Presses Or Press Platen Structures, Per Se Patents (Class 156/580)
  • Publication number: 20120132372
    Abstract: The invention relates to a positioning device (203) for a manual welding machine (300), particularly for a plastic welding machine, comprising at least one contact shield (16) associated with the manual welding machine (300) and a positioning ring (3) associated with the material to be welded. In order to perform precise welding and to prevent the subsequent slipping of the manual welding machine (300), according to the invention, the positioning ring (3) can be fixed to the material to be welded and a contact shield (16) that can be inserted in the positioning ring (3) transfers a pressure distributed evenly over the circumference to the materials to be welded, in order to allow secure welding over a large area.
    Type: Application
    Filed: May 31, 2010
    Publication date: May 31, 2012
    Applicant: PLASTICON GERMANY GMBH
    Inventor: Hermann Van Laak
  • Publication number: 20120125534
    Abstract: Methods and apparatus for fabricating adhesive bonded joints while minimizing the voids and/or porosity found in the cured bondline. In accordance with various embodiments, the apparatus comprises an evacuation chamber combined with a pressure inducing device to produce bonded joints that are both void free and thoroughly compacted. The surfaces to be bonded are continuously evacuated throughout the bonding process (pre-mating, mating, debulking and cure). Continuous evacuation is provided via standard vacuum, while the induced pressure can be pneumatically or mechanically provided.
    Type: Application
    Filed: November 24, 2010
    Publication date: May 24, 2012
    Applicant: THE BOEING COMPANY
    Inventors: Megan Nicole Watson, Joseph L. Hafenrichter, Mary H. Vargas, Michael W. Evens
  • Publication number: 20120125536
    Abstract: Link mechanisms provided corresponding to press bonding heads each include a first link member having one end pivotably connected to an upper end of the press bonding head, a second link member having one end pivotably connected to the other end of the first link member and having the other end pivotably connected to a link bracket above the press bonding head, and a connection slide part connected to a connection part between the first and second link members, collectively drive the connection slide parts of the link mechanisms by a press bonding head driving unit in horizontal directions (Y axis directions) orthogonal to a direction (X axis direction) of side-by-side arrangement of the plurality of press bonding heads, open and close the first and second link members of the link mechanisms in the vertical directions thereby collectively moving the plurality of press bonding heads downward and upward.
    Type: Application
    Filed: August 5, 2010
    Publication date: May 24, 2012
    Inventors: Masahiro Morimoto, Nobuyuki Kakita, Akira Kabeshita
  • Publication number: 20120129082
    Abstract: A method of adhering a lithographic pellicle includes steps of pressing the pellicle frame 6 toward the exposure stencil 5 by a pressure plate 2 via a bag 3 containing a low viscosity liquid being mounted on the surface of the pressure plate 2 facing the pellicle frame 6 so as to be along sides of the pellicle frame 6 and face the pellicle frame 6, the compressively deformable member being easily deformable when a pressure is applied thereonto. According to the thus constituted method of adhering a pellicle, it is possible to uniformize a pressure applied onto an exposure stencil 5 such as a photomask, a reticle or the like via a pellicle frame 6 when a pellicle is adhered onto the exposure stencil 5.
    Type: Application
    Filed: November 16, 2011
    Publication date: May 24, 2012
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventor: Yuichi Hamada
  • Publication number: 20120126281
    Abstract: System for flash-free overmolding of LED array substrates. In an aspect, a method is provided for molding encapsulations onto an LED array substrate. The method includes attaching a protective tape onto a substrate surface of the substrate so that openings in the protective tape align with LED devices of the substrate and applying molding material onto a molding surface of a molding tool and to portions of the substrate exposed through the openings in the protective tape. The method also includes pressing the molding surface and the substrate surface together at a selected pressure and a selected temperature so that encapsulations are formed on the portions of the substrate exposed through the openings in the protective tape, separating the molding surface from the substrate surface, and removing the protective tape so that molding material flash is removed from the substrate leaving a clean molded substrate.
    Type: Application
    Filed: December 23, 2010
    Publication date: May 24, 2012
    Applicant: Bridgelux, Inc.
    Inventors: Alexander Shaikevitch, Vahid Moshtagh
  • Publication number: 20120118503
    Abstract: A deformable label processor and related methods are described. The processor is heated and urged against a label, such as a pressure sensitive heat shrink label, to apply the label onto a container or other surface. The processor and methods are well suited for application of labels onto compound curved surfaces. Also described are high volume label application processes using assemblies of multiple label processors. Additional assemblies and methods are described for selectively contacting and adhering regions of a label onto a moving container during labeling operations. Select regions of a label can be wiped to modify or alter label portions that are in contact and not in contact with the container. A label treatment process performed after label application is also disclosed. The treatment process reduces the occurrence of label defects and improves label retention, adherence and aesthetics. The treatment process includes heating an applied label and adhesive to a particular temperature.
    Type: Application
    Filed: July 27, 2010
    Publication date: May 17, 2012
    Applicant: Avery Dennison Corporation
    Inventors: James P. Lorence, Jeremy Bockmuller, Richard L. Cevera, John A. Charny, Nick McClellen, Craig W. Potter, Richard A. Previty, Shawn Ross, Richard W. Sheldon
  • Patent number: 8177935
    Abstract: A manufacturing method of a laminated plate (19) includes: a first step of supporting, by a support member (9), a thermoplastic resin-made laminated material (1) in which a pair of plate-like members (3, 4) are laminated to each other while interposing a longitudinal wall portion (2b) so that a peripheral edge portion (1a) of the laminated material (1) can be exposed, and heating and softening the peripheral edge portion (1a) by blowing a hot air to the peripheral edge portion (1a); and a second step of pressing the plate-like member (4) as one of the pair of plate-like members (3, 4) against other plate-like member (3) by thrusting a cutting blade (17a) of a cutting die (17) against the heated and softened peripheral edge portion (1a), thereby bringing the pair of plate-like members (3, 4) into contact with each other and welding the plate-like members (3, 4) to each other, and then cutting the laminated plate (19) out of the laminated material (1).
    Type: Grant
    Filed: December 7, 2007
    Date of Patent: May 15, 2012
    Assignee: Meiwa Industry Co., Ltd.
    Inventors: Takahiro Hasegawa, Sinya Noto
  • Patent number: 8171975
    Abstract: An apparatus for mounting planar components onto a pad for a seat is disclosed.
    Type: Grant
    Filed: August 29, 2008
    Date of Patent: May 8, 2012
    Assignee: TS TECH Co., Ltd.
    Inventor: Yoshinobu Suzuki
  • Patent number: 8163126
    Abstract: Disclosed is a film sticking device that sticks a first film substrate and a second film substrate together on a curved-surface shape. The film sticking device includes a mold having a curved attachment surface formed into a desired curved-surface shape; an attracting and holding unit capable of relatively moving on the curved attachment surface and having plural vacuum chambers on which an attracting surface for attracting and holding the second film substrate is provided; and a suctioning unit capable of separately applying suction processing to the plural vacuum chambers. The suctioning unit starts, as the attracting and holding unit moves, the suction processing of the vacuum chamber corresponding to a position opposing the second film substrate and sequentially stops, as the second film substrate is stuck to the first film substrate, the suction processing of the vacuum chamber corresponding to the stuck second film substrate.
    Type: Grant
    Filed: February 3, 2011
    Date of Patent: April 24, 2012
    Assignee: Fujitsu Limited
    Inventors: Tohru Harada, Kazuhisa Mishima, Hirokazu Yamanishi, Yoshiaki Yanagida
  • Patent number: 8156990
    Abstract: An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers includes a base plate configured to support a plurality of green sheet layers thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.
    Type: Grant
    Filed: April 18, 2008
    Date of Patent: April 17, 2012
    Assignee: International Business Machines Corporation
    Inventors: Jay A. Bunt, Donald W. Diangelo, Cristian Docu, Thomas Foley, Melvin R. Gottschalk, Jr., Lisa A. Hamilton, Thomas A. Kline, Mark J. LaPlante, Hsichang Liu, Sebastian Loscerbo, Govindarajan Natarajan, Olga A. Otieno, Renee L. Weisman
  • Publication number: 20120088075
    Abstract: A functional element of metal having a flange of larger diameter forming an attachment surface and having a centering section arranged inside the attachment surface and extending away from the flange, is characterized in that an adhesive which hardens under pressure is arranged around the centering section and adjacent to the attachment surface.
    Type: Application
    Filed: October 6, 2011
    Publication date: April 12, 2012
    Inventors: Oliver Diehl, Richard Humpert
  • Publication number: 20120080132
    Abstract: Disclosed are various features associated with a securing mechanism for a wafer bonder. In certain situations, operation of securing mechanisms can generate undesirable particles and debris, and some them can be introduced to a wafer being bonded. In certain implementations, a securing mechanism can be configured to reduce the likelihood of such particles and debris being introduced to the wafer.
    Type: Application
    Filed: October 5, 2010
    Publication date: April 5, 2012
    Applicant: SKYWORKS SOLUTIONS, INC.
    Inventors: Steve Canale, David J. Zapp
  • Publication number: 20120076989
    Abstract: A mandrel having an out-of-plane curvature and a corresponding in-plane change in mandrel geometry is used to fabricate substantially wrinkle-free, fiber reinforced stiffeners having an out-of-plane curvature.
    Type: Application
    Filed: September 23, 2010
    Publication date: March 29, 2012
    Inventor: JAMEL R. BLAND
  • Patent number: 8142603
    Abstract: The present invention relates to a method of attaching an active film (5) onto a flexible package comprising the steps of heating a foil (2); applying an active film (5) to the foil (2); and applying sufficient pressure to the active film (5) and foil (2) combination and sufficient heat to the foil (2) so that active film (5) adheres to the foil (2). In one example, the active film (5) comprises two components and wherein the two components are an active agent and a polymer. In another example, the active agent is an absorbing material.
    Type: Grant
    Filed: March 28, 2005
    Date of Patent: March 27, 2012
    Assignee: CSP Technologies, Inc.
    Inventors: Peter J. Sagona, Jonathan R. Freedman, Jean Pierre Giraud
  • Patent number: 8136566
    Abstract: A laminating apparatus for laminating a separator, a membrane electrode structure member and another separator on top of each other includes a placement base which places the separator on the placement base, a first clamp which holds a portion of the upper surface of the separator placed on the placement base, first moving means which superimpose the membrane electrode structure member on the upper surface of the separator placed on the placement base, a second clamp which holds a portion of the upper surface of the thus superimposed membrane electrode structure member, second moving means which superimpose the separator on the upper surfaces of the membrane electrode structure member and second clamp, a pressing member which presses the separator in the central portion thereof to deform the separator elastically to thereby bring the separator into contact with the membrane electrode structure member, and pull-out means which pull out the second clamp from between the membrane electrode structure member and s
    Type: Grant
    Filed: April 17, 2008
    Date of Patent: March 20, 2012
    Assignee: Honda Motor Co., Ltd.
    Inventor: Hiroki Tahira
  • Publication number: 20120048449
    Abstract: A welding tool, such as a vibration welding tool, includes one or more relief areas for material to flow into during a welding process to help prevent deformation of a substrate that a component is being attached to.
    Type: Application
    Filed: August 25, 2010
    Publication date: March 1, 2012
    Applicant: FAURECIA INTERIOR SYSTEMS, INC.
    Inventors: Friedhelm Manzke, Douglas E. Redmond
  • Publication number: 20120048477
    Abstract: A linear friction welding system in one embodiment includes a ram configured to vibrate along a welding axis, at least one rocker arm with a first end portion spaced apart from the welding axis and constrained against movement along the welding axis, and a second end portion which is movable along the welding axis, and a first welding component support member configured to hold a first welding component, the first welding component support member operably connected to the ram and supported by the second end portion of the at least one rocker arm, such that vibration of the ram along the welding axis causes the location of the first welding component support member along an axis orthogonal to the welding axis to vary.
    Type: Application
    Filed: October 28, 2011
    Publication date: March 1, 2012
    Applicant: APCI, INC.
    Inventors: Stephen A. Johnson, Thaddeus W. Gorski
  • Patent number: 8118074
    Abstract: An apparatus and method of material bonding using captive plungers is disclosed. In one embodiment, an apparatus includes a base plate to have multiple holes in an array, multiple captive plungers each surrounded by a compressible spring to couple to the multiple holes in such a way which allows each of the multiple captive plungers to vertically move in a confine of each of the multiple holes corresponding to the each of the multiple captive plungers, and a fastening device to apply a force to bond two or more parts placed on top of each other with a bonding material in between the two or more parts through pressing the base plate to the two or more parts such that the force delivered through the multiple captive plungers to the two or more parts is concentrated to the array.
    Type: Grant
    Filed: April 10, 2007
    Date of Patent: February 21, 2012
    Assignee: Altair Technologies, Inc
    Inventors: Christopher Paul Ferrari, Curtis Gary Allen, Andrew Dean White
  • Patent number: 8118957
    Abstract: In a vibration welding method and a vibration welding apparatus, a base plate and a vibrating plate which can be vibrated relatively to each other clamp an instrument panel, a storage box, and a duct as layers therebetween, which are joined to each other under pressure with vibration. A protective member of urethane is disposed on a workpiece rest for placing the base plate thereon. The storage box is made of a material having a relatively low melting point, and the duct is made of a material having a relatively high melting point. The thickness of the protective member is different depending on the location where the protective member supports the resin base, and the storage box or the duct.
    Type: Grant
    Filed: February 6, 2009
    Date of Patent: February 21, 2012
    Assignee: Honda Motor Co., Ltd.
    Inventors: Kenji Hisai, Shuji Kanamoto
  • Patent number: 8109314
    Abstract: A portable air clamp for use during lamination of substrates is provided. The clamp includes a top clamp plate, a bottom clamp plate and at least one flexible, expandable tube within a housing of the clamp. The top clamp plate is adjacent to a top housing and the bottom clamp plate is adjacent to a bottom housing. An expandable tube or bladder may be disposed in the top housing or the bottom housing. The clamp may also include alignment devices and mechanisms for ensuring proper alignment of the substrates during the laminating procedure. The clamp is adapted to provide uniform pressure along the surfaces of the substrates to be laminated.
    Type: Grant
    Filed: June 9, 2008
    Date of Patent: February 7, 2012
    Inventors: Santiago Rodriguez, Errol Gendreau
  • Publication number: 20120024475
    Abstract: A display bonding device includes a stage configured to place an adhesive tape and an adherend thereon, a pressure head configured to press the adhesive tape onto the adherend with a pressure surface having a tapered shape or a curved shape which is tilted with respect to the stage, and a movement mechanism configured to move the pressure head toward the adhesive tape through a pressure rod which is coupled to the pressure head. The pressure head is configured to rotate around the pressure rod.
    Type: Application
    Filed: July 20, 2011
    Publication date: February 2, 2012
    Applicant: FUJITSU LIMITED
    Inventors: Masayuki KITAJIMA, Hidehiko KOBAYASHI
  • Publication number: 20120013228
    Abstract: In a method for manufacturing a dishwasher having at least one component and at least one bitumen mat provided on the component for noise deadening and/or sound insulation of the component, a usable, flowable and reactively-hardenable bituminous mixture is applied upon the bitumen mat and/or component such as to form at least one adhesive bead. The adhesive bead is partly surrounded by at least one area which is free of the reactively-hardenable bituminous mixture. Before the hardening of the bituminous mixture, the component and the bitumen mat are pressed together and thereby glued to one another.
    Type: Application
    Filed: July 7, 2011
    Publication date: January 19, 2012
    Applicant: BSH Bosch und Siemens Hausgeräte GmbH
    Inventors: Heiko Fritz, Bernd Schwenk
  • Publication number: 20120006472
    Abstract: A forming tool and method for its use with flat pre-preg composite laminate assemblies which incorporates a mandrel segmented into multiple forming blocks, the forming blocks sized to receive a draped composite laminate assembly with all portions of the composite laminate assembly spaced from a shaping surface on each block. A spline plate engages the shaping surface of the forming blocks to provide a neutral axis for maintaining the entire composite laminate assembly in tension during forming. In the exemplary embodiments, the draped composite laminate assembly is formed to the forming blocks from the flat composite laminate assembly and maintained in contact with the forming blocks using a vacuum bag. The mandrel forming blocks are then displaced to a desired curvature on the spline plate.
    Type: Application
    Filed: August 31, 2011
    Publication date: January 12, 2012
    Applicant: THE BOEING COMPANY
    Inventors: Paul E. Nelson, Peter D. McCowin, Worm Lund
  • Patent number: 8092631
    Abstract: An apparatus for welding a first plastic sheet to a second plastic sheet is provided. The apparatus includes an elongate die including a channel extending longitudinally along the die's welding face. In combination with a plate and a high frequency alternating current generator, the die and the plate are operable to compress the first and second plastic sheets in an overlapping arrangement and generate a high frequency alternating electromagnetic field between the die and the plate and weld the first and second plastic sheets to one another. The depth of the die channel prevents the formation of an electromagnetic field that is strong enough to weld the first and second plastic sheets in an area between the die channel and the plate. A die for use in such an apparatus and a method of use thereof are further provided.
    Type: Grant
    Filed: March 2, 2009
    Date of Patent: January 10, 2012
    Assignee: Solmax International Inc.
    Inventors: Jean-Paul Germain, Steve Shannon
  • Patent number: 8079396
    Abstract: A micro device feeder is provided which is adjustable to accommodate micro devices supplied on tapes with different widths. A mounting plate has a movable drive plate slidably mounted thereto. An input mechanism on the movable drive plate receives micro devices contained in a tape and advances the tape under motor drive. A feeder width adjustment mechanism is interposed between the mounting plate and the movable drive plate for positioning of the movable drive plate relative to the mounting plate for accommodating tapes with different widths.
    Type: Grant
    Filed: January 5, 2009
    Date of Patent: December 20, 2011
    Assignee: Leannoux Properties AG L.L.C.
    Inventor: Rossen Atanassov Rachkov
  • Publication number: 20110300336
    Abstract: A method of applying a strip to a surface is disclosed. The strip is laid out spaced apart from a path guide. The path guide is referenced with least two longitudinally spaced apart reference guides to guide an applicator transversely spaced from the reference guides over the strip. The strip is lifted upstream of the applicator with a strip guide longitudinally spaced from the applicator to space the strip from the surface. Heat is applied to at least one of the strip or the surface in a location longitudinally between the applicator and the strip guide. The applicator is moved along the strip to apply pressure to the strip against the surface to bond the strip to the surface. A related apparatus for applying a strip to a surface is also disclosed.
    Type: Application
    Filed: June 7, 2011
    Publication date: December 8, 2011
    Applicant: Duro-Last Inc.
    Inventors: Gregory A. Korf, Keith Gere
  • Patent number: 8072573
    Abstract: An apparatus for attaching substrates includes an upper chamber for holding an upper substrate and a lower chamber for holding a lower substrate which is to be attached to the upper substrate. The lower chamber is moved up and down so as to come together with the upper chamber to form a sealed attaching space. A substrate receiving part is fixed to a frame of the apparatus so that it does not move as the lower chamber is raised and lowered. The substrate receiving part alternatively projects from the lower chamber is the lower chamber is moved down, or is recessed into the top of the lower chamber when the lower chamber is lifted up.
    Type: Grant
    Filed: December 1, 2010
    Date of Patent: December 6, 2011
    Assignee: ADP Engineering Co., Ltd.
    Inventors: Jae Seok Hwang, Kyung Mi Kim
  • Patent number: 8070902
    Abstract: A method for manufacturing a solar cell module for a vehicle sunroof is disclosed, in which a solar cell is cut into multiple pieces so that it can be closely adhered to a curved glasses of a sunroof which is generally installed at an intermediate portion of a vehicle roof so as to provide a driver with an air circulation effect in the interior of a vehicle and a fresh driving feeling with its open environment. A solar cell module for a sunroof is manufactured based on a high temperature and vacuum compression work using a laminator as an EVA film adhering unit. So, it is possible to easily perform a laminating work for adhering a sunroof curved glass and a solar cell as compared to a conventional art in which it is not easy to perform the above work.
    Type: Grant
    Filed: May 3, 2007
    Date of Patent: December 6, 2011
    Inventor: Jae-Hak Ryu
  • Patent number: 8066835
    Abstract: A method and an apparatus are described for the production of a mitered corner joint between parts of a frame, by vibration welding. During the welding procedure, in each case two parts of a frame are displaced by oscillatory heads into mutually perpendicular straight-line translatorial oscillations, the phases of which have been matched to one another in such a way that mitered areas of the two parts of the frame oscillate perpendicularly with respect to a stationary mitered plane and through the same, while the mitered area is retained under a prescribed welding pressure in the system. The method and the apparatus can be used for the simultaneous production of the four corner joints of a frame, in particular of a frame of the moveable or fixed part of windows or of doors. For this, at least four, and preferably eight, oscillatory heads, which displace the parts of the frame into the translatorial oscillations, are synchronized in such a way that their frequencies and amplitudes are the same.
    Type: Grant
    Filed: December 11, 2007
    Date of Patent: November 29, 2011
    Assignees: Branson Ultraschall, Fentech AG
    Inventors: Jörg Vetter, Peter Eugster, Beat Bruderer
  • Publication number: 20110277918
    Abstract: A collapsible mandrel comprises an inflatable bladder. The bladder includes a reinforcement sandwiched between inner and outer layers of a fluoroelastomeric rubber.
    Type: Application
    Filed: May 11, 2010
    Publication date: November 17, 2011
    Inventors: Michael A. Lee, John D. Morris
  • Patent number: 8057624
    Abstract: A pair of laminated panels are simultaneously manufactured in a single panel press. A thermal band is stacked between two panel sets and then the two panel sets are simultaneously heated and compressed together in a common stack with the band, with the band being separately heated.
    Type: Grant
    Filed: October 24, 2008
    Date of Patent: November 15, 2011
    Assignee: The NORDAM Group, Inc.
    Inventor: Bryan Keith Martin
  • Patent number: 8052036
    Abstract: A tab lead soldering apparatus soldering a tab lead to a front face and a rear face of a solar cell has a first pressing mechanism pressing the tab lead toward the front face of the solar cell, a second pressing mechanism pressing the tab lead toward the rear face of the solar cell rear face, a heat member and a support member provided to the first pressing mechanism and/or the second pressing mechanism to contact with the tab lead, a heat member shift mechanism shifting the heat member between a contact position to contact an end of the heat member with the tab lead and a separation position to separate the end of the heat member from the tab lead, and a support member shift mechanism shifting the support member between a contact position to contact an end of the support member with the tab lead and a separation position to separate the end of the support member from the tab lead.
    Type: Grant
    Filed: August 27, 2007
    Date of Patent: November 8, 2011
    Assignee: NPC Incorporated
    Inventor: Yoshiro Chikaki
  • Patent number: 8052823
    Abstract: Stiffener tool positioning apparatus and methods are provided. In one embodiment, the apparatus includes a base, a first flipper member and second flipper member. The first flipper member is slide-ably attached to the base. The first flipper member is also configured to selectively attach a first mandrel thereon and to rotate the first mandrel. The second flipper member is also slide-ably attached to the base. The first and second flipper members are slide-ably positioned select distances from each other on the base in embodiments. The second mandrel is further configured to attach a second mandrel thereon and to rotate the second mandrel.
    Type: Grant
    Filed: January 30, 2009
    Date of Patent: November 8, 2011
    Assignee: Alliant Techsystems Inc.
    Inventors: Vernon M. Benson, Douglas G. Harris, Jason K. Slack, Michael D. Cimbalista, Jr., Nicklaus C. Kimball, Timothy S. Olschewski, Jeremy D. Palmer
  • Patent number: 8047252
    Abstract: The present invention relates to a pressure application device for curing an adhesive on a component, particularly components of complex geometries. The device comprises a pair of jaws, at least one spring recessed into a cavity defined within the first jaw, and a cap. A first end of a spring partially extends into the cavity and a second end of the spring contacts the cap. When force is applied to the cap, the cap transmits the force through the spring to the first jaw. In order to limit the separation of the cap from the first jaw, a retainer is used.
    Type: Grant
    Filed: December 19, 2008
    Date of Patent: November 1, 2011
    Assignee: United Technologies Corporation
    Inventor: John H. Vontell
  • Patent number: 8048254
    Abstract: A mounting method is provided for mounting electric components on both faces of a substrate. Because the electric components on a front face and a rear face of the substrate are simultaneously pressed with first and second pressing rubbers, the electric components can be connected to the front face and the rear face of the substrate at a time. Because the peripheries of the first and second pressing rubbers are surrounded by a dam member when the first and second pressing rubbers deform, the first and second pressing rubbers are dammed by the dam member and not spread. Thus, positional slip of the electric components does not occur. Because the electric components are connected to the substrate at the same positions as at the time of temporary compression bonding, an electric component having high connection reliability is obtained.
    Type: Grant
    Filed: August 20, 2008
    Date of Patent: November 1, 2011
    Assignee: Sony Chemical & Information Device Corporation
    Inventor: Takashi Matsumura
  • Patent number: 8042590
    Abstract: A protection mechanism for dry film laminator includes a lower member, and an upper member located above the lower member. The upper member moves downwardly/upwardly relative to the lower member. The upper member has a plurality of through holes defined therein and extending therethrough. An air supply device communicates with the through holes for feeding air into the through holes. A film guide device is disposed above the upper member and includes a supply spool and a take-up spool disposed thereon. A continuous release film movably connected to the film guide device. The continuous release film which is wound on the supply spool is routed from the supply spool to flatly pass between the upper member and the lower member, and is sequentially collected by the take-up spool.
    Type: Grant
    Filed: February 3, 2010
    Date of Patent: October 25, 2011
    Assignee: C Sum Mfg. Ltd.
    Inventor: Chin-Sen Lai
  • Patent number: 8042594
    Abstract: A method and system for a fiber compaction device with interdependent segment travel is described. A compaction device structure supports a series of individual interdependent segments including a compaction surface. Each segment also includes an opening in which a presser member can be located. The presser members consist of either an elastomeric bladder filled with an incompressible fluid or individual pistons that are manifolded together with a fixed volume of incompressible fluid. The presser members create an interdependence in segment positions such that if one or more segments are displaced the others move to balance the segment positions. Having a fixed volume of incompressible fluid allows the segments to work interdependently, thus guaranteeing that the average section position will be the nominal position and eliminating the need for a fixed center section.
    Type: Grant
    Filed: June 28, 2006
    Date of Patent: October 25, 2011
    Assignee: Alliant Techsystems Inc.
    Inventors: Lloyd G. Miller, Douglas G. Harris, Vernon M. Benson, Keith G. Shupe, Kevin L. Wade
  • Patent number: 8042593
    Abstract: A semiconductor chip bonding apparatus maintains a semiconductor chip in a parallel state with respect to a lead frame when applying a bonding load.
    Type: Grant
    Filed: July 17, 2008
    Date of Patent: October 25, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Cheal-Sang Yoon, Yong-Dae Ha, Jae-Ryoung Lee, Jeong-Soon Cho, Bum-Woo Lee, Pil-June Kim
  • Publication number: 20110253287
    Abstract: A press having oppositely arranged lower and upper master tools, at least one having an elongate pressing tool which is vertically displaceable in a groove in the master tool, and two lateral pressing tools arranged between the main surfaces of the master tools, on each side of the groove. The press also having at least two mould inserts, arranged on the pressing surface of at least one of the master tools, having the form of an elongate rod extending along substantially the whole of the longitudinal extent of the press and having a substantially U-shaped, outward-facing cross-sectional form, and which are displaceably movable, at least to a limited extent, along the horizontal pressing surface of the master tool transversely to a longitudinal extent of the press, and at least one partition wall arranged between the mould inserts on the pressing surface of at least one of the master tools.
    Type: Application
    Filed: December 21, 2009
    Publication date: October 20, 2011
    Applicant: NEWBEAM SWEDEN AB
    Inventor: Ulf Nyberg
  • Publication number: 20110226424
    Abstract: Implementations of the present invention relate to a translucent and/or transparent polymer-based panel system that incorporates multi-colored insert layers that enable manipulation of color, transparency or light transmission of the finished panel system. Implementations of the present invention also relate to the construction of such panels to avoid the capture and retention of air within the panels through the use of textured surfaces at the lamination interfaces. In addition, implementations of the present invention provide a method of quantifying the optical response achieved in a given panel system and describes types of construction that enable the multiplicity of color and optic manipulation. Furthermore, implementations of the present invention provide methods for applying texture in an efficient, uniform manner.
    Type: Application
    Filed: May 31, 2011
    Publication date: September 22, 2011
    Applicant: 3FORM, INC.
    Inventor: John E.C. Willham
  • Publication number: 20110220272
    Abstract: A coupled portion of mutual laminate films sufficiently contributes to the formation of a packaging bag in that the coupled portion itself has excellent air tightness and liquid tightness. The tensile strength required for the laminate film is given to the coupled portion, whereby a temporary stop of a packaging apparatus is useless when a connecting portion of the laminate film is passed through the apparatus, thereby enhancing the operation efficiency and improving the yield of the material. Oriented base film layers are joined in a mitre form at the coupled portion between a rear end portion and a front end portion of laminate films comprising oriented base film layers and sealant layers.
    Type: Application
    Filed: April 28, 2011
    Publication date: September 15, 2011
    Applicant: TAISEI LAMICK CO., LTD.
    Inventor: Katsunori FUTASE
  • Publication number: 20110212572
    Abstract: In one embodiment, a support structure comprises a base, a compliant layer, and a protective layer which is used to secure a semiconductor device, such as a lead-frame, to a window clamp during a bonding process. The compliant layer distributes even loading over the surface of the semiconductor device while clamped. In other embodiments, the compliant layer may be segmented into individual portions corresponding with openings in the window clamp. The window clamp may also have a compliant layer and a protective layer and may be used with or without a compliant layer on the support structure. Features on the protective layer may be included to support structures of the semiconductor device.
    Type: Application
    Filed: November 19, 2009
    Publication date: September 1, 2011
    Applicant: ORTHODYNE ELECTRONICS CORPORATION
    Inventors: Jonathan Byars, Theodore J. Copperthite
  • Patent number: 8006383
    Abstract: A frame and an ink-jet head including a nozzle plate and a fixed plate are placed on a first jig having a first face and a second face parallel to the first face and located outside the first face when seen in a direction perpendicular to the first face while being at a predetermined distance from the first face with respect to the direction perpendicular to the first face, in such a manner that a portion of the frame other than a portion formed with an adhesive layer is in contact with the second face, that an ink ejection face of the nozzle plate is opposed to the first face, and that both ends of the fixed plate are in contact with the adhesive layer. Thereafter, the adhesive layer is cured under a state where the ink ejection face is in contact with the first face, so that a head unit is manufactured.
    Type: Grant
    Filed: September 6, 2007
    Date of Patent: August 30, 2011
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventor: Atsuhisa Nakashima
  • Patent number: 8006614
    Abstract: Two press cylinders are disposed at an equal interval at left and right having the opening-closing cylinder therebetween, so as to have the approximately same distance from the conveying reference plane as the opening-closing cylinder. The opening-closing cylinder comprises an opening-closing linear encoder, which detects a decreased amount of the entire thickness of the object-to-be-processed as a displacement of the ram, when the object-to-be-processed is hot-pressed. The respective press cylinders comprise pressure sensors for press cylinders detecting pressing pressures of the pressing plates as cylinder inner pressures.
    Type: Grant
    Filed: July 27, 2009
    Date of Patent: August 30, 2011
    Assignee: Taihei Machinery Works
    Inventors: Reiji Yamada, Yasuyuki Ohdaira, Fumio Kurita, Mineo Masuda
  • Patent number: 8002011
    Abstract: The invention relates to top seal driver assembly for sealing the top opening of a pouch comprising Motor means for driving a rocker bar mounted on a central drive shaft, the rocker bar being connected on opposite ends to an outer seal rod drive bar and to an inner seal rod drive bar, the outer seal rod drive bar being connected to outer seal drive rods, and the inner seal rod drive bar being connected to inner seal drive rods, the outer and inner seal drive rods being supported in a box frame with bearing means, wherein outside dovetail bars are mounted to the outer seal drive rod and inner dovetail bars are mounted to the inner seal drive rod, wherein seal bar assemblies are mounted to the dovetail bars, wherein the box frame contains the central drive shaft, the rocker bar, the outer and inner seal rod drive bars and the outer and inner seal drive rods.
    Type: Grant
    Filed: April 22, 2009
    Date of Patent: August 23, 2011
    Assignee: KHS GmbH
    Inventor: Scott Veix
  • Publication number: 20110195230
    Abstract: Tooling aids for applying pressure in laminating, and methods for their use, are described herein. In one embodiment, a caul for applying pressure in laminating includes a base portion positioned between first and second corner portions. The base portion can have a curved shape when it is in a relaxed state, but it moves to a flatter shape when subjected to pressure during lamination. Movement of the base portion to the flatter shape causes the first and second corner portions to move outwardly and away from the base portion. In this manner, the caul can be used to compact laminating materials into corner regions of a corresponding female mold surface.
    Type: Application
    Filed: April 20, 2011
    Publication date: August 11, 2011
    Applicant: THE BOEING COMPANY
    Inventor: Steven F. Hanson
  • Patent number: 7992614
    Abstract: A horizontal hotpress system is provided, which can maintain the thickness of the boards (laminated boards) after hot-pressing within the allowable range, by driving and controlling the press cylinders individually, even when, for example, the size or material of the boards changes. Also, A horizontal hotpress system is provided, which can maintain the thickness of the boards (laminated boards) after hot-pressing within the allowable range, by driving and controlling the press cylinders individually or jointly without adjusting the pressing positions of the press cylinders, even when, for example, the size or material of the boards changes, and further, being able to adapt to change of the material of the boards or the like.
    Type: Grant
    Filed: July 15, 2009
    Date of Patent: August 9, 2011
    Assignee: Taihei Machinery Works
    Inventors: Reiji Yamada, Yasuyuki Ohdaira, Fumio Kurita, Mineo Masuda
  • Patent number: 7984742
    Abstract: A panel clamping assembly (10) facilitates gluing wooden boards (12) edge-to-edge so that they will form a perfectly flat panel after the glue sets. The assembly (10) includes a plurality of vertically oriented platens (14) each having a leading edge (16). All of the leading edges (16) lie in a common vertical plane. Wooden boards (12) are gently pressed against the leading edges (16) of the platens (14) by opposing press bars (22). Press actuators (28) create compression between the press bars (22) and their opposing platens (14). Conventional bar clamps (40) are removably hooked into respective clamp saddles (54) flanking the platens (14) to provide distributed clamping pressure normal to the glue lines. The lower ends (44) of the bar clamps (40) are slidably captured in shaft guides (92). The clamp saddles (54) are mounted to an upper mounting board (86) through the convenience of a lip (82). Likewise, the lower shaft guides (92) are attached to a lower mounting board (96).
    Type: Grant
    Filed: January 6, 2009
    Date of Patent: July 26, 2011
    Inventor: Jon E. Shackelford
  • Publication number: 20110174444
    Abstract: Device (1) for applying a strip (B) of a viscoelastic material to a receiving surface (S) in relative motion (R) with respect to the device, comprising a feed means and an application nozzle (1) at the end of which there is an outlet orifice (10). The outlet orifice comprises a front lip (11) and a rear lip (12). The rear lip (12) is connected to an applicator flap (2) by an elastic articulated joint (3) so that the applicator flap (2) applies pressure pressing the strip (B) onto the surface (S) when the device (1) is functioning.
    Type: Application
    Filed: March 30, 2009
    Publication date: July 21, 2011
    Applicants: SOCIETE DE TECHNOLOGIE MICHELIN, Michelin Rechererche et Technique S.A.
    Inventors: Jean-Claude Delorme, Christophe Ougier
  • Patent number: H2266
    Abstract: A jig is provided for setting and gluing pairs of specimens along their joining faces to cure into a lap joint. The jig includes a platform with a setting surface flanked by first and second upright walls, first and second plates and fasteners. The platform positions the pairs of specimens for lap joint arrangement.
    Type: Grant
    Filed: December 2, 2008
    Date of Patent: February 7, 2012
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventor: William E. Blakley, II