Abstract: There is disclosed a method and apparatus for ensuring release of objects such as solder balls from a pick head in a transfer and placement apparatus, comprising causing said pick head to vibrate by applying a vibration signal to said pick head over a range of frequencies. The range of frequencies is chosen such that it bounds the resonant frequencies of the pick head which may be calculated by computer simulation.

Abstract: At the step of printing a wiring portion of a ceramic substrate with a conductive adhesive for mounting an IC chip or a part such as a capacitor other than the IC chip, a wire bonding pad made of gold is formed by the ball bonding method or the like at the portion of the wiring portion to be wire-bonded. After the pad was formed and before the conductive adhesive is printed, a heat treatment is performed to cause a thermal diffusion between the wiring portion and the pad to improve the jointability therebetween.

Abstract: An object of the present invention is to provide a novel system for supporting a vibrator having a terminal for electrical connection so that the vibrator may be miniaturized and the deviation of vibration property among vibrators mounted on the supporting systems may be prevented. The supporting system has a substrate 11 and bonding wires 9, 10 supported on the substrate 11 and to be joined with a vibrator 1. The vibrator 1 is supported with the bonding wires 9, 10 so that the vibrator 1 does not directly contact the substrate 11 and bonding wires 9, 10 are electrically connected with a terminal 6 of the vibrator 1.

Abstract: A connecting method of connecting covered wires with each other and recessed resinous tips used in the method are provided. In the method, it is executed at the first step to put a connecting part constituted by a shield wire and a ground wire between a first resin tip and a second resin tip. The first resin tip has, around the connecting part, first recessed parts for accommodating the molten cover of the shield wire and second recessed parts for accommodating the molten cover of the ground wire. The second resin tip has second recessed parts formed for accommodating the molten cover of the ground wire.

Abstract: A board piece 2 of the present invention comprises a non-thermoplastic resin film 11, a thermoplastic resin film 10 formed on the non-thermoplastic resin film 11 and a metal wiring 8 formed on the surface of the thermoplastic resin film 10. Metal wiring 8 is partially exposed on board piece 2 to form a contact 12. A low-melting metal coating 13 is formed on contact 12 and two board pieces 2a, 2b are pressed against each other under heating with contacts 12a, 12b thereof being in contact with each other so that thermoplastic resin films 10a, 10b soften to adhere board pieces 2a, 2b to each other and low-melting metal coatings 13a, 13b melt and then solidify to connect contacts 12a, 12b to each other. The region of metal wiring 8 not used for connection is wiring 17 connecting contacts 12 to each other and a cover film 19 can be provided on the surface thereof. Contacts 12a, 12b can also be connected by applying ultrasonic wave.

Abstract: A methodology for applying ultrasonic welding processes to insulation jacketed wires without firstly stripping them. A preferred acronym therefor is “UWTI” (Ultrasonic Welding Through Insulation). A wire with its insulation jacket thereon and intact is placed upon a top surface of a base of a terminal to which it is to be bonded and the staking wings of the terminal are staked down onto the wire. The operator places the insulation jacketed wire and terminal combination into a conventional ultrasonic welder, such that the a bottom surface of the base rests upon the anvil and the insulation jacketed wire is aligned with the tip. The operator then causes the sonic welder to automatically sequence so as to provide an ultrasonic weld of the wire to the terminal.

Abstract: An energy controller is described for a vibration welder wherein the energy imparted into work-pieces being vibration welded is derived and compared with an energy set point to control the vibration welding operation. After a vibration welding operation has encountered the energy set point the welding operation is stopped and the quality of a weld derived from a comparison with another parameter associated with the vibration welding. The other parameter can be the amount of movement of one of the work-pieces during vibration welding or the time involved to inject the energy into the work-pieces to achieve the vibration weld.

Abstract: A method and apparatus (20) for ultrasonic bonding or other processing can include a rotatable ultrasonic horn member (28) and a rotatable axle member (34). The axle member is operatively joined to the horn member (28), and can provide a node plane (38). An isolation member (42) can be operatively joined to the axle member (34), and may have a location that is operatively proximate the node plane (38) of the axle member (34). In a particular aspect, the isolation member (42) can exhibit high rigidity. In a further feature, the isolation member (42) is capable of bending under a horn-life range of sonic frequencies to provide an operative component of motion along a radial direction (102), and an operative component of motion along an axial direction (100) of the isolation member.

Abstract: A method of connecting a generally flat battery lead to at least one flat current collector of a polymer battery, comprising the steps of: bending a generally planar lead about at least one generally planar current collector tab to form a layered area, wherein at least one planar tab is disposed between planar portions of the lead with the lead wrapped around one edge of at least one tab; clamping the layered area between two weld fixtures of an ultrasonic welder; and vibrating the weld fixtures to ultrasonically weld together the battery lead and at least one current collector tab.

Abstract: An ultrasonic transducer used in a bonding apparatus, comprising a first hollow section, which communicates with a rear end opening formed in a base end of a horn body of the transducer, and an inner unit, which is installed inside the first hollow section. The inner unit comprises a vibrator assembly and a pressing block, and the pressing block pushes and fastens in place the vibrator assembly in the first hollow section. A through-hole is formed in the central portion of the inner unit, and a second hollow section and third hollow section are further formed in the horn body. Signal wires are connected to the vibrator assembly through the rear end opening.

Abstract: In a wire bonding apparatus including a horn driver for generating ultrasonic waves, a capillary, an ultrasonic horn formed by a symmetrical section fixed to the horn driver and an asymmetrical section having an end for mounting the capillary, the asymmetrical section is constructed by a spurious vibration releasing structure for releasing a vibration component of the ultrasonic horn perpendicular to a propagation direction of the ultrasonic waves with the ultrasonic horn.

Abstract: In a wire bonding apparatus including a horn driver for generating ultrasonic waves, a capillary, an ultrasonic horn formed by a symmetrical section fixed to the horn driver and an asymmetrical section having an end for mounting the capillary, the asymmetrical section is constructed by a spurious vibration suppressing structure for suppressing a vibration component of the ultrasonic horn perpendicular to a propagation direction of the ultrasonic waves with the ultrasonic horn.

Abstract: The present invention provides a bump-joining apparatus, a bump-joining method, and a semiconductor component-manufacturing apparatus whereby bumps and electrode portions of circuit board are perfectly joined with higher join strength than in the conventional art. The apparatus includes a vibration generation device, a pressing device and a control unit, wherein bumps are pressed to electrode portions of a circuit board and vibrated with ultrasonic waves after reaching an initial contact area before reaching a join-completed-contact area at a completion of the joining, so that the bumps are more perfectly joined to the electrode portion than in the conventional art which vibrates the bump only after reaching the join-completed-contact area. Larger join strength is achieved than in the conventional art.

Abstract: A hermetically sealed electrical package having wires entering at the base and being embedded vertically in its walls for connecting to the leads of a component assembly within the package. The wires protrude vertically from the walls, serving as pins for electrical connection of the leads inside the package. The component assembly is secured to an inner side of the package by an adhesive. A cover is affixed to the upper edges of the walls by an ultrasonic weld so as to create a hermetic seal.

Abstract: A methodology for applying ultrasonic welding processes to insulation jacketed wires without firstly stripping them. A preferred acronym therefor is “UWTI” (Ultrasonic Welding Through Insulation). A wire with its insulation jacket thereon and intact is placed upon a top surface of a base of a terminal to which it is to be bonded and the staking wings of the terminal are staked down onto the wire. The operator places the insulation jacketed wire and terminal combination into a conventional ultrasonic welder, such that the a bottom surface of the base rests upon the anvil and the insulation jacketed wire is aligned with the tip. The operator then causes the sonic welder to automatically sequence so as to provide an ultrasonic weld of the wire to the terminal.

Abstract: An object is to reduce impact load applied on a bonding subject at the time of wire contact detection and achieve a stable and highly precise fabrication of a minute bonding ball so as to shorten the bonding time. A wire bonding arm comprises: a Z driving shaft supported by a Z-axis base to be capable of swinging via a first shaft; and a low pressurizing shaft with a smaller inertia than that of the Z driving shaft having a capillary, which is supported on one end of the Z driving shaft to be capable of swinging via a second shaft. The capillary is brought down by the swing of the Z driving shaft to the position of the height right before an initial ball comes to be in contact with a first bonding point. Then, only the low pressurizing shaft is swung to be driven at low speed to be brought down while holding the Z driving shaft in the position.

Abstract: An apparatus for improved shock and vibration isolation of a CGA integrated package which utilizes solder column grid arrays to provide electrical connection to a printed circuit board. The CGA integrated package includes a substrate and a package lid. A support frame is attached at an attachment point to the substrate or the package lid of the CGA integrated package and at a second attachment point to the printed circuit board. An isolation material, such as Styrofoam or Sorbathane is located at the attachment point of the support frame to the substrate or the package lid, or located at the second attachment point of the support frame to the circuit board such that a vibration or shock to the circuit board must travel through the isolation material at the attachment point prior to reaching the integrated circuit. A method of supporting an integrated circuit on a circuit board and improving the isolation of an integrated circuit from any vibration and shock to the circuit board is also provided.

Abstract: A method of manufacturing a head suspension assembly includes attaching underfill to a portion on which an IC chip with a circuit for a thin-film magnetic head element is to be mounted, disposing the IC chip on the attached underfill, and performing ultrasonic bonding of the IC chip.

Abstract: Method of testing wire-bond connections between a bonding wire and a substrate surface, which are produced by a bonding head with a bonding tool and a wire clamp associated with the bonding tool, under pressure and the action of ultrasound and/or heat, wherein after the bonded connection has been created, the bonding head or the bonding tool is raised a short distance away from the bonding site, the bonding wire is firmly gripped by the wire clamp, and the bonding head or the wire clamp with bonding wire gripped therein is raised for a second distance, during which process the tensile force acting on the bonding wire is detected.

Abstract: A Wire Bonder has a capillary clamped to a horn. An ultrasonic transducer applies ultrasonics to the horn whereby the ultrasonic transducer is controlled by a parameter P. For calibration of the parameter P, a pizoresistive sensor integrated into a semiconductor chip is used. The capillary is lowered onto the semiconductor chip and a bond force is applied to it. Afterwards, a value P1 of the parameter P is applied to the ultrasonic transducer and the output signal of the sensor is stored as the reference value URef as soon as the transient reaction is concluded. The bond force is selected great enough so that the capillary does not slide back and forth.

Abstract: A method of wiring a head suspension assembly includes fixing a tube binding a plurality of wires on a suspension assembly, and fixing the wires extending from the fixed tube on the suspension while leading them to a top side of the suspension. The suspension has a tab frame with first and second frames. Each wire led to the top side of the suspension is bonded to the second frame of a tab frame. An insulation film is removed from each connecting portion of the wires to connect the wires to respective connecting pads of the slider. A first frame is bent substantially perpendicular to the suspension, and the second frame is bent substantially perpendicular to the first frame, thereby positioning the wires bonded to the second frame at the connecting pads on the slider. The wires are then ultrasonically welded to the respective connecting pads on the slider.

Abstract: A ball forming method and device used in a wire bonding apparatus in which a discharge is caused to occur by applying a high voltage between an electric torch and a tip end of a wire that extends out of a lower end of a capillary so as to form a ball at a tip end of the wire, and an insulating member is provided so as to cover the electric torch with a space between the vicinity of a discharge portion of the electric torch and the insulating member, a heater being further provided on the insulating member so as to heat such a space.

Abstract: An apparatus and method for ultrasonically welding workpieces that reduces sonotrode adhesion during the ultrasonic welding process. The sonotrode includes a contact surface wherein a fluid is deposited on the contact surface prior to the welding process. The fluid may be applied in different ways, including providing an aperture in the contact surface of the sonotrode. In addition, the sonotrode may be cooled below the dew point of the surrounding atmosphere thus causing moisture to form on the contact surface of the sonotrode. Cooling the sonotrode to a temperature above the dew point also reduces sonotrode adhesion during the ultrasonic welding process.

Abstract: A method and apparatus for joining multiple layers of materials using an ultrasonic welding apparatus. The ultrasonic welding apparatus utilizes a sonotrode to perform a weld between at least the top and intermediate layer of the multi-layer member. Then, either the multi-layer member or the ultrasonic welding apparatus is rotated such that the bottom layer is positioned adjacent the sonotrode wherein the sonotrode forms a weld between at least the bottom layer and intermediate layer of the multi-layer member. The apparatus includes an ultrasonic welding gun having a C-shape frame including a base portion and a head portion. An ultrasonic welding device, including a sonotrode, is secured to the head portion and an anvil secured to the base portion. The ultrasonic welding gun is connected to a robot operative to position the ultrasonic welding gun to perform the welding operation.

Abstract: A mounting method and a mounting apparatus of an electronic part onto a substrate are provided, which enable inspection of a bond formed between an electronic part and a substrate when flip-chip bonding is executed by an ultrasonic wave and thermocompression bonding connecting method. The semiconductor chip has bumps which, when are compressed and subjected to ultrasonic vibration, enable formation of a connection between the semiconductor chip and a substrate conductor.

Abstract: In a bonding tool which bonds a component to a substrate by urging and vibration, a through hole is formed in the horn. An adhesion section is fit into a lower section of the hole and an engaging section is fit into an upper section of the hole, so that a sealed inner space is formed inside the hole by tightening an outer screw. An adhesion hole open to a bonding section communicates with a sucking hole of the horn via the inner space, so that a simply structured vacuum-adhesion-system can be formed. This mechanics does not loose replaceablility of the adhesion section detachable to the horn. As a result, the adhesion section can be replaceable as an independent part (urging terminal), and a bonding apparatus as well as a bonding tool having the simply structured vacuum-adhesion-system can be provided.

Abstract: A transducer for a wire bonding apparatus is formed of two separate parts sandwiching therebetween a plurality of piezoelectric elements. One of the two parts is the amplifying horn, and by selecting appropriate sizes and shapes for the two parts, vibrational energy can be concentrated at the distal end of the amplifying horn where the bonding tool is located.

Abstract: An apparatus and method for manufacturing solder balls used for an electrical and/or mechanical connection between a semiconductor chip and a substrate are provided. The apparatus includes a melting furnace having a nozzle through which a molten solder paste flows and drops, for producing solder balls; a vibrating mechanism attached to the nozzle of the melting furnace, for applying vibration to the nozzle; and a vibration controlling mechanism for controlling the vibration frequency of the vibrating mechanism to adjust the size of the solder balls dropped from the nozzle. The method includes the steps of setting a vibration frequency according to a desired solder ball size, applying vibration to a nozzle with the set vibration frequency, making the molten solder paste flow through the nozzle to manufacture solder balls of a predetermined size according to the vibration frequency, and measuring the size of the manufactured solder balls.

Abstract: A machine and method for bonding puncture-type conductive contact members of an interconnect to the bond pads of a bare semiconductor die includes the use of one or two ultrasonic vibrators mounted to vibrate one or both of the die and interconnect. A short axial linear burst of ultrasonic energy enables the contact members to pierce hard oxide layers on the surfaces of the bond pads at a much lower compressive force and rapidly achieve full penetration depth.

Abstract: The invention is an apparatus comprising an ultrasonic horn. The horn is mounted to a support structure and includes a first mounting surface. An anvil is mounted to the support structure and spaced from the ultrasonic horn. The anvil has a first bearer surface. A bearer assembly supportably links the first mounting surface to the first bearer surface.

Abstract: A transducer vibrated by a vibrator and used in a bonding apparatus, the transducer including holding portions and connecting portions. The holding portions are provided so as to protrude at at least two locations that correspond to the nodes of vibration of a transducer main body, and the connecting portions each connects the tip ends of two protruding holding portions to each other. The external force applied to one of the holding portions is thus dispersed in each of the respective holding portions connected by the connecting portions, deformation of the holding portions is prevented, and the respective holding portions can be formed extremely thin in the axial direction of the transducer main body.

Abstract: The object is to provide a method of connecting covered wires mutually which can solve increasing cost. Each of the covered wires 2, 3 is comprised of a conductor 4, 10 and a cover 5, 11. The covered wires 2, 3 are connected to each other by ultrasonic welding. An ultrasonic welding machine includes a chip and an anvil. The covered wires 2, 3 are placed between the chip and the anvil. The chip is located with the length of its cross section disposed along the length of the other covered wire 3. The chip and the anvil are pushed toward each other and the chip is vibrated. Friction heat is generated between the covered wires 2, 3. The covers 5, 11 are adhered together and the conductors 4, 10 are bonded to each other by ultrasonic welding.

Abstract: An electronic component with at least one semiconductor chip and a wiring layer are described. The wiring layer has elastic contact elements of low mechanical strength in the spatial directions x, y and z, which can be electrically connected to corresponding contact terminal areas of a printed circuit board. The semiconductor chip or the wiring layer additionally has at least two spacers for the mechanical connection to a printed circuit board. A method for producing the electronic component is also described.

Abstract: In a bonding tool which bonds a component to a substrate by urging and vibration, a through hole is formed in the horn. An adhesion section is fit into a lower section of the hole and an engaging section is fit into an upper section of the hole, so that a sealed inner space is formed inside the hole by tightening an outer screw. An adhesion hole open to a bonding section communicates with a sucking hole of the horn via the inner space, so that a simply structured vacuum-adhesionsystem can be formed. This mechanics does not loose replaceablility of the adhesion section detachable to the horn. As a result, the adhesion section can be replaceable as an independent part (urging terminal), and a bonding apparatus as well as a bonding tool having the simply structured vacuum-adhesion-system can be provided.

Abstract: A method for joining a first wiring board covered with a conductive pattern on a surface of a thin resin basic plate to a second wiring board covered with a conductive pattern on a thin resin basic plate to ensure the electric connection therebetween, including the steps of putting said first and second wiring boards together in a confront relationship so as to adjust join predetermined portions on the conductive patterns, catching the join predetermined portions in the status by a pair of ultrasonic welding tools, and applying an ultrasonic vibration to said ultrasonic welding tools to weld the conductive metals located on the join predetermined portions.

Abstract: A controlled attenuation bonding tool for bonding a fine wire to a substrate. The bonding tool comprises a first cylindrical section having a substantially uniform first diameter; a second cylindrical section having a first end coupled to an end of the first cylindrical section, the second cylindrical section having a substantially uniform second diameter less than the first diameter; and a third section having a predetermined taper, a first end of the third section coupled to an end of the second cylindrical section.

Abstract: An apparatus for ultrasonically welding workpieces that reduces sonotrode adhesion during the ultrasonic welding process. The sonotrode tip has a specific surface configuration, including a curvilinear shaped outer surface combined with a plurality of grooves and lands. Due to the curvilinear surface, the depth of the grooves gradually decreases near the outer edge or periphery of a contact surface of the sonotrode tip. Further, such a groove and land combination also provides a sharp edge or corner that reduces sliding of the tip on the workpiece and correspondingly reduces sticking. In addition, various types of coatings or inserts may also be used to reduce sticking of the sonotrode tip to the workpiece.

Abstract: A thermosonic bonding apparatus including an ultrasonic transducer; a bonding tool including a high resistivity tip, and a low resistivity shaft extending from the tip; a tool support arm interconnecting the bonding tool and the ultrasonic transducer to vibrate the high resistivity bonding tool tip; and a voltage source connected to the bonding tool to locally heat the high resistivity bonding tool tip in a pulsed fashion.

Abstract: A method of manufacturing a filter comprises the steps of assembling multiple layers of filtration material on top of one another to form an assembly; holding the assembly between an ultrasonic weld horn and a weld nest so that the assembly has a marginal area outside of an edge formed on either the nest or the weld horn; and operating the weld horn so as to cause the marginal area to be cut off from the assembly at the edge and to simultaneously seal together the layers of filtration material of the remaining assembly at the edge. A filter made by the process and an apparatus used to practice the process are also disclosed.

Abstract: The present invention solves a problem with a wire bonding device, that during a wire bonding process, a cover at the periphery of a working hole warps upward to cause inadvertent sparking to occur across the cover that has warped upwards and a torch electrode. This invention's bonding device 21 provided with recognition device is characterized in that insulation treatment is applied to a part 231 of a cover 23 positioned at the periphery of a working hole 24. The interior of a working region is kept, for example, at 230° C. by a heater 30 inside a setting base 22, and by being placed under high temperature constantly, a part 471 of cover 23 warps upwards. However, since insulation treatment is applied to part 231 of cover 23, a bonding device can be realized with which inadvertent sparking between a torch electrode 28 will not occur.

Abstract: An outer cover shell and plate member soldering method includes the steps of: (a) applying a predetermined thickness of soldering material to the border of the plate member, (b) pressing the outer cover shell on the plate member in the platform of a high-frequency heating machine, (c) lifting the platform to let the outer cover shell be coupled to the induction coil of the high-frequency heating machine, (d) driving the high-frequency heating machine to output an oscillating current, causing a high temperature to be produced around the border of the outer cover shell within the induction coil, (e) letting the soldering material be melted due to the thermal effect of the outer cover shell, so that the outer cover shell and the plate member are bonded together.

Abstract: Methods are provided for hermetically sealing the reservoirs of microchip devices and for hermetically sealing the substrate assemblies in a hermetic packaging structure.

Abstract: The present invention is a method for bonding gold wire to gold bond pads at temperatures lower than 125 degrees Celsius, and more particularly at room temperature, defined to be 25 degrees Celsius. By applying compressive force and ultrasonic energy, an intermetallic bond can be formed between a gold wire and a gold bond pad without elevating the temperature. Furthermore, the present invention uses ultrasonic energy with frequencies low enough to be in the range of commercially available wire bonders.

Abstract: A device for making metal bumps includes a hard conical tubular member having a vertical passage which is conical in shape and has a larger diameter at a bottom such that a lower portion of the vertical passage is larger than an upper portion of the vertical passage, whereby a metal wire is inserted into the vertical passage of the hard conical tubular member, with a lower end of the metal wire protruded downwardly out of the vertical passage, the lower end of the metal wire is melted to form a ball, the hard conical tubular member is approached to a raised platform formed on a top of a chip, and a load is applied to the metal wire and the metal wire is heated and bonded on the pad of die and ultrasonic energy is applied to deform the melted metal so as to fill up the lower portion of the vertical passage thereby forming a metal bump on the raised platform of the chip, and finally the hard conical tubular member is removed to pull off the necking position between the metal wire and a top of the metal bump the

Abstract: The present invention is a method for bonding gold wire to gold bond pads at temperatures lower than 125 degrees Celsius, and more particularly at room temperature, defined to be 25 degrees Celsius. By applying compressive force and ultrasonic energy, an intermetallic bond can be formed between a gold wire and a gold bond pad without elevating the temperature. Furthermore, the present invention uses ultrasonic energy with frequencies low enough to be in the range of commercially available wire bonders.

Abstract: The present invention solves a problem that in a wire bonding process, an inert gas used for prevention of oxidation of a substrate gave rise to shimmer due to the temperature difference during bonding, thereby degrading the precision of pattern recognition. With this invention's bonding device 21, shielding lids 31, 32, and 33 are disposed at upper and lower parts of a ring illumination 25 and at a lower part of lens barrel 29. Shimmer 37 of nitrogen gas that blows out from a working hole 24 can thus be prevented from entering inside ring illumination 25, especially by shielding lid 31 at the lower part of ring illumination 25. As a result, the recognition precision of a recognition camera can be improved and the wire bonding precision of the &mgr;m order can be improved.

Abstract: The invention relates to the methods which make it possible to establish contacts between two conductive layers separated by an insulating layer. It consists in pressing the complex (101) formed by these three layers between a sonotrode (105) excited by ultrasound perpendicular to the plane of the complex and an anvil (106) whose face in contact with the complex has protruding ridges (107). Under the effect of the pressure and the ultrasound, the ridges deform the complex and make the insulating layer flow. When the conductive layers come into contact, after contraction of the insulating layer, they become welded to one another under the effect of the ultrasound. It makes it possible to obtain, at low cost, completely ohmic contacts between these two conductive layers.

Abstract: A device for making metal bumps includes a hard conical tubular member having a vertical conical passage at an upper portion thereof, a bell shaped chamber at a lower portion thereof which is larger than the vertical conical passage in diameter, located under and communicated with the vertical conical passage, and a circular recess which is larger than the bell shaped chamber in diameter, located under and communicated with the bell shaped chamber, thereby forming a capillary tube with a surface.

Abstract: The invention relates to an ultrasonic welding and cutting device for use in the manufacture of a flat-cable. The flat cable includes a plurality of wire conductors which are arranged in parallel at a given interval with respect to each other and interposed between first and second insulator films. The device has a product flow line in an upstream to downstream direction. The device comprises a horn unit including a horn melter unit that imparts ultrasonic oscillations, and a horn cutter unit. The horn melter unit and the horn cutter unit are located sequentially from upstream to downstream at a predetermined distance along the product flow line. The device further includes an anvil unit including an anvil melter unit and at least one anvil blade unit.

Abstract: A suspension of a head assembly provided in a disk apparatus is prevented from being deformed due to mounting of a head IC chip onto the suspension. The head IC chip mounted on the suspension has protruding electrodes made of gold. The suspension has electrode pads connected to the respective protruding electrodes of the head IC chip. Each of the electrode pads has a surface layer made of gold. The protruding electrodes of the head IC chip are bonded to the electrode pads of the suspension by ultrasonic bonding.