Nitrogen Reactant Contains At Least One Amino-nitrogen Atom Patents (Class 528/183)
  • Patent number: 6849706
    Abstract: Copolyetherimides comprise phthalimide structural units comprising both 3- and 4-linkages, wherein the designations 3-linkage and 4-linkage refer to the isomeric positions on the phthalimide ring in the totality of phthalimide-comprising structural units in the copolymer. The products have excellent properties, including high glass transition and heat distortion temperatures, high ductility and good melt flow properties, and low polydispersity.
    Type: Grant
    Filed: August 25, 2003
    Date of Patent: February 1, 2005
    Assignee: General Electric Company
    Inventors: Daniel Joseph Brunelle, Havva Yagci Acar, Farid Fouad Khouri, William David Richards
  • Patent number: 6828408
    Abstract: An aromatic polyimide ester having a small coefficient of linear expansion, small water absorbing property, and excellent heat resistance. The aromatic polyimide ester comprising: a repeating unit represented by a following formula (I), a repeating unit represented by a following formula (II), (n represents 0 or 1) a repeating unit represented by a following formula (III), and a repeating unit represented by a following formula (IV), (-A- represents —O— or —CO—, and is located in para-position or meta position to imido group, and X represents direct coupling, —O—, —S—, or —SO2—) and the repeating units are mutually bonded with each other through ester-bonds.
    Type: Grant
    Filed: September 5, 2002
    Date of Patent: December 7, 2004
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Satoshi Okamoto, Manabu Hirakawa
  • Patent number: 6824642
    Abstract: The following invention relates to phenyl-linked polybenzoxazoles having terminal, aryl- or heteroaryl-attached cyanate groups which can be used for adhesive bonding and as dielectrics, especially for electronic components, and to a process for preparing them.
    Type: Grant
    Filed: July 26, 2002
    Date of Patent: November 30, 2004
    Assignee: Infineon Technologies AG
    Inventors: Andreas Walter, Recai Sezi
  • Patent number: 6808818
    Abstract: A fusible polyimide showing a fusion endothermic peak in a differential scanning calorimeter has a recurring unit of the following formula (1): in which Ar1 is a mixture of residues of tetracarboxylic dianhydrides composed of 12-25 mol. & of a residue of pyromellitic dianhydride, 5-15 mol. % of a residue of 3,3′4,4′-benzophenonetetracarboxylic dianhydride, and a remaining mol. % of a residue of 3,3′,4,4′-biphenyltetracarboxylic dianhydride, and Ar2 is an aromatic diamine residue composed of 1,3-bis(4-aminophenoxy)benzene.
    Type: Grant
    Filed: October 11, 2002
    Date of Patent: October 26, 2004
    Assignee: Ube Industries, Ltd.
    Inventors: Hideki Ozawa, Shigeru Yamamoto
  • Patent number: 6784276
    Abstract: This invention is a highly concentrated stable solution of polyimide precursors (monomers) having a solids content ranging from about 80 to 98 percent by weight in lower aliphatic alcohols i.e. methyl and/or ethyl alcohol. The concentrated polyimide precursor solution comprises effective amounts of at least one aromatic diamine, at least one aromatic dianhydride or a lower molecular weight alkyl ester of said dianhydride, and a monofunctional endcap including monoamines, monoanhydrides and the lower alkyl esters of said monoanhydrides. These concentrated polyimide precursor solutions are particularly useful for the preparation of fibrous prepregs and composites for use in structural materials for military and civil applications.
    Type: Grant
    Filed: July 25, 2002
    Date of Patent: August 31, 2004
    Assignee: The United States of America as represented by the United States National Aeronautics and Space Administration
    Inventor: Chun-Hua Chuang
  • Patent number: 6780960
    Abstract: A method of making a solution of a polyimide from a diamine monomer and a dianhydride monomer is disclosed. A solution or slurry of one of the monomers in a solvent that boils at a temperature between about 80° C. and about 160° C. is prepared. The solution or slurry is heated to a temperature between about 80° C. and about 160° C. and the other monomer is slowly added to the solution or slurry. Polyamic acid that is formed quickly imidizes to form the polyimide.
    Type: Grant
    Filed: July 22, 2002
    Date of Patent: August 24, 2004
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Michael C. Hausladen, Jin-O Choi
  • Patent number: 6777525
    Abstract: Polyimides having a desired combination of high thermo-oxidative stability, low moisture absorption and excellent chemical and corrosion resistance are prepared by reacting a mixture of compounds including (a) 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA), (b) 3,4′-oxydianiline (3,4′-ODA), and (c) 5-norbornene-2,3-dicarboxylic anhydride (NA) in a high boiling, aprotic solvent to give 5 to 35% by weight of polyamic acid solution. The ratio of (a), (b), and (c) is selected to afford a family of polyimides having different molecular weights and properties. The mixture first forms a polyamic acid precursor. Upon heating at or above 300° C., the polyamic acids form polyimides, which are particularly suitable for use as a high temperature coating, adhesive, thin film, or composite matrix resin.
    Type: Grant
    Filed: April 1, 2002
    Date of Patent: August 17, 2004
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventor: Ruth H. Pater
  • Publication number: 20040152855
    Abstract: A composition, comprising, in an appropriate medium, at least one polymer with a highly specific ordered structure is disclosed. These compositions find a specific application in the field of make-up and are capable of being applied to keratinous fibres, in particular to the nails, eyelashes, eyebrows and hair. In particular, these compositions can make it possible to obtain a film which exhibits good resistance to chipping, to impacts, to rubbing movements, to scratches and/or to pressing actions.
    Type: Application
    Filed: January 17, 2003
    Publication date: August 5, 2004
    Applicant: L'Oreal
    Inventor: Nathalie Mougin
  • Patent number: 6770733
    Abstract: A film-formable polyimide copolymer, which comprises two kinds of tetracarboxylic acid dianhydride consisting of (A) pyromellitic acid dianhydride and (B) 3,3′,4,4′-benzophenonetetracarboxylic acid dianhydride, and (C) 6-amino-2-(p-aminophenyl)benzimidazole has a heat-resistant dimensional stability without any deterioration of mechanical properties inherent in the polyimide resin when used as a film.
    Type: Grant
    Filed: January 3, 2003
    Date of Patent: August 3, 2004
    Assignee: Nippon Mektron, Limited
    Inventors: Min Zuo, Jenq-Tain Lin
  • Publication number: 20040138406
    Abstract: The invention relates to novel polyhydroxyamide compounds that, in the form of their oxazoles, ane suited as a coating material, particularly for electronic components. The invention also relates to a method for producing these novel compounds and to the use thereof.
    Type: Application
    Filed: February 10, 2004
    Publication date: July 15, 2004
    Inventors: Marcus Halik, Klaus Lowack, Recai Sezi, Andreas Walter
  • Patent number: 6762277
    Abstract: A method of manufacturing a new N-carboxyamino acid anhydride and polyamino acid using a simple process operation. The method for manufacturing N-carboxyamino acid anhydride comprising reacting &agr;-amino acid with di-tert-butyltricarbonate. The method for manufacturing polyamino acid comprising decarboxylating the N-carboxyamino acid anhydride obtained by reacting &agr;-amino acid with di-tert-butyltricarbonate.
    Type: Grant
    Filed: April 26, 2002
    Date of Patent: July 13, 2004
    Assignee: JSR Corporation
    Inventors: Hiroto Kudoh, Takeshi Endoh
  • Patent number: 6750317
    Abstract: Polyhydroxyamides are polymerized to form highly-crosslinked, temperature-stable polymers. The polyhydroxyamides include as their central, parent structure a benzenetricarboxylic acid to which side chains containing a terminal reactive group are attached by an amide bond. By way of this reactive group, highly crosslinked polymers can be formed. In addition, the polyhydroxyamide can be added as an additive to polymers in order to bring about three-dimensional crosslinking.
    Type: Grant
    Filed: May 31, 2002
    Date of Patent: June 15, 2004
    Assignee: Infineon Technologies AG
    Inventors: Marcus Halik, Holger Hösch, Sezi Recai, Andreas Walter
  • Patent number: 6740371
    Abstract: An alkyldiamine having excellent polymerization reactivity, a polyimide comprising it as a constituting element, and a liquid crystal alignment film excellent in uniformity of liquid crystal alignment, are presented. Namely, the present invention relates to a diaminobenzene derivative represented by the following general formula (1) and to a polyimide obtained by reacting a diamine containing at least 1 mol % of the diaminobenzene derivative represented by the general formula (1), with at least one compound selected from a tetracarboxylic. dianhydride and its derivatives, to obtain a polyimide. precursor having a reduced viscosity of from 0.05 to 5.0 dl/g (in N-methylpyrrolidone at a temperature of 30° C., concentration: 0.5 g/dl) and ring-closing it, and having a repeating unit represented by the general formula (2). Further, the present invention relates to a liquid crystal alignment film containing at least 1 mol % of the above repeating unit.
    Type: Grant
    Filed: December 26, 2001
    Date of Patent: May 25, 2004
    Assignee: Nissan Chemical Industries, Ltd.
    Inventors: Kazuyoshi Hosaka, Hideyuki Nawata, Takayasu Nihira, Hideyuki Isogai, Hideyuki Endou, Hiroyoshi Fukuro
  • Patent number: 6740359
    Abstract: The present invention is directed to fast dry ambient temperature curable coating compositions especially suited for use in automotive refinish applications. A binder component of the two pack coating composition includes an epoxy resin having at least one acetoacetate functionality and at least one epoxy group, and one or more reactive components provided with at least two acetoacetate functionalities. Some of the suitable reactive components include structured reactive diluent, an acrylic polymer, a polyester, or a combination thereof. A crosslinking component of the coating composition includes polyamine, a blocked polyamine or a mixture thereof. The present invention is further directed to a method of producing a coating on a substrate from the coating composition.
    Type: Grant
    Filed: January 25, 2002
    Date of Patent: May 25, 2004
    Assignees: E. I. du Pont de Nemours and Company, Renner Dupont Tintas Automotives E Industrials S.A.
    Inventors: Uday Kumar, Patrick H. Corcoran, Cesar A. Rodrigues
  • Patent number: 6737503
    Abstract: The aromatic diamine compound of the present invention is represented by the following formula (1), and from the aromatic diamine compound a polyimide having a repeating unit represented by the following formula (4), which has low-temperature adherability, can be obtained. In the formulas (1) and (4), n is an integer of 3 to 7, each R is independently an atom or a group selected from the group consisting of a hydrogen atom, a halogen atom and a hydrocarbon group, the same or different two hetero atoms selected from nitrogen atoms and oxygen atoms bonded to each benzene ring are at the ortho- or meta-positions to each other on at least one benzene ring, and when n is 3, the hetero atoms are at the ortho- or meta-positions to each other on all the benzene rings. In the formula (4), Y is a tetravalent organic group.
    Type: Grant
    Filed: September 3, 2002
    Date of Patent: May 18, 2004
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Yoichi Kodama, Minehiro Mori, Naoshi Nagai, Masaru Kawaguchi
  • Patent number: 6734210
    Abstract: Stable salts of azelaic acid with polycations such as chitosan are described. The salts according to the invention are water-soluble, therapeutically more efficacious and are valuable for use as active constituents in pharmaceutical as well as cosmeceutical compositions.
    Type: Grant
    Filed: February 23, 2001
    Date of Patent: May 11, 2004
    Inventor: Rolland F. Hebert
  • Patent number: 6734276
    Abstract: The invention is a polyimide, random copolymer having repeating units of the formula (1): wherein R1 and R2 each represent a divalent group selected from and R1 and R2 may be the same or different; and x=0.60 to 0.80, y+z=0.40 to 0.20, and x+y+z=1.00, and a linear expansion coefficient at 100 to 200° C. is in the range of from 10 to 20 ppm/K. This is a useful polyimide that can be a polyimide circuit substrate material capable of keeping flat, neither shrinking nor expanding in its laminate.
    Type: Grant
    Filed: April 11, 2002
    Date of Patent: May 11, 2004
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Wataru Yamashita, Katsuji Watanabe, Takahisa Oguchi
  • Patent number: 6693162
    Abstract: The present invention provides a polyimide resin, a resin composition, an adhesive solution, a film-state joining component, and an adhesive laminate film soluble in a solvent having excellent heat resistance and adhesion, capable of bonding and curing at relatively low temperatures.
    Type: Grant
    Filed: October 9, 2001
    Date of Patent: February 17, 2004
    Assignee: Kaneka Japan Corporation
    Inventors: Hiroyuki Tsuji, Hiroyuki Furutani, Koichiro Tanaka, Takeshi Kikuchi
  • Patent number: 6680363
    Abstract: An acid dianhydride, together with a diamine, is heated in an organic polar solvent in the presence of &ggr;-caprolactone or &bgr;-butyrolactone as an acid catalyst to prepare a polyimide having an average molecular weight of 10,000 to 300,000. This production process can realize the production of a polyimide which is soluble in a solvent and has high processability and stability.
    Type: Grant
    Filed: January 23, 2002
    Date of Patent: January 20, 2004
    Assignee: Hitachi Cable, Ltd.
    Inventors: Katsumoto Hosokawa, Yuuki Honda, Seiji Kamimura, Yoshiyuki Ando, Kenji Asano
  • Patent number: 6657016
    Abstract: A polyester resin composition comprising 50 equivalents/ton or more of an aromatic ring in the resin and at least one thermosetting resin selected from the group consisting of melamine resin, urea resin, benzoguanamine resin and phenol resin. The aromatic ring in the polyester resin has a phenolic hydroxyl group and at least one of ortho-position and para-position of the aromatic ring to the phenolic hydroxyl group is a hydrogen atom. The resin composition has excellent toughness at ambient temperature and heat resistance.
    Type: Grant
    Filed: March 14, 2002
    Date of Patent: December 2, 2003
    Assignee: Toyo Boseki Kabushiki Kaisha
    Inventor: Takeshi Yatsuka
  • Patent number: 6653433
    Abstract: A polyimide film that exhibits improved peel strength when clad with a metal layer is prepared by reacting a polyamic acid polymer and an esterified polyamic acid oligomer. The esterified oligomer has from two to twenty repeating units and at least two crosslinkable groups selected from the group consisting of carbonyl, cyano, hydroxy, alkyne, maleimide, norbornene and sulfonyl groups. The polyamic acid is dissolved in a solvent to form a polyamic acid solution, which has a minimum gel-film forming temperature, or a minimum green film forming temperature, associated therewith. The esterified polyamic acid oligomer has an imidization temperature, which is higher than the minimum gel-film forming temperature, or the minimum green film forming temperature, of the polyamic acid solution.
    Type: Grant
    Filed: May 4, 2001
    Date of Patent: November 25, 2003
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: James Richard Edman, Meredith Lynn White
  • Patent number: 6642348
    Abstract: The present invention provides PMR-type polyimides that exhibit lower melt viscosities than PMR-type polyimides of the prior art. These PMR-type polyimides are created by incorporating flexible linkages, such as kinked structures and twisted or non-coplanar moietes into the backbone structure of the PMR. Specifically, the present invention provides for the production of PMR-type polyimides having 2,2′-disubstituted biaryls in the polymer backbone.
    Type: Grant
    Filed: March 2, 2001
    Date of Patent: November 4, 2003
    Assignee: The University of Akron
    Inventors: Ronald Eby, Michael Meador, Christopher Gariepy
  • Patent number: 6607795
    Abstract: Herein is disclosed an oxygen scavenging composition, comprising (i) an oxygen scavenging polymer comprising units having structure I: wherein R1 and R2 are independently selected from the group consisting of —O—, —NCO—, and —NR—, wherein R is selected from the group consisting of —H and —C1-C6 alkyls; (ii) a transition metal oxidation catalyst; and (iii) an energy-absorbing compound selected from the group consisting of microwave reactive materials and photoinitiators having a wavelength of maximum absorption of electromagnetic radiation from about 200 nm to about 750 nm. The oxygen scavenging composition can be used to form an oxygen scavenging packaging article.
    Type: Grant
    Filed: December 19, 2001
    Date of Patent: August 19, 2003
    Assignee: Chevron Phillips Chemical Company LP
    Inventors: Hu Yang, Ta Yen Ching, Peter Kwan
  • Patent number: 6600006
    Abstract: A polyamic ester prepared by partially substituting hydrogen atoms of carboxylic groups of a polyamic acid with acid labile groups, the polyamic ester comprising one or more repeating units represented by Formula 1, and each of at least one terminal of the polyamic ester molecule terminates with the same or different reactive end-capping monomer: wherein in Formula 1, R1 and R2 are independently a hydrogen atom, or an acid labile group; X is a tetravalent, an aromatic or an aliphatic organic group; Y is a divalent, an aromatic or an aliphatic organic group; and m is an integer equal to or greater than 1.
    Type: Grant
    Filed: December 31, 2001
    Date of Patent: July 29, 2003
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Myung Sup Jung, Sung Kyung Jung, Yong Young Park, Bong Seok Moon, Bong Kyu Kim
  • Patent number: 6596838
    Abstract: The invention relates to a semi-permeable membrane separation process and device in which the said membranes comprise sulphonated polyimides. The present invention also relates to the use of sulphonated polyimide membranes in separation processes and devices using semi-permeable membranes.
    Type: Grant
    Filed: August 17, 2001
    Date of Patent: July 22, 2003
    Assignees: Commissariat A l'Energie Atomique, Centre National de la Recherche
    Inventors: Michel Pinery, Gérald Pourcelly, Régis Mercier
  • Publication number: 20030135004
    Abstract: A composition, comprising, in an appropriate medium, at least one polymer with a highly specific ordered structure is disclosed. These compositions find a specific application in the field of make-up and are capable of being applied to keratinous fibres, in particular to the nails, eyelashes, eyebrows and hair. In particular, these compositions can make it possible to obtain a film which exhibits good resistance to chipping, to impacts, to rubbing movements, to scratches and/or to pressing actions.
    Type: Application
    Filed: January 17, 2003
    Publication date: July 17, 2003
    Applicant: L'Oreal
    Inventor: Nathalie Mougin
  • Patent number: 6586561
    Abstract: Sulfonated polyimide polymers incorporating bulky monomers are disclosed. The polymers have a liquid crystalline structure and exhibit high conductivity, high water uptake and water stability over a range of relative humidities and temperatures. The polymers are particularly adapted for use as a polymer electrolyte membrane in fuel cells.
    Type: Grant
    Filed: February 18, 2000
    Date of Patent: July 1, 2003
    Assignee: Case Western Reserve University
    Inventors: Morton H. Litt, Robert F. Savinell, Jesse S. Wainright, Yue Zhang
  • Patent number: 6586555
    Abstract: This invention provides processes of the preparation of polyamides, polyimides, and polyamideimides, which are easy to purify after reactions, from polycarboxylic acids and polyamines in high yield without side reactions such as a change of color to black by direct polycondensation reaction with heat, especially processes of preparing aromatic polyamides (aramids), aromatic polyimides, and aromatic polyamideimides, which are difficult to synthesize in direct polycondensation reaction. Polyamides, polymides, and polyamideimides are prepared in high yield by the polycondensation of aromatic dicarboxylic acids, aromatic tetracarboxylic acids or aromatic tricarboxylic acids and aromatic diamines, using arylboric acids such as 3,4,5-trifluorophenylboric acids as polycondensation catalysts, in a mixed solvent of pentamethylbenzene and N-methylpyrrolidinone or a mixed solvent of m-terphenyl and N-butylpyrrolidinone.
    Type: Grant
    Filed: September 12, 2001
    Date of Patent: July 1, 2003
    Assignee: Japan Science and Technology Corporation
    Inventors: Kazuaki Ishihara, Hisashi Yamamoto
  • Patent number: 6569984
    Abstract: The invention is directed to method for making a polyimide by converting the dianhydride to the ester acid and reacting the ester acid with a diamine. The invention allows for the controlled addition of aliphatic diamines resulting in control of the polyimide properties such as the glass transition temperature, solubility, and melt processability.
    Type: Grant
    Filed: April 27, 2001
    Date of Patent: May 27, 2003
    Assignee: Virginia Tech Intellectual Properties, Inc.
    Inventors: James E. McGrath, Sue J. Mecham
  • Patent number: 6552146
    Abstract: A composition, comprising, in an appropriate medium, at least one polymer with a highly specific ordered structure is disclosed. These compositions find a specific application in the field of make-up and are capable of being applied to keratinous fibers, in particular to the nails, eyelashes, eyebrows and hair. In particular, these compositions can make it possible to obtain a film which exhibits good resistance to chipping, to impacts, to rubbing movements, to scratches and/or to pressing actions.
    Type: Grant
    Filed: April 5, 2000
    Date of Patent: April 22, 2003
    Assignee: L'Oreal S.A.
    Inventor: Nathalie Mougin
  • Patent number: 6538100
    Abstract: The object of the present invention is to provide a method capable of producing polyimide resins having excellent heat resistance, which can utilize inexpensive monomers and does not use solvents. The method comprises mixing, in the absence of a solvent, a diamine and at least one tetracarboxylic acid component selected from the group consisting of a tetracarboxylic acid, a tetracarboxylic acid monoanhydride and a tetracarboxylic acid dianhydride capable of forming two imide rings upon cyclization, and then heat-treating the mixture.
    Type: Grant
    Filed: February 14, 2000
    Date of Patent: March 25, 2003
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Yoshiyuki Yamamori, Hiroyuki Yasuda
  • Patent number: 6538097
    Abstract: A process for production of polyimide powder, which comprises reacting a biphenyltetracarboxylic dianhydride and an aromatic diamine in an amide-based solvent optionally containing a water-soluble ketone, in the presence of an imidazole at 1-100 equivalent percent based on the carboxylic acid content of the polyimide precursor, separating and collecting the produced polyimide precursor powder from a water-soluble ketone solvent containing 3-30 wt % of an amide-based solvent, and heating the polyimide precursor powder to an imidation rate of 90% or greater, as well as polyimide powder obtained thereby, molded bodies of the polyimide powder, and a process for production of the molded bodies.
    Type: Grant
    Filed: October 29, 2001
    Date of Patent: March 25, 2003
    Assignee: UBE Industries, Ltd.
    Inventors: Hiroaki Yamaguchi, Fumio Aoki
  • Patent number: 6534622
    Abstract: A process for production of polyimide powder, which comprises reacting an aromatic diamine with a partial ester of a biphenyltetracarboxylic dianhydride, which is a partial ester of a biphenyltetracarboxylic dianhydride with a primary alcohol of 1-5 carbon atoms of which at least 30 mole percent is a 2,3,3′,4′-biphenyltetracarboxylic acid component, in the presence of the primary alcohol, separating out and collecting the resulting solid polyimide precursor and heating for dehydrating ring closure, polyimide powder obtained thereby, molded bodies of the polyimide powder, and a process for production of the molded bodies.
    Type: Grant
    Filed: October 29, 2001
    Date of Patent: March 18, 2003
    Assignee: Ube Industries, Ltd.
    Inventors: Hiroaki Yamaguchi, Fumio Aoki
  • Patent number: 6531568
    Abstract: This invention provides crosslinkable-group-containing polyimides of various known thermoplastic polyimide backbone structures, which are provided with far better heat resistance, chemical resistance and mechanical properties than known polyimides of the structures without impairing excellent moldability or formability, superb sliding property, low water absorption property, outstanding electrical properties, high thermal oxidation stability and high radiation resistance, all of which are inherent to the structures.
    Type: Grant
    Filed: April 9, 2001
    Date of Patent: March 11, 2003
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Atsushi Shibuya, Tomomi Okumura, Hideaki Oikawa, Yoshihiro Sakata, Takashi Kuroki, Yuichi Okawa, Shoji Tamai
  • Patent number: 6518392
    Abstract: A novel dielectric composition is provided that is useful in the manufacture of integrated circuit devices and integrated circuit packaging devices. The dielectric composition is prepared by imidizing and curing an oligomeric precursor compound comprised of a central polybenzoxazole, polybenzothiazole, polyamic acid or polyamic acid ester segment end-capped at each terminus with an aryl-substituted acetylene moiety such as an ortho-bis(arylethynyl)aryl group, e.g., 3,4-bis(phenylethynyl)phenyl. Integrated circuit devices, integrated circuit packaging devices, and methods of synthesis and manufacture are provided as well.
    Type: Grant
    Filed: March 8, 2001
    Date of Patent: February 11, 2003
    Assignee: International Business Machines Corporation
    Inventors: Kenneth R. Carter, James L. Hedrick, Victor Yee-Way Lee, Dale C. McHerron, Robert D. Miller
  • Patent number: 6506536
    Abstract: The present invention also includes an imageable element, comprising a substrate and a thermally imageable composition comprising a thermally sensitive polymer which exhibits an increased solubility in an aqueous developer solution upon heating. The thermally sensitive polymer includes at least one covalently bonded unit and at least one thermally reversible non-covalently bonded unit, which includes a two or more centered H-bond within each of the non-covalently bonded unit. The present invention also includes a method of producing the imaged element. The present invention still further includes a thermally imageable composition comprising comprising a thermally sensitive polymer according to the present invention and a process for preparing the thermally sensitive polymer, which is a supramolecular polymer.
    Type: Grant
    Filed: December 29, 2000
    Date of Patent: January 14, 2003
    Assignee: Kodak Polychrome Graphics, LLC
    Inventors: S. Peter Pappas, Alan Monk, Shashikant Saraiya, Jianbing Huang
  • Patent number: 6500913
    Abstract: The present invention relates to a novel polyimide of the general formula (1) and a process for the preparation thereof.
    Type: Grant
    Filed: March 13, 2001
    Date of Patent: December 31, 2002
    Assignees: Council of Scientific and Industrial Research, Laboratoire des Materiaux Organiques a Proprietes Speciques
    Inventors: Jinu Suju Mathew, Subhash Pundlik Vernekar, Reges Mercier, Rachid Kerboua
  • Patent number: 6500904
    Abstract: A method for the synthesis of high molecular weight poly(imide)s comprising coupling poly(imide) precursors having complementary functional groups and a weight average molecular weight of less than about 50,000 Daltons to form high molecular weight poly (imides)s having a weight average molecular weight greater than 50,000 Daltons.
    Type: Grant
    Filed: November 2, 2001
    Date of Patent: December 31, 2002
    Assignee: General Electric Company
    Inventor: Robert F. Hayes
  • Publication number: 20020198358
    Abstract: The present invention provides a polymer in which coumarin, a photo-reactive molecule, is grafted onto a polyimide for preparing liquid crystal alignment layer which has a superior alignment property and an excellent thermal stability in photo-alignment, a process for preparing the said grafted polymer, a process for preparing liquid crystal alignment layer by employing the said grafted polymer, and a liquid crystal alignment layer prepared by the process. The polymer of the invention is prepared by mixing a coumarin compound with a polyimide, dissolving the mixture in an organic solvent, adding a catalyst, and stirring under an environment of N2 gas. The polymer of the invention is superior in terms of the thermal stability, which makes possible its universal application for the development of a novel liquid crystal display(LCD).
    Type: Application
    Filed: March 8, 2002
    Publication date: December 26, 2002
    Inventors: Jung-Ki Park, Shi-joon Sung, Jong-Woo Lee
  • Patent number: 6498226
    Abstract: This invention provides cycloaliphatic polyimide having the following formula (I): wherein 1 and n are integers from 4 to 7; m is an integer from 0 to 2; p is an integer from 1 to 8; polycyclic aliphatic compound R reprents C1-8 cycloalkyl, cycloalkenyl, cycloalkynyl, norbornenyl, decalinyl, adamantanyl, or cubanyl. That cycloaliphatic polyimide can be a through transparent film, their thermal stability is over 430° C. and dielectric constant is about 2.7.
    Type: Grant
    Filed: May 3, 2001
    Date of Patent: December 24, 2002
    Assignee: Industrial Technology Research Institute
    Inventors: Kung-Lung Cheng, Shu-Chen Lin, Wen-Ling Lui, Chih-Hsiang Lin, Wei-Ling Lin, Woan-Shiow Tzeng
  • Patent number: 6498224
    Abstract: A new method for the synthesis of poly(etherimide)s comprises transimidation of bis(imide) (IV) in the presence of a substituted phthalic anhydride or 4-substituted tetrahydrophthalic anhydride to yield dianhydride (V) which may then be reacted with a diamine to produce poly(etherimide)s. By-product substituted N-alkylphthalimide or 4-substituted N-alkyltetrahydrophthalic anhydride may be recycled or converted to 4-substituted N-alkylphthalimide for use in the formation bisimide (IV), obviating the need for a nitration step.
    Type: Grant
    Filed: December 5, 2001
    Date of Patent: December 24, 2002
    Assignee: General Electric Company
    Inventors: Roy Ray Odle, Thomas Link Guggenheim, William James Swatos, Michael J. Vollmer
  • Publication number: 20020188095
    Abstract: A method of manufacturing a new N-carboxyamino acid anhydride and polyamino acid using a simple process operation.
    Type: Application
    Filed: April 26, 2002
    Publication date: December 12, 2002
    Applicant: JSR CORPORATION
    Inventors: Hiroto Kudoh, Takeshi Endoh
  • Publication number: 20020188090
    Abstract: Disclosed are a polyamic acid having repeating units represented by the formula (1): 1
    Type: Application
    Filed: March 20, 2002
    Publication date: December 12, 2002
    Inventors: Wataru Yamashita, Katsuji Watanabe, Hideaki Oikawa, Hisato Ito
  • Patent number: 6489436
    Abstract: Novel polyimide copolymer, which is a copolymer of isopropylidene-bis-(4-phenyleneoxy-4-phthalic acid)dianhydride and 6-amino-2-(p-aminophenyl)benzimidazole or a copolymer of two kinds of tetracarboxylic acid dianhydrides consisting of isopropylidene-bis-(4-phenyleneoxy-4-phthalic acid)dianhydride and 3,3′,4,4′-benxophenonetetracarboxylic acid dianhydride and 6-amino-2-(p-aminophenyl)benzimidazole, can form a metal laminate by direct lamination with metallic foils. The metal laminate can fully satisfy the peel strength.
    Type: Grant
    Filed: November 29, 2001
    Date of Patent: December 3, 2002
    Assignee: Nippon Mektron, Limited
    Inventors: Jenq-Tain Lin, Hiroyuki Sekine, Alexandre L'vovich Rusanov, Lyubov Borisovna Elchina, Calina Valentinovna Kazakova, Yakov Semionovich Vygodskii
  • Patent number: 6489431
    Abstract: A polyimide precursor having a repeating unit represented by the following general formula (1), wherein R1 contains a bivalent organic group constituting a diamine having a hexafluoropropylidene group in its molecule represented by the following general formula (2), and the reduced viscosity is from 0.05 to 5.0 dl/g (in N-methylpyrrolidone at a temperature of 30° C., concentration: 0.5 g/dl), and a polyimide obtained by imidizing said precursor: (wherein R1 is a bivalent organic group constituting a diamine, A is a hydrogen atom, a linear alkyl group including a methyl group, or a trifluoromethyl group, and n is the number of a substituent on an aromatic ring and an integer of from 1 to 4).
    Type: Grant
    Filed: April 12, 2001
    Date of Patent: December 3, 2002
    Assignee: Nissan Chemical Industries, Ltd.
    Inventors: Kazuhisa Ishii, Takayasu Nihira, Hiroyoshi Fukuro
  • Patent number: 6486292
    Abstract: The present invention provides an optical polyimide compound defined by the following formula in an optical high polymer material: wherein X is Cl, Br, oxo-halide, or fully halogenated alkyl; A is a divalent aromatic or halogenated aromatic moiety; and Z is a tetravalent moiety which may be a partly or fully fluorinated aromatic ring, a partly or fully chlorinated aromatic ring, a partly or fully fluorinated cycloaliphatic group, a partly or fully chlorinated aliphatic group, or combinations thereof connected via hetero atoms.
    Type: Grant
    Filed: March 7, 2001
    Date of Patent: November 26, 2002
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kyung-Hee You, Kwan-Soo Han, Tae-Hyung Rhee, Eun-Ji Kim, Jung-Hee Kim, Woo-Hyeuk Jang
  • Patent number: 6482915
    Abstract: The invention provides a method for producing a thermotropic liquid crystalline polymer of high quality at high yield and in short polymerization time, which method includes polymerizing staring monomers I, II, III, and IV, i.e., (I) an aromatic hydroxycarboxylic acid, etc.; (II) an aromatic dicarboxylic acid and an alicyclic dicarboxylic acid; (III) an aromatic diol, an alicyclic diol, an aliphatic diol, etc.; and (IV) an aromatic hydroxylamine, an aromatic diamine, etc. in the presence of an acylating agent, wherein the starting materials are charged so as to satisfy the following equations (1) to (4): 0.0015≦((A)−(B))/((A)+(B))≦0.006  (1); 1.01≦(D)/(C)≦1.08  (2); 0≦(E)≦40  (3); and (D)/(C)≧−0.002 ×(E)+1.
    Type: Grant
    Filed: July 19, 2001
    Date of Patent: November 19, 2002
    Assignee: Polyplastics Co., Ltd.
    Inventor: Toshiaki Yokota
  • Patent number: 6479615
    Abstract: The polyamic acid of the invention can be obtained by the reaction of an acid anhydride component comprising pyromellitic anhydride and 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane with 2,2′-di-substituted-4,4′-diaminobiphenyls as a first aromatic diamine and any aromatic diamine component, as a second aromatic diamine, of 2,2-bis(4-aminophenoxyphenyl)propanes, 1,1-bis(4-(4-aminophenoxy)-3-t-butyl-6-methylphenyl)butane, 2,2-bis(3-amino-4-methylphenyl)hexafluoropropane and &agr;,&agr;′-bis(4-aminophenyl)diisopropylbenzenes in an organic solvent. The polyimide resin of the invention can be obtained by heating such a polyamic acid solution. In the production of a circuit board, by using a photosensitive polyamic acid having a sensitizer incorporated in such a polyamic acid solution, a patterned polyimide resin layer can be provided as an insulation layer on a metal foil.
    Type: Grant
    Filed: December 11, 2000
    Date of Patent: November 12, 2002
    Assignee: Nitto Denko Corporation
    Inventors: Takahiro Fukuoka, Amane Mochizuki, Naoki Kurata, Naotaka Kinjo, Toshihiko Omote
  • Patent number: 6476182
    Abstract: Random, melt-processible copolyimides are disclosed herein. These copolyimides are semicrystalline and exhibit recoverable (semi)crystallinity from their melts. Associated processes, which entail either solution polymerization or melt polymerization, for producing and fabricating these copolyimides into useful articles having a predetermined shape are also disclosed.
    Type: Grant
    Filed: December 21, 2000
    Date of Patent: November 5, 2002
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: Brian C Auman, William R Corcoran, Jr., John D Summers
  • Patent number: 6476177
    Abstract: Random, melt-processible copolyimides are disclosed herein. These copolyimides are semicrystalline and exhibit recoverable (semi)crystallinity from their melts. Associated processes, which entail either solution polymerization or melt polymerization, for producing and fabricating these copolyimides into useful articles having a predetermined shape are also disclosed.
    Type: Grant
    Filed: December 21, 2000
    Date of Patent: November 5, 2002
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: Brian C. Auman, William R Corcoran, Jr., John R Dodd, Mark A Guidry, John D. Summers