Abstract: One exemplary embodiment is a method for detecting existence of an undesirable particle between a planar lithographic object, such as a semiconductor wafer or a lithographic mask, and a chuck during semiconductor fabrication. The exemplary method in this embodiment includes placing the planar lithographic object, such as the semiconductor wafer, over the chuck. The method further includes measuring a change in at least one electrical characteristic formed by and between the chuck and the planar lithographic object, such as measuring a change in capacitance between the chuck and semiconductor wafer, caused by the undesirable particle.

Abstract: Aspects of the present disclosure include systems and methods for indicating an amount of use of a pulse oximetry sensor. According to one embodiment, the system includes an oximeter that monitors the amount of use for a given sensor. The oximeter and/or the sensor may advantageously include a visual alarm, an audio alarm, a vibrational alarm, a power down function, or the like, which can be activated when a predetermined amount of use has expired. According to another embodiment, the system includes a sensor having a memory device storing a unique identifier.

Abstract: A method of testing a physical manufacturing automation system for manufactured work pieces is provided via a testing system and includes connecting a computer-simulated manufacturing automation system to a controller of the physical manufacturing automation system, wherein the computer-simulated manufacturing automation system is configured to represent a portion of the physical manufacturing automation system, including a simulated work piece. The method then includes concurrently running the physical manufacturing automation system and the computer-simulated manufacturing automation system via the controller, with the physical automation system running in the absence of the physical work pieces.

Abstract: By performing a two-step approach for predicting a quality distribution during the fabrication of semiconductor devices, enhanced flexibility and efficiency may be accomplished. The two-step approach first models electrical characteristics on the basis of measurement data, such as inline measurement data, and, in a second step, an appropriate distribution for the electrical characteristics may be established, thereby obtaining modeled wafer sort data which may then be used for predicting a quality distribution of the semiconductor devices under consideration.

Abstract: A method for controlling a semiconductor manufacturing apparatus for processing wafers divided for each lot, has acquiring quality control value data group containing quality control value data of wafers in a plurality of lots previously processed, and an equipment engineering system parameter group containing equipment engineering system parameters corresponding to the wafers; creating a prediction formula of quality control value data, acquiring a first equipment engineering system parameters; inputting the first equipment engineering system parameters to the prediction formula, and performing calculation to predict first quality control value data of the wafers in the first lot; determining processing of the wafers corresponding to the first quality control value data; acquiring measured first quality control value data of the wafers in the first lot; replacing the quality control value data corresponding to the wafers in the first processed lot; updating the prediction formula.

Abstract: Techniques for estimating a quality of one or more wafers are presented. One or more first wafers comprising one or more first dies are tested. A probability of wafer failure is determined in accordance with one or more first test measurements of the one or more first dies. A pass status and/or a fail status of one or more second wafers is inferred by testing a select one or more second dies of the one or more second wafers and evaluating one or more second test measurements of the select one or more second dies in accordance with the determined probability of wafer failure.

Abstract: A method, apparatus, and a system for generating a binary mapping of wafer regions using measured value. A first measured value relating to processing a first workpiece is acquired. A second measured value relating to a second workpiece is acquired. At least a first region common to the first and second workpieces is defined. A determination is made as to whether the results associated with the first or second measured value is above a predetermined threshold. A first binary value is assigned to the first region based upon a determination that the results associated the first or second measured value data is above the threshold.

Abstract: Embodiments of the present invention comprise a quality control system and method for testing micro- or nano-channeled devices. The system and method can utilize a pressure-driven gas flow for the detection and quantification of structural defects. The test method and system are non-destructive and allow defects to be detected and classified quickly based on measured factors, such as mass flow rate for a given pressure differential.

Abstract: An average fault ratio is calculated from product characteristics of a product as a target of yield prediction, in order to predict yield accurately in the course of manufacturing the prediction target product. With respect to a reference product, whose wiring pattern is different from the prediction target product but manufactured by the same manufacturing process, a monthly electric fault density is calculated from actually measured data. Respective average fault ratios are obtained from product characteristics of the prediction target product and the reference product. A monthly electric fault density of the prediction target product is obtained by multiplying the monthly electric fault density of the reference product by the ratio of the average fault ratios. The yield is calculated by using the monthly electric fault density of the month in which a yield prediction target lot of the prediction target product was processed.

Abstract: Classification of spatial patterns on wafer maps is generally described. In one example, a method includes applying K-means type clustering to wafer maps comprising one or more spatial patterns to group one or more clusters comprising wafer maps having similar spatial patterns and producing a dendrogram using a clustering process to display the one or more clusters.

Abstract: Methods and systems to detect abnormal operations in a process of a process plant include collecting on-line process data. The collected on-line process data is generated from a plurality of dependent and independent process variables of the process, such as a coker heater. A plurality of multivariate statistical models of the operation of the process are generated using corresponding sets of the process data. Each model is a measure of the operation of the process when the process is on-line at different times, and at least one model is a measure of the operation of the process when the process is on-line and operating normally. The models are executed to generate outputs corresponding to loading value metrics of a corresponding dependent process variable, and the loading value metrics are utilized to detect abnormal operations of the process.

Abstract: A quality control method using a plurality of analyzers and a control device connected to the analyzers via a network, the method comprising: (a) measuring quality control samples by the analyzers; (b) collecting a plurality of quality control data obtained by measuring the quality control samples; (c) implementing a quality control by the control device based on the collected quality control data; (d) obtaining uncertainty of measurement of analyzer based on uncertainty of analyzer calibration and the quality control data; (e) outputting a result of the quality control; and (f) outputting the uncertainty of measurement is disclosed. A quality control system and an analyzer are also disclosed.

Abstract: A method and system of location specific processing on a plurality of substrates is described. The method comprises measuring metrology data for the plurality of substrates. Thereafter, the method comprises computing correction data for a first substrate using the metrology data, followed by computing correction data for a second substrate using the metrology data. While computing the correction data for a second substrate, the method comprises applying the correction data for a first substrate to the first substrate using a gas cluster ion beam (GCIB).

Abstract: An improved simulator for an analytical instrument that provides the student with an experience similar to that of operating the actual instrument. In one preferred embodiment, the invention combines real functionality and simulated functionality where at least one function of the analytical instrument is real. In another preferred embodiment, the invention combines a functional first instrument along with a simulation of a second instrument, the simulation including both hardware with limited functionality and software that simulates the output of a functional instrument to create a teaching aid for use in classrooms and teaching laboratories.

Abstract: A process for a prognosis of faults in electronic circuits identifies parameters of a circuit under test. An upper and a lower limit is determined for one or more components of the circuit under test. A population of faulty and non-faulty circuits are generated for the circuit under test, and feature vectors are generated for each faulty and non-faulty circuit. The feature vectors are stored in a fault dictionary, and a feature vector for an implementation of the circuit under test in a field operation is generated. The feature vector for the implementation of the circuit under test in the field operation is compared to the feature vectors in the fault dictionary.

Abstract: A defect testing apparatus for testing defects of optical film sheet-shaped product of an optical displaying apparatus, which includes a defect detecting means for detecting defects of a monolayer body and/or a laminate body constituting the sheet-shaped product in a state in which a protective layer on a surface of the sheet-shaped product is not disposed and defect information preparing means for preparing defect information which is information related to the defects detected by the defect detecting means, and the defect information is used for producing the sheet-shaped product provided in a roll form or in separate sheets.

Abstract: Methods, computer-readable media, and systems for automatically performing Human Factors Process Failure Modes and Effects Analysis for a process are provided. At least one task involved in a process is identified, where the task includes at least one human activity. The human activity is described using at least one verb. A human error potentially resulting from the human activity is automatically identified, the human error is related to the verb used in describing the task. A likelihood of occurrence, detection, and correction of the human error is identified. The severity of the effect of the human error is identified. The likelihood of occurrence, and the severity of the risk of potential harm is identified. The risk of potential harm is compared with a risk threshold to identify the appropriateness of corrective measures.

Abstract: A method for use in semiconductor fabrication is provided that includes providing manufacturing data of a semiconductor process, providing a plurality of functional transformations, optimizing each of the functional transformations based on the manufacturing data, selecting one of the functional transformations that has a least deviation with respect to the manufacturing data, predicting performance of the semiconductor process using the selected transformation function, and controlling a fabrication tool based on the predicted performance.

Abstract: The method was tackled with picking line for generating strip steel for the automobile industry. The initial conditions to which the tandem-type mill coupled with picking line executed using the installation is exposed. The installation receives an input in the form of human resources, energy, media, raw materials, semifinished product, etc., which is converted by the installation into output. Since the plant is a hot rolling mill, the output is in the form of hot rolled strips. The different components of the input can be assigned to the factor markets that are relevant to the real installation. The different components of the output can further be assigned to the product markets that are relevant to the real installation.

Abstract: By directly using relative biases, contained in the relative bias date matrix, and by appropriately weighting the components thereof, sampling rate limitations in an APC control scheme may be efficiently compensated for. In particular embodiments, an age-based weighting factor is established that scales measurement data uncertainty according to the delay with which the corresponding measurement data for a specific control thread are obtained.

Abstract: Systems and methods for modeling a subscriber network experience. In one embodiment, a method includes the act of receiving a plurality of subscriber metrics associated with a subscriber to an access network. The method also includes the act of modeling the subscriber experience by applying at least one transformation to the plurality of subscriber metrics to produce a set of subscriber experience data. The metrics measure quality of service for a subscriber experience with the access network. Each element of the subscriber experience data quantifies an aspect of the subscriber experience.

Abstract: A production information reporting/recording system is disclosed herein including a number of features to ensure efficient, flexible and reliable recording of production data in a manufacturing system. Such features include validating the content of event messages to ensure compliance of event report information with a standard. The system also supports caching IDs associated with particular aspects of an event message (e.g., a production request, a process segment) as well as a unique ID corresponding to the ID assigned by the production event database to reduce the need to access the database when assigning unique database IDs to received events. The production event messaging system also supports both asynchronous and synchronous transactional messaging between the sources of events and the production database service.

Abstract: Recipe steps of a manufacturing process run that generated a fault are displayed in a current view of a user interface, the recipe steps being displayed in association with a first axis. At least one of measured parameters or calculated parameters of the manufacturing process run are displayed in the current view, where at least one of the measured parameters and the calculated parameters are displayed in association with a second axis. A plurality of intersections of the recipe steps with at least one of the measured parameters or the calculated parameters are displayed in the current view, each of the plurality of intersections including a representation of a fault contribution attributable to at least one of a distinct measured parameter or a distinct calculated parameter at a distinct recipe step.

Abstract: A system and method is disclosed for providing automatic qualification intervention in a manufacturing process that is performed by a plurality of components. At least one qualification process is associated with each of the components. The qualification processes are stored in a component/qualification matrix in a computerized database management system. The automatic qualification intervention system requires that all qualification processes for a component must be performed in conformity with the qualification processes for the component that have been stored in the component/qualification matrix. The automatic qualification intervention system significantly reduces the delays that are inherent in prior art methods.

Abstract: A method that involves matching the trend of process outcome with the trend of process variables to identify the variables that have an impact on the process outcome is disclosed. The method for process trend matching comprises processing of raw data of process outcome and of process variables using an outlier filtering method, smoothing these data using common smoothing algorithm like Kernel, dividing smoothed raw data equally into time intervals, computing the gradients of the points at both ends of the time intervals, and translating the gradients into a scale based on the magnitude of the gradients. The following steps comprise comparing the process outcome and each process variable independently for same time frame, and assigning a score for both outcome and variable. The sum of the scores is then computed which is used to determine the quality of fit. A real-time monitoring system is then set up to monitor these variables for any drifts.

Abstract: System and method for implementing wafer acceptance test (“WAT”) advanced process control (“APC”) are described. In one embodiment, the method comprises performing an inter-metal (“IM”) WAT on a plurality of processed wafer lots; selecting a subset of the plurality of wafer lots using a lot sampling process; and selecting a sample wafer group using the wafer lot subset, wherein IM WAT is performed on wafers of the sample wafer group to obtain IM WAT data therefore. The method further comprises estimating final WAT data for all wafers in the processed wafer lots from IM WAT data obtained for the sample wafer group and providing the estimated final WAT data to a WAT APC process for controlling processes.

Abstract: A system for correcting quality problems includes a server (1), a database (2), and a plurality of client terminals (4) connected to the server through a network (3). The database stores data used or generated in utilizing the system. Each client terminal provides an interactive user interface for quality control operators to perform corrective actions. The server comprises: a data receiving module (12) for receiving confirmations and responses from the client terminals through the network; a data transmitting module (13) for transmitting initial corrective action reports generated by the server to corresponding client terminals, for operators located at the client terminals to reply to the initial corrective action reports; and a CAR (corrective action report) generating module (14) for integrating all data received by the data receiving module and automatically generating formal corrective action reports. A related method for correcting quality problems is also disclosed.

Abstract: A system and method for analyzing mutilation defects including a benchmark image of a part and a grid having a plurality of cells plotted onto the benchmark image is provided. The system further includes a computer processing unit having an interface operable to associate each identified mutilation defects with the associated cell where the mutilation defect occurred. The system and method further includes a plotting circuit having a code. Each of the labels is associated with a predetermined occurrence of mutilation defects within a given cell. The plotting circuit counts each occurrence of a mutilation defect within each of the cells and plots the associated label within the cell so as to improve the quality control of a part by providing a map showing the frequency of mutilation defects on a particular part of a mass produced product.

Abstract: Some embodiments of the present invention provide a system that generates a simulated vibration pattern in a computer subsystem. During operation, a vibration pattern is monitored at a location in the computer subsystem, wherein the vibration pattern is monitored while the computer subsystem is incorporated into the computer system and the computer system is operating. Then, the vibrations of the computer subsystem are mimicked by generating the simulated vibration pattern at the same location in the computer subsystem based on the monitored vibration pattern.

Abstract: According to typical inventive practice, a baseline describing a statistical distribution is established for a set of historical occurrences of an event. Comparison is made between the baseline and at least one current occurrence of the same event. Any current occurrence that is anomalous vis-à-vis the baseline is considered a possible leading indicator. According to some inventive embodiments of graphical presentation of such comparison, at least one graphical baseline comparative display component is rendered that includes a “bar” (describing a historical statistical distribution with respect to a criterion pertaining to occurrence of an event) and a “slider” (describing one or more current occurrences of the event). The bar includes at least one band representing a statistical mean range, and at least one band representing a statistical outlier range. Situation of the slider along the bar indicates whether and to what extent the current occurrence(s) is/are anomalous vis-à-vis the baseline.

Abstract: A method of inspecting equipment to ensure quality control that employs a computer program to assist in the inspection. The program contains an inspection protocol adapted to specific equipment. The inspector follows the protocol to inspect component parts of the equipment. The inspection protocol can only be closed, indicating completion of the inspection, when the protocol has been followed. The program is capable of generating a variety of inspection reports.

Abstract: A process debug method used to identify at least one excursive machine in a manufacturing process comprising the following steps: First, a series of validity identification data is collected, and the serial validity identification data is associated with its pathway to obtain a plurality of validity identification data sequences in corresponding to the machines. Subsequently, a sorting process is conducted to cluster the validity identification data sequence into several groups, and the clustered groups are ranked into a first order. The validity identification data sequences are subjected a continuity analysis to determine the continuity of the defects occurring in a particular machine. And the continuities of the machines involved in a particular group are ranked into a second order. Accordingly, the excursive machines causing the defective end products in the manufacturing process can be identified by the way of joining the second orders according to the first order.

Abstract: The present invention is an integrated method and apparatus for determining the quality of electrochemical energy storage devices, especially batteries. The invention is based on an integrated usage of electromagnetic and ultrasonic energy to probe of the interior volume of the battery. The first probe is carried out when the battery is at an initial charged state. After the first probe stage, a discharge of the battery being diagnosed is carried out until the test battery is at a small fixed test charge value. Signals from the eddy current probes allow determination of the continuity of the discharge current during the discharge process. After the discharge of the battery, the above described test sequence is repeated. The resultant eddy current signal generated at the initial state of the battery and the gradients of the eddy current signal and of the ultrasonic signal versus the battery capacity is determined.

Abstract: There is provided a manufacturing system for manufacturing an electronic device through a plurality of manufacturing stages. The manufacturing system includes a plurality of manufacturing apparatuses performing processes corresponding to the plurality of manufacturing stages.

Abstract: A method increases a reliability of packaged semiconductor integrated circuit dice by identifying one or more dice on a wafer having failed an electrical test. One or more failed dice are added to a character map. A first tier of buffer dice is added to the initial character map adjacent to each die on the character map. Both the failed dice and the first tier of buffer dice are indicated or marked, such as by inking, thereby indicating dice not requiring packaging. A wafer may include multiple die, with die corresponding to the die in the character map being marked. The marked die thus include die that have failed an electrical test plus die that may be likely to fail in the future due to their proximity to the failed die.

Abstract: A method for monitoring machine conditions is based on machine learning through the use of a statistical model. A correlation coefficient is calculated using weights assigned to each sample that indicate the likelihood that that sample is an outlier. The resulting correlation coefficient is more robust against outliers. The calculation of the weight is based on the Mahalanobis distance from the sample to the sample mean. Additionally, hierarchical clustering is applied to intuitively reveal group information among sensors. By specifying a similarity threshold, the user can easily obtain desired clustering results.

Abstract: A process for the automatic control of the thickness of extruded film lowers the deviations in the thickness of the film more quickly after the start of the extrusion process. The process includes the measurement of the thickness profile of the film just extruded by means of a thickness-measuring probe. The thickness-measuring probe is moved along the surface of the film substantially perpendicular to the conveying direction of the extruded film. The thickness-measuring probe records a thickness profile of the film for each measuring cycle at least over parts of the expansion of the film perpendicular to its conveying direction. While providing statistical values in relation to older measured values, the latest measured values during a predetermined time-frame at the start of the extrusion process are more heavily weighted by a computer than those measured during the normal operation.

Abstract: A method for the analysis, control, automation, and information management of life-cycle processes of technical products includes an engineering process, an analysis process, a test process, and accesses an information system. The engineering process, the analysis process and the test process, which includes a plurality of test modules, have connections for information exchange exclusively to the control process and information system. For every test of the test modules, the scope and form of the input and output values are determined by data stored in the information system. The data that are input into the engineering process and determined, and the specified values, are processed by the process control, which determines all of the tests to be carried out. The results are passed on to the process control. The analysis process determines if data and specified values input in the engineering process have been reached by a numerical or numerical/statistical calculation.

Abstract: According to the present, there is proved a semiconductor fabrication apparatus management system having: a sensor which monitors and outputs a plurality of apparatus parameters of a semiconductor fabrication apparatus which fabricates a semiconductor device; a measurement unit which measures a dimensional value of the semiconductor device, and outputs the dimensional value as dimensional data; an apparatus parameter storage unit which stores the apparatus parameters; a dimensional data storage unit which stores the dimensional data; an apparatus parameter controller which calculates predicted dimensional data by extracting the dimensional data from the dimensional data storage unit, and controls at least one of the plurality of apparatus parameters on the basis of the predicted dimensional data; and an abnormality factor extraction unit which analyzes correlations between the controlled apparatus parameter and other apparatus parameters, and extracts an abnormal apparatus parameter on the basis of a calculat

Abstract: A testing method includes: storing QC data for each of electronic device manufacturing processes in a storage unit; changing the QC data for each of the processes to a common fixed form of data; providing a contour for the QC data for each of the processes using the common fixed form of data; comparing a singularity map to a failure generation map for a completed device; and finding a causal process for a failure and a defect through the comparison.

Abstract: The present invention quickly resolves troubles in an analyzer and performs effective external quality control management. An analyzer (2) and a control device (1) are connected by a network (3). Error data and sample data taken from assay of a quality control substance are transmitted from the control device (1) to the analyzer (2). The analyzer (2) is made to be remotely operable from the control device (1) and when troubles arise repair from the control device (1) is possible. The control device (1) tallies sample data, and provides the tally results to a Web page. The analyzer (2) accesses the Web page using a WWW browser, and can perform external quality control in real time.

Abstract: A system and method that enables a laboratory to integrate its internal and external quality control programs to thereby control the quality of its laboratory testing services. The system has a storage device and a processor operable to maintain in the storage device a database identifying a plurality of laboratory tests and the corresponding internal laboratory statistical data, group statistical summary data and control rules. The processor is also operable to calculate a control range for a specified laboratory test by applying the group statistical summary data (and, in some cases, the internal laboratory statistical data) to the control rule corresponding to the specified laboratory test. Preferably, the processor is also operable to receive a test result from a laboratory instrument, and determine whether the test result falls within the calculated control range for the specified laboratory test. Various exemplary embodiments of the system and associated method are provided.

Abstract: The invention relates to a peak position correcting method that is a pre-process for testing whether properties of a product, a raw material, etc., are good or defective from a spectrum waveform pattern. The method involves setting a reference peak position in a single region including a spectrum waveform pattern, or setting reference peak positions in each of a plurality of regions; specifying a peak to be corrected as an object of correction in the single region or each of the plurality of regions; shifting the peak to be corrected to the reference peak position in the single region or in each of the plurality of regions; and substantially proportionally expanding or contracting the spectrum waveform pattern positioned at both sides of the peak to be corrected in the horizontal axis direction.

Abstract: An inspecting method includes registering a pre-obtained relationship between contact time of probes with a target object having a predetermined temperature and tip positions of the probes which vary in accordance with the contact time. The method further includes inspecting one or more chips at a time by estimating the tip positions of the probes based on the relationship and the contact time of the probes with the one or more chips and then correcting the tip positions of the probes from previous tip positions based on the estimated tip positions until the probes are stable without being extended or contracted.

Abstract: A computer-based method for controlling product quality is disclosed. The method includes the steps of: detecting whether a quality of raw materials bought from at least one supplier are acceptable; detecting whether a quality of using materials used at a processing procedure are acceptable; detecting whether a quality of products being manufactured at the processing procedure are acceptable; receiving and storing a post-procedure report obtained by sampling the products after the processing procedure; repeating steps of detecting materials used at a processing procedure, detecting products being manufactured at the processing procedure, detecting the sampling products after the processing procedure, and completing the manufacturing if all the products are finished. A related system is also disclosed.

Abstract: A system for controlling the quality of industrial processes including the steps of: having one or more reference signals relating to the industrial process, acquiring one or more real signals which are indicative of the quality of said industrial process, obtaining a transformed signal from the reference signal, obtaining a transformed signal from the real signal, calculating energies of the transformed reference and real signals, comparing the one or more reference signals to the one or more real signals to identify defects in the industrial process. Also, the comparing step includes: comparing the energies of the transformed reference and real signals to each other to extract corresponding time frequency distributions for selected frequency values, calculating energies of the time frequency distributions, and comparing the energies of the time frequency distributions with threshold values to identify energy values associated to defects.

Abstract: Usually in automated production processes, new model ranges must be created and new calibrations carried out which may be costly, if a product is perfected or individual ingredients are exchanged. The aim of the invention is to simplify and also automate the recalibration. To achieve this, if there is a deviation from the product characteristics, a new calibration model is calculated, taking into consideration the modified ingredients. The process is modified as a result of the new calibration model in such a way that the model range that has been defined as the process objective is achieved again despite the modification of individual components.

Abstract: An accounting method and system is disclosed that provides for real time financial accounting of plant performance at a sub-plant level. A multiplicity of process variable transmitters is utilized to sense, in real time, the current state of the processes and process equipment used in a manufacturing plant. Sub-plant accounting modules utilize the sensed process data to calculate a plurality of sub-plant accounting measures, which are stored in one or more real time plant historian. The accounting measures are typically converted to a suitable format and subsequently stored in a production model accounting database where they are accessible to an accounting module.

Abstract: Non-intrusive speech quality assessment method and apparatus for storing a sequence of intercepted packets associated with a call, each packet containing speech data, and an indication of a transmission time of the packet; storing with each intercepted packet an indication of an intercept time of the packet; extracting a set of parameters from the sequence of packets; and generating an estimated mean opinion score in dependence upon the set of parameters. The extracting step comprises the sub steps of: generating a jitter parameter for each packet of the sequence of stored packets; generating a long term average jitter parameter for the stored packet; and generating a differential jitter parameter in dependence upon the jitter parameter for the stored packet and the long term average jitter parameter.

Abstract: What has been developed is a method for testing ophthalmic plastic lenses and ophthalmic plastic lens-making processes for compliance with federal safety performance requirements. The method of the invention provides an easier, less costly, and more effective means for complying with these safety performance requirements than what current methods provide.