Abstract: A set of candidate global optima is identified, one of which is a global solution for making a mask for printing a lithographic pattern. A solution space is formed from dominant joint eigenvectors that is constrained for bright and dark areas of the printed pattern. The solution space is mapped to identify regions each containing at most one local minimum intensity. For each selected region, stepped intensity contours are generated for intensity of the dark areas and stepped constraint surfaces are generated for a target exposure dose at an individual test point. An individual test point is stepped toward a lowest intensity contour along the stepped constraint surfaces of each selected region. Further lowering of the intensities of these points is also detailed, where possible in adjacent regions, to yield final test points. The set of candidate global optima is the final test points at their respective lowest intensity contour of the respective selected regions.

Abstract: A detection method for identifying unintentionally forward-biased diode devices identifies one or more forward-biased diodes directly from a graphical representation of an integrated circuit (IC) device design. The graphical representation describing one or more IC components as a plurality of geometric shapes that correspond to a set of patterns in at least one semiconductor layer. A detection method may work in conjunction with one or more checks (e.g., electrical rule check (ERC)) to analyze the graphical representation and ensure its manufacturability by reducing the likelihood the forward-biased diodes will be present in the manufactured IC device.

Abstract: An embodiment performs dummy fill in a design layout to achieve a target density that is within a narrow range of target densities. During operation, the system can receive a design layout that includes a region whose density is not within a desired range of target densities. Next, the system can receive a set of dummy-fill cells which can be used to place a dummy-fill array to fill an arbitrarily sized rectangle. The set of dummy-fill cells may contain assist features and optical proximity corrections which cause the dummy shapes to print properly regardless of the size of the dummy-fill array. The system may then determine a polygon in the design layout to fill with dummy-fill cells. Next, the system may fracture the polygon into a set of rectangles. The system may use the set of dummy-fill cells to place a dummy-fill array that fills a rectangle.

Abstract: According to one embodiment, a system LSI verification system that verifies a processor module included in a system LSI, the system comprising: a circuit description storage that stores description data that describes a design of the processor module; a verification task generator that generates a verification task file based on the description data and a verification environment specification file in which specifications of a verification environment are described; a test program storage that stores a test program including an environment command function for starting the verification task; and a logical simulator that performs a logical simulation according to the test program.

Abstract: The invention provides apparatus and methods for processing substrates using a hot-spot library.

Abstract: A pattern evaluation method for evaluating a mask pattern includes generating desired wafer pattern data corresponding to the evaluation position of a mask pattern, generating mask pattern contour data based on an image of the mask pattern, and performing a lithography/simulation process based on the mask pattern contour data and generating predicted wafer pattern data when the mask pattern is transferred to a wafer. Further, it includes deriving positional offset between the mask pattern contour data and mask pattern data, correcting a positional error between the desired wafer pattern data and the predicted wafer pattern data based on the positional offset, and comparing the desired wafer pattern data with the predicted wafer pattern data with the positional error corrected.

Abstract: System and method for using adjustment patterns as well as physical parameters as targets to control mask structure dimensions using optical proximity correction. A method for correcting layer patterns comprises selecting optimum sacrificial patterns, defining virtual targets from the optimum sacrificial patterns, and executing an optical proximity correction process with the virtual targets to correct layer patterns. The selecting of the optimum sacrificial patterns may be performed in a separate processing stage, thereby reducing the number of targets to be investigated during a process window optical proximity correction, thereby reducing the runtime, processing, and memory requirements.

Abstract: A design structure embodied in a machine readable medium for use in a design process, the design structure representing a CMOS image sensor device comprising an array of active pixel cells. Each active pixel cell includes a substrate; a photosensing device formed at or below a substrate surface for collecting charge carriers in response to incident light; and, one or more light transmissive conductive wire structures formed above the photosensing device, the one or more conductive wire structures being located in an optical path above the photosensing device. The formed light transmissive conductive wire structures provide both an electrical and optical functions. An optical function is provided by tailoring the thickness of the conductive wire layer to filter light according to a pixel color scheme. Alternately, the light transmissive conductive wire structures may be formed as a microlens structure providing a light focusing function.

Abstract: Systems, methodologies and technologies for the analysis and transformation of integrated circuit layouts using situations are disclosed. A method for transforming an integrated circuit (IC) layout includes recognizing shapes within the IC layout, identifying features for each of the shapes and extracting situations for the respective features. Extracted situations can be used to improve optical proximity correction (OPC) of the IC layout. This improved OPC includes extracting the situations, simulating the situations to determine a set of the situations identified for modification based on failing to satisfy a desired OPC tolerance level, modifying the set of situations to improve satisfaction of the desired OPC tolerance level, and reintegrating the modified set of situations into the IC layout. Extracted situations can also be used to improve aerial image simulation of the IC layout.

Abstract: Systems and methods for creating and implementing two-dimensional (2D), image-based design rules (IBDRs) are disclosed. Techniques for creating 2D IBDR can include identifying a search pattern that is representative of a 2D pattern of interest of a design, creating a pattern representation based on the search pattern, defining an anchor point for the pattern representation, and assigning weights to elements of the pattern representation. The 2D IBDR can be used in systems and method for searching a design by comparing the 2D IBDR to the design. A number of 2D IBDRs can be merged into a subset of similar 2D IBDRs by characterizing desired rule geometries, sorting the 2D IBDRs into groups according to the desired rule geometries, merging the groups of 2D IBDRs into a single representative search pattern. Additionally, standard design rules can be created from the disclosed 2D IBDRs.

Abstract: A method and system for timing exception verification in integrated circuit (IC) designs included verification of functional false paths as well as multi-cycle paths (MCPs). A false path or a MCP is modeled to a satisfiability formula and the formula is validated using a Boolean satisfiability solver. Time required for timing exception verification can be significantly reduced.

Abstract: In one implementation, the invention can be a computer-implemented method for generating an engineering change order (ECO) netlist for an integrated circuit (IC). The method includes performing a formal equivalence check between an implementation netlist and a reference netlist to identify one or more corresponding failed compare points in the implementation and reference netlists. The method further includes, for at least one failed comparison: (i) performing equivalence verifications based on fan-in cones for the failed compare points, to generate pin pass/fail information, (ii) tracing the fan-in cone for the reference netlist to generate ECO pin and cell information, and (iii) modifying the implementation netlist, based on (1) the pin pass/fail information, (2) cell connectivity information, (3) cell description information, and (4) the ECO pin and cell information, to generate the ECO netlist by adding one or more new ECO cells to the implementation netlist and appropriately connecting them.

Abstract: To configure a system, models of corresponding components are provided, where the models contain constraints. The models specify that at least one of the components is composed of at least another one of the components. The models are input into a design tool. The design tool generates a configuration of the system that includes the components, wherein the generated configuration satisfies the constraints contained in the models.

Abstract: A hardware accelerator factors functions during the compilation of a user design. The hardware accelerator includes cofactor units, each adapted to determine a cofactor of a function in response to a specified factorization and a set of input values. The factorization specifies the constant function inputs and varying function inputs. Each cofactor unit determines the cofactor of the function in response to a different constant value. The hardware accelerator operates all of the cofactor units simultaneously to determine some or all of the cofactors of a function for a factorization in parallel. Signature generators determine attributes of the cofactors. A signature analyzer uses these attributes to identify identical cofactors, constant cofactors, and inverse cofactors. The signature analyzer returns potentially optimal factorizations to compilation software applications for possible incorporation into user designs.

Abstract: A method of trace delay error compensation for measurements that are taken remotely from the signal source or receiver of a circuit uses data available from a computer aided design (CAD) tool to characterize electrical connections to an instrument measurement point, such as a connectorless probe, which is remote from the signal source or receiver. Extracted parameters from the CAD data are applied to signals acquired by the probe to adjust the signal timing and/or shape to more accurately represent the signal information timing at the signal source or receiver or other remote location of interest to a user. The corrected signals at the desired location may be displayed by a measurement instrument.

Abstract: In a support method of designing a semiconductor device, a plurality of wiring lines are arranged in parallel in a wiring line layer to transfer a same signal. A wiring line inhibition area is set in the wiring line layer to cover a space between the plurality of wiring lines and to inhibit arrangement of another wiring line other than the plurality of wiring lines.

Abstract: In manufacturing a structured ASIC, after production of an intermediate product with a transistor layer or the transistor layer and a metal layer, the transistor speed of each intermediate product is measured and, using the speed and associated statistical data, a maximum transistor speed delay is estimated. Based on the estimate, the type of the structured ASIC is determined from among an existing list of LSI circuit types.

Abstract: A macrocell including a physical layer circuit includes a transmitter circuit and a receiver circuit connected with pads for differential signals DP and DM. The transmitter circuit includes a transmission driver which drives a signal line for the DP and a transmission driver which drives a signal line for the DM. When a direction from a side SD1 to a side SD3 of the macrocell is defined as a first direction, the transmission drivers are disposed on the side of the pads for the DP and DM in the first direction and are disposed line-symmetrically about a line SYL, and the receiver circuit is disposed on the side of the transmitter circuit in the first direction. A routing region of signal lines SLR1 and SLR2 for connecting the receiver circuit with the pads for the DP and DM is provided in the region between the transmission drivers.

Abstract: The temperature distribution associated with a design of an integrated circuit is calculated by convoluting a surface power usage represented by a power matrix with a heat spreading function. The heat spreading function may be calculated from a simulation of a point source on the integrated circuit using a finite element analysis model of the integrated circuit or other techniques. To account for spatial variations on the chip, the heat spreading function may be made dependent on position using a position scaling function. Steady-state or transient temperature distributions may be computed by using a steady-state or transient heat spreading function. A single heat spreading function may be convolved with various alternative power maps to efficiently calculate temperature distributions for different designs. In an inverse problem, one can calculate the power map from an empirically measured temperature distribution and a heat spreading function using various de-convolution techniques.

Abstract: Disclosed is a method, system, and computer program product for routing, modeling routes, and measuring congestion. In some embodiments, Gcells are implemented with reduced number of nodes to facilitate route modeling and congestion measurement. Some embodiments are particularly suitable for direct congestion and routing analysis of diagonal routing paths. In this way, congestion analysis can be directly performed along diagonal boundaries for diagonal routes, without requiring association with Gcell boundaries on Manhattan routing layers.