Abstract: Disclosed herein is an electrically conductive adhesive composition, which including milled carbon fibers dispersed in a thermosetting resin and a curative agent. Also, disclosed herein are articles comprising at least two components adhesively bonded by the electrically conductive adhesive composition and methods of making such adhesives and articles.

Abstract: Provided is a resin composition that has satisfactory impregnability into reinforcing fibers due to low viscosity and small viscosity increase even in an impregnation process performed for a long time. The resin composition being suitable as a matrix resin for a fiber-reinforced composite material for producing a cured molded article that has toughness and fatigue resistance. The resin composition for a fiber-reinforced composite material includes an epoxy resin, an acid anhydride-based curing agent, an imidazole-based curing accelerator, a radically polymerizable monomer, and a radical polymerization initiator as essential components, has a viscosity at 25° C. that falls within a range of 50 mPa·s to 800 mPa·s as measured by an E-type viscometer, and exhibits a viscosity increase ratio of 200% or less after 8 h at 25° C., wherein 50% by mass or more of the acid anhydride-based curing agent is an alicyclic acid anhydride having no olefinic unsaturated bond.

Abstract: The thermosetting resin composition according to an embodiment of the present invention contains a component (A) which is a novolac vinyl ester resin having a hydroxyl group and an ethylenically unsaturated group in the molecule, a component (B) which is an ethylenically unsaturated monomer, and a component (D) which is a polyisocyanate compound, wherein the component (A) has a hydroxyl value of 30-150 mgKOH/g, and the mole number of the hydroxyl group with respect to the mole number of the ethylenically unsaturated group per gram of the component (A) ((the amount of the hydroxyl group [mol/g])/(the amount of the ethylenically unsaturated group [mol/g])) is 0.1-0.8.

Abstract: A polysulfide material having reactive vinyl end groups and a method of making a vinyl end-capped polysulfide material are described. The vinyl end-capped polysulfide material has potential applications as a sealant, an adhesive, a coating, a caulking, or the like. In a specific example, the polysulfide material may be used as a precursor material for a sealant resin in the manufacturing of an integral fuel tank of an aircraft. An example method for making polysulfide materials includes contacting a vinyl-functionalized aryl halide and/or a vinyl-functionalized heteroaryl halide with dithiols and/or trithiols in the presence of an organic solvent.

Abstract: A polysulfide material having reactive vinyl end groups and a method of making a vinyl end-capped polysulfide material are described. The vinyl end-capped polysulfide material has potential applications as a sealant, an adhesive, a coating, a caulking, or the like. In a specific example, the polysulfide material may be used as a precursor material for a sealant resin in the manufacturing of an integral fuel tank of an aircraft. An example method for making polysulfide materials includes contacting a vinyl-functionalized aryl halide and/or a vinyl-functionalized heteroaryl halide with dithiols and/or trithiols in the presence of an organic solvent.

Abstract: Provided are an adhesive composition with good storage stability, heat resistance, moisture resistance reliability, and adhesion properties; and a curl- and heat-resistant adhesive film and a wiring film using the adhesive composition. The adhesive composition contains 100 parts by weight of a phenoxy resin (A) having plural alcoholic hydroxyl groups in a side chain of the molecule thereof; 2 to 60 parts by weight of a polyfunctional isocyanate compound (B) having an isocyanate group and at least one functional group selected from vinyl, acrylate, and methacrylate groups in the molecule thereof; and 5 to 30 parts by weight of a maleimide compound (C) having plural maleimide groups in the molecule thereof or/and reaction product thereof, in which a total amount of the components (B) and (C) is from 7 to 60 parts by weight.

Abstract: Methods are generally provided for preparing a polymeric composition that includes a grafted block copolymer. Methods are also generally provided for preparing a polymeric composition that includes a star block copolymer prepared from a central core molecule that includes a plurality of attachment moieties. Methods are also generally provided for preparing a polymeric composition that includes a linear block copolymer. Block copolymers are also generally provided. Multi-segmented linear block copolymers are also generally provided.

Abstract: The invention relates to a polyethylene composition comprising a mixture of flame retardants which are bromine-containing polymers. The polyethylene composition is useful in the manufacture of pallets. A process for making the polyethylene composition through a masterbatch route is also disclosed.

Abstract: Polyamines A1 of formula (I) or (II). They can be easily synthesized from readily available raw materials and have no primary amino groups or only a low content of primary amino groups and thus exhibit hardly any blushing. Their viscosity is relatively low, compared with polyamine/polyepoxide adducts of the polyamine on which polyamine A1 is based. Thus epoxy resin compositions can be formulated that are free of benzyl alcohol and free of blushing.

Abstract: An object of the present invention is to provide a curable composition that can be used as sealing materials, adhesives, and the like, has excellent curing properties, and gives a cured product excellent in elongation properties. The object can be attained by means of a curable composition comprising: a reactive silyl group-containing polyether polymer (A) that contains a reactive silyl group with high activity (e.g., (ClCH2)(CH3O)2Si—, (CH3OCH2)(CH3O)2Si—, or CH3(CH3O)2Si—CH2—NH—C(?O)—); and a reactive silyl group-containing polyether polymer (B) that contains a reactive silyl group (e.g., CH3(CH3O)2Si— or (CH3O)3Si—) different from that mentioned above and/or a (meth)acrylic polymer (C) containing a reactive silyl group that is not particularly limited.

Abstract: A structural adhesive composition that is suitable for high-strength bonding of metals and aerospace structural materials. In one embodiment, the structural adhesive composition based on a two-part system, which is curable at or below 200° F. (93° C.). The two-part system is composed of a resinous part (A) and a catalyst part (B), which may be stored separately at room temperature until they are ready to be used. The resinous part (A) includes at least two different multifunctional epoxy resins, toughening components, and inorganic filler particles. The catalyst part (B) includes an aliphatic or cyclic amine compound as a curing agent and inorganic filler. In another embodiment, the structural adhesive composition is based on a one-part system, which includes the components of the resinous part (A) mixed with a latent amine curing agent. The one-part system may further include an imidazole and/or an aliphatic amine.

Abstract: A process for curing epoxy resins which comprises curing epoxy resin compositions comprising a) epoxy resins and b) a compound of the general formula I in which R1 and R2 independently of one another are hydrogen, C1-C6-alkyl, C1-C4-alkoxy-C1-C4-alkyl, C5-C6-cycloalkyl, phenyl, phenyl-C1-C4-alkyl, C2-C6-alkenyl or C2-C6-alkynyl, or R1 and R2 together are a C3-C11-alkylene group; R3 and R4 independently of one another are hydrogen, C1-C6-alkyl, C1-C4-alkoxy-C1-C4-alkyl, C5-C6-cycloalkyl, phenyl, phenyl-C1-C4-alkyl, C2-C6-alkenyl or C2-C6-alkynyl, or R3 and R4 together are a C4-C6-alkylene group; by adding amino hardeners, and the curing takes place in the presence of a compound of the following formula II in which at least one of the radicals R11, R12 and R13 is a hydrocarbon group having 1 to 10 C atoms, which is substituted with a hydroxyl group and optionally remaining radicals R11 to R13 are an unsubstituted hydrocarbon group having 1 to 10 C atoms.

Abstract: A hem-curing epoxy resin composition, that includes an epoxy resin A having more than one epoxy group per molecule on average; a curing agent B for epoxy resins, which is activated at a temperature in a range of 100° C. to 220° C.; and an activator C for epoxy resin compositions, wherein activator C is a compound of formula (I), or is a reaction product between a compound of formula (Ia) and an isocyanate or an epoxide.

Abstract: Novel adhesive compositions that can be used in the die attach process. The adhesives include a curable resin component, a curing agent, and a block copolymer additive. The block copolymer additive has a glass transition temperature of at least about 40° C. The block copolymer additive improves the affinity of the adhesive composition to a hydrophilic substrate, such as a silicon wafer, during the die pickup process. Also disclosed is an assembly which includes a hydrophilic substrate and a layer of adhesive and methods of producing the assembly.

Abstract: An epoxy resin composition including (A) an epoxy resin that is solid at room temperature and has a softening point of 40° C. to 110° C., (B) a curing agent that is solid at room temperature and has a softening point of not less than 40° C. to 110° C., (C) a curing accelerator, (D) an inorganic filler having a mass-average particle size of 0.05 to 5 ?m, (E) a diluent, and (F) a specific dimethyl silicone, in which at least one of the component (A) and the component (B) is silicone-modified is provided. The composition can be used in a silicon chip die attach method or to produce a semiconductor device containing a silicon chip, a substrate and a cured product of the composition, in which the silicon chip is bonded to the substrate via the cured product.

Abstract: A thermally curable adhesive in strip or film form, having a thickness in the range of 0.1 to 5 mm, containing: a) at least one reactive epoxy prepolymer, b) at least one latent hardener for epoxies, and c) one or more elastomers that are selected from: c1) thermoplastic polyurethanes, c2) thermoplastic isocyanates, and c3) block copolymers having thermoplastic polymer blocks. Further components can additionally be contained, for example a blowing agent for foaming. The adhesive in the uncured state at 22° C. is bendable or wrappable and can be extended at least 100% before tearing. It can be laid onto a foil. It can be used, for example, for adhesive bonding of planar, tubular, or cylindrical components, preferably components made of metal, wood, ceramic, or ferrites.

Abstract: The invention relates to a process for preparing a reinforced and reactive thermoplastic composition having a continuous phase which is based on at least one thermoplastic polymer and dispersed in which is a discontinuous phase based on at least one reactive reinforcing agent that may be immiscible with said at least one thermoplastic polymer, and also to a composition obtained by this process.

Abstract: An adhesive composition comprising elastomeric polymer, epoxy resin, reactive diluent, and filler, is suitable for use within the electronics industry, and in particular for wafer back side coating adhesives. The elastomeric polymer is a mixture of a vinyl elastomer and an epoxy elastomer; the reactive diluent is a combination of two or more diluents, one of which must have carbon to carbon unsaturation, providing cross-linking within the composition after cure; and the filler is a non-conductive filler.

Abstract: Multi-piece, solid golf balls containing an inner core, an intermediate layer surrounding the core, and an outer cover are provided. At least one layer is made from an epoxy composition comprising a curing agent such as zinc diacrylate or zinc dimethacrylate. The epoxy composition is produced by reacting an epoxy prepolymer with a curing agent. Preferably, the epoxy composition is used to form an intermediate and/or cover layer resulting in a golf ball having high resiliency, good impact durability, and soft feel.

Abstract: The present invention relates to the use of cyclic carbonates of the formula I or a mixture thereof in epoxy resin compositions and also to epoxy resin compositions which comprise such cyclic carbonates. in which R1 and R2 independently of each other are hydrogen, C1-C6-alkyl, C1-C4-alkoxy-C1-C4-alkyl, C5-C6-cycloalkyl, phenyl, phenyl-C1-C4-alkyl, C2-C6-alkenyl or C2-C6-alkynyl, or R1 and R2 together are a C3-C11-alkylene group; R3 and R4 independently of each other are hydrogen, C1-C6-alkyl, C1-C4-alkoxy-C1-C4-alkyl, C5-C6-cycloalkyl, phenyl, phenyl-C1-C4-alkyl, C2-C6-alkenyl or C2-C6-alkynyl, or R3 and R4 together are a C4-C6-alkylene group; or mixtures thereof, as additives in epoxy resin compositions.

Abstract: Composition comprising polypropylene and (a) at least one phenolic antioxidant (A) (b) at least one hindered amine light stabilizer (B) (c) at least one slip agent (C) being a fatty acid amide, (d) a bisphenol A epoxy resin with an average molecular weight (Mw) below 2000 g/mol (D), and (e) talc (E).

Abstract: A method for the preparation of a photocurable resin by a reaction comprising the following steps i) reacting a mixture of a novolak type epoxy resin (A) and a dicyclopentadiene-phenol glycidylether resin (B) with ii) an advancement component (C) containing at least 2 phenolic hydroxyl groups per molecule; iii) reacting with an unsaturated monocarboxylic acid (D); and iv) esterification of the unsaturated group containing resin obtained from the steps of i) to iii) with a polycarboxylic acid anhydride or a carboxylic acid anhydride (E) is disclosed.

Abstract: To provide a resin composite material in which aggregation of silane compounds in the resin is suppressed and the linear expansion coefficient is lowered, and a method for producing the resin composite material. A resin composite material containing a resin and a silane compound 12 having a structure of the formula (1), wherein a molecular chain of the resin and a molecular chain of the silane compound 12 form an IPN structure or a semi-IPN structure, and a method for producing a resin composite material including a step of mixing a resin and a silane compound 12a to obtain a resin composition and an IPN structure formation step of allowing a plurality of the silane compounds 12a contained in the resin composition to be condensed with each other. Each of Rs in the formula (1) is independently selected from the group consisting of hydrogen, halogen and an arbitrary organic functional group and at least one thereof is a reactive organic functional group. x represents 1 or 1.5.

Abstract: An epoxy resin composition comprises an epoxy resin (A) and rubber-like polymer particles (B). The rubber-like polymer particles (B) maintain a finely dispersed state of primary particles. The content of the rubber-like polymer particles (B) is 0.5 to 80% by weight when the total amount of the epoxy resin (A) and rubber-like polymer particles (B) is 100% by weight. Rubber-like polymer particles (B) are obtainable by graft-polymerizing 5 to 50% by weight of a shell layer (B-2) with 50 to 95% by weight of a rubber particle core (B-1), and average particle diameter of the rubber-like polymer particles (B) is 0.03 to 2 ?m. Rubber particle core (B-1) comprises elastic material of not less than 50% by weight of at least one monomer selected from diene monomers and (meth)acrylate monomers and less than 50% by weight of another coploymerizable vinyl monomer, or polysiloxane rubber elastic materials, or a mixture thereof.

Abstract: The invention relates to a crosslinkable polymer powder composition redispersible in water, obtainable by means of free radical polymerization, in an aqueous medium, of one or more monomers from the group consisting of vinyl esters of straight-chain or branched alkylcarboxylic acids having 1 to 15 C atoms, methacrylates and acrylates of alcohols having 1 to 15 C atoms, vinylaromatics, olefins, dienes and vinyl halides, no epoxide-functional comonomers being copolymerized, and subsequent drying of the polymer dispersion obtained thereby, wherein, before and/or during the polymerization and/or before the drying of the polymer dispersion obtained thereby, an epoxy resin is added and, if appropriate after the drying, a curing agent crosslinking with the epoxy resin is added.

Abstract: The present invention encompasses polymer compositions comprising aliphatic polycarbonate chains containing functional groups that increase the polymer's ability to wet or adhere to inorganic materials. In certain embodiments, chain ends of the aliphatic polycarbonates are modified to introduce silicon-containing functional groups, boron-containing functional groups, phosphorous-containing functional groups, sulfonic acid groups or carboxylic acid groups.

Abstract: A method of accelerating a curing process in resin overflow systems for use in casting processes includes the step of adding a curing accelerator for the resin into the resin overflow system. In addition, a resin overflow container and a compartment with a curing accelerator for use in casting processes are provided.

Abstract: Epoxy reactive liquid modifiers include acrylate functionalized compounds, acrylamide functionalized compounds, oxalic amide functionalized compounds, actoacetoxy functionalized urethanes and acetoacetoxy functionalized polyalkenes. The reactive liquid modifiers are incorporated into epoxy resin compositions comprising a curable epoxy resin, an amine curing agent, and the reactive liquid modifier, wherein the reactive liquid modifier is polymerized to form at least one of an interpenetrating polymer network and a semi-interpenetrating polymer network with the curable epoxy resin.

Abstract: A process for curing an epoxy resin composition containing an epoxy resin and a compound of the general formula I: where R1 and R2 independently are hydrogen, C1-C6-alkyl, C1-C4-alkoxy-C1-C4-alkyl, C5-C6-cycloalkyl, phenyl, phenyl-C1-C4-alkyl, C2-C6-alkenyl or C2-C6-alkynyl, or R1 and R2 together are a C3-C11-alkylene group; and where R3 and R4 independently are hydrogen, C1-C6-alkyl, C1-C4-alkoxy-C1-C4-alkyl, C5-C6-cycloalkyl, phenyl, phenyl-C1-C4-alkyl, C2-C6-alkenyl or C2-C6-alkynyl, or R3 and R4 together are a C4-C6-alkylene group. The process includes adding amino hardeners, where 0.1% to 50% by weight of the amino hardeners are aliphatic, cycloaliphatic or aromatic amine compounds having 1 to 4 primary amino groups and optionally further functional groups, selected from secondary amino groups, tertiary amino groups, and hydroxyl groups.

Abstract: Disclosed is a thermosetting resin composition including; (A) a carboxyl group-containing polyurethane prepared by using (a) a polyisocyanate compound (b) polyol compounds (c) a carboxyl group-containing dihydroxy compound as raw materials, (B) a curing agent, wherein the polyol compounds (b) are one or more kinds of polyol compound(s) selected from Group (I) and one or more kinds of polyol compound(s) selected from Group (II); Group I: polycarbonate polyol, polyether polyol, polyester polyol, and polylactone polyol, Group II: polybutadiene polyol, polysilicone having terminal hydroxyl groups, and such a polyol that has 18 to 72 carbon atoms and oxygen atoms present only in hydroxyl groups. The thermosetting resin composition can give a protection film for flexible printed circuits that has excellent long-term reliability of electric insulation, flexibility, and low warpage from curing shrinkage, and particularly low tackiness.

Abstract: A resin composition for photoimprinting, a cured product of the resin composition which is excellent in etching and heat resistance, and a pattern forming process using the resin composition are provided. The resin composition contains photocurable monomer (A) containing at least one carbazole compound of formula (I): a photocurable monomer (B) containing at least one compound of the following formulae (II), (III), and (IV): and a photopolymerization initiator (C). The weight ratio of the photocurable monomer (A) to the photocurable monomer (B) is from 30/70 to 87/13.

Abstract: The invention is a radiation curable coating composition containing epoxyacrylate formed by ring opening reaction between (meth)acrylic acid and a self-dispersing epoxy resin in an aqueous system.

Abstract: An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): wherein R1 and R2 are independently hydrogen or alkyl having 1 to 4 carbon atoms and two or more R1s or two or more R2s are the same or different; a is integer of 0 to 4; b is integer of 0 to 4; c is integer of 0 to 3; and n is average and is number of 0 to 10, (C) a (co)polymer containing butadiene-derived structural unit or its derivative, and (D) an inorganic filler in the amount of 80 wt % to 95 wt % both inclusive in the total epoxy resin composition.

Abstract: Phosphorus-containing oligomer is represented by formula (1): (R1 represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, or a phenyl group; n is the number of repeating units and an integer of 1 or more; X is a structural unit represented by structural formula (x1) or (x2) below; Y is a hydrogen atom, a hydroxyl group, or a structural unit represented by the formula (x1) or (x2); and, in the formula (x1) or (x2), R2, R3, R4, and R5 each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, a phenyl group, or an aralkyl group), wherein the content of components whose n is 2 or more in the formula (1) is in the range of 5% to 90% in peak area in GPC measurement.

Abstract: Disclosed is a method for preventing a photocatalyst from decreasing in hydrophilicity due to contamination by components seeping from a sealing material for anchoring a construction material, exterior material, glass structure, or other article on which a photocatalyst layer is formed. In said method, a transparent sealing-material-component seepage-prevention layer, which contains a modified epoxy resin comprising polymerizable unsaturated monomers graft-polymerized onto or copolymerized with an epoxy resin, is formed on the surface of the sealing material. Said polymerizable unsaturated monomers include a carboxyl-group-containing monomer, and a modified epoxy resin obtained by a carboxyl-group/epoxy-group reaction after graft polymerization or copolymerization is more favorable.

Abstract: The invention provides epoxy and oxetane compositions including the novel acyloxy and N-acyl curing agents described herein. Use of invention curing agents result in cured adhesive compositions with remarkably increased adhesion and reduced hydrophilicity when compared to resins cured with other types of curing agents. Furthermore, the curatives of this invention do not interfere with free-radical cure and are thus suited for use in hybrid cure thermoset compositions.

Abstract: The invention relates to a glass printing ink and a glass printing lacquer comprising at least one pigment, at least one photoinitiator and at least two resins. One resin is an epoxy resin having an average molecular weight based on bisphenol A, diluted in a UV hardening monomer. Another resin is a resin which contains free functional amino, hydroxy, epoxy, acid, acid anhydride and/or acrylate groups. The invention also relates to the use of the glass printing ink and glass printing lacquer when printing a glass substrate and to a method for printing a glass substrate.

Abstract: An epoxy resin composition of the following chemical structure (I), where n is a number from 1 to about 3000; each m independently has a value of 0 or 1; each R0 is independently —H or —CH3; each R1 is independently —H or a C1 to C6 alkylene radical (saturated divalent aliphatic hydrocarbon radical), Ar is a divalent aryl group or heteroarylene group; and X is a cycloalkylene group, including a substituted cycloalkylene group, where the substituent group include an alkyl, cycloalkyl, an aryl or an aralkyl group or other substituent group, for example, a halogen, a nitro, or a blocked isocyanate, an alkyloxy group; the combination of cycloalkylene and alkylene groups and the combination of alkylene and cycloalkylene group with a bridging moiety in between.

Abstract: A process is for preparing a self-healing composite material including a matrix of epoxy polymer in which a catalyst of ring opening metathesis reaction and vessels containing at least one monomer able to polymerize due to a ring opening metathesis reaction are dispersed. The process includes the preliminary step of dispersing at molecular level the catalyst in a mixture containing at least one precursor of the epoxy polymer, and then the steps of dispersing, in the mixture, the vessels and a tertiary amine acting as curing agent of the precursor, and the step of curing the mixture by at least a first heating stage performed at a temperature between 70 and 90° C. for a time between 1 and 5 hours, and a second heating stage performed at a temperature between 90 and 170° C. for a time between 2 and 3 hours.

Abstract: To provide a resin composition for sealing an optical semiconductor, which is a raw material for a sealing resin layer having good curability and excellent storage stability; preferably a raw material for a sealing resin layer further having excellent weather resistance. The surface sealant for an optical semiconductor of Embodiment 1 according to the present invention contains epoxy resin (a) having two or more epoxy groups in a molecule, and metal complex (b1) which contains at least one metal ion selected from the group consisting of Zn, Bi, Ca, Al, Cd, La and Zr, a tertiary amine capable of forming a complex with the metal ion and having no N—H bond and an anionic ligand having a molecular weight of 17 to 200, in which the surface sealant has a viscosity of 10 to 10000 mPa·s, as measured by E-type viscometer at 25° C. and 1.0 rpm.

Abstract: Disclosed is a mold-releasing agent comprising, as active ingredients, a graft copolymer (A) in which a polyalkylene glycol or an alkyl ether thereof is graft-copolymerized with a polyfluoro-1-alkene represented by the general formula: CnF2n+1(CH2CF2)a(CF2CF2)bCH?CH2 (wherein n is an integer of 1 to 6, a is an integer of 1 to 4, and b is an integer of 1 to 3), and a polyfluoroalkylphosphonic acid represented by the general formula: CnF2n+1(CH2CF2)a(CF2CF2)b(CH2CH2)cP(O)(OH)2 (wherein n is an integer of 1 to 6, a is an integer of 1 to 4, and b is an integer of 1 to 3, and c is an integer of 1 to 3) or a salt thereof (B). The mold-releasing agent comprises, as an active ingredient, a compound having a perfluoroalkyl group containing 6 or less carbon atoms, which is said to have low bioaccumulation potential, and having mold release performance equivalent to or more than that of a mold-releasing agent comprising a compound having a perfluoroalkyl group containing 8 or more carbon atoms as an active ingredient.

Abstract: Provided are a resin composition for the manufacture of marble chips including a halogenated epoxy resin binder and showing high heat resistance, high chemical resistance, high impact resistance, high specific gravity and high transparency, a marble chip manufacturing method using the resin composition and an artificial marble made from marble chips.

Abstract: A solid epoxy resin powder coating composition which includes a divinylarene dioxide resin as one component; and wherein the solid epoxy resin powder coating composition can be formed by blending or reacting various other components with the divinylarene dioxide resin. For example, other components can include other epoxy resins; phenolic resins; or monomeric and/or polymeric isocyanates. The powder coating composition or formulation may advantageously provide, for example, a Fusion Bonded Epoxy coating on a substrate.

Abstract: A method and system for the spray application of epoxy materials is provided. The system includes a dual walled tank structure as a reservoir for containing and preheating the epoxy materials in preparation for mixing and spray application. Each component of the epoxy material is preheated before the components are mixed. After preheating, the components are then mixed together and spray applied. The method and system of the present invention provides a high quality spray applied epoxy coating while reducing equipment down time and cleaning.

Abstract: A process for curing an epoxy resin composition containing an epoxy resin and a compound of the general formula I: where R1 and R2 independently are hydrogen, C1-C6-alkyl, C1-C4-alkoxy-C1-C4-alkyl, C5-C6-cycloalkyl, phenyl, phenyl-C1-C4-alkyl, C2-C6-alkenyl or C2-C6-alkynyl, or R1 and R2 together are a C3-C11-alkylene group; and where R3 and R4 independently are hydrogen, C1-C6-alkyl, C1-C4-alkoxy-C1-C4-alkyl, C5-C6-cycloalkyl, phenyl, phenyl-C1-C4-alkyl, C2-C6-alkenyl or C2-C6-alkynyl, or R3 and R4 together are a C4-C6-alkylene group. The process includes adding amino hardeners, where 0.1% to 50% by weight of the amino hardeners are aliphatic, cycloaliphatic or aromatic amine compounds having 1 to 4 primary amino groups and optionally further functional groups, selected from secondary amino groups, tertiary amino groups, and hydroxyl groups.

Abstract: A urethane coating is formed by a reaction of a hydroxy-functional resin and a blocked isocyanate crosslinker. A method of catalyzing this reaction includes forming a polymeric ligand from the resin and/or the crosslinker. The method also includes incorporating a metal catalyst with the polymeric ligand to complex the metal catalyst with the polymeric ligand. The method further includes reacting resin and the crosslinker to form the urethane coating.

Abstract: Provided is a curable composition excellent in curability and mechanical properties as well as a cured product thereof. Specially provided is a curable composition containing a vinyl-based polymer (I) having one or more crosslinkable functional groups at a terminus on average and a nucleophilic agent (II) and a cured product obtained by curing the curable composition. Preferably, the curable composition of the invention further contains an epoxy resin (III).

Abstract: An epoxy resin hardener composition including a reaction product of (i) a compound having at least one vicinal epoxy group, and (ii) an amino alcohol; an epoxy resin composition including the epoxy resin hardener composition and a compound having at least one vicinal epoxy group; and a powder coating composition including particles of the epoxy resin hardener composition and particles of a compound having at least one vicinal epoxy group.

Abstract: Disclosed is a graft copolymer in which a polyalkylene glycol or an alkyl ether thereof is graft-copolymerized with a polyfluoro-1-alkene represented by the general formula: CnF2n+(CH2CF2)a(CF2CF2)bCH?CH2 (wherein n is an integer of 1 to 6, a is an integer of 1 to 4, and b is an integer of 1 to 3). The graft copolymer is an oligomer compound having a perfluoroalkyl group containing 6 or less carbon atoms, which is said to have low bioaccumulation potential, and having, when used as an active ingredient of a mold-releasing agent, mold release performance equivalent to that of a compound having a perfluoroalkyl group containing 8 or more carbon atoms.

Abstract: The present invention is aimed to provide a thermosetting resin composition which is easily produced, has excellent storage stability and thermal stability while maintaining high transparency and preventing formation of voids on the occasion of semiconductor chip bonding, and gives a cured product having excellent heat resistance, a flip-chip mounting adhesive containing the thermosetting resin composition, a method for producing a semiconductor device using the flip-chip mounting adhesive, and a semiconductor device produced by the method for producing a semiconductor device. The present invention is a thermosetting resin composition including an epoxy resin, an acid anhydride having a bicycle skeleton, and an imidazole curing accelerator that is in a liquid form at an ordinary temperature.