Thermoelectric; E.g., Peltier Effect Patents (Class 62/3.2)
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Publication number: 20090266085Abstract: A refrigeration device for compostable materials, comprising, a recycling bin adapted to receive compostable materials, a liner element adapted to receive the recycling bin; and refrigeration means adapted for cooling the liner element wherein when compostable materials are positioned within the recycling bin and the recycling bin is positioned within the liner element, the refrigeration means cools the liner element, the recycling bin and the compostable materials positioned therein.Type: ApplicationFiled: April 15, 2009Publication date: October 29, 2009Inventors: Robert Jason Goodwin, Reginald Joseph Leblanc
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Patent number: 7609732Abstract: The present invention is to provide a control algorithm of a thermo-electric cooler (TEC) for a laser diode (LD) where a rush current accompanied with the stepwise change of the target temperature of the TEC. First, the controller stops the TEC driver prior to the setting of the target temperature, and sets the present temperature of the LD. Subsequently, the controller gradually increases the reference temperature of the TEC in stepwise to the target temperature. Thus, the controller suppresses the rush current accompanied with the instantaneous increase of the reference temperature of the TEC.Type: GrantFiled: September 27, 2007Date of Patent: October 27, 2009Assignee: Sumitomo Electric Industries Ltd.Inventor: Hiroto Ishibashi
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Publication number: 20090260358Abstract: A system for generating electrical energy using a naturally occurring temperature difference is disclosed. The system provides electrical energy by thermally coupling a conduit that conveys hot material from a petroleum reserve and cold deep-level water to opposing sides of a thermoelectric element. The thermoelectric element generates electrical energy based on the temperature difference between these two surfaces.Type: ApplicationFiled: March 26, 2009Publication date: October 22, 2009Applicant: LOCKHEED MARTIN CORPORATIONInventors: John W. Rapp, Robert James Howard, Nicholas J. Nagurny, Natalie Levings, Lance Greer
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Publication number: 20090250202Abstract: Device and method for regulating the temperature of a substrate, in particular of a wafer, by means of a device comprising two temperature-regulating circuits that are operated with different temperature-regulating fluids.Type: ApplicationFiled: October 17, 2006Publication date: October 8, 2009Inventor: Markus Eibl
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Publication number: 20090236326Abstract: A heat pipe cooling system adapted for exemplary use with a gas metal arc welding torch, includes a container enclosing a capillary structure and quantity of working fluid, and functions to accelerate the dissipation of heat energy from a heated zone generated by the torch through the vaporization and condensation of the fluid and the capillary action of the structure.Type: ApplicationFiled: March 19, 2008Publication date: September 24, 2009Applicant: GM GLOBAL TECHNOLOGY OPERATIONS, INC.Inventor: Jay Hampton
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Publication number: 20090237619Abstract: In at least one embodiment of the disclosure, a liquid-cooling device to cool an optical element in a projector includes an optical element holding member configured to allow a flow of a cooling liquid therein and to hold the optical element so as to transfer heat to the cooling liquid. A liquid pumping unit is configured to circulate the cooling liquid. Liquid circulation members are configured to connect the optical element holding member and the liquid pumping unit and to define a flow channel of the cooling liquid. A thermoelectric conversion element has a heat-absorbing surface and a heat-radiating surface. The thermoelectric conversion element is connected to the liquid-cooling device to transfer the heat from the cooling liquid to the heat-absorbing surface.Type: ApplicationFiled: March 18, 2009Publication date: September 24, 2009Applicant: Seiko Epson CorporationInventors: Yoshiyuki Yanagisawa, Yasunaga Momose
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Patent number: 7588549Abstract: A waterless blood heater/cooler device directly controlling temperature of blood flowing through an extracorporeal blood circuit. A thermoelectric module is coupled to a supply voltage to generate a temperature difference. A heat exchanger cassette comprising a core and first and second laminar flow guides is in thermal contact (directly or indirectly) with the thermoelectric module. The cassette has a plurality of tubes for carrying parallel channels of the blood. The first and second laminar flow guides provide an inlet and an outlet for coupling to the extracorporeal blood circuit and respective intermediate chambers for receiving respective ends of the tubes in order to guide the blood to and from respective tubes in a substantially laminar flow.Type: GrantFiled: August 3, 2006Date of Patent: September 15, 2009Assignee: Terumo Cardiovascular Systems CorporationInventor: Rolando A. Eccleston
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Patent number: 7587902Abstract: A number of compact, high-efficiency and high-power density thermoelectric systems utilizing the advantages of thermal isolation are described. Such configurations exhibit high system efficiency and power density. Some configurations exhibit a substantial reduction in the amount of thermoelectric material required.Type: GrantFiled: May 24, 2005Date of Patent: September 15, 2009Assignee: BSST, LLCInventor: Lon E. Bell
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Publication number: 20090223548Abstract: A thermionic or thermotunneling converter consisting of two electrodes maintained at a desired distance from one another by means of spacers in which the electrodes comprise silicon coated with a hard material, or comprise a ceramic or other refractory material. The spacers are formed by oxidizing one electrode, protecting certain oxidized areas and removing the remainder of the oxidized layer. The protected oxidized areas remain as spacers. These spacers have the effect of maintaining the electrodes at a desired distance without the need for active elements, thus greatly reducing costs.Type: ApplicationFiled: October 4, 2006Publication date: September 10, 2009Applicant: BOREALIS TECHNICAL LIMITEDInventor: Hans Juergen Walitzki
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Patent number: 7581404Abstract: A system includes at least one hard disk drive (HDD) controlling the temperature of an internal thermal zone. The HDD preferably includes a thermal controller directing a thermoelectric device based upon a temperature measure of internal thermal zone. The thermoelectric device thermal-couples via thermal interface to internal thermal zone and to air exterior to HDD, providing a first heat transfer to remove heat from the internal thermal zone and providing a second heat transfer to add heat to the internal thermal zone. The thermal controller directs the thermoelectric device to provide the first heat transfer, when the temperature measure is above a top operating temperature, and directs the thermoelectric device to provide the second heat transfer, when the temperature measure is below a bottom operating temperature. The system may be a RAID, server computer, desktop computer, and notebook computer. Manufacturing these systems. The systems as manufacturing products.Type: GrantFiled: June 13, 2006Date of Patent: September 1, 2009Assignee: Samsung Electronics Co., Ltd.Inventors: Michael Sullivan, George Tyndall
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Publication number: 20090213538Abstract: A graphics card includes a graphics processing unit (GPU), a heat dissipation fin, an electric cooling module and a thermoelectric generator. The electric cooling module has a cold side and a hot side. The cold side contacts the GPU, and the hot side contacts the heat dissipation fin. The thermoelectric generator contacts the heat dissipation fin and is electrically connected to the electric cooling module. Furthermore, a method for dissipating the heat of the graphics card is also disclosed herein.Type: ApplicationFiled: February 4, 2009Publication date: August 27, 2009Applicant: ASUSTEK COMPUTER INC.Inventor: Sheng-Hung Wang
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Publication number: 20090211152Abstract: A device for keeping cut flowers in condition comprises a holder (10) for receiving the cut flowers therein in a suitable medium, in particular water. Cooling means (21, 22) comprise a cooling body (22) which is capable of heat-exchanging contact with at least a part of a wall of the holder for cooling the medium therein. The holder has a bottom with a channel (13) for releasably receiving the cooling body (22) therein. In a method for displaying cut flowers such a holder is placed together with flowers received therein on a cooling body and, when deterioration is imminent, exchanged for a similar holder with a fresh bouquet of flowers.Type: ApplicationFiled: June 9, 2006Publication date: August 27, 2009Applicant: Vital Flowers Patent B.V.Inventors: Gerardus Johannes Jozef Maria Meeuws, Anton Koning, Johannes Petrus Franciscus Maria Burgmans, Renier Cornelius Petrus Helena Jamers
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Publication number: 20090204271Abstract: The invention relates to a cooling device for a reaction chamber for processing a biochip and to a method for controlling said cooling device. The cooling device (50) according to the invention comprises a cooling piston (51), a cooling unit (52) for cooling the cooling piston (51) and a drive (53) for displacing the cooling piston (51) or the reaction chamber in such a manner that the cooling piston can be brought into contact with a wall of the reaction chamber (5) and can be removed again. The cooling device (50) according to the invention allows high cooling rates and a high reproducibility of cooling processes. It has a simple design and can be reliably used in portable devices for examining biochips.Type: ApplicationFiled: June 27, 2007Publication date: August 13, 2009Applicant: ZENTERIS GMBHInventors: Jana Lepschi, Jens Gohring, Stefan Heydenhaus, Manuel Ullrich
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Publication number: 20090199571Abstract: In an embodiment, a system is provided. The system includes a heat exchanger including a thermal exchange block having a top surface and a bottom surface. The system further includes a first thermoelectric cooler abutting the top surface of the thermal exchanger block and a first heat sink thermally coupled to the first thermoelectric cooler. The system also includes a second thermoelectric cooler abutting the bottom surface of the thermal exchanger block and a second heat sink thermally coupled to the second thermoelectric cooler.Type: ApplicationFiled: December 3, 2008Publication date: August 13, 2009Inventors: John Creech, Jason Drees, Ryan Koenig
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Patent number: 7573706Abstract: An external expanding apparatus or “docking station” operable with a portable computer device of a type having a display unit having a display screen on an inner surface thereof and a hard shell backing surface opposite thereof and pivotally mounted on a substantially rigid casing having a pair of locating holes adjacent to opposite corners of a substantially planar bottom surface thereof, and an input/output (I/O) connector positioned on a back plane thereof with a pair of positioning apertures provided on opposite sides thereof.Type: GrantFiled: July 31, 2006Date of Patent: August 11, 2009Inventor: Jeffrey D. Carnevali
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Patent number: 7571616Abstract: A cooling apparatus for articles operated at low temperatures comprises a refrigerating machine and a cold head provided in the refrigerating machine. A first Peltier element is thermally contacted and fixed with the cold head, and a second Peltier element is thermally contacted and fixed with the cold head. A first article can be arranged with the first Peltier element with being thermally contacted therewith, and a second article can be arranged with the second Peltier element with being thermally contacted therewith. The cold head is cooled to low temperatures by the refrigerating machine, and temperatures of the first article and the second article each is further controlled by the first Peltier element and the second Peltier element, respectively, to thereby cool the articles to different temperatures.Type: GrantFiled: April 25, 2005Date of Patent: August 11, 2009Assignee: Fujitsu LimitedInventors: Kazunori Yamanaka, Teru Nakanishi
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Publication number: 20090188259Abstract: An integrated thermoelectric cooling element and a positive temperature coefficient heating element are integrated into a single package. A heat sink is shared between the thermoelectric cooling element and the positive temperature coefficient.Type: ApplicationFiled: November 15, 2007Publication date: July 30, 2009Applicant: SCHUKRA OF NORTH AMERICA, LTD.Inventors: Renato Colja, Jianlin Zhang, Corina Alionte
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Publication number: 20090188306Abstract: The present invention is directed to an analyzer for measuring the vapor pressure of a hydrocarbon liquid. The analyzer includes a pressure measuring system connected to an air saturation system having a circulation chamber with opposing first and second ends. A first opening is disposed toward the first end and a second opening is disposed toward the second end. A plumbing system connects the first and second openings. A pump moves the hydrocarbon liquid through the plumbing system from the first opening to the second opening so as to saturate the hydrocarbon liquid with air. The air saturation system has a cooler for cooling the hydrocarbon liquid and the pressure measuring system has a heater for heating the hydrocarbon liquid. The pump may be a piston actuated pump or a motor-driven pump and the plumbing system may include an aeration chamber.Type: ApplicationFiled: August 1, 2008Publication date: July 30, 2009Applicant: ABB INC.Inventors: Thomas J. Thomas, Terry E. Davis
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Patent number: 7562533Abstract: A method for transferring heat from a first location to a second location includes thermoelelectrically transferring heat from the first location to a third location; and transferring heat from the third location to the second location through a magneto-hydrodynamic (MHD) flow. A cooling system includes a thermoelectric cooling (TEC) component; and a magnetohydrodynamic (MHD) component, wherein the MHD component and the TEC component are in thermal contact.Type: GrantFiled: July 17, 2006Date of Patent: July 21, 2009Assignee: Sun Microsystems, Inc.Inventor: Chien Ouyang
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Publication number: 20090179042Abstract: A smoothie dispenser (20, 20S, 20A) comprises a frame (22); a smoothie receptacle storage section (24); and a receptacle conformed chiller section (26). The smoothie receptacle storage section (24) is provided within the frame (22) and configured to house plural smoothie receptacles (30) at a first temperature. The chiller section (26) is arranged to receive a selected smoothie receptacle released from the smoothie receptacle storage section and configured to crystallize contents of the selected smoothie receptacle. The receptacle conformed chiller section (26) is “receptacle conformed” in the sense that a surface of the chiller section is configured to conform to (e.g., have a surface of shape to mate with or to form substantially greater than linear contact with) at least a portion an exterior profile or periphery of the selected smoothie receptacle.Type: ApplicationFiled: October 27, 2008Publication date: July 16, 2009Applicant: PARADISE SMOOTHIE, INC.Inventors: Michael Milan, Robert C. Hendricks, Jack Durban
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Publication number: 20090173082Abstract: A device for simultaneously generating electrical power and cooling, including an active layer for intrinsically transducing thermal energy into electrical energy, a first electrical contact having a first work function and a second electrical contact having a second work function, a first electron diffusion barrier positioned between and in electric communication with the active layer and the first electrical contact, and a second electron diffusion barrier positioned between and in electric communication with the active layer and the second electrical contact. The first work function and the second work function are nonidentical. Transduction of thermal energy into electrical energy yields thermally generated electrical carriers of both positive and negative charge, wherein thermally generated electrical carriers are separated according to charge to either the first electrical contact or the second electrical contact, thereby lowering the average thermal energy of the active layer.Type: ApplicationFiled: December 12, 2008Publication date: July 9, 2009Inventor: Matthew Rubin
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Patent number: 7554808Abstract: An apparatus may include a thermally-conductive heat sink core having at least one surface, a solid-state heat pump including a first surface and a second surface, the first surface in contact with the at least one surface of the core, and a thermally-conductive unit in contact with the second surface of the solid-state heat pump. Also included may be a stop in contact with the thermally-conductive unit, disposed at least partially over the first end of a cavity defined by the thermally-conductive unit, and defining an opening, and a fastener passing through the cavity, in contact with the core, and to bias the core toward the stop.Type: GrantFiled: June 22, 2006Date of Patent: June 30, 2009Assignee: Intel CorporationInventors: Brian A. Scott, Paul J. Gwin, Ioan Sauciuc
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Publication number: 20090158750Abstract: A method of addressing environmental warming and generating power, including positioning a device for generating electrical power in an environment experiencing undesired warming, the device including an active layer for intrinsically transducing thermal energy into electrical energy, and first and second electrical contacts having different work functions, respective first and second electron diffusion barriers positioned between and in electric communication with the active layer and respective first and second electrical contacts, wherein thermally generated electrons are separated to the first electrical contact and holes are separated to the second electrical contact, and wherein the introduction of thermal energy to the active layer increases the rate at which electron-hole pairs are formed, connecting the device to a power grid, removing thermal energy from the environment via conversion into electricity, and supplying electricity to the power grid, wherein the removal of thermal energy from the enviroType: ApplicationFiled: December 12, 2008Publication date: June 25, 2009Inventor: Matthew Rubin
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Patent number: 7551435Abstract: Electronic components differing in height (a CPU 2a, a capacitor 2b, and coil elements 2c) are mounted on a printed circuit board 1. A heat-absorbing member 3 is provided above the printed circuit board 1 in such a way that the member 3 contacts not only the top surface of the CPU 2a that is the shortest but the sides of the capacitor 2b and the coil elements 2c. To circulate a cooling medium, a flow path 4 is formed in the heat-absorbing member 3. Heat generated at the CPU 2a is transmitted from its top surface to the cooling medium in the flow path 4 via the heat-absorbing member 3; heat generated at the capacitor 2b and the coil elements 2c is transmitted from their sides to the cooling medium in the flow path 4 via the heat-absorbing member 3.Type: GrantFiled: September 11, 2007Date of Patent: June 23, 2009Assignee: Fujitsu LimitedInventors: Jun Taniguchi, Hiroki Uchida, Hideshi Tokuhira, Minoru Ishinabe, Masanobu Ishiduka, Hiroaki Date, Masatomo Asano, Nobuhiro Nanri
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Publication number: 20090151321Abstract: An electrical power generation system incorporates thermoelectric devices (TE Devices) for electrical power generation adjacent a flow path heat exchanger (HEX) adjacent to a vehicle flowpath structure such as a scramjet flow path to take advantage of the waste heat, high thermal gradients, and available, unused volume. A thermally conductive material communicates thermal energy from a vehicle external skin structure to the TE Device while a thermally conductive compliant material allows the TE Device to “float” with minimal mechanical stress.Type: ApplicationFiled: December 13, 2007Publication date: June 18, 2009Inventors: David C. Jarmon, Mark A. Sillence, Paul Attridge, Jean Yamanis
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Publication number: 20090151891Abstract: A portable cold and hot water supply device. A container body includes a fluid inlet, a fluid outlet, a first chamber, a second chamber, and a valve sphere. The first chamber connects to the fluid inlet and includes a circular connecting hole. The second chamber connects to the fluid outlet and connects to the first chamber via the circular connecting hole. The diameter of the valve sphere exceeds that of the circular connecting hole. The valve sphere is rotatably disposed between the first and second chambers and is detachably engaged in the circular connecting hole, controlling connection between the first and second chambers. A power supply device is electrically connected to a controller. A thermoelectric semiconductor chip abuts the second chamber of the container body and is electrically connected to the power supply device.Type: ApplicationFiled: November 10, 2008Publication date: June 18, 2009Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Hsin-Hung Li, Jung-Ya Hsieh, Chun-Chien Ting, Yung-Feng Nien
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Publication number: 20090120104Abstract: The present invention discloses a thermal block unit for thermal treatment of samples comprising temperature regulating units, temperature sensors for measuring temperature at different locations of the thermal block unit, a converter for converting signals from the temperature sensors into digital signals and a thermal block interface for communicating with an instrument.Type: ApplicationFiled: November 10, 2008Publication date: May 14, 2009Applicant: ROCHE MOLECULAR SYSTEMS, INC.Inventor: Paul Federer
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Publication number: 20090120961Abstract: The present invention relates to a multiple chilled alcoholic beverages dispenser system comprising: at least two independent sources of alcoholic beverage each stored in a separate container (29, 26); a cooling system (10, 23, 27, 29) through which the at least two independent sources of alcoholic beverage pass (29) before dispensing; and dispenser means (13a, 13b) wherein the cooling system comprises a single chamber (10) through which the at least two independent sources of alcoholic beverage pass before reaching the dispenser means.Type: ApplicationFiled: May 19, 2005Publication date: May 14, 2009Applicant: DIEAU-EDAFIMInventors: Eric Dietschi, Eric Fournier, Alexandre Pereira
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Publication number: 20090118869Abstract: Various embodiments of the invention are directed toward a heating and cooling system for pet living spaces, which is easily transportable and is efficient in heating and cooling the pet because it heats and cools both the air surrounding the pet and the surfaces that the pet lays upon.Type: ApplicationFiled: March 22, 2006Publication date: May 7, 2009Applicant: Covenant Partners Inc.Inventors: Mati Cauchy, Cecil McKinney
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Patent number: 7523617Abstract: A structure, system and method for controlling a temperature of a heat generating device in a solid medium, wherein heat is extracted from the medium into at least one heat extraction device, the heat extraction device dissipates heat into an environment apart from the medium by a heat sink thermally coupled to the heat extraction device; and heat from the medium is dissipated into the heat sink by a first thermal interface material thermally coupling the heat sink to the medium.Type: GrantFiled: October 22, 2004Date of Patent: April 28, 2009Assignee: Nextreme Thermal Solutions, Inc.Inventors: Rama Venkatasubramanian, Randall G. Alley, Pratima Addepalli, Anil J. Reddy, Edward P. Siivola, Brooks C. O'Quinn, Kip D. Coonley, John Posthill, Thomas Colpitts
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Publication number: 20090100841Abstract: A waste heat reclamation device absorbs waste heat from a heat generating object. A thermocouple loop is used to convert thermal energy into electrical energy which may be utilized to provide electrical power to an electronic device that is the heat generating object. The invention increases the efficiency of electronic devices such as computer processing units.Type: ApplicationFiled: October 17, 2008Publication date: April 23, 2009Inventor: Jerome Kahn
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Publication number: 20090086433Abstract: An apparatus with some embodiments is described having cooling capabilities for a computing device. In some embodiments, the apparatus may include a thermoelectric component (TEC) to transfer thermal energy with a first heat exchanger, through a heat attach and heat pipe, to or from the TEC, and then with a second heat exchanger. In some embodiments, the apparatus may include a second heat attach and a second heat pipe between the second heat exchanger and the TEC. Furthermore, in some embodiments, the apparatus may be at a docking station, where the docking station may connect with the computing device. Other embodiments are described.Type: ApplicationFiled: September 28, 2007Publication date: April 2, 2009Inventor: Rajiv K. Mongia
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Publication number: 20090084112Abstract: Engine air may be cooled at any point in the intake passageways by means of a remote thermoelectric temperature control unit which cools a liquid, gas or other coolant in a coolant circuit, the coolant then contacting the circuit to a point in the intake passageways where engine air is cooled by means of a coolant to gas heat exchanger. A reservoir of cold coolant, or a cold sink, may be cooled substantially so that when the engine demands an increased supply of air a reservoir of cooled coolant is available. Engine air may be cooled in the ram or scoop, in the cold air intakes, in an intercooler, in a turbocharger, supercharger, chargecooler, throttle body, carburetor or at any other point in the engine air intake passageways.Type: ApplicationFiled: October 2, 2007Publication date: April 2, 2009Inventor: Demetrius Calvin Ham
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Patent number: 7508671Abstract: A computer system and its method of cooling are provided. A vapor chamber serves as a heat spreader for heat from the microelectronic die. A thermoelectric module serves to cool the vapor chamber and maintain proper functioning of the vapor chamber, thus keeping the microelectronic die cooled. A controller receives input from five temperature sensors, and utilizes the input to control current to the thermoelectric module and voltage/current to a motor that drives a fan and provides additional cooling. A current sensor allows the controller to monitor and limit power provided to the thermoelectric module.Type: GrantFiled: October 10, 2003Date of Patent: March 24, 2009Assignee: Intel CorporationInventors: Ioan Sauciuc, Gregory M. Chrysler, Ravi V. Mahajan
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Publication number: 20090072747Abstract: A super cooler device including a thermo electric cooler on a digital micro mirror device.Type: ApplicationFiled: November 20, 2008Publication date: March 19, 2009Applicant: PRODUCTION RESOURCE GROUP L.L.CInventors: Nigel Evans, William E. Hewlett
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Publication number: 20090038317Abstract: A Thermoelectric-based container holder has a receptacle with a recess for receiving a container to be heated or cooled, a variable interface surface disposed within the holder and configured to flexibly contact an outside surface of the container to be heated or cooled where the variable surface interface is in thermal contact with the surface of the receptacle, and a thermoelectric assembly thermally connected to at least the variable surface interface.Type: ApplicationFiled: August 6, 2008Publication date: February 12, 2009Applicant: FERROTEC (USA) CORPORATIONInventor: Robert W. Otey
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Publication number: 20090019861Abstract: An air conditioning unit is disclosed for motor vehicles. The air conditioning unit includes with a compression refrigerant circuit where a refrigerant circulates, comprising comprehensively switched in series with respect to fluid flow at least one compressor upstream of a heat-delivering heat exchanger, and an expansion element upstream of a heat-absorbing heat exchanger, whereby into the flow path leading from the outlet of the heat-delivering heat exchanger to the expansion element an additional heat exchanger is integrated thermally coupled to at least one cooling means the temperature of which can be put to values below the temperature of the refrigerant in the compression refrigeration circuit at the position of the refrigerant's outflow from the heat-delivering heat exchanger, and a method for its operation.Type: ApplicationFiled: July 17, 2008Publication date: January 22, 2009Inventors: Roman Heckt, Marc Graaf, Tobias Haas
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Patent number: 7478535Abstract: A system for condensing water from air includes a column having a substantially non-reflective surface effective for absorbing heat energy from the sun and transferring the heat to air in the interior of the column. A condenser is secured within the column, and includes a condensing surface with a thermoelectric cooler positioned thereon for cooling the condensing surface. A collector is positioned within the column for collecting water that condenses on and falls from the at least one condensing surface of the condenser, and an accumulator is coupled in fluid communication with the collector for accumulating the water.Type: GrantFiled: June 9, 2005Date of Patent: January 20, 2009Inventor: J. Glenn Turner, Jr.
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Patent number: 7475551Abstract: Active cooling technologies such as thermoelectrics can be used to introduce thermal “gain” into a cooling system and, when employed in combination with forced flow cooling loops, can provide an attractive solution for cooling high heat flux density devices and/or components. In such configurations, it can be advantageous to discontinuously flow thermal transfer fluid into thermal contact with the hot or cold side of a thermoelectric module (TEM), allow it to dwell while heat is transferred from or to the TEM, and resume the flow. In configurations in which the TEM operation is itself discontinuous, various relationships between thermal transfer fluid flow and TEM operation can be advantageously employed to temporally integrate thermoelectric action.Type: GrantFiled: September 21, 2005Date of Patent: January 13, 2009Assignee: NanoCoolers, Inc.Inventor: Uttam Ghoshal
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Publication number: 20090007572Abstract: An improved efficiency thermoelectric system is disclosed wherein convection is actively facilitated through a thermoelectric array. Thermoelectrics are commonly used for cooling and heating applications. Thermal power is convected through a thermoelectric array toward at least one side of the thermoelectric array, which leads to increased efficiency. Several different configurations are disclosed to provide convective thermal power transport, using a convective medium. In addition, a control system is disclosed which responds to one or more inputs to make adjustments to the thermoelectric system.Type: ApplicationFiled: July 8, 2008Publication date: January 8, 2009Inventor: Lon E. Bell
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Patent number: 7466553Abstract: Liquid cooling systems and apparatus are presented. A number of embodiments are presented. In each embodiment, a heat transfer system capable of thermally coupling to heat generating components and adapted to transfer heat from the heat generating components is implemented. A variety of embodiments of the heat transfer system are presented. For example, several embodiments of a heat transfer system including electron-conducting material is presented. In one embodiment of the present invention, the electron conducting material operates under the peltier principal.Type: GrantFiled: October 24, 2006Date of Patent: December 16, 2008Assignee: QNX Cooling Systems, Inc.Inventor: Brian A. Hamman
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Publication number: 20080295522Abstract: The present invention reduces to practice discoveries made by the present inventors during their investigations into present-art-perceived-difficulties in thermal-management applications of solid-state devices.Type: ApplicationFiled: May 25, 2008Publication date: December 4, 2008Inventors: David Allen Hubbell, Thorgeir Jonsson, Sturla Jonsson
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Patent number: 7454915Abstract: A super cooler device including a thermo electric cooler on a digital micro mirror device.Type: GrantFiled: February 21, 2006Date of Patent: November 25, 2008Assignee: Production Resource Group L.L.C.Inventors: Nigel Evans, William E. Hewlett
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Publication number: 20080271464Abstract: Embodiments include systems and methods for selectively cooling heat-generating electronic components in an enclosure. According to one embodiment, an enclosure houses a plurality of heat-generating electronic components. Air enters the enclosure at the front and is exhausted at the rear. After passing through one or more upstream components, air diverges into at least first and second airstreams within the enclosure. The first airstream is re-cooled by a cooling system having a thermoelectric cooling module. The thermoelectric cooling module is configured such that a first side is cooled and a second side is heated in response to an applied voltage. A voltage regulator may govern the voltage in response to one or more temperatures sensed within the rack system.Type: ApplicationFiled: July 15, 2008Publication date: November 6, 2008Inventors: Martin Joseph Crippen, Albert Vincent Makley, Jason Aaron Matteson, William Joseph Piazza
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Patent number: 7444822Abstract: Resins (5, 6) are interposed as insulating layers between heat radiation side and heat absorption side heat exchange bodies (2, 3) and heat radiation side and heat absorption side electrodes (41, 42) of a thermoelectric conversion element module (4). The resin (5) is fusion bonded to the heat radiation side heat exchange body (2), and the resin (6) is fusion bonded to the heat radiation side heat exchange body (3). The material of the resins (5, 6) is, for example, a thermosetting plastic. The thermosetting plastic becomes soft when heated and then cures. At the time of fusion bonding of the resins (5, 6) to the heat exchange bodies (2, 3), the heat exchange bodies (2, 3) and the resins (5, 6) are heated and pressed. Then, the resins (5, 6) become soft and enter the cavities and flaws formed in the surfaces of the heat exchange bodies (2, 3). The resins (5, 6) having entered the cavities and flaws cure to fill the cavities in the surfaces of the heat exchange bodies (2, 3).Type: GrantFiled: July 29, 2005Date of Patent: November 4, 2008Assignee: Komatsu Electronics Inc.Inventors: Norio Takahashi, Wataru Kiyosawa
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Publication number: 20080251125Abstract: A photoelectric conversion structure includes a light energy plate, a thermoelectric cooling element and a control circuit. The light energy plate is suitable to receive light energy and convert the light energy to electrical energy. The thermoelectric cooling element has a hot side and a cold side. The hot side faces the light energy plate. The control circuit is electrically connected to the light energy plate and the thermoelectric cooling element. The control circuit is suitable to provide the electrical energy for the thermoelectric cooling element.Type: ApplicationFiled: April 16, 2008Publication date: October 16, 2008Applicant: ASUSTeK COMPUTER INC.Inventors: Ching-Fu Cheng, Hsiang-Jui Hung, Sun-Chen Yang, Yun-Jiun You, Chun-San Lin
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Patent number: 7431225Abstract: The present invention is generally directed to a vaporizer with positive liquid shut-off. In one illustrative embodiment, the vaporizer is comprised of a body, a liquid inlet and a carrier gas inlet coupled to the body, a nozzle positioned within the body, the nozzle having at least one opening formed therethrough that defines a vaporized liquid exit, and a positive shut-off valve, a portion of which is adapted to engage the vaporized liquid exit of the nozzle. In another illustrative embodiment, the vaporizer is comprised of a body, a liquid inlet and a carrier gas inlet coupled to-the body and a plurality of peltier cells coupled to the body.Type: GrantFiled: August 10, 2004Date of Patent: October 7, 2008Assignee: Micron Technology, Inc.Inventors: Ross S. Dando, Allen P. Mardian, Raynald B. Cantin, Gurtej S. Sandhu
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Patent number: 7430875Abstract: The exhaust heat recovery system of the invention includes: a thermoelectric conversion element that generates electric energy by thermoelectric conversion using heat of exhaust gas discharged from an engine; and a heat pump including a heat recovery unit that absorbs the heat contained in the exhaust gas through an endothermic reaction using a heating medium, and a heat generation unit which generates heat through an exothermic reaction of the heating medium and which supplies the heat to the thermoelectric conversion element. With this configuration, the thermoelectric conversion element and the heat generation unit are movably attached to each other such that they can be placed in contact with and separated from each other, and the heat recovery unit is positioned in an exhaust gas passage in an exhaust gas downstream flow direction from the heat generation unit.Type: GrantFiled: March 10, 2005Date of Patent: October 7, 2008Assignee: Toyota Jidosha Kabushiki KaishaInventors: Toshitake Sasaki, Kiyohito Murata, Yuji Itoh
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Publication number: 20080236175Abstract: An integrated circuit is cooled by microarchitecture controlled Peltier effect cooling. In one embodiment, a temperature sensor thermally coupled to at least a portion of the integrated circuit of a die is adapted to provide an output as a function of the temperature of an integrated circuit portion. Operation of a thermoelectric cooler thermally coupled to the integrated circuit portion is controlled as a function of the sensor output, wherein a controller of the integrated circuit controls the thermal electric cooler. Other embodiments are described and claimed.Type: ApplicationFiled: March 30, 2007Publication date: October 2, 2008Inventors: Pedro Chaparro Monferrer, Jose Gonzalez, Gregory Martin Chrysler
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Publication number: 20080236174Abstract: Thermoelectric devices are provided. In one embodiment, a thermoelectric device may include a glass wafer defined by conductive vias, a second wafer, and a plurality of metal film disposed between the glass wafer and the second wafer and against solid, conductive, integral, end surfaces of the conductive vias. A nanogap may be disposed between the metal film and the second wafer. The nanogap may have been created by applying a voltage extending between the conductive vias and the second wafer. Methods of forming the devices, along with methods of using the devices to transform heat energy to electricity, and for refrigeration, are also provided.Type: ApplicationFiled: March 26, 2007Publication date: October 2, 2008Applicant: THE BOEING COMPANYInventor: Minas Tanielian