Abstract: A non-contact, far-field radar nondestructive testing (NDT) method is disclosed that is capable of detecting at least one of defects, damages, and reinforcement conditions in near-surface region of multi-layer systems using monostatic inverse synthetic aperture radar (ISAR) measurements and applicable to various types of structural elements. The method includes the steps of conducting far-field monostatic ISAR measurements, executing an imaging algorithm, and executing a progressive image focusing algorithm.

Abstract: A method, apparatus, and computer usable program code for non-destructive detection of corrosion using quantum dots. In one embodiment, a surface of an area on a commodity associated with a set of quantum dots is tested. A pattern of wavelengths emitted by the set of quantum dots associated with the surface of the commodity is detected to form a quantum dot pattern. The quantum dot pattern is analyzed to determine whether corrosion has occurred in the area on the surface of the commodity.

Abstract: An optical metrology model is created for a structure formed on a semiconductor wafer. The optical metrology model comprises one or more profile parameters, one or more process parameters, and dispersion. A dispersion function is obtained that relates the dispersion to at least one of the one or more process parameters. A simulated diffraction signal is generated using the optical metrology model and a value for the at least one of the process parameters and a value for the dispersion. The value for the dispersion is calculated using the value for the at least one of the process parameter and the dispersion function. A measured diffraction signal of the structure is obtained. The measured diffraction signal is compared to the simulated diffraction signal. One or more profile parameters of the structure and one or more process parameters are determined based on the comparison of the measured diffraction signal to the simulated diffraction signal.

Abstract: Systems and methods for determining two or more characteristics of a wafer are provided. The two or more characteristics include a characteristic of the wafer that is spatially localized in at least one dimension and a characteristic of the wafer that is not spatially localized in two dimensions.

Abstract: A system for providing a compensated Auger spectrum, the system includes: a processor, adapted to generate a compensated Auger spectrum in response to a non-compensated Auger spectrum and in response to an electric potential related parameter, and an interface to an electron detector that is adapted to detect electrons emitted from the first area, wherein the interface is connected to the processor, and wherein the electric potential related parameter reflects a state of a first area of an object that was illuminated by a charged particle beam during the generation of the non-compensated Auger spectrum.

Abstract: A system, program product, and method to perform automated three-dimensional image registration of a part within an inspection cell, are provided. The system can include a laser-ultrasound inspection device having a scanning head to generate ultrasonic surface displacements in a part, an inspection laser, and an interferometer to collect phase modulated light reflected by the part. The system can also include a part position locator positioned to measure a distance between points on a surface of the part and a scanning laser reference location. The system can also include a database containing computer-aided design models for each part of interest, and a model of the inspection cell. The system can further include a laser ultrasound inspection computer communication with the laser-ultrasound detection device and the part position locator, and laser ultrasound inspection program product adapted to perform automated three-dimensional image registration of the part.

Abstract: An inspection system comprises a sensor configured to acquire inspection data of the object, a motion control device, a joint assembly coupled to the motion control device, and a probe housing coupled to the joint assembly and configured to hold the sensor. The inspection system further comprises a compliant element coupled to the probe housing and configured to cooperate with the joint assembly and the motion control device to position the sensor relative to the object. A self-aligning probe assembly is also presented.

Abstract: A foil lid inspection system for detecting and separating defective foil lids on a container in a production line includes one or more light sources, an inspection camera, and inspection software. The light sources are positioned to direct light in an upward direction to illuminate the container. The inspection camera is positioned above the foil lid, and the camera includes one or more outputs. The inspection software is in communication with the inspection camera. The inspection software is constructed and arranged to determine if the foil lid on the container is defective. A reject signal is applied to an output if the software determines that the foil lid is defective.

Abstract: When size of a defect on an increasingly miniaturized pattern is obtained by defect inspection apparatus in the related art, a value is inconveniently given, which is different from a measured value of the same defect by SEM. Thus, a dimension value of a defect detected by defect inspection apparatus needs to be accurately calculated to be approximated to a value measured by SEM. To this end, size of the defect detected by the defect inspection apparatus is corrected depending on feature quantity or type of the defect, thereby defect size can be accurately calculated.

Abstract: A method of detecting a pileup in an energy-dispersive radiation spectrometry system, wherein a filter of the system generates a first pulse in response to a preamplifier signal, and wherein the system has one or more fast channels having an energy of full efficiency wherein substantially all photons received having at least the full efficiency energy are detected. The method includes measuring an above threshold time duration of the filter, determining that the fast channels have not made any detections while the first pulse is above the minimum detectable threshold energy of the filter, in response thereto, declaring a pileup if the above threshold time duration exceeds a longest expected pulse duration that is a duration of a second pulse that would be output by the filter in response to a single photon having an energy equal to the energy of full efficiency being received by the system.

Abstract: A method for processing thermographic data is disclosed including thermally disturbing a specimen of unknown quality, collecting thermal data from said specimen, converting the collected data into a measure of variance and comparing the variance from the sample of unknown quality against the variance of a sample of known quality in order to determine if the quality of the specimen of unknown quality is acceptable.

Abstract: Systems and methods for determining one or more characteristics of a specimen using radiation in the terahertz range are provided. One system includes an illumination subsystem configured to illuminate the specimen with radiation. The system also includes a detection subsystem configured to detect radiation propagating from the specimen in response to illumination of the specimen and to generate output responsive to the detected radiation. The detected radiation includes radiation in the terahertz range. In addition, the system includes a processor configured to determine the one or more characteristics of the specimen using the output.

Abstract: A mask inspecting apparatus and method of inspecting a mask having a plurality of openings used in deposition in a desired pattern, the mask inspecting apparatus capable of detecting a defect of the mask through the openings of the mask.

Abstract: The invention concerns a device for monitoring an imaging or radiotherapy unit (1) for treating members of the human body subject to displacements related to movements of the diaphragm. The invention is characterized in that said monitoring device is designed to enable, in a prior preparation phase, to store two values, called rest value and triggering value, respectively representing, for each patient, of his suspended ventilatory level and an inhalation or exhalation ventilatory level, triggering acquisition of images or irradiation, then, during the real monitoring of the unit (1), in commanding an image or irradiation acquisition, once the correspondence between the measured value of the suspended ventilatory level and the stored rest value has been established, and only when the correspondence between the measured respiratory value of the patient and the stored triggering value has been subsequently established.

Abstract: A time-of-flight PET nuclear imaging device (A) includes radiation detectors (20, 22, 24), electronic circuits (26, 28, 30, 32) for processing output signals from each of detectors (20), a coincidence detector (34), a time-of-flight calculator (38) and image processing circuitry (40). A calibration system (48) includes an energy source (50, 150) which generates an electrical or optical calibration pulse. The electrical calibration pulse is applied at an input to the electronics at an output of the detector and the optical calibration pulse is applied to a preselected point adjacent a face of each optical sensor (20) of the detectors. A calibration processor (52) measures the time differences between the generation of the calibration pulse and the receipt of a trigger signal from the electronic circuitry by the coincidence detector (34) and adjusts adjustable delay circuits (44, 46) to minimize these time differences.

Abstract: An inspection system (9) includes an idler wheel (61) that is coupled to a fabrication system (8) and is in contact with a backing layer (65) of an applied material (64), A rotation sensor (63) monitors the idler wheel (61) and generates a rotational signal. A controller (24) is coupled to the rotation sensor (63) and determines a characteristic of one or more flaws and FOD (19) on a composite structure (12) in response to the rotation signal.

Abstract: When detecting light scattered by an object to be inspected by using a pulse laser as a light source, noise increases unless a sampling repletion period of an A/D converter is determined so as to be related to a pulse oscillation repetition period of the light source. (1) The sampling repletion period of the A/D converter is set equal to the pulse oscillation repetition period of the light source or an integer times thereof, and the sampling is synchronized with oscillation of the light source. Or (2) the sampling repletion period of the A/D converter is set equal to a half-integer times the pulse oscillation repetition period of the light source. Even if a ripple component resulting from emission pulses of the light source remains in the scattered light signal supplied to the A/D converter remains, therefore, its influence can be eliminated or reduced.

Abstract: A method for visualizing the eccentricity of cables which is acquired in the eccentricity measurement of the cables, wherein eccentricity measurements take place at the same time on plural locations spaced apart across the perimeter of the cable during the transportation of the cable, and the measurement values are represented graphically on a display after being processed in a computer, characterized in that a frequency distribution of individual eccentricity values acquired during the measurement interval is represented on the display, wherein the scattering caused by measuring instruments is significantly smaller than the scattering of the individual eccentricity values.

Abstract: An optical signal transmitting apparatus includes a light-emitting element, a light-receiving section, a conductive line and a controller. The light-emitting element converts an electric signal into an optical signal. The light-receiving section converts the optical signal, which is received from the light-emitting element through an optical transmission medium, into an electric signal. The conductive line is connected to an output terminal of the light-receiving section. The light-receiving section outputs an analog signal through the output terminal. The controller controls an extinction ratio of the light-emitting element in accordance with a characteristic impedance of the conductive line.

Abstract: A system for inspecting a pipeline having at least two transducers divided into segments, the segments each containing a number of sensors, wherein a maximum number of segments is equal to a number of transducers, an arrangement configured to send, receive and store signals, wherein the arrangement has a number of pulser channels and a number of receiver channels, wherein the arrangement has at least one multiplexing arrangement for multiplexing signals from the arrangement; and a time delay arrangement connected to the arrangement configured to send, receive and store signals. The system may also provide for focal point skewing, near real time coating compensation for proper excitation mode, adjusted time delay capability and the ability to focus beyond changes in geometry.

Abstract: This present specification provides, amongst other things, an electro-optical monitoring system for obtaining a once-per revolution signal based on the surface reflection of a rotating device that mandates non-contacting sensor input in potentially hostile environments. The system can use optical and electronic sections to illuminate and detect surface reflections from the rotating surface using existing mounting locations on the periphery of the machine to be measured. The electronic portion is configured to determine a unique mark as the once-per-revolution marker or allow an attending operator to assign a specific marker based on the observed reflected pattern. The optical portion consists of a light source, receiver, and optics that allow for focused and directed light paths.

Abstract: An apparatus and method to inspect a defect of a semiconductor device. The amount of secondary electrons generated due to a scanning electron microscope (SEM) may depend on the topology of a pattern of a semiconductor substrate. The amount of secondary electrons emitted from a recess of an under layer is far smaller than that of secondary electrons emitted from a projection of a top layer. Since the recess is darker than the projection, a ratio of a value of a secondary electron signal of the under layer to a value of a secondary electron signal of the top layer may be increased in order to improve a pattern image used to inspect a defect in the under layer. To do this, a plurality of conditions under which electron beams (e-beams) are irradiated may be set, at least two may be selected out of the set conditions, and the pattern may be scanned under the selected conditions.

Abstract: An optical tactile sensor has a touch pad and a CCD camera for imaging behavior of the touch pad. A CPU processes image information from the CCD camera, extracts information on the size, shape, and center of gravity of a contact region, and extracts information on the size of a fixation region. The CPU obtains a normal force from the size of the contact region, obtains a tangential force from the shape of the contact region and the center of gravity of the contact region, and obtains a friction coefficient from the ratio of the size of the fixation region to the size of the contact region.

Abstract: Provided is a method of determining one or more profile parameters of a photomask covered with a pellicle, the method comprising developing an optical metrology model of a pellicle covering a photomask, developing an optical metrology model of the photomask, the photomask separated from the pellicle by a medium and having a structure, the structure having profile parameters, the optical metrology model of the photomask taking into account the optical effects on the illumination beam transmitted through the pellicle and diffracted by the photomask structure. The optical metrology model of the pellicle and the optical metrology model of the photomask structure are integrated and optimized. At least one profile parameters of the photomask structure is determined using the optimized integrated optical metrology model.

Abstract: The inspection system arbitrarily selects from among a plurality of optical conditions to change a distribution of reflected or diffracted light component from an object being inspected. The inspection system has a one- or two-dimensional optoelectric conversion image sensor, optically acquires an image of the object by scanning a stage on which the object is mounted or scanning the image sensor, and processes the image to check for defects in the object. Under each optical condition (illumination optical system, detection optical system, scan direction, etc.) the object being inspected is imaged and, based on the brightness distribution and contrast in the detection field of the image sensor, image sensor output correction data is generated to correct the output of the image sensor.

Abstract: A method including receiving a first line and a second line to be joined at a junction location to provide a reference curve. A corresponding system and computer program product.

Abstract: An apparatus and method for detecting defects on a specimen includes an illumination optical unit which obliquely projects a laser focused onto a line on a surface of the specimen, a table unit which mounts the specimen and which is movable, a detection optical unit which detects with an image sensor an image of light formed by light reflected from the specimen and passed through a filter which blocks diffraction light resulting from patterns formed on the specimen, a signal processor which processes a signal outputted from the image sensor of the detection optical unit to extract defects of the specimen, and a display unit which displays information of defects extracted by the signal processor. The filter is adjustable.

Abstract: Equipment extracts components of spatial frequency that need to be evaluated in manufacturing a device or in analyzing a material or process out of edge roughness on fine line patterns and displays them as indexes. The equipment acquires data of edge roughness over a sufficiently long area, integrates components corresponding to a spatial frequency region being set on a power spectrum by the operator, and displays them on a length measuring SEM. Alternatively, the equipment divides the edge roughness data of the sufficiently long area, computes long-period roughness and short-period roughness that correspond to an arbitrary inspection area by performing statistical processing and fitting based on theoretical calculation, and displays them on the length measuring SEM.

Abstract: A substrate inspection method includes the following steps. Substrates are sequentially moved while an optical system including a light-projecting system and a light-receiving system are moved in a direction orthogonal to the moving direction of each substrate, so as to change the scanned area of each substrate which is scanned with an inspection light having a specific width in the direction orthogonal to the moving direction of the substrate from the light-projecting system; data of the inspected defects of the substrates in the scanned areas are stored for each scanned area; and the stored data of the defects of the substrates in the scanned areas are updated with newly inspected data of the defects of the substrates in the same scanned areas for each substrate, and defect data of one substrate are produced based on the data of the defects of the substrates in a plurality of scanned areas.

Abstract: Methods and apparatus for screening the unknown contents of containers using Raman spectroscopy are disclosed, especially for security screening applications such as in airports. A probe light beam is directed through the wall of a container to a sample region within the container contents. Light scattered out of the beam within the sample region is collected along a path which passes through a separate part of the container wall, for Raman spectral analysis.

Abstract: An X-ray inspection apparatus includes a storage device, a setting device, a determining device, a calculating device and a display control device. The setting device is configured to set a hypothetical reference value that is different from an actual reference value that was used during the inspection of the articles. The determining device is configured to determine whether a contaminant exists inside each of the articles based on a result of a comparison between the hypothetical reference value and each of detection data stored in the storage device. The calculating device is configured to calculate a hypothetical contaminant existence rate as a ratio of a number of the articles in which the determining device has determined that a contaminant exists with respect to a total number of the articles. The display control device is configured to control a display section to indicate the hypothetical contaminant existence rate.

Abstract: A foreign matter detecting apparatus includes a detecting device for detecting foreign matter by measuring smoothness of a surface of an object undergoing measurement, a marking device for providing a dent on the surface of the object with a predetermined horizontal distance from the foreign matter detected by the detecting device, and a mass spectrum measuring device for irradiating and scanning a small area with a primary ion beam, as a part of the object, including the foreign matter and the dent, so as to measure a mass spectrum of secondary ions emitted from the foreign matter located at a position within a predetermined horizontal distance from the dent.

Abstract: Methods for generating a customized spectral profile, which can be used to generate a corresponding filter. A trial source spectrum is generated. An uncorrected lamp source spectrum is determined. One or more optical indices are calculated using the trial source spectrum or the uncorrected lamp source spectrum, and one or more of the optical indices are optimized by varying the trial source spectrum to generate the customized spectral profile.

Abstract: A pattern inspection apparatus which compares images of regions, corresponding to each other, of patterns that are formed so as to be identical and judges that non-coincident portions in the images are defects. The pattern inspection apparatus is equipped with an image comparing section which plots individual pixels of an inspection subject image in a feature space and detects excessively deviated points in the feature space as defects. Defects can be detected correctly even when the same patterns in images have a brightness difference due to a difference in the thickness of a film formed on a wafer.

Abstract: A method of increasing consistency between separate parametric measurement readings that are taken with an electron beam imaging tool at different times within a period of time, by correcting drift in the imaging tool at a time frequency that is less than a time period during which the drift is anticipated to be undesirably large.

Abstract: In a detection step, light produced on a sample in plural directions are collectively detected using a plurality of detectors. Multidimensional features containing information about scattered light distributions are extracted based on a plurality of detector outputs obtained. The feature is compared with data in a scattered light distribution library thereby to determine the types and sizes of defects. In a feature extraction step, a feature outputted based on the magnitude of each of scattered light detected signals of scatterers already known in refractive index and shape, which are obtained in the detection step, is corrected, thereby realizing high precision determination.

Abstract: The present invention is an apparatus for inspecting foreign particles/defects, comprises an illumination optical system, a detection optical system, a shielding unit which is provided in said detection optical system to selectively shield diffracted light pattern coming from circuit pattern existing on an inspection object and an arithmetic processing system, wherein said shielding unit comprises a micro-mirror array device or a reflected type liquid crystal, or a transmission type liquid crystal, or an object which is transferred a shielding pattern to an optical transparent substrate, or a substrate or a film which is etched so as to leave shielding patterns, or an optical transparent substrate which can be changed in transmission by heating, sudden cold, or light illumination, or change of electric field or magnetic field, or a shielding plate of cylindrical shape or plate shape.

Abstract: An optical metrology model for the structure is obtained. The optical metrology model comprising one or more profile parameters, one or more process parameters, and a dispersion. A dispersion function that relates the dispersion to at least one of the one or more process parameters is obtained. A simulated diffraction signal is generated using the optical metrology model and a value for the at least one of the process parameters and a value for the dispersion. The value for the dispersion is calculated using the value for the at least one of the process parameter and the dispersion function. A measured diffraction signal of the structure is obtained using an optical metrology tool. The measured diffraction signal is compared to the simulated diffraction signal to determine one or more profile parameters of the structure. The fabrication tool is controlled based on the determined one or more profile parameters of the structure.

Abstract: The disclosure relates to a defect detection system for identifying defects in weld seams. An exemplary system comprises a scanner device, which is mounted on a displacement device of a processing unit and which can be displaced by said unit over at least one weld seam that is to be examined. The scanner unit scans the weld seam using a predefinable frequency, each scanning sweep being correlated with a time signal and the time signal being used to record the point in time when at least one location containing defects is scanned. The system is equipped with an analysis module to determine the co-ordinates of the defects from the signals that are obtained by means of the scanning sweeps. The analysis module also stores the co-ordinates of the defects and transmits them to a localisation module.

Abstract: A circuit board detecting device and a detecting method are provided. The circuit board detecting device includes an image capture apparatus and a main unit. The image capture apparatus is coupled to the main unit to capture images of the surfaces of a sample circuit board and a test circuit board. In addition, the main unit is used to receive a sample frame and a test frame and compare the images of every object on the sample frame with the images of every object on the test frame to confirm if the test circuit board has flaws on the surface.

Abstract: Systems and methods for determining two or more characteristics of a wafer are provided. The two or more characteristics include a characteristic of the wafer that is spatially localized in at least one dimension and a characteristic of the wafer that is not spatially localized in two dimensions.

Abstract: To effectively reduce a measurement error in a parameter indicating a state of spectroscopic polarization generated by variations in retardation of a retarder due to a temperature change or other factors, while holding a variety of properties of a channeled spectroscopic polarimeter. By noting that reference phase functions ?1(?) and ?2(?) are obtained by solving an equation from each vibration component contained in a channeled spectrum P(?), the reference phase functions ?1(?) and ?2(?) are calibrated concurrently with measurement of spectrometric Stokes parameters S0(?), S1(?), S2(?), and S3(?).

Abstract: A method for modeling samples includes the use of control points to define lines profiles and other geometric shapes. Each control point used within a model influences a shape within the model. Typically, the control points are used in a connect-the-dots fashion where a set of dots defines the outline or profile of a shape. The layers within the sample are typically modeled independently of the shape defined using the control points. The overall result is to minimize the number of parameters used to model shapes while maintaining the accuracy of the resulting scatterometry models.

Abstract: A plant protection instrumentation equipment, comprises, a sensor that detects a process signal indicating a quantity of a state of a plant, a plurality of A/D converters, each of the A/D converters converts the process signal into a digital signal and outputs a value corresponding to the digital signal, a plurality of instrumentation circuits, each of the instrumentation circuits receives the value corresponding to the process signal and performs a logical operation using the value, and a judgment circuit that judges the state of the plant based on outputs of the plurality of instrumentation circuits and outputs an operation signal based on the process signal, wherein each of the instrumentation circuits comprises a logical integrated circuit including a set value comparator that compares the value corresponding to the process signal with a predetermined set value, and outputs a signal when the value corresponding to the process signal exceeds the set value.

Abstract: An optical receiving apparatus that receives an optical signal and outputs a data value of digital data transmitted by the optical signal is provided, including a light receiving element that receives the optical signal and outputs a photocurrent according to a strength of the optical signal, a present cycle integrator that integrates the photocurrent corresponding to a present cycle of the digital data over a prescribed period within the cycle, a previous cycle integrator that integrates the photocurrent corresponding to a cycle prior to the present cycle over a period that is substantially equal to the prescribed period in the cycle, and a data value identifying circuit that outputs a data value of the present cycle of the digital data based on a difference between a charge amount obtained through integration by the present cycle integrator and a charge amount obtained through integration by the previous cycle integrator.

Abstract: A method of identifying a material using an x-ray emission characteristic is provided. X-ray data representing a monitored x-ray emission characteristic is obtained from a specimen in response to an incident energy beam. A dataset is also obtained, this comprising composition data of a plurality of materials. The material of the specimen is contained within the dataset. Predicted x-ray data are calculated for each of the materials in the dataset using the composition data. The obtained and the predicted x-ray data are compared and the likely identity of the material of the specimen is determined, based upon the comparison.

Abstract: Described herein are systems and methods that provide the ability for ultrasonic inspection to be performed on both traditional and composite materials in the field to automatically identify defects with minimal error.

Abstract: Apparatus for producing an object by sequentially forming thin layers of a construction material one on top of the other responsive to data defining the object, the apparatus comprising: a plurality of printing heads each having a surface formed with a plurality of output orifices and controllable to dispense the construction material through each orifice independently of the other orifices; a shuttle to which the printing heads are mounted; a support surface; and a controller adapted to control the shuttle to move back and forth over the support surface and as the shuttle moves to control the printing heads to dispense the construction material through each of their respective orifices responsive to the data to form a first layer on the support surface and thereafter, sequentially the other layers; wherein each printing head is dismountable from the shuttle and replaceable independently of the other printing heads.

Abstract: The teachings provided herein are generally directed to a non-destructive method of measuring a moisture content profile across a dimension of a hygroexpansive, composite material using radiation and a volumetric shrinkage correction. The measurement of a series of moisture content profiles over time can provide, for example, a measure of the movement of moisture during the process of drying of the composite material.

Abstract: The invention is directed to detect a warp amount in a real-time manner in a wafer rotating at high speed under inspection.