From Ketone Or Ketene Reactant Patents (Class 528/220)
  • Publication number: 20020045729
    Abstract: A method for lateral chain modification of aryl main chain polymers with aromatic ketones or aldehydes containing tertiary basic N-groups is described. The modification can be accomplished via addition of an aromatic carboxylic acid or an acid derivative containing a tertiary amine moiety to a metallized polymer. The tertiary amines on the modified polymer can be converted to quaternary amines with halogen alkanes. Modification of the aryl main chain polymers with aromatic groups containing sulphonic acid radicals is also described. The polymers formed can be crosslinked and prepared for use in a wide variety of membrane technologies including ion exchange, dialysis, reverse osmosis, nanofiltration.
    Type: Application
    Filed: February 12, 2001
    Publication date: April 18, 2002
    Inventors: Jochen Kerres, Andreas Ullrich, Thomas Haering
  • Patent number: 6372877
    Abstract: This invention relates generally to poly(aryl ether ketones) bearing alkylated side chains. It relates particularly to soluble, thermally stable, low dielectric poly(aryl ether ketones) with alkylated side chains and especially to films and coatings thereof. These poly(aryl ether ketones) have the following structural formula: wherein Y is selected from the group consisting of CF3 and CH3; and wherein R is CnH(2n+1) and n=11-18.
    Type: Grant
    Filed: June 1, 2000
    Date of Patent: April 16, 2002
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Patrick E. Cassidy, John W. Fitch, III, Scott D. Gronewald, Anne K. St. Clair, Diane M. Stoakley
  • Publication number: 20020037991
    Abstract: A 6,6′-dialkyl-3,3′,4,4′-biphenyltetracarboxylic dianhydride is prepared by brominating a 4-alkylphthalic anhydride at its 5-position, and coupling the bromination product in the presence of a nickel catalyst; A photosensitive resin composition containing a polyimide precursor having repetitive units of general formula (7) is applied onto a substrate, exposed to 1-line, developed and heated to form a polyimide relief pattern.
    Type: Application
    Filed: August 30, 2001
    Publication date: March 28, 2002
    Applicant: Hitachi Chemical DuPont MicroSystems Ltd.
    Inventors: Noriyoshi Arai, Makoto Kaji, Akihiro Sasaki, Toshiki Hagiwara
  • Publication number: 20020037428
    Abstract: OLED materials are provided that have the general formula:
    Type: Application
    Filed: April 10, 2001
    Publication date: March 28, 2002
    Inventor: Gene C. Koch
  • Patent number: 6359107
    Abstract: A composition of and method for making high performance imide resins that are processable by resin transfer molding (RTM) and resin infusion (RI) techniques were developed. Materials with a combination of properties, making them particularly useful for the fabrication of composite parts via RTM and/or RI processes, were prepared, characterized and fabricated into moldings and carbon fiber reinforced composites and their mechanical properties were determined. These materials are particularly useful for the fabrication of structural composite components for aerospace applications. The method for making high performance resins for RTM and RI processes is a multi-faceted approach. It involves the preparation of a mixture of products from a combination of aromatic diamines and aromatic dianhydrides at relatively low calculated molecular weights (i.e. high stoichiometric offsets) and endcapping with latent reactive groups.
    Type: Grant
    Filed: May 18, 2000
    Date of Patent: March 19, 2002
    Assignee: The United States of America as represented by the Administrator, National Aeronautics and Space Administration
    Inventors: John W. Connell, Joseph G. Smith, Paul M. Hergenrother
  • Patent number: 6355357
    Abstract: A flexible printed board, in which a polyimide resulting from the imidation of a polyamic acid obtained by the addition polymerization of diamines and acid dianhydrides is formed as an insulating layer on a metal foil, is characterized in that the diamines include specific imidazolyl-diaminoazines represented by the formula 1; (where A is an imidazolyl group; R1 is an alkylene group; m is 0 or 1; R2 is an alkyl group; n is 0, 1, or 2; R3 and R4 are alkylene groups; p and q are each 0 or 1; and B is an azine residue, diazine residue, or triazine residue).
    Type: Grant
    Filed: December 8, 1999
    Date of Patent: March 12, 2002
    Assignee: Sony Chemicals Corp.
    Inventors: Satoshi Takahashi, Hidetsugu Namiki
  • Patent number: 6350817
    Abstract: Phenylethynyl containing reactive additives were prepared from aromatic diamines containing phenylethynyl groups and various ratios of phthalic anhydride and 4-phenylethynylphthalic anhydride in glacial acetic acid to form the imide in one step or in N-methyl-2-pyrrolidinone to form the amide acid intermediate. The reactive additives were mixed in various amounts (10% to 90%) with oligomers containing either terminal or pendent phenylethynyl groups (or both) to reduce the melt viscosity and thereby enhance processability. Upon thermal cure, the additives react and become chemically incorporated into the matrix and effect an increase in crosslink density relative to that of the host resin. This resultant increase in crosslink density has advantageous consequences on the cured resin properties such as higher glass transition temperature and higher modulus as compared to that of the host resin.
    Type: Grant
    Filed: April 13, 1999
    Date of Patent: February 26, 2002
    Assignee: The United States of America as represented by the United States National Aeronautics and Space Administration
    Inventors: John W. Connell, Joseph G. Smith, Jr., Paul M. Hergenrother
  • Patent number: 6350845
    Abstract: Novel polyimides substituted by a substituent having an alkyl or fluoroalkyl group and having reduced water absorption; a process for producing these novel polyimides; and novel acid dianhydrides to be used in the production thereof. A polyimide containing a structure represented by the following general formula (I): wherein X1 represents a tetravalent organic group having a substituent —R1AR2 (wherein A represents a divalent linkage group; R1 represents a single bond or a C1-3 alkylene group; and R2 represents a C1-25 alkyl group or a fluoroalkyl group); and Y represents a divalent organic group.
    Type: Grant
    Filed: June 26, 2000
    Date of Patent: February 26, 2002
    Assignee: Kaneka Corporation
    Inventors: Koji Okada, Shoji Hara, Hitoshi Nojiri
  • Patent number: 6350844
    Abstract: A polyimide film having sufficiently excellent characteristics such as a sufficiently high elastic modulus, a low water absorption, a small coefficient of moisture-absorption expansion, a small coefficient of linear expansion and a high dimensional stability; and various electric/electronic equipment bases with the use of the polyimide film. A polyimide film having a tensile elastic modulus of 700 kg/mm2 or less and a coefficient of moisture-absorption expansion of 20 ppm or less and containing a specific repeating unit as an essential repeating unit is synthesized. Then various electric/electronic equipment bases such as a laminate for flexible print connection boards are produced by using the polyimide film.
    Type: Grant
    Filed: November 5, 1999
    Date of Patent: February 26, 2002
    Assignee: Kaneka Corporation
    Inventors: Kazuhiro Ono, Kiyokazu Akahori, Hidehito Nishimura
  • Patent number: 6348564
    Abstract: Unsubstituted oxepane-diones useful as monomers for the production of polymers, process for the synthesis thereof by oxidation of unsubstituted cyclohexanediones, process for the preparation of polyesterketone polymers by polymerization of cyclic esterketones and polyesterketone polymers so obtained.
    Type: Grant
    Filed: June 16, 2000
    Date of Patent: February 19, 2002
    Assignee: Solvay (Societe Anonyme)
    Inventors: Henri Wautier, Jean-Pierre Latere, Philippe Lecomte, Robert Jerome, Philippe Dubois
  • Patent number: 6335416
    Abstract: A polyimide film, which is produced from polyamide acid prepared through the reaction of p-phenylenebis(trimellitic acid monoester anhydride), oxydiphthalic acid dianhydride, p-phenylenediamine, and 4,4′-diaminodiphenylether in an organic solvent, and which has a high elastic modulus, a high elongation, a low coefficient of linear expansion which is not quite different from that of copper, and a low coefficient of hygroscopic expansion.
    Type: Grant
    Filed: April 25, 2000
    Date of Patent: January 1, 2002
    Assignee: Kaneka Corporation
    Inventors: Hitoshi Nojiri, Koichiro Tanaka
  • Patent number: 6335304
    Abstract: A metal (M) alkyl acid phosphate catalyst for the reaction of an epoxy compound with a carboxyl compound to provide a coating formulation that is stable at room temperature; that is humidity resistant, and non-yellowing, wherein the alkyl acid phosphate has the formula: (RO)n—(P═O)—(OH)m and wherein: a. each R is selected from the group consisting of: i) a C1 to C18 alkly, cycloalkyl, or aryl; ii) a linear or branched C6 to C18 alkyl substituted with —(O—CH2—CH2—)o or —(O—CH—CH3—CH2—)p, wherein o or p is from 1 to 20; iii) a &bgr;-hydroxyethyl compound, R′—X—CH2—CH—OH—CH2—, wherein R′ is a C6 to C18 alkyl or cycloalkyl or aryl, X is either —CH2—, —O— or —COO—; b. n+m=3 and n is between 2 to 1; and c. M is Zn or Sn (II) in a mole equivalent of 0.7 to 1.5 moles per mole of alkyl acid phosphate.
    Type: Grant
    Filed: November 9, 1999
    Date of Patent: January 1, 2002
    Assignee: KIng Industries, INC
    Inventors: Zhiqiang Alex He, Werner J. Blank, Marie Emmanuelle Picci
  • Patent number: 6335418
    Abstract: A primary object of the invention is to provide a production technology for functional polyamic acid microfine particles and functional polyimide microfine particles by which the particle shape, size and size distribution can be freely controlled. The invention is concerned with a process for synthesizing polyamic acid particles having functional groups at least on the surface from a tetracarboxylic anhydride and a diamine compound characterized by its comprising (a) a first step which comprises providing a tetracarboxylic anhydride and a diamine compound at least one of which has functional groups and preparing a first solution containing the tetracarboxylic anhydride and a second solution containing the diamine compound and (b) a second step which comprises mixing the first and second solutions under ultrasonic agitation to thereby precipitate polyamic acid microfine particles from the mixed solution.
    Type: Grant
    Filed: August 18, 2000
    Date of Patent: January 1, 2002
    Assignees: Osaka Prefectural Government, Sumitomo Bakelite Co., Ltd.
    Inventors: Katsuya Asao, Hitoshi Morita, Hitoshi Onishi, Masaki Kimoto, Yayoi Yoshioka, Hidenori Saito
  • Patent number: 6333392
    Abstract: An object of the invention is to provide thermosetting amic acid microfine particles, thermosetting imide microfine particles and crosslinked imide microfine particles of controlled particle shape and size distribution. The invention provides a production technology which comprises mixing a first solution containing a tetracarboxylic anhydride and a C═C bond-containing acid anhydride with a second solution containing a diamine compound, causing precipitation of thermosetting amic acid microfine particles from the resulting mixture, and further producing thermosetting imide microfine particles and crosslinked imide microfine particles from the thermosetting amic acid microfine particles.
    Type: Grant
    Filed: May 5, 2000
    Date of Patent: December 25, 2001
    Assignees: Sumitomo Bakelite and Co. Ltd., Osaka Prefectual Government
    Inventors: Katsuya Asao, Hidenori Saito
  • Patent number: 6333391
    Abstract: A process for the preparation of an oligomeric polyimide comprises: mixing a tetracarboxylic acid, a dianhydride, a partially hydrolysed dianhydride or a mixture thereof with a diamine in a reaction medium comprising greater than 80% by weight water, and heating mixture in said reaction medium at a temperature above 100° C. for a time sufficient to form said oligomeric polyimide.
    Type: Grant
    Filed: April 21, 2000
    Date of Patent: December 25, 2001
    Assignees: Commonwealth Scientific and Industrial Research Organisation, The Boeing Company
    Inventors: Bronwyn Glenice Laycock, David Geoffrey Hawthorne, Jonathan Howard Hodgkin, Trevor Charles Morton
  • Patent number: 6323301
    Abstract: Disclosed is a composition comprising a polymer with a weight average molecular weight of from about 1,000 to about 100,000, said polymer containing at least some monomer repeat units with a first, photosensitivity-imparting substituent which enables crosslinking or chain extension of the polymer upon exposure to actinic radiation, said polymer also containing a second, thermal sensitivity-imparting substituent which enables further crosslinking or chain extension of the polymer upon exposure to temperatures of about 140° C.
    Type: Grant
    Filed: August 10, 2000
    Date of Patent: November 27, 2001
    Assignee: Xerox Corporation
    Inventors: Thomas W. Smith, Timothy J. Fuller, Ram S. Narang, David J. Luca
  • Patent number: 6320019
    Abstract: A method for preparing polyamic acid and polyimide of three-dimensional molecular structure such that these polymers are superior in adhesive strength and high-temperature stability while maintaining their inherent thermal resistance and mechanical properties, and thus can be effectively used as an adhesive material for high temperature adhesive tapes suitable for semiconductor assembly.
    Type: Grant
    Filed: February 25, 2000
    Date of Patent: November 20, 2001
    Assignee: Saehan Industries Incorporation
    Inventors: Kyung Rok Lee, Soon Sik Kim, Kyeong Ho Chang, Jeong Min Kweon
  • Patent number: 6316574
    Abstract: The present invention provides a liquid crystal display element having an adequate pre-tilt angle for preventing the reverse domain, as well as excellent electrical properties by preparation of the polyamic acid composition for the liquid crystal display element which comprises a polyamic acid A that excels in electrical properties and a polyamic acid B that has side chains, mixed in the ratio A/B of 50/50 to 95/5 (by weight).
    Type: Grant
    Filed: June 19, 2000
    Date of Patent: November 13, 2001
    Assignee: Chisso Corporation
    Inventors: Satoshi Tanioka, Shizuo Murata, Itsuo Shimizu, Kazumi Ito
  • Patent number: 6316589
    Abstract: A polyimide for optical communications, which is expressed by the formula (1) where R1 and R2 are independently selected from the group consisting of CF3, CCl3, unsubstituted aromatic ring group and halogenerated aromatic ring group; R3 and R4 are independently selected from the group consisting of Cl, F, I, Br, CF3, CCl3, unsubstituted aromatic ring group and halogenated aromatic ring group; and n is an integer from 1 to 39. The polyimides have a superior heat resistance, and can avoid the increase in optical absorption loss due to a refractive index increase and deterioration of adhesive and coating properties due to weak surface tension of a polyimide film. In addition, use of the polyimides as a material for a core layer of optical waveguides can expand the selection range of material for the cladding layer of the optical waveguide.
    Type: Grant
    Filed: April 11, 2000
    Date of Patent: November 13, 2001
    Assignee: SamSung Electronics Co., Ltd
    Inventors: Kyung-Hee You, Kwan-Soo Han, Tae-Hyung Rhee
  • Patent number: 6316582
    Abstract: The present invention relates to a method of reducing the clogging of nozzles and slits and diminishing the formation of deposits in the spin bath system in the process of making viscose filamentary and film materials by using an alkoxylated polyamine surfactant having the formula: RNA&Parenopenst;CnH2nNA&Parenclosest;x−1A  (I) where R represents a hydrogen or an aliphatic group with 1-24 carbon atoms, each A represents a hydrogen, an aliphatic group with 1-24 carbon atoms, or H(OCmH2m)y-groups, where m is a number from 2-3, n is a number from 2-3, x is 4-8, with the proviso that the number of H(OCmH2m)y-groups are from 1 to x+1, and the total number of carbon atoms in the aliphatic groups is from 8 to 45. The alkoxylated polyamine surfactant has an excellent anticlogging effect, since it is a good dispersant and prevent or reduce precipitation in the spin bath. In addition it is very stable.
    Type: Grant
    Filed: June 1, 2000
    Date of Patent: November 13, 2001
    Assignee: Akzo Nobel N.V.
    Inventors: Kent Bjur, Anders Cassel, Margreth Strandberg, Ingemar Uneback
  • Publication number: 20010037010
    Abstract: The invention relates to carbodiimide-based block copolymers, a method of preparing them and also their use as hydrolysis stabilizers in ester-group-containing polymers.
    Type: Application
    Filed: March 20, 2001
    Publication date: November 1, 2001
    Inventors: Heiko Tebbe, Ludger Heiliger, Volker Muller
  • Patent number: 6307002
    Abstract: A polyimide represented by the following general formula (1); wherein l, m, and n represent not the order of each repeating unit, but the numbers of each repeating unit existing in the molecule, E1 is a photosensitive group, E2 is a group comprising an alkyl group having 2 to 20 carbon atoms, —A(—E1)—, —A(—E2)—, and B each are a divalent organic group, X and Y each are a tetravalent organic group, X, Y, A, B, E1 and E2 may be identical or different among the repeating units, 1 is an integer of 1 or more, m and n each are an integer of 0 or more. The polyimide and polyimide compositions comprising it has thermoreactivity as well as photoreactivity and photosensitivity.
    Type: Grant
    Filed: November 9, 1999
    Date of Patent: October 23, 2001
    Assignee: Kaneka Corporation
    Inventors: Kohji Okada, Hitoshi Nojiri
  • Patent number: 6307008
    Abstract: A polymide useful as an adhesive for semiconductor assemblies having excellent thermal resistance and adhesive strength at high temperatures.
    Type: Grant
    Filed: February 25, 2000
    Date of Patent: October 23, 2001
    Assignee: Saehan Industries Corporation
    Inventors: Kyung Rok Lee, Soon Sik Kim, Kyeong Ho Chang, Jeong Min Kweon
  • Patent number: 6303744
    Abstract: Polyimides and the process for preparing polyimides having improved thermal-oxidative stability derived from the polymerization of effective amounts of one or more of the polyamines such as the aromatic diamines, one or more of the tetracarboxylic dianhydrides and a novel dicarboxylic endcap having a formula selected from the group consisting of: wherein R1 is either a radical where R is either hydrogen or an alkyl radical of 1 to 4 carbons, R2 is either OH, NH2, F, or Cl radical, R3 is either H, OH, NH2, F, Cl or an alkylene radical, R4 is either an alkyl, aryl, alkoxy, aryloxy, nitro, F, or Cl radical, and R5 is either H, alkyl, aryl, alkoxy, aryloxy, nitro, F, or Cl radical. The polyimides are useful particularly in the preparation of prepregs and PMR composites.
    Type: Grant
    Filed: March 23, 2000
    Date of Patent: October 16, 2001
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Mary Ann B. Meador, Aryeh A. Frimer
  • Patent number: 6303270
    Abstract: A composition is derived from an addition polymerizable organotitanium polymer which upon exposure to an oxygen plasma or baking in air, is converted to titanium dioxide (titania) or is converted to a mixed, titanium-containing metal oxide. The metal oxide formed in situ imparts etch-resistant action to a patterned photoresist layer. The composition may also be directly deposited and patterned into permanent metal oxide device features by a photolithographic process.
    Type: Grant
    Filed: March 1, 1999
    Date of Patent: October 16, 2001
    Assignees: The Curators of the University of Missouri, Brewer Science, Inc
    Inventors: Tony D. Flaim, Douglas J. Guerrero, Michelle R. Fowler, William J. James, Vladimir Petrovsky, Harlan U. Anderson
  • Patent number: 6303742
    Abstract: The present invention provides a novel polyimide composition which includes a cinnamoyl group or a derived cinnamoyl group and has photo-reactivity and heat-reactivity inherent to the cinnamoyl group. Further, a novel diamine and an acid dianhydride according to the present invention are materials mainly used for preparing a novel polyimide composition having the cinnamoyl group or the derived cinnamoyl group in a main chain or a side chain.
    Type: Grant
    Filed: December 1, 1999
    Date of Patent: October 16, 2001
    Assignee: Kanekafuchi Kagaku Kogyo Kabushiki Kaisha
    Inventors: Kohji Okada, Hitoshi Nojiri
  • Patent number: 6303743
    Abstract: A polyimide for optical communications, which is expressed by the formula (1), a method of preparing the same, and a method of forming multiple polyimide films using the polyimide, wherein the formula (1) is given by X1, X2, X3, A1, A2, B1, B2, B3, D1, D2, E1, E2, Y1, Y2, Y3, Y4, Y5, Y6, Y7, and Y8, are independently selected from the group consisting of hydrogen atom, halogen atom, alkyl group, halogenated alkyl group, aryl group and halogenated aryl group; Z is a simple chemical bond or selected from the group consisting of —O—, —CO—, —SO3—, —S—, —(T)m—, —(OT)m— and —(OTO)m—, wherein T is alkylene or arylene group substituted by at least one of halogen atom and halogenated alkyl group and m is an integer from 1 to 10; and n is an integer from 1 to 39.
    Type: Grant
    Filed: November 17, 1999
    Date of Patent: October 16, 2001
    Assignee: SamSung Electronics Co., Ltd.
    Inventors: Kyung-hee You, Kwan-soo Han, Tae-hyung Rhee
  • Patent number: 6300424
    Abstract: Hyperbranched polyester and polyamide polymers are prepared by a one-step process of polymerizing a monomer of the formula A—R—B2 so that high molecular weight globular polymers having a multiplicity of a particular functional group on the outside surface are obtained.
    Type: Grant
    Filed: July 19, 1993
    Date of Patent: October 9, 2001
    Assignee: Cornell Research Foundation, Inc.
    Inventors: Jean M. J. Frechet, Craig J. Hawker, Kathryn Uhrich
  • Patent number: 6288209
    Abstract: Polyimide copolymers were obtained containing 1,3-bis(3-aminophenoxy)benzene (APB) and other diamines and dianhydrides and terminating with the appropriate amount of reactive endcapper. The reactive endcappers studied include but should not be limited to 4-phenylethynyl phthalic anhydride (PEPA), 3-aminophenoxy-4′-phenylethynylbenzophenone (3-APEB), maleic anhydride (MA) and nadic anhydride (5-norbornene-2,3-dicarboxylic anhydride, NA). Homopolymers containing only other diamines and dianhydrides which are not processable under conditions described previously can be made processable by incorporating various amounts of APB, depending on the chemical structures of the diamines and dianhydrides used. By simply changing the ratio of APB to the other diamine in the polyimide backbone, a material with a unique combination of solubility, Tg, Tm, melt viscosity, toughness and elevated temperature mechanical properties can be prepared.
    Type: Grant
    Filed: September 21, 2000
    Date of Patent: September 11, 2001
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventor: Brian J. Jensen
  • Patent number: 6288188
    Abstract: An oligomer, uncured polymer or cured polymer comprising the reaction product of one or more polyfunctional compounds containing two or more cyclopentadienone groups and at least one polyfunctional compound containing two or more aromatic acetylene groups wherein at least some of the polyfunctional compounds contain three or more reactive groups. Such oligomers and uncured polymers may be cured to form cured polymers which are useful as dielectrics in the microelectronics industry, especially for dielectrics in integrated circuits.
    Type: Grant
    Filed: March 31, 1999
    Date of Patent: September 11, 2001
    Assignee: The Dow Chemical Company
    Inventors: James P. Godschalx, Duane R. Romer, Zenon Lysenko, Michael E. Mills
  • Publication number: 20010018506
    Abstract: A perfluorodicarboxylic fluoride of the formula: F—CO—CF2—O—Rf—O—CF2—CO—F or perfluorodiketone of the formula: R1—CO—Rf—CO—R1 wherein Rf is a perfluoroalkylene group and R1 is a C1-8 perfluoroalkyl group is mixed with an alkali metal fluoride in an aprotic polar solvent to form an initiator solution. Hexafluoropropene oxide is fed to the initiator solution for polymerization, obtaining difunctional hexafluoropropene oxide polymers of high purity.
    Type: Application
    Filed: December 5, 2000
    Publication date: August 30, 2001
    Inventors: Yasunori Sakano, Noriyuki Koike
  • Patent number: 6281323
    Abstract: Terminal-modified imide oligomers with an inherent viscosity of 0.05-1 obtained by reacting 2,3,3′,4′-biphenyltetracarboxylic dianhydride, an aromatic diamine compound and 4-(2-phenylethynyl)phthalic anhydride, and their cured products. There are provided highly practical terminal-modified imide oligomers and their cured products, which cured products have satisfactory heat resistance and mechanical properties.
    Type: Grant
    Filed: November 19, 1999
    Date of Patent: August 28, 2001
    Assignee: Ube Industries, Ltd.
    Inventors: Rikio Yokota, Masatoshi Hasegawa, Hiroaki Yamaguchi
  • Patent number: 6277495
    Abstract: A polyimide film of birefringence less than 0.01 is formed by drawing a copolymerized polyimide comprising a block component and a random component which are molecularly bonded, wherein the block component of copolymerized polyimide comprises an aromatic diamine compound having a rigid structure and an aromatic tetracarboxylic acid compound and wherein the random component of copolymerized polyimide comprises an aromatic diamine compound having a flexible structure and at least two aromatic tetracarboxylic acid components. The resulting polyimide film has high elasticity, a low thermal expansion equivalent to that of metal and low water absorbing properties. A method for its manufacture and a metal laminated plate having improved curl properties in which the polyimide is used as the base material are also disclosed.
    Type: Grant
    Filed: July 14, 1998
    Date of Patent: August 21, 2001
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: Koichi Sawasaki, Kenji Uhara, Michihiro Kubo
  • Patent number: 6277950
    Abstract: The present invention provides polyimides and co-polyimides that are organosoluble. The polyimides and co-polyimides are prepared from an aromatic diamine having ortho-linked phenylene and pendant tert-butyl group, i.e., 1,2-bis(4-aminophenoxy)-4-tert-butyl-benzene, or its mixture with other diamines, and a mixture of dianhydrides that containing at least one dianhydride selected from s-BPDA, DSDA, ODPA, 6FDA and other diether-dianhydrides.
    Type: Grant
    Filed: January 26, 2000
    Date of Patent: August 21, 2001
    Assignee: National Science Council
    Inventors: Chin-Ping Yang, Sheng-Huei Hsiao, Shin-Hung Chen
  • Patent number: 6274695
    Abstract: The present invention relates to a treating agent for liquid crystal alignment, which is an agent for liquid crystal alignment to be used for a method in which polarized ultraviolet rays or electron rays are irradiated on a polymer thin film formed on a substrate in a predetermined direction relative to the substrate plane, and said substrate is used for aligning liquid crystal without rubbing treatment, wherein said agent for liquid crystal alignment contains a polymer compound having photochemically reactive groups in the polymer main chain and a glass transition temperature of at least 200° C.
    Type: Grant
    Filed: November 1, 1999
    Date of Patent: August 14, 2001
    Assignee: Nissan Chemical Industries, Ltd.
    Inventors: Hideyuki Endou, Takayasu Nihira, Hiroyoshi Fukuro
  • Patent number: 6274699
    Abstract: Polyimides and the process for preparing polyimides having improved thermal-oxidative stability derived from the polymerization of effective amounts of one or more of the polyamines such as the aromatic diamines, one or more of the tetracarboxylic dianhydrides and a novel dicarboxylic endcap having a formula selected from the group consisting of: wherein R1 is either a radical where R is either hydrogen or an alkyl radical of 1 to 4 carbons, R2 is either OH, NH2, F, or Cl radical, R3 is either H, OH, NH2, F, Cl or an alkylene radical, R4 is either an alkyl, aryl, alkoxy, aryloxy, nitro, F, or Cl radical, and R5 is either H, alkyl, aryl, alkoxy, aryloxy, nitro, F, or Cl radical. The polyimides are useful particularly in the preparation of prepregs and PMR composites.
    Type: Grant
    Filed: March 23, 2000
    Date of Patent: August 14, 2001
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventor: Mary Ann B. Meador
  • Patent number: 6273543
    Abstract: Disclosed is a composition which comprises a polymer containing at least some monomer repeat units with water-solubility- or water-dispersability-imparting substituents and at least some monomer repeat units with photosensitivity-imparting substituents which enable crosslinking or chain extension of the polymer upon exposure to actinic radiation, said polymer being of the formula wherein x is an integer of 0 or 1, A is one of several specified groups, such as B is one of several specified groups, such as or mixtures thereof, and n is an integer representing the number of repeating monomer units. In one embodiment, a single functional group imparts both photosensitivity and water solubility or dispersability to the polymer. In another embodiment, a first functional group imparts photosensitivity to the polymer and a second functional group imparts water solubility or dispersability to the polymer.
    Type: Grant
    Filed: February 9, 1999
    Date of Patent: August 14, 2001
    Assignee: Xerox Corporation
    Inventors: Ram S. Narang, Timothy J. Fuller
  • Patent number: 6268465
    Abstract: An aliphatic polyester amide which is hydrolysis-resistant includes a ternary polycondensation product of monomeric constituents composed of a monomeric constituent A which is at least one diol having a general formula: HO—R1—OH, where R1 is an aliphatic residue having 2-16 carbon atoms; a monomeric constituent B which is at least one dicarboxylic acid having a general formula: HOOC—R2—COOH, where R2 is an aliphatic residue having 1-14 carbon atoms; and a monomeric constituent C which is at least one diamine having a general formula: H2N—R3—NH2, where R3 is an aliphatic residue having 2-16 carbon atoms and is present in an amount of up to about 5% by weight based on total weight of the monomeric constituents, wherein polycondensation proceeds in the presence of a catalyst comprised of constituent D, which is a metal-containing catalyst, in combination with constituent E, which is at least one of an organic phosphorus compound and an inorganic phosphorus compound, and wherei
    Type: Grant
    Filed: April 12, 1999
    Date of Patent: July 31, 2001
    Assignee: BK Giulini Chemie GmbH Co OHG
    Inventors: Gudrun Chomiakow, Hasan Ulubay, Emil Wilding
  • Patent number: 6268460
    Abstract: The present invention provides a process for preparing an optical alignment layer for aligning liquid crystals and liquid crystal displays comprising exposing polyimide layers with polarized light. The invention further describes optical alignment layers, liquid crystal displays incorporating optical alignment layers and novel polymer compositions within the class of polyimide, polyamic acids and esters thereof.
    Type: Grant
    Filed: July 18, 2000
    Date of Patent: July 31, 2001
    Inventors: Wayne M. Gibbons, Patricia A. Rose, Paul J. Shannon, Hanxing Zheng
  • Patent number: 6265588
    Abstract: A compound of the formula where R1 is the radical of the formula II or III is suitable for the production of a pharmaceutical for the treatment of inflammations, carcinomatous diseases, or autoimmune diseases. A compound of the formula IV is suitable for the production of specific antibodies against a compound of the formula I for the discovery of specific-binding proteins from cell extracts, serum, blood, or synovial fluids, for the purification of proteins, for the modification of microtiter plates, or for the preparation of chromatography material, in particular of affinity chromatography material, and for use in diagnostics.
    Type: Grant
    Filed: May 30, 2000
    Date of Patent: July 24, 2001
    Assignee: Aventis Pharma Deutschland GmbH
    Inventors: Stefan Müllner, Bernd Kirschbaum, Wilfried Schwab
  • Patent number: 6265520
    Abstract: Disclosed is a solvent soluble polyimide and a method for making thereof, which characterizes by producing a solvent soluble polyimide with low electric conductivity through the polymerization of an anhydride and a diamine under the condition with or without catalyst.
    Type: Grant
    Filed: November 29, 1999
    Date of Patent: July 24, 2001
    Assignee: Industrial Technology Research Institute
    Inventors: Hui-Lung Kuo, Chein-Dhau Lee, Yi-Chun Liu, Shih-Chi Yang
  • Patent number: 6265521
    Abstract: Polyether polymers such as polyetherimides are prepared by a two-step reaction. The first step is the reaction between an alkali metal salt of a dihydroxy-substituted aromatic hydrocarbon, such as bisphenol A disodium salt, and a substituted aromatic compound such as 1,3-bis[N-(4-chlorophthalimido)]benzene, the alkali metal salt being employed in an amount less than stoichiometric. The intermediate low molecular weight polymer thus produced then undergoes reaction with additional alkali metal salt. By this method, a polyether polymer of closely controlled molecular weight can be conveniently prepared.
    Type: Grant
    Filed: August 7, 2000
    Date of Patent: July 24, 2001
    Assignee: General Electric Company
    Inventors: Thomas Joseph Fyvie, Peter David Phelps, Paul Edward Howson, Donald Frank Rohr, Ganesh Kailasam, Elliott West Shanklin
  • Patent number: 6262223
    Abstract: Addition-cured polyimides that contain the reaction product of an aromatic triamine or trianhydride analogue thereof, a reactive end group such as 5-norbornene-2, 3-dicarboxylic acid, ester derivatives of 5-norbornene-2,3-dicarboxylic acid, anhydride derivatives of 5-norbornene-2,3-dicarboxylic acid, or 4-phenylethynylphthalic anhydride, an aromatic diamine, and a dialkyl ester of an aromatic tetracarboxylic acid. The resultant starlike polyimides exhibit lower melt flow viscosity than its linear counterparts, providing for improved processability of the polyimide. Also disclosed are methods for the synthesis of these polyimides as well as composite structures formed using these polyimides.
    Type: Grant
    Filed: February 1, 2000
    Date of Patent: July 17, 2001
    Assignee: The United States of America as represented by the Administrator of National Aeronautics and Space Administration
    Inventors: Michael A. Meador, Baochau N. Nguyen, Ronald K. Eby
  • Publication number: 20010007064
    Abstract: Bi-component superabsorbent materials are disclosed. The superabsorbent materials comprise a mixture of about 20% to about 40%, by weight, poly-(vinylamine) polymer or other basic resin and about 60% to about 80%, by weight of an acidic water-absorbing polymer, like polyacrylic acid.
    Type: Application
    Filed: December 22, 2000
    Publication date: July 5, 2001
    Inventors: Michael A. Mitchell, Thomas W. Beihoffer, Raffat S. Sultana
  • Patent number: 6252033
    Abstract: A method for preparing polyamic acid and polyimide, which is suitable for use in adhesives or adhesive tapes for electronic parts. The polymers have such three-dimensional molecular structures that a significant improvement can be brought about in solvent solubility, thermal resistance, mechanical properties, and adhesive properties onto various substrates. The polyamic acid is prepared by reacting at least one tetracarboxylic dianhydride, at least one aromatic diamine, at least one diamine with a siloxane structure, represented by the following general formula I, and at least one polyamino compound represented by the following general formula II or III. The polyamic acid is converted into polyimide through thermal or chemical imidization.
    Type: Grant
    Filed: March 20, 2000
    Date of Patent: June 26, 2001
    Assignee: Saehan Industries Incorporation
    Inventors: Jeong Min Kweon, Soon Sik Kim, Kyeong Ho Chang, Kyung Rok Lee
  • Patent number: 6248857
    Abstract: An aromatic polycarbodiimide comprising a structure represented by the following formula (1) has excellent low moisture resistance, heat resistance and a low dielectric constant: wherein Q is one selected from the group consisting of —CH2—, m is 0 or 1, A is a divalent organic group having 4 or less carbon atoms, Ph is a phenyl group, X's are a hydrogen atom when Q is and the same or different halogen atoms when Q is —CH2—, and n is an integer of 2 to 300.
    Type: Grant
    Filed: September 23, 1999
    Date of Patent: June 19, 2001
    Assignee: Nitto Denko Corporation
    Inventors: Sadahito Misumi, Akiko Matsumura, Amane Mochizuki, Michio Satsuma, Michie Sakamoto
  • Patent number: 6235868
    Abstract: Polymerisable resins which comprise a porphyrinogenic ring system obtained by the reaction of: (a) one or more compounds selected from the group consisting of pyrrole and N-(lower)alkyl pyrroles, any of which may be optionally substituted, and (b) a C4-C6 saturated alicyclic ketone which is capable of reacting with the 2 or 5 position of the pyrrole ring. Resin coating systems comprising the said resins.
    Type: Grant
    Filed: September 22, 1994
    Date of Patent: May 22, 2001
    Assignee: The Australian National University
    Inventors: James Thomas Guthrie, Richard Allan Morris, He Wei Dong
  • Patent number: 6235866
    Abstract: Bis(halophthalimides) such as, 3-bis[N-(4-chlorophthalimido)]benzene are prepared in slurry in an organic liquid such as o-dichlorobenzene or anisole, by a reaction at a temperature of at least 150° C. between at least one diamino compound, preferably an aromatic diamine such as m- or p-phenylenediamine, and at least one halophthalic anhydride such as 4-chlorophthalic anhydride, in the presence of an imidization catalyst such as sodium phenylphosphinate. The solids content of the reaction mixture is at least about 5% and preferably at least about 12% by weight. The product slurry may be employed directly in the preparation of polyetherimides, and similar slurries may be employed to prepare other polyether polymers.
    Type: Grant
    Filed: October 6, 1999
    Date of Patent: May 22, 2001
    Assignee: General Electric Company
    Inventors: Farid Fouad Khouri, Ganesh Kailasam, Joseph John Caringi, Peter David Phelps, Paul Edward Howson
  • Patent number: 6235867
    Abstract: The present invention provides a liquid crystal-aligning agent including, as the resin component, a polyimide precursor containing a chemical structure represented by the following formula (1): The present invention further provides a liquid crystal-aligning agent including, the above polyimide precursor and a polyimide precursor represented by the following general formula (2): (wherein Y is a tetravalent aliphatic group, Z is a bivalent aromatic group, and R is H or an alkyl group).
    Type: Grant
    Filed: November 5, 1999
    Date of Patent: May 22, 2001
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Toshimasa Eguchi, Toshiro Takeda
  • Patent number: 6232428
    Abstract: Essentially colorless, transparent polyimide coatings and films prepared by combining aromatic dianhydrides with para-substituted aromatic diamines are provided. The polyimide coatings and films are produced by a process whereby the dianhydride and diamine monomer components are reacted at temperatures of greater than 80° C.
    Type: Grant
    Filed: January 14, 2000
    Date of Patent: May 15, 2001
    Assignee: I.S.T. Corporation
    Inventors: Gary L. Deets, Toshiyuki Hattori