Abstract: A compression-bonding apparatus includes a support stage and a pressing tool. The pressing tool includes a pressing stage, an elastic member and a plurality of bonding heads. The elastic member is held by the pressing stage. The plurality of bonding heads includes an upper surface attached to the elastic member and a lower surface facing an upper surface of the support stage.

Abstract: The present invention describes an improved side-sealing machine for use with heat sealable films. Briefly, a cutting and sealing element is located between a set of cooperating guide and alignment members. The downstream guide and alignment member also includes a compression mechanism. This compression mechanism serves to compress the seal created upstream, and to draw the heat away from the film. In some embodiments, the downstream guide and alignment member also serves to separate the film into a surplus portion and a remaining portion, where only the remaining portion is subjected to compression.

Abstract: Semiconductor die are assembled on a substrate by providing the semiconductor die, substrate, and an elastically deformable foil fixture preformed with one or more sunken regions having sidewalls and a bottom, and placing the semiconductor die in the one or more sunken regions so that the foil fixture is populated with a first side of the semiconductor die facing the bottom of the one or more sunken regions and a second opposing side of the semiconductor die facing away from the bottom of the one or more sunken regions. The substrate is placed adjacent the second side of the semiconductor die with a joining material interposed between the substrate and the semiconductor die. The substrate and the populated foil fixture are pressed together at an elevated temperature and pressure via first and second pressing tool members so that the substrate is attached to the second side of the semiconductor die via the joining material.

Abstract: Implementations of the present invention relate to systems, methods, and apparatus for applying heat and pressure to a laminate assembly and to form a unitary product therefrom with increased processing efficiency. One implementation includes an apparatus that can decrease processing time by directly heating and cooling platens that press the laminate assembly. Additionally, the lamination press can allow the platens to flex about the laminate assembly, thereby applying substantially uniform pressure to the laminate assembly.

Abstract: Link mechanisms provided corresponding to press bonding heads each include a first link member having one end pivotably connected to an upper end of the press bonding head, a second link member having one end pivotably connected to the other end of the first link member and having the other end pivotably connected to a link bracket above the press bonding head, and a connection slide part connected to a connection part between the first and second link members, collectively drive the connection slide parts of the link mechanisms by a press bonding head driving unit in horizontal directions (Y axis directions) orthogonal to a direction (X axis direction) of side-by-side arrangement of the plurality of press bonding heads, open and close the first and second link members of the link mechanisms in the vertical directions thereby collectively moving the plurality of press bonding heads downward and upward.

Abstract: An adhesive chuck, and an apparatus and method for assembling substrates using the same are disclosed. The apparatus comprises a chamber, a first adhesive chuck inside the chamber and having a plurality of adhesive protrusions to adhere to a first substrate conveyed from an outside into the chamber via an intermolecular attractive force, and a driving unit to move the first substrate adhered to the first adhesive chuck and a second substrate toward each other to be compressed and assembled to each other. The apparatus can achieve adhesion and separation of a substrate with minimal power consumption, enhancing an to operating efficiency. Additionally, the adhesive chuck can overcome a problem of spot generation on a display panel caused by remaining static electricity. Furthermore, since the adhesive chuck is almost free from a problem of electric instability, it can exhibit high stability and efficiency and can be fabricated at lower costs.

Abstract: An object of the present invention is to provide a method for producing a transfer body, which method neither causes adhesion failure at the interface between a transferring film and a substrate, nor causes interlayer peeling in the transferring film. Another object of the present invention is to provide a method for producing a transfer body with high productivity, which method neither causes breakage of a functional pattern forming a transferring layer during peeling of a release film from the transferring film, nor causes any damage to the substrate during separation of an attaching roller and a peeling roller from the substrate.

Abstract: A method of applying graphics to a set of articles with a graphic transfer assembly is disclosed. The method includes a step of selecting an article from a set of articles comprising different types of articles. After selecting a last that may be associated with the article, the last may be attached to a last assembly of the graphic transfer assembly. With the article attached to the graphic transfer assembly, a deformable membrane may apply graphics to curved portions of the article.

Abstract: A substrate holder pair comprising a first substrate holder and a second substrate holder that holds a first substrate and a second substrate bonded to each other, between itself and the first substrate holder. The first substrate holder includes a pressure receiving portion that, when the first substrate holder is separated from the second substrate holder, is pressed by a pressing member, and the second substrate holder includes a passing portion through which passes the pressing member, to enable pressing of the pressure receiving portion by the pressing member.

Abstract: An attaching device and a method of fabricating an organic light emitting device using the same are disclosed. The attaching device includes a process chamber, first and second substrate supporters, a substrate detachable part, and an open-close valve. The first and second substrate supporters are positioned inside the process chamber, load and fix substrates. The substrate detachable part is positioned inside the second substrate supporter, and moves up and down to allow the second substrate supporter to instantaneously receive a physical pressure. The open-close valve is positioned on a portion of the process chamber, and opens and closes the process chamber to control a pressure inside the process chamber.

Abstract: In one embodiment, a decal applicator machine includes a main frame, a decal frame supported by the main frame, the decal frame being adapted to securely hold a decal during application of the decal to a substrate, a deformable element adapted to support the decal during its application to the substrate, a substrate support element to which the substrate mounts, and drive means for driving the substrate into the decal and into the deformable member to firmly apply the decal to the substrate.

Abstract: The invention relates to a production method for incorporating an object into a multi-part, transparent casing. According to the method, an object is aligned on a first joint surface of a first casing part and is pressed into said part using a second casing part with a second joint surface. The first joint surface of the first casing part and the second joint surface of the second casing part are then fused by pressure and temperature, forming a region between the casing parts that is devoid of a visible seam.

Abstract: A bond substrate is attached with an incline toward the setting surface of a base substrate. Accordingly, an attachment starting portion can be limited. Further, the bond substrate is provided so that part of the bond substrate extends beyond a support base and the part is closest to the base substrate. Because of this, part of the bond substrate is separated from the support base with the use of an end portion of the support base as a fulcrum point because the support base is not provided below the contact portion, and attachment sequentially proceeds from a portion which gets close to the base substrate; thus, stable attachment can be performed without an air layer remaining at the interface between the bond substrate and the base substrate.

Abstract: Methods and other embodiments associated with a fabric welding machine are presented. The fabric welding machine includes a base, a welding machine body, and a support beam with a first end and a second end. A first roller is positioned adjacent to the first end of the support beam opposite the welding machine body. A swing arm with a body end and a roller end is attached to the welding machine body. The roller end is opposite the welding machine body and is configured to move to a first position and a second position. A heat element attached to the first end of the support beam.

Abstract: A system for forming a composite structure comprises an electromagnetic press including an upper die, a lower die and an electromagnet. The lower die may be mounted in spaced relation to the upper die for receiving a composite layup therebetween. The electromagnet is energizable such that the upper and lower dies apply a compressive force to the composite layup.

Abstract: While bumps formed on pads of a semiconductor chip and a board having a sheet-like seal-bonding resin stuck on its surface are set face to face, the bumps and the board are pressed to each other with a tool, thereby forming a semiconductor chip mounted structure in which the seal-bonding resin is filled between the semiconductor chip and the board and in which the pads of the semiconductor chip and the electrodes of the board are connected to each other via the bumps, respectively. Entire side faces at corner portions of the semiconductor chip are covered with the seal-bonding resin. Therefore, loads generated at the corner portions due to board flexures for thermal expansion and contraction differences among the individual members caused by heating and cooling during mounting as well as for mechanical loads after mounting so that internal breakdown of the semiconductor chip can be avoided.

Abstract: A method and a device are provided for laminating a component, in particular an interior lining component for a motor vehicle, which is arranged on a lower die of a press tool and which is overlaid with a pre-fixed laminating material. The laminating material is fixed on the surface of the component by means of a seam fixing stay which is formed as an integral constituent part of the upper die of the press tool.

Abstract: A method and a device are provided for pre-fixing a laminating material to at least one surface portion of a component, in particular an interior lining component for a motor vehicle, which is arranged on a component receptacle 5. Here, a seam blade which can be acted on with different contact pressures is, by means of a pivoting movement from a position arranged offset from the component receptacle, applied with a pivoting movement to the laminating material placed onto and aligned on the component.

Abstract: Methods and apparatus for fabricating adhesive bonded joints while minimizing the voids and/or porosity found in the cured bondline. In accordance with various embodiments, the apparatus comprises an evacuation chamber combined with a pressure inducing device to produce bonded joints that are both void free and thoroughly compacted. The surfaces to be bonded are continuously evacuated throughout the bonding process (pre-mating, mating, debulking and cure). Continuous evacuation is provided via standard vacuum, while the induced pressure can be pneumatically or mechanically provided.

Abstract: An isostatic press is disclosed in which tunnel-like passages are formed between the envelope surface of a force absorbing body and a prestressing device. A method and a press are further disclosed, wherein a cylindrical element is prestressed simultaneously with obtaining a tunnel-like passage on the cylindrical element.

Abstract: Provided is a position controller for a flexible substrate (100) provided in a processing apparatus conveying a band-shaped flexible substrate (1) in a longitudinal position, in the lateral direction and processing the substrate in a processing unit (20) installed on a conveying path of the substrate.

Abstract: A fiber bundle arranging device is provided that laminates fiber bundle layers formed of a fiber bundle. The fiber bundle is engaged with arranged pins to have straight parts. The device includes a press roller and a first moving device. The press roller includes a peripheral portion. The peripheral portion of the press roller depresses the straight parts of the fiber bundle engaged with the pins toward the roots of the pins in the vicinity of the pin. The first moving device moves the press roller in the arrangement direction of the pins such that the peripheral portion sequentially intersects the straight parts of the fiber bundle.

Abstract: A double facer that fabricates a corrugated fiberboard and that includes heat plate units having thin walls aims at improving the heat conductive efficiency to fiberboard sheets in order to enhance responsibility to the setting temperature and concurrently avoiding thermal deformation of the heat plates due to a difference in temperature between the top surface and the bottom surface.

Abstract: It is an object of the invention to provide a method for producing a combined optical film that includes opposing the end faces of a plurality of optical films to one another and can narrow the gap between the opposed end faces.

Abstract: The invention relates to a method of bonding two members together utilizing a stack of solid film adhesive and a layer of solid film adhesive, both disposed between the members. A pressure-applying device may be utilized to apply low pressure to force the members together. The pressure may force the stack to compress and expand in varying directions in order to substantially remove air-bubbles between the layer and one of the members. A heating device may be utilized to change the layer and the stack into liquid states in order to bond the members together with a void-free bond-line.

Abstract: An apparatus for welding a covering film superimposed on a sheet of thermoformable plastic material provided with a plurality of containers thermoformed thereupon, includes a first plate arrangement provided with an operating wall for supporting the sheet and a second plate arrangement provided with a welding arrangement for pressing the film and the sheet against the operating wall such as to weld the film and the sheet. The sheet includes a plurality of through holes interposed between the containers, and the first plate arrangement includes a conduit arrangement leading onto the operating wall at the through holes for extracting air from the containers, and/or for directing a gas to the containers.

Abstract: A bonding apparatus for bonding a first substrate and a second substrate includes a base body, a first stripping device, a second stripping device, at least two vacuum bonding devices, and a loading mechanism. The first stripping device removes a film from the first substrate, and the second stripping device removes a film from the second substrate. The at least two vacuum bonding devices are arranged on the base body and aligned with each other. The loading mechanism includes a slide-rail on the base body and an adjustment assembly slidably connected to the slide-rail. The loading mechanism transfers a first substrate and a second substrate into one vacuum bonding device, and then, sliding on the slider, transfers another first substrate and another second substrate to another vacuum bonding device.

Abstract: A preforming device and method of use thereof, the device including a rack, a pinion, belt, belt tensioning feature, and mechanism for supporting a variably appliable enhanced pressure, such as may be applied using a bladder or bladders having one or more valves, the device capable of engaging a mandrel to form at least one ply and a binder against the exterior of the mandrel.

Abstract: The invention relates to a portable strapping device to strap packaged goods using a strapping band, the device comprising a tightening mechanism for applying tension to a loop of a strapping band, a frictional welding element (5) to generate a friction weld connection of two overlapping strapping-loop segments, and a rechargeable energy-storing device (10) for storing energy, in particular mechanical, elastic or potential energy that may be released as drive energy applied to a frictional welding system (5) to produce a frictional weld connection. One objective of the invention is to attain applicability, in the absence of an electric storage battery, at the highest possible efficiency, to such an above described portable strapping device. This objective is attained in that the energy storage (10) may be loaded using a manually triggered drive component and in that, when energy stored in the storage is released, the energy storage carries out a displacement devoid of any reversal of motion.

Abstract: The invention relates to a tightening strap device for a heat-weldable plastic strip that is used to strap a packaged item and that is joined at a welding point to form a loop. Whereas in prior art the plastic strip is held during welding by several clamping elements, in the present invention the welding plate functions simultaneously as a clamping element.

Abstract: A laminated assembly (10) is mountable on a wall and comprises a back support (20) and opposed side supports (40,50) for holding the laminating roller (60) and nip roller (70). The assembly includes hanging supports (120) for hanging the assembly (10) on a wall oriented so that the nip is substantially parallel to the wall and items to be laminated can be fed from above, passed through the machine and released below the machine.

Abstract: A film loading arrangement simplifies the film loading process for a user and prevents the improper loading of a laminate film roll into a laminator. The components allow the laminate roll of film to be loaded in the correct orientation by providing differing connection structures on each end of the laminate film roll. The differing connection structures are received by respective receiving structures on the laminator. Each connection structure is compatible with only one of the receiving structures such that when the connection structures are attached to the roll, the film can be loaded in only one direction, i.e., correctly. Therefore, the user can properly load a laminate film roll and avoid damaging the laminator as a result of improper film loading. A tensioning mechanism can be provided for adjusting the force required to unroll laminating film from the supported roll.

Abstract: Various modifications to a printer to allow the printer to print on linerless adhesive media are described. In one embodiment, a release block is attached to the printer superior to a rubber drive roller. The release block limits the linerless adhesive media from contacting and/or remaining on the rubber drive roller when the linerless adhesive media is fed past print head. The release block may be a guide label, a piece of tape, or fixture. A guide label is adhesively attached and comprises a substrate, an adhesive layer, and release layers so that the linerless adhesive media does not stick to the guide label. Tape may be adhesively attached with a release layer attached to the tape. The fixture may be mechanically attached, magnetically attached, or adhesively attached to the printer. The release block may be removed at any time to allow for standard operation of the printer.

Abstract: While bumps formed on pads of a semiconductor chip and a board having a sheet-like seal-bonding resin stuck on its surface are set face to face, the bumps and the board are pressed to each other with a tool, thereby forming a semiconductor chip mounted structure in which the seal-bonding resin is filled between the semiconductor chip and the board and in which the pads of the semiconductor chip and the electrodes of the board are connected to each other via the bumps, respectively. Entire side faces at corner portions of the semiconductor chip are covered with the seal-bonding resin. Therefore, loads generated at the corner portions due to board flexures for thermal expansion and contraction differences among the individual members caused by heating and cooling during mounting as well as for mechanical loads after mounting so that internal breakdown of the semiconductor chip can be avoided.

Abstract: This invention relates to a heat sealing element for use in a heat sealing jaw in cooperation with an opposing backing jaw for sealing layers of film together to form a sealed portion and a notch within the sealed portion, the heat sealing element comprising: a sealing face for pressing the layers of film together against the opposing backing jaw and forming the sealed portion, the sealing face having a protrusion for forming the notch within the sealed portion; and a clamping portion adjacent to the sealing face, the clamping portion being disposed at an orientation diverging from a plane along which the layers of film are sealed together.

Abstract: A substrate bonding apparatus and method are provided. The substrate bonding apparatus may include a board having a receiving surface opposite to a substrate fixed at one side thereof, a plurality of chucking members located between the receiving surface of the board and the substrate, and a substrate separation device to separate the substrate from the chucking members. The substrate separation device includes a pusher for pushing the substrate to separate the substrate from the chucking members, and a base plate installed at the receiving surface of the board, the base plate having an installation space to install the pusher formed therein. The pusher protrudes out of the base plate through an inlet and outlet port located at one end of the installation space to pressurize the substrate.

Abstract: An enclosure is filled with a filling gas according to the disclosed method. An enclosure is provided having an interior, a width, a height, a thickness, and fluid filling and exit holes fluidly communicating with the interior. Filling of the enclosure is commenced by directing a flow of the filling gas at a filling flow rate into the fluid filling hole. An oxygen concentration of gas exiting the fluid exit hole is sensed. The filling of the enclosure is stopped when the sensed oxygen concentration reaches a threshold concentration, wherein the threshold oxygen concentration and/or the filling flow rate are selected by a Decision Support Tool based upon the width, height, and/or the thickness.

Abstract: Method for welding a tubular plastic container, comprising at least the following operations: a. a winding operation in which a laminate (11) is wound, b. a positioning operation in which the ends (8, 9) of the laminate (11) are positioned next to one another, c. an extrusion operation in which a softened resin string (12) is extruded and deposited on the said ends (8, 9), d. a fusion operation in which the said ends (8, 9) are fused by means of the said string (12), e. a compression operation in which the weld zone (10) is compressed, f. a cooling operation in which the weld is cooled.

Abstract: Wind turbine systems and methods are disclosed herein. A representative system includes a wind turbine blade having an inner region that has an internal load-bearing truss structure, and an outer region that has an internal, non-truss, load-bearing structure. In particular embodiments, the truss structure can include a triangular arrangement of spars, and/or can include truss attachment members that connect components of the truss without the use of holes in the spars. Spars can be produced from a plurality of pultruded composite members laminated together in longitudinally extending portions. The longitudinally extending portions can be connected at joints that interleave projections and recesses of each of the spar portions. The blades can include fan-shaped transitions at a hub attachment portion, formed by laminated layers and/or a combination of laminated layers and transition plates.

Abstract: A substrate bonding method includes: applying a predetermined load to a first substrate by causing a pressing member to come into surface contact with a predetermined region of the first substrate; and simultaneously with the applying of the predetermined load or after applying the predetermined load to the first substrate, in the state where the pressing member comes into surface contact with the first substrate, causing the first substrate to come into contact with a second substrate.

Abstract: An apparatus for bonding semiconductor wafers together including a moveable upper bond head and a resilient member positioned on a surface of the bond head for contacting a first wafer that is positioned at an elevation below the upper bond head. The resilient member is configured to apply a force onto a top side surface of the first wafer thereby compressing the first wafer against a second wafer that is positioned at an elevation below the first wafer. A method of wafer to wafer bonding includes the steps of positioning at least two wafers beneath the moveable upper bond head, positioning the resilient member in physical contact with one of the at least two wafers, and resiliently deforming the resilient member as it is moved into contact with the wafer to facilitate bonding of the wafers.

Abstract: Appliance for applying labels to receptacles, which comprises a transport device that transport the receptacles to be labeled along a predefined transport path, and comprises a first pressing-on unit that presses the labels onto an outer wall of the receptacles, the first pressing-on unit having a brush device having a multiplicity of bristles that extend in the direction of the receptacles. According to the invention, the first pressing-on unit, at least in a partial region of the first pressing-on unit, is shorter, in the longitudinal direction of the receptacles, than the label to be applied.

Abstract: A substrate bonding apparatus and method are provided. The substrate bonding apparatus may include a first support member that receives a first substrate, a second support member that receives a second substrate opposite the first support member, and a support pin located at the outside of the first substrate fixed to the first support member. The support pin may be connected to the first support member, and a distance adjustment device may move the support pin upward or downward to adjust the distance between the first support member and the second support member.

Abstract: A vibration welding apparatus vibrates a vibration-side processing member when the vibration-side processing member comes into pressure-contact with a fixing-side processing member, and the vibration-side processing member and the fixing-side processing member are welded. The vibration welding apparatus includes a first clamp unit for clamping the processing member on the vibration side, a second clamp unit for clamping the processing member on the fixing side, a vibration unit for vibrating the first clamp unit, and a release unit for releasing a state in which the first clamp unit clamps the vibration-side processing member. The first clamp unit moves a pressing member with elastic force of an elastic member, and presses the vibration-side processing member to clamp the vibration side processing member, and the release unit is disposed independently of the first clamp unit, and separates the vibration-side processing member pressed under the elastic force of the elastic member.

Abstract: An application device which ensures a predetermined angular surface when applied over imperfections encountered within the substrate.

Abstract: The present invention provides a device for transferring image-forming layers from a transfer foil to printing sheets. The device includes a coating device for applying the image-forming layer of the transfer foil to an image area on the printing sheet that has been provided with an adhesive patter such that the image-forming layer is separated from a carrier layer of the transfer foil.

Abstract: There is described a joining device (1) comprising a stamp which can be moved up and down between a lower working position and an upper loading position. For example a hot embossing film (14) and a substrate (13) arranged under the hot embossing film (14) can be arranged between the stamp and the support table (12). The support table (12) is mounted pivotably about two pivot axes which are perpendicular to each other and which are perpendicular to the axis of movement of the stamp (11) and is pivotable by means of adjusting devices (18) about the two pivot axes, wherein the stamp (11) forms a rigid support in the working position. Alternatively the stamp (11) is mounted pivotably about two pivot axes which are perpendicular to each other and which are perpendicular to the axis of movement of the stamp (11) and is pivotable by means of adjusting devices (18) about the two pivot axes, wherein the support table (12) forms a rigid support in the working position.

Abstract: An apparatus for use with multiple chips having multiple posts as to engage at least a portion of a surface of one of the multiple chips, a frame configured to releasably constrain each of the posts so that, when unconstrained, each individual post can contact an individual chip and, when constrained, will allow a uniform vertical force to be applied to the chips.

Abstract: An apparatus for use with multiple individual chips having a rigid plate, and a deformable membrane located on the plate, the deformable membrane having a thickness sufficient to allow the deformable membrane to peripherally conform to each of the individual multiple chips irrespective of any difference in height among the multiple individual chips and to prevent each of the multiple individual chips from moving in a lateral direction, the deformable membrane being configured to uniformly transfer a vertical force, applied to the rigid plate, to the chips so as to bring, under pressure, a bonding surface of each individual chip into contact with a bonding surface of an element to which the individual chips will be bonded during a connect and release cycle without causing damage to the individual chips or bonding surface.

Abstract: The sealing element for integration into a sealing tool for producing smooth stamping fields during the sealing of two plastic sheets has a base body. A first slot extends into the base body from a first narrow lateral surface, and a second slot, which is offset vertically from the first slot, extends into the base body from a second narrow lateral surface, in such a way that the two slots define a section of the base body which has substantially the shape of an S or reversed S. The first slot has a U-shape with a first leg of the first slot being longer than a second leg of the first slot, and the second slot has a U-shape with a first leg of the second slot being longer than a second leg of the second slot. Each of the two slots expands at its inner end to form a bore.