Abstract: A latent fluxing agent comprising a material which liberates phenol or a carboxylic acid containing compound when heated above 140° C. The latent fluxing agent may be incorporated into a thermoset resin, which includes an epoxy resin. The uncured epoxy resin, which includes the epoxy resin, the latent fluxing agent and an epoxy curing agent are useful as an underfill composition in a method for applying a chip die, having one or more solder balls, to a substrate. The method is used to produce an integrated circuit chip that includes a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical engagement with a carrier substrate.

Abstract: An ultraviolet curable resin composition is provided, which is excellent in developing width and resolution, and exhibits good solder heat resistance and resistance to gold plating.

Abstract: A thermosetting resin composition which contains: (A) an epoxy resin having at least two epoxy groups per molecule; (B) a hardener; (C) a compound represented by the following general formula (1) or (2); and (D) a microcapsule type hardening accelerator containing microcapsules each having a structure made up of a core containing a hardening accelerator and a shell covering the core and containing a polymer having a structural unit represented by the following general formula (3), and which, when examined by differential scanning calorimetry at a heating rate of 10° C./min, shows an exothermic peak due to reaction in the range of from 180 to 250° C., and a semiconductor device obtained through sealing with the composition are described.

Abstract: A powder coating composition includes an epoxy resin and a styrene-maleic anhydride copolymer having a glass transition temperature less than 105° C. The compositions provide low gloss finishes at low curing temperatures, as well as consistent gloss over a wide range of curing temperatures.

Abstract: The present invention provides two part, room-temperature curable epoxy resin/(meth)acrylate compositions. The compositions provide among other advantageous properties high flash point and low odor, and reaction products thereof demonstrate at least comparable and often improved fixture time, improved adhesion strength, and improved adhesion strength over time, to substrates which are ordinarily difficult to bond (such as plastics) with epoxy-based compositions, as contrasted to commercially available comparable products that are of low flash point and higher odor.

Abstract: A powder coating composition includes an acid-functional polyester resin and a matting agent selected from styrene-maleic anhydride copolymers and acid-functional acrylic resins. The compositions provide low gloss finishes at low curing temperatures, as well as consistent gloss over a wide range of curing temperatures.

Abstract: A low viscosity (and therefore low VOC) resin can be produced by limiting the molar ratio of the reactants, especially the dicarboxylic acid compound, used in the reaction. Specifically, reacting a reaction mixture comprising (i) one mole of a diepoxide having at least two glycidyl ether type epoxy groups; (ii) 0.5 to 2.0 moles of an unsaturated monocarboxylic acid; (iii) 0.1 to 0.5, preferably 0.1 to 0.3, moles of maleic anhydride; and, (iv) water, until substantially all of the epoxy groups disappear leads to the formation of a resin with a high shear (at least 500 s?1) viscosity of less than 1200 cP when measured in a 70% NVM (non-volatile matter) styrene solution. The resin may be used in barrier coatings, gel coatings, skin coatings and as a laminate resin.

Abstract: An ultraviolet curable resin composition comprises (A) an ultraviolet curable resin obtained by reacting an epoxy group containing polymer (a), which is prepared by polymerizing an ethylenically unsaturated monomer component including an ethylenically unsaturated monomer (i) having an epoxy group, with an ethylenically unsaturated monomer (b) having a carboxyl group, and then reacting a resultant intermediate product with a saturated or unsaturated polybasic acid anhydride (c); (B) an epoxy compound having at least two epoxy groups in molecule; (C) a photopolymerization initiator; and (D) a diluent The ultraviolet curable resin includes 0.3 to 10 mol of a polymerizable unsaturated group in 1 kg thereof. A photo solder resist ink containing this resin composition has the capability of providing a permanent film with excellent flexibility and solder heat resistance, and is preferably used to manufacture flexible printed circuit boards.

Abstract: This invention relates to epoxidized acetals and thioacetals, episulfidized acetals and thioacetals, thermosetting resin compositions based on such epoxidized acetals and thioacetals, episulfidized acetals and thioacetals, reaction products of which are controllably degradable when subjected to appropriate conditions.

Abstract: Condensation products prepared from cyclic carboxylic anhydrides of dicarboxylic acids, tricarboxylic anhydrides or tetracarboxylic anhydrides and difunctional polyamines, in particular polyoxyalkyleneamines, are suitable as a builder component for epoxy resin compositions. The reaction products based on tricarboxylic anhydrides or tetracarboxylic anhydrides are distinguished by having on average more than one imide group and carboxyl group per molecule. The compositions may optionally also contain condensation products obtained from tri- or poly-functional polyols and/or tri- or poly-functional amino-terminated polymers and cyclic carboxylic anhydrides, wherein the latter reaction products contain on average more than one carboxyl group per molecule. These compositions additionally contain conventional rubber-modified epoxy resins together with liquid and/or solid polyepoxy resins and conventional hardeners and accelerators and optionally fillers and rheology auxiliaries.

Abstract: An activatable (e.g., heat expandable) material and articles incorporating the same is disclosed. The material includes an epoxy resin; an epoxy/elastomer hybrid or reaction product; a blowing agent; a curing agent; and optionally, a filler. In preferred embodiments, the material includes aramid fiber, nanoclay or both.

Abstract: A thermosetting resin composition that is useful as an epoxy resin-based overcoating agent for flexible circuit boards or for film carriers for the TAB method, and the like, providing basic properties required of general insulation protective films, since the cured coated films are excellent in adhesiveness, electric insulation property, chemical resistance, thermal resistance, and the like, reduced in warp caused by cure shrinkage, and excellent in flexibility.

Abstract: A radiation curable resin composition for a Fresnel lens is provided, which exhibits a high elastic modulus and a high refractive index and is superior in adhesion to the plastic substrate and is superior in transparency. A lens layer exhibits excellent shape retention over a wide temperature range and is less likely to chip and crack due to an external force. A Fresnel lens sheet using the radiation curable resin composition is also provided. The resin composition comprises, as an essential component, an epoxy (meth)acrylate (a) having an epoxy equivalent per weight of 450 g/eq or more, which has a cyclic structure and two or more (meth)acryloyl groups; a specific trifunctional (meth)acrylate (b); a (meth)acrylate (c) having a molecular weight of 700 or less from an aliphatic polyhydric alcohol having an oxypropylene structure; and a monofunctional (meth)acrylate (d) having a cyclic structure.

Abstract: A method of assembling a structure comprises applying an epoxy composition to at least one of a first member and a second member, sandwiching the epoxy composition between the first and second members, and bonding the two members wherein the adhesive bond is a thermally cured mass. The epoxy composition contains an epoxy resin, a phenolic or amine compound as a chain extender, a basic catalyst and a polymeric toughener. The composition can be formulated in two parts wherein part A contains the catalyst and part B has the epoxy resin.

Abstract: A 100% solids laminating adhesive for flexible packaging with an improved range of adhesion and bond strength to various substrates along with reduced odor during application and improved ink compatibility and ink bonding. The adhesive is an epoxy-acrylate/amine formulation. Methods of application of the inventive adhesive are also disclosed.

Abstract: A carboxyl group-containing epoxy acrylate is prepared by the reaction of an epoxy resin advanced with an aromatic biphenol compound which is reacted with a polycarboxylic acid anhydride in the presence or absence of a catalyst and a polymerization inhibitor at an elevated temperature. The carboxyl group-containing epoxy acrylate is mixed with a photoinitiator to obtain a photoresist formulation.

Abstract: A photosensitive composition of (a) a compound of formula (Ia) or (Ib) and (b) a bifunctional acrylate or methacrylate.

Abstract: A cured composition is the cured residue of a curable composition including (a) an epoxy resin essentially free of bromine atoms, a curing agent for the epoxy resin, (b) a flame retardant additive that is the condensation product of (i) a brominated phenol or a mixture of brominated phenols with (ii) a cyanuric halide; (c) a thermoplastic resin, and (d) a bismaleimide resin. The preferred epoxy resin is a mixture of an epoxy resin with less than 2 glycidyl ether groups per molecule and an epoxy resin that has greater than 2 glycidyl ether groups per molecule. The preferred flame-retardant additive is a brominated heterocyclic compound that preferably is a triazine. The preferred thermoplastic resin is a poly(phenylene ether). The cured composition further including a reinforcement may be used in the manufacture of circuit boards having excellent electrical properties, good solvent resistance, and good thermal expansion characteristics.

Abstract: The disclosure relates to using metal acrylate compounds such as zinc diacrylate (ZDA), zinc dimethacrylate (ZDMA), among others for curing epoxy functional (and other cross-linking compounds), and to compositions containing such compounds. ZDA and ZDMA containing compounds can cure the epoxy component of the compositions while being substantially free of conventional epoxy curing agents.

Abstract: An epoxy resin cured article has a high glass transition temperature and low dissipation factor. An epoxy resin composition from which the cured article can be having excellent solubility in solvents is used to produce the cured articles. A polyester as a curing agent of an epoxy resin composition having an aromatic polyhydroxy coumpound residue including an aryloxycarbonyl group at the molecule of the terminal, an aromatic polyvalent hydrocarbon group residue, and bulky structure, is used. Since the curing agent behaves as a polyfunctional curing agent, a cured article produced therefrom has a high crosslink density. Since highly polar hydroxyl groups are not formed during curing, a cured article has high glass transition temperature and a low dissipation factor. The cured article does not release low molecular weight carboxylic acids though hydrolysis of ester bonds at crosslinked bonds.

Abstract: A coating compound comprising a binder/crosslinking agent system that comprises 20 wt. % to 80 wt. % of one or more carboxyl-functional components A) and 80 wt. % to 20 wt. % of one or more epoxy-functional (meth)acrylic copolymers B).

Abstract: A thermosetting adhesive film comprising a uniform adhesive matrix containing a thermosetting resin and a curing agent therefor, and a thermoplastic resin; and a filler material dispersed in the adhesive matrix, wherein the filler material comprises an inorganic material and a domain to incorporate the inorganic material, the domain consisting of an elastic polymer which is elongated and oriented in one direction substantially perpendicular to the thickness direction of the adhesive film. This adhesive film provides good properties of coefficient of thermal expansion and elastic modulus, without exhibiting reduced adhesive force which would be otherwise observed in association with the addition of large amounts of filler material.

Abstract: The present invention relates to a new urethane oligomer (A) and a resin composition comprising (A) and an unsaturated group containing polycarboxylic acid resin (B) that can be diluted with water and is excellent in providing a cured product and that is suitable for a solder resist and an interlayer dielectric layer because the cured product is excellent in flexibility, soldering-heat resistance or the like and allows a development with an organic solvent or a dilute alkali solution; a photosensitive resin composition suitable for an etching resist or a cover lay; and a photosensitive film obtained thereby.

Abstract: A screen-printable adhesive composition capable of being applied to a substrate at room temperature comprising at least one alkyl acrylate; at least one reinforcing comonomer, a polyepoxide resin, and a polyepoxide resin curing agent; wherein said composition is substantially solvent free and said composition has a yield point of greater than 3 Pascals and a viscosity of less than 6000 centipoise. In another aspect, the invention provides heat-curable electrically and/or thermally conductive adhesive films that are substantially solvent-free acrylic polymers further containing a polyepoxide resin, a polyepoxide resin curing agent, and an electrically conductive material and/or a thermally conductive material.

Abstract: Water-dilutable, cationically stabilized epoxy resins ZYX are obtained by reacting, in the first stage, aromatic or aliphatic epoxide compounds Z with aliphatic amines Y to form epoxy-amine adducts ZY which are neutralized and then in aqueous dispersion are reacted in a second stage with a further epoxy resin X. The resins ZYX may be formulated without additional curatives to give aqueous coating materials which exhibit a good corrosion protection effect.

Abstract: The invention relates to a binder, preferably for coating materials, which is curable thermally and/or by high-energy radiation and comprises a mixture of substances comprising (a) as one component, monomers or polymers which have a least one vinyl ether, vinyl ester, (meth)acrylic and/or allyl group and (b) as a further component, saturated polymers and/or unsaturated polymers different from component (a), with the proviso that at least one of components (a) and (b) has structural units of the formulae (I) and/or (II) the other component (b) has structural units of the formulae (I) and/or (II) at least when it contains saturated polymers. The invention also relates to a process for preparing the binder and to a formulation which comprises the binder of the invention. This formulation is in the form of a pigmented or unpigmented coating material or powder coating material.

Abstract: A thermosetting resin composition usable for sealing a gap formed between a printed circuit board and a semiconductor element in a semiconductor package having a face-down structure; a semiconductor device comprising a printed circuit board, a semiconductor element, and the thermosetting resin composition mentioned above, wherein a gap formed between the printed circuit board and the semiconductor element is sealed by the thermosetting resin composition; and a process for manufacturing the semiconductor device.

Abstract: A process of forming vias in a composition comprising (a) applying a layer of a composition containing (i) a cyanate ester, (ii) a bismaleimide, (iii) a co-curing agent having the structure R1—Ar—R2 wherein Ar is at least one aryl moiety, R1 is at least one unsaturated aliphatic moiety and R2 is at least one glycidyl moiety, (iv) an epoxy resin and, optionally, (v) a free-radical initiator; (b) covering the layer with a mask having windows through which radiation can be transmitted; (c) exposing part of the composition to radiation to at least partially cure it in the exposed areas; (d) removing the non-cured portions of the composition; and (e) completing the cure of the resin compositions.

Abstract: An epoxy resin composition comprises a) a polyepoxide, b) a cure inhibitor of boric acid, a Lewis acid derivative of boron, an alkyl borane, a mineral acid having a nucleophilicity value “n” of greater than zero and less than 2.5, or an organic acid having a pKa value of 1 or more, a catalyst which can be complexed with the cure inhibitor, and c) more than 30 parts by weight per 100 parts by weight of polyepoxide of a cross-linker such as a polycarboxylic acid or anhydride including a copolymer of an ethylenically unsaturated anhydride and a vinyl compound, or a hydroxy-functional compound such as a copolymer of styrene and hydroxystyrene.

Abstract: Disclosed is a radiation-crosslinkable thermoplastic polymer composition, a process for the preparation thereof, an angioplasty balloon made using such a composition, and a method of using the angioplasty balloon. The composition contains a reactive monomer cross-linker, that facilitates cross-linking of the reaction product upon contact of the cross-linker-containing composition with a particle beam from a radiation source.

Abstract: Stabilized pre-promoted unsaturated polymer resin systems that include a tertiary aromatic amine cure promoter. The stabilized curable resins systems can include a vinyl ester resin.

Abstract: The present invention is related to an improved process for obtaining oleochemical polyols from oils, principally of a vegetable origin. The polyols obtained consist of a mixture of ethers, esters, primary and secondary alcohols and have the characteristic of being self-compatible with the new blowing agents: hydrochlorofluorocarbons, HCFC's, hydrofluorocarbons, HFC's and hydrocarbons, HC's of a low molecular weight and low boiling point. The process of this invention is characterized because it uses Lewis type acids in such a way that they do not form precipitates and therefore it is not necessary to remove precipitates from the polyol. The process of the present invention makes it possible to obtain polyols with high functionality and controlled reactivity. These characteristics render the product suitable for use as a raw material in the production process of rigid foams, such as polyurethane for spraying, refrigeration and imitation wood, coatings, among others.

Abstract: The invention provides adhesives and adhesive compositions that comprise epoxy resin and non-volatile anhydride. One embodiment further comprises a hydroxyl containing compound that is insoluble in the epoxy resin/anhydride blend at mixing temperatures which reacts with the anhydride at solder reflow temperatures to form a fluxing agent in-situ. Another embodiment further comprises catalyst.

Abstract: A thermosetting resin composition for carbon fiber reinforced composite materials of the present invention chiefly comprises (A)2 thermosetting resin such as epoxy resin and a curing agent, and (B)2 compound containing one functional group which can react with thermosetting resin (A) or its curing agent, and a moiety selected from the following formulae (1) to (4) Furthermore, the present invention also relates to a prepreg formed by impregnating reinforcing fiber with the aforesaid resin composition and to carbon fiber reinforced composite materials comprising reinforcing fiber and a cured aforesaid thermosetting resin composition.

Abstract: A two-part composition useful as an adhesive comprises an epoxy resin, a chain extender selected from an amine or a phenolic compound, a base catalyst and a polymeric toughener wherein Part A contains the catalyst and Part B with the epoxy resin.

Abstract: Novel epoxy acrylates and carboxyl group-containing epoxy acrylates of formulae II and III of the claims that are relatively highmolecular and are chemically crosslinkable can be used in photoresist formulations with the additional use of highly polymerised polymer binders. Such resist formulations are used in particular in the field of printed circuit boards and printing plates, are applicable from aqueous medium, are almost tack-free and have very good edge coverage, especially on conductors.

Abstract: The resin system comprises at least two components which can be stored separately and crosslinked with one another at room temperature, preferably without curing accelerators. The first component comprises at least one compound of the formula (I) where A is an unsubstituted or substituted aromatic radical. The second component comprises at least one cyclic anhydride of an organic acid.

Abstract: Disclosed is a novel amino-polyether-modified epoxy for an electrodeposition paint. The amin-polyether-modified epoxy compound is obtained by reacting amino polyether represented by a formula as follow: wherein m is an integer of 5 or more, R is hydrogen, methyl group or ethyl group, and n is 2 or 3, with polyglycidyl ether having a molecular weight of 1,000 to 7,000 and an epoxy equivalent of 500 to 3,500, wherein an equivalent ratio of a primary amino group of the amino polyether to an epoxy group of the polyglycidyl ether is controlled within the range of 0.52 to 1.0.

Abstract: A resin composition useful as an adhesive film and insulating material for a multilayer wiring substrate or electronic parts comprises (A) a polymer containing a quinoline ring represented by the formula (1) in the structure such as 6,6′-bis(2-(4-fluorophenyl)-4-phenylquinoline) and 4,4′-(1,1,1,3,3,3-hexafluoro-2,2-propylidene)bisphenol, and (B) a bismaleimide compound represented by the formula (2) such as 2,2-bis((4-maleimidophenoxy)phenyl)propane.

Abstract: The present invention provides a novel amino-group-containing polymer (salt) and a production process therefor wherein the amino-group-containing polymer (salt) is a product by a process including the step of introducing amino groups into a grafted polymer having a polyether skeleton, and can make good use of the reactivity or cationic property of at least primary amino groups and further, according to circumstances, secondary amino groups, and further can display various performances, such as curability useful for various uses and adsorbency onto films or fibers.

Abstract: A curable vinyl ester resin composition capable of undergoing B-staging at room temperature comprises (a) an unmodified vinyl ester resin; (b) a reactive diluent consisting of an ethylenically unsaturated monomer; (c) a free-radical curing agent; (d) a B-staging agent comprising a Group II metal oxide or hydroxide, or a mixture thereof; and (e) a thickening agent comprising an ester, a ketone, an aldehyde or a mixture thereof. The thickening agent coacts with the B-staging agent to cause B-staging of the vinyl ester resin at room temperature. The vinyl ester resin composition according to the invention is particularly useful for impregnating a fibrous material such as a woven fabric material. The fibrous material impregnated with the vinyl ester resin composition of the invention has a shelf life of up to 12 months. B-staging is generally reached in about two weeks following mixture of the various components and impregnation of the fibrous material.

Abstract: A process for cationic electrodeposition coating which comprises the steps of: (1) immersing a substrate in a cationic electrodeposition coating composition: (2) applying a voltage between an anode and said substrate, which serves as a cathode, to thereby cause coat film deposition; and (3) further applying a voltage to the coat film deposited so as to increase electric resistance per unit volume of said coat film, wherein, in said step (3), coat films are deposited at those sites of the substrate where coat films have not yet been deposited, said cationic electrodeposition coating composition having a time point when the electric resistance per unit volume of the coat film deposited increases in the course of electrodeposition under constant-current conditions.

Abstract: Hardeners for epoxy resins produced by reacting one or more &agr;,&bgr;-unsaturated carboxylic acid esters with one or more hydroxy compounds, reacting the thus formed intermediate with one or more aminopolyalkylene oxide compounds, reacting the thus formed intermediate with one or more polyepoxide compounds, and reacting the thus formed intermediate with one or more amines are described. Processes for their production, aqueous dispersions containing the same and methods for their use are also described.

Abstract: Hardeners for epoxy resins produced by reacting one or more &agr;,&bgr;-unsaturated carboxylic acid esters with one or more aminopolyalkylene oxide compounds, reacting the thus formed intermediate with one or more polyepoxide compounds, and reacting the thus formed intermediate with one or more amines are described. Processes for their production, aqueous dispersions containing the same and methods for their use are also described.

Abstract: Hardeners for epoxy resins produced by reacting one or more &agr;,&bgr;-unsaturated carboxylic acid esters with one or more aminopolyalkylene oxide compounds, reacting the thus formed intermediate with one or more polyhydroxy compounds, reacting the thus formed intermediate with one or more polyepoxide compounds, and reacting the thus formed intermediate with one or more amines are described. Processes for their production, aqueous dispersions containing the same and methods for their use are also described.

Abstract: A curable powder film-forming composition which includes: (a) about 55 to 80 percent by weight based on the total weight of resin solids in the film forming composition, of an epoxy functional copolymer having a Tg of about 77° F. to about 158° F. formed by free radical initiated polymerization of: (i) about 25 to about 75 percent by of a glycidyl functional ethylenically unsaturated monomer, and (ii) about 25 to about 75 percent by weight of a copolymerizable ethylenically unsaturated monomer or mixture of monomers free of glycidyl functionality; (b) about 15 to about 35 percent by weight of a polycarboxylic acid; and (c) about 1.0 to about 4.0 percent by weight of a polyisocyanate at least partially capped with a capping agent. A multi-component composite coating composition is also provided, which includes a pigmented film-forming base coat and a transparent top coat of the film-forming composition described above.

Abstract: This invention concerns low viscosity aldimine and ketimine reactive diluents having multi-imine functionality, which are useful in automotive refinish coating compositions, including a process for making them and the coatings that contain them.

Abstract: Binders for road-marking paints, comprising a (meth)acrylate copolymer A and one or more olefinincally unsaturated monomers B which can be cured by adding free-radical initiators C, wherein the binders have mass fractions of from 20 to 80% of the (meth)acrylate copolymer A and from 80 to 20% of the olefinically unsaturated monomers B, where the (meth)acrylate copolymers A are obtainable by reacting, mass fractions of, from 10 to 50% of compounds A1 selected from the group consisting of from 10 to 50% of compounds A1 selected from the group consisting of monoexpoxides, lactones and lactams having from 4 to 18 carbon atoms, from 1 to 25% of olefinically unsaturated monomers A2 which contain at least one acid group selected from the group consisting of carboxyl groups, sulfonic acid groups and phosphonic acid groups, from 5 to 70% of methacylates A3 of linear, branched or cyclic alchohols having from 1 to 20 carbon atoms, from 2 to 84% of acrylates A4 of linear, branched or cyclic alcohols having from 2 to 2

Abstract: A process for preparing an epoxidized organic polymer by dispersing or suspending a solid organic polymer in an organic solvent and epoxidizing the dispersed or suspended polymer with a peroxide. The epoxidized polymer thus obtained is usable for coating materials, resin modifiers, rubber modifiers or adhesives, thus being extremely useful. The epoxidized organic polymer is useful to prepare a thermoplastic resin composition having improved mechanical strength, and comprising a thermoplastic resin, an epoxidized EPDM and an acid anhydride. The thermoplastic composition can be used to prepare a primer composition including a 100 parts by weight of an epoxidized EPDM and 50 to 70 parts by weight of a product of chlorination of a polyolefin modified with an unsaturated carboxylic acid or an anhydride thereof.

Abstract: The invention is a curable resin composition comprising A) an epoxy vinylester resin or a polyester resin; B) a polymerizable monomer; C) a chelating agent; and D) a copper salt or complex of copper with an alcohol, aldehyde or ketone; and E) an inhibitor comprising alkylated phenolic compound or polyhydroxy aromatic compound. In another aspect it is a resin system comprising I) a resin composition comprising: A) an epoxy vinylester resin or a polyester resin; B) a polymerizable monomer; C) a chelating agent comprising a polar or aromatic ring containing compound; D) a copper salt or a copper complex with an alcohol, ketone or aldehyde; and E) an inhibitor comprising alkylated phenolic compound or a polyhydroxy aromatic hydrocarbon and I) a catalyst system which comprises E) an additional amount of an inhibitor; F) optionally an aliphatic amine, an aromatic amine, or a heterocyclic amine; G) a peroxide or persulphate initiator; and H) a transition metal accelerator.