Wherein Unsaturated Reactant Is A Carboxylic Acid Or Derivative Or Polymer Derived Therefrom Patents (Class 525/530)
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Patent number: 8058345Abstract: Disclosed are adhesive compositions include polymerizable resin, preferably in an amount of from about 10 wt % to about 90 wt % and multifunctional acrylate, preferably in an amount of from about 5 wt % to about 30 wt %. The polymerizable resin can include free radical initiated vinyl addition resins. The adhesives in preferred embodiments exhibit enhanced bonding strength of the adhesive at high temperatures, such as at about 80° C., and enhanced the fire resistance.Type: GrantFiled: May 8, 2009Date of Patent: November 15, 2011Assignee: Illinois Tool Works Inc.Inventors: Wen-Feng Liu, Barbara Chabut
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Patent number: 8039559Abstract: The present invention relates to a two-component composition comprising a first component and a second component, wherein the first component being a non-aqueous resin composition comprising an unsaturated polyester resin or vinyl ester resin, a transition metal compound selected from a copper, iron, manganese or titanium compound, a potassium compound, and the resin composition contains less than 0.01 mmol cobalt per kg primary resin system and less than 0.01 mmol vanadium per kg primary resin system; and the second component comprises a peroxide compound.Type: GrantFiled: July 5, 2007Date of Patent: October 18, 2011Assignee: DSM IP Assets B.V.Inventors: Johan Franz Gradus Antonius Jansen, Ronald Ivo Kraeger
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Publication number: 20110247756Abstract: Homogeneous solutions including an epoxy resin, a maleimide component including at least one bismaleimide, and a cyanate ester component are disclosed. Such compositions may be useful, for example, in curable compositions, thermoset compositions, and the manufacture of electrical laminates and other end products that may be formed from or using the curable and thermoset compositions.Type: ApplicationFiled: December 11, 2009Publication date: October 13, 2011Applicant: DOW GLOBAL TECHNOLOGIES LLCInventors: Mark B. Wilson, Donde R. Anderson
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Publication number: 20110201744Abstract: A reactive component suitable for use in a radiation-curable composition, which comprises an acrylated epoxy-amine oligomer represented by the formula (I): C-B-[A-B]n-A-B-C wherein: n is from 2 to 500; each A is individually a unit derived from a diglycidyl ether; each B is individually a unit derived from a difunctional secondary amine or a monofunctional primary amine; and each C is individually a unit derived from a multifunctional acrylate monomer, radiation-curable compositions, such as inks, coatings and adhesives, comprising said reactive component and methods of making said reactive component.Type: ApplicationFiled: October 19, 2009Publication date: August 18, 2011Applicant: Sun Chemical, B.V.Inventors: Shaun Herlihy, Luisa Fuertes
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Publication number: 20110176288Abstract: The adhesive composition of the invention comprises a thermoplastic resin, a radical polymerizing compound, a radical polymerization initiator and a radical polymerization regulator. According to the present invention it is possible to provide an adhesive composition, a circuit connecting material, a connection structure for a circuit member and a semiconductor device whereby curing treatment can be carried out with sufficient speed at low temperature, curing treatment can be carried out with a wide process margin, and adequately stable adhesive strength can be obtained.Type: ApplicationFiled: June 8, 2005Publication date: July 21, 2011Applicant: HITACHI CHEMICAL COMPANY LTD.Inventors: Shigeki Katogi, Houko Sutou, Hiroyuki Izawa, Toshiaki Shirasaka, Masami Yusa, Takanobu Kobayashi
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Patent number: 7968622Abstract: An ink-jet composition for a color filter excellent in storage stability, straightness and sustainability at the time of ejection from a head, wherein a cured layer thereof is excellent in heat resistance, adhesive property, and solvent resistance. The ink-jet ink composition for a color filter is a specific epoxy group-containing polymer (A), a specific epoxy group-containing compound (B) having two or more specific epoxy groups and a polycarboxlic acid derivative (C) in which specific carboxylic acid (c1) having alicyclic hydrocarbon is rendered latent by vinyl ether (c2), wherein the equivalence ratio of carboxyl groups rendered latent by the polycarbonoxylic acid derivative (C) to the total epoxy groups contained in the epoxy-group containing polymer (A) and the epoxy-group containing compound (B) is in the range from 0.7 to 1.1.Type: GrantFiled: March 20, 2006Date of Patent: June 28, 2011Assignees: Dai Nippon Printing Co., Ltd., NOF CorporationInventors: Tomonori Nishida, Masashi Nishiyama, Masato Tezuka, Atsushi Sato, Yukihiro Kato
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Publication number: 20110120646Abstract: A two-part structural adhesive composition comprising a curable epoxy resin, an amine curing agent, a toughening agent, and a reactive liquid modifier. The structural adhesive may also include secondary curatives, initiators, reactive diluents and combinations thereof. The structural adhesives may be used to replace or augment conventional joining means such as welds or mechanical fasteners in bonding parts together.Type: ApplicationFiled: July 22, 2009Publication date: May 26, 2011Inventors: Ilya Gorodisher, Alphonsus V. Pocius, Babu N. Gaddam
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Patent number: 7842756Abstract: A copolymer and a process of making the copolymer are disclosed. The copolymer is produced from reacting a glycidyl ester and/or ether with a polyol comprising a functionality of at least 2 wherein at least 50% by weight of the copolymer comprises a minimum of 3n+X repeating units, wherein n is a monomer unit and X is a monomer unit and/or other reactant. The copolymer may also include less than 50% of the polymeric units having the same molecular weight. The present invention is further directed to processes for preparing the copolymer and to coating compositions employing the copolymer.Type: GrantFiled: March 17, 2008Date of Patent: November 30, 2010Assignee: PPG Industries Ohio, Inc.Inventors: Jonathan T. Martz, Erick B. Iezzi
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Patent number: 7820741Abstract: The present invention provides a halogen-free, flame retardant adhesive composition that exhibits excellent anti-migration properties, not only within single layer structures, but also within multilayer structures of much higher density. The flame retardant adhesive composition according to the present invention comprises: (A) a halogen-free epoxy resin, (B) a carboxyl group-containing acrylic resin and/or a carboxyl group-containing acrylonitrile-butadiene rubber, (C) a curing agent, (E) a specific polyphosphoric acid-melamine-based compound salt and/or polyphosphoric acid-diamine compound salt, and (F) an ion scavenger and/or a heavy metal deactivator.Type: GrantFiled: October 1, 2007Date of Patent: October 26, 2010Assignee: Shin-Etsu Chemicals Co., Ltd.Inventors: Kazunori Kondo, Shigehiro Hoshida, Tadashi Amano
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Patent number: 7820740Abstract: The present invention provides a halogen-free, flame retardant adhesive composition that exhibits excellent anti-migration properties, not only within single layer structures, but also within multilayer structures of much higher density such as copper-clad laminates. The flame retardant adhesive composition according to the present invention comprises: (A) a halogen-free epoxy resin, (B) a carboxyl group-containing acrylic resin and/or a carboxyl group-containing acrylonitrile-butadiene rubber, (C) a curing agent, (E) specific phosphinate and/or diphosphonate compounds, and (F) an ion scavenger and/or a heavy metal deactivator.Type: GrantFiled: October 1, 2007Date of Patent: October 26, 2010Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Kazunori Kondo, Shigehiro Hoshida, Tadashi Amano
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Patent number: 7786225Abstract: A curable resin composition, which is a solid resin at ordinary temperatures obtained by reacting an epoxy resin with a (meth)acrylic anhydride, contains an unsaturated resin having a (meth)acryloyl group (A) which has a double bond equivalent weight of 200 to 500, an ester number of 100 to 300, and a hydroxyl number of no more than 130, an ethylenically unsaturated monomer (B), and a radical polymerization initiator (C).Type: GrantFiled: April 30, 2004Date of Patent: August 31, 2010Assignee: DIC CorporationInventors: Takashi Yasumura, Takashi Tomiyama, Tetsuya Harada
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Patent number: 7772333Abstract: Film-forming materials include resins and/or crosslinkers having a —Si(OR)3 group. Film-forming resins can include epoxy, acrylic, polyurethane, polycarbonate, polysiloxane, polyvinyl, polyether, aminoplast, and polyester resins. A process to produce a film-forming resin includes reacting various polymers to incorporate a pendent group comprising a —Si(OR)3 group. Film-forming resins can be used in methods of producing coating compositions. Coating compositions can be used to coat a substrate, such as a metal substrate, by electrodeposition. Applied coatings containing the film-forming resins can be cured to form crosslinked films on substrates.Type: GrantFiled: March 13, 2007Date of Patent: August 10, 2010Assignee: BASF Coatings GmbHInventors: Sergio Gonzalez, Timothy S. December
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Publication number: 20100163417Abstract: A coating layer prepared from an aqueous electrodeposition coating composition comprising an electrodepositable binder, the binder comprising a sulfo or sulfamyl group-containing resin, provides corrosion protection to a metallic substrate.Type: ApplicationFiled: December 29, 2008Publication date: July 1, 2010Applicant: BASF CORPORATIONInventors: Abdellatif Chouai, Timothy S. December
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Patent number: 7736744Abstract: Aqueous resinous binders comprising graft copolymers, water-dilutable urethane polyols and epoxy-phosphorus acid reaction products are disclosed. The binders are useful in primer formulations for automotive applications.Type: GrantFiled: September 20, 2006Date of Patent: June 15, 2010Assignee: PPG Industries Ohio, Inc.Inventors: Paul H. Lamers, Christopher A. Verardi, Michele L. Meli, Carolyn A. Novak
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Epoxy resin composition, process for providing latency to the composition and a semiconductor device
Patent number: 7723444Abstract: An epoxy resin composition which comprises an epoxy resin (A), a curing agent (B), a curing accelerator (C) and a component retarding curing of the epoxy resin (D) which is at least one component selected from components (a), (b) and (c) represented by general formulae [1], [2] and [3], respectively, a semiconductor device having a semiconductor element encapsulated by using the composition, and a process for providing latency to an epoxy resin composition. The epoxy resin exhibits excellent storage stability, excellent fluidity and curing property during encapsulating by molding and excellent resistance to soldering without forming cleavages or cracks by the soldering treatment at high temperatures in accordance with the lead-free soldering. An epoxy resin composition can be provided with latency by adjusting the amounts of the curing accelerator and the component for retarding curing.Type: GrantFiled: January 20, 2006Date of Patent: May 25, 2010Assignee: Sumitomo Bakelite Co., Ltd.Inventors: Yoshihito Akiyama, Naoki Tomida -
Patent number: 7722932Abstract: Provided herein are one-solution type thermosetting resin compositions that may be useful to form protective films for color filters used in liquid crystal displays or image sensors. According to some embodiments, the resin compositions may include a self-curable copolymer and an epoxy compound. The protective films may exhibit desirable flatness, adhesiveness, transmittance, heat resistance and chemical resistance. Also provided are methods of forming a film on a substrate, and substrates having a film formed thereon. In addition, provided herein are color filters including a film formed from a composition according to an embodiment of the invention, and liquid crystal displays and image sensors including such color filters.Type: GrantFiled: January 17, 2007Date of Patent: May 25, 2010Assignee: Cheil Industries, Inc.Inventors: O Bum Kwon, Hyun Moon Choi, Sun Yul Lee, Kil Sung Lee
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Patent number: 7714042Abstract: The present invention provides a coating composition for cans comprising 100 parts by mass of a neutralized acrylic resin-modified epoxy resin (A), and from 1 to 50 parts by mass of anionic polymer crosslinked fine particles (B), (A) and (B) being dispersed in an aqueous medium, wherein the anionic polymer fine particles (B) are polymer fine particles comprising a polymer having an acid value of from 10 to 120 mg KOH/g and being produced by polymerizing radically polymerizable unsaturated monomers comprising from 2 to 30% by mass of a carboxyl group-containing radically polymerizable unsaturated monomer (b1), from 2 to 30% by mass of a polyvinyl compound (b2) and from 40 to 96% by mass of other radically polymerizable unsaturated monomer (b3) in the presence of water.Type: GrantFiled: March 23, 2007Date of Patent: May 11, 2010Assignee: Kansai Paint Co., Ltd.Inventors: Masaaki Saika, Hideki Matsuda, Yuuichi Inada, Naoki Horike, Sumio Noda, Hideki Masuda, Keiichi Shimizu, Hiromi Harakawa
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Patent number: 7713892Abstract: A laminate sheet that can be easily produced together with improving the heat resistance and the water absorbency. Provided is a laminate sheet prepared by laminating plural sheet materials by a resin composition, wherein the resin composition is comprised of an aromatic polyamide resin and an epoxy group-containing phenoxy resin having an epoxy group in the molecule, and the resin composition is a polyamide resin composition that contains 30 to 50% by mass of the epoxy group-containing phenoxy resin.Type: GrantFiled: May 17, 2006Date of Patent: May 11, 2010Assignees: Nitto Shinko Corporation, E.I. du Pont de Nemours and Company, Dupont Teijin Advanced Papers (Japan) LimitedInventors: Yasuyuki Kihara, Yoshiki Takahashi, Hidenori Takayama, Masanori Imai, Yasunori Tanaka, Shinji Naruse, David Wayne Anderson
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Patent number: 7682699Abstract: The present invention provides a method of making an aqueous coating composition comprising an aqueous dispersion of an epoxy acrylate resin and a polymerized reactive diluent. The aqueous coating composition preferably has a volatile organic compound content of no greater than 0.4 kilogram per liter of solids.Type: GrantFiled: February 17, 2006Date of Patent: March 23, 2010Assignee: Valspar Sourcing, Inc.Inventors: Donald G. Wind, Robert M. O'Brien, Richard H. Evans
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Publication number: 20100068522Abstract: A process for the production of surface functionalised nanoparticles, such as the production of semiconductor quantum dot nanoparticles incorporating surface-bound functional groups that increase the ease with which the dots can be employed in applications, such as incorporation into solvents, inks, polymers, glasses, metals, electronic materials and devices, bio-molecules and cells. Embodiments of the method include reacting first and second nanoparticle precursor species in the presence of a nanoparticle surface binding ligand X—Y—Z where X is a nanoparticle surface binding group, Y is a linker group, and Z is a functional group, in which Y comprises a polyethyleneglycol group and/or Z comprises an aliphatic group incorporating a terminal unsaturated group, the reaction being effected under conditions permitting binding of said surface binding ligand to the growing nanoparticles to produce said surface functionalised nanoparticles.Type: ApplicationFiled: August 7, 2009Publication date: March 18, 2010Applicant: NANOCO TECHNOLOGIES LIMITEDInventors: Nigel Pickett, Mark C. McCairn, Steven M. Daniels, Imrana Mushtaq, Paul Glarvey
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Patent number: 7671114Abstract: In accordance with the present invention, it has now been found that glycidyl epoxy resins containing substitution on the epoxide ring can be used with conventional epoxy curing agents and fluxing agents to produce underfill adhesives that are suitable for use with silver-based alloys. Owing to the structural similarity of the new materials to conventional epoxy resins, physical and material properties of the invention formulations are altered little, if at all, relative to products currently in use, and so are highly compatible with existing processes.Type: GrantFiled: July 21, 2008Date of Patent: March 2, 2010Assignee: Henkel CorporationInventors: John G. Woods, Yuhshi Lu, Bruce C. B. Chan, Philip T. Klemarczyk, Andrew D. Messana
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Patent number: 7670683Abstract: A composition includes a cross-linkable epoxy resin, a polystyrene-polybutadiene-polymethylmethacrylate tri-block copolymer, and a filler material. The polystyrene-polybutadiene-polymethylmethacrylate tri-block copolymer has a concentration ratio of from about 1:1:1 to about 1:1:1.5.Type: GrantFiled: December 12, 2006Date of Patent: March 2, 2010Assignee: 3M Innovative Properties CompanyInventors: Meghan L. Mallozzi, Salvatore M. Attaguile, David J. Baratto
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Patent number: 7645514Abstract: It is an object of the invention to provide a curable resin composition excellent in mechanical strength, heat resistance, moisture resistance, flexibility, resistance to thermal cycles, resistance to solder reflow, dimensional stability, and the like after curing and providing high adhesion reliability and conduction reliability and an adhesive epoxy resin paste, an adhesive epoxy resin sheet, a conductive connection paste, and a conductive connection sheet using the curable resin composition, and an electronic component joined body. The invention relates to a curable resin composition, which contains an epoxy resin, a solid polymer having a functional group to react with the epoxy group and a curing agent for an epoxy resin, no phase separation structure being observed in a matrix of a resin when a cured product is dyed with a heavy metal and observed with a transmission electron microscope.Type: GrantFiled: December 26, 2003Date of Patent: January 12, 2010Assignee: Sekisui Chemical Co., Ltd.Inventors: Koji Watanabe, Toshio Enami, Yoshiyuki Takebe, Tatsuo Suzuki
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Patent number: 7632570Abstract: Aqueous resinous binders comprising graft copolymers, water-dilutable urethane polyols, epoxy-phosphorus acid reaction products, and an aqueous dispersion comprising the reaction product of trimellitic anhydride and a polyol, wherein the molar ratio of trimellitic anhydride to the polyol in the reaction product ranges from 1:2 to 1:4, and wherein the reaction product is further reacted with an anhydride to form another reaction product are disclosed. The binders are useful in primer formulations for automotive applications.Type: GrantFiled: July 5, 2007Date of Patent: December 15, 2009Assignee: PPG Industries Ohio, Inc.Inventors: Paul H. Lamers, Christopher A. Verardi, Michele L. Meli, Carolyn A. K. Novak
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Patent number: 7625984Abstract: This invention is directed to fluorinated acrylate compositions, which are suitable for use as low shrinkage, low absorbance refractive index matching adhesives for use in “pig-tailing” polymeric integrated waveguides to optical fiber bundles.Type: GrantFiled: February 13, 2008Date of Patent: December 1, 2009Assignee: Enablence Technologies USA Inc.Inventor: Paul Gregory Bekiarian
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Patent number: 7608663Abstract: The invention provides methods for preparing polymers bearing a terminal propionic acid. The method involves first reacting a water soluble and non-peptidic polymer comprising at least one hydroxyl group with a tertiary alkyl acrylate in the presence of a catalyst to form a propionic acid ester of the polymer, wherein the polymer has a weight average molecular weight of at least about 10,000 Da; and then treating the propionic acid ester of the polymer with a strong acid to form a propionic acid of the polymer.Type: GrantFiled: January 21, 2005Date of Patent: October 27, 2009Assignee: Nektar TherapeuticsInventors: Antoni Kozlowski, Samuel P. McManus
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Patent number: 7572506Abstract: The invention relates to aqueous coating compositions for producing primer and/or filler layers in a multi-layer coating, in particular in vehicle coating, comprising the following components: A) at least one water-dilutable epoxy resin, B) at least one polyamine curing agent, C) optionally, at least one water-dilutable polyurethane resin, D) water and E) optionally, pigments, fillers, conventional paint additives and/or organic solvents, wherein the polyamine curing agent B) comprises: B1) 5-95% by weight of at least one amino functional compound with at least two secondary and/or primary amino groups and B2) 95-5% by weight of at least one water-dilutable (meth)acrylic copolymer, wherein the percentages by weight of components B1) and B2) are based on the solids and add up to 100% by weight.Type: GrantFiled: June 22, 2005Date of Patent: August 11, 2009Assignee: E. I. du Pont de Nemours and CompanyInventors: Klaus Wissing, Wilfried Collong
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Patent number: 7560519Abstract: A 100% non-volatile, one-part liquid underfill encapsulant is disclosed for application to the active side of a large wafer or integrated circuit chip. Upon coating, the encapsulant is converted to a liquefiable, tack-free solid by exposure to radiation, particularly in the UV, visible and infrared spectrum. The underfill-coated wafer exhibits outstanding shelf aging of months without advancement of cure. The large wafer can be singulated into smaller wafer sections and stored for months after which during solder reflow assembly, the wafer connects are fixed and the underfill liquefies, flows out to a fillet and transitions to a thermoset state on heat activated crosslinking.Type: GrantFiled: June 2, 2004Date of Patent: July 14, 2009Assignee: Lord CorporationInventors: Dorian Canelas, Kaylan Ghosh, Amanda W. Kyles, Edward Cole
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Patent number: 7560143Abstract: Aqueous radiation curable binders comprising non-ionically stabilized epoxy resins ABC. Resins ABC are an adduct mixture of: adducts formed by the reaction of polyethylene glycol-modified epoxy resins A with olefinically unsaturated acids C, and adducts formed by the reaction of epoxy resins B, that are free from polyethylene glycol derived groups, with olefinically unsaturated acids C. A process for preparing aqueous radiation curable binders comprising non-ionically stabilized epoxy resins ABC, and a process of coating a substrate with aqueous radiation curable binders comprising non-ionically stabilized epoxy resins ABC.Type: GrantFiled: October 17, 2003Date of Patent: July 14, 2009Assignee: Surface Specialties Austria GmbHInventors: Rami-Raimund Awad, Florian Lunzer, Martin Gerlitz
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Patent number: 7553890Abstract: A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating free radicals upon heating, (2) a hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) a radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material.Type: GrantFiled: August 20, 2007Date of Patent: June 30, 2009Assignee: Hitachi Chemical Company, Ltd.Inventors: Itsuo Watanabe, Tohru Fujinawa, Motohiro Arifuku, Houko Kanazawa, Atsushi Kuwano
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Patent number: 7544739Abstract: Disclosed are adhesive compositions including polymerizable resin, preferably in an amount of from about 10 wt % to about 90 wt % and reactive multifunctional acrylate, preferably in an amount of from about 5 wt % to about 30 wt %. The polymerizable resin can include free radical initiated vinyl addition polymerized resins. The adhesives in preferred embodiments exhibit enhanced bonding strength at high temperatures, such as at about 80° C., and enhanced the fire resistance.Type: GrantFiled: October 6, 2003Date of Patent: June 9, 2009Assignee: Illinois Tool Works Inc.Inventors: Wen-Feng Liu, Barbara Chabut
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Patent number: 7528189Abstract: The disclosure relates to using metal acrylate compounds such as zinc diacrylate (ZDA), zinc dimethacrylate (ZDMA), among others for curing epoxy functional (and other cross-linking compounds), and to compositions containing such compounds for use in powder coat, film, adhesive, among other applications. ZDA and ZDMA containing compounds can cure the epoxy component of the compositions while being substantially free of conventional curing agents.Type: GrantFiled: October 27, 2004Date of Patent: May 5, 2009Assignee: Blue Goo, LLCInventors: Donald W. Taylor, James W. Freitag, Don K. Howard
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Patent number: 7501476Abstract: Disclosed is a method for preparing polyolefins containing vinylidine end groups from quasiliving carbocationically terminated polyolefin polymers by contacting the quasiliving carbocationically terminated polymer with a suitable azole quenching agent and substituted derivatives thereof.Type: GrantFiled: February 16, 2006Date of Patent: March 10, 2009Assignees: Chevron Oronite Company, LLC, The University of Southern MississippiInventors: Casey D. Stokes, Robson F. Storey
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Patent number: 7498384Abstract: Multi-component epoxy-amine primer systems are disclosed, which comprise an amine component that comprises a polythioether. Also disclosed are substrates coated with such primer systems as well as methods for coating substrates with such primer systems.Type: GrantFiled: February 2, 2006Date of Patent: March 3, 2009Assignee: PPG Industries Ohio, Inc.Inventors: John A. Walker, Scott C. Peterson
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Patent number: 7425594Abstract: A copolymer and a process of making the copolymer are disclosed. The copolymer is produced from reacting a glycidyl ester and/or ether with a polyol comprising a functionality of at least 2 wherein at least 50% by weight of the copolymer comprises a minimum of 3n+X repeating units, wherein n is a monomer unit and X is a monomer unit and/or other reactant. The copolymer may also include less than 50% of the polymeric units having the same molecular weight. The present invention is further directed to processes for preparing the copolymer and to coating compositions employing the copolymer.Type: GrantFiled: November 23, 2005Date of Patent: September 16, 2008Assignee: PPG Industries Ohio, Inc.Inventors: Jonathan T. Martz, Stephen J. Thomas
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Patent number: 7423096Abstract: An underfill composition includes a thermosetting resin and a thermally cleavable component that releases sulfonic acid upon thermal activation. The underfill composition is applied to flip-chip technology during no-flow underfill mounting of the flip-chip to a mounting substrate. The mounting substrate can be further mounted on a board. A process includes formation of the underfill composition. A method includes assembly of the underfill composition with the flip-chip, and further can include assembly of the mounting substrate to a board. A computing system is also included that uses the underfill composition.Type: GrantFiled: September 29, 2004Date of Patent: September 9, 2008Assignee: Intel CorporationInventor: Saikumar Jayaraman
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Patent number: 7405247Abstract: A reworkable conductive adhesive composition, comprising an epoxy based conductive adhesive containing conductive metal filler particles dispersed in a solvent-free hybrid epoxy polymer matrix.Type: GrantFiled: July 31, 2007Date of Patent: July 29, 2008Assignee: International Business Machines CorporationInventors: Krishna G. Sachdev, Daniel George Berger, Kelly May Chioujones, Glenn Graham Daves, Hilton T. Toy
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Patent number: 7396869Abstract: The disclosure relates to using metallic acrylate compounds such as zinc diacrylate (ZDA), zinc dimethacrylate (ZDMA), among others for curing epoxy functional (and other cross-linking compounds), and to compositions containing such compounds for use in powder coat, film, adhesive, among other applications. ZDA and ZDMA containing compounds can also be supplied as an intermediate product that can cure the epoxy component of the compositions while being substantially free of conventional curing agents.Type: GrantFiled: December 3, 2004Date of Patent: July 8, 2008Assignee: Denovus LLCInventors: Donald W. Taylor, James W. Freitag
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Patent number: 7393419Abstract: A method of removing cured conductive polymer adhesives, disclosed here as thermal interface materials, from electronic components for reclamation or recovery of usable parts of module assemblies, particularly high cost semiconductor devices, heat sinks and other module components.Type: GrantFiled: July 31, 2007Date of Patent: July 1, 2008Assignee: International Business Machines CorporationInventors: Krishna G. Sachdev, Daniel George Berger, Kelly May Chioujones, Glenn Graham Daves, Hilton T. Toy
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Patent number: 7388044Abstract: The invention provides high solids epoxy-based autodeposition coating materials that have improved moisture barrier properties and/or anti-corrosive properties and a means to obtain the high solids epoxy-based autodeposition coating materials that eliminates/minimizes the need for process solvents. A hydrophobic water barrier enhancing agent, epoxy pre-polymer and ethylenically unsaturated monomer, as an alternative to organic solvent, are combined to yield an epoxy pre-polymer-monomer-hydrophobic water barrier enhancing agent blend, which may be blended with other coating components and additives. The resulting blend is then dispersed in water with surfactant and the ethylenically unsaturated monomer is polymerized (in the presence of other formulation components) to yield a dispersion. The dispersion may then be used as one component of a coating formulation. The coating formulation can then be applied to materials and cured to form a final coating.Type: GrantFiled: July 30, 2004Date of Patent: June 17, 2008Assignee: Henkel Kommanditgesellschaft Auf AktienInventors: John D. McGee, Brian D. Bammel, Danielle Kapp
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Patent number: 7323242Abstract: A heat-curable binder based on an aqueous polymer dispersion comprising an emulsion polymer (EP), a polymer composed of at least 5% by weight of an ethylenically unsaturated monocarboxylic acid, dicarboxylic acid or dicarboxylic anhydride (acid polymer SP for short), and monofunctional or polyfunctional epoxide compounds as curatives. The monofunctional or polyfunctional epoxide compound is stirred, preferably in the liquid state, into the aqueous polymer dispersion. Besides the epoxide compound, the heat-curable binder may further comprise a polyol or an alkanolamine as hardener.Type: GrantFiled: October 18, 2002Date of Patent: January 29, 2008Assignee: BASF AktiengesellschaftInventors: Matthias Gerst, Matthias Laubender, Bernd Reck
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Patent number: 7208538Abstract: The disclosure relates to using metal acrylate compounds such as zinc diacrylate (ZDA), zinc dimethacrylate (ZDMA), among others for curing epoxy functional (and other cross-linking compounds), and to compositions containing such compounds. ZDA and ZDMA containing compounds can cure the epoxy component of the compositions while being substantially free of conventional epoxy curing agents.Type: GrantFiled: December 4, 2003Date of Patent: April 24, 2007Assignee: DeNovus LLCInventors: Donald W. Taylor, James W. Freitag, Don K. Howard
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Patent number: 7179552Abstract: Resin compositions which comprise the following components (A) to (E) are useful for interlayer insulation of a multilayer printed wiring board: (A) an epoxy resin having 2 or more epoxy group in one molecule and which exists in a liquid state at a temperature of 20° C.; (B) an aromatic epoxy resin having 3 or more epoxy groups in one molecule and an epoxy equivalent of 200 or less; (C) a phenol type curing agent; (D) one or more resins selected from the group consisting of a phenoxy resin, a polyvinyl acetal resin, a polyamide resin, a polyamideimide resin, and mixtures thereof, and having a glass transition temperature of 100° C. or more; and (E) an inorganic filler.Type: GrantFiled: May 20, 2004Date of Patent: February 20, 2007Assignee: Ajinomoto Co., Inc.Inventors: Shigeo Nakamura, Kenji Kawai
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Patent number: 7144630Abstract: The present invention relates to improved compositions for aqueous adhesives and aqueous primers that increase the durability of composites made by adhering elastomers to metal.Type: GrantFiled: January 23, 2003Date of Patent: December 5, 2006Assignee: Rohm and Haas CompanyInventors: Peter James Jazenski, Paul Anthony Dorrington, Dean Edward Hoy, Lipa Leon Roitman
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Patent number: 7087684Abstract: Self-dispersing, hardenable epoxy resins produced by reacting one or more ?,?-unsaturated carboxylic acid esters with one or more aminopolyalkylene oxide compounds, and reacting the thus formed intermediate with one or more polyepoxide compounds, are described. Processes for their production, aqueous dispersions containing the same and methods for their use are also described.Type: GrantFiled: November 30, 2004Date of Patent: August 8, 2006Assignee: Cognis Deutschland GmbH & Co. KGInventors: Horst Sulzbach, Thomas Huver, Hans-Josef Thomas, Vincenzo Foglianisi
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Patent number: 7084210Abstract: An expandable adhesive for a structural foam insert useful for vehicular reinforcement is described. The adhesive is characterized by containing a viscosity enhancing agent such as a polymethylmethacrylate, which results in a cured adhesive having unusually small voids and unusually high Young's modulus.Type: GrantFiled: December 17, 2003Date of Patent: August 1, 2006Assignee: Dow Global Technologies Inc.Inventor: Glenn G. Eagle
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Patent number: 7078106Abstract: A thermosetting resin composition comprising: (1) a copolymer resin comprising (a) a monomer unit and (b) a monomer unit respectively represented by the following general formulae (I) and (II): wherein R1 represents hydrogen, a halogen, or a C1–C5 hydrocarbon group; R2 represents a halogen or a C1–C5 hydrocarbon group; x is 0 to 3; and each of m and n is a natural number; and (2) a cyanate resin having at least two cyanate groups per molecule; is used to provide a printed wiring board material and a printed wiring board for electronic appliances, having a low dielectric constant and a low dielectric dissipation factor as well as improved heat resistance.Type: GrantFiled: October 31, 2003Date of Patent: July 18, 2006Assignee: Hitachi Chemical Co., LTDInventors: Shinji Tsuchikawa, Kazuhito Kobayashi, Yasuyuki Mizuno, Daisuke Fujimoto, Nozomu Takano
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Patent number: 7037584Abstract: The present invention provides a method of making an aqueous coating composition comprising an aqueous dispersion of an epoxy acrylate resin and a polymerized reactive diluent. The aqueous coating composition preferably has a volatile organic compound content of no greater than 0.4 kilogram per liter of solids.Type: GrantFiled: March 7, 2003Date of Patent: May 2, 2006Assignee: Valspar Sourcing, Inc.Inventors: Donald G. Wind, Robert M. O'Brien, Richard H. Evans
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Patent number: 7022779Abstract: A one-pack moisture-curing epoxy resin composition which can be cured at ordinary temperatures and is improved in storage stability without impairing the quickness of curing, i.e., is excellent in two properties incompatible with each other. This composition includes one ore more members selected from the group consisting of vinyl carboxylates of the general formula (1) and epoxy-containing silyl compounds of the general formula (2), one or more members selected from the group consisting of ketimines and oxazolidines, and an epoxy resin.Type: GrantFiled: December 17, 2001Date of Patent: April 4, 2006Assignee: Konishi Co., Ltd.Inventors: Takeshi Endo, Fumio Sanda, Hisakazu Horii, Kentaro Suzuki, Nobuki Matsuura
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Patent number: 7014699Abstract: The invention relates to addition compounds of formula (1): in which: n is a number from 1 to 10; R1 and R2 are identical or different and are each a hydrogen atom or a saturated or unsaturated aliphatic radical having 1 to 4 carbon atoms; R3 and R4 are identical or different and are each a hydrogen atom or alkyl having 1 to 3 carbon atoms, and the bridge member (R3+R4) is in each case positioned ortho or meta in relation to the phenolic oxygen atom; Z represents a group —CH2—CH2—, —CH2—CH(CH3)—, —CH(CH3)—CH2— or a combination thereof; s is number from 1 to 200; B represents hydrogen, —CO—CH?CH—COOM, —COCH(SO3M)CH2COOM, —CO—CH2—CH(SO3M)—COOM, —SO3M, —SO2M and/or —PO3MM, whereby M is preferably a cation selected from the group Li+, Na+, K+, NH4+, HO—CH2—CH2—NH3+, (HO—CH2—CH2—)2NH2+ or (HO—CH2—CH2—)3NH+; and Y is a radical of an amine. The inventive addition compounds are used as dispersing agents of solids, for example, pigments, particularly in aqueous media.Type: GrantFiled: February 26, 2002Date of Patent: March 21, 2006Assignee: Clariant GmbHInventors: Martin Alexander Winter, Hans Joachim Metz, Andreas Harz, Andreas Pfrengle