From Ketone Or Ketene Reactant Patents (Class 528/220)
  • Publication number: 20030176635
    Abstract: A melt processible Polyether Ether Ketone (PEEK) polymer with novel end-group structure is synthesized electrophilically using Methane Sulfonic Acid containing Methane Sulfonic Anhydride or Phosphorous Pentoxide. The product so obtained shows controlled structure with elimination of reactive end group like —COOH and is therefore melt processible by conventional techniques and exhibits high thermal and mechanical properties making it useful high temperature engineering and specialty plastics. It can be extruded into a rod, film and can also be molded into commercially useful products.
    Type: Application
    Filed: March 14, 2003
    Publication date: September 18, 2003
    Applicant: GHARDA CHEMICALS LTD.
    Inventors: Keki Hormusji Gharda, Prakash Druman Trivedi, Venkat Srinivasan Iyer, Utpal Mahendra Vakil, Sanjav Chintaman Limaye
  • Publication number: 20030149224
    Abstract: The invention is related to a thermosetting composition containing a functional resin with —OH or —NH2 groups, a functionality of more than 2, and a crosslinking agent, wherein the crosslinking agent is a carbonylbislactamate. The composition preferably contains also an acid or a base as a catalyst. The invention further relates to the use of a carbonylbislactamate for curing of a functional resin with —OH or —NH2 groups and a functionality of more than 2.
    Type: Application
    Filed: December 13, 2002
    Publication date: August 7, 2003
    Inventors: Jacobus A Loontjens, Rudolfus A T M Van Benthem, Bartholomeus J M Plum, Johan Rietberg
  • Patent number: 6600005
    Abstract: The invention relates to a method for producing poly(1,4-phenylenazine-N,N-dioxide) and derivatives thereof which are substituted in the ring, by oxidizing p-benzoquinonedioxime or the corresponding derivative thereof which is substituted in the ring, using polyanions of the halogens bromine or iodine. Tribromide Br3- or triiodide I3- can be used as polyanions and these can be obtained in situ from H2O2 and a bromide or iodide.
    Type: Grant
    Filed: November 2, 2001
    Date of Patent: July 29, 2003
    Assignee: Rohm and Haas Denmark Finance A/S
    Inventors: Stefan Dehnicke, Ernst List, Bernhard Krtsch, Adolf Zellner, Helmut Rullman
  • Patent number: 6600006
    Abstract: A polyamic ester prepared by partially substituting hydrogen atoms of carboxylic groups of a polyamic acid with acid labile groups, the polyamic ester comprising one or more repeating units represented by Formula 1, and each of at least one terminal of the polyamic ester molecule terminates with the same or different reactive end-capping monomer: wherein in Formula 1, R1 and R2 are independently a hydrogen atom, or an acid labile group; X is a tetravalent, an aromatic or an aliphatic organic group; Y is a divalent, an aromatic or an aliphatic organic group; and m is an integer equal to or greater than 1.
    Type: Grant
    Filed: December 31, 2001
    Date of Patent: July 29, 2003
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Myung Sup Jung, Sung Kyung Jung, Yong Young Park, Bong Seok Moon, Bong Kyu Kim
  • Patent number: 6596838
    Abstract: The invention relates to a semi-permeable membrane separation process and device in which the said membranes comprise sulphonated polyimides. The present invention also relates to the use of sulphonated polyimide membranes in separation processes and devices using semi-permeable membranes.
    Type: Grant
    Filed: August 17, 2001
    Date of Patent: July 22, 2003
    Assignees: Commissariat A l'Energie Atomique, Centre National de la Recherche
    Inventors: Michel Pinery, Gérald Pourcelly, Régis Mercier
  • Patent number: 6593389
    Abstract: The polyimides of this invention are derived from a Diels-Alder cyclopolymerization of a photochemically generated bisdiene with dienophiles, such as bismaleimides, trismaleimides and mixtures thereof with maleimide end-caps. Irradiation of one or more diketones produces two distinct hydroxy o-quinodimethane (photoenol) intermediates. These intermediates are trapped via a Diels-Alder cycloaddition with appropriate dienophiles, e.g., bismaleimide and/or trismaleimides to give the corresponding polyimides in quantitative yields. When bismaleimides, trismaleimides or mixtures thereof with maleimide end-caps are used as the dienophile, the resulting polyimides have glass transition temperatures (Tg) as high as 300° C. Polyimide films can be prepared by ultraviolet irradiation of high solids content varnishes of the monomers in a small amount of solvent, e.g., cyclohexanone, dimethyl formamide, N-methylpyrollidone and the like.
    Type: Grant
    Filed: April 5, 2001
    Date of Patent: July 15, 2003
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventor: Michael A. Meador
  • Patent number: 6590059
    Abstract: Bioerodible polyorthoesters useful as orthopedic implants or vehicles for the sustained delivery of pharmaceutical, cosmetic and agricultural agents contain hydrogen bonding groups and &agr;-hydroxy acid-containing groups.
    Type: Grant
    Filed: May 11, 2001
    Date of Patent: July 8, 2003
    Assignee: AP Pharma, Inc.
    Inventors: Steven Y. Ng, Jorge Heller
  • Patent number: 6586555
    Abstract: This invention provides processes of the preparation of polyamides, polyimides, and polyamideimides, which are easy to purify after reactions, from polycarboxylic acids and polyamines in high yield without side reactions such as a change of color to black by direct polycondensation reaction with heat, especially processes of preparing aromatic polyamides (aramids), aromatic polyimides, and aromatic polyamideimides, which are difficult to synthesize in direct polycondensation reaction. Polyamides, polymides, and polyamideimides are prepared in high yield by the polycondensation of aromatic dicarboxylic acids, aromatic tetracarboxylic acids or aromatic tricarboxylic acids and aromatic diamines, using arylboric acids such as 3,4,5-trifluorophenylboric acids as polycondensation catalysts, in a mixed solvent of pentamethylbenzene and N-methylpyrrolidinone or a mixed solvent of m-terphenyl and N-butylpyrrolidinone.
    Type: Grant
    Filed: September 12, 2001
    Date of Patent: July 1, 2003
    Assignee: Japan Science and Technology Corporation
    Inventors: Kazuaki Ishihara, Hisashi Yamamoto
  • Patent number: 6586561
    Abstract: Sulfonated polyimide polymers incorporating bulky monomers are disclosed. The polymers have a liquid crystalline structure and exhibit high conductivity, high water uptake and water stability over a range of relative humidities and temperatures. The polymers are particularly adapted for use as a polymer electrolyte membrane in fuel cells.
    Type: Grant
    Filed: February 18, 2000
    Date of Patent: July 1, 2003
    Assignee: Case Western Reserve University
    Inventors: Morton H. Litt, Robert F. Savinell, Jesse S. Wainright, Yue Zhang
  • Patent number: 6569984
    Abstract: The invention is directed to method for making a polyimide by converting the dianhydride to the ester acid and reacting the ester acid with a diamine. The invention allows for the controlled addition of aliphatic diamines resulting in control of the polyimide properties such as the glass transition temperature, solubility, and melt processability.
    Type: Grant
    Filed: April 27, 2001
    Date of Patent: May 27, 2003
    Assignee: Virginia Tech Intellectual Properties, Inc.
    Inventors: James E. McGrath, Sue J. Mecham
  • Patent number: 6566484
    Abstract: A melt processible Polyether Ether Ketone (PEEK) polymer with novel end-group structure is synthesized electrophilically using Methane Sulfonic Acid containing Methane Sulfonic Anhydride or Phosphorous Pentoxide. The product so obtained shows controlled structure with elimination of reactive end group like —COOH and is therefore melt processible by conventional techniques and exhibits high thermal and mechanical properties making it useful high temperature engineering and specialty plastics. It can be extruded into a rod, film and can also be molded into commercially useful products.
    Type: Grant
    Filed: June 22, 2001
    Date of Patent: May 20, 2003
    Assignee: Gharda Chemicals Ltd.
    Inventors: Keki Hormusji Gharda, Prakash Druman Trivedi, Venkat Srinivasan Iyer, Utpal Mahendra Vakil, Sanjav Chintaman Limaye
  • Publication number: 20030069386
    Abstract: Polymer electrolytes and process for their preparation
    Type: Application
    Filed: October 10, 2002
    Publication date: April 10, 2003
    Inventors: Joachim Clauss, Gregor Deckers, Arnold Schneller, Helmut Witteler
  • Patent number: 6541535
    Abstract: The invention relates to a binder for powder coating materials having an oligomeric or polymeric substructure which are curable thermally and/or by means of high-energy radiation, said binder comprising in each case terminally and/or laterally at least one vinyl ether group a) and at least one group b) which is different from the vinyl ether groups a) but is coreactive with said groups a), there being on average at least one vinyl ether group a) and one coreactive group b) per oligomer or polymer molecule. The invention also relates to powder coating materials comprising such a binder and to the use of said powder coating materials for coating surfaces, especially in the form of an automotive top coat and a coil coating material.
    Type: Grant
    Filed: February 7, 2001
    Date of Patent: April 1, 2003
    Assignee: BASF Coatings AG
    Inventors: Rainer Blum, Rodriguez Jorge Prieto
  • Publication number: 20030060590
    Abstract: In a method of producing a low dielectric constant polymer, a thermosetting monomer is provided, wherein the thermosetting monomer has a cage compound or aryl core structure, and a plurality of arms that are covalently bound to the cage compound or core structure. In a subsequent step, the thermosetting monomer is incorporated into a polymer to form the low dielectric constant polymer, wherein the incorporation into the polymer comprises a chemical reaction of a triple bond that is located in at least one of the arms. Contemplated cage compounds and core structures include adamantane, diamantane, silicon, a phenyl group and a sexiphenylene group, while preferred arms include an arylene, a branched arylene, and an arylene ether. The thermosetting monomers may advantageously be employed to produce low-k dielectric material in electronic devices, and the dielectric constant of the polymer can be controlled by varying the overall length of the arms.
    Type: Application
    Filed: June 19, 2002
    Publication date: March 27, 2003
    Applicant: Honeywell International Inc.
    Inventors: Kreisler S. Lau, Feng Quan Liu, Boris A. Korolev, Emma Brouk, Ruslan Zherebin, David Nalewajek
  • Patent number: 6538100
    Abstract: The object of the present invention is to provide a method capable of producing polyimide resins having excellent heat resistance, which can utilize inexpensive monomers and does not use solvents. The method comprises mixing, in the absence of a solvent, a diamine and at least one tetracarboxylic acid component selected from the group consisting of a tetracarboxylic acid, a tetracarboxylic acid monoanhydride and a tetracarboxylic acid dianhydride capable of forming two imide rings upon cyclization, and then heat-treating the mixture.
    Type: Grant
    Filed: February 14, 2000
    Date of Patent: March 25, 2003
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Yoshiyuki Yamamori, Hiroyuki Yasuda
  • Patent number: 6538097
    Abstract: A process for production of polyimide powder, which comprises reacting a biphenyltetracarboxylic dianhydride and an aromatic diamine in an amide-based solvent optionally containing a water-soluble ketone, in the presence of an imidazole at 1-100 equivalent percent based on the carboxylic acid content of the polyimide precursor, separating and collecting the produced polyimide precursor powder from a water-soluble ketone solvent containing 3-30 wt % of an amide-based solvent, and heating the polyimide precursor powder to an imidation rate of 90% or greater, as well as polyimide powder obtained thereby, molded bodies of the polyimide powder, and a process for production of the molded bodies.
    Type: Grant
    Filed: October 29, 2001
    Date of Patent: March 25, 2003
    Assignee: UBE Industries, Ltd.
    Inventors: Hiroaki Yamaguchi, Fumio Aoki
  • Patent number: 6534622
    Abstract: A process for production of polyimide powder, which comprises reacting an aromatic diamine with a partial ester of a biphenyltetracarboxylic dianhydride, which is a partial ester of a biphenyltetracarboxylic dianhydride with a primary alcohol of 1-5 carbon atoms of which at least 30 mole percent is a 2,3,3′,4′-biphenyltetracarboxylic acid component, in the presence of the primary alcohol, separating out and collecting the resulting solid polyimide precursor and heating for dehydrating ring closure, polyimide powder obtained thereby, molded bodies of the polyimide powder, and a process for production of the molded bodies.
    Type: Grant
    Filed: October 29, 2001
    Date of Patent: March 18, 2003
    Assignee: Ube Industries, Ltd.
    Inventors: Hiroaki Yamaguchi, Fumio Aoki
  • Patent number: 6531568
    Abstract: This invention provides crosslinkable-group-containing polyimides of various known thermoplastic polyimide backbone structures, which are provided with far better heat resistance, chemical resistance and mechanical properties than known polyimides of the structures without impairing excellent moldability or formability, superb sliding property, low water absorption property, outstanding electrical properties, high thermal oxidation stability and high radiation resistance, all of which are inherent to the structures.
    Type: Grant
    Filed: April 9, 2001
    Date of Patent: March 11, 2003
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Atsushi Shibuya, Tomomi Okumura, Hideaki Oikawa, Yoshihiro Sakata, Takashi Kuroki, Yuichi Okawa, Shoji Tamai
  • Patent number: 6524606
    Abstract: Bioerodible polyorthoesters useful as orthopedic implants or vehicles for the sustained delivery of pharmaceutical, cosmetic and agricultural agents contain amine functionalities and &agr;-hydroxy acid-containing groups.
    Type: Grant
    Filed: November 16, 2001
    Date of Patent: February 25, 2003
    Assignee: AP Pharma, Inc.
    Inventors: Steven Y. Ng, Jorge Heller
  • Patent number: 6518392
    Abstract: A novel dielectric composition is provided that is useful in the manufacture of integrated circuit devices and integrated circuit packaging devices. The dielectric composition is prepared by imidizing and curing an oligomeric precursor compound comprised of a central polybenzoxazole, polybenzothiazole, polyamic acid or polyamic acid ester segment end-capped at each terminus with an aryl-substituted acetylene moiety such as an ortho-bis(arylethynyl)aryl group, e.g., 3,4-bis(phenylethynyl)phenyl. Integrated circuit devices, integrated circuit packaging devices, and methods of synthesis and manufacture are provided as well.
    Type: Grant
    Filed: March 8, 2001
    Date of Patent: February 11, 2003
    Assignee: International Business Machines Corporation
    Inventors: Kenneth R. Carter, James L. Hedrick, Victor Yee-Way Lee, Dale C. McHerron, Robert D. Miller
  • Publication number: 20030027885
    Abstract: The novel photo-cross-linkable polymers are suitable as coating materials. The photo-cross-linkable polymers contain a biphenylene unit, which can be dimerized by exposure. Attached to the biphenyl unit are side chains of a polymer with a high temperature resistance and a high chemical stability. Through exposure, the biphenylene units dimerize, whereby the polymers are spatially cross-linked.
    Type: Application
    Filed: July 1, 2002
    Publication date: February 6, 2003
    Inventors: Marcus Halik, Klaus Lowack, Recai Sezi, Andreas Walter
  • Patent number: 6500904
    Abstract: A method for the synthesis of high molecular weight poly(imide)s comprising coupling poly(imide) precursors having complementary functional groups and a weight average molecular weight of less than about 50,000 Daltons to form high molecular weight poly (imides)s having a weight average molecular weight greater than 50,000 Daltons.
    Type: Grant
    Filed: November 2, 2001
    Date of Patent: December 31, 2002
    Assignee: General Electric Company
    Inventor: Robert F. Hayes
  • Patent number: 6500913
    Abstract: The present invention relates to a novel polyimide of the general formula (1) and a process for the preparation thereof.
    Type: Grant
    Filed: March 13, 2001
    Date of Patent: December 31, 2002
    Assignees: Council of Scientific and Industrial Research, Laboratoire des Materiaux Organiques a Proprietes Speciques
    Inventors: Jinu Suju Mathew, Subhash Pundlik Vernekar, Reges Mercier, Rachid Kerboua
  • Publication number: 20020198358
    Abstract: The present invention provides a polymer in which coumarin, a photo-reactive molecule, is grafted onto a polyimide for preparing liquid crystal alignment layer which has a superior alignment property and an excellent thermal stability in photo-alignment, a process for preparing the said grafted polymer, a process for preparing liquid crystal alignment layer by employing the said grafted polymer, and a liquid crystal alignment layer prepared by the process. The polymer of the invention is prepared by mixing a coumarin compound with a polyimide, dissolving the mixture in an organic solvent, adding a catalyst, and stirring under an environment of N2 gas. The polymer of the invention is superior in terms of the thermal stability, which makes possible its universal application for the development of a novel liquid crystal display(LCD).
    Type: Application
    Filed: March 8, 2002
    Publication date: December 26, 2002
    Inventors: Jung-Ki Park, Shi-joon Sung, Jong-Woo Lee
  • Patent number: 6498224
    Abstract: A new method for the synthesis of poly(etherimide)s comprises transimidation of bis(imide) (IV) in the presence of a substituted phthalic anhydride or 4-substituted tetrahydrophthalic anhydride to yield dianhydride (V) which may then be reacted with a diamine to produce poly(etherimide)s. By-product substituted N-alkylphthalimide or 4-substituted N-alkyltetrahydrophthalic anhydride may be recycled or converted to 4-substituted N-alkylphthalimide for use in the formation bisimide (IV), obviating the need for a nitration step.
    Type: Grant
    Filed: December 5, 2001
    Date of Patent: December 24, 2002
    Assignee: General Electric Company
    Inventors: Roy Ray Odle, Thomas Link Guggenheim, William James Swatos, Michael J. Vollmer
  • Patent number: 6498226
    Abstract: This invention provides cycloaliphatic polyimide having the following formula (I): wherein 1 and n are integers from 4 to 7; m is an integer from 0 to 2; p is an integer from 1 to 8; polycyclic aliphatic compound R reprents C1-8 cycloalkyl, cycloalkenyl, cycloalkynyl, norbornenyl, decalinyl, adamantanyl, or cubanyl. That cycloaliphatic polyimide can be a through transparent film, their thermal stability is over 430° C. and dielectric constant is about 2.7.
    Type: Grant
    Filed: May 3, 2001
    Date of Patent: December 24, 2002
    Assignee: Industrial Technology Research Institute
    Inventors: Kung-Lung Cheng, Shu-Chen Lin, Wen-Ling Lui, Chih-Hsiang Lin, Wei-Ling Lin, Woan-Shiow Tzeng
  • Publication number: 20020188090
    Abstract: Disclosed are a polyamic acid having repeating units represented by the formula (1): 1
    Type: Application
    Filed: March 20, 2002
    Publication date: December 12, 2002
    Inventors: Wataru Yamashita, Katsuji Watanabe, Hideaki Oikawa, Hisato Ito
  • Patent number: 6489431
    Abstract: A polyimide precursor having a repeating unit represented by the following general formula (1), wherein R1 contains a bivalent organic group constituting a diamine having a hexafluoropropylidene group in its molecule represented by the following general formula (2), and the reduced viscosity is from 0.05 to 5.0 dl/g (in N-methylpyrrolidone at a temperature of 30° C., concentration: 0.5 g/dl), and a polyimide obtained by imidizing said precursor: (wherein R1 is a bivalent organic group constituting a diamine, A is a hydrogen atom, a linear alkyl group including a methyl group, or a trifluoromethyl group, and n is the number of a substituent on an aromatic ring and an integer of from 1 to 4).
    Type: Grant
    Filed: April 12, 2001
    Date of Patent: December 3, 2002
    Assignee: Nissan Chemical Industries, Ltd.
    Inventors: Kazuhisa Ishii, Takayasu Nihira, Hiroyoshi Fukuro
  • Patent number: 6489436
    Abstract: Novel polyimide copolymer, which is a copolymer of isopropylidene-bis-(4-phenyleneoxy-4-phthalic acid)dianhydride and 6-amino-2-(p-aminophenyl)benzimidazole or a copolymer of two kinds of tetracarboxylic acid dianhydrides consisting of isopropylidene-bis-(4-phenyleneoxy-4-phthalic acid)dianhydride and 3,3′,4,4′-benxophenonetetracarboxylic acid dianhydride and 6-amino-2-(p-aminophenyl)benzimidazole, can form a metal laminate by direct lamination with metallic foils. The metal laminate can fully satisfy the peel strength.
    Type: Grant
    Filed: November 29, 2001
    Date of Patent: December 3, 2002
    Assignee: Nippon Mektron, Limited
    Inventors: Jenq-Tain Lin, Hiroyuki Sekine, Alexandre L'vovich Rusanov, Lyubov Borisovna Elchina, Calina Valentinovna Kazakova, Yakov Semionovich Vygodskii
  • Publication number: 20020176844
    Abstract: Bioerodible polyorthoesters useful as orthopedic implants or vehicles for the sustained delivery of pharmaceutical, cosmetic and agricultural agents contain hydrogen bonding groups and &agr;-hydroxy acid-containing groups.
    Type: Application
    Filed: May 11, 2001
    Publication date: November 28, 2002
    Inventors: Steven Y. Ng, Jorge Heller
  • Patent number: 6486230
    Abstract: The polyesters of this invention are derived from a Diels-Alder cyclopolymerization of a photochemically generated bisdiene with dienophiles, such as di(acrylates), tri(acrylates), di(methacrylates), tri(methacrylates) and mixtures thereof with mono(methacrylates) or mono(acrylate) end-caps. Irradiation of one or more diketones produces two distinct hydroxy o-quinodimethane (photoenol) intermediates. These intermediates are trapped via a Diels-Alder cycloaddition with appropriate dienophiles, e.g., di(acrylates) to give the corresponding in polyesters quantitative yields. When di(acrylates), tri(acrylates) and di and tri(methacrylates) or mixtures thereof with monoacrylate end-caps are used as the dienophile, the resulting polyesters have glass transition temperatures (Tg) as high as 200° C. Polyesters films can be prepared by ultraviolet irradiation of high solids content varnishes of the monomers in a small amount of solvent, e.g., cyclohexanone, dimethyl formamide, N-methylpyrollidone and the like.
    Type: Grant
    Filed: April 5, 2001
    Date of Patent: November 26, 2002
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventor: Michael A. Meador
  • Patent number: 6486292
    Abstract: The present invention provides an optical polyimide compound defined by the following formula in an optical high polymer material: wherein X is Cl, Br, oxo-halide, or fully halogenated alkyl; A is a divalent aromatic or halogenated aromatic moiety; and Z is a tetravalent moiety which may be a partly or fully fluorinated aromatic ring, a partly or fully chlorinated aromatic ring, a partly or fully fluorinated cycloaliphatic group, a partly or fully chlorinated aliphatic group, or combinations thereof connected via hetero atoms.
    Type: Grant
    Filed: March 7, 2001
    Date of Patent: November 26, 2002
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kyung-Hee You, Kwan-Soo Han, Tae-Hyung Rhee, Eun-Ji Kim, Jung-Hee Kim, Woo-Hyeuk Jang
  • Patent number: 6479615
    Abstract: The polyamic acid of the invention can be obtained by the reaction of an acid anhydride component comprising pyromellitic anhydride and 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane with 2,2′-di-substituted-4,4′-diaminobiphenyls as a first aromatic diamine and any aromatic diamine component, as a second aromatic diamine, of 2,2-bis(4-aminophenoxyphenyl)propanes, 1,1-bis(4-(4-aminophenoxy)-3-t-butyl-6-methylphenyl)butane, 2,2-bis(3-amino-4-methylphenyl)hexafluoropropane and &agr;,&agr;′-bis(4-aminophenyl)diisopropylbenzenes in an organic solvent. The polyimide resin of the invention can be obtained by heating such a polyamic acid solution. In the production of a circuit board, by using a photosensitive polyamic acid having a sensitizer incorporated in such a polyamic acid solution, a patterned polyimide resin layer can be provided as an insulation layer on a metal foil.
    Type: Grant
    Filed: December 11, 2000
    Date of Patent: November 12, 2002
    Assignee: Nitto Denko Corporation
    Inventors: Takahiro Fukuoka, Amane Mochizuki, Naoki Kurata, Naotaka Kinjo, Toshihiko Omote
  • Patent number: 6476182
    Abstract: Random, melt-processible copolyimides are disclosed herein. These copolyimides are semicrystalline and exhibit recoverable (semi)crystallinity from their melts. Associated processes, which entail either solution polymerization or melt polymerization, for producing and fabricating these copolyimides into useful articles having a predetermined shape are also disclosed.
    Type: Grant
    Filed: December 21, 2000
    Date of Patent: November 5, 2002
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: Brian C Auman, William R Corcoran, Jr., John D Summers
  • Patent number: 6476177
    Abstract: Random, melt-processible copolyimides are disclosed herein. These copolyimides are semicrystalline and exhibit recoverable (semi)crystallinity from their melts. Associated processes, which entail either solution polymerization or melt polymerization, for producing and fabricating these copolyimides into useful articles having a predetermined shape are also disclosed.
    Type: Grant
    Filed: December 21, 2000
    Date of Patent: November 5, 2002
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: Brian C. Auman, William R Corcoran, Jr., John R Dodd, Mark A Guidry, John D. Summers
  • Publication number: 20020156231
    Abstract: An electronically active film comprising a compound of the formula: 1
    Type: Application
    Filed: April 20, 2001
    Publication date: October 24, 2002
    Inventors: Geoffrey A. Lindsay, Richard A. Hollins, John D. Stenger-Smith, Peter Zarras
  • Patent number: 6469126
    Abstract: Random, melt-processible copolyimides are disclosed herein. These copolyimides are semicrystalline and exhibit recoverable (semi)crystallinity from their melts. Associated processes, which entail either solution polymerization or melt polymerization, for producing and fabricating these copolyimides into useful articles having a predetermined shape are also disclosed.
    Type: Grant
    Filed: December 21, 2000
    Date of Patent: October 22, 2002
    Assignee: E. I. du Pont de Nmeours and Company
    Inventors: Brian C. Auman, William R. Corcoran, Jr., John D. Summers
  • Patent number: 6451955
    Abstract: A method of making a solution of a polyimide from a diamine monomer and a dianhydride monomer is disclosed. A solution or slurry of one of the monomers in a solvent that boils at a temperature between about 80° C. and about 160° C. is prepared. The solution or slurry is heated to a temperature between about 80° C. and about 160° C. and the other monomer is slowly added to the solution or slurry. Polyamic acid that is formed quickly imidizes to form the polyimide.
    Type: Grant
    Filed: September 28, 2000
    Date of Patent: September 17, 2002
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Michael C. Hausladen, Jin-O Choi
  • Patent number: 6451956
    Abstract: In a photoconductive element comprising a conductive support, e.g., an electrically conductive film, drum or belt on which a negatively chargeable photoconductive layer is formed, an electrical barrier layer is formed between the support and the photoconductive layer. The barrier layer provides a high energy barrier to the injection of positive charges but transports electrons under an applied electric field. The barrier layer of the invention transports charge by electronic rather than ionic mechanisms and, therefore, is not substantially affected by humidity changes. The barrier layer comprises a polyester-co-imide, polyesterionomer-co-imide or polyamide-co-imide having covalently bonded as repeating units in the polymer chain, aromatic tetracarboxylbisimide groups of the formula: wherein Ar1 and Ar2 represent, respectively, tetravalent and trivalent aromatic groups of 6 to 20 carbon atoms.
    Type: Grant
    Filed: June 8, 2001
    Date of Patent: September 17, 2002
    Assignee: Nex Press Solutions LLC
    Inventors: Louis J. Sorriero, Marie B. O'Regan, Michel F. Molaire
  • Publication number: 20020120095
    Abstract: The object of the present invention is to provide a method capable of producing polyimide resins having excellent heat resistance, which can utilize inexpensive monomers and does not use solvents. The method comprises mixing, in the absence of a solvent, a diamine and at least one tetracarboxylic acid component selected from the group consisting of a tetracarboxylic acid, a tetracarboxylic acid monoanhydride and a tetracarboxylic acid dianhydride capable of forming two imide rings upon cyclization, and then heat-treating the mixture.
    Type: Application
    Filed: February 14, 2000
    Publication date: August 29, 2002
    Inventors: Yoshiyuki Yamamori, Hiroyuki Yasuda
  • Patent number: 6441124
    Abstract: There are disclosed polymeric or oligomeric product obtainable from the reaction of an anthraquinone with an aromatic diamine, characterised in that the anthraquinone is substituted or is not substituted and in that the diamine is a diamino anthracene which is substituted or is not substituted. The anthraquinone may be of the general formula (I): where, R may be the same as or different to R′, and may be a hydrogen atom (when R=R′=H, the compound is anthraquinone), or CH3, CH3CH2—, —OCH3, —OCH2CH3, —CH2OCH3, —CH2OCH2CH2OCH3, methoxyethoxyethoxymethyl, aryloxymethyl, phenyl, Cl, Br, CN or NO2, —CH2COOR or CH2NHCOR″ (where R″ is C1-C6 alkyl or a phenyl or biphenyl group).
    Type: Grant
    Filed: June 2, 2000
    Date of Patent: August 27, 2002
    Assignee: Nissan Chemical Industries, Ltd.
    Inventors: Poopathy Kathirgamanathan, Subramaniam Ganeshamurugan
  • Patent number: 6441127
    Abstract: An alignment treating agent for a liquid crystal cell, which comprises a polyimide resin of the formula (I): wherein R1 is a tetravalent organic group constituting a tetracarboxylic acid or its derivative, R2 is a bivalent organic group constituting a diamine, and m is a positive integer, provided that at least 10 mol % of R2 is a bivalent organic group selected from the group consisting of: wherein X is H, OH, an alkyl group, an alkoxy group, a carboxyl group, an acyl group or a halogen atom, said polyimide resin being made insoluble in an organic solvent by coating a precursor solution of said polyimide resin on a substrate, followed by heating.
    Type: Grant
    Filed: January 19, 1994
    Date of Patent: August 27, 2002
    Assignee: Nissan Chemical Industries Ltd.
    Inventors: Kiyoshi Sawahata, Toyohiko Abe, Yoshihiro Tsuruoka, Hiroyoshi Fukuro
  • Publication number: 20020099166
    Abstract: An acid dianhydride, together with a diamine, is heated in an organic polar solvent in the presence of &ggr;-caprolactone or &bgr;-butyrolactone as an acid catalyst to prepare a polyimide having an average molecular weight of 10,000 to 300,000. This production process can realize the production of a polyimide which is soluble in a solvent and has high processability and stability.
    Type: Application
    Filed: January 23, 2002
    Publication date: July 25, 2002
    Applicant: HITACHI CABLE,LTD.
    Inventors: Katsumoto Hosokawa, Yuuki Honda, Seiji Kamimura, Yoshiyuki Ando, Kenji Asano
  • Patent number: 6423811
    Abstract: A low dielectric constant material has a polymeric network that is fabricated from a first and a second component. The first component comprises a polymeric strand, and the second component comprises a molecule having a central portion with at least three arms extending from the central portion, wherein each of the arms includes a backbone with a reactive group. The first component and the second component form the polymeric network in a reaction that involves at least one of the reactive groups when the first and second components are thermally activated. Contemplated low dielectric constant materials are advantageously employed in the fabrication of electronic devices, and particularly contemplated devices include integrated circuits.
    Type: Grant
    Filed: July 19, 2000
    Date of Patent: July 23, 2002
    Assignee: Honeywell International Inc.
    Inventors: Kreisler S. Lau, Feng Quan Liu, Boris Korolev, Emma Brouk, Ruslan Zherebin, David Nalewajek
  • Patent number: 6420515
    Abstract: A perfluorodicarboxylic fluoride of the formula: F—CO—CF2—O—Rf—O—CF2—CO—F or perfluorodiketone of the formula: R1—CO—Rf—CO—R1 wherein Rf is a perfluoroalkylene group and R1 is a C1-8 perfluoroalkyl group is mixed with an alkali metal fluoride in an aprotic polar solvent to form an initiator solution. Hexafluoropropene oxide is fed to the initiator solution for polymerization, obtaining difunctional hexafluoropropene oxide polymers of high purity.
    Type: Grant
    Filed: December 5, 2000
    Date of Patent: July 16, 2002
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Yasunori Sakano, Noriyuki Koike
  • Patent number: 6417321
    Abstract: A thermally cured polyimide is provided, and in particular a crosslinked polyimide, comprising a fluorenyl diamine and comprising an aromatic ring having at least one C1-C10 branched or unbranched alkyl substituent, where the alkyl substituent includes a benzylic hydrogen. The present invention provides a crosslinked polyimide made by a process comprising the step of crosslinking a polyimide comprising diamines comprising pendent fluorenyl groups and comprising aromatic rings having at least one C1-C10 branched or unbranched alkyl substituent, the alkyl substituent including a benzylic hydrogen, by raising the temperature of said polyimide above its glass transition temperature.
    Type: Grant
    Filed: August 21, 2000
    Date of Patent: July 9, 2002
    Assignee: 3M Innovative Properties Company
    Inventors: Kazuhiko Minami, Hiroshi Ayukawa, Toshihiro Suwa, Mitsuaki Kobayashi, Bert T. Chien, Stephen A. Ezzell
  • Patent number: 6395399
    Abstract: A flexible printed substrate is constituted of metallic foil and provided thereon a polyimide layer which is produced by forming a film of a polyamic acid varnish on the metallic foil, followed by imidating. The polyimide layer has a linear expansion coefficient of 10×10−6 to 30×10−6 (1/K) and a softening point not more than the imidation temperature.
    Type: Grant
    Filed: December 7, 2000
    Date of Patent: May 28, 2002
    Assignee: Sony Chemicals Corp.
    Inventors: Noriaki Kudo, Minoru Nagashima
  • Patent number: 6392004
    Abstract: An element of a gigahertz electronic device is provided comprising a polyimide selected to have an imide equivalent weight of 375 or greater. The polyimide preferably has a dielectric loss at 12.8 GHz of 0.009 or less and a Tg of 260° C. or greater. Such elements include circuit substrates and antennas.
    Type: Grant
    Filed: August 21, 2000
    Date of Patent: May 21, 2002
    Assignee: 3M Innovative Properties Company
    Inventors: Bert T. Chien, Stephen A. Ezzell
  • Publication number: 20020052464
    Abstract: A process for production of polyimide powder, which comprises reacting a biphenyltetracarboxlic dianhydride and an aromatic diamine in an amide-based solvent optionally containing a water-soluble ketone, in the presence of an imidazole at 1-100 equivalent percent based on the carboxylic acid content of the polyimide precursor, separating and collecting the produced polyimide precursor powder from a water-soluble ketone solvent containing 3-30 wt % of an amide-based solvent, and heating the polyimide precursor powder to an imidation rate of 90% or greater, as well as polyimide powder obtained thereby, molded bodies of the polyimide powder, and a process for production of the molded bodies.
    Type: Application
    Filed: October 29, 2001
    Publication date: May 2, 2002
    Applicant: Ube Industries, Ltd.
    Inventors: Hiroaki Yamaguchi, Fumio Aoki
  • Publication number: 20020052463
    Abstract: A process for production of polyimide powder, which comprises reacting an aromatic diamine with a partial ester of a biphenyltetracarboxylic dianhydride, which is a partial ester of a biphenyltetracarboxylic dianhydride with a primary alcohol of 1-5 carbon atoms of which at least 30 mole percent is a 2,3,3′,4′-biphenyltetracarboxylic acid component, in the presence of the primary alcohol, separating out and collecting the resulting solid polyimide precursor and heating for dehydrating ring closure, polyimide powder obtained thereby, molded bodies of the polyimide powder, and a process for production of the molded bodies.
    Type: Application
    Filed: October 29, 2001
    Publication date: May 2, 2002
    Applicant: Ube Industries, Ltd.
    Inventors: Hiroaki Yamaguchi, Fumio Aoki