Abstract: Disclosed is system, method, and rack stand portion for the advantageous cooling of computer equipment 305. The rack stand 200 includes a hollow body 210, 212 that may be formed of cartridges 2416. Gas from an airflow source 5204 is guided into the rack stand body and then into a sealed case of the computer equipment. Air flow is then guided out of the computer equipment for recirculation, exhaust, or other purpose.

Abstract: An air conditioner is provided. The air conditioner may include an electronic device, which may include a control component to drive a refrigerant cycle, and a cooling tube through which a refrigerant to cool the electronic device may flow. The cooling tube may be coupled to one side of the electronic device. The electronic device may include an electronic case having at least one through hole, an electronic board to which the control component may be coupled, the electronic board being disposed in the electronic case, at least one heat transfer plate disposed to contact the control component, the at least one heat transfer plate being coupled to the electronic case, and at least one heat sink, to which the cooling tube may be coupled, the at least one heat sink contacting the at least one heat transfer plate through the at least one through hole.

Abstract: An air channeling sub-system may include a mechanical cooling section and a direct evaporative cooling section. The direct evaporative cooling section may be downstream from the mechanical cooling section. Cooling air is channeled through the air channeling sub-system and into the room. If a first set of control conditions is met, the air channeling sub-systems is operated in an adiabatic mode. The adiabatic mode includes channeling cooling air through the direct evaporative cooling section to evaporate water into the cooling air. If a second set of control conditions is met, the air channeling sub-system is operated in a hybrid mode. The hybrid mode includes channeling cooling air through the mechanical cooling section to remove heat from the cooling air and channeling the cooling air through the direct evaporative cooling section to evaporate water into the cooling air.

Abstract: Disclosed is system, method, and rack stand portion for the advantageous cooling of computer equipment 305. The rack stand 200 includes a hollow body 210, 212 that may be formed of cartridges 2416. Gas from an airflow source 5204 is guided into the rack stand body and then into a sealed case of the computer equipment. Air flow is then guided out of the computer equipment for recirculation, exhaust, or other purpose.

Abstract: A cooling container comprises a container housing with a chilled water storage tank including a first interface for receiving chilled water. The chilled water tank has a plurality of straight pipes joined by elbows connections to provide a folded path, the full path length being greater than the length of the container housing, and a second interface for outputting the chilled water. A number of interfaces within the container housing are configured to receive a chiller module or a free cool unit.

Abstract: A data center cooling system configured to cool one or more components of a data center thereby enabling a data center to be maintained at a higher overall temperature while still providing sufficient cooling to the components housed in the data center is disclosed. By maintaining the data center at a higher overall temperature, significant operational costs are realized due to savings in power costs. The data center cooling system may include one or more turbo-expanders having a rotary turbine positioned within a turbo-expander housing in which compressed air expands and drives the rotary turbine. The cooled expanded air is heated passing through a thermal transfer system that pulls heat from the data center component. The air is further heated passing through a brake system that generates heat by applying resistance to a shaft coupled to the rotary turbine. The heated air is exhausted outside of the data center.

Abstract: A small form factor computer chassis is disclosed. The computer chassis includes a solid bulkhead that separates the computer chassis cavity into two thermal chambers. According to certain embodiments, a radiator that is oriented along the XZ plane and is along a wall of computer chassis helps remove heat from a liquid coolant arriving form a cold plate associated with a CPU and/or a GPU.

Abstract: A thermal stabilization system for a packaged diode laser. An outer thermoelectric cooler (TEC) stabilizes the temperature of the laser package and an inner TEC stabilizes the temperature of the laser diode element of the packaged laser. The inner and outer TECs may be controlled by electronics which is also stabilized in temperature, for example using resistive heating. The packaged laser may be mounted on a heat spreader mounted on the outer TEC and may be surrounded by an insulated covering on all sides other than the surface mounted on the heat spreader. There may also be a thermally conductive cap over the packaged laser, with the insulation arranged outside the cap if both are present.

Abstract: Method and system are provided for controlling a scalable panel cooling system having multiple cooling panels for cooling heat-generating components housed in a support structure. The method includes: dividing the support structure into areas, each area of the support structure capable of housing a heat-generating component; for each area of the support structure: providing a cooling panel adjacent the area of the support structure; determining whether the area of the support structure is housing an operational heat-generating component; in the case that the area of the support structure is housing an operational heat-generating component, activating the cooling panel adjacent the area of the support structure housing the operational heat-generating component; and in the case that the area of the support structure is not housing a operational heat-generating component, deactivating the cooling panel adjacent the area of the support structure.

Abstract: A cooling system for a computer system comprises at least one unit such as a central processing unit (CPU) generating thermal energy and a reservoir having an amount of cooling liquid, said cooling liquid intended for accumulating and transferring of thermal energy dissipated from the processing unit to the cooling liquid. The cooling system has a heat exchanging interface for providing thermal contact between the processing unit and the cooling liquid for dissipating heat from the processing unit to the cooling liquid. Different embodiments of the heat exchanging system as well as means for establishing and controlling a flow of cooling liquid and a cooling strategy constitutes the invention of the cooling system.

Abstract: According to an example, a cooling system includes a cooling fluid reservoir, a cooling apparatus in fluid communication with the cooling fluid reservoir, a chamber having a side in thermal contact with a portion of the heat generating component, in which cooling fluid delivered by the cooling apparatus is to be heated through receipt of heat from the heat generating component, a cooling plate positioned at a distance and separated from the chamber, and a cooling fluid tube connecting the chamber and the cooling plate, in which the heated cooling fluid is to flow through the cooling fluid tube to the cooling plate. The cooling plate is also to be in thermal contact with a heat exchanger that that is to remove heat from the cooling fluid.

Abstract: Embodiments of an implantable device for delivering a therapeutic agent to a patient include a reservoir configured to contain a liquid comprising the therapeutic agent, and a cannula in fluid communication with the reservoir. The cannula is shaped to facilitate insertion thereof into a patient's eyeball.

Abstract: A refrigeration device includes a high-voltage electrical parts group having reactors and cooled elements, a low-voltage electrical parts group, a printed wiring board with the electrical parts groups mounted, and a refrigerant jacket that uses refrigerant flowing through the refrigerant circuit to cool the cooled elements. The high-voltage electrical parts group form an interleaved power supply circuit. The cooled elements are placed in an order conforming to a power supply path of the power supply circuit. The power supply circuit has a rectifier circuit, a power factor improvement circuit, smoothing capacitors, and an inverter circuit. The power factor improvement circuit has the reactors connected to each other in parallel and diodes and switching elements serving as the cooled elements connected to each of the reactors. The reactors are placed on an opposite side of the smoothing capacitors, with the diodes and the switching elements sandwiched in between.

Abstract: A system for controlling an atmospheric condition. The system includes: a pre-atmospheric conditioner configured to: collect ambient air and generate test air comprising the atmospheric condition for a first test computing device by modifying the ambient air. The system also includes an intake conduit, external to the first test computing device, configured to channel the test air to the first test computing device.

Abstract: A cooler 20 of a semiconductor device includes an inlet portion 27 and an outlet portion 28 for a cooling liquid, an inlet path 24, an outlet path 25, and a cooling flow path 26. The inlet path 24 and the outlet path 25 have asymmetrical planar shapes. A connection portion 271 between the inlet path 24 and the inlet portion 27 is opposed to the cooling flow path 26 of a part immediately below plural circuit substrates 13 arranged on the cooler 20. A connection portion 281 between the outlet path 25 and the outlet portion 28 is opposed to the cooling flow path 26 of a part immediately below plural circuit substrates 13 arranged on the cooler 20.

Abstract: A cooling container comprises a container housing with a chilled water storage tank including a first interface for receiving chilled water. The chilled water tank has a plurality of straight pipes joined by elbows connections to provide a folded path, the full path length being greater than the length of the container housing, and a second interface for outputting the chilled water. A number of interfaces within the container housing are configured to receive a chiller module or a free cool unit.

Abstract: A system for controlling an atmospheric condition. The system includes: an exhaust conduit, external to a first test computing device, configured to channel exhaust from the first test computing device. Further, the system includes a primary atmospheric conditioner, external to the first test computing device, configured to generate test air comprising the atmospheric condition for the first test computing device by modifying the exhaust. Further still, the system also includes an intake conduit, external to the first test computing device, configured to channel the test air to the first test computing device.

Abstract: A case for cooling a portable electronic device, the case including a housing and a cartridge. The housing holds the electronic device and has a cartridge compartment for retaining the cartridge. The cartridge includes sets of compartments for retaining substances configured to generate an endothermic reaction when mixed or combined. Pairs of compartments are separated by a divider configured to be selectively breached. The duration of the cooling effect may be extended by periodically breaching dividers of additional compartment pairs. The magnitude of the cooling effect may be increased by breaching multiple compartment pairs at once. The case may also include electronic components for monitoring the temperature of the electronic device and automatically initiating an endothermic reaction when the temperature reaches a predetermined threshold.

Abstract: The invention relates to a vehicle, having a cooling air duct disposed within a battery to move cooling air for cooling the battery, so as to enable same to be compact and improve space utilization, in order to optimize cooling performance within a limited space. The vehicle of the present invention also includes a battery-cooling unit that exchanges heat and cools air ventilated from the passenger compartment and then supplies the air to the battery, so as to use the air from the passenger compartment with minimal effects on the air temperature in the passenger compartment, and more efficiently cool the battery. Further, the vehicle and method for controlling same according to the present invention can detect the temperatures of the battery and of the passenger compartment, and determine whether to cool the air in the passenger compartment using a heat exchanger in accordance with each detected temperature, or control the rotation speed of a ventilation fan, in order to more efficiently cool the battery.

Abstract: Technologies are generally described for devices, methods, and programs for heat dissipating utilizing flow of refrigerant. An example heat dissipating device includes a conductive chamber to receive a fluid refrigerant, and the conductive chamber itself includes an evaporation portion having an interior layer and an exterior layer that is in contact with a heat generating unit, a condensation portion, and a rotatable brush that is configured inside of the conductive chamber to have an axis that is parallel to the interior layer of the evaporation portion and that is further configured to sweep across the interior layer of the evaporation portion to form a thin film of the fluid refrigerant.

Abstract: In a refrigeration apparatus, a main surface of a printed wiring board has a heavy electric region, which is a region in the lower part of the printed wiring board where a heavy electric component group is disposed, and a light electric region, which is a region positioned above the heavy electric region, where a light electric component group is disposed. A refrigerant jacket contacts a power device which is disposed in the heavy electric region. A liquid pipe of the refrigerant pipe includes a portion that extends upwards towards the refrigerant jacket, and a cooling portion contacts the refrigerant jacket.

Abstract: In accordance with embodiments of the present disclosure, an information handling system may include a processor, one or more information handling resources communicatively coupled to the processor, and a management controller communicatively coupled to the processor. The management controller may have stored thereon at least one of a power table comprising parameters for power management of the one or more information handling resources and a thermal table comprising parameters for thermal management of the one or more information handling resources, and firmware comprising instructions executable on the management controller and configured to enable a user of the information handling system to, during runtime of the management controller, create a virtual power and thermal table capable of storing one or more entries, each entry setting forth power parameters and thermal parameters for an information handling resource.

Abstract: Systems and methods for cooling include one or more computing structure, an inter-structure liquid cooling system that includes valves configured to selectively provide liquid coolant to the one or more computing structures; a heat rejection system that includes one or more heat rejection units configured to cool liquid coolant; and one or more liquid-to-liquid heat exchangers that include valves configured to selectively transfer heat from liquid coolant in the inter-structure liquid cooling system to liquid coolant in the heat rejection system. Each computing structure further includes one or more liquid-cooled servers; and an intra-structure liquid cooling system that has valves configured to selectively provide liquid coolant to the one or more liquid-cooled servers.

Abstract: Generally, apparatuses, systems, and methods are described to prime a refrigerant pump by decoupling or shielding from a condenser operation, such as for example the condenser water pump, so that liquid refrigerant can be appropriately sourced from the condenser and/or the evaporator using flow control device(s) such as a source valve on a source line of the condenser and/or on a source line of the evaporator and the control of such valve(s).

Abstract: Generally, apparatuses, systems, and methods are described that are directed to accessing liquid refrigerant from an evaporator to source a refrigerant pump and pump line to cool and lubricate such moving parts that may be part of the compressor, for example the compressor motor and the compressor bearings, and/or for cooling drives such as an adjustable or variable frequency drive.

Abstract: A cooling apparatus is provided, which includes: a thermal conductor to cool a heat-dissipating component(s) of an electronics enclosure, the enclosure including an air inlet side through which airflow ingresses. The thermal conductor includes a first conductor portion coupled to the heat-dissipating component(s), and a second conductor portion positioned along the enclosure's air inlet side. The apparatus further includes one or more air-cooled heat sinks coupled to the second conductor portion to facilitate transfer of heat from the second conductor portion to the airflow ingressing into the enclosure, and one or more thermoelectric devices coupled to at least one of the first or second conductor portions to selectively provide auxiliary cooling.

Abstract: Method and system are provided for controlling a scalable panel cooling system having multiple cooling panels for cooling multiple heat-generating components housed in a support structure. The method includes: dividing a support structure into areas, each area capable of housing one or more heat-generating component; providing a cooling panel adjacent an area of the support structure, a cooling panel being operable to cool the one or more heat-generating components housed in the area; determining whether an area of the support structure is housing one or more operational heat-generating components; and activating a cooling panel adjacent an area housing one or more operational heat-generating components; and de-activating a cooling panel adjacent an area housing no operational heat-generating components.

Abstract: Some modular heat-transfer systems can have an array of at least one heat-transfer element being configured to transfer heat to a working fluid from an operable element. A manifold module can have a distribution manifold and a collection manifold. A decoupleable inlet coupler can be configured to fluidicly couple the distribution manifold to a respective heat-transfer element. A decoupleable outlet coupler can be configured to fluidicly couple the respective heat-transfer element to the collection manifold. An environmental coupler can be configured to receive the working fluid from the collection manifold, to transfer heat to an environmental fluid from the working fluid or to transfer heat from an environmental fluid to the working fluid, and to discharge the working fluid to the distribution manifold.

Abstract: A system for performing computing operations includes a rack that rests on a floor and a stabilization device coupled on the top of the rack. The stabilization device includes a mounting portion coupled to the rack, a ballast member, and one or more spring devices coupled between the ballast member and the mounting portion. The ballast member reduces displacement of the rack from seismic loads transmitted from the floor to the rack to mitigate effects of the seismic loads on the rack.

Abstract: A cooling apparatus includes N (N is an integer of 2 or larger) refrigerant storage units arranged in a vertical direction and configured to store refrigerants, a condensation unit disposed above the N refrigerant storage units, a steam pipe for circulating gas phase refrigerants flowing out of the N refrigerant storage units to the condensation unit, a liquid pipe for circulating a liquid phase refrigerant flowing out of the condensation unit to an uppermost refrigerant storage unit, and separation piping for circulating a liquid phase refrigerant flowing out of an upper refrigerant storage unit to a lower refrigerant storage unit. The liquid phase refrigerant flows into each refrigerant storage unit via an inlet, and flows out from the refrigerant storage unit via a first connection port formed below the inlet.

Abstract: Embodiments of the present disclosure refers to an electronic device, comprising a first bracket that is made of a first material having a thermal conductivity greater than a first threshold and has therein at least one passage including a chamber; wherein the first bracket and the chamber define a closed space in which a cooling medium having a thermal conductivity greater than a second threshold is able to circulate; and wherein the chamber is provided with a driving body at at least one side wall of the chamber and the driving body is deformable under a perdetermined condition to change a capacity of the chamber so as to drive the cooling medium to flow.

Abstract: A scalable liquid submersion cooling system for electronics. The system includes a plurality of modular system components, such as electronics enclosures, manifolds, pumps, and heat exchanger units. The modular system components permit the liquid submersion cooling system to be scaled up or down to accommodate changing needs. In addition, the modularity of the components facilitates portability, allowing relatively easy transport and set-up/break-down of electronic systems.

Abstract: An air condition system includes a casing, a first heat exchanger, a fan and a second heat exchanger. A host is held by the casing. The first heat exchanger is disposed inside the casing. Air flows into the casing, and is processed by the first heat exchanger. Then, the air processed by the heat exchange procedure flows forward the host. The fan exhausts the air passing through the host. The second heat exchanger disposed on the fan and inside the casing. The air exhausted by the fan is processed by the second heat exchanger, and flows out of the casing by wind force of the fan.

Abstract: Flexible data center systems and methods of deployment are provided. A flexible data center (100, 200) including T rows of server racks (106, 206, 306) can be deployed by constructing a number B of blocks (101, 201). Constructing each block (101, 201) can include constructing from one to a number P of perimeter structures (104, 204, 304) each housing up to a number R of rows of server racks (106, 206, 306). Constructing each block (102, 201) can include constructing a connecting structure (102, 202) connected to the perimeter structures (104, 204, 304), the connecting structure (102, 202) housing operations monitoring equipment (108, 208) for the server racks (106, 206, 306). A total integer number T/R of perimeter structures (104, 204, 304) can be constructed for the flexible data center (100, 200). At most one perimeter structure (10, 204, 304) houses less than R rows of server racks (106, 206, 306). B is equal to an integer number (T/R)/P.

Abstract: A process liquid changing method is provided for changing process liquids in a substrate processing apparatus including storage tank, a circulation line with a circulation pump, and a process liquid supply nozzle connected to the circulation line through a branch line. The method includes: discharging the process liquid in the storage tank; discharging a process liquid remaining in the circulation line from a drain connected to the circulation line at a second position of the circulation line, while supplying a purge gas to the circulation line at a first position of the circulation line, wherein the first position is located upstream of a junction area where the branch line is connected to the circulation line, and the second position is located downstream of the junction area and upstream of the storage tank; and supplying a process liquid into the storage tank.

Abstract: An electronic device is provided that includes a base having a first side and a second side, and a lid having a first side and a second side. A hinge device may couple to the base and the lid, and may allow the lid to move relative to the base between the closed state and the opened state. A heat exchange device may be adjacent to the hinge device in an area between the base and the lid. The heat exchange device may receive heat from a component in the base.

Abstract: A method is provided which includes providing a coolant-conditioning unit which includes a facility coolant path, having a facility coolant flow control valve, and a system coolant path accommodating a system coolant, and having a bypass line with a system coolant bypass valve. A heat exchanger is coupled to the facility and system coolant paths to facilitate transfer of heat from the system coolant to facility coolant in the facility coolant path, and the bypass line is disposed in the system coolant path in parallel with the heat exchanger. A controller automatically controls a regulation position of the coolant bypass valve and a regulation position of the facility coolant flow control valve based on a temperature of the system coolant, and automatically adjusts the regulation position of the system coolant bypass valve to facilitate maintaining the facility coolant flow control valve at or above a specified, partially open, minimum regulation position.

Abstract: Air conditioning systems and techniques are described that include passing a fluid through a slab. The fluid is cooled in the slab and the cooled fluid is circulated to a coil. The coil is arranged in an airflow such that ambient air passes over the coil, thereby reducing the relative humidity of the ambient air. A control unit may also be provided to selectively operate a pump to control the flow of the fluid through the slab.

Abstract: A data center module is a data center that can be prefabricated using generally standardized off-the-shelf components, and quickly assembled on a collocation site where a shared central facility is provided. The data center module is typically configured to be deployed with other identical data center modules around the central facility both in side-to-side and/or in back-to-back juxtapositions, typically without the need for interleaving space between adjacent modules in order to maximize real estate use. Each data center module typically comprises harden party walls, several floors for accommodating all the necessary electrical and cooling subsystems and for accommodating all the computing machinery (e.g. servers). Though all the data center modules share similar physical configuration, each data center module can be independently customized and operated to accommodate different needs.

Abstract: An exemplary power electronics module includes a first power electronics element that generates a first heat flow during operation of the power electronics module, a second power electronics element that generates a second heat flow during operation of the power electronics module. The first cooler is in thermal contact with the first power electronics element to receive at least part of the first heat flow. The second cooler is in thermal contact with the second power electronics element to receive at least part of the second heat flow. A heat exchanger is configured to transmit at least part of the first heat flow and the second heat flow to a primary cooling flow and transfer heat flow in a thermally efficient manner. A magnitude of the heat flow is less than a total magnitude that is formed from a maximum first heat flow and a maximum second heat flow.

Abstract: An integrated platform assembled with different electrical cabinets and components mounted on a framework in order to provide a complete datacenter critical power distribution package. The integrated platform supports the weight of cabinet enclosures and UPSs mounted onto a skeletal framework, which acts as an equipment support structure and a cable routing support system. Main and redundant power supply wiring is routed along the skeletal framework to and between the cabinet enclosures and the UPSs mounted thereon. Electrical connections between the cabinets are internally connected via bus bars as switchgear cabinets. The skeletal framework has top and bottom rails run substantially parallel to each other with cross bars connecting the top and bottom rails and a top horizontal surface to which one or more of the cabinet enclosures are mounted. The skeletal framework and cabinet enclosures are fabricated prior to installation and installed as a monolithic pre-wired pre-assembled integrated platform.

Abstract: In accordance with these and other embodiments of the present disclosure, a controller for thermal control of an enclosure comprising one or more storage resources may be configured to receive an indication of a physical quantity indicative of a power delivered from at least one power supply module to information handling resources of the enclosure. The controller may also be configured to, based on the physical quantity indicative of the power delivered from the at least one power supply module, determine a desired rate of the flow of air from at least one air mover configured to cool one or more storage resources received by the enclosure by delivering a flow of air within the storage enclosure and cause the at least one air mover to deliver the flow of air in accordance with the desired rate.

Abstract: A semiconductor device includes a semiconductor chip and a first material including molecules that are configured to absorb thermal energy by reversibly changing a spatial molecular structure of the molecules.

Abstract: According to one embodiment, a system for removing heat from a rack of information technology equipment may include a sidecar indoor air to liquid heat exchanger that cools air utilized by the rack of information technology equipment to cool the rack of information technology equipment. The system may also include a liquid to liquid heat exchanger and an outdoor heat exchanger. The system may further include configurable pathways to connect and control fluid flow through the sidecar heat exchanger, the liquid to liquid heat exchanger, the rack of information technology equipment, and the outdoor heat exchanger based upon ambient temperature and/or ambient humidity to remove heat generated by the rack of information technology equipment.

Abstract: A system of efficiently and safely generating and storing energy from the weight and motion of a moving vehicle across a roadway. It is a object of the present invention to transform energy in the form of pressure, weight, or movement, for example, produced by moving vehicles into air pressure, store it, and subsequently convert the energy into the type of usable energy typically desired by cities, municipalities or private entities. In an embodiment, pressurized air is utilized. In another embodiment, magnetoelectric energy is utilized.

Abstract: A joint is provided between two abutting cables, where the cables each have, around a central support, at least one phase layer composed of at least one layer of superconducting material and a neutral layer that are concentric and contained in a shell, filled with cryogenic fluid. The neutral layer of each cable is also stripped, at least one bridging support member is placed between the stripped neutral layers, and a layer of conducting or superconducting material, for, the electrical connection of these neutral layers, is placed on the support member.

Abstract: The embodiments of the present invention provide an insert box with front and rear insertion and a heat dissipation method of the insert box. The insert box includes a front board area, a backboard, and a rear board area. A first air flow passing from a first wind inlet at an upper end portion at a front side of the insert box passes through one of the front board area and the rear board area; and a second air flow passing from a second wind inlet at a lower end portion at the front side of the insert box passes through the other one of the front board area and the rear board area.

Abstract: Cooling methods are provided which include providing: one or more coolant-cooled structures associated with an electronics rack, a coolant loop coupled in fluid communication with one or more passages of the coolant-cooled structure(s), one or more heat exchange units coupled to facilitate heat transfer from coolant within the coolant loop, and N controllable components associated with the coolant loop or the heat exchange unit(s), wherein N?1. The N controllable components facilitate circulation of coolant through the coolant loop or transfer of heat from the coolant via the heat exchange unit(s). A controller is also provided to dynamically adjust operation of the N controllable components, based on Z input parameters and one or more specified constraints, and provide a specified cooling to the coolant-cooled structure(s), while limiting energy consumed by the N controllable components, wherein Z?1.

Abstract: Cooling apparatuses and methods are provided which include one or more coolant-cooled structures associated with an electronics rack, a coolant loop coupled in fluid communication with one or more passages of the coolant-cooled structure(s), one or more heat exchange units coupled to facilitate heat transfer from coolant within the coolant loop, and N controllable components associated with the coolant loop or the heat exchange unit(s), wherein N?1. The N controllable components facilitate circulation of coolant through the coolant loop or transfer of heat from the coolant via the heat exchange unit(s). A controller is coupled to the N controllable components, and dynamically adjusts operation of the N controllable components, based on Z input parameters and one or more specified constraints, to provide a specified cooling to the coolant-cooled structure(s), while limiting energy consumed by the N controllable components, wherein Z?1.

Abstract: Dehumidifying cooling apparatus and method are provided for an electronics rack. The apparatus includes an air-to-liquid heat exchanger disposed at an air inlet or outlet side of the rack and positioned for air passing through the electronics rack to pass across the heat exchanger. The heat exchanger is in fluid communication with a coolant loop for passing coolant therethrough at a temperature below a dew point temperature of the air passing across the heat exchanger so that air passing across the heat exchanger is dehumidified and cooled. A condensate collector, disposed below the heat exchanger, collects liquid condensate from the dehumidifying of air passing through the electronics rack, wherein the heat exchanger includes a plurality of sloped surfaces configured to facilitate drainage of liquid condensate from the heat exchanger to the condensate collector.