From Ketone Or Ketene Reactant Patents (Class 528/220)
  • Patent number: 6222007
    Abstract: High quality films, preimpregnated tape (prepegs) and composites have been fabricated from polyimide precursor “salt-like” solutions. These “salt-like” solutions have a low viscosity (5,000 to 10,000 cp) and a high solids content (50-65% by weight) and can be coated onto reinforcing fiber to produce prepegs with excellent tack and drape at 12-15% residual solvent (˜4-6% water from thermal imidization reaction). The processing of these types of prepegs significantly overcomes solvent removal problems and allows excellent fiber wet out. In addition, the physical characteristics of the polyimide precursor “salt-like” solutions permits processing into high-performance materials through the use of standard prepregging and composite fabrication equipment. The resultant composites are of high quality.
    Type: Grant
    Filed: May 29, 1998
    Date of Patent: April 24, 2001
    Assignee: The United States of America as represented by the National Aeronautics and Space Administration
    Inventors: Roberto J. Cano, Erik S. Weiser, Terry L. St. Clair, Yoshiaki Echigo, Hisayasu Kaneshiro
  • Patent number: 6211326
    Abstract: The invention relates to a process for preparing hydroxyl- and carboxyl-containing polyesterimide resins, comprising as monomeric components: (A) imide-forming compounds having at least two primary amino groups and/or at least two isocyanate groups or imide-forming compounds having at least one primary amino group and/or at least one isocyanate group and at least one further functional group selected from hydroxyl, carboxyl and/or carboxylic anhydride, (B) polycarboxylic acids and/or their anhydrides and/or their esters and (C) polyols, characterized in that (I) component (A) is reacted with part of component (B) to form a polyimide, (II) the polyimide obtained in accordance with stage (I) is reacted with component (C) to form a polyesterimide, and finally (III) the polyesterimide obtained in accordance with stage (II) is reacted with the remaining part of component (B) to form the Also embraced by the invention is the use of the polyesterimides prepared by the process according to the invention as bi
    Type: Grant
    Filed: July 13, 1999
    Date of Patent: April 3, 2001
    Assignee: Schenectady International, Inc.
    Inventors: Brian W. Glasper, Geoffrey C. Rix, Klaus-Wilhelm Lienert
  • Patent number: 6211329
    Abstract: A process for synthesis of a polymeric polyalcohol substantially and preferably built up form polyester units and composed of a monomeric or polymeric initiator molecule to which at least one dentritic branch (dendron) consisting of a number of branching generations is added. The branching generations comprise a polymericor monomeric branching chain extender having three reactive functions of which two are hydroxyl groups. The two hydroxyl groups of the ranching chain extender is acetal protected by reaction between said two hydroxyl groups and an acetal-forming carbonyl compound, preferably an aldehyde. The acetal protected branching chain extender is then employed for addition to the initiator molecule of a first branching generation followed by an optional deprotection of the hydroxyl groups by decomposition of acetals and for addition in repeated steps of further branching generations.
    Type: Grant
    Filed: February 29, 2000
    Date of Patent: April 3, 2001
    Assignee: Perstorp AB
    Inventors: Nicola Rehnberg, Bo Pettersson, Ulf Annby, Mats Malmberg
  • Patent number: 6211261
    Abstract: A thermosetting pressure-sensitive adhesive which can obtain the high rate of polymerization without a decrease in the molecular weight by photopolymerization, thereby show the tackiness at ordinary temperatures to permit easy temporary adhesion to an adherend, can be cured by heating for a short period of time to exhibit strong adhesive strength and high heat resistance, and is excellent in storage stability before heating, comprising a photopolymerized product of a composition comprising a) 100 parts by weight of a monomer mixture comprising 70% to 99% by weight of an alkyl (meth)acrylate whose alkyl group has 2 to 14 carbon atoms on average, and 1% to 30% by weight of a monoethylenic unsaturated acid copolymerizable therewith based on the monomer mixture, b) 0.
    Type: Grant
    Filed: September 21, 1999
    Date of Patent: April 3, 2001
    Assignee: Nitto Denko Corporation
    Inventors: Kazuhito Hosokawa, Masahiro Oura
  • Patent number: 6203143
    Abstract: Disclosed is a composition which comprises (a) a polymer containing at least some monomer repeat units with photosensitivity-imparting substituents which enable crosslinking or chain extension of the polymer upon exposure to actinic radiation, said polymer being of the formula wherein x is an integer of 0 or 1, A is one of several specified groups, such as B is one of several specified groups, such as or mixtures thereof, and n is an integer representing the number of repeating monomer units, wherein said photosensitivity-imparting substituents are hydroxyalkyl groups; (b) at least one member selected from the group consisting of photoinitiators and sensitizers; and (c) an optional solvent. Also disclosed are processes for preparing the above polymers and methods of preparing thermal ink jet printheads containing the above polymers.
    Type: Grant
    Filed: September 23, 1998
    Date of Patent: March 20, 2001
    Assignee: Xerox Corporation
    Inventors: Ram S. Narang, Timothy J. Fuller
  • Patent number: 6204343
    Abstract: A curable composition for electrical applications, the curable composition comprising (i) a compound having at least two &agr;,&bgr;-unsaturated groups and an equivalent weight of less than 250 g/mol, (ii) a catalyst capable of initiating a Michael reaction and (iii) a Michael donor having an equivalent weight of less than 250 g/mol, and a package for using this composition in electical splices.
    Type: Grant
    Filed: June 3, 1999
    Date of Patent: March 20, 2001
    Assignee: 3M Innovative Properties Company
    Inventors: Dieter Barucha, Dean M. Moren, Manfred Stepputtis, Frank Y. Xu
  • Patent number: 6201098
    Abstract: The invention concerns a process for preparing linear or branched sulphurous polymers such as polyarylene sulphides, in particular polyphenylene sulphide, from an aromatic dihalide compound and a sulphide in a solvent, wherein a) the aromatic dihalide compound and the sulphide are partially reacted; b) the resultant salt which is not dissolved in the reaction medium is separated off; and c) the reaction mixture largely freed of the salt is further polymerized.
    Type: Grant
    Filed: May 24, 1999
    Date of Patent: March 13, 2001
    Assignee: Ticona GmbH
    Inventors: Michael Haubs, Stephan Wagner, Olaf Besser
  • Patent number: 6197920
    Abstract: The present invention relates to the synthesis of new type of diamine monomer, 1,3-bis(4-amonophenoxy)naphthalene, and with such a compound to produce a series of aromatic polymers, including polyamide, polyimide, copoly(amide-imide)s, etc., such polymers having excellent resistance to heat and mechanical properties.
    Type: Grant
    Filed: July 21, 1999
    Date of Patent: March 6, 2001
    Assignee: China Textile Institute
    Inventors: Kun Lin Cheng, Wen-Tung Chen
  • Patent number: 6187899
    Abstract: A process for producing polyimide microfine particles which is amenable to free control of particle morphology and particle diameter distribution is provided. A polyamic acid and a polyimide, each in the form of microfine particles with good monodispersibility, are also provided. There is also provided a process for producing polyimide microfine particles from a tetracarboxylic anhydride and a diamine compound which comprises (a) a first step of preparing a first solution containing the tetracarboxylic anhydride and a second solution containing the diamine compound, (b) a second step of mixing the first and second solutions and causing a polyamic acid to precipitate in the form of microfine particles from the mixed solution under ultrasonic agitation, and (c) a third step of imidating the polyamic acid particles to provide the objective polyimide in the form of microfine particles.
    Type: Grant
    Filed: February 25, 1999
    Date of Patent: February 13, 2001
    Assignees: Osaka Prefectural Government, Sumitomo Bekelite Co., Ltd.
    Inventors: Katsuya Asao, Hidenori Saito
  • Patent number: 6184333
    Abstract: The present invention is directed to polyimide systems which simultaneously offer low toxicity, a high glass transition temperature, excellent thermal oxidative stability, and desirable processing characteristics. These various polyimide systems include mixtures of monomeric reactants, polyimide-precursor reaction products, polyimides, and polyimide-containing articles. In one aspect of the invention, the mixture of monomeric reactants includes at least one dia-nhydride or a derivative thereof, and at least one diamine. The diamine may be 4,4′-[1,4-phenylene-bis(1-methylethylidene)]bisaniline, 4,4′-[1,3-phenylene-bis(1-methylethylidene)]bisaniline, and/or a derivative thereof. The diamine also may include a phenylenediamine, 2,2-bis[4-(4-aminophenoxyl)phenyl]propane, 4,4′(1,4-phenylene-bismethylene)bisaniline, and/or a derivative thereof. In addition, the mixture may include a reactive end-capping agent and/or a non-reactive end-capping agent.
    Type: Grant
    Filed: January 15, 1999
    Date of Patent: February 6, 2001
    Assignee: Maverick Corporation
    Inventor: Robert A. Gray
  • Patent number: 6180746
    Abstract: A polyimide precursor solid residuum is an admixture of an aromatic dianhydride or derivative thereof and an aromatic diamine or dervative thereof plus a complexing agent, which is complexed with the admixture by hydrogen bonding. The polyimide precursor solid residuum is effectively employed in the preparation of polyimide foam and the fabrication of polyimide foam structures.
    Type: Grant
    Filed: May 21, 1999
    Date of Patent: January 30, 2001
    Assignees: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration, Unitika, LTD
    Inventors: Erik S. Weiser, Terry L. St. Clair, Yoshiaki Echigo, Hisayasu Kaneshiro
  • Patent number: 6177539
    Abstract: A process of producing a polyester or copolyester, wherein at least one cyclic lactone of the following formula (I): wherein n is an integer of 1-4 provided that n is not 2 when only one cyclic lactone is used, is polymerized under a pressure of at least 200 MPa in the absence of any catalyst or in the presence of a metal-free polyesterification catalyst.
    Type: Grant
    Filed: March 20, 2000
    Date of Patent: January 23, 2001
    Assignee: Secretary of Agency of Industrial Science and Technology
    Inventors: Akihiro Oishi, Yoichi Taguchi, Ken-ichi Fujita, Yoshikazu Ikeda, Takashi Masuda, Yutaka Ishigami, Kazuo Nakayama, Shinichi Kinugasa, Hisae Nakahara
  • Patent number: 6177144
    Abstract: The present invention relates to a radiation-curable binder BM consisting of a copolymer which is composed of: A) from 80 to 99% by weight of a hydroxyl-containing polyether acrylate and/or polyester acrylate A), which optionally contains a mono-, di- and/or polyamine AA) as adduct, and of B) from 1 to 20% by weight of benzophenonetetracarboxylic acid, its anhydrides and/or its esters. The invention additionally relates to processes for the preparation of the binder BM and to the use of the binders BM in radiation-curable coating compositions.
    Type: Grant
    Filed: January 14, 1999
    Date of Patent: January 23, 2001
    Assignee: BASF Coatings AG
    Inventors: Wolfgang Kranig, Rainer Blum
  • Patent number: 6172181
    Abstract: A (2,3,4,5,6-pentafluorobenzoyl)diphenyl ether compound represented by the formula (I): wherein R stands for a hydroxyl group or a group represented by ether ketone polymer represented by the formula (II): wherein n stands for a degree of polymerization, m is an integer of 0 or 1, and R1 stands for a group represented by the formula (III): wherein p is an integer 0 or 1 and R2 stands for
    Type: Grant
    Filed: July 16, 1999
    Date of Patent: January 9, 2001
    Assignee: Nippon Shokubai Co., Ltd.
    Inventors: Kunio Kimura, Yuhiko Yamashita, Patrick E. Cassidy, John W. Fitch, III, V. Sreenivasulu Reddy
  • Patent number: 6166174
    Abstract: Polyimide copolymers were obtained containing 1,3-bis(3-aminophenoxy)benzene (APB) and other diamines and dianhydrides and terminating with the appropriate amount of a non-reactive endcapper, such as phthalic anhydride. Homopolymers containing only other diamines and dianhydrides which are not processable under conditions described previously can be made processable by incorporating various amounts of APB, depending on the chemical structures of the diamines and dianhydrides used. Polyimides that are more rigid in nature require more APB to impart processability than polyimides that are less rigid in nature. The copolymers that result from using APB to enhance processability have a unique combination of properties including: excellent thin film properties, low pressure processing (200 psi and below), improved toughness, improved solvent resistance, improved adhesive properties, improved composite mechanical properties, long term melt stability (several hours at 390 C.), and lower melt viscosities.
    Type: Grant
    Filed: August 5, 1999
    Date of Patent: December 26, 2000
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventor: Brian J. Jensen
  • Patent number: 6166168
    Abstract: A novel polyalkyl ether/polyaryl ether sulfone or ketone copolymer and a specific polyether ester copolymer are useful for producing a medical material to be used to contact the blood; and methods for producing the medical material comprising said polyalkyl ether/polyaryl ether sulfone or ketone copolymer or a specific polyether ester copolymer.
    Type: Grant
    Filed: March 17, 1999
    Date of Patent: December 26, 2000
    Assignee: Teijin Limited
    Inventors: Hiroaki Kuwahara, Takeyuki Kawaguchi, Satoru Ohmori, Shunichi Matsumura
  • Patent number: 6162892
    Abstract: The invention relates to a gas barrier composition as well as to composite structures having at least one surface of a molded resin coated with the composition, said composition comprising:(A) an alkoxysilyl functional polyamine compound, or a hydrolyzate thereof, said polyamine compound having three or more amine groups, at least one nitrogen atom of said amine groups being bonded to a hydrogen atom and at least one nitrogen of said amine groups being bonded to an alkoxysilyl group expressed by the formula--W--SiR.sup.2.sub.3-f (OR.sup.1).sub.fwherein R.sup.1 is an alkyl group having 1 to 6 carbon atoms, R.sup.
    Type: Grant
    Filed: September 28, 1999
    Date of Patent: December 19, 2000
    Assignee: Dow Corning Toray Silicone Co., Ltd.
    Inventors: Hideki Kobayashi, Masayuki Hayashi
  • Patent number: 6160081
    Abstract: The invention relates to a photosensitive polyimide resin composition comprising (A) a polyamic acid having, in its main chain, repeating units formed from a polycondensation product of at least one tetracarboxylic acid or tetracarboxylic anhydride thereof with at least one diamine compound, and having actinic ray-sensitive functional groups at both terminals thereof; (B) a photosensitive auxiliary having a photopolymerizable functional group; (C) a photopolymerization initiator; and (D) a solvent, wherein 1 the polyamic acid is such that when the repeating unit represented by the formula (1) is defined as a unit molecular weight, a unit molecular weight per carboxyl group (unit molecular weight/COOH) falls within a range of from 200 to 300, and 2 the photosensitive resin composition permits the formation of a polyimide film having a residual stress of 40 MPa or lower and a coefficient of thermal expansion of 30 ppm/.degree. C.
    Type: Grant
    Filed: October 30, 1998
    Date of Patent: December 12, 2000
    Assignees: Nippon Zeon Co., Ltd., Fujitsu Limited
    Inventors: Akira Tanaka, Kei Sakamoto, Kenichi Ito, Yasuhiro Yoneda, Kishio Yokouchi, Yasuo Naganuma
  • Patent number: 6156429
    Abstract: The invention concerns monomers with dilactonic cycle and the corresponding polymers, their preparation, and materials containing these polymers. The monomers are of formula (IIIa) ##STR1## in which R is the residue of an acid derived from an ose such as glyconic, gylcuronic or glycaric acid and X represents in particular a methylene or ethylene group optionally substituted by at least an alkyl, allyl, aryl or aralkyl. The corresponding polymers are in the form of degradable non-toxic products and are used for example for packaging (films) or in medicine (implants).
    Type: Grant
    Filed: March 21, 2000
    Date of Patent: December 5, 2000
    Assignee: Centre National de la Recherche Scientifique (CNRS)
    Inventors: Katarina Marcincinova, Mahfoud Boustta, Jean Coudane, Michel Vert
  • Patent number: 6143860
    Abstract: A polymer composition made by combining a polyketone polymer and a phenolic alkylene dicarboxylate of the general formula: ##STR1## each R.sup.1 independently is hydrogen or alkyl with 1-6 carbon atoms, each R.sup.2 independently is alkyl with 1-6 carbon atoms,each m is an integer of 0-4, andn is an integer of 2-12; anda process for preparing these compositions.
    Type: Grant
    Filed: September 29, 1998
    Date of Patent: November 7, 2000
    Assignee: Shell Oil Company
    Inventors: Abraham Adriaan Smaardijk, Hendrik De Wit
  • Patent number: 6137008
    Abstract: A diamine which is useful in preparing a new flexible polyamide and polyimide with an aromatic dicarboxylic acid and a tetracarboxylic dianhydrides, respectively, has a general formula as follows: ##STR1## wherein R.sub.1 is methyl (--CH.sub.3) and n is an integer ranging from 1 to 4.
    Type: Grant
    Filed: June 2, 1999
    Date of Patent: October 24, 2000
    Assignee: National Science Council
    Inventors: Der-Jang Liaw, Been-Yang Liaw
  • Patent number: 6136949
    Abstract: A compound of the formula: ##STR1## wherein Ar.sup.
    Type: Grant
    Filed: September 3, 1998
    Date of Patent: October 24, 2000
    Assignee: The Dow Chemical Company
    Inventors: Jimmy Dan Earls, Bruce L. Burton, Brenda Thies Colegrove
  • Patent number: 6133405
    Abstract: Water soluble polyalkanolamides and a process to prepare same by reacting polycarboxylic acid or its anhydride, ester or halide derivative with at least one alkanolamine and optionally with a polyamine and removing the condensation byproduct water, alcohol or hydrogen halide.
    Type: Grant
    Filed: July 10, 1997
    Date of Patent: October 17, 2000
    Assignee: Hercules Incorporated
    Inventor: Anthony J. Allen
  • Patent number: 6133401
    Abstract: Polyimide copolymers were obtained containing 1,3-bis(3-aminophenoxy)benzene (APB) and other diamines and dianhydrides and terminating with the appropriate amount of reactive endcapper. The reactive endcappers studied include but should not be limited to 4-phenylethynyl phthalic anhydride (PEPA), 3-aminophenoxy-4'-phenylethynylbenzophenone (3-APEB), maleic anhydride (MA) and nadic anhydride (5-norbornene-2,3-dicarboxylic anhydride, NA). Homopolymers containing only other diamines and dianhydrides which are not processable under conditions described previously can be made processable by incorporating various amounts of APB, depending on the chemical structures of the diamines and dianhydrides used. By simply changing the ratio of APB to the other diamine in the polyimide backbone, a material with a unique combination of solubility, Tg, Tm, melt viscosity, toughness and elevated temperature mechanical properties can be prepared.
    Type: Grant
    Filed: June 29, 1999
    Date of Patent: October 17, 2000
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventor: Brian J. Jensen
  • Patent number: 6133408
    Abstract: A polyimide resin having good thermal stability and good adhesion to a metal foil is disclosed. The polyimide resin is prepared by dissolving at least one diamine in a polar aprotic solvent followed by the addition of an aromatic tetracarboxylic acid dianhydride to the solution of the aromatic diamines to prepare a polyamic acid solution, imidizing this solution to a polyimide resin by heating at a temperature above 250.degree. C., the polar aprotic solvent comprising at least 1 weight % of acetone. Polyimide laminates with a metal foil, such as a copper foil, are also described. The laminates may be used to form flexible printed circuit boards.
    Type: Grant
    Filed: January 15, 1999
    Date of Patent: October 17, 2000
    Assignee: Wirex Corporation
    Inventors: Chien-Hwa Chiu, Der-Jen Sun, Yen-Huey Hsu, Fu-Ti Shiang, Chien-Hsiang Chen, Paul S. C. Wu
  • Patent number: 6133407
    Abstract: A polyimide precursor solution having a high concentration yet low viscosity, a polyimide coating film having satisfactory physical properties which is prepared from the polyimide precursor solution, and a process for producing a polyimide coating film using the polyimide precursor solution. The polyimide precursor solution has dissolved therein a specific salt of a diamine and a tetracarboxylic acid and/or a dicarboxylic acid-dialkyl ester in a high concentration, the diamine and the tetracarboxylic acid and/or the dicarboxylic acid-dialkyl ester being capable of forming a polyimide. Also disclosed is a polyimide coating film obtained by heating the solution to cause imidization and a process for producing the polyimide coating film.
    Type: Grant
    Filed: June 23, 1998
    Date of Patent: October 17, 2000
    Assignee: Unitka Ltd.
    Inventors: Hisayasu Kaneshiro, Jushiro Eguchi, Yoshiaki Echigo, Takahiro Ono
  • Patent number: 6127509
    Abstract: Polyimide polymers from 3,4,3',4'-biphenyltetracarboxylic dianhydride and 3,4,3',4'-benzophenonetetracarboxylic dianhydride and a diamine such as p-phenylenediamine exhibit a high glass transition temperature, high thermal oxidative stability and low moisture regain, useful for structural applications.
    Type: Grant
    Filed: June 1, 1999
    Date of Patent: October 3, 2000
    Assignees: E. I. du Pont de Nemours and Company, Fiberite Inc.
    Inventors: James F. Pratte, Murty S. Tanikella
  • Patent number: 6121409
    Abstract: Poly(vinylamine)-based superabsorbent gels are disclosed. The superabsorbent gels either comprise a mixture of a poly(vinylamine) polymer and an acidic water-absorbing polymer, like polyacrylic acid, or comprise a salt of a poly(vinylamine) polymer. An improved method of preparing poly(vinylamine) also is disclosed.
    Type: Grant
    Filed: April 13, 1999
    Date of Patent: September 19, 2000
    Assignee: AMCOL International Corporation
    Inventors: Michael A. Mitchell, Thomas W. Beihoffer, Leticia L. Lobo, Jerald W. Darlington, Jr.
  • Patent number: 6117970
    Abstract: Sodium salt of (poly-(2,5-dihydroxy-phenylene))-4-thiosulfonic acid, being a cyclo-linear polymer, is proposed as the regulator of a cell metabolism. There are provided for the production of the claimed preparation: interaction of para-benzoquinone and sodium thiosulfate at the molar ratio of 10:1 to 2:1, separation of a final product, and purification from admixtures. The interaction of para-bernzoquinone and sodium thiosulfate is made in a water-organic medium, preferably in the water-acetone one, at the temperature of 40 to 70 C.
    Type: Grant
    Filed: April 28, 1999
    Date of Patent: September 12, 2000
    Inventors: Viktor Georgievich Popov, Ekaterina Mikhailovna Igumnova
  • Patent number: 6114493
    Abstract: This invention relates to methods for preparing novel, solid-phase transfer reagents, specifically phosgenated oxime resins and non-symmetrical ureas, that are useful as supports in combinatorial synthesis for the creation of libraries of compounds for lead identification.
    Type: Grant
    Filed: December 22, 1998
    Date of Patent: September 5, 2000
    Assignee: E. I. du Pont de Nemours and Company
    Inventor: Mark Andrew Scialdone
  • Patent number: 6114494
    Abstract: A fully imidized cresylic acid soluble polymer comprising 4,4'- oxydiphthalic anhydride (ODPA), 3,4,3',4',-biphenyltetracarboxylic dianhydride (BPDA), 3,4'-oxydianiline (ODA), and 4,4'-oxydianiline (DAPE) that can be used as a coating material such as a wire coated enamel. The polyimide has relatively low viscosity and high percent solids by substituting some of the 3,4'oxydianiline with 4,4'oxydianiline. Substitution with the 4,4'oxydianiline can be accomplished up to 25% on the molar basis without losing the fully imidized, cresol solubility characteristics.
    Type: Grant
    Filed: December 3, 1998
    Date of Patent: September 5, 2000
    Assignee: Ranbar Electrical Materials, Inc.
    Inventors: Edward W. Kifer, James R. Kwiecinski
  • Patent number: 6114490
    Abstract: A novel polymer comprising oligo-p-phenylene units and having formula (A.sub.k B).sub.n is disclosed, wherein A and B have the following chemical structure: ##STR1## Y are identical or different and are each (E)--CR.sup.9 .dbd.CR.sup.10 --, --C.dbd.C-- or --CHR.sup.11 --CHR.sup.12 ;R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5, R.sup.6, R.sup.7, R.sup.8, R.sup.9, R.sup.10, R.sup.11, R.sup.12 are, independently of one another, identical or different in the individual structural elements and are each H, a straight-chain or branched alkyl group having from 1 to 22 carbon atoms, or an aryl or aryloxy group, or Br, Cl, F, CN or alkyloxycarbonyl having from 2 to 23 carbon atoms;k is from 1 to 25,n is from 1 to 200.The polymer of the present invention may be used as an electroluminescence material.
    Type: Grant
    Filed: September 18, 1997
    Date of Patent: September 5, 2000
    Assignee: Hoechst Aktiengesellschaft
    Inventors: Willi Kreuder, Dieter Neher, Marcus Remmers
  • Patent number: 6111059
    Abstract: A diaminobenzene derivative represented by formula (1), and a polyimide obtained by reacting a diamine containing at least 1 mol % of said diaminobenzene derivative, with a tetracarboxylic acid and its derivatives to obtain a polyimide precursor and ring-closing it, having a repeating unit represented by formula (2), and a liquid crystal alignment film containing said polyimide. ##STR1## P is a single bond or --O--, --COO--, or --CONH--, Q is a cyclic substituent selected from an aromatic ring, an aliphatic ring, a hetero ring and their substitution products, R.sup.1 is an aliphatic ring, and R.sup.2 is C.sub.1-22 straight chain alkyl group, A is a tetravalent organic group constituting a tetracarboxylic acid, B is a bivalent organic group constituting a diamine.
    Type: Grant
    Filed: August 12, 1998
    Date of Patent: August 29, 2000
    Assignee: Nissan Chemical Industries, Ltd.
    Inventors: Takayasu Nihira, Hideyuki Nawata, Hiroyoshi Fukuro
  • Patent number: 6111054
    Abstract: The present invention relates to a dispersing agent for pigments or extenders which is obtainable by salt formation from an amine-functional compound by means of an acid,wherein a polyamine which contains at least three amino groups and which is from the group comprising aliphatic linear polyamines and/or aliphatic branched polyamines and/or modified polyamines, with the proviso that after modification three amino groups which can be converted into salts are still present per molecule, or a mixture of polyamines such as these, is used as the amine-functional compound, andwherein a substance from the group comprising phosphoric acid esters of general formula: (HO).sub.3-n PO(OR.sup.1).sub.n where n=1 or 2, sulphonic acids of general formula HOSO.sub.2 R.sup.2 and acidic sulphuric acid esters of general formula HOSO.sub.3 R.sup.2 is used as the acid, wherein R.sup.1 and R.sup.
    Type: Grant
    Filed: June 26, 1998
    Date of Patent: August 29, 2000
    Assignee: BYK-Chemie GmbH
    Inventors: Karlheinz Haubennestel, Ulrich Orth, Wolfgang Pritschins, Udo Krappe
  • Patent number: 6111056
    Abstract: A cyclic amine containing polymer substantially free of primary and secondary amino groups which is prepared by reacting:a) an amine selected from the group consisting of:i) cyclic amines having at least one nitrogen atom in the ring and at least one primary amino alkyl group bonded to the nitrogen atom of the ring, andii) mixtures of cyclic amines containing at least two nitrogen atoms which react with a cross-linking agent with at least one other amine containing 1-6 nitrogen atoms which react with a cross-linking agent, withb) at least one cross-linker selected from the group consisting of at least one compound containing two groups which react with the primary amino group and said nitrogen atoms and mixtures of at least one compound containing two groups which react with the primary amino group and said nitrogen atoms with at least one compound containing at least three groups which react with the primary amino group and said nitrogen atoms in a molar ratio of (a):(b) of from 2.5:1 to 1:1.
    Type: Grant
    Filed: September 15, 1998
    Date of Patent: August 29, 2000
    Assignee: BASF Aktiengesellschaft
    Inventors: Soren Hildebrandt, Elisabeth Kappes, Dieter Boeckh, Rajan Panandiker, Sherri Randall, Eugene Paul Gosselink, William Conrad Wertz
  • Patent number: 6107438
    Abstract: A method of producing a polyamide resin by reacting with at least one diamine compound, at least one linear polyester resin consisting of at least one dicarboxylic acid component and at least one diol component and having an intrinsic viscosity of not less than 0.2 dl/g, the at least one diamine compound being used in an amount of 0.5-1.5 mol per 1 mol of the at least one linear polyester resin as calculated in the repeating unit thereof, the linear polyester resin and the diamine compound being reacted in a reaction medium comprising at least one solvent selected from aprotic protophobic polar solvents, so that the at least one diol component of the linear polyester resin is substituted by the diamine compound, resulting in the polyamide resin as a reaction product.
    Type: Grant
    Filed: October 1, 1998
    Date of Patent: August 22, 2000
    Assignee: M & S Research and Development Co., Ltd.
    Inventor: Seiko Nakano
  • Patent number: 6103322
    Abstract: The present invention provides novel polyamic acids and polyimide optical alignment layers for inducing alignment of a liquid crystal medium. The novel compositions comprise crosslinking diamines containing a C.sub.3 -C.sub.20 linear or branched hydrocarbon chains containing 1 to 4 carbon-carbon double bonds. The invention further describes liquid crystal displays comprising the novel polyimide optical alignment layers.
    Type: Grant
    Filed: December 23, 1998
    Date of Patent: August 15, 2000
    Assignee: Elsicon Inc.
    Inventors: Wayne M. Gibbons, Paul Joseph Shannon, Hanxing Zheng
  • Patent number: 6103864
    Abstract: The polyimides are derived from solutions of at least one low-boiling organic solvent, e.g. isopropanol containing a mixture of polyimide-forming monomers. The monomeric solutions have an extended shelf life at ambient (room) temperatures as high as 80.degree. C. and consist essentially of a mixture of monoalkyl ester-acids, alkyl diester-diacids and aromatic polyamines wherein the alkyl radicals of the ester-acids are derived from lower molecular weight aliphatic secondary alcohols having 3 to 5 carbon atoms per molecule such as isopropanol, secondary butanol, 2-methyl-3-butanol, 2 pentanol or 3-pentanol. The solutions of the polyimide-forming monomers have a substantially improved shelf-life and are particularly useful in the aerospace and aeronautical industry for the preparation of polyimide reinforced fiber composites such as the polyimide cured carbon composites used in jet engines, missiles, and for other high temperature applications.
    Type: Grant
    Filed: January 14, 1999
    Date of Patent: August 15, 2000
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: William B. Alston, Gloria S. Gahn
  • Patent number: 6100371
    Abstract: A polyimide for optical communications has a monomer, represented by the formula (1), as a repeating unit: ##STR1## wherein X.sub.1 and X.sub.2 are independently selected from the group consisting of halogen atom, halogenated alkyl group, halogenated aromatic ring group, --NO.sub.2, --OR.sup.1 and --SR.sup.1 (where R.sup.1 is selected from the group consisting of halogenated alkyl and halogenated aromatic ring groups); and Z is selected from the group consisting of divalent halogenated aliphatic hydrocarbon, divalent halogenated aliphatic cyclic hydrocarbon and divalent halogenated aromatic hydrocarbon. Thus, light absorption loss at a near infrared light wavelength range can be minimized by using the polyimide, so that the polyimide is very useful as an optical material in the optical communications field using light of a near infrared light region.
    Type: Grant
    Filed: September 18, 1998
    Date of Patent: August 8, 2000
    Assignee: SamSung Electronics Co., Ltd.
    Inventors: Dong-Hack Suh, Eun-Young Chung, Tae-Hyung Rhee
  • Patent number: 6096850
    Abstract: Polyimide is produced by reacting two kinds of diamine compounds consisting of diaminopolysiloxane and a hydroxyl group-containing diamine or three kinds of diamine compounds consisting of diaminopolysiloxane, a hydroxyl group-containing diamine and an aromatic or alicyclic diamine with a 4,4'-(hexafluoroisopropylidene)diphthalic acid dianhydride, thereby once forming a polyamic acid, and subjecting the polyamic acid to polyimidization reaction. The resulting polyimide itself is soluble in low boiling organic solvents for general purpose use, typically methyl ethyl ketone. A photosensitive composition comprising the polyimide, a photo crosslinking agent and a photo acid-generating agent forms a negative type polyimide pattern upon development with an aqueous alkali solution.
    Type: Grant
    Filed: February 26, 1999
    Date of Patent: August 1, 2000
    Assignee: Nippon Mektron Limited
    Inventors: Lin-chiu Chiang, Jenq-Tain Lin, Nobuyuki Sensui
  • Patent number: 6093790
    Abstract: The present invention provides polyimides and co-polyimides that are organosoluble. The polyimides and co-polyimides are prepared from an aromatic diamine having tert-butyl group, i.e., 1,4-bis(4-aminophenoxy)-2-tert-butyl-benzene, or its mixture with other diamines, and a mixture of dianhydrides that containing DSDA or 6FDA or other diether-dianhydrides.
    Type: Grant
    Filed: August 18, 1998
    Date of Patent: July 25, 2000
    Assignee: National Science Council
    Inventors: Chin-Ping Yang, Huei-Wen Yang
  • Patent number: 6087414
    Abstract: Disclosed is a process which comprises reacting a polymer of the general formula ##STR1## wherein x is an integer of 0 or 1, A is one of several specified groups, such as ##STR2## B is one of several specified groups, such as ##STR3##
    Type: Grant
    Filed: December 23, 1998
    Date of Patent: July 11, 2000
    Assignee: Xerox Corporation
    Inventors: Timothy J. Fuller, Ram S. Narang, Thomas W. Smith, David J. Luca, Raymond K. Crandall
  • Patent number: 6084058
    Abstract: A composition for a polyimide type liquid crystal aligning film characterized in that a diamino compound constituting polyimide contains one, two or more diamine selected from 4,4'-diaminodiphenyl methane, 3,3'-dimethyl-4,4'-diaminodiphenyl methane, 2,2'-dimethyl-4,4'-diaminodiphenyl methane, 3,3',5,5'-tetramethyl-4,4'-diaminodiphenyl methane and 4,4'-ethylene di-meta-toluidine.
    Type: Grant
    Filed: September 11, 1998
    Date of Patent: July 4, 2000
    Assignee: Chisso Corporation
    Inventors: Shizuo Murata, Toshiya Sawai, Satoshi Tanioka, Haruo Kato
  • Patent number: 6084052
    Abstract: The present invention relates generally to the use of polyaryletherketone-based thermoplastic materials in the fabrication of logging tools employed in high pressure, high temperature, downhole logging applications. A polyaryletherketone resin bonded with glass fibers is formed into a housing for the logging tool. The housing is constructed by any of the following processes: filament winding or compression molding. When used with a logging tool, the housing encloses the operative components of the logging tool, such as sensors and sources, and protects the operative components from borehole fluids.
    Type: Grant
    Filed: February 19, 1998
    Date of Patent: July 4, 2000
    Assignee: Schlumberger Technology Corporation
    Inventors: Carl Aufdermarsh, Monib M. Monib, Stanley R. Thomas
  • Patent number: 6084053
    Abstract: Electronic parts and a process for manufacturing the electronic parts are provided. The electronic parts comprise an electric insulating material exhibiting a high heat resistance and low dielectric constant as a structural component. The electric insulating material is formed of a polyimide containing a recurring unit represented by the following general formula (1).
    Type: Grant
    Filed: April 15, 1998
    Date of Patent: July 4, 2000
    Assignee: JSR Corporation
    Inventors: Minoru Matsubara, Yasutake Inoue, Mayumi Kakuta, Igor Rozhanskii, Kohei Goto
  • Patent number: 6080832
    Abstract: A diamine-containing polyamic acid alignment layer material provided by the polymerization of aromatic diamine and dianhydride, and having an excellent coating, adhesion and stability. After the polyamic acid alignment layer material is coated and cured at a high temperature, a polyamic acid alignment layer having a pretilt angle of below 2 degrees is formed due to a close ring reaction. The polyamic acid alignment layer with a low pretilt angle can be used in a TN (twisted nematic) type liquid crystal display.
    Type: Grant
    Filed: September 10, 1998
    Date of Patent: June 27, 2000
    Assignee: Industrial Technology Research Institute
    Inventors: Fu-Lung Chen, Ted Hong Shinn, Wen Hishin Wang, Chein-Dhau Lee
  • Patent number: 6077924
    Abstract: Polyimide is produced by reacting two kinds of diamine compounds consisting of diaminopolysiloxane and a hydroxyl group-containing diamine or three kinds of diamine compounds consisting of diaminopolysiloxane, a hydroxyl group-containing diamine and an aromatic or alicyclic diamine with a dicarboxylic acid anhydride having a 2,5-dioxotetrahydrofuryl group as one acid anhydride group, thereby once forming a polyamic acid, and subjecting the polyamic acid to polyimidization reaction. The resulting polyimide itself is soluble in low boiling organic solvents for general purpose use, typically methyl ethyl ketone. A photosensitive composition comprising the polyimide, a photo crosslinking agent and a photo acid-generating agent forms a negative type polyimide pattern upon development with an aqueous alkali solution.
    Type: Grant
    Filed: February 26, 1999
    Date of Patent: June 20, 2000
    Assignee: Nipopon Mektron Limited
    Inventors: Lin-chiu Chiang, Jenq-Tain Lin, Nobuyuki Sensui
  • Patent number: 6077929
    Abstract: The present invention pertains to coating compositions including a particular class of internally blocked polyamines as replacement for traditional blocked and unblocked polyamine crosslinkers. The use of these internally blocked polyamines results in better appearance characteristics and a lower VOC than are generally available with the traditional blocked varieties.
    Type: Grant
    Filed: April 7, 1998
    Date of Patent: June 20, 2000
    Assignee: Akzo Nobel N.V.
    Inventors: Johannes Adrianus Pardoen, Wincenty Lambertus Stanislaw Pilaszek, Jan Wilhelm Ernst Moos, Keimpe Jan Van Den Berg
  • Patent number: 6069278
    Abstract: This invention relates the novel diamines, the polyimide oligomers and the polyimides derived therefrom and to the method of preparing the diamines, oligomers and the polyimides. The thermoplastic polyimides derived from the aromatic diamines of this invention are characterized as having a high glass transition temperature, good mechanical properties and improved processability in the manufacture of adhesives, electronic and composite materials for use in the automotive and aerospace industry. The distinction of the novel aromatic diamines of this invention is the 2,2',6,6'-substituted biphenyl radicals which exhibit noncoplanar conformation that enhances the solubility of the diamine as well as the processability of the polyimides, while retaining a relatively high glass transition temperature and improved mechanical properties at useful temperature ranges.
    Type: Grant
    Filed: November 23, 1999
    Date of Patent: May 30, 2000
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventor: Chun-Hua K. Chuang
  • Patent number: 6066710
    Abstract: Disclosed is a method of making an imide-containing polymer by bulk or melt polymerizing monomers. A mixture is formed of (1) a cyclic compound that contains an anhydride group and a second group which is an anhydride, a carboxylic acid, or an ester and (2) a diamine in an amount stoichiometric .+-.5 mole % of stoichiometric with the amount of cyclic compound. An end capper may also be included in the mixture to control the molecular weight but no solvent is used. A polyimidesiloxane can be made by using a siloxane-containing diamine. The mixture is heated to a temperature above the T.sub.g or T.sub.m of the polymer but below its degradation temperature.
    Type: Grant
    Filed: October 29, 1998
    Date of Patent: May 23, 2000
    Assignee: Occidental Chemical Corporation
    Inventors: Kevin H. Becker, Jerold C. Rosenfeld