Abstract: Various embodiments describe a method of quantifying bow in a wafer. In one embodiment, the method includes measuring a first plurality of distances from a first sensor to a first surface of the wafer to calculate the bow in the wafer. The first sensor is positioned outside of a set of process modules of the plasma processing system. A determination is made whether the calculated bow of the wafer is within a pre-determined range. If the calculated bow of the wafer is within the pre-determined range, the wafer is moved into a process module of the set of process modules for processing and a recipe for processing the wafer is adjusted based on the calculated bow of the wafer. If the calculated bow of the wafer is outside the pre-determined range, the wafer is removed from the plasma processing system. Other methods are described as well.

Abstract: In a flexible manufacturing system, a control apparatus for a transfer device stores in a memory section thereof correlation information for correlating workpieces (ante-machining workpieces) to be attached to pallets with blank materials contained in blank material baskets. When a selected one of the pallets is to be transferred to a pallet loading station, the control apparatus determines blank materials corresponding to the workpieces to be attached to the selected one of the pallets based on the correlation information and then, controls the transfer device to transfer a blank material basket containing the determined blank materials from a basket rack to a basket loading station located adjacent to the pallet loading station in connection with transferring the selected one of the pallets to the pallet loading station. Thus, when the selected one of the pallets is transferred to the pallet loading station, it becomes possible to reduce the time taken for the worker to search for the blank material basket.

Abstract: A scheduling optimizer system, method and program product that analyzes a device for sensitivities, such as ESD sensitivities, and allows for modification of a floor schedule of the assembly unit of the device based on the sensitivity of the device while improving the overall performance of the assembly unit are disclosed. The scheduling optimizer analyzes sensitivity data for a device during operation of the assembly unit on the floor schedule. The floor schedule is then optimized based on the analyzed sensitivity data.

Abstract: A setup method of a substrate processing apparatus includes: connecting a test terminal, which includes a pseudo comprehensive control unit and a second operation unit, to a plurality of process chamber control units, with the process chamber control units being separated from the comprehensive control unit and a first operation unit; transmitting a process chamber test operation command from the second operation unit to the plurality of process chamber control units through the pseudo comprehensive control unit; testing operations of a plurality of process chambers in parallel by the plurality of process chamber control units receiving the process chamber test operation command; and transmitting a process chamber test operation report from the plurality of process chamber control units to the second operation unit through the pseudo comprehensive control unit.

Abstract: Arrangement (1) for processing electronic components, including a plurality of processing stations (3) for processing electronic component, at least some processing stations including an electrical actuator (8); a conveyor (2), such as a turret, for transporting components from one processing station to the next; and a central processing unit (5) for commanding the processing stations. At least some processing stations (3) include a local processing unit (7) for generating command signals (74) for the electric actuators (8). The central processing unit (5) is connected to the local processing units (7) over an electronic bus (6). Digital command instructions (75) are transferred on the electronic bus (6) between the central processing unit (5) and the local processing units (7).

Abstract: A method includes designating a plurality of wafers as members of a group. A first subset of the wafers is housed in a first wafer pod and a second subset of the wafers is housed in a second wafer pod. The first wafer pod is routed to a first tool, and at least a first operation is performed on the wafers in the first subset using the first tool. The second wafer pod is routed to a second tool, and the first operation is performed on the wafers in the second subset using the second tool. The wafers in the first and second subsets are consolidated following the performing of the first operation.

Abstract: The disclosure relates to a realtime process history server for use in a process control system comprising a process information management system (PIMS) and one or more distributed processing systems (distributed control systems DCS, 14.1 to 14.n). The realtime process history server features a combined PIMS/DCS server and a report server and is set up such that, by means of the report server, both clients and operator workstations of the DCS systems (14.1 to 14.n) have concurrent access under realtime conditions to the PIMS/DCS server and process history data which is stored therein.

Abstract: An apparatus comprises a grouping unit dividing substrates into groups, and determining reference and non-reference substrates for each group, a measurement unit measuring a first number of points for the reference substrate, and measuring a second number, smaller than the first number, of points for the non-reference substrate, a correction value determining unit determining a first correction value to position the reference substrate, and a second correction value to position the non-reference substrate, and an exposure unit exposing the reference substrate by positioning it based on the first correction value, and exposing the non-reference substrate by positioning it based on the second correction value, the correction value determining unit determining the first correction value based on the measurement of the reference substrate, and determining the second correction value based on the measurement of the non-reference substrate, and the measurement of the reference substrate or the first correction valu

Abstract: An eyeglass lens supplying system for supplying an eyeglass lens to a plurality of eyeglass lens processing apparatus includes: a plurality of conveyer line units, each of which includes: at least one conveyer line conveying a tray; a tray moving unit separating at least two trays from the conveyer line to move the trays to standby positions, and put the tray on the conveyer line; and a control unit obtaining processing information from a host computer; a carrying-in conveyer line connected to the conveyer line of the conveyer line unit; a carrying-out conveyer line connected to the conveyer line o the conveyer line unit; a main control unit communicating with each of the control units, and determines the processing apparatus to process the lens in the tray on the carrying-in conveyer unit, or determines the conveyer line unit to convey the tray on the carrying-in conveyer unit.

Abstract: A monitoring device for monitoring an abnormal load or unload operation of a wafer. The monitoring device includes a sensing unit and a detective unit. The sensing unit is for providing a sensing information, which indicates whether the wafer protrudes from a side of a carrier. The detective unit is for determining whether a duration, for which the wafer protrudes from the side of the carrier exceeds a predetermined time, for which the wafer is loaded or unloaded, according to the sensing information. If the duration exceeds the predetermined time, the detective unit further triggers an abnormal event.

Abstract: A semiconductor fabrication facility (fab) configuration module is defined to virtually model physical systems and attributes of a fab. A data acquisition module is defined to interface with the physical systems of the fab and gather operational data from the physical systems. A visualizer module is defined to collect and aggregate the operational data gathered from the physical systems. The visualizer module is further defined to process the operational data into a format suitable for visual rendering. The processed operational data is displayed within a visual context of the fab in a graphical user interface controlled by the visualizer module. An analyzer module is defined to analyze data collected by the visualizer module and to resolve queries regarding fab performance. An optimizer module is defined to control systems within the fab in response to data collected by the visualizer module, data generated by the analyzer module, or a combination thereof.

Abstract: A method and apparatus for assembling a complex product in a parallel process system wherein a collection of components are provided for assembling the complex product. The present invention involves transferring the collection of the components to one of a plurality of similar computerized assembly cells through the use of a transport system. The collection of components is automatically assembled into the complex product through the use of the computerized assembly cells. The complex product is then transferred from one of the assembly cells to a computerized test cell, where the complex product is tested to ensure for the proper dimensioning and functioning of the complex product. The complex product is then transferred from the test cell via the transport system to either a part reject area or conveyor, if the complex product is defective, or to an automatic dunnage load or part return system, if the complex product is not defective.

Abstract: A computerized system for a fabrication facility capable of routine placement and replacement of processing tools in at least a vertical dimension relative to each other.

Abstract: An objective of the present invention is to provide an assembly system capable of reducing the equipment space while various kinds of automotive parts are assembled on one production line. The assembly system assembles plural kinds of automotive parts consisting of a main body and a part to be installed to the main body. This assembly system comprises an operator area at which an operator is assigned, a plurality of travel carts on which a main body of each of automotive parts is placed, traveling along the operator area, a part pallet on which a part to be installed to each of the automotive parts is placed, a belt conveyer conveying this part pallet along the operator area, and a control device controlling thereof. The control device drives the travel carts and the belt conveyer so as to convey the travel carts and the part pallet synchronously.

Abstract: The invention controls a carrier moving and mounting device such that at normal time, the device moves and mounts carriers in sequence to a delivery mounting units according to a carry-in order, and when a priority carrier is carried into the carry-in mounting unit and if all of the delivery mounting units are occupied by the carriers, the device moves and mounts one of the carriers on the retreat mounting unit, and mounts the priority carrier on the delivery mounting unit which has become vacant by the movement; and controls a delivery device such that at normal time, the delivery device carries the substrates out of the carriers according to the carry-in order of the carriers mounted on the delivery mounting units, and when the priority carrier is mounted, the delivery device carries out the substrates in the priority carrier before the substrates in the other carriers.

Abstract: Systems, tools, and methods are provided in which a first signal is transmitted from a tool to a Fab indicating that all substrates to be processed have been removed from a specific carrier and that the specific carrier may be temporarily unloaded from a loadport of the tool. A second signal is transmitted from the tool to the Fab indicating that the specific carrier may be returned to the tool. While the carrier is unloaded from the tool, other carriers may be loaded on the vacated loadport. Numerous other features and aspects of the invention are disclosed.

Abstract: A radio tag reading device has a target tag storage unit, a non-target storage unit, and an antenna. The target tag storage unit stores the tag data of any radio tag held in a section from which to read data. The non-target storage unit stores at least the identification data of any radio tag existing outside sections and sections that surround the section. The target tag storage unit stores all tag data read from radio tags via the antenna, except the tag data containing the identification data stored in the non-target tag storage unit.

Abstract: The invention relates to a method for distributed control of a machining tool (24), in particular a laser machining tool, which comprises a machining area (31) which is surrounded by a protective housing (22) and has at least one area (27, 28) for access to the machining area (31) which is monitored, and comprising a control which is operated by at least one operator panel (21) to start the machining tool (24), wherein the machining tool is controlled by means of one or more multifunction keys (16), and at least one multifunction key (16) is associated with the at least one access area (27, 28), and when the respective multifunction key is pressed, (16) a work step of an operating sequence for the machining tool (24) is actuated which is next in a repetitive sequence of consecutive work steps of the operating sequence.

Abstract: One of reverse passing parts provided in a substrate passing part comprises a first holding mechanism and a second holding mechanism. The first holding mechanism and the second holding mechanism are arranged in vertically symmetry with respect to a rotary central axis and rotate 180 degrees about the rotary central axis, to replace each other in position. A transport robot on the loading side passes a substrate to a third holding mechanism or a fourth holding mechanism at a first vertical position. The substrate reversed in the reverse passing part is passed to a transport robot on the unloading side from the third holding mechanism or the fourth holding mechanism at a second vertical position. Before a reverse process on the preceding substrate is finished, the transport robot on the loading side can start the transfer of the following substrate.

Abstract: A substrate treatment system includes a plurality of treatment apparatuses, a position adjustment apparatus adjusting a center position of the substrate, a substrate transfer apparatus transferring the substrate to the treatment apparatuses and the position adjustment apparatus, and a control unit controlling operations of the apparatuses. The substrate transfer apparatus includes an arm part curved along a peripheral edge portion of the substrate with a radius of curvature larger than a radius of the substrate, and a holding part projecting inward from the arm part and holding a rear surface of the substrate. The position adjustment apparatus includes a mounting table which holds a central portion of the rear surface of the substrate and is rotatable and horizontally movable. The control unit controls the mounting table such that the center position of the substrate held on the mounting table is aligned with a center position of the arm part.

Abstract: A method for positioning substrates in a substrate processing apparatus having a substrate alignment device, a first substrate transport apparatus and a second substrate transport apparatus, includes calibrating the substrate alignment device with a motion of the first substrate transport apparatus, and calibrating a coordinate system of the second substrate transport apparatus with the substrate alignment device.

Abstract: A substrate processing apparatus includes a substrate processing unit for performing a process on substrates; a recipe protection unit for prohibiting processing conditions for the process from being changed while the process is being performed on a specific number of substrates; a protection cancellation unit for canceling a prohibition of a change in the process to allow the processing conditions to be changed while the process is being performed on the specific number of substrates; and a modifying unit for modifying the processing conditions. Further, a method for examining substrate processing conditions includes a protection cancellation step of canceling a prohibition of a change in the process to allow the processing conditions to be changed while the process is being performed on the specific number of substrates; and a modifying step of modifying the processing conditions.

Abstract: A conveyorized oven that provides uniform cooking with control of the heater and/or the conveyor belt speed. The oven includes a controller that monitors power consumption of the heater and uses the power consumption to control the heater and/or the speed of the motor that drives the conveyor belt. The power consumption is monitored by counting the on time cycles of a switch that connects and disconnects the heater to a power main. Changes in the power consumption due to changes in loading are used by the controller to reduce recovery times of the oven temperature to a set temperature by controlling the heater and/or the motor. By using a stepper motor, there is no need for a gear box.

Abstract: The invention relates to a storage device (1) for storing storage goods (25) in storage spaces (8), comprising at least one storage good carrier (7) which can be supplied with storage goods (25) and which is associated with a stowage space volume (S) that can be occupied by the storage goods (25) at a maximum. The storage device (1) comprises a control station (10), on which the stowage space volume (S) of the at least one storage good carrier (7) can be arranged accessible from outside of the storage device (1). The storage device (1) is equipped with a conveyer unit (5, 6), by which the storage goods carrier (7) can be moved from the control station (10) to the storage spaces (8).

Abstract: In a parts assembly system which assembled subsidiary parts with main parts, the main parts are conveyed through a first conveying path to an assembly robot provided along the first conveying path, and the subsidiary parts are supplied through the first conveying path to stockers provided along the first conveying path. In consequence, the travel space of the conveying cart is saved.

Abstract: An apparatus for manufacturing a device comprises a processing unit configured to perform a process for manufacturing the device, a conveying unit configured to convey an article to the processing unit, and a controller configured to control the conveying unit based on a job queue. Information for controlling conveyance of an article for a job next to a job for which the processing unit is performing the process is registered in the job queue. The controller is configured to control the conveying unit so as to convey the article for the next job in advance, based on the information.

Abstract: A polishing method includes: a pre-polishing film thickness measurement step of taking a substrate before polishing out of a cassette and measuring a thickness of a polishing film of the substrate with a film thickness measurement device; the pre-polishing substrate withdrawal step of returning the substrate after the pre-polishing film thickness measurement to the cassette; the polishing step of taking the substrate, which has been returned to the cassette, out of the cassette and polishing the substrate; the cleaning/drying step of cleaning and drying the substrate after polishing; the post-polishing substrate withdrawal step of returning the substrate after cleaning/drying to the cassette; and the post-polishing film thickness measurement step of taking the substrate after cleaning/drying, which has been returned to the cassette, out of the cassette and measuring the thickness of the polishing film of the substrate with the film thickness measurement device.

Abstract: Efficient manufacturing automation system and methods are described. The automation system controls movement of materials for processing by tools in a manufacturing facility. The system and methods include pre-emptive dispatching for transferring of materials. With the pre-emptive dispatching, the next destination and next lot to be processed is determined prior to a first lot being converted to a ready to unload state. This reduces wait time or idle time to improve tool utilization.

Abstract: A method includes generating a reticle transport job using a computing device. The reticle job identifies a selected reticle. A reticle pod available for transporting the reticle is autonomously identified using the computing device. The reticle transport job is updated suing the computing device with an identifier of the reticle pod.

Abstract: A semiconductor manufacturing apparatus 1 includes a wafer 10, a FOUP 20 that is a sealed container retaining the wafer 10 therein, an etching apparatus 30 that is a semiconductor processing apparatus, and an EFEM 40 that carries the wafer in a sealed condition between the FOUP and the etching apparatus. The FOUP includes a front door 20a, a sensor unit 21b detecting at least one of a temperature, a humidity, and a gas concentration, and a transmitter 25 that transmits information detected by the sensor unit. A receiver 31 receives information from the transmitter, and supplies the information to a purging unit 43. The purging unit performs purging until the temperature, etc., in the FOUP satisfies a reference value set beforehand.

Abstract: As an interrupt start button is depressed while control, under which product wafers Wp and dummy wafers Wd are transferred in an order defined in a normal transfer pattern, is repeatedly executed, a decision is made based upon wafer transfer history as to whether or not the most recent transfer pattern cycle has ended. If the cycle is determined to have ended, the operation immediately proceeds to the subsequent cycle to transfer interrupt wafers Wf and Wd in an order defined in the interrupt transfer pattern achieved by replacing Wp in the normal transfer pattern with Wf, whereas if the cycle is determined to be incomplete, the wafer transfer based upon the normal transfer pattern is carried on until the cycle ends and then the operation proceeds to the next cycle to transfer Wf and Wd in the order defined in the interrupt transfer pattern.

Abstract: The present disclosure relates to systems and processes for detecting and rejecting defective absorbent articles from a converting line. In particular, the systems and methods may utilize feedback from technologies, such as vision systems, sensors, remote input and output stations, and controllers with synchronized embedded clocks to accurately correlate inspection results and measurements from an absorbent article converting process. As such, the systems and methods may accurately apply the use of precision clock synchronization for both instrumentation and control system devices on a non-deterministic communications network. In turn, the clock synchronized control and instrumentation network may be used to control a reject system on converters of absorbent articles. In some embodiments, the controller will reject only defective absorbent articles without the need to reject non-defective absorbent articles.

Abstract: An automatic mould stripping system for moulding modules (7) located in a curing tool (12), comprising: a programmable robot (1) comprising an articulated arm (1a) with one end free, actuation means (13, 14) for conferring a horizontal rotary movement and a vertical tilting movement to the articulated arm (1a), and a head (2) located in the free end of the articulated arm (1a) with at least one vacuum suction pad (11) able to adhere itself to a surface (16, 17) of an object; a voiding,system (15) for generating a vacuum; referencing means (3) for referencing a vertical and horizontal position of each object (6, 7); and programmable controlling means (18) which govern said actuation means (13, 14) so that the articulated arm (1a) can position the suction pad (11) on that surface (16, 17) of the object (6, 7) in an initial position and transport it to a final position.

Abstract: There is provided a substrate transfer method capable of preventing fine particles from adhering to a wafer. A substrate processing system 10 includes process modules 12 to 17 each having therein an inner space S1; a transfer module 11, having an inner space S2, connected to the process modules 12 to 17; and opening/closing gate valves 30 each partitioning the inner space S1 and the inner space S2. The transfer module 11 includes in the inner space S2 a transfer arm device 21 for holding a wafer W and for loading/unloading the wafer W into/from the process modules 12 to 17. The transfer arm device 21 holds the wafer W at a retreated position deviated from a facing position facing the gate valve 30 during an opening motion of the gate valve 30.

Abstract: A conveyor or other transport mechanism is provided to support multiple, sequential builds from a three-dimensional fabrication machine. The conveyor may be heated/cooled, coated, or otherwise treated to assist in adhesion during a build, as well as removal of objects after a build. Each fabricated object may be automatically removed from the conveyor as the conveyor moves in order to restore a buildable surface for fabrication of additional objects.

Abstract: By providing a look-ahead functionality for a tool internal substrate handling system of process tools on the basis of a process history, the tool internal substrate sequencing may be significantly enhanced. The look-ahead functionality enables a prediction of process time of substrates currently being processed in a respective process module, thereby enabling the initiation of transport activity for substrate load operations in order to significantly reduce the overall idle time of process modules occurring during substrate exchange.

Abstract: An apparatus for recognizing and processing information of electronic parts includes a seating unit on which electronic parts are seated and aligned and a part information processing unit disposed adjacent to the seating unit. The part information processing unit is configured to align the electronic parts using the seating unit, recognize a recognition surface of the electronic parts, obtaining part information of the recognized surface, and store the obtained part information.

Abstract: A conveyor or other transport mechanism is provided to support multiple, sequential builds from a three-dimensional fabrication machine. The conveyor may be heated/cooled, coated, or otherwise treated to assist in adhesion during a build, as well as removal of objects after a build. Each fabricated object may be automatically removed from the conveyor as the conveyor moves in order to restore a buildable surface for fabrication of additional objects.

Abstract: In response to a transfer request, for which a loading time at a transfer source and a loading time at a transfer target are designated by a production controller, there is created a transfer scenario, which contains a basic transfer (From) from the transfer source to a buffer near the transfer target, for example, and a basic transfer (To) from the buffer to the transfer target. In order that the basic transfers (From, To) may be able to be executed, the buffer is reserved, and a transfer vehicle is allocated. The time period for the transfer vehicle to run to the transfer source or the buffer and the time period for the transfer vehicle to run from the transfer source or the buffer are estimated to assign a transfer command to the transfer vehicle. The possibility that the loading and the loading time may deviate from a designated period is evaluated. In case this possibility is high, a production controller is informed that a just-in-time transfer is difficult.

Abstract: A compact apparatus for automatically making a plurality of flat edibles includes a storage and dispensing unit that makes it unnecessary for a user to pre-measure ingredients. The apparatus also includes a mixing and kneading unit for making dough of optimal consistency. The mixing and kneading unit may be configured to prepare dough. The dough may be prepared by mixing and kneading the ingredients dispensed by the dispensers. The dough prepared may be transferred onto a lower platen from a transfer base by a transfer sweeper. The dough may be flattened in a platen unit. An upper platen and the lower platen of the platen unit may be heated to a pre-programmed temperature for cooking the flat edible. The temperature may also be manually set by the user based on user's preference. The flat may be cooked (e.g., heated, roasted and/or puffed) by the platen unit.

Abstract: A non-contact ID tag writing apparatus capable of applying high-speed writing to a non-contact ID tag is realized. With a plurality of antennas (221 to 223) arranged along the direction in which tags (11) are transported, one antenna applies writing to one of the tags while the tags pass through the coverage area of the antenna. The antennas apply the writing to the respective tags different from one another, whereby the writing can be applied to all the tags in a row.

Abstract: An embodiment is a method for semiconductor processing control. The method comprises identifying a key process stage from a plurality of process stages based on a parameter of processed wafers, forecasting a trend for a wafer processed by the key process stage and some of the plurality of process stages based on the parameter, and dispatching the wafer to one of a first plurality of tools in a tuning process stage. The one of the first plurality of tools is determined based on the trend.

Abstract: Control systems and methods are disclosed for controlling operation of movable systems in an automated process with a stationary system having a first control system component and at least one movable system having a second control system component, in which optical or other non-contacting signaling between the stationary and movable systems is used to ascertain whether a movable system is proximate the stationary system, and wireless communications is used to transfer control data between the systems while the non-contacting signal link is maintained.

Abstract: Electronic device manufacturing systems and methods are provided. In some aspects, a system having a dual-mode robot is provided which is disposed within a system component (e.g., a factory interface or transfer chamber) and adapted to operate in a first mode and a second mode. In the first mode, the robot may transfer a substrate between components of the system (e.g., between a carrier and a process chamber or chamber to chamber) and in the second mode, the robot may execute a process motion profile (e.g., metrology).

Abstract: A production control apparatus of a production system provided with a storing means for storing in advance a production system model comprised of workpiece information regarding workpieces and program information regarding a plurality of work programs of robots and a plurality of machining programs of machine tools, an updating means for updating the production system model based on run status signals showing run statuses of the robots and machines tools and workpiece signals from the detectors, and an instructing means for selecting one work program and one machining program based on the updated production system model and instructing running of the selected work program and work program to the robot and machine tool. Due to this, by calling up a work program of the robot etc. in accordance with the state of the production system, it is possible to change the program and restore the system from error.

Abstract: A plurality of autonomous control processes, with each controlling one or more components of the material transport (or processing) system, is used to radically simplify the controller software. Each autonomous control process is responsible for the actions of only a subset of the cluster tool components. For example, in one embodiment, a separate autonomous control process is used to control each automated component in the material handling system. However, other embodiments in which a control process controls a plurality of components are also contemplated.

Abstract: A control system includes at least one part mounter installing parts on a printed circuit board and a control device integrally controlling the operation of the at least one part mounter. The control device controls the part mounter using information about the printed circuit board and information on a production process flow of the printed circuit board. The control device integrally controls the operations of the part mounters, including receiving and storing information on parts that the part mounters install, information on a feeder that supplies the parts, and information on arrangement of the parts on the printed circuit board, receiving and displaying operation information and operation situations from the part mounters, and controlling operations of the part mounters using the stored information and displayed information.

Abstract: An automatic wafer storage system and a method of controlling the system are disclosed. The automatic wafer storage system includes an analysis module and a storage unit. The analysis module estimates the locations between an idle equipment, a transport tool, and the storage unit, so as to control the storage unit and the transport tool to move to the best location for the transport tool to receive wafers from the storage unit. After that, the transport tool carries the wafers to the idle equipment for processing.

Abstract: A method of manufacturing electronic circuits including generating CAD data, a bill of materials and an approved component vendor list for an electronic circuit and employing the CAD data, the bill of materials and the approved component vendor list for automatically generating a pick & place machine-specific component loading specification, a pick & place machine-specific component placement sequence and pick & place machine-specific component data for governing the operation of at least one specific pick & place machine in a manufacturing line.

Abstract: A substrate processing system (100) includes a main transfer line (20) configured to transfer wafers (W) over the entire system, and an auxiliary transfer line (30) configured to transfer wafers (W) inside a photolithography process section (1a). The photolithography process section (1a) is arranged such that a resist coating process apparatus (2) and a developing process apparatus (5) are disposed separately from each other, a first light exposure process apparatus (3a) and a first PEB process apparatus (4a) are disposed adjacent to each other, and a second light exposure process apparatus (3b) and a second PEB process apparatus (4b) are disposed adjacent to each other.