Abstract: A substrate bonding apparatus includes a bonding chamber, lower and upper stages positioned at lower and upper spaces at an interior of the bonding chamber, respectively, the lower stage including a first receiving part, a first lifting system having a first support part for supporting a first substrate, the first receiving part receiving the first support part within the lower stage, and a blowing system formed in the first support part to blow air through the first support part.

Abstract: An off-line stretching device includes a film supply chamber, a tenter section, a relaxation chamber, a cooling chamber, and a winding chamber. The film supply chamber includes a splicing section, where a rear end of a preceding film and a front end of a trailing film are overlapped to be spliced to each other by thermal welding. The thermal welding is performed from above and below the film while a temperature of welding heads of a heat sealer, contacting with the film, is kept at a level equal to or less than a decomposition temperature of the preceding and trailing films. The spliced film is stretched in the tenter section and subjected to heat treatment for stress relaxation in the relaxation chamber, to shrink in a film width direction. Since the shrinkage amount of a spliced area and that of a peripheral area become equal to each other, the occurrence of wrinkles in the spliced area and tears of the film in the peripheral area can be prevented.

Abstract: An apparatus and method for producing semiconductor modules is disclosed. One embodiment provides for bonding at least one semiconductor die onto a carrier including a support film strip, the support film having applied an adhesive layer to one of its surfaces to attach the semiconductor die, and a pressure tool to press the semiconductor die and the support film strip onto the carrier to permanently contact the at least one semiconductor die to the carrier.

Abstract: A sealer for bonding a cover foil to a support foil has upper and lower tools having confronting faces between which the foils move in a transport direction, a drive for pressing one of the tools vertically toward the other tool and thereby compressing the foils together between the faces, an intermediate plate between the drive means and the one tool formed with an array of pressurizable chambers. These chambers can be selectively pressurized.

Abstract: A laminator 100 in which the diaphragm can be mounted simply and easily without the use of a mounting frame. The laminator 100 includes an upper chamber 110, on the bottom surface of which is mounted the diaphragm 140, and a lower chamber 120 on which the upper chamber 110 is stacked and in which is disposed a support base 130 on which a workpiece A that is to be laminated is set. The diaphragm 140 is larger than the upper chamber 110, and an excess portion of the diaphragm that protrudes outside the upper chamber when the diaphragm is mounted on the upper chamber is folded upward and clamped against the sides of the upper chamber by multiple clamps to fix the diaphragm in place on the upper chamber.

Abstract: The present invention relates to an apparatus for conforming a functionalized flexible planar film on an optical lens. The apparatus according to the invention may also be used in a process of functionalization of an optical lens. As a factor of the functionalization that one wishes to introduce into said optical lens and the nature of the functionalized flexible planar film used, the functionalization process is a process of gluing, transfer, or molding of a functionalized flexible planar film onto an optical lens. The implementation of each of these respective processes makes it possible to obtain a functionalized optical lens, said functionalization being adhered, transferred, or molded using a functionalized flexible planar film.

Abstract: An expandable membrane (280), e.g. a membrane that is elastic and/or has a corrugated edge, is expanded to exert more uniform pressure over a semiconductor wafer (110) or a carrier (254) to bond the wafer to the carrier.

Abstract: A device for manufacturing double-faced corrugated paperboards is provided, which exerts uniform pressure and enlarge the heated area during the adhesion of a single-faced corrugated paperboard and a liner into a double-faced corrugated paperboard. The device mainly contains a number of flexible, strip-shaped, pressurizing members arranged in parallel along the advancing direction of the paperboard, each of which is suspended by two ore more lifting members which can lower the pressurizing member down to the paperboard and lift the pressurizing member up from the paperboard.

Abstract: A functional film of the invention includes a microparticulate-containing layer containing functional microparticulates. The microparticulate-containing layer inhibits the occurrence of cracks even when drawn 10%. When the functional film includes a microparticulate-containing layer containing conductive microparticulates, the microparticulate-containing layer exhibits a surface resistivity after drawn 10% which is at most 10 times greater than the surface resistivity prior to drawing. The invention thus implements a functional film which is unsusceptible to reduction or loss of its function due to deformation.

Abstract: Configurable layup tooling is used to fabricate reinforced composite parts have a common shape but varying features. The tooling includes a tool base, multiple mandrels and optionally, a tool insert, all of which may be used to form a portion of the common shape. The mandrels have differing tool geometries for forming the varying features of the commonly shaped parts. The tool base may be used as a bonding jig to assemble and bond assemblies that include the fabricated parts.

Abstract: A method for compacting a surface of a wooden workpiece (1), wherein the addition of a foreign material is to be avoided, is characterized in that the surface (17) of the wooden workpiece (1)—while preventing the entry of oxygen—is heated in at least partial areas by supplying energy to the surface (17) and under pressure until a thermoplastic adhesive substance (3) coming from the wooden workpiece (1) is formed, whereupon the surface (17) and a volume area beneath the surface (17) are compacted under application of pressure while being cooled.

Abstract: A method of adhering a first panel, such as an OLED assembly, to a second panel, such as a protective cover plate, is disclosed. An adhesive is applied to a face of at least one of the first and second panels. The first panel is positioned to be responsive to movement of any of a plurality of independently controlled expandable elements. The second panel is held adjacent the first panel. At least one of the expandable elements is selectively expanded so that a first edge of the first panel contacts a first edge of the second panel. The expandable elements are further selectively expanded so that the adhesive fully contacts the first and second panels.

Abstract: The present invention provides a CD label applicator. It comprises a lower plate and an upper plate being linked each other with one side thereof. A round sunk area is formed on the middle of the lower plate to accommodate a CD; three posts are formed at appropriate points along peripheral of the lower plate. A layer of removable adhesive with anular shape is attached on the middle of the upper plate; three holes are formed at appropriate points along peripheral of the upper plate. When the upper plate covers the lower plate, the removable adhesive with anular shape just coincides with the round sunk area, and the three holes just sleeve on the the three posts respectively. The present invention also provides a CD label paper, three notches are formed at appropriate points along peripheral of the CD label paper to coincide respectively with three posts on the lower plate of the CD label applicator.

Abstract: Two circuit bearing substrates, such as a rigid electronic circuit board and a flexible circuit film, each having large arrays or multiple arrays of surface contact pads or traces, are mechanically and electrically joined without relocating the substrates during the bonding process by using a bonding apparatus with multiple working tools or bond shoes. The bonding apparatus includes a fixture for holding the circuit bearing substrates with a joining layer between them, and two or more independently operated heated bond shoes that compress different portions of the circuit bearing substrates with the joining layer, such as a layer of anisotropic conductive film.

Abstract: A bonding machine for fabrication of a large size LCD having an upper stage and a lower stage provided in a bonding chamber to face each other, for adsorbing the first and second substrates carried in the bonding chamber, and bonding the substrates together. The bonding machine having supporting means in the bonding chamber, lifting means, and process supplementing means fitted in the bonding chamber so as to be rotatable and movable up/down. The method including loading the first and second substrates on respective stages, driving the supporting means to support the second substrate loaded on the upper stage, and evacuating the bonding chamber, the upper stage adsorbing the second substrate and bonding the first and second substrates together, and lifting the bonded first and second substrates from the lower stage by using the lifting means, and unloading the first and second substrates.

Abstract: A method for manufacturing a friction plate in which a plurality of frictional material segments are adhered to a substantially annular core plate. The method previously registers the frictional material segments to adhesion positions, and presses the core plate to which adhesive agent is applied and the frictional segments to perform temporary adhesion. Further, an apparatus for manufacturing a friction plate in which a plurality of frictional material segments are adhered to a substantially annular core plate. The apparatus comprises a member for registering the frictional material segments while holding the frictional material segments in a state arranged in the adhesion positions.

Abstract: An electronic assembly includes a backplate, a substrate and a pressure sensitive adhesive (PSA). The backplate includes a cavity and the substrate includes a plurality of interconnected electrical components. The substrate is positioned within the cavity and a wall height of the cavity is greater than a combined thickness of the substrate and the adhesive, which bonds the substrate to the backplate.

Abstract: A bonding apparatus for fabricating a liquid crystal display device includes a vacuum chamber for bonding first and second substrates together, an upper stage and a lower stage oppositely arranged in an upper space and a lower space of the vacuum chamber, and a pressure application system coupled to one of the upper and lower stages for applying first and second pressures to different parts of the one of the upper and lower stages.

Abstract: An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers includes a base plate configured to support a plurality of green sheet layers thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.

Abstract: An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers includes a base plate configured to support a plurality of green sheet layers thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.

Abstract: An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers includes a base plate configured to support a plurality of green sheet layers thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.

Abstract: An attaching apparatus (10) includes a guiding bracket (30), a pivot bracket (40), and a sliding bracket (50). The guiding bracket includes a supporting plate (312), and a first table (32) defining a first space (322). The pivot bracket includes a pivot device having a connecting plate (42) and a pivoting plate, the pivoting plate is pivotably connected to the connecting plate. The sliding bracket slidably engages with the guiding bracket. The first table is movably positioned on the supporting plate. The first table under the first space defines one or more suction holes. The pivoting plate includes a second table (430), and two locators (440, 450) movably positioned on the second table. The second table defines one or more suction holes (434). The attaching apparatus can be readily adjusted to attach LCD panels and polarizers of various different sizes.

Abstract: There is disclosed an applicator and method for applying transfers such as heat transfers, decals or labels to transfer-receptive materials. The applicator has a lightweight, T-shaped, sheet metal support or frame having an applicator station. A motorized supply roll unwind and a motorized take-up roll rewind are mounted on the support to hold supply and take-up rolls, to tension the transfer-containing web and to advance the web onto the take-up roll after the transfer has been applied at the applicator station.

Abstract: A web of a first sheet material and a web of a second sheet material are laminated together by a process wherein the sheet materials are wound, in an interleaved relationship, upon a roller having a radially displaceable outer surface. The roller and webs and then subjected to heating and/or a low-pressure environment so as to complete the lamination. A body of adhesive material, such as a hot melt adhesive, may be interposed between the webs and the heating or low pressure environment can activate this adhesive. Further disposed are particular configurations of rollers with radially displaceable surfaces.

Abstract: Provided is a lamination unit of ceramic green sheets including a pair of upper and lower plates having a plurality of slits formed therein; a plurality of posts of which the upper and lower ends are closely attached to corresponding surfaces of the respective plates such that the upper and lower plates are supported in parallel to each other; a plurality of fixing sections, each of which is composed of a bolt inserted into a contact portion between the plate and the post and a button surrounding the bolt; and a pressing bar attached on the bottom surface of the lower plate and pressing the top surface of the ceramic green sheets laminated under the lower plate.

Abstract: The present invention relates to a method of manufacturing a semiconductor substrate including the back grind step, the dicing step, the pick up step, and the die bonding step of the wafer; and to a semiconductor substrate jig used in such method. The object of the present invention is to mitigate the effect and to prevent damage caused by the lack of strength in thinned semiconductor substrates. A jig with an outer frame 21, and a rubber film 22 arranged within the outer frame 21 and having increasing and decreasing body size while deforming its shape by supplying air therein are provided. As the volume of the rubber film 22 increases, the wafer-fixing jig 20 deforms the rubber film and allows the tapes 2 and 6 arranged between the wafer 1 and the rubber film 22A to be pushed toward the wafer 1 gradually from the center outward. The attachment step, the back grind step, the tape reapplication step, the pick up step and the die bonding step are conducted using such wafer-fixing jig.

Abstract: A tool for laminating a metal foil and polymer film to form a laminate structure is disclosed. A method of using the tool to form a laminate structure is also disclosed.

Abstract: Disclosed herein is a high release nip roll assembly comprising a nip roll with a covering comprising a high release material. The release properties of the nip roll material can permit intermittent contact without the coating adhering to the surface of the roller and wrapping the nip. Also disclosed is a high release nip roll belt is made of a high release material on the top and bottom surfaces of the belt. The belt can be positioned at each end of a nip roll so that areas of the nip roll typically vulnerable to molten thermoplastic material contact are protected by a belt. Also disclosed is a belt making apparatus. Also disclosed is a frame assembly for moving a belt longitudinally along a nip roll. Also disclosed is a rope guide assembly for threading a belt in relation to a nip roll and at least at least one belt roller.

Abstract: In a method and apparatus for producing a plate-type insulation support provided with an adhesive layer for a gradient coil for a magnetic resonance device, an adhesive film forming the adhesive layer is used, which has a number of openings distributed over its surface to allow the passage of air and which is applied to the insulation support.

Abstract: A heating apparatus and method for heating a semiconductor device during bonding of electrical contacts onto the device is provided, which includes a heating plate that is provided for heating the semiconductor device and a layer of compliant material extending over at least a portion of the heating plate for mounting the semiconductor device. A holding mechanism secures the semiconductor device on the layer of compliant material during bonding of electrical contacts onto the semiconductor device while it is being heated by the heating plate.

Abstract: According to an embodiment of the present invention, a printed wiring board manufacturing apparatus being provided with a drum unit having a processing cylinder that holds the printed wiring board material and comprises a cylinder outer circumference and a processing unit that performs processing on the printed wiring board material held by the processing cylinder.

Abstract: A pressure loader for firing a laminated ceramic substrate includes an outer loader and an inner loader. The outer loader is mounted on a periphery region of a ceramic laminated body to press the periphery region, and the inner loader is mounted on an internal region of the ceramic laminated body to press the internal region.

Abstract: An attitude-changeable surface pressing member is attached to a front end of a clip such that substrates can evenly be pressed even if a distance clipped at the front end by the clip is changed during a heating process in a sealing process. A display panel sealing clip includes a pressing member which has a pair of clipping portions for clipping both the substrates and the tubulation tubing to apply pressure in a direction in which the pair of clipping portions is brought close to each other and a surface pressing member which presses the tubulation tubing by a surface thereof.

Abstract: An apparatus for manufacturing a laminated substrate with a simple structure and with satisfactory yield. First and second holding plates each attract substrates without contacting a laminating surface of the two substrates. A substrate conveying device conveys the substrates into the processing chamber. The substrate conveying device attracts only the surface of a substrate that is opposite to the laminating surface, transfers the substrate to a holding plate, and receives the substrate from the holding plate.

Abstract: Method for manufacturing corrugated board or the like, whereby different material strips (3-6) are fastened together by means of a bonding agent, whereby one or several material strips (3-6) are guided along at least one press-on device (15-16), where they are guided over one or several elements (10-14), in particular supporting elements, and are pressed against them by means of a series of movable press-on parts (19), wherein for pressing on these press-on parts (19), use is made of magnetic forces.

Abstract: Apparatus for applying adhesive tape to an article having first and second surfaces to be securely joined together by the adhesive tape. The apparatus includes a gripper (11) which draws tape T from a reel R. A cutter assembly (14) is operable to cut the tape T to a required length. The length of tape is held by suction on grids (16). The grids (16) are moveable to a lowered position to enable the length of tape T to be transferred to application arms (21) and thereby be positioned adjacent the first and second surfaces. Applicating heads (30) are operable to press an area of the tape onto the first and second surfaces. Relative movement between the applicating heads (30) and the surfaces cause the tape to become adhered to and join the first and second surfaces.

Abstract: A process for the manufacture of veneer comprises gluing board-like, plane pieces of wood together with an adhesive to form a beam-like block of wood. The humidity content of the beam-like block of wood is increased. Veneer is cut from the beam-like block of wood and dried until the humidity content is below a fiber saturation point. Because of the rules governing abstracts, this abstract should not be used to construe the claims.

Abstract: Vibratory welded connections are formed between first and second members of thermoplastic material by interposing a junction piece of similar material and vibrating the junction piece at high speed while pressing the first and second members in a controlled manner against opposite sides of the junction piece. Friction created by the vibration generates heat which melts a small amount of material at the engaging surfaces which upon cooling provides a strong welded joint having minimal flash. Entire frame systems such as window frames can be fabricated by an apparatus system which forms a friction welded joint between adjacent ends of the frame members. Furthermore the frame can be fabricated around a panel such as a glazing panel. The welded connections formed by the system do not mar the finish of the frame members and produce no unsightly flash bead requiring subsequent machining steps for its removal.

Abstract: In an optical disc fabricating apparatus, when the disc substrate is lowered from the tip of a disc inserting portion at a center pin down to a disc supporting portion, a disc urging portion of an alignment lever is pressed by a disc substrate, to be thus pushed in toward an inner periphery and a sheet urging portion is pushed out toward an outer periphery, so as to press the inner peripheral surface of a cover sheet so that both of the cover sheet and the disc substrate are urged in an alignment direction. Thus, it is possible to eliminate play generated between the inner peripheral surface of the cover sheet and the outer peripheral surface of a sheet inserting portion and play generated between the inner peripheral surface of the disc substrate and the outer peripheral surface of the disc inserting portion.

Abstract: A press has an upper traverse, a lower traverse below the upper traverse, and vertical frame elements extending between the traverse, fixing same together against relative movement, and forming a rigid frame with the upper traverse and lower traverse. A central traverse is vertically reciprocal on the elements between the upper and lower traverses. A workpiece is fed horizontally through the press between the upper traverse and the central traverse. A stationary support is provided adjacent the frame, and the frame is supported for at least limited vertical movement relative to the support. A drive connected between the support, the frame, and the central traverse vertically reciprocates the frame and the central traverse relative to the support.

Abstract: An annular convex portion is formed along an outer periphery of a back face of a wafer so as to surround a ground area in the back face. The wafer is placed on a holding table in a state that a front face thereof is directed upward. A locking member of the holding table supports the outer periphery of the annular convex portion so as to come into contact with the outer periphery of the annular convex portion, thereby securing the wafer. In this state, a separating adhesive tape is supplied toward a surface of a protective tape joined to the front face of the wafer. Then, a joining member moves from a first end to a second end of the wafer while pressing a non-adhesive surface of the adhesive tape against the wafer, thereby joining the adhesive tape to the surface of the protective tape.

Abstract: There is provided a friction stir spot joining device to eliminate the generation of tipping torque caused by a pressing force by allowing the axis of a ball screw for generating the pressing force and the center of a shaft of a stirring motor to be coincident with each other, thereby allowing the device to be downsized and the device to effect joining operation with ease. The friction stir spot joining device comprises a ball nut fixed to the rear end side the stirring motor, a hole is defined in an output shaft of the stirring motor in which the ball screw is housed from a rear portion of the hole so as to be positioned in the hole, wherein a rotating force of the pressing motor is transmitted to the ball screw and the stirring motor is moved forward and backward by the ball nut threaded with the ball screw.

Abstract: A method and apparatus for producing continuous belts is disclosed. The belts are formed from plastic films and are used as transfer belts in electrographic printers and copiers. The ends of the film are welded together by abutting their front faces and the ends are held together under pressure while being heated by radiation to a temperature to cause welding of the ends.

Abstract: A film adhesion device includes a table carrying a semiconductor wafer, a pressing member (pressing roller) which presses a film (photoresist film) onto a surface side of the semiconductor wafer placed on the table, a bumper member provided on an outer peripheral side of the table and including a contact surface which is contacted by the pressing member when the pressing member presses the film, and an elevating support mechanism which supports the bumper member elevatably and positions the bumper member at a predetermined height level.

Abstract: Apparatus for assembling substrates of a planar fluorescent lamp including a base mounted movable along a process line, the base having an upper surface for placing a first substrate of the fluorescent lamp, at least one movable board over the base, the movable board being mounted rotatable between a first position and a second position, at least one pair of parallel links each having one end rotatably coupled to the base and the other end rotatably coupled to the movable board for the movable board rotatable from the first position to the second position, a plurality of clamping members mounted on the movable board for holding a second substrate of the fluorescent lamp at a position under the movable board, a stopping member mounted in the process line over a direction of movement of the base, for coming into contact with the movable board to cause rotation of the movable board, and a damping member for making a damping action at a time the first, and second substrates of the fluorescent lamp come into conta

Abstract: A facestock releasably adhered to a liner sheet is die cut to form one or two compact disc labels, and two diametrically opposed tabs on each compact disc label and located so that one edge of the tab is in contact with one of the compact disc labels and is perforated. The liner side of the tab also has a die cut patterned so that it generally follows the outline of the tab, but which forms a shape which is inside of and slightly smaller than the face cut tab pattern. After the label sheet has passed through a printer or copier and the desired indicia has been printed on the labels, at least one of the tabs is pushed through from the reverse side of the sheet, or pulled through via a sheet opening partially separating the tab from the rest of the sheet. The tab, which is mostly free of exposed adhesive in that it is still laminated to the die cut section of release liner, is then grasped from the face side, and lifted upward, pulling the compact disc label away from the label sheet.

Abstract: A label applicator including a support surface having a central area and curving downwardly from the central area. A post assembly extends up from the central area such that a label having a label through-hole can be positioned in a support position generally on the support surface with the post assembly extending up through the label through-hole and an adhesive face of the label facing up. Thereby an article having an article through-hole can be positioned over the post assembly so that a flat surface of the article can be pressed and guided against the adhesive face of the positioned label. The curved surface flattens out as the article is pressed down, allowing the label to be smoothly applied to the article. Pins extending up adjacent to the support surface engage in notches on the label and help hold the label in place.

Abstract: Method and device for the rotational friction welding of plastic parts. A method for the rotational friction welding of plastics wherein a rotationally symmetrical plastic body is set in rotation and, as it rotates, is pressed against a welding location of a plastic part that is held stationary until plastification of the pressing surfaces of the plastic part and/or the plastic body is achieved, and wherein the rotationally symmetrical plastic body is braked to a standstill after plastifying and is held pressed against the stationary plastic part until the plastified pressing surfaces solidify, is known. According to the invention, the rotationally symmetrical plastic body is pressed at a circumferential speed of more than 7 m/s and a pressing pressure of less than 0.5 N/mm2 against the welding location of the plastic part that is held stationary. Use for plastic tanks.

Abstract: A method for the production of a wood composite board is provided that comprises the steps of: providing a quantity of wood in the form of strands; coating the wood strands with a binder composition to from coated strands; forming a mat from the coated strands; exposing said mat to steam; ventilating steam; and pressing the mat, at a high temperature, to form the wood composite board having a final thickness.

Abstract: A method of friction welding first and second parts together at an angular orientation relative to each other includes the steps of mounting the first part in a spindle for axial rotation and the second part in a non-rotatable holder. The spindle is then rotated and the angular orientation of the first part relative to the second part is determined at any specific time. The holder is moved toward the spindle to bring the second part into frictional contact with the first part at a selected one of the specific times that the angular orientation is determined. Accordingly, due to frictional contact, the respective contacting surface of the parts are melted. The speed of the rotation of the spindle is then decreased and the holder is moved toward the spindle to forcibly urge the first and second parts together at the contacting surface.