Abstract: A process of washing plastics contaminated with polychlorinated biphenyls (PCBs) is provided to reduce the concentration of the PCBs. A two-step process includes a first washing step using a selected washing solution or solvent, such as, a non-flammable solvent, and followed by a second step using thermal desorption. The two-step process enables reducing the concentration of PCBs in polymers, such as recovered from shredder residue, for example, to as low as 0.253 PPM. One of the preferred solvents is Perchloroethylene.

Abstract: Cracks are conventionally difficult to clean which often leads to damage to other regions of the component for cleaning. According to the invention, a plasma cleaning method is used, whereby a pressure and/or a separation of an electrode to the component are varied, in order to achieve a plasma cleaning in the crack.

Abstract: A method of cleaning cavities on gas turbine components, in particular on gas turbine blades, wherein a caustic cleaning medium and subsequently a rinsing medium are directed for this purpose in particular repeatedly through the or each cavity, to be cleaned, of a gas turbine component is disclosed. Before the treatment of the or each cavity with cleaning medium and rinsing medium, the or each cavity of the gas turbine component is flooded with inert gas. The gas turbine component, with the inert gas atmosphere in the or each cavity being maintained, is then subjected to a preferably repetitive thermal treatment, wherein the component is heated for this purpose in a first time interval, is held at this temperature for a second time interval and is then cooled in a third time interval. The cleaning medium and the rinsing medium are then directed through the or each cavity.

Abstract: A cleaning effect is improved by cleaning a component that has a recess structure by using a cleaning medium of a liquefied gas or a supercritical fluid. By the cleaning method of removing adhering substances adhering to at least the surface of the recess structure of the component that has the recess structure, cleaning is carried out by using the supercritical gas or the liquefied gas so that the cleaning medium spreads over the surface of the recess structure.

Abstract: A process for the removal of dry adhesives and/or inks from the surface and from the interior of the cells of the engraved cylinders used in printing and coupling processes, using a supercritical mixture formed by one or more organic solvents and a supercritical fluid, preferably consisting of supercritical carbon dioxide. The microscopic cells of the engraved cylinders used in printing industry or of the cylinders used for film coupling in packaging industry are thoroughly and easily cleaned by a process comprising the steps of forming the said supercritical mixture, delivering it in a high pressure autoclave previously filled with the engraved cylinders to be cleaned, cleaning for a given residence time, eliminating the organic solvent residue in the autoclave by washing it with supercritical fluid and precipitating the extracted inks and/or adhesives in one or more separators located downstream the autoclave.

Abstract: A lithographic apparatus, comprising a collector being constructed to receive radiation from a radiation source and transmit radiation to an illumination system, wherein the collector is provided with at least one fluid duct, the apparatus including a temperature conditioner to thermally condition the collector utilizing the fluid duct of the collector, the temperature conditioner being configured to feed a first fluid to the fluid duct during a first period, and to feed a second fluid to the fluid duct during at least a second period.

Abstract: A method of cleaning an imprint template is disclosed. The method includes exposing the imprint template to a reductive fluid.

Abstract: A container is adapted to receive a mask blank having a resist film and includes a container body having an upper opening and a cap put on the container body. The container body has an opening edge provided with an annular elastic member made of polyolefin elastomer or the like and extending throughout entire circumference. When the cap is put on the container body, the elastic member is interposed at a joint portion between the cap and the container body to hermetically seal the container.

Abstract: There are provided a spin processing method and a spin processing apparatus with which the improvement of a processing speed in spin processing can be compatible with the saving of a processing solution. The spin processing method comprises holding and fixing the wafer on the upper surface of the spin table, and supplying the processing solution to the surface of the wafer by the predetermined amount while rotating the spin table, to process the surface of the wafer, wherein the processing solution is supplied while the wafer is heated and maintained at the predetermined temperature, to process the wafer. The predetermined temperature for heating the wafer is equal to or higher than 25° C.

Abstract: Apparatus for cleaning a window of a vehicle, including a vessel, having an inlet through which a washing fluid is received from a reservoir and an outlet through which the fluid is discharged for cleaning the window. There is a heating element for heating the fluid in the vessel, which element preheats the vessel before the washing fluid is received therein, whereby at least an initial quantity of the fluid is rapidly heated and discharged from the vessel.

Abstract: Cleaning and/or benefit compositions comprising a formaldehyde-generating agent, particularly a formaldehyde-containing crosslinking agent, and a formaldehyde scavenger are disclosed. Processes for making and using the aforementioned compositions are further disclosed.

Abstract: The present invention refers to an aqueous composition comprising one or more amphoteric, organic polynitrogen-compounds having at least 3 nitrogen atoms contained in the molecule in the form of an amine and/or amide and one or more types of inorganic nanoparticles, a concentrate comprising said composition and to a method for treating and/or cleaning a surface which uses said composition.

Abstract: A method of cleaning a turbo pump is described. The turbo pump is coupled with a CVD chamber of depositing a material and thus accumulates the material therein. The method includes using another pump to pump a reactive gas, which can react with the material to form gaseous products, through the turbo pump. Thereby, the turbo pump is cleaned up and is prevented from being a particle source in subsequent CVD operations.

Abstract: Improved photocathodes are provided by a fabrication method including steps of wet chemically cleaning the photocathode emission surface (to reduce the level of cleaning-induced surface damage), two stage heat treatment (to complete the cleaning without desorbing nitrogen from the emission surface), followed by activation with Cs only, as opposed to Cs—O. The resulting photocathodes have improved performance (lifetime, brightness, efficiency) compared to conventional photocathodes, and are thus attractive candidates for demanding photocathode applications.

Abstract: A method for using a film formation apparatus for a semiconductor process includes setting an idling state where a reaction chamber of the film formation apparatus accommodates no product target substrate therein, and then, performing a purging process of removing a contaminant present in an inner surface of the reaction chamber by causing radicals to act on the inner surface of the reaction chamber. The radicals are generated by activating a purging process gas containing oxygen and hydrogen as elements.

Abstract: A substrate processing apparatus has a pressure-reducible reaction chamber, a substrate support provided in the reaction chamber, a gas inlet port provided in a wall portion of the reaction chamber to introduce a gas into the reaction chamber, a first plate provided between the substrate support and the gas inlet port in the reaction chamber and having a plurality of first holes for dispersing the gas introduced from the gas inlet port into the reaction chamber, and a second plate provided between the substrate support and the first plate in the reaction chamber in opposing relation to the first plate and having a plurality of second holes for further dispersing the gas dispersed by the first plate. The first and second plates can be moved relatively to each other such that a spacing between the first and second plates is variable.

Abstract: A solvent for urethane adhesives and coatings, the solvent having a carbaldehyde and a cyclic amide as constituents. In some embodiments the solvent consists only of miscible constituents. In some embodiments the carbaldehyde is benzaldehyde and in some embodiments the cyclic amide is N-methylpyrrolidone (M-pyrole). An extender may be added to the solvent. In some embodiments the extender is miscible with the other ingredients, and in some embodiments the extender is non-aqueous. For example, the extender may include isopropanol, ethanol, tetrahydro furfuryl alcohol, benzyl alcohol, Gamma-butyrolactone or a caprolactone. In some embodiments a carbaldehyde and a cyclic amide are heated and used to separate a urethane bonded to a component.

Abstract: The present invention is directed to ion source and vacuum housings for use in MALDI-TOF mass spectrometry which operates with any type of mass analyzer including linear, reflector, or tandem TOF-TOF instruments. By removing the requirement for the vacuum lock, the present invention allows operation of the ion source vacuum chamber at a pressure at least two orders of magnitude higher than conventional instruments. The present invention also requires only a single valve that isolates the ion source vacuum housing from the TOF analyzer vacuum housing. This is a significant improvement over vacuum locks in the art where the valve opening must be sufficiently large to allow the sample plate to pass through.

Abstract: Systematic and effective methodology to clean capacitively coupled plasma reactor electrodes and reduce surface roughness so that the cleaned electrodes meet surface contamination specifications and manufacturing yields are enhanced. Pre-cleaning of tools used in the cleaning process helps prevent contamination of the electrode being cleaned.

Abstract: The invention relates to a method for removing an area of a layer of a component consisting of metal or a metal compound. According to prior art, corrosion products of a component are removed in a first step by applying a molten mass or by heating in a voluminous powder bed. This requires high temperatures or a large amount of space. The inventive method for removing corrosion products of a component is characterized in that a cleaning agent is applied locally, which removes the corrosion products by means of a gaseous reaction product.

Abstract: A substrate processing apparatus includes: a support member supporting a substrate in a process chamber; a first temperature adjusting member in thermal contact with the support member; and a second temperature adjusting member capable of thermally coming into contact with and separating from the support member, wherein the first temperature adjusting member and the second temperature adjusting member are temperature-adjusted to different temperatures respectively.

Abstract: A method and system for measuring contamination, such as metal contamination, on a substrate. A dry cleaning system is utilized for non-destructive, occasional removal of contamination, such as metal containing contamination, on a substrate, whereby a monitoring system coupled to the exhaust of the dry cleaning system is employed to determine the relative level of contamination on the substrate prior to dry cleaning.

Abstract: An apparatus for removing haze in a photo mask includes sealed chamber having a bake module disposed therein to support a photo mask, a reactant gas feed line to feed a reactant gas into the chamber, and a discharge device to discharge impurities in the chamber to the outside.

Abstract: In a method and apparatus for cleaning or processing a workpiece, a process gas is brought into contact with the workpiece by diffusion through a heated liquid layer on the workpiece, and by bulk transport achieved by entraining the gas in a liquid stream, spray or jet impinging on the workpiece. The process gas, which may be ozone, is entrained in the liquid via entrainment nozzles. Use of entrainment and diffusion together increases the amount of gas available for reaction at the workpiece surface, increases the reaction rate, and decreases required process times.

Abstract: A method for activating surface of electron emission source of a field emission display. After a cathode structure is fabricated and sintered with high temperature, the surface of electron emission source is activated by employing a spray coating technology. The spray coating technology includes a spraying device. The spraying device employs compressed air to homogeneously spray the solution onto the surface of the cathode structure. The solution will then cover the gate electrode layer and permeate into the hole and sagged area on the surface of electron emission source to form a covering layer. The covering layer is then dried and peeled off using a roller peeling device. The roller peeling device includes two rollers, one of which includes a heating unit to heat and soften the covering layer when rolled on the covering layer of the cathode structure. The other roller can thus peel off the covering layer easily.

Abstract: The inventive substrate treatment method includes a treatment liquid supplying step, a pre-drying liquid supplying step and a vapor supplying step. In the treatment liquid supplying step, a treatment liquid is supplied to a major surface of a substrate. In the pre-drying liquid supplying step, a first lower surface-tension liquid having a lower surface tension than deionized water is supplied to the major surface after the treatment liquid supplying step. In the vapor supplying step, vapor of a second lower surface-tension liquid having a lower surface tension than the deionized water and soluble in the first lower surface-tension liquid is supplied to the major surface after the pre-drying liquid supplying step.

Abstract: The present invention relates to a method and apparatus for the prevention of fouling of process streams by the application of electric charge on process components. The electric charge may be attractive or repulsive to the foulants, they may be constant or variable and may be applied to any section of the process stream where convenient and wherein their preventive effects are optimized.

Abstract: Resists can be removed while metal contamination of wafers, etc. and generation of particles, and growth of oxide films are suppressed. A substrate processing method comprises feeding a processing gas, such as ozone gas, into a processing vessel to pressurize an atmosphere surrounding a substrate. A solvent gas, such as steam, is fed into the processing vessel while the processing gas is fed into the processing vessel, whereby a resist of the substrate can be removed with the solvent gas and the processing gas while metal corrosion, etc. can be prevented.

Abstract: A substrate cleaning apparatus (1) of the present invention is the substrate cleaning apparatus (1) for cleaning a substrate (wafer 7) with the use of a cleaning agent (e.g., Caro's acid) that is generated by reacting plural kinds of chemical liquids (e.g., sulfuric acid and hydrogen peroxide solution). The substrate cleaning apparatus (1) comprises: a mixing unit (31) for mixing plural kinds of chemical liquids, a supplying unit (32) for supplying the chemical liquids that have been mixed by the mixing unit, onto a surface of a substrate to be cleaned; and a heating unit (14) for heating the chemical liquids that have been supplied onto the surface of the substrate by the supplying unit, on the surface of the substrate. In particular, the mixing unit (31) includes a reaction restraining mechanism (33) for restraining a reaction of the mixed chemical liquids, and the reaction restraining mechanism (33) is on a cooling mechanism for cooling the mixed chemical liquids.

Abstract: An apparatus for removing haze in a photo mask includes sealed chamber having a bake module disposed therein to support a photo mask, a reactant gas feed line to feed a reactant gas into the chamber, and a discharge device to discharge impurities in the chamber to the outside.

Abstract: A thermal process for cleaning equipment surfaces of undesired silicon nitride in semiconductor processing chamber with thermally activated source of pre-diluted fluorine is disclosed in the specification. The process comprising: (a)flowing pre-diluted fluorine in an inert gas through the chamber; (b)maintaining the chamber at an elevated temperature of 230° C. to 565° C. to thermally disassociate the fluorine; (c)cleaning undesired silicon nitride from the surfaces by chemical reaction of thermally disassociated fluorine in (b) with the undesired silicon nitride to form volatile reaction products; (d)removing the volatile reaction products from the chamber.

Abstract: The present invention generally relates to a wet wipe or sheet that is suitable for contacting the skin and that has a stratified wetting composition therein. More specifically, the present invention related to a wet wipe, which may optionally be an ion-triggerable, water-disintegratable wipe, wherein the organic phase, and more particularly one or more components of the organic phase, of the wetting composition is concentrated near the surface of the wipe, and the aqueous phase of the wetting composition is concentrated in the bulk of the wipe. The present invention is further directed to a number of processes for preparing such a wet wipe. For example, in one embodiment an emulsified wetting composition is applied to a fibrous substrate of the wet wipe, and then treated to destabilize the emulsion. In an alternative embodiment, an emulsified wetting composition may be destabilized prior to it being applied to the fibrous substrate.

Abstract: In a cleaning step of a substrate-processing device, vacuum drawing is made for the space between an inner chamber and an outer chamber that receives the inner chamber. Temperature of the inner chamber is set higher than the temperature of the inner chamber during substrate processing and set lower than the temperature of a substrate support member. After that, a cleaning gas containing hexafluoroacetylaceton (Hhfac) is supplied in the inner chamber, and substances to be cleaned off adhering inside the inner chamber are removed.

Abstract: An surface treatment apparatus of a substrate can clean a substrate surface in the air without employing a vacuum apparatus, and can remove a natural oxide film or an organic material, such as BTA, from the substrate surface without resorting to plasma cleaning. The surface treatment apparatus includes: an inert gas supply section for supplying an inert gas to the whole or part of a substrate surface to form an oxygen-blocking zone; a heating section for keeping the substrate surface at a predetermined temperature; and a cleaning gas supply section for supplying a cleaning gas to the oxygen-blocking zone to clean the substrate surface.

Abstract: Disclosed herein is a method of cleaning a photomask, which prevents haze from being generated on a surface of the photomask during a photolithography process. The photomask is heat treated to remove residual ions on a surface thereof and to induce curing and oxidation of Cr and MoSiON layers, thereby preventing diffusion of the ions. Etching of Cr and MoSiON layers due to a cleaning process is suppressed in order to significantly reduce a change in phase and transmissivity of optical properties of Cr and MoSiON.

Abstract: A method of cleaning a chamber used for annealing doped wafer substrates. In one embodiment the method provides removing dopants deposited in an annealing chamber after an annealing process of a doped substrate by flowing one or more volatilizing gases into the annealing chamber, applying heat to volatilize the deposited dopants in the annealing chamber, and exhausting the chamber to remove volatilized dopants from the annealing chamber.

Abstract: A method of transporting a reticle is disclosed. The reticle is placed in a reticle carrier that has an ionizer. Moreover, the reticle may be attached with a pellicle. The pellicle consists of a pellicle frame and a pellicle film stretched over the pellicle frame. The pellicle frame has included within an absorbent material.

Abstract: A process of washing plastics contaminated with polychlorinated biphenyls (PCBs) is provided to reduce the concentration of the PCBs. A two-step process includes a first washing step using a selected washing solution or solvent, such as, a non-flammable solvent, and followed by a second step using thermal desorption. The two-step process enables reducing the concentration of PCBs in polymers, such as recovered from shredder residue, for example, to as low as 0.253 PPM. One of the preferred solvents is Perchloroethylene.

Abstract: Described are methods of rinsing and processing devices such as semiconductor wafers wherein the device is rinsed with using a surface tension reducing agent; the method may include a subsequent drying step which preferably incorporates the use of a surface tension reducing agent during at least partial drying; and the method may be performed using automated rinsing equipment; also described are automated rinsing apparatuses useful with the method.

Abstract: The pulsed partial pressure hydrogen cleaning of cobalt-based alloys in turbine components is achieved by disposing the component within a vacuum furnace and heating the component. Upon heating to about 1400° F., a partial pressure hydrogen gas and a vacuum are repetitively cycled within the furnace by supplying in each cycle a fresh supply of hydrogen gas, followed by removal of reaction products between the hydrogen gas and surface contaminants and substantially all residual hydrogen gas from within the furnace. The repetitious cycling renders the surfaces clean, enabling refurbishment thereof by activated diffusion healing repair.

Abstract: A method for cleaning vias, trenches, or other features on a workpiece, such as a semiconductor wafer, includes pre-heating the wafer to a desired temperature. A heated processing or cleaning fluid is then applied to the workpiece. The workpiece may be heated to a temperature higher than the temperature of the processing fluid, to increase the chemical reaction efficiency between the processing fluid and the workpiece features. The workpiece may be heated before or after being loaded into a processing chamber.

Abstract: Process for the treatment of cork or a cork-based material particularly with a view towards extracting contaminating organic compounds, in which said cork or said cork-based material is put into contact with a dense fluid under pressure at a temperature of from 10 to 120° C. and at a pressure of from 10 to 600 bars. Manufacturing installation for parts made of cork or a cork-based material, such as bottle corks, comprising an installation for treatment or extraction by putting the said cork or the said material into contact with a dense fluid under pressure.

Abstract: A dishwasher that fits within the conventional U.S. residential dishwasher counter space and uses the conventional U.S. residential power supply to achieve within a convenient cycle time the same standard of sanitation as set forth for commercial and residential hot water sanitizing dishwashers.

Abstract: A system and method for the selective etching or removal of encapsulating material from an encapsulated object, such as a semiconductor, includes depositing an encapsulant-removal agent, such as a solvent or acid, onto the surface of the object. A flow of heated gas, such as an inert gas, is directed onto the deposited agent to effect the heating thereof and promote the removal of the encapsulating material. In general, the flow of heated gas is sufficient to cause the formation of a depression or depression-like concavity in the surface of the removing agent to promote the removal process. In a preferred embodiment, a pipe is provided with an internal heater to heat the gas flow there through and a nozzle at one end to direct the gas flow toward and onto the deposited removal agent.

Abstract: A lithographic mask is placed in a chamber which is then sealed. The gas pressure in the chamber is reduced to dislodge contaminant particles on the mask surface.

Abstract: A cleaning method and cleaning recipes are disclosed. The present invention relates to a method for cleaning a semiconductor substrate and cleaning recipes. The present invention utilizes a first cleaning solution including diluted hydrofluoric acid and a second cleaning solution including hydrogen chloride and hydrogen peroxide (H2O2) to clean a semiconductor substrate without using an alkaline solution including ammonium hydroxide. Accordingly, a clean surface of a semiconductor substrate is provided in selective epitaxial growth (SEG) process to grow an epitaxial layer with smooth surface.

Abstract: The present invention is a composition for removal of multi-layer photoresist layers on an electronic device substrate for rework of the photoresist on the substrate, comprising; (i) a solvent blend of at least three discrete solvents, (ii) at least one organic sulfonic acid, and (iii) at least one corrosion inhibitor. The present invention is also a method for using the composition. This composition and method succeed in removing such multi-layer photoresist at temperatures less than 65° C. and in contact times under three minutes, allowing high throughput on single wafer tools.

Abstract: A method for activating the surface of a base material and an apparatus thereof, which is suited to be utilized for pretreatment in electrochemical treatment such as, for example, electroplating or the like, in which the surface of a base material such as metal can be subjected to degreasing treatment and oxide film removing treatment simultaneously, efficiently and rationally, in which productivity can be enhanced and the equipment cost can be reduced, and in which a waste solution can be rationalized so that the solution can be reutilized and the environmental pollution can be prevented. A method for activating the surface of a base material in which the surface of a member to be treated is subjected to degreasing treatment or oxide film removing treatment. Pressurized carbon dioxide is dissolved in a predetermined quantity of water, thereby preparing an oxide film removing solution having a predetermined acidic concentration.

Abstract: A method for cleaning a semiconductor structure including providing a chamber for holding the semiconductor structure and a dense phase fluid, providing a thermal transfer device having a thermal transfer surface, connecting the thermal transfer device to the chamber, placing the semiconductor structure in the chamber in contact with the thermal transfer surface and thermally cycling the thermal transfer surface.

Abstract: The present invention relates to the use of a C1 to C5 alcohol during the cleaning step. With the use of said alcohol, the surface tension of the solution is reduced which allows the application of reduced megasonic power with increased cleaning efficiency.