Abstract: A substrate bonding apparatus includes a first chamber including a first surface plate on which a first substrate is supported, a second chamber spaced from the first chamber and including a second surface plate on which a second substrate to be bonded to the first substrate is supported, an adhesive module provided on the first surface plate and including a plurality of adhesive rubber areas holding the first substrate, and a lift module for lifting at least one of the plurality of adhesive rubber areas.

Abstract: Embodiments disclosed herein provide a novel and cost effective application of a thermoplastic heat-welding rod for welding thermoplastic standing seam profiles and other similar materials to thermoplastic roofing membrane, and providing secure attachment without roof penetration and profile/membrane separation. In addition, embodiments disclosed herein provide a welding attachment or apparatus for performing such heat-welding of thermoplastic materials. In one embodiment, an apparatus for welding a thermoplastic profile strip to a thermoplastic membrane may comprise a first nozzle configured to direct hot air along a portion of a first longitudinal edge of a horizontal base of a thermoplastic profile strip placed on a thermoplastic membrane. Also, such an apparatus may comprise a second nozzle configured to direct hot air along a portion of a second, opposing longitudinal edge of the thermoplastic profile strip.

Abstract: The invention relates to squeeze pressing of a laid-up veneer assembly having glue applied as glue stripes. The pressing in the method is subjected to the assembly as two uniform fronts advancing in opposite directions from the central area of the assembly. A press for implementing the method comprises press plates to be pressed together, at least one press plate being equipped with a sub-pressing plate extending as an arch at the central area of the press plate to the press opening.

Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.

Abstract: The present invention relates to a method for vibration welding. The vibration welding is performed with a plurality of mechanically decoupled oscillating heads, each of which is connected with a frequency converter. An electrical circuit connects the frequency converters such that one of the frequency converters can be operated as the master and the other frequency converters as slaves. With the help of the controlling effect of the master, both a synchronous and a targeted asynchronous operation of the plurality of oscillating heads can be realized.

Abstract: A stabilizing mechanism for resisting relative movement of upper and lower laminates of a composite structure having a core comprises a lower grip strip and at least one upper grip strip. The lower grip strip may be mounted to a tool upon which the composite structure may be processed. The lower grip strip may include an outer surface having at least one engagement feature for engaging at least one of the upper and lower laminates which make up the composite structure. The upper grip strip may have opposing outer surfaces which may include at least one engagement feature for engaging the lower strip and at least one of the upper and lower laminates.

Abstract: A geogrid using fiber-reinforced polymeric strips and its producing method are disclosed. The geogrid of a lattice shape includes plural longitudinal fiber-reinforced polymeric strips longitudinally arranged in parallel at regular intervals and formed by reinforcing fiber in a thermoplastic polymer resin, and plural lateral fiber-reinforced polymer strip laterally arranged in parallel at regular intervals and formed by reinforcing fiber in a thermoplastic polymer resin. Each longitudinal fiber-reinforced polymer strip has at lease one first contact point crossed with the lateral fiber-reinforced polymer strip on the upper surface and at least one second contact point crossed with the lateral fiber-reinforced polymer strips on the lower surface. The contact points are fixed by welding the longitudinal and lateral fiber-reinforced polymer strips.

Abstract: Device for coupling two or more paper webs or plies by gluing, comprising gluing means destined to apply glue to a paper ply (N2) and pressure means which are located downstream of said gluing means and press more paper plies (N1, N2; N3) onto each other determining their coupling. The said gluing means comprise at least one body (1) provided with corresponding reliefs (R1) which apply the glue on predetermined gluing zones or areas of a paper ply (N2) advancing along a predetermined direction (F2) and said pressure means comprise a presser (3) which is located downstream of the said gluing means with respect to the said direction (F2) and is provided with corresponding reliefs (R3) which exert, on said paper plies (N1, N2; N3), a localized pressure on pressure zones or areas interfering with said gluing zones or areas, so that the glue passes through the glued ply (N2) only in correspondence of said pressure areas or zones.

Abstract: An adhering apparatus having a pressurizing tool including a plurality of pressurizing surfaces and rotatably mounted on a base member, a supply reel which supplies a release tape adhered to an adhesive tape along the pressurizing surfaces of a periphery of the pressurizing tool, a cutter which is disposed to face one of the pressurizing surfaces and cuts only the adhesive tape into a predetermined length, and a backup tool supporting a lower surface of the substrate and disposed to face a pressurizing surface located downstream from the pressurizing surface facing the cutter. When the base member is driven downward in the vertical direction, the pressurizing surface facing the backup tool adheres the adhesive tape to the upper surface of the substrate.

Abstract: An efficient lamination presses can rapidly heat and precisely control the temperature of a laminate assembly to create final products with excellent structural and aesthetic properties. Specifically, an efficient lamination press can include a radiant heating assembly. The radiant heating assemblies can uniformly heat one or more platens using radiation. The platens in turn can comprise material having a high thermal conductivity, which can allow them to quickly transfer heat to a laminate assembly. The platens can further comprise one or more fluid channels that enable rapid cooling. The rapid heating and cooling capability can enable fast processing times for laminate panels at much lower energy levels than with conventional presses.

Abstract: A web of a first sheet material and a web of a second sheet material are laminated together by a process wherein the sheet materials are wound, in an interleaved relationship, upon a roller having a radially displaceable outer surface. The roller and webs and then subjected to heating and/or a low-pressure environment so as to complete the lamination. A body of adhesive material, such as a hot melt adhesive, may be interposed between the webs and the heating or low pressure environment can activate this adhesive. Further disposed are particular configurations of rollers with radially displaceable surfaces.

Abstract: An apparatus for use with multiple chips having multiple posts as to engage at least a portion of a surface of one of the multiple chips, a frame configured to releasably constrain each of the posts so that, when unconstrained, each individual post can contact an individual chip and, when constrained, will allow a uniform vertical force to be applied to the chips.

Abstract: An apparatus for use with multiple individual chips having a rigid plate, and a deformable membrane located on the plate, the deformable membrane having a thickness sufficient to allow the deformable membrane to peripherally conform to each of the individual multiple chips irrespective of any difference in height among the multiple individual chips and to prevent each of the multiple individual chips from moving in a lateral direction, the deformable membrane being configured to uniformly transfer a vertical force, applied to the rigid plate, to the chips so as to bring, under pressure, a bonding surface of each individual chip into contact with a bonding surface of an element to which the individual chips will be bonded during a connect and release cycle without causing damage to the individual chips or bonding surface.

Abstract: A tool and a method for packaging lens module are provided. The method for packaging lens module includes the following steps. Firstly, a carrier having at least one cavity is provided. Next, a holder is disposed in the cavity. Then, a die is disposed on a surface of a substrate. After that, the substrate is inversely placed on the carrier, wherein the surface where the die is disposed faces the carrier, and the die corresponds to the holder. Then, a cover plate covers the carrier and the substrate, such that the substrate is fixed on the holder.

Abstract: Methods and other embodiments associated with a fabric welding machine are presented. The fabric welding machine includes a base, a welding machine body, and a support beam with a first end and a second end. A first roller is positioned adjacent to the first end of the support beam opposite the welding machine body. A swing arm with a body end and a roller end is attached to the welding machine body. The roller end is opposite the welding machine body and is configured to move to a first position and a second position. A heat element attached to the first end of the support beam.

Abstract: An adhesive chuck, and an apparatus and method for assembling substrates using the same are disclosed. The apparatus comprises a chamber, a first adhesive chuck inside the chamber and having a plurality of adhesive protrusions to adhere to a first substrate conveyed from an outside into the chamber via an intermolecular attractive force, and a driving unit to move the first substrate adhered to the first adhesive chuck and a second substrate toward each other to be compressed and assembled to each other. The apparatus can achieve adhesion and separation of a substrate with minimal power consumption, enhancing an operating efficiency. Additionally, the adhesive chuck can overcome a problem of spot generation on a display panel caused by remaining static electricity. Furthermore, since the adhesive chuck is almost free from a problem of electric instability, it can exhibit high stability and efficiency and can be fabricated at lower costs.

Abstract: An agglutinant compound and agglutinated product for reconstituting powders of vegetal origin, that allow employing a lamination or similar process, being said agglutinated product comprised of agglutinant compound and a vegetal mass formed by the powder of vegetal origin, that may range from 5-50% (mass/mass, regarding the powder mass used), with drying temperature ranging between 100-400° C., thickness between 0.05-2.50 mm and vegetal film humidity between 8 and 20%; being said agglutinant compound formed only by a mixture of polymers of hydroxylated organic acids, such as lactic acid and malic acid, and it may contain agents improving its agglutinant and sensorial properties.

Abstract: An improved pressure label applicator provides increased speed, quality, and/or reliability in the labeling of containers.

Abstract: A present embodiment provides a method of fabricating a semiconductor device includes tentatively compressing a second electrode formed on a second semiconductor chip in a substrate to a first electrode on a first semiconductor chip, at least one of the first electrode and the second electrode being constituted with a metal protrusion, and fixedly compressing between the first electrode and the second electrode.

Abstract: A friction welding device allows one work (5) and the other work (9) to be in contact with each other and gives friction thrust thereto, giving a fixed relative rotation operation to the one work (5) and the other work (9) by energizing a servo motor (15) and rotating a main shaft (3), and thereby softens a connection interface between the works (5, 9). Then, the friction welding device decelerates the main shaft (3) until the number of the rotation of the main shaft (3) is set to the number of phase focusing rotation, and when the number of the rotation of the main shaft reaches the number of the phase focusing rotation, allows a clutch device (19) to be engaged with the main shaft, shuts off the energization to the servo motor (15), and thereby stops the rotation of the main shaft (3).

Abstract: A substrate bonding apparatus includes a first chamber having a first surface plate where a first substrate is placed. A second chamber is disposed opposite to the first chamber. The second chamber has a second surface plate where a second substrate is placed. The second substrate is to be bonded to the first substrate. An alignment unit is installed in at least one of the first and second chambers. The alignment unit is capable of carrying out a six-degrees-of-freedom alignment between the first and second substrates. Thus, the substrates can be maintained parallel to each other, a spacing between the substrates can be automatically adjusted, and the substrates can be aligned in the X and Y axis directions.

Abstract: A sheet peeling machine includes a movable table for moving a substrate in a moving direction, a planar member, a holder for holding the planar member; an elevating unit for supporting the holder and moving the holder in an elevating direction, a forwarding unit for contacting an end of the planar member with an edge of a sheet member on the substrate, a tape roller for affixing a peeling tape from the planar member and the sheet member, and a tape wind-up unit for peeling off the sheet member together with the peeling tape. According to the sheet peeling machine, the peeling tape is affixed onto the sheet member and then the sheet member is peeled off together with the peeling tape with a support by the planar member.

Abstract: A chip bonding tool, related apparatus and a method thereof. The chip bonding tool includes a pressing block, through which a laser beam passes, for pressing a semiconductor chip; and a projection disposed under the pressing block, through which the laser beam passes, onto which the semiconductor chip is sucked, which spaces the pressing block from the semiconductor chip.

Abstract: An apparatus for stacking a plurality of pieces of material has an assembly region, one or more platens on a first longitudinal side of the assembly region, and, a plurality of press rams on a second longitudinal side of the assembly region opposite the first longitudinal side. The press rams are movable transversely across the assembly region to immobilize or partially immobilize pieces of material in the assembly region permitting accurate and precise alignment of the pieces relative to each other in the assembly region.

Abstract: Apparatus and method for applying thermal energy to a sealing member. Electrical current is applied to a heating assembly to generate thermal energy, and a heat conductor transfers the generated thermal energy to a seal member adjacent a housing. The heating assembly is configured to substantially prevent a magnetic field generated by the applied electrical current from extending to the housing.

Abstract: An electronic component mounting apparatus is capable of significantly reducing a warpage amount of an electronic component warped in a case of thermocompression bonding using a non-conductive adhesive agent having a low minimum melt viscosity and having no conductive particle where a thin electronic component having a thickness smaller than or equal to 200 ?m is mounted on a wiring board. In the mounting apparatus, a non-conductive adhesive film having the minimum melt viscosity lower than or equal to 1.0×103 Pa·s is placed on a wiring board placed on a base, and an IC chip having a thickness smaller than or equal to 200 ?m is placed on the non-conductive adhesive film. In the mounting apparatus, the IC chip is pressurized by a thermocompression bonding head having a compression bonding portion made of elastomer having a rubber hardness lower than or equal to 60, so that the IC chip is bonded onto the wiring board by thermocompression.

Abstract: A fabric material for use in craft activities, the fabric material comprising a textile substrate and a pressure sensitive adhesive carried by opposite surfaces of the substrate, whereby upon the application of pressure to one piece of the fabric material against another piece of the fabric material causes the adhesion of the pieces of fabric.

Abstract: A transferring device 10 for transferring plate-like members such as a semiconductor wafer and the like among the first table T1, the second table T2 and the third table T3. The transferring device 10 includes a supporting unit 11 provided with a supporting face for a semiconductor wafer W, and a multi joint robot 12 for transferring the supporting unit 11. The supporting face includes a stacked body of adhesive sheets S in which an adhesive layer A is laminated on a sheet base material SB, and transferring among the table T1 through T3 can be performed through sticking and peeling operation between the adhesive sheet S positioned in an outermost layer and the semiconductor wafer W.

Abstract: A hold-down structure used in a machine for compacting a workpiece being transferred by the machine is disclosed to include two conveyers for transferring the workpiece through a transfer path defined between circulating endless transfer belts of the two conveyers, front and rear pairs of upright supports arranged at two opposite lateral sides relative to the conveyers, and multiple linked series of pressure blocks arranged in parallel and suspending between the front and rear pairs of upright supports and pressed on the top surface of the lower part of the circulating endless transfer belt of the upper conveyer to give a downward pressure to the workpiece being transferred through the transfer path, thereby compacting the workpiece.

Abstract: In a soldering method for mounting a semiconductor device on a wiring board, a plurality of solid-phase solders are provided between the semiconductor device and the wiring board, and are thermally melted to thereby produce a plurality of liquid-phase solders therebetween. A constant force is exerted on the liquid-phase solders by relatively moving the semiconductor device with respect to the wiring board so that an invariable gap is determined between the semiconductor device and the wiring board.

Abstract: Provided is a lamination unit of ceramic green sheets including a pair of upper and lower plates having a plurality of slits formed therein; a plurality of posts of which the upper and lower ends are closely attached to corresponding surfaces of the respective plates such that the upper and lower plates are supported in parallel to each other; a plurality of fixing sections, each of which is composed of a bolt inserted into a contact portion between the plate and the post and a button surrounding the bolt; and a pressing bar attached on the bottom surface of the lower plate and pressing the top surface of the ceramic green sheets laminated under the lower plate.

Abstract: A method and apparatus for welding two separate ends of an extrusion or two separate extrusion ends to form a flashless extrudate or gasket by having a first and a second mold for supporting and clamping the extrusion ends, and a spacer bar for positioning the extrusion ends to a location within the mold. A heating element elevates the temperature of the extrusion ends to a welding condition, and a clamping device is used for securing the extrusion ends. A flashless welding operation results by inserting and clamping at least one heated extrusion end into a welding mold until an acceptable contact pressure is obtained against the opposing heated extrusion end.

Abstract: An apparatus for attaching substrates includes an upper chamber for holding an upper substrate and a lower chamber for holding a lower substrate which is to be attached to the upper substrate. The lower chamber is moved up and down so as to come together with the upper chamber to form a sealed attaching space. A substrate receiving part is fixed to a frame of the apparatus so that it does not move as the lower chamber is raised and lowered. The substrate receiving part alternatively projects from the lower chamber is the lower chamber is moved down, or is recessed into the top of the lower chamber when the lower chamber is lifted up.

Abstract: A device for applying a coating film (63) on a face of a lens, the film previously being placed on the face concerned of the lens, includes a seat (40) suitable for receiving the lens, a membrane (62) including a peripheral fixing portion (62A) and an inflatable portion (62B), and an inflater element (61) for inflating the membrane towards the lens seat. The inflater element include a first plate (66) and a second plate (65) with the membrane (62) placed between them, the first plate presenting as a setback a pressurization chamber (80) connected to a source (93) of compressed gas, and the second plate presenting a protrusion opening (71), the two plates being mounted to move relative to each other between an open configuration and a closed configuration.

Abstract: A mounting device for an electric component includes a thermocompression bonding head with a pressure bonding member made of a predetermined elastomer, the pressure bonding member provided in a head main body, and a pressing force adjusting mechanism for adjusting a pressing force corresponding to a region on a pressure bonding surface of the pressure bonding member, wherein the pressure bonding member is pressed at a predetermined pressure toward an electric component placed on a wiring board.

Abstract: A method for fast fabricating a glued laminated timber is provided. The method includes the following steps: preparing a plurality of prelaminating pieces, each of the prelaminating pieces having at least two laminating surfaces, arranging the prelaminating pieces to position the laminating surfaces substantially perpendicular with a horizontal plane, and uniformly distributing glue onto the laminating surfaces of the prelaminating pieces; drying the prelaminating pieces having glue distributed thereon to precuring the glue distributed on the laminating surfaces; sequentially stacking the prelaminating pieces one on another to obtain a stack, wherein each of the prelaminating pieces is stacked to another with its laminating surfaces only; conducting a compression treatment to the stack and maintaining the compression treatment for a certain time to obtain a glued laminated timber preform; and conducting a drying treatment to the glued laminated timber preform to obtain the glued laminated timber.

Abstract: The invention refers to a method and a device for forming a weld joint at the connecting surfaces between two parts. At the connecting surfaces a heatable element is provided, during warm-up the two parts approach each other, and the heatable element is also moved or positioned depending on the movement or position of the parts.

Abstract: An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers includes a base plate configured to support a plurality of green sheet layers thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.

Abstract: A substrate bonding apparatus for use in fabricating LCD devices substantially prevents substrates held to upper stages from sagging. The substrate bonding apparatus may, for example, include upper and lower stages having a plurality of passages for holding respective substrates; suction force applying means having one end mounted within each passage for transmitting a suction force to operably proximate portions of a substrate, wherein the one end of the suction force applying means is projectable from within each passage to a predetermined distance from the stage; and a vacuum pump for providing a suction force to the suction force applying means.

Abstract: A press for laminating essentially planar work pieces under the effects of pressure and heat is provided, having a bottom half of the press and a top half of the press, which are movable in reference to each other in order to open and close the press, with the bottom half of the press and the top half of the press, in the closed state, together with circumferential seals forming a vacuum chamber. A pliable diaphragm divides the vacuum chamber into a product space that can be evacuated and is provided to receive at least one work piece, and a pressure space that can be evacuated and/or impinged with pressure. The diaphragm is embodied and arranged such that due to the pressure difference in the vacuum chamber, created by evacuating the product space and/or by impinging it with pressure, the work piece is pressed directly or indirectly against the bottom of the vacuum chamber 14.

Abstract: A machine for applying pressure sensitive sample chips to a card includes a linear conveyor for receiving and transporting cards, and at least one sample application station disposed along the conveyor. The sample application station includes a feed roller overlying and spaced from the conveyor for holding a spool containing at least one row of individual pressure sensitive sample chips on a substrate. A plate has an edge immediately overlying and spaced from the conveyor to permit passage of cards beneath the edge. A drive roller is spaced from the feed roller and from the plate for drawing the substrate from the spool on the feed roller over the plate edge to separate the sample chips from the substrate and apply the chips to the cards. A resilient roller preferably is disposed adjacent to the plate edge for pressing the sample chips removed from the substrate onto the cards transported on the conveyor.

Abstract: A method of laminating a surface of a flexible material to a surface of a rigid, curved material. The method includes pressing an area of the surface of the flexible material into the surface of the rigid, curved material with a holder to create a contact area while the flexible material is conformed to the holder, which has a curvature greater than a curvature of the rigid, curved material surface; and changing the contact area between the surface of the flexible material and the surface of the rigid, curved material while maintaining pressure on the contact area until the surface of the flexible material and the surface of the rigid curved material are laminated.

Abstract: This invention relates to a temporary plaque manufacturing apparatus of the type comprising a plaque support frame having a pair of substantially parallel slots, one of which is a plaque receiving slot and the other is a flexible sheet receiving slot. The plaque receiving slot has a plaque support surface and an elongate flap housed therein and located on opposite sides thereof. Biasing means are provided to urge the flap towards the plaque supporting surface. A temporary plaque comprising a two part plaque, one part being a mounting plate and the other part being a flexible sheet, is inserted through the plaque receiving slot to affix the flexible sheet to the mounting plate. The elongate flaps are provided with wear resistant covers, preferably of a reinforced vinyl material that extend upwardly along the forward face of the elongate flaps.

Abstract: In order to manufacture an ink-jet head, a head body and a reservoir unit are formed first. Then, UV-cured resin is applied on the lower surface of the reservoir unit. Then, the head body is placed on a plane of a jig so that the plane abuts against the ink discharge surface. Then, the reservoir unit is positioned with respect to the head body and the jig so that an ink reservoir of the reservoir unit and ink flow channels of a flow channel unit are brought into communication and the both ends in the longitudinal direction of a reservoir base plate and the upper surfaces of walls oppose to each other, and the reservoir unit is laminated on upper surface of the flow channel unit via the UV-cured resin. Subsequently, the UV-cured resin is cured in a state in which the lower surface of the reservoir base plate abuts against the upper surfaces of the walls.

Abstract: An apparatus and method for providing pressure for bonding parts together. The apparatus may comprise a plurality of bladders independently actuatable to apply pressure for pushing a second part toward a first part having adhesive thereon. The apparatus may further comprise a frame supporting a plurality of reconfigurable bladder retainer devices positioned and angled such that the configuration of the bladders matches the contour of the second part. The bladders may expand and contract according to a sequence dictated by a control device, such that excess air and adhesive between the first and second part may be substantially squeegeed toward outer edges of the parts.

Abstract: A bonding apparatus, suitable for accurately bonding large substrates for a liquid crystal display, includes Z-axis drive mechanisms, and upper and lower chambers. The Z-axis drive mechanisms for moving an upper frame vertically are disposed at four corners of a mount. The upper chamber is supported by the upper frame and has an upper table inside. The lower chamber has a lower table inside and is supported on the mount. The upper and lower chambers are united through a seal ring to define a vacuum chamber. Moving the upper frame moves the upper chamber vertically to open or close the vacuum chamber. The lower table is supported via a free joint stage between the plurality of support legs and the table, and is moved horizontally by a side thrust mechanism disposed outside of the vacuum chamber.

Abstract: A laminated assembly (10) is mountable on a wall and comprises a back support (20) and opposed side supports (40,50) for holding the laminating roller (60) and nip roller (70). The assembly includes hanging supports (120) for hanging the assembly (10) on a wall oriented so that the nip is substantially parallel to the wall and items to be laminated can be fed from above, passed through the machine and released below the machine.

Abstract: A method of manufacturing a hermetically sealed container including a pair of substrates disposed in opposition to each other, a frame member disposed between the pair of substrates, and a bonding member bonding the substrate to the frame member, includes a bonding step of heating the bonding member for bonding the substrate to the frame member. The bonding step includes a measuring process for measuring a height of the bonding member in a direction perpendicular to the substrate, and a heating and pressing process for partially pressing the substrate to the bonding member while partially heating the bonding member. The heating and pressing process is conducted by scanning, along the bonding member, an area of the bonding member partially heated and an area of the substrate partially pressed.

Abstract: An apparatus for applying adhesive sheets includes a sheet applying base which is placed on a placement base so as to be withdrawable from the placement base and which has a sheet applying region to which adhesive sheets positioned closely before and after a junction portion are to be applied. In the sheet applying base, an upstream-side end portion of the sheet applying region in the adhesive sheet feed direction is placed so as to confront an end portion of the sheet applying head, and moreover a sheet escaping space opened downward is set in place.

Abstract: Tools for compacting composite parts are disclosed. These tools are used while layers of composite material, such as tows or laminae, are being deposited onto a fabricating surface, such as a mold or other forming tool. The compacting tool is typically divided into a series of narrow segments, each segment able to advance or retreat individually so as to conform to the surface of a composite part being formed. Pressurized fluid, such as air or hydraulic fluid, or non-pressurized internal bladders with incompressible fluid, are used to evenly apply pressure to the segments in order to compact the material with which the tool and the segments are in contact. The compacting tool thus helps eliminate voids and helps the material conform to the desired shape on the forming tool.