Abstract: Methods and apparatus are disclosed for using multi-axis articulating robot to manipulate plastic molded parts through a series of processing steps on one or more processing machines that are relatively stationary with respect to the parts and/or the robot.

Abstract: A method and apparatus for assembling a complex product in a parallel process system wherein a collection of components are provided for assembling the complex product. The present invention involves transferring the collection of components to one of a plurality of similar computerized assembly cells through the use of a transport system. The collection of components is automatically assembled into the complex product through the use of the computerized assembly cells. The complex product is then transferred from one of the assembly cells to a computerized test cell, where the complex product is tested to ensure for the proper dimensioning and functioning of the complex product. The complex product is then transferred from the test cell via the transport system to either a part reject area or conveyor, if the product is defective, or to an automatic dunnage load or part return system, if the product is not defective.

Abstract: A processing equipment unit performs a predetermined process to a carried object. A case accommodates the carried object. A carrier carries the carried object in the case. An opener is configured to enable the carrier to mount the case on the opener. The opener includes an opener control unit configured to exchange a signal with the carrier to control elevation of the case. The carrier is configured to exchange a signal with the opener control unit thereby to mount the case on the opener. The opener is equipped to the processing equipment unit.

Abstract: Provided is a card issuing apparatus that includes a plurality of processing units that perform predetermined processing on a card, which enables reduction of the installation space thereof. A card issuing apparatus that performs processing on a card to be processed and issues the processed card includes: a plurality of processing units including at least a first processing unit that executes a process of forming at least one of a character string and a symbol on a surface of the card to be processed, and a second processing unit that executes a process of recording information on a recording medium included in the card to be processed. The plurality of processing units are installed in the card issuing apparatus body to be arranged in the up-down direction.

Abstract: The sample transport system includes a management section which holds information on the status of a sample transport system as a whole as well as sample information in order to transport and control a plurality of carriers as a consecutive group and which generates group information on a group of carriers to be handled simultaneously based on sample attributes and request information; and units made up of a conveyer line, a connecting line, and a processing section to control received carriers at a converging point based on the group information, so as to permit group management control of the carriers. In this manner, the sample transport system processes as a single batch a plurality of samples collected for the same processing purpose.

Abstract: A substrate processing system, which repeats a carrying cycle in which a substrate is carried sequentially in a carrying order indicated by module numbers assigned to the modules, respectively, from the module of a lower module number to that of a higher module number, and is capable of processing substrates at a high throughput even if some modules become unusable and, thereafter, become usable. A controller controls a carrier such that the carrier carries a substrate taken out from the module preceding a multimodule unit including a plurality of modules to the module nest in the carrying order to the module of the multimodule unit from which a substrate is carried out at time nearest to time when the substrate was carried out from the module preceding the multimodule.

Abstract: A processing system includes process modules, load lock modules, an equipment controller, and a machine controller. The equipment controller controls transfer and processing of wafers in the processing system. A transfer destination determining portion determines the transfer destination of each wafer such that each wafer is sequentially transferred to a normally operating process module. When an abnormality occurs in a process module, an evacuation portion temporarily evacuates to a cassette stage the wafer determined to be transferred to the abnormal process module and that has not yet been transferred to the abnormal process module. When an error of the abnormal process module is dealt with, a transfer destination change portion changes the transfer destination of a wafer scheduled to be first transferred from the cassette case, to the transfer inhibition-released process module. When the error of the transfer-inhibited processing chamber is released, the transfer route is optimized.

Abstract: An apparatus for machining the ends of a component includes a plurality of work stations, and a transport mechanism for moving the component along a path to the plurality of work stations. The transport mechanism is positioned to be inboard of the ends of a component. At least one of a first work station or a second work station of the plurality of workstations includes a first fixturing portion for holding a first end, and a first machine for carrying out machine operations on the first end. The first fixturing portion and the first machine are movable in a direction transverse to the path.

Abstract: A method for causing vehicles to travel improves work efficiency by minimizing stop time of the vehicles while avoiding deadlock, wherein reservation-requested routes are generated for the respective vehicles. The reservation-requested routes are parts of travel routes and between the current positions and travel stop positions, and are generated in so that a position not interfering with an interference region shown on a map and the terminal position of the reservation-requested routes for other vehicles becomes a terminal. Then, an already reserved route, is generated on conditions that the reservation-requested route for the vehicle does not interfere with the already reserved routes for the other vehicles and that deadlock does not occur. Then, the respective vehicles are controlled to travel from the current positions to the terminal positions of the already reserved routes.

Abstract: The present embodiment provides for methods and systems for use in processing objects such as wafers, including polishing and/or grinding wafers. Some embodiments provide systems that include a front-end module and a processing module. The front end module couples with a storage device that stores objects for processing. The front-end module can comprise a single robot, a transfer station, and a plurality of end effectors. The processing module is coupled with the front-end module such that the single robot delivers objects from the storage device to the processing module. The processing module comprising a rotating table, and a spindle with a carrier configured to retrieve the delivered object and process the object on the rotating table.

Abstract: Even when a module constituting a multi-module becomes an unavailable module, transfer of substrates can be promptly performed, while restricting generation of inferior products. When a destination module of a multi-module becomes unavailable before a substrate is transferred to the destination module, a destination of the substrate is changed to a module to which a substrate subsequent to the substrate is to be loaded. Upon generation of an unavailable module, before the transfer unit accesses the module on an upstream end of the transfer cycle, the transfer cycle proceeds until a precedent substrate becomes ready to be unloaded from the changed destination module. Alternatively, upon generation of an unavailable module, when the transfer unit is located on an upstream side of the unavailable module in the transfer cycle, the transfer operation of the transfer unit is made standby until a precedent substrate becomes ready to be unloaded in the changed destination module.

Abstract: A method of controlling a transfer robot is provided, in which method the communication time of the transfer robot can be reduced and the transfer time of a substrate can be shortened. A series of actions of the transfer robot when a substrate that is present in a processing chamber is transferred to a predetermined position in a processing chamber, are performed by a single command. The series of actions may include a swap action in which, after having taken out by a robot hand the substrate that is present in the processing chamber, a substrate that is different from the substrate is handed over by a robot hand to a predetermined position on the processing chamber.

Abstract: Provided are novel photovoltaic cell alignment apparatuses and methods for fabricating photovoltaic module sub-assemblies that include multiple aligned photovoltaic cells. The apparatuses and methods provide high-speed precise alignment of the cells with respect to each other and other components of a photovoltaic module. In certain embodiments, a set of photovoltaic cells is first aligned on an alignment plate of an alignment apparatus and then transferred to a sealing sheet of the module such that the respective alignments of the cells are maintained during transfer. The alignment plate may include multiple cell receiving areas that have corresponding alignment edges. Aligning photovoltaic cells on this plate may involve forcing the cells against the alignment edges and/or moving the cells in the receiving areas in a direction parallel to the alignment edges.

Abstract: The present invention provides various aspects for processing multiple types of substrates within cleanspace fabricators or for processing multiple or single types of substrates in multiple types of cleanspace environments. In some embodiments, a collocated composite cleanspace fabricator may be capable of processing semiconductor devices into integrated circuits and then performing assembly operations to result in product in packaged form.

Abstract: Manufacturing and industrial processes that involve the transfer of materials from source locations to destination location may utilize the presently described system and process to verify that the correct physical connections are established and maintained in a material handling system. The system collects information related to individual physical connections, including machine-identifiable indicia, and compares this information to data that defines the intended connections within the material handling system. In doing so, the system and process verify whether the proper physical connections are in place.

Abstract: A technique which, when transporting a substrate from one module to another, detects a displacement of the substrate on a holding member and transfers the substrate to another module with the displacement within an acceptable range. Displacement of a wafer on a fork of a transport arm from a reference position is determined when the fork has received the wafer from one module and, when the displacement is within an acceptable range, the wafer is transported by the transport arm to another module. When the displacement is out of the acceptable range, the wafer is transported by the transport arm to a wafer stage module, and then the transport arm receives the wafer from the wafer stage module so that the displacement comes to fall within the acceptable range. The wafer can therefore be transferred to another module with the displacement within the acceptable range.

Abstract: Disclosed is a processing apparatus to restrain load of a common usage system shared by a plurality of liquid processing modules. A processing module group includes k sets of share groups comprising a plurality of processing modules to perform an identical processing for each substrate (where, k?2), each set of share groups includes n processing modules (where, n?2), and each processing module includes the common usage system shared by n processing modules in each set and having a maximum capacity capable of processing m processing modules (where m?n). A carrying mechanism repeatedly loads a substrate one by one to the processing module of each set in sequence.

Abstract: A substrate transfer apparatus to transfer a circular substrate provided with a cutout at an edge portion thereof, includes: a sensor part including three light source parts applying light to positions different from one another at the edge portion, and three light receiving parts paired with the light source parts; and a drive part for moving the substrate holding part, wherein the three light source parts apply light to the light receiving parts so that whether or not a detection range of the sensor part overlaps with the cutout of the substrate is determined on the basis of an amount of received light by each light receiving part, and when it is determined that there is an overlap at any position, positions of the edge portion of the substrate are further detected with the position of the substrate displaced with respect to the sensor part.

Abstract: At least a first reticle is stored in a housing of a stocker. A first gas is delivered to the housing. At least one reticle pod having an additional reticle is delivered into a enclosure within the housing of the stocker. A second gas different from the first gas is delivered to the enclosure. The reticle pod is automatically retrieved from the enclosure. The delivery and retrieval of the reticle pod and delivery of the first gas and the second gas are automatically controlled.

Abstract: The present invention provides various methods for forming cleanspace fabricators by retrofitting a structure of an existing cleanroom based fabricator. In some embodiments, a cleanspace fabricator is formed within a region of a cleanroom fabricator which is not transformed.

Abstract: Provided is a work assembling system (1) comprising a manpower working area (30A) for transferring bodies (10) continuously, a robot working area (40) disposed on the downstream of the manpower working area (30A) for tact-transferring the bodies (10), and a first buffer space (50A) disposed at a boundary portion between the manpower working area (30A) and the robot working area (40).

Abstract: A wafer transfer system, and method of controlling pressure in the system, includes a loadport for receiving a wafer container, a housing operably connected to the loadport, a wafer transfer mechanism for transferring a wafer between the wafer container and the housing, a wafer container sensor for detecting a presence of the wafer container on the loadport, a variable speed fan disposed in a first portion of the housing, a variable exhaust unit disposed in a second portion of the housing facing the first portion, the variable exhaust unit being capable of varying an exhaust rate of air from the housing, and a controller for variably operating the variable speed fan and the variable exhaust unit in response to a signal from the wafer container sensor.

Abstract: A method and apparatus for assembling a complex product in a parallel process system wherein a collection of components are provided for assembling the complex product. The present invention involves transferring the collection of components to one of a plurality of similar computerized assembly cells through the use of a transport system. The collection of components is automatically assembled into the complex product through the use of the computerized assembly cells. The complex product is then transferred from one of the assembly cells to a computerized test cell, where the complex product is tested to ensure for the proper dimensioning and functioning of the complex product. The complex product is then transferred from the test cell via the transport system to either a part reject area or conveyor, if the product is defective, or to an automatic dunnage load or part return system, if the product is not defective.

Abstract: A conveyance system. The conveyance system includes a movable device for conveying an article, and a robot selected from the group consisting of an articulated robot and an orthogonal robot. The movable device is configured to be both vertically and horizontally movable; and, the robot is mounted on the movable device. The robot includes a hand and a gripper disposed on the hand. The gripper is configured to hold the article. The movable device and the robot are configured to convey the article in conveyance operations that include an extraction, a conveyance, and an installation, of the article; the range of the conveyance operations lies within a working range of the robot from a present position that is selected with priority. The movable device is configured to remain in a stationary state when the article is conveyed by the robot using the conveyance operations within the working range.

Abstract: Disclosed are a substrate processing apparatus, a substrate processing method, and a storage medium, which can process a normal substrate according to a normal schedule in parallel with a substrate to be processed in preference to other substrates. Processing block performs the same types of processes for substrates, carried therein from FOUP placing unit, by using process arms. When a priority substrate having a priority over other substrates are carried, control unit carries and processes the priority substrate in priority processing unit that can receive a next substrate among priority processing units to which a plurality of processing units are partially or wholly assigned, in preference to other substrates.

Abstract: A spatial three-dimensional (3D) inline handling system comprises: a ceiling with guide rails; a plurality of cassettes disposed at a bottom surface of the ceiling to temporarily store substrates; a plurality of processing units disposed below the cassettes to process the substrates; and an overhead handling apparatus for handling the substrates between the cassettes and the processing units and slidably connected with the guide rails. In the present disclosure, the ground space occupied by the handling system is reduced by adopting a 3D handling manner and disposing robot arms at overhead positions, and the space utilization factor is greatly increased by disposing the processing units of the substrate processing line concentratively. Meanwhile, the robot arms handles the substrates overhead to improve the handling efficiency; furthermore, because the overhead handling apparatus is located near the FFUs, cleanliness of the substrates is increased and, consequently, the product yield is increased.

Abstract: Methods and apparatus, including systems and computer program products, for a services architecture design that provides enterprise services having foundation layer functionality at the level of an enterprise application. The design includes a set of service operations, process components, and optionally deployment units. Suitable business objects are also described.

Abstract: A robot system includes transport means which transports an object, first detecting means which detects a three-dimensional shape of the object transported on a transport path by the transport means, a robot which performs a predetermined task on the object transported on the transport path by the transport means, means which generates an operation command to the robot, and means which corrects the operation command based on a detection result by the first detecting means.

Abstract: A production system and a production method, which can change a period to delivery of products flexibly depending on a change of demand, in the case of producing a plurality of products having different specifications by mixing. A production system of plural kinds of products has a plurality of lower processes, which is capable of diverging, with respect to an upper process that can be applied common in a plurality of products. These upper process and lower process are organized by including one or a plurality of processes. A production line is constructed by a plurality of manufacturing facilities having different functions through the upper process and the lower process. Such a production system is provided with an order and delivery management system, a design management system, and a process management system.

Abstract: A method for synchronizing a first machine of a manufacturing process section arranged to carry out a production cycle including a working part and a non-working part. The first machine is operated in conjunction with at least one second machine. The first machine carries out a process during the working part of the cycle on a workpiece that is loaded into and/or unloaded out of the first machine by the at least one second machine during the non-working part of each process cycle. Also, a system for carrying out the method and a computer program.

Abstract: Disclosed is a modular semiconductor substrate processing system (1), including a plurality of independently operable substrate processing units (100). Each unit (100) comprises a reactor module (104) and a substrate transfer module (102). Within the system (1), the substrate transfer modules (102) of the different units (100) are serially interconnected such that substrates (116) may be exchanged between them. Exchange of substrates (116) between neighboring processing units (100) is facilitated by a shared substrate hand-off station (130) that is associated with each pair of neighboring processing units. The actual transfer of substrates is performed by a substrate handling robot (122), which may preferably be of the SCARA-type.

Abstract: A method includes generating a reticle transport job using a computing device. The reticle job identifies a selected reticle. A reticle pod available for transporting the reticle is autonomously identified using the computing device. The reticle transport job is updated suing the computing device with an identifier of the reticle pod.

Abstract: A foreign matter detection unit detects an entry of an unexpected foreign matter that is other than the substrates by light transmitting optical sensors 7 having light projecting portions 7a and light receiving portions 7b at opening sections 3a, 3b formed in cover members 2 through which the substrates pass. By executing an emergency stop processing, when the entry of the foreign matter is detected at one of the opening sections, to stop the electronic component mounting apparatus that is adjacent to the opening section at which the entry of the foreign matter is detected, safety of the machine operators is properly ensured in check and confirmation works conducted at the time of machine troubles etc even in an electronic component assembling line in which the small-sized thin unit apparatuses are combined.

Abstract: In a system, one or more robotic arms are positioned adjacent a transport surface that is moving workpieces, and one or more picking elements are connected to each of the robotic arms. The picking elements have physical picking features that remove the workpieces from the transport surface and move the workpieces to another location. A controller is operatively connected to the robotic arms and the picking elements, and the controller independently controls the robotic arms and the picking elements to dynamically position the picking elements in coordination with a dynamic size, spacing, and transport speed of the workpieces being moved by the transport surface.

Abstract: A method for increasing overall yield in semiconductor manufacturing including routing wafers or wafer lots from tool to tool in a manner which at least partially neutralizes or compensates for processing variations. A system for increasing overall yield in semiconductor manufacturing includes a module for recording processing data from plural first and second types of tools and a module for routing wafers or wafer lots from tools of the first type of tools to tools of the second type of tools so as to at least partially neutralizes or compensate for processing variation.

Abstract: A setup system at least including a substrate processing apparatus and a test terminal is provided. The substrate processing apparatus includes a plurality of process chambers, a plurality of process chamber control units, a comprehensive control unit and an operation unit. The test terminal is connected to the plurality of process chamber control units while the comprehensive control unit and the operation unit are disconnected from the plurality of process chamber control units. The test terminal transmits a process chamber test operation command to the plurality of process chamber control units by executing a test terminal program. The setup system is capable of reducing time necessary for a setup process when starting to operate the substrate processing apparatus with the plurality of process chambers.

Abstract: A method and system for estimating context offsets for run-to-run control in a semiconductor fabrication facility is described. In one embodiment, contexts associated with a process are identified. The process has one or more threads, and each thread involves one or more contexts. A set of input-output equations describing the process is defined. Each input-output equation corresponds to a thread and includes a thread offset expressed as a summation of individual context offsets. A state-space model is created that describes an evolution of the process using the set of input-output equations. The state-space model allows to estimate individual context offsets.

Abstract: A gripper type material feeding apparatus for the intermittent feeding of a workpiece. The apparatus includes a first linearly guided gripper mechanism which is movable in a first direction of workpiece feeding and in a second direction opposite to the first direction. The first gripper mechanism includes a first gripping member and a second gripping member wherein the second gripping member is movable relative to the first gripping member for gripping the workpiece. The apparatus includes a first release actuator for moving the second gripping member of the first gripper mechanism in a direction relative to the first gripping member of the first gripper mechanism. The apparatus includes a first release connecting link with a first end pivotally connected at a first pivot axis to the first release actuator and with a second end pivotally connected at a second pivot axis to the second gripping member of the first gripper mechanism.

Abstract: An apparatus for the intermittent feeding of a workpiece. The apparatus includes a first linearly guided gripper mechanism which is movable in a first direction of workpiece feeding and in a second direction opposite to the first direction. The first gripper mechanism includes a first gripping member and a second gripping member wherein the second gripping member is movable relative to the first gripping member for gripping the workpiece. The apparatus further includes a gripper mechanism drive actuator which is angularly adjustable, reversible and rotary, a fixed length driving member connected to the gripper mechanism drive actuator for rotation therewith. The apparatus further includes a first gripper mechanism drive connecting link with a first end pivotally connected to a first end of the fixed length driving member and with a second end pivotally connected to the first gripper mechanism for moving the first gripper mechanism in the first direction of workpiece feeding and the second direction.

Abstract: A hazardous area in the region surrounding a reel transport of a reel changer is secured. A contactless protective device is located at the access boundaries of the region. This protective device can be deactivated for feeding and/or removing a known object and comprises an evaluation unit. The protective device is configured as a light curtain that is comprised of a plurality of light beams that run in parallel to each other. The evaluation unit includes an assembly for detecting the sequence of the interruption of the light beams during the feeding and/or the removal of an object. Based on the detected sequence of interruption of the light beams, a known object, that is permitted to access the hazardous area, is detected. The protective device is deactivated in this situation. Securing the hazardous area further includes the provision of a second contactless protective device that is permanently active.

Abstract: Preparation of a wafer processing or measuring tool for a job can be initiated prior to assigning a wafer carrier to deliver wafers to the tool. The automated process may include transfer of wafers from a container, such as a bare wafer stocker, or between two tools.

Abstract: A configurable tissue processing system is disclosed that includes a plurality of configurable tissue processing stations, each station configured to receive tissue samples and selectively configurable to heat, agitate and apply either a positive pressure or a vacuum pressure to the received tissue samples; a transport mechanism that is configured to transport the tissue samples between the plurality of configurable tissue processing stations; and a control unit coupled to the plurality of configurable tissue processing stations and to the transport mechanism, the control unit controlling the transport mechanism to selectively position the tissue samples in the plurality of configurable tissue processing stations, and the control unit configuring each of the plurality of configurable tissue processing stations to heat, agitate and apply either a positive pressure or a vacuum pressure to the received samples. Also disclosed is a method of configuring the plurality of tissue processing stations.

Abstract: For controlling a printed product processing system (100), which comprises a collecting system (1) having a conveyor (11) and a plurality of feed conveyors (13) for creating product collections (4) from products (3) fed by the feed conveyors (13), system configuration parameters (24) which define a configuration of the printed product processing system (100) and production configuration parameters (25) which define the production of product collections (4, 4#) created from a plurality of products fed are detected and run time data are determined during the production. On the basis of the system configuration parameters (24), the production configuration parameters (25) and the run time data, one of a plurality of defined production strategies (26), which in each case determine the control of the printed product processing system (100), is selected during the production.

Abstract: A substrate processing system capable of extending and changing a substrate processing module easily according to changes of processing contents for a substrate. An embodiment is the system including a main device and sub-devices. A transfer controlling part includes an acquiring part that acquires transfer-destination specifying information that includes additional information identifying at least a local address and a substrate processing device to which the local address belongs, and that specifies a substrate transfer destination uniquely within the main device and the sub-devices, a judging part that judges which one of the main device, and the sub-devices is the substrate transfer destination based on the specifying information acquired by the acquiring part, and a local transfer part that transfers the substrate to a process chamber connected to a transfer chamber of its own device by using the address allocated uniquely within the own device.

Abstract: Various embodiments describe a method of quantifying bow in a wafer. In one embodiment, the method includes measuring a first plurality of distances from a first sensor to a first surface of the wafer to calculate the bow in the wafer. The first sensor is positioned outside of a set of process modules of the plasma processing system. A determination is made whether the calculated bow of the wafer is within a pre-determined range. If the calculated bow of the wafer is within the pre-determined range, the wafer is moved into a process module of the set of process modules for processing and a recipe for processing the wafer is adjusted based on the calculated bow of the wafer. If the calculated bow of the wafer is outside the pre-determined range, the wafer is removed from the plasma processing system. Other methods are described as well.

Abstract: In a flexible manufacturing system, a control apparatus for a transfer device stores in a memory section thereof correlation information for correlating workpieces (ante-machining workpieces) to be attached to pallets with blank materials contained in blank material baskets. When a selected one of the pallets is to be transferred to a pallet loading station, the control apparatus determines blank materials corresponding to the workpieces to be attached to the selected one of the pallets based on the correlation information and then, controls the transfer device to transfer a blank material basket containing the determined blank materials from a basket rack to a basket loading station located adjacent to the pallet loading station in connection with transferring the selected one of the pallets to the pallet loading station. Thus, when the selected one of the pallets is transferred to the pallet loading station, it becomes possible to reduce the time taken for the worker to search for the blank material basket.

Abstract: A scheduling optimizer system, method and program product that analyzes a device for sensitivities, such as ESD sensitivities, and allows for modification of a floor schedule of the assembly unit of the device based on the sensitivity of the device while improving the overall performance of the assembly unit are disclosed. The scheduling optimizer analyzes sensitivity data for a device during operation of the assembly unit on the floor schedule. The floor schedule is then optimized based on the analyzed sensitivity data.

Abstract: A setup method of a substrate processing apparatus includes: connecting a test terminal, which includes a pseudo comprehensive control unit and a second operation unit, to a plurality of process chamber control units, with the process chamber control units being separated from the comprehensive control unit and a first operation unit; transmitting a process chamber test operation command from the second operation unit to the plurality of process chamber control units through the pseudo comprehensive control unit; testing operations of a plurality of process chambers in parallel by the plurality of process chamber control units receiving the process chamber test operation command; and transmitting a process chamber test operation report from the plurality of process chamber control units to the second operation unit through the pseudo comprehensive control unit.

Abstract: Arrangement (1) for processing electronic components, including a plurality of processing stations (3) for processing electronic component, at least some processing stations including an electrical actuator (8); a conveyor (2), such as a turret, for transporting components from one processing station to the next; and a central processing unit (5) for commanding the processing stations. At least some processing stations (3) include a local processing unit (7) for generating command signals (74) for the electric actuators (8). The central processing unit (5) is connected to the local processing units (7) over an electronic bus (6). Digital command instructions (75) are transferred on the electronic bus (6) between the central processing unit (5) and the local processing units (7).

Abstract: A method includes designating a plurality of wafers as members of a group. A first subset of the wafers is housed in a first wafer pod and a second subset of the wafers is housed in a second wafer pod. The first wafer pod is routed to a first tool, and at least a first operation is performed on the wafers in the first subset using the first tool. The second wafer pod is routed to a second tool, and the first operation is performed on the wafers in the second subset using the second tool. The wafers in the first and second subsets are consolidated following the performing of the first operation.