Abstract: A liquid ethylenically unsaturated polyetherurethane composition having a viscosity at 24.degree. C. of 1000 to 10,000 centipoises dispersible in dilute aqueous sodium hydroxide is capable of being polymerized by actinic light to yield a solid having a Shore A hardness of at least 30 when the composition contains 0.5 to 15 percent dialkyl, aminoalkyl, acrylate or methacrylate. The resulting polymer is capable of taking on excellent halftone or half dot quality.

Abstract: A coating method is provided based on the use of a UV curable mixture of a polyolefin and a polythiol having an onium salt photoinitiator. There are also provided, ultraviolet radiation curable compositions useful as coating compositions.

Abstract: A light-sensitive resin composition containing (a) at least one ethylenically unsaturated compound having at least two terminal ethylenically unsaturated groups, which is capable of forming a polymer through photo-addition polymerization, and which has a boiling point of about 100.degree. C. or higher at atmospheric pressure, (b) an addition polymerization initiator activatable by irradiation with actinic radiation, and (c) an organic high polymer binder having water-solubilizing groups in the side chains thereof, wherein the improvement comprises the binder being a copolymer containing (A) a repeating unit derived from at least one compound selected from the group consisting of acrylic acid and methacrylic acid and (B) a repeating unit derived from at least one compound selected from the group consisting of benzyl acrylate, benzyl methacrylate, phenethyl acrylate, phenethyl methacrylate, 3-phenylpropyl acrylate, 3-phenylpropyl methacrylate, 4-phenylbutyl acrylate and 4-phenylbutyl methacrylate.

Abstract: A presensitized printing plate contains a leuco dye and an organic azide to provide a print-out image when the presensitized plate is exposed to light. Development of the plate may remove the print-out image but provides a relief image which may be dyed or pigmented. The light sensitive unsaturated materials used to provide the relief image include photocrosslinkable unsaturated polymers containing the moiety ##STR1## as part of the polymer backbone.

Abstract: Cationic polymerization of epoxy resin materials, such as epoxy monomers or prepolymers, can be achieved by use of certain radiation sensitive aromatic onium salts of Group VIa elements. Curable compositions are provided which can be used as sealants, coating compounds, encapsulants, etc.

Abstract: It has been found that excellent quality photopolymer printing plates having hardness, flexibility, resilience, abrasion resistance and resistance to alcohol-based inks can be prepared from photopolymer compositions comprising a liquid polymer containing at least two terminal olefin groups attached to the polymer through a combination of at least two ether, thioether, ester, keto or amide groups, from about 1 to about 50% by weight based on the polymer of at least one ethylenically unsaturated monomer, from about 0.1 to about 10% by weight of a photoinitiator and about 0.01 to about 2% of a stabilizer.

Abstract: Disclosed is a method of forming patterned electron beam resists from polymers that undergo energy intensity or electron dosage dependent reactions. Upon the introduction of sufficient energy, the polymer generates two reactive species that react with each other. However, with a lower amount of energy, the polymer generates only one reactive species. A thin film of the dosage dependent polymer is applied to a support and is subjected to a programmed electron beam scan. The electron beam irradiates a portion of the polymer film according to the programmed pattern and furnishes enough energy in the path of the beam to cause the polymer to cross link where directly irradiated, thus causing the polymer to become insoluble in certain solvents. The portion of the polymer adjacent the directly irradiated portion is subjected to electrons back-scattering from the surface of the support, which electrons are a small percentage of the total beamed at the polymer.

Abstract: A photopolymerizable coating over a diazo resin provides a high-speed lithographic plate or photoresist while improving the printing life of the plate while making its development simpler than that of most other photopolymer plates. The photopolymer is a cinnamoylated polyvinyl alcohol resin which is placed over a diazo based material.

Abstract: A germanium mesa transistor is fabricated having an epitaxially grown base region and an aluminum alloy emitter in the epitaxially grown layer spaced from the collector junction, and having a gold-comprising base electrode surrounding the emitter and closely spaced therefrom. The gold contact is formed by photolithographic and selective etching techniques, followed by the formation of the aluminum emitter, which is also formed by photolithographic and selective etching techniques. A key step is the selective removal of the aluminum from the germanium wafer without disturbing the gold contact.

Abstract: Radiation-sensitive linear polymers comprise repeating structural units containing an o-nitrophenyl acetal. The polymer is formed, for example, by the linear polycondensation of o-nitrobenzaldehyde with a particular dihydroxy alcohol. The polymers are useful as coatings to form positive-working radiation-sensitive elements such as photoresists or lithographic printing plates.

Abstract: Negative resist compositions are based on carbonaceous polymers with substituent branches containing epoxy groupings. Exemplary materials which include, for example, a copolymer of glycidyl methacrylate and ethyl acrylate in which epoxy groupings are unesterified show high sensitivity, for example, to electron radiation and to X-rays. Resolution is sufficient to permit expedient fabrication of detailed resist patterns for integrated circuits. High adherence permits use of acid or base reagents and thermal stability permits use of ion milling for circuit fabrication.

Abstract: A process is described for applying, under vacuum, a photoresist-forming layer to a surface, such as a printed circuit board, whereby a laminate without entrapped air bubbles is obtained. The surface to which the photoresist-forming layer is applied has raised areas, such as circuit lines, which are completely enveloped by the layer.

Abstract: This invention pertains to a method for forming a surface relief pattern in a metal layer which comprises forming a wet poly(olefin sulfone) layer on the metal layer, forming a surface relief pattern in the wet poly(olefin sulfone) layer, and sputter etching the surface relief pattern from the wet poly(olefin sulfone) layer into the metal layer.

Abstract: A composite, photohardenable element comprising in intimate surface contact (a) a resist layer, photohardenable by exposure to actinic radiation and; (b) a soluble layer comprising a macromolecular organic polymer and at least one ultraviolet absorbent dye or pigment. In the preferred elements, the layers are disposed between and adherent to a cover sheet and a support film, respectively.

Abstract: A light sensitive printing plate comprising a support having provided thereon a light sensitive layer and a matted layer, said matted layer being removable upon development and containing a light absorbing agent possessing an absorption in the spectral region to which the light-sensitive material coated on the light sensitive printing plate is sensitive.

Abstract: Resist images are hardened so that they are flow resistant at elevated temperatures by coating the image with a layer of a quinone-diazide hardening agent and heating the image to cause the agent to react with the resist and form a hardened image.

Abstract: A negative-working, reversibly gelled composition is disclosed, suitable for use as the photocurable component in a blank for preparation of an article in relief, such as a printing plate. Uncured portions of the composition are removed with an aqueous solution following imagewise modulated exposure of such a blank to actinic radiation. The composition comprises a first organic polymer bearing per molecule, at least one ethylenically unsaturated group which is polymerizable by a free radical source; and a second organic polymer bearing per molecule, at least two Z groups, Z being a primary hydroxyl or mercapto group, with the proviso that when said first organic polymer bears at least two Z groups per molecule, said second organic polymer may be omitted; said Z groups being reacted by contact with a dialdehyde to produce the reversibly gelled composition.

Abstract: A positive-working imaging element is described comprising a support coated first with a negative-working, solvent-developable, photohardenable stratum, then over-coated with a second negative-working, solvent-developable, photohardenable stratum; the second stratum serves as a mask for the first stratum since it contains ingredients which strongly absorb radiation actinic to the first stratum. The second stratum is imagewise exposed, solvent developed, and the resulting actinically opaque image used as a negative in exposing the first stratum, which is solvent developed to remove the composition in unexposed, but not in exposed areas. Optionally, a separating layer can be present between the photohardenable strata and a cover layer can be present over the second stratum. Positive-working low relief images suitable for lithographic printing plates, printed circuit resists, and contact-speed lithographic films are obtained from the elements of this invention.

Abstract: A photosensitive composition is prepared comprising (a) a copolymer having an acid value of 10 to 100 and containing structural units represented by the following general formula I ##STR1## where R.sub.1 represents a hydrogen atom or methyl group, R.sub.2 represents a hydrogen atom, methyl group, ethyl group or chloromethyl group, and n is an integer of from 1 to 10, inclusive, and structural units represented by the following general formula II ##STR2## where, in the formula, R.sub.3 represents a hydrogen atom or methyl group, and(b) a diazo compound and, optionally,(c) a resin having hydrophilic groups.

Abstract: A film of poly(methacrylamide) is heated to partially form imide bonds with elimination of ammonia, and such imide bonding causes crosslinking in the polymer to form a crosslinked polymer film. This film can be advantageously adapted as a positive resist capable of forming a positive image by exposure to radiation such as electron beams. The minimum incident charge required for such exposure is of the order of 10.sup.-7 coulomb/cm.sup.2, which is far lower than the level required in the use of conventional resists. The resist provided according to this invention is also capable of forming an excellent heat-resistant positive resist image by short-time exposure to radiation.

Abstract: A photosensitive composition in solution for printing screens which comprises:(a) a liquid medium selected from the group consisting of water-miscible organic solvents and solvent mixtures of said organic solvents and water;(b) a polymer soluble in both said organic solvents and water; and(c) a sensitizer soluble in said organic solvents which is selected from the group consisting of photosensitive monomers and prepolymers thereof.This composition makes it possible to produce presensitized printing screens of excellent preservability and printing resistance and to provide a process for efficiently producing pre-sensitized printing screens.

Abstract: A method of making a perforated metal foil, especially for screen printing, comprises applying to a metallic surface a photosensitive layer, exposing the photosensitive layer through a screen pattern, developing the exposed photosensitive layer to remove portions surrounding dots of the photosensitive material, and electrodepositing a metal upon the surface in the region surrounding the dots. Prior to or during a galvanic deposition of the screen metal on the surface, the dots of photosensitive material are swelled so that the tendency of the perforation boundaries to be encrusted with metal is reduced and the perforations resulting in the screen have substantially the same cross sections and sizes as the dots of the photosensitive material.

Abstract: A photopolymerizable composition useful in photo-imaging processes comprises an ethylenically unsaturated polymerizable compound and a photoinitiator comprising a combination of a photoreducible dye and an alkanolamine. The composition is substantially insensitive to visible light when in an acidic pH condition, yet may be made highly sensitive to visible light upon adjustment to a condition of alkaline pH. Imaging materials may be repeatedly sensitized and desensitized by pH adjustment and multiple-spaced exposures made prior to final washoff development processing.

Abstract: A shallow relief printing plate is disclosed having a polymerized layer of less than about 0.020 inch and which includes an array of small protuberances in non-image or background areas to prevent bottoming. Photopolymerizable elements, as well as processing techniques, are also disclosed for making such printing plates.

Abstract: A shallow relief printing plate is disclosed having a polymerized layer of less than about 0.020 inch and which includes an array of small protuberances in non-image or background areas to prevent bottoming. Photopolymerizable elements, as well as processing techniques, are also disclosed for making such printing plates.

Abstract: A radiation-sensitive composition capable of producing a positive image upon exposure to actinic radiation and subsequent treatment with a basic solution which comprises (a) an o-naphthoquinone diazide compound, (b) an alkali soluble film-forming phenolic resin and (c) an organic acid cyclic anhydride.

Abstract: A process of spin coating a coating composition on the surface of a base plate, comprising supplying a material which is compatable with the coating composition, in either a liquid or vapor form, to the opposite surface of the base plate to the surface on which the coating composition has been supplied (hereinafter "back surface" or "back side") while rotating the base plate to remove the coating composition flowing to the back surface or to the edge portion of the plate. The material compatible with the coating composition may be applied to the surface of the base plate at the periphery thereof to reduce or remove the coating composition there.

Abstract: Photopolymerizable compositions and processes for photopolymerizing such compositions are provided, said process comprising admixing with said epoxides, photosensitive organohalogen compounds and thereafter applying energy to the resulting mixture. The organohalogens decompose to liberate an active catalyst which then serves to initiate polymerization of the epoxide material.

Abstract: The modified advanced epoxide resins described, having an average molecular weight of up to 50,000, can be photopolymerized without the need to include photosensitizers. They may be prepared by reaction of a diepoxide ##STR1## with a keto group-containing dihydric phenol ##STR2## to form the advanced epoxide resin ##STR3## followed by condensation with an aldehyde RCHO to yield ##STR4## In the above formulae, R is an organic group which preferably has ethylenic unsaturation or heterocyclic aromaticity in conjugation with the indicated ethylenic double bond; R.sup.1 is the divalent residue linking two epoxide groups; R.sup.2 is preferably a hydrogen atom but may be an organic group, halogen, or cyano; R.sup.3 is a trivalent aromatic or heterocyclic group, especially a group ##STR5## If desired, other dihydric phenols can be employed with that containing a keto group, and condensation with the aldehyde may be carried out so that only some groups --COCH.sub.2 R.sup.2 undergo reaction.

Abstract: A photosensitive composition for a photoresist, which comprises (A) a compound having the following general formula: ##STR1## wherein Z is a cyclic dibasic acid anhydride moiety, R.sup.1 is an alkylene group having 1 to 3 carbon atoms, R.sup.2 is hydrogen or methyl, and R.sup.3 is hydrogen, methyl, ethyl or -CH.sub.2 X in which X is chlorine or bromine, (B) a photopolymerization sensitizer, (C) a polymer being capable of giving a film-forming property, (D) a chain transfer agent and (E) a thermal polymerization inhibitor; and a laminated photosensitive element which has a substantially dry photosensitive layer of the photosensitive composition. The composition and element are capable of giving a minute resist pattern which is excellent as an etching resist or metal plating resist and can be readily removed after etching or metal plating.

Abstract: Photosensitive polyaldehydes are provided which have the formula: ##STR1## WHEREIN R is a photosensitive end group selected from ##STR2## R.sup.1 is H or n-alkyl of 1-5 carbon atoms, preferably H, R.sup.2 is (a) n-alkanoyl of 1-4 carbon atoms or (b) n-alkanoyl of 1-4 carbon atoms or ##STR3## when R.sup.1 is H, and n is a positive integer of about 10-4000. The polyaldehydes are prepared by the anionic polymerization of the appropriate aldehyde with an initiating amount of an alkali metal or tetraalkylammonium alkoxide of RO in the above formula.The polyaldehydes are useful in articles and methods of relief imaging and in lithographic plates.

Abstract: Cationically polymerizable compositions are provided, such as epoxides, vinyl ethers, and N-vinyl compounds having an effective amount of aryl onium trifluoromethane sulfonate salts, such as a triphenyl sulfonium trifluoromethane sulfonate and diphenyliodonium trifluoromethane sulfonate. The curable compositions are polymerizable under ultraviolet radiation. In addition to being used as adhesives, encapsulents and in coating applications, the aforementioned curable compositions can be employed as photoresists and as printing inks.

Abstract: An organic solvent- or water-developable photosensitive composition consisting essentially of a ring-opened polymer or copolymer of at least one norbornene derivative having at least one substituent selected from the group consisting of ester groups, nitrile groups, carboxyl groups, amide groups, imide groups, hydroxyl groups, halogens and carboxylic acid anhydride groups, or a ring-opened copolymer of at least one said norbornene derivative and at least one cycloolefin other than cyclohexene, or a hydrolysis product of said ring-opened polymer or copolymer and a photosensitive crosslinking agent or photosensitizer soluble in organic solvents or water. The above photosensitive composition is excellent in sensitivity, adhesion and stability.

Abstract: UV curable coating compositions are provided based on the use of a Group VIa onium salt photoinitiator in combination with an organic resin, such as an alkoxylated melamine, or ureaformaldehyde or phenolformaldehyde resin. The coating compositions can be applied to a variety of substrates and thereafter cured with UV light, followed by a heating step.

Abstract: The adhesion between inorganic oxides and photoresistant polymers is improved by, prior to contacting the oxide and the polymer, treating the oxide with(a) an aminosilane of the formulae R.sub.3 SiNHR' and R.sub.2 Si(NHR').sub.2 ; or a polysilazane, with the exception of hexaalkyldisilazanes, having 0.8 to 3 organic groups per silicon atom, and having units of the formulae R.sub.3 Si(NH).sub.0.5, R.sub.2 SiNH, RSi(NH).sub.1.5 or Si(NH).sub.

Abstract: Micropattern devices, such as electronic microcircuits, are produced by establishing on a substrate base a film of resist material, such as a polymeric film, containing dispersed therethrough a substantial proportion of an enzyme and then producing a pattern of a metal by reactions depending upon presence of the enzyme.

Abstract: Articles exhibiting a micropattern carried by a surface of a support, typically microdevices comprising a micropattern of a functional material on or in a substrate of a dissimilar material, are produced by a method employing a microsubstrate comprising a substrate base, a protein layer which comprises at least a compressed monolayer of a denatured non-fibrous protein on the base, and a masking film overlying the protein layer, the material of the masking film being such as to be modified by radiant energy so as to be removable from the protein layer where irradiated. The method is flexible in the sense that it is possible to proceed via either a positive or a negative of the desired micropattern and to build a more extensive, or more complex, micropattern from an initial relatively simple micropattern.

Abstract: New bisbenzoin ethers are produced. The method of producing the bisbenzoin ethers comprises the reaction of an alkyl glycol with benzoin utilizing phosphorous oxychloride as the catalyst with hydrogen chloride as acid reacting agent. The use of phosphorous oxychloride as catalyst with hydrogen chloride improves the production of benzoin ethers in general by the reaction of benzoin with the selected alcohol.

Abstract: A process is disclosed for inhibiting in a polymerization reaction crosslinking of photocrosslinkable condensation homopolymers and copolymers by use of a synergistic inhibitor composition comprising specified amounts of a hindered phenolic compound and a phosphoric acid ester in the presence of monomers from which said homopolymers and copolymers are formed. Residue from the inhibitor composition remains in the polymeric product and serves as a stabilizer against heat deterioration and premature crosslinking of the product during recovery and storage. The stabilized homopolymers and copolymers are useful for manufacture of radiation sensitive elements. Photographic elements formed from the stabilized condensation polymers are particularly useful as lithographic plates.

Abstract: A printing plate comprising a support, reliefs formed thereon as an image area, and from about 20 to about 4,000/cm.sup.2 small projections thereon in non-image areas, the height of the reliefs being at least 0.05 mm larger than that of the small projections, and a method for making a printing plate which comprises:(a) superimposing a photosensitive resin layer having a thickness of at least 0.06 mm on a support, which is at least semi-transparent to actinic light, in intimate contact therewith;(b) exposing the resulting assembly to actinic light through an image-bearing transparency from the side of the photosensitive resin layer;(c) exposing the assembly to actinic light through a dot-image-bearing transparency having a transparent halftone dot area in a proportion of 1 to 40% from the side of the support to thereby form reliefs on the support, as image areas, and a number of small projections having a height of at least 0.

Abstract: Method of providing a substrate with a patterned metal layer disposed thereon, wherein a patterned metal mask is employed in conjunction with ion milling to form the pattern in the metal layer on the substrate. The metal mask as contemplated herein is made of a metallic masking mterial taken from the group consisting of vanadium, tantalum, titanium, and a titanium-tungsten alloy--vanadium being a preferred material because of its resistance to erosion or etching from ion milling coupled with its relatively fast etch rate in a plasma atmosphere. This method has particular application to magnetic bubble domain technology, wherein successive layers of a magnetically soft material, vanadium, and photoresist are deposited on a magnetic film capable of supporting magnetic bubble domain propagation. The layer of magnetically soft material is typically permalloy, and upon being patterned in a selected configuration, defines a bubble propagation path on the magnetic bubble-supporting film.

Abstract: A water-soluble, photosensitive resin composition containing a water-soluble polymer having an ethylenic unsaturated bond in its side-chains, a water-soluble anthraquinone sulfonic acid or anthraquinone carboxylic acid sensitizer, or salts thereof, and if desired, a water-soluble azide compound.

Abstract: A positive working, thermally stable photoresist, comprising a light-sensitive orthoquinone diazide or naphthoquinone diazide and a polyamic acid condensation product of an aromatic dianhydride and an aromatic di-primary amine, and a support carrying a layer of said photoresist. After exposure, the image is developed in the layer with an alkaline aqueous developer and is unaffected by heating to 500.degree. C, thus allowing the use of the photoresist layer for plasma and sputter-etching as well as ion implantation.

Abstract: A photocurable composition comprising a copolymer of maleic acid monoester with .alpha.-olefine compound, a vinylurethane compound obtained by urethanation reaction of a polyisocyanate compound with a photopolymerizable ethylenically unsaturated alcohol having a number average molecular weight of less than 3,000 or by urethanation reaction of 1 mole of diisocyanate compound with about 1 mole of the photopolymerizable ethylenically unsaturated alcohol and about 1/m mole of m-valent alcohol (wherein m is an integer of 2 to 6) having a number average molecular weight of less than 3,000, and a photosensitizer.

Abstract: A polyimide mask is used as an undercoat for a standard resist material during the patterning of an underlying thin film layer by plasma etching. The polyimide mask can withstand the conditions of reactive ion (plasma) etching so that it can be used as a protective coating when the thin film is subtractively etched by the plasma etching. The polyimide is particularly useful in processes using either positive or negative electron beam lithography which require sensitive resists.

Abstract: Photohardenable, liquid compositions are described which are particularly useful as plating and etching resists.

Abstract: A method of depositing a metal on a surface of a substrate is disclosed. The method comprises selectively treating the surface with a photopolymerizable composition, comprising an addition polymer containing a plurality of units of the formulae ##STR1## WHERE R and R.sub.1 are each a member taken from the group consisting of ##STR2## and pyrrolidone, R.sub.3 is an alkyl group of 1 to 18 carbons, R.sub.2 is a member selected from the group consisting of H and CH.sub.3 and x is a positive integer of 10 to 1000, to form a polymerized coating thereof on the surface to delineate an exposed surface pattern conforming to a desired metal pattern. The exposed surface pattern is capable of retaining a noble metal ion thereon. The treated surface is then exposed to a noble metal ion to selectively deposit the metal ion on the exposed pattern.

Abstract: Method comprises (a) applying to a supporting surface a coating comprised of a photosensitizable water-soluble polymer, a soluble dichromate photosensitizer for the polymer, a soluble vanadate, and particles of the pattern material; (b) exposing the coating to a pattern of actinic radiation until exposed portions of the coating are rendered insoluble; (c) and flushing the exposed coating with an aqueous solvent to remove soluble portions of the coating, while retaining the insoluble portions of the coating in place.

Abstract: The invention provides a method for the preparation of relief structures of highly heat-resistant polymers, using radiation-sensitive, soluble preliminary polymers in the form of polyaddition or polycondensation products of polyfunctional carbocyclic or heterocyclic compounds containing radiation-sensitive radicals in ester groups bound to said compounds with diamines, diisocyanates, bis-acid chlorides or dicarboxylic acids of cyclic structure. According to the invention, the polyfunctional compounds carrying the radiation-sensitive radicals have, besides carboxyl, carboxylic acid chloride, amino, isocyanate or hydroxyl groups suitable for addition and condensation reactions, radiation-reactive radicals in the ester-groups bound to the compounds, partly in ortho or peri position thereto of the following structure: ##STR1## wherein: R.sub.1 = alkylene or aralkyleneR.sub.2 = h, ch.sub.3, clR.sub.

Abstract: Polymethyl methacrylate methacrylic acid (P[MMA/MAA]) copolymer powder is prebaked above 200.degree. C. The prebaked powder is dissolved in a suitable casting solvent. The insoluble material produced during prebaking is removed by filtration. Then the solution remaining is applied to a substrate, post-baked at a temperature less than or equal to the prebaking temperature to drive off the solvent, exposed to electron beam radiation, and developed in a developing solvent.