including an average of more than one epoxide group per molecule, and at least one compound of formula (I). Such compositions are suitable as adhesives, sealants or coatings. Shortly after the application thereof, they have a high initial strength and, after further hardening at room temperature, they reach a high level of final strength.
    Type: Application
    Filed: January 14, 2011
    Publication date: January 26, 2012
    Applicant: SIKA TECHNOLOGY AG
    Inventors: Markus Haufe, Andreas Kramer
  • Patent number: 8067093
    Abstract: The present invention relates to compounds suitable to use as curing agents for epoxy systems which can be obtained by reacting an amine-functional compound with an ?-? unsaturated acid and/or ester and a mono-functional epoxy compound. The invention further relates to coating compositions comprising these curing agents.
    Type: Grant
    Filed: January 15, 2007
    Date of Patent: November 29, 2011
    Assignee: Akzo Nobel Coatings International B.V.
    Inventors: Steve Alister Nixon, Susan Elizabeth Borthwick
  • Patent number: 8058345
    Abstract: Disclosed are adhesive compositions include polymerizable resin, preferably in an amount of from about 10 wt % to about 90 wt % and multifunctional acrylate, preferably in an amount of from about 5 wt % to about 30 wt %. The polymerizable resin can include free radical initiated vinyl addition resins. The adhesives in preferred embodiments exhibit enhanced bonding strength of the adhesive at high temperatures, such as at about 80° C., and enhanced the fire resistance.
    Type: Grant
    Filed: May 8, 2009
    Date of Patent: November 15, 2011
    Assignee: Illinois Tool Works Inc.
    Inventors: Wen-Feng Liu, Barbara Chabut
  • Patent number: 8039559
    Abstract: The present invention relates to a two-component composition comprising a first component and a second component, wherein the first component being a non-aqueous resin composition comprising an unsaturated polyester resin or vinyl ester resin, a transition metal compound selected from a copper, iron, manganese or titanium compound, a potassium compound, and the resin composition contains less than 0.01 mmol cobalt per kg primary resin system and less than 0.01 mmol vanadium per kg primary resin system; and the second component comprises a peroxide compound.
    Type: Grant
    Filed: July 5, 2007
    Date of Patent: October 18, 2011
    Assignee: DSM IP Assets B.V.
    Inventors: Johan Franz Gradus Antonius Jansen, Ronald Ivo Kraeger