Abstract: Foot measurement and footwear manufacture systems and methods. A three-dimensional foot frame of a foot and pressure data corresponding to a bottom of the foot are measured, and a first and a second group of characteristic points are respectively determined accordingly. A preset foot skeleton template model is adjusted according to the second group of characteristic points, and merged into the three-dimensional foot frame according to the first group of characteristic points and protrusion points of the adjusted foot skeleton template model. The protrusion points and/or joint points of the adjusted foot skeleton template model are connected to generate at least one line and at least one plane, intersecting the three-dimensional foot frame at contact points and contact planes, respectively. The foot frame size is determined according to the distance between the contact points and the girth of the contact planes.

Abstract: A system for measuring geometrical characters of a figure includes an application server (1), client computers (3), and a database (5). The application server includes: a figure inputting module (10) for inputting a figure of a workpiece and displaying the figure, which is constituted by different kinds of objects; an object filtering module (11) for filtering needless objects and keeping the objects that need to be measured, and for marking the kept objects; a measuring module (12) for measuring the marked objects and obtaining measuring results, and for recording measure paths; a program storing module (13) for storing the measure paths as a program; and a simulative demo module (14) for demonstrating the measure paths via invoking the program. A related method is also disclosed.

Abstract: One or more profile parameters of a structure fabricated on a wafer in a wafer application are determined by developing a correlation between a set of profile models and one or more key profile shape variables. The wafer application has one or more process steps and one or more process parameters. Each profile model is defined using a set of profile parameters to characterize the shape of the structure. Different sets of profile parameters define the profile models in the set. The one or more key profile shape variables include one or more profile parameters or one or more process parameters. A value of at least one key profile shape variable of the process step of the wafer application to be used in fabricating the structure is determined. One profile model is selected from the set of profile models based on the determined correlation and the value of the at least one determined key profile shape variable.

Abstract: The present invention provides a method for evaluating nanotopography of a surface of a semiconductor wafer sliced from a semiconductor ingot, the method being conducted prior to polishing of the surface, the method at least comprising: measuring a surface profile of the wafer in the direction that the wafer is sliced; determining a maximum inclination value of warp change of the wafer surface in a sectional profile in the direction that the wafer is sliced of the measured surface profile; and estimating nanotopography of the wafer surface after being polished based on the determined maximum value. As a result, there are provided a method and an apparatus for evaluating nanotopography of a surface of a semiconductor wafer, and a method for manufacturing a semiconductor wafer exhibiting good nanotopography level on the surface.

Abstract: A system for performing dimension checkings of mechanical pieces is provided including a contact detecting probe with wireless transmission, for example through a single radiofrequency two-way communication link, to and from a base station connected to an interface unit. The probe includes a logic unit and a memory unit in which reside the values of some operation parameters, for example the transmission frequency and/or the activation mode of the probe. The values of the operation parameters can be modified in a programming phase, according to a method that foresees the wireless transmission of control signals from a manually operated control device—to the probe, for updating of the values among the selectable values of a sequence residing in the probe, and the acquisition of the current value.

Abstract: Problems to be solved include problems of an expense in replacing a manual type of roundness measurement apparatus with an automatic type of roundness measurement apparatus; a repair time for maintenance, overhaul or the like of the roundness measurement apparatus; a cost of a replacement component during repair; and the like.

Abstract: A system and method for automatically generating a computation mesh for use with an analytical tool, the computation mesh having a plurality of ?-grid lines and ?-grid lines intersecting at grid points positioned with respect to an inner boundary and an outer boundary. The method includes receiving from a user information corresponding to a shape to be analyzed using the analytical tool and solving one or more mesh equation for a plurality of point locations, the one or more mesh equations depending on a source Jacobian scaling parameter that is not equal to 2.

Abstract: A system and method for automatically generating a computation mesh for use with an analytical tool, the computation mesh having a plurality of ?-grid lines and ?-grid lines intersecting at grid points positioned with respect to an inner boundary and an outer boundary. The method includes receiving from a user information corresponding to a shape to be analyzed using the analytical tool and solving one or more mesh equation for a plurality of point locations, the one or more mesh equations depending on a source decay factor that is inversely proportional to the number of ?-grid lines.

Abstract: A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.

Abstract: The top-view profiles of repeating structures in a wafer are characterized and parameters to represent variations in the top-view profile of the repeating structures are selected. An optical metrology model is developed that includes the selected top-view profile parameters of the repeating structures. The optimized optical metrology model is used to generate simulated diffraction signals that are compared to measured diffraction signals.

Abstract: Arrangements and methods for performing structural clustering between different time series. Time series data relating to a plurality of time series is accepted, structural features relating to the time series data are ascertained, and at least one distance between different time series via employing the structural features is determined. The different time series may be partitioned into clusters based on the at least one distance, and/or the k closest matches to a given time series query based on the at least one distance may be returned.

Abstract: A structured light pattern digitizing method is combined with photogrammetry to determine a 3D model of an object. The structured light digitizing operation generates a 3D model of the object being scanned, and this model is then used to compute a higher accuracy model using photogrammetry.

Abstract: A form measuring instrument comprising: a roughness sensor placed on the table, and for outputting measurement data that includes information on the cross-sectional shape; a relative movement mechanism for relatively moving the table and the roughness sensor such that the position of the roughness sensor on the workpiece is relatively moved along the surface to be evaluated, and for outputting the amount of relative movement at a movement resolution ?? as indexed-movement-amount information; a time sampler for sampling the measurement data output from the roughness sensor, at a constant time interval ts; and a data processing mechanism for converting the measurement data sampled at the constant time interval ts by the time sampler to measurement data having a fixed interval according to the indexed-movement-amount information output from the relative movement mechanism.

Abstract: A method for determining a mobility of foot comprising: measuring at least a portion of a shape of the foot under a first weight load; measuring the at least the portion of the shape of the foot under a second weight load; and comparing the measurement under the first weight load to the measurement under the second weight load, thereby determining a mobility of at least the portion of the foot.

Abstract: A surface texture measuring instrument is provided that is capable of performing a correction operation depending on the rotation angle position of a detector even when the detector is rotated for measurement.

Abstract: A method of inspecting the profile of the connection zone between the cylindrical portion and the taper of a roller for a turbomachine roller bearing. The method includes taking a measurement of the surface profile of the roller; on the basis of a calculation of the first derivative of the measured profile, calculating straight line segments for each of the geometrical zones of the roller, where the straight line segments model the first derivative of the measured profile; calculating the radii of curvature of the surface profile of the roller by taking the first derivative of the straight line segments; and comparing the calculated radii of curvature with predefined threshold values in order to verify continuity thereof.

Abstract: Process for plotting the shape of a contour (5, 6) of a previously machined ophthalmic lens (1), which comprises the steps of: illuminating an optical face (2, 3) of the lens (1) with a flat light beam (15) to form a linear light spot (16) on this face (2, 3), such that the beam (15) extends beyond said face (2, 3) and illuminates the contour (5, 6); forming on the optical reception element (18) an image of the light spot (16); rotating the lens (1) about an axis (A); scanning the contour (5, 6) with the light beam (15); plotting concomitantly on the optical reception element (18) the successive positions of at least one single point of this image corresponding to the illuminated point of the contour (5, 6); deducing the shape of the contour (5, 6).

Abstract: A system and method to fully characterize the thermal behavior of complex 3D submicron electronic devices. The system replaces and/or supplements laser-based surface temperature scanning with a CCD camera-based approach. A CCD camera records multiple points of light energy reflected from an integrated circuit to obtain a static temperature measurement. The system is used to non-invasively measure with submicron resolution the 2D surface temperature field of an activated device. A CW laser illuminates a single point on the surface of an active device and a photodetector records the reflected light energy to obtain a transient temperature measurement. The measured 2D temperature field is used as input for an ultra-fast inverse computational solution to fully characterize the thermal behavior of the complex 3D device. The system extracts geometric features of a known device, assessing the system's ability to combine measured results and computations to fully characterize complex 3D electronic devices.

Abstract: Methods and apparatus for inspecting a component are provided. The method includes receiving a plurality of data points that define a shape of the component, fitting the received data points to a curve that defines a predetermined model shape, and comparing the received data points to the curve defining the predetermined model shape to determine a break radius of the component.

Abstract: A three-dimensional shape measuring method and a measuring apparatus thereof that allow the operation of a robot to be readily taught and set in a short time when a three-dimensional measuring device mounted on the robot is caused to move along the surface of a work, thereby measuring the shape of the work. A block data representative of measurement operation that causes the three-dimensional measuring device, which is a laser scanner, to move along the surface of the work is set and recorded. Then longitudinally copying (Step S2) and laterally copying (Step S3) block data is longitudinally and laterally copied after entering the size and basic shape type of the work. Then the shape of the work is measured on the basis of the copied block data.

Abstract: A system to process requests for wafer structure profile determination from optical metrology measurements off a plurality of structures formed on one or more wafer includes a diffraction signal processor, a diffraction signal distributor, and a plurality of profile search servers. The diffraction signal processor is configured to obtain a plurality of measured diffraction signals of the plurality of structures. The diffraction signal distributor is coupled to the diffraction signal processor. The diffraction signal processor is configured to transmit the plurality of measured diffraction signals to the diffraction signal distributor. The plurality of profile search servers is coupled to the diffraction signal distributor. The diffraction signal distributor is configured to distribute the plurality of measured diffraction signals to the plurality of profile search servers.

Abstract: A data set (D) is provided for machine control of a grinding machine to determine time-efficient, collision-free travel paths. The data set has a collision parameter of “0” or “1” in each separate coordination point (X, Y, Z, A) as well as for each combination of the separated tool types (WZI) and workpiece types (WSJ). The collision parameter indicates if the constellation assigned to the corresponding coordination point (X, Y, Z, A), which means the relative position of workpiece (11) and tool (3), does or does not result in a collision or spatial overlapping of the tool and the workpiece. The data base (D) forms a lookup table that can be used to check given paths or expansions or the step-by-step layout of paths. The computation of time-efficient paths can be performed within a few seconds, even at limited computing capacities.

Abstract: A method and tooling for inspecting a contour of an edge of a cutout formed in a disk, each cutout fixedly receiving a turbine blade. A first device receives the disk containing the cutouts. A second device has a sensor associated with the movement of an instrument, the first device securing the disk at a predetermined orientation to the sensor. The disk is secured to the first device, the instrument being directed along the cutout defining a path substantially parallel to a surface of the contour, the instrument remaining in physical contact with the surface of the contour. The sensor transmits a signal associated with instrument movement to an algorithm to convert the signal to two-dimensional positions along the tangent path along the surface of the contour. The acceptability of the edge contour of the cutout is determined by comparing the two-dimensional positions to predetermined ranges of values.

Abstract: The present invention relates to an improved method for the simultaneous calibration and qualification of a non-contact probe on a localizer using a single artifact, in which non-contact probe readings and localizer readings are synchronised using parameters determined simultaneously with calibration and qualification. The invention also relates to a non-contact probe and other devices, and a computer program for performing the invention.

Abstract: A measuring instrument comprising a stylus displaced following a work, the instrument further comprises a corrector for correcting a displacement in the translation axis direction value according to a height detection axis direction value of the stylus position in a plane specified by the height detection axis and the translation axis, the corrector comprising a calibration measuring device that obtains the calibration measurement data including the displacement information of the translation axis direction value corresponding to the height detection axis direction value of the stylus by moving the stylus; a correction parameter setting device that determines a correction parameter best suited for correcting the measurement error due to the vertical movement error of the stylus based on the displacement information of the stylus; and a measurement data correcting device that corrects a measurement data by using the correction parameter.

Abstract: A dimension of a conductive material in a semiconductor wafer is determined by a computer that treats as identical (a) volume of the conductive material which is proportional to an effective surface area of sidewalls of an insulative trench and (b) volume of the conductive material derived from geometry based on a predetermined amount by which width of a conductive trench (if present) in the conductive material differs from width of the insulative trench. In some embodiments, the computer computes the effective surface area as the product of trench depth and a layout parameter, either or both of which may be partially or wholly empirically determined from a test wafer containing several topographies. The computer computes the dimension assuming one topography and validates the assumption if a predetermined condition is met. If the condition is not met, the computer re-computes the dimension, assuming another topography.

Abstract: An image measurement system and method for obtaining measurement data on objects by processing images of the objects is provided. The image measurement system includes an image obtaining device (101) for obtaining a first image of an object to be measured and a second image of a standard object, and a plurality of measurement computers (103) linked to the image obtaining device via a communication network (102). The measurement computers are used for processing the first image and the second image to obtain measurement data on the object. Each of the measurement computers comprises an image obtaining module (210), an image processing module (220), and an image measuring module (230).

Abstract: A method of measuring warpage of a rear surface of a substrate includes a substrate detection step, a best fit plane calculation step, and a warpage calculation step. Further, the method of measuring warpage of a rear surface of a substrate can further includes after the substrate detection step and before the best fit plane calculation step: a noise removal step and an outer peripheral portion removal step; the outer peripheral portion removal step and a smoothing step; or the noise removal step, the outer peripheral portion removal step, and the smoothing step. Thereby, a method of measuring warpage of a rear surface with a high surface roughness of a substrate can be provided.

Abstract: A theoretical expression of a workpiece (W) the curved surface of which is measured by a measuring probe (110) equipped with a stylus (111) is specified, a measuring area where the measurement is executed on the measuring surface of the workpiece (W) is determined, and the axis angles of the stylus (111) are determined based on the coordinate values and the normal vector of a representative point determined in the measuring area.

Abstract: A method an apparatus for measuring the depths of many fine holes formed in the surface of a sample by etching. Positional information on a plurality of hole patterns is acquired by scanning, with a stylus, the surface of the sample in which the hole patterns are formed by etching. The depths of the plurality of hole patterns are measured by scanning, with the stylus, bottom faces of the plurality of hole patterns and the surface of the sample in the respective vicinities of the hole patterns on the basis of the positional information that has been acquired. Information on distribution of the depths of the plurality of hole patterns is displayed on a screen on the basis of information on the measured depths of the plurality of hole patterns and the positional information on each of the hole patterns.

Abstract: A surface topography detector includes a first sensor, a second sensor and a digital control unit. The angle defined between the center axis of the first sensor and the center axis of the second sensor is equal to or less than 90 degrees. The digital control unit is electrically connected with the first sensor and the second sensor and is arranged for controlling the movement of the first sensor and the second sensor and processing the output signals of the first sensor and the second sensor. The surface topography detector can detect a surface with a bigger range of gradient angle accurately.

Abstract: A computer-based method for generating a scanning program for a stand-alone measuring equipment is provided. The method includes the steps of: receiving parameters, the parameters including output types of probing points; calculating a probing point coordinate multidimensional array; creating probing features; generating 3D program of each probing feature, and forming a control file by assimilating all 3D programs; and transferring the control file to a computer in the measuring equipment and executing the control file by utilizing measuring software in the computer to measure a workpiece. A related system is also provided.

Abstract: Systems and methods are described that facilitate verifying that bottom apertures in tapered vias are open and free of obstruction. Scatterometry can be employed to monitor tapered via formation during and/or after a dry etch process on a photoresist bilayer. Information regarding critical dimensions at the bottoms of tapered vias can be analyzed to assess whether bottom apertures exhibit a minimum acceptable diameter that is equal to or greater than a predetermined threshold tolerance. Via apertures with dimensions below the threshold tolerance and/or regions of a wafer evincing unacceptable frequent occurrences of faulty via apertures are considered occluded, or suspect, and a corrective re-etch can be performed thereon.

Abstract: Systems and methods for determining characteristic transition values such as elbow values in sigmoid or growth-type curves, such as the cycle threshold (Ct) value in PCR amplification curves. A double sigmoid function with parameters determined by a Levenberg-Marquardt (LM) regression process is used to find an approximation to a curve that fits a PCR dataset. Once the parameters have been determined, the curve can be normalized using one or more of the determined parameters. After normalization, the normalized curve is processed to determine the curvature of the curve at some or all points along the curve, e.g., to produce a dataset or plot representing the curvature v. the cycle number. The cycle number at which the maximum curvature occurs corresponds to the Ct value. The Ct value is then returned and may be displayed or otherwise used for further processing.

Abstract: A method for simulating the optical properties of samples having non-uniform line edges includes creating a model for the sample being analyzed. To simulate roughness, lines within the model are represented as combinations of three dimensional objects, such as circular or elliptical mesas. The three-dimensional objects are arranged in a partially overlapping linear fashion. The objects, when spaced closely together resemble a line with edge roughness that corresponds to the object size and pitch. A second method allows lines within the model to vary in width over their lengths. The model is evaluated using a suitable three-dimensional technique to simulate the optical properties of the sample being analyzed.

Abstract: In a state of separating a front end face of an air injecting nozzle 23 from a worked work W by a predetermined interval h, the air injecting nozzle 23 is moved at a constant speed in an X axis direction, injects air from an injecting hole 27a of a nozzle main body 27 and is moved to pass centers O1, O2 of worked holes Wb, Wc of the work W. A variation in a pressure is measured by a pressure measuring unit 30. X axis coordinates of the centers O1, O2 of the holes Wb, Wc, a hole diameter E and a center interval distance D1 are calculated based on coordinates of center points T1, T2 of inclined portions Ld, Lu of a curve Lx of the pressure relative to the measured X axis coordinate.

Abstract: A shape model generation method or system for generating a shape model from shape description data such as X-ray CT data, including a process by virtual probe measuring unit of causing a virtual probe defined as an area having a finite expansion in a virtual space in the shape description data to sequentially scan a plurality of probe paths sequentially set by probe path setting unit, measuring the shape description data and thereby acquiring a characteristic value specific to the position in the virtual space of the virtual probe for each of the probe paths and a process by the probe path setting unit of generating a new probe path using the characteristic value obtained for the probe paths and thereby sequentially setting the plurality of probe paths.

Abstract: An automated system for tool mark analysis includes an acquisition mechanism for acquiring 3D data of tool marks left on the surfaces of specimens by tools, a signature generation module for generating tool mark signatures from the acquired data, an analysis unit for comparing pairs of the tool mark signatures to obtain a numerical similarity value reflective of their similarity, and a database in which the similarity values are stored. An automated method for tool mark analysis involves the steps of acquiring the 3D data of tool marks, generating the tool mark signature, statistically evaluating pairs of the tool mark signatures, and providing a numerical similarity value for each pair of tool mark signatures reflecting the degree of similarity between the tool mark signatures of each pair. The method is carried out with automated assistance of a computer.

Abstract: A method for generating a surface profile of a microstructure. The profile is processed to determine positions of at least two edges and an approximate center point of the profiled surface. Segments of points on the determined profile are fit to a straight line centered at the approximate center point. A standard deviation of the fitted points is measured. The length and position of the segment are varied until a minimum standard deviation is determined and the process is repeated for segments having different lengths. The point is determined from the longest segment having a standard deviation approximately equal to the minimum standard deviation of all of the segment lengths.

Abstract: Provided is a road surface state estimating system for carrying out measuring along a plurality of measuring lines on a paved road surface, which improves the reliability of texture estimation of the road surface. A road surface state estimating system (1) includes a laser displacement meter (11) for measuring a distance to the road surface, a stepping motor (120A), rails (12A and 12B), a ball screw (121A), and mounting members (13A and 13B) for causing the laser displacement meter (11) to scan along the measuring lines, and a stepping motor (130), a rail (13), a ball screw (131), and a mounting member (11A) for moving the laser displacement meter (11) in a direction orthogonal to the measuring lines, which allows the laser displacement meter (11) to carry out measurement along the plurality of measuring lines while it is translated two-dimensionally.

Abstract: An apparatus for measuring sizes of articles including a light projecting device for projecting light toward an article placed on a stationary transparent plate from one side of the plate, a photo-sensor device arranged on the other side of the plate and having plural photo-detectors arranged in array in Y direction to receive light projected from the light projecting device and impinging upon the photo-sensor device without being interrupted by the article, a driving device for reciprocally moving the light projecting device and photo-sensor device relative to the article in X direction perpendicular to the Y direction, and a shifting device for shifting the photo-sensor device in the Y direction between first and second positions which are mutually separated by a half of a photo-detector array.

Abstract: An apparatus and method for displaying the weight or cost of segments of an irregularly shaped item involves passing a sensor bar supported above a supporting surface over the item lying on the surface. A compact hand-held embodiment of the sensor bar enables the operator to move the sensor bar in various linear or non-linear motions over the item surface as the sensor bar moves laterally across the item surface while the sensor bar support posts remain in constant contact with the supporting surface. The sensor bar contains one or more sensors which generate signals corresponding to the height of the item as the sensor bar traverses the item. At the same time, a displacement detector arrangement generates signals corresponding to displacement of the sensor bar relative to the support surface. These signals are processed in a signal processor to determine the volume of an uncut segment of the item lying behind the sensor bar at successive positions.

Abstract: A method of extracting the shape of a probe tip of a probe-based instrument from data obtained by the instrument is provided. The method employs algorithms based on the principle that no reconstructed image points can physically occupy the same region as the tip during imaging. Sequential translates of the tip shape or volume sweep out an area or volume that is an “exclusion zone” similar to morphological erosion. The embodiments of the alternative method use either the region defined by the tip boundary or simply the tip boundary.

Abstract: A method and apparatus for tracing an edge contour of an object in three dimensional space is provided. The method and apparatus is utilized in a computer vision system that is designed to obtain precise dimensional measurements of a scanned object. In order to save focusing time during an automatic tracing measurement, multiple images may be collected and saved for a number of Z heights for a particular position of the XY stage. These saved images can later be used to calculate a focal position for each edge point trial location in the selected XY area rather than requiring a physical Z stage movement. In addition, a Z height extrapolation based on the Z heights of previous edge points can significantly speed up the searching process, particularly for objects where the Z height change of a contour is gradual and predictable.

Abstract: A method of analyzing structural characteristics of sidewall spacers fabricated on a wafer is disclosed. A grating bar having a plurality of grating targets is provided. A theoretical optical scatterometry spectrum is generated by subjecting the grating targets to optical scatterometry. An experimental optical scatterometry spectrum is generated by subjecting the sidewall spacers on the wafer to optical scatterometry. The structural characteristics of the sidewall spacers are equated with the structural characteristics of the grating targets when the theoretical optical scatterometry spectrum substantially matches the experimental optical scatterometry spectrum.

Abstract: An optical contour digitizer including a radiation source for emitting radiation therefrom, a first mirror for folding the radiation emitted from the radiation source towards an object being measured, a second mirror for folding a reflection of the radiation from the object being measured and a sensor for sensing the reflected radiation folded by the second mirror, and a method of using the same.

Abstract: A measurement support apparatus comprises a shape definition data input section, a contour shape generator, a measurement part program input section, an analyzer, a synthesizer, and a display unit. The shape definition data input section is used for entering shape definition data for an object to be measured. The contour shape generates a contour shape based on the shape definition data. The measurement part program input section is used for entering a measurement part program. The analyzer analyzes the measurement part program and outputs the analysis results. The synthesizer synthesizes the analysis results with the contour shape. The display unit displays the synthesis image.

Abstract: A surface scan measuring instrument is provided with: a scanning probe (2) that has a probe sensor (24) for detecting a relative position of a measurement point and a workpiece and scans a workpiece surface; a drive mechanism (12) for moving the scanning probe (2); a joystick (32) for inputting an instruction of a direction and a size with a manual operation; a moving vector commander (43) that generates a moving vector having the direction and the size instructed by the joystick (32); an retraction vector commander (51) that automatically generates a retraction vector for commanding a movement in a retraction direction based on a value detected by the probe sensor (24); a scanning vector commander (44) that generates a scanning vector by combining the moving vector and the retraction vector; and a drive control circuit (45) for controlling a drive of the drive mechanism (12) according to the scanning vector.

Abstract: Systems and methods for measuring a contour match between adjacent components are disclosed. In one embodiment, at least two pressure sensors are located between adjacent components. Each pressure sensor is adapted to obtain a pressure measurement at a location a predetermined distance away from the other pressure sensors, and to output a pressure measurement for each sensor location. An output device is adapted to receive the pressure measurements from at least two pressure sensors and display the pressure measurements. In one aspect, the pressure sensors include flexible thin film pressure sensors. In accordance with other aspects of the invention, a method is provided for measuring a contour match between two interfacing components including measuring at least one pressure applied to at least one sensor between the interfacing components.

Abstract: A non-contact measurement system employing a non-contact optical sensor and an edge detection sensor with a positioning system for moving the sensors over the surface and edges of a part (A) held in a predetermined, fixed position. The part is aligned in a co-ordinate system for obtaining accurate measurements of the part's surface (S) and edges (E). For parts smaller than the optical sensor's field of view, the part is rotated about an axis so both sides of the part are viewed by the sensor. If required, the part can also be shifted linearly along a horizontal axis (X) parallel to the sensor. For parts larger in size than the sensor's field of view, the part is moved along a vertical axis (Y) in predetermined segments so all of the part is exposed to viewing by the sensor.