Abstract: An electroless deposition system includes a deposition solution, and saturating the deposition solution with an oxygen concentration in a range from about two thousand parts per million to about twenty thousand parts per million.

Abstract: An electroless plating system includes a plating solution, and controlling reducing agents in the plating solution for deposition over outlier features smaller than about five hundred nanometers and isolated by about one thousand nanometers.

Abstract: A coating apparatus for batches of elongate flimsy members includes batch handling portion and a coating portion. The batch handling portion having an array support portion and an array alignment portion. The array support portion secures and vertically moves an array of elongate flimsy members to be lowered into an array of inlets of the coating portion, the inlets aligned in an array. The array alignment portion provides removable discrete position locating of the individual flimsy members by a guide portion that moves from an upwardly position downwardly to position each member of the array in alignment with the array of inlets. The support portion then lowers the flimsy members into the coating portion through the array.

Abstract: In electric plating of supplying a current between an anode electrode and a cathode electrode as a plated body immersed in a plating solution thereby forming a plated film comprising a conductor on a surface of the cathode electrode, a preliminary electrolytic electrode that comes in contact with the plating solution before the cathode electrode comes in contact with the plating solution is disposed, and the cathode electrode is brought into contact with the plating solution while supplying a preliminary electrolytic current between the preliminary electrolytic electrode and the anode electrode, whereby a uniform plated film with no voids can be formed while suppressing dissolution of the underlying conductive film in the electric plating treatment.

Abstract: The invention provides a process for depositing metallic layers from acidic or alkaline zinc or zinc alloy baths containing organic additives selected from brighteners, surfactants and complexing agents, a soluble zinc salt and optionally further metal salts selected from Fe, Ni, Co, Sn salts, wherein the bath can be purified continuously so that the process can be operated without interruption, as well as apparatus for carrying out this process.

Abstract: An intermediate module comprising a dimensionally stable mounting module and a first device attached to the dimensionally stable mounting module. The dimensionally stable mounting module can include a front docking unit with front alignment elements for connecting the mounting module to a load/unload module, and a rear docking unit with rear alignment elements for connecting the mounting module to a main processing unit. The mounting module can further include a deck between the front docking unit and the rear docking unit, positioning elements at the deck, and attachment elements at the deck. The first device can be a processing chamber, an annealing station, a metrology station, a buffer station, or another type of component for holding or otherwise performing a function on a workpiece.

Abstract: System for soaking absorbing material rolls or sheets (1b, 2b) with a solvent (1a, 2a), such a solvent being contained into a bag made of plastic divided into two separated partitions, one (A) suited to contain the solvent, and the other (B) to contain the sheets or rolls (1b, 2b) of absorbing material. Such a system is able to allow a contact between the solvent and the absorbing material only when one wants to use the absorbing material in order to clean the printing machines, after soaking it with solvent.

Abstract: A cap layer for a metal feature such as a copper interconnect on a semiconductor wafer is formed by immersion plating a more noble metal (e.g. Pd) onto the copper interconnect and breaking up, preferably by mechanical abrasion, loose nodules of the noble metal that form on the copper interconnect surface. The mechanical abrasion removes plated noble metal which is only loosely attached to the copper surface, and then continued exposure of the copper surface to immersion plating chemicals leads to plating at new sites on the surface until a continuous, well-bonded noble metal layer has formed. The method can be implemented conveniently by supplying immersion plating chemicals to the surface of a wafer undergoing CMP or undergoing scrubbing in a wafer-scrubber apparatus.

Abstract: A method for depositing a copper seed layer onto a semiconductor substrate comprises applying a SCuD plating bath onto a surface of a substrate, rinsing the surface with an organic solvent, applying a co-reactant bath to the surface, and again rinsing the surface with an organic solvent. The SCuD plating bath is non-aqueous and comprises a copper precursor that is dissolved into an organic solvent. The co-reactant bath is also non-aqueous and comprises a co-reactant dissolved into an organic solvent. The SCuD plating bath may be heated before being applied to the substrate surface.

Abstract: Provided is a semiconductor plating system for plating a semiconductor object with a desired layer. The semiconductor plating system include a plating tank configured to accommodate a plating solution for use in plating the semiconductor object, and a plating solution induction device configured to induce the plating solution to spirally flow toward the semiconductor object.

Abstract: An electroless plating system is provided. The system includes a first vacuum chuck supporting a first wafer and a second vacuum chuck supporting a second wafer such that a top surface of the second wafer is opposing a top surface of the first wafer. The system also includes a fluid delivery system configured to deliver a plating solution to the top surface of the first wafer, wherein in response to delivery of the plating solution, the top surface of the second wafer is brought proximate to the top surface of the first wafer so that the plating solution contacts both top surfaces. A method for applying an electroless plating solution to a substrate is also provided.

Abstract: A method for plating includes positioning a substrate facing a plating solution. The method also includes immersing the substrate into the plating solution while plating a layer of material over a surface of the substrate, wherein an immersion speed of the substrate is about 100 millimeters per second (mm/s) or more while at least one portion of the substrate contacts the plating solution.

Abstract: To produce a ceramic foam-filled structural sandwich panel, a coating of a pre-ceramic slurry is applied on a preform. The preform includes a foam template sandwiched between a plurality of panels. In addition, the coating is cured to the preform, the preform is modified, and the coating is converted to a ceramic.

Abstract: There is provided a layer forming apparatus for forming a photosensitive layer of an electrophotographic photoreceptor, containing no bubbles in a coating liquid. In the layer forming apparatus for forming the photosensitive layer of the electrophotographic photoreceptor through the dip coating method, a lower end port of a dipping cylinder is distanced away in a horizontal direction from a coating liquid discharge port, and the coating liquid discharge port is disposed above the lower end port of the dipping cylinder, in order to prevent a bubble from moving into a coating liquid portion used for actual coating even when a bubble exits in the course of circulation of the coating liquid.

Abstract: A method for coating with a coating liquid according to the present invention is a method for coating an object-to-be-coated with a coating liquid containing dispersed particles, using a die, wherein the flowage of the coating liquid within a manifold 5 provided within the die is such that the deviation of the average flow rate of the coating liquid in the direction of the width becomes equal to or less than 60% of an average flow rate over the entire area of the manifold 5, in at least 80% of the area from a liquid supplying portion 8 in the manifold to an end portion P of the manifold.

Abstract: A method is disclosed to measure the permeability of films or coatings towards solvents (e.g. water). First a substrate comprising an absorption or container layer is provided, preferably the material is a porous material. To study water permeability, the porous material is hydrophilic or is made hydrophilic by means of e.g. an anneal process. To study the permeability of the film or coating, the coating is deposited on top of the porous material. The substrate comprising the film or coating on top of the absorption or container layer is then brought into a pressurizable chamber subsequently filled with the gaseous substance of the solvent (e.g. water vapor). By increasing/decreasing the vapor pressure in the chamber between zero and the equilibrium vapor pressure of the solvent used, the permeability (penetration) of solvent through the film or coating can be determined. The amount of solvent that can penetrate through the film or coating can be measured by means of ellipsometry, mass spectrometry, etc.

Abstract: A liquid-phase growth apparatus for growing a crystal on a substrate includes a crucible containing a solution that contains a raw material for forming the crystal, and a substrate holder for vertically holding the substrate. The substrate holder includes connectors, a receiving component, and a push component. The receiving component and the push component are opposite to each other and are connected by the connectors. The push component holds an upper portion of the substrate while the receiving component holds a lower portion of the substrate. The substrate holder containing the vertically held substrate is dipped into the solution. The receiving component ascends with buoyancy in the solution contained in the crucible, so that the substrate is now held securely and prevented from cracking due to thermal expansion.

Abstract: A process for the continuous dip-coating of a metal strip (1) in a tank (11) containing a liquid metal bath (12), in which process the metal strip (1) is made to run continuously through a duct (13), the lower part of which is immersed in the liquid metal bath (12), in order to define with the surface of the bath a liquid seal (14). In the region where the strip (1) leaves the liquid metal bath (12), the liquid metal is isolated from the surface of the bath in an isolating enclosure (20), and the metal oxide particles and intermetallic compound particles are recovered by the liquid metal flowing from this region into the enclosure (20), and the particles are extracted from this enclosure (20). Also, a plant for implementing the process.

Abstract: The present invention relates to a web handling apparatus and process ideally suited for applications involving wet chemistry. The invention involves the horizontal processing of webs in processing containers. The web is redirected into the processing container by inserting a cassette across the web and into the processing container. The cassette includes at least one functional fluid element that facilitates processing of the web. The web handling practices of the invention improve the quality of the processed web. The invention is preferably used in electrodeposition processes.

Abstract: The flow of electrolyte and/or of ions is controlled by a diffuser element provided in a plating reactor, wherein, in one embodiment, the diffuser element comprises a mechanical adjustment mechanism to adjust the effective size of passages of the diffuser element. In another embodiment, the diffuser element comprises at least two patterns of passages that are movable relatively to each other so as to adjust an overlap and thus an effective size of the corresponding passages. Moreover, the path of ions within the plating reactor may be controlled by an electromagnetically driven diffuser element so that a required thickness profile on the workpiece surface may be obtained.

Abstract: The invention concerns the treatment of porous structures such as cross-linked foams, woven or nonwoven, to make them electrically conductive by depositing polymers. The device enables, in a chemical reactor, to perform the activating treatment directly through non-reeled off blocks or rolls of porous structures, the treating fluids of the successive steps being made to circulate inside said blocks or rolls, via a perforated rotary mandrel whereon they are pressed. Said device enables to activate efficiently the structures, which may be metal-coated or not, and are particularly designed to be used as electrodes for liquid effluent electrolysis, of detectors and traps of organic or biological molecules, electrode supports for electrochemical generators, catalyst supports, filtering media, acoustic insulants, electromagnetic, nuclear and antistatic protection structures, heat exchangers and the like.

Abstract: A plating apparatus is provided to allow the whole area of a target plating surface of a wafer to be subjected to more uniform plating treatment and moreover enables a target plating surface of a wider area to be subjected to positive and uniform plating treatment. In the plating apparatus which has a stirring bar within a plating tank and which performs plating treatment of a target plating surface of the wafer while stirring a plating solution near the target plating surface of the wafer by moving the stirring bar, the stirring bar is rotated while being oscillated in a motion plane substantially parallel to the target plating surface of the wafer. By this operation, the occurrence of an eddy flow of the plating solution is suppressed during stirring and it becomes possible to positively carry out more uniform plating treatment of a wider region.

Abstract: Disclosed herein is a coating system for pre-coating a vehicle chassis, comprising a coating station and a curing oven, the coating station being upstream from said curing oven along a travel path, the coating station to deliver a layer of coating material thereon, the chassis having a number of sites, each of which is known to be source for accumulating excess coating to cause unwanted drips thereof during curing, further comprising a plurality of nozzles, each being in a nozzle group of one or more, where each group is arranged to deliver a flow of air sufficient to remove the excess coating.

Abstract: A method for processing a substrate having a metal layer formed on a surface of the substrate is set forth. The method first preprocesses a surface of the metal layer, deposits a protective film selectively on a surface of the metal layer by an electroless plating process, cleans the substrate after depositing the protective film, and dries the substrate after cleaning. These processes are repeated a plurality of times to process a plurality of substrate. The deposition rate in the deposition process is 10˜600 Å/min, and a variance of deposition rate for the plurality of substrate is controlled within ±10%.

Abstract: A system for hot-dip galvanizing metal components. The system is comprised of: i) a lifting device; ii) a lifting bow; and iii) a tank containing a molten galvanizing composition.

Abstract: The invention concerns a method and a device for coating the surface of elongated metal products (1) in particular strips or wires, by applying a metal coating material (2), the product (1) requiring to be coated being continuously passed through a bath (3) containing a molten liquid coating material (2). The invention aims at enhancing the productivity of such a coating device. Therefor, the inventive method consists in: a) measuring the thickness (dIst) of the coating material layer (2) applied on the product (1) after it has passed in the bath (3); b) comparing the measured thickness (dIst) with a predefined value of the layer thickness (dsoll) and in determining the difference (&Dgr;) between the two values: and, c) influencing or modifying at least one parameter (P) of the coating process on the basis of the determined difference (&Dgr;) so as to be closer to the measured value (dIst) of the predefined value (dsoll).

Abstract: A vehicle air bag for use with an on-board inflator mechanism. The air bag is formed from a base fabric that has been dipped in an aqueous solution. As a result, a finish is applied to the base fabric to achieve a desired low permeability.

Abstract: There is provided a plating device that can easily form a uniform plated film on the surface, to be plated, of a material. The plating device includes: a holder for holding a material with its surface, to be plated, upward and its peripheral portion of the surface, to be plated, sealed; a heated fluid holding section for holding a heated fluid which is allowed to come into contact with the back surface of the material held by the holder to heat the material; and a plating solution supply section for supplying a plating solution to the surface, to be plated, of the material held by the holder.

Abstract: A method of applying a multi-component coating of a desired composition over a substrate includes providing a coating device in flow communication with a first coating component having a first rheological profile and at least one second coating component having a second rheological profile. The method further includes defining a desired ratio of the first and at least one second coating components to provide a coating of a desired composition, and selecting the rheological profiles of the first and at least one second coating components such that the coating components are supplied at a desired ratio.

Abstract: The invention relates to a process for introducing fluids into a solids flow of a spouted bed apparatus, as well as an associated apparatus.

Abstract: The invention is a die comprising a die body. The die body defines an internal cavity and an applicator slot. The cavity is in fluid communication with the applicator slot. A plurality of gas relief passages are in fluid communication with the internal cavity.

Abstract: A dip-spin coating apparatus and method is described. A disk is partially immersed into a coating liquid and rotated while the disk is maintained in a substantially vertical plane. Once the disk is coated, the disk is removed from the coating liquid where excess material is spun off at a higher rotational speed while the disk is maintained in the vertical plane.

Abstract: A dispenser to dispense towels selectively treated with a fluid, includes a compartment having an open upper end and containing at least one dispensable towel therein. A removable cover is disposable on the compartment to form an enclosure with the compartment. A towel dispensing conduit extends through the cover to a top opening of the cover, the conduit defining a path through which the dispensable towel is extracted from the compartment and dispensed from the top opening of the cover. A fluid application assembly is associated with the removable cover. The fluid application assembly includes a fluid reservoir, oriented over the compartment when the cover is disposed on the compartment, and being configured to receive and store the fluid therein; and a fluid applicator, in fluid communication with the reservoir and being selectively operable by a user to selectively apply the fluid to the dispensable towel as the towel is dispensed from the dispenser.

Abstract: The coating device (10) for coating a metal band (12,12′) in a melted metal mass (14) comprises a shaft (16,18) rotatably supported in the melted metal mass (14) by a slide bearing (261, 262), for guiding the metal band (12). The slide bearing (261, 262) is formed by a bearing housing (32) and an open bearing shell (34) held therein, with two bearing surfaces (36). Between the two bearing surfaces (36), the bearing shell (34) comprises a deformation zone (40) with a deformation element (44). With high radial forces of the shaft occurring, the two bearing shell halves (381, 382) are slightly spread. The flexible deformation zone ensures that the two bearing shell halves remain interconnected and cannot break in this area.

Abstract: Embodiments of the invention generally provide a substrate processing system and method. The substrate processing system generally includes two primary components. The first component is an interface section having at least one first substrate transfer robot positioned therein, and the second component is at least one processing module in communication with the interface section, the at least one processing module having a pretreatment and post treatment cell, a processing cell, at a second substrate transfer robot positioned therein. The substrate processing method generally includes transporting a dry substrate to a processing module via a dry interface. Once the substrate is positioned in the processing module, a robot transfers the substrate between a treatment cell and a processing cell contained within the processing module to complete a predetermined sequence of processing steps.

Abstract: A pattern forming method has the steps of: forming a pattern by discharging droplets of a conductive material forming solution onto an insulating substrate; forming a conductive layer pattern on the pattern by discharging droplets of a solution which becomes a growth core; and forming a metal pattern by immersing the conductive layer pattern in a plating liquid. The pattern forming method may further have the step of forming a protective layer on a surface of the metal pattern by discharging droplets of an insulating material forming solution except at regions which are to become electrodes of the metal pattern.

Abstract: Systems and methods for creating a combinatorial coating library including a coating system operatively coupled to at least one of a plurality of materials suitable for forming at least one coating layer on a surface of one or more substrates. The systems and methods also including a curing system operative to apply at least one of a plurality of curing environments to each of a plurality of regions associated with the at least one coating layer, the curing system comprising a plurality of waveguides each having a first end corresponding to at least one of the plurality of regions and a second end associated with at least one curing source. The combinatorial coating library comprising a predetermined combination of at least one of the plurality of materials and at least one of the plurality of curing environments associated with each of the plurality of regions.

Abstract: An apparatus for coating a photoreceptor substrate, such as a photoreceptor belt or a photoreceptor drum, consists of at least one photoreceptor coating fluid reservoir or diptank. The diptank defines an inlet at one end and a conduit with an orifice at the other end. The conduit includes at least one porous element such as a grid, screen or mesh arranged for suspending a plurality of layers of non-contaminating rounded objects, such as stainless steel or glass beads, in the bottom of the conduit. Photoreceptor coating solution supplied to the inlet is thereby forced to flow through the plurality of layers of beads prior to coating a photoreceptor substrate that is inserted through the orifice. As a result, the uniformity of the coating solution is improved as it coats the photoreceptor substrate, thereby reducing coating defects in the finished photoreceptor belt or drum.

Abstract: A coating apparatus having a fluid circulating system wherein the fluid ascending in a dipping container overflows an overflow edge disposed at the top of the dipping container into an overflow-fluid receiving container and returns from the bottom of the overflow-fluid receiving container into the dipping container, wherein the dipping container has a depth of ⅓ to ⅔ of the internal diameter thereof. When the dipping container is too deep, the powder or the like tends to be compressed tightly in the upper part of the dipping container, often impeding efficient insertion of a substrate, but the coating apparatus according to the present invention, the dimension thereof being specified as above, keeps favorable fluidity of the powder or the like.

Abstract: A metal oxide layer can be deposited onto metallic or ceramic surfaces of a structure in situ, by exposing the surfaces to a precursor solution at an elevated temperature. The precursor solution contains: an organometallic, an oxidant, a surfactant, a chelating agent and water. The precursor solution is injected into the structure and maintained at a specific temperature, pH level and pressure for a predetermined period of time. The resulting in situ metal oxide layer is permanently bonded to the surface structure and does require post deposition heat treatment.

Abstract: A method and apparatus for applying a fluid preservative to wood or wood products has a work tank for maintaining a predetermined concentration of preservative in the fluid. The work tank is equipped with a heater to keep the temperature of the fluid and the preservative in the work tank at a predetermined level. Hot fluid and preservative is drawn under a vacuum, initially from the work tank. On filling a pressure vessel, a pressure pump then supplies the preservative and fluid mixture under pressure to the pressure vessel in which the wood or wood product is being treated. As the treatment process depletes the preservative in the fluid, through absorption in the wood, the depleted fluid is circulated back to the work tank where it is heated and more preservative is added to restore the concentration of preservative in the fluid to a desired level. The fluid, replenished with preservative, is then pumped into the pressure vessel.

Abstract: A method and an arrangement in connection with a production line for optic cable, wherein optical fibers (1) are guided to a coating point (3), where filling gel is applied around the fibres, and a loose tubular casing is formed around the fibres and the filling gel. The fibres (1) are guided to the coating point through a device (4) that is formed from three parts (4a, 4b, 4c), said device being supported on a first base (5) and on a second base (6) moving in the travel direction of the fibres. Sensors (7, 8) are arranged in the first and second bases (5, 6) for measuring the force acting on the bases (5, 6). The arrangement further comprises means (9) for calculating the difference between said measured values for determining the friction force between the fibres and the tubular device (4).

Abstract: This invention relates to methods and apparatus for making coated articles with one or more layers by dip, spray or flow coating. In one aspect, this invention relates to an apparatus and method for making coated containers, preferably comprising polyethylene terephthalate, from coated preforms. In preferred embodiments, the apparatus and method permit the coated container or preform to be made in an energy-efficient manner that reduces the danger of coating damage and thus increases the efficacy of the final container.

Abstract: The intermittent coating apparatus which includes a nozzle 1 which applies a paint 6 to a base material, a feeding side two-way valve 10 which repeats feeding of the paint 6 to the nozzle 1 and stop of the feeding, a return side two-way valve which 11 repeats discharge of the paint 6 to a return side and stop of the discharge, a paint flow path 12, means to feed the paint 6 into the flow path 12, and paint returning means 5 which repeats suction and return of the paint 6 out of and into the nozzle 1, and is characterized in that switching of the feeding side two-way valve 10 is carried out earlier than that of the return side two-way valve 11 within a range not shorter than 5 msec and not longer than 100 msec at least at a coating start time.

Abstract: A diptank applies coating solution to devices that are dipped therein. A reservoir tank contains a reservoir of coating solution. The diptank forms a coating solution overflow return that flows to the reservoir by means of a conduit and a self-adjusting return line. The self-adjusting return line comprises a plastic tubing with an upper portion, a central portion and a lower portion. The upper portion is coupled to the conduit. The tubing central portion is flexible and corrugated and arranged to extend and compress in its length. The lower portion is supported by an attached buoy that floats on the surface of the reservoir. The lower portion defines an outlet that discharges the coating solution overflow return to the reservoir. As a result, the coating solution overflow return is discharged to the reservoir at a fixed vertical distance or level with respect to the surface of the reservoir.

Abstract: An applicator apparatus for applying a preferably foamed treating fluid to a traveling permeable fabric, web or other substrate can include either or both of a low-pressure exhaust chamber on the opposite side of the substrate from the applicator nozzle and a flexible lip extending from either or both sides of the nozzle opening, between the nozzle and the substrate. The applicator apparatus is particularly adapted and well-suited for lightly coating or treating the surface of a fragile and fast moving substrate, without deformation or breakage of the substrate and without undesirable substrate penetration.

Abstract: The invention relates to a process for the continuous dip-coating of a metal strip (1) in a tank (11) containing a liquid metal bath (12), in which process the metal strip (1) is made to run continuously through a duct (13), the lower part (13a) of which is immersed in the liquid metal bath (12) in order to define with the surface of the said bath a seal (14). A natural flow of the liquid metal from the surface of the liquid seal is set up in an overflow compartment (25) made in the said duct (13) and having an internal wall which extends the duct (13) in its lower part and the level of liquid metal in the said compartment (25) is maintained at a level below the surface of the liquid seal (14).

Abstract: The subject of the invention is a process for the continuous dip-coating of a metal strip (1) in a tank (11) containing a liquid metal bath (12), in which process the metal strip (1) is made to run continuously through a duct (13), the lower part of which is immersed in the liquid metal bath (12), in order to define with the surface of the said bath a liquid seal (14). In the region where the strip (1) leaves the liquid metal bath (12), the liquid metal is isolated from the surface of the said bath in an isolating enclosure (20) and the metal oxide particles and intermetallic compound particles are recovered by the liquid metal flowing from this region into the said enclosure (20) and the said particles are extracted from this enclosure (20).

Abstract: An apparatus for controlling coating weight on a steel strip in a continuous hot dip galvanizing process, in which the coating weight is controlled through air wiping after the steel strip passes through a molten zinc coating bath. More particularly, the apparatus keeps the steel strip equidistant from each air knife, uniformly distributes a spray pressure of the air knives in a widthwise direction of the steel strip, and minimizes variation in coating weights on both surfaces of the steel strip. Furthermore, when two steel strips that are different in thickness are continuously hot dip galvanized, the apparatus predicts the movement of the passing line of the steel strips and accurately controls the positions of the air knives. As a result, product deficiencies such as insufficient coating can be reduced and zinc loss due to excess coating can be minimized.

Abstract: The subject of the invention is a process for the continuous dip-coating of a metal strip (1) in a tank (11) containing a liquid metal bath (12), in which process the metal strip (1) is made to run continuously through a duct (13), the lower part (13a) of which is immersed in the liquid metal bath (12) in order to define with the surface of the said bath a liquid seal (14). A natural flow of the liquid metal from the surface of the liquid seal (14) is set up in two overflow compartments (25, 29) made in the said duct (13) and each having an internal wall which extends the duct (13) in its lower part and the level of liquid metal in the said compartments is maintained at a level below the surface of the liquid seal (14).