Abstract: Methods and apparatus for detecting the welding state in each bonding section and the application of ultrasonic vibration and pressing force is stopped promptly when completion of welding is determined. This permits bonding to be finished, corresponding to each wire bonding section at all times, in a shortest time without need of application of unnecessary ultrasonic vibration and pressing force after completion of welding in spite of dispersion of the welding characteristic of the individual bonding pads.

Abstract: A metal member is treated and vibrated with a number of vibrating particles to have the particles to strike and act onto an outer peripheral portion of the metal member in order to smooth the outer peripheral portion of the metal member, the particles are immersed with an additive for allowing the additive to be transmitted from the particles to the metal member and for allowing the outer peripheral portion of the metal member to be polished with the particles, the metal member may have dirt or impurities removed with a sand blasting method. The metal member may be tempered to form an oxidized membrane on the outer peripheral portion of the metal member, and may be immersed with in a rust preventive.

Abstract: A device for compacting and/or welding electric conductors (10), in particular for producing via nodes or end nodes of stranded conductors. The device includes a first electrode, one section of which constitutes a first delimitation surface of a compacting chamber that receives the conductor, the chamber in addition being delimited by one section of a counter-electrode that forms a second delimitation surface and by at least one additional third delimitation surface that is formed by a section of a delimitation element. The inventions simplifies the construction of the device, enabling repeated compacting and welding of conductors. To achieve this, a compacting chamber has a substantially triangular open cross-section, which is surrounded by the sections of the first electrode and the counter-electrode, these sections being adjustable in relation to one another, and by the delimitation element.

Abstract: When a weld area of weld surface between a flange portion 3a of a pipe 3 and a flange portion 4a of a pipe connection member 4 is S and total energy consumed on the weld surface is Et, ultrasonic welding is carried out to produce said ultrasonic weld assembly in such a manner that an energy density E defined as the quotient obtained by dividing the total energy Et by the weld area S satisfies the relation 26.69e?0.3708P<E<240.9e?0.1445P with a surface pressure P on the weld surfaces of the flange portion 3a and the flange portion 4a. Preferably, ultrasonic welding is carried out in such a manner that the energy density E satisfies the relation 133.45e?0.3708P<E<240.9e?0.1445P.

Abstract: A method of ultrasonic mounting can increase mounting efficiency by using high-frequency ultrasound and can also mount large semiconductor chips. The method ultrasonically bonds a semiconductor chip 52 to a substrate 50 using an ultrasonic mounting apparatus including a horn 15 that propagates ultrasonic vibration of an ultrasonic vibrator, the horn 15 being made of a ceramic that has a higher vibration propagation speed than metal. The method includes steps of disposing the substrate 50 on a stage 13, disposing the semiconductor chip 52 on the substrate 50, and placing the semiconductor chip 52 in contact with a convex part 15a provided on the horn 15 and applying ultrasonic vibration to bond the semiconductor chip 52 to the substrate 50.

Abstract: A method for production of a welded connection between at least one first electrical conductor and at least one second electrical conductor, in which the conductors are brought into a compression chamber enclosed by delimitation elements and welded therein by an ultrasound welding device, one of the delimitation elements forming a sonotrode which may be subjected to ultrasound vibration. According to the invention, in order to connect a first conductor in the desired circumference with second conductors, where the total cross-section of the second conductors for connection to the first conductor can optionally be greater than the usual cross-section with the ultrasound device used, the first conductor is welded sequentially with two or more second conductors in the compression chamber.

Abstract: The invention relates to an orbital friction welding method and a friction welding device for welding workpieces by means of friction welding units, wherein the workpieces are pressed against each other in the contact plane during the application of the oscillation energy. To this effect, n>1 friction welding heads are mounted, in a stationary manner, at least on one side of the contact plane in an orbital plane, in the area of the workpieces so that the n>1 friction welding heads, respectively facing one side, are oscillated with the same friction frequency, the same amplitude and the same preset phase position.

Abstract: A method of stress relief for stainless steel combustion turbine components includes vibrating the components during welding at a subharmonic frequency. The proper frequency is selected to be below a harmonic frequency, and to produce an amplitude in the range of ¼ to ½ the amplitude produced by a harmonic frequency. The component to be repaired is vibrated during and after welding at this frequency.

Abstract: A capillary tip for deforming a bonding wire during bonding of the wire to a bonding surface comprises a bottom face along an inner periphery of the capillary tip for pressing the bonding wire against a bonding surface, an outer radius along an outer periphery of the capillary tip, and includes a first inclined face adjacent to the bottom face and extending obliquely to the bottom face as well as a second inclined face adjacent to the first inclined face and extending obliquely to the first inclined face.

Abstract: A method of ultrasonic mounting can increase mounting efficiency by using high-frequency ultrasound and can also mount large semiconductor chips. The method ultrasonically bonds a semiconductor chip 52 to a substrate 50 using an ultrasonic mounting apparatus including a horn 15 that propagates ultrasonic vibration of an ultrasonic vibrator, the horn 15 being made of a ceramic that has a higher vibration propagation speed than metal. The method includes steps of disposing the substrate 50 on a stage 13, disposing the semiconductor chip 52 on the substrate 50, and placing the semiconductor chip 52 in contact with a convex part 15a provided on the horn 15 and applying ultrasonic vibration to bond the semiconductor chip 52 to the substrate 50.

Abstract: A method for producing a power semiconductor module including forming a contact between a contact region and a contact element as an ultrasonic welding contact via a sonotrode. The ultrasonic welding operation also being used for joining the contact regions with the contact ends and consequently for joining the contacts and the foot regions.

Abstract: In the manufacture of electronic devices (22, 22?), e.g. discrete semiconductor power devices or ICs, a reversible bonding tool (10) is used having a bonding tip or wedge (1, 2) at each of its opposite ends (11, 12). After extensive use of the wedge-tip (1) at one end (11) for bonding wires (21), the tip (1) is worn somewhat. Instead of needing to replace the bond tool as in the prior art, the tool (10) in accordance with the invention is then reversed to use the wedge-tip (2) at the opposite end (12) for bonding further wires (20?). Thus, a cost saving is achieved with regard to tool material.

Abstract: An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create depressions in a ribbon approximately 150 ?m or less from the underlying bonding surface. The tool is then brought down further into the ribbon to contact the portions of the ribbon between the depressions, such as an additional 25 to 50 ?m. The result is lightly bonded regions underneath the groove portions and highly bonded regions underneath the protrusions and around the perimeter of the bond. In another embodiment, an ultrasonic bond is formed along a partial width of a ribbon.

Abstract: A semiconductor device with a chip having at least one metallic bond pad (101) over weak insulating material (102). In contact with this bond pad is a flattened metal ball (104) made of at least 99.999% pure metal such as gold, copper, or silver. The diameter (104a) of the flattened ball is less than or equal to the diameter (103a) of the bond pad. A wire (110) is connected to the bond pad so that the wire has a thickened portion (111) conductively attached to the flattened metal ball. The wire is preferably made of composed metal such as gold alloy. The composition of the flattened ball is softer than the wire. This softness of the flattened ball protects the underlying insulator against damage caused by pressure or stress, when the composed ball is attached.

Abstract: An ultrasonic welding machine having a tool in the form of, for example, a sonotrode. In order to allow for an optimal utilization of the working surfaces of the sonotrode, it is proposed to move or mount the sonotrode in a desired position with respect to the element that connects the ultrasonic welding machine to the sonotrode by rotating the sonotrode around its longitudinal axis as well as a transverse axis running perpendicular thereto.

Abstract: Since an electronic device of the present invention has a pair of joint pieces thereof formed (extended) on both sides with respect to one end of the body thereof, the pair of joint pieces both connected to one of the substrates improves the joining strength between the lead frame connector and the one of substrates and ensures the reliability of electrical connection between the lead frame connector and the one of the substrates.

Abstract: Batteries are disclosed having a vent opening that is sealed by a metal foil. Methods and tooling for manufacturing such batteries and methods of venting sealed batteries are also disclosed. In some implementations, sealing is performed using ultrasonic metal welding.

Abstract: In ultrasonic welding of a seam, such as for creation of an imaging belt, an ultrasonic welding horn is applied to an overlap area. The welding horn has a contact surface within a certain set of dimensions comparable to the overlap area. The welding horn defines a conical main body that tapers to the dimensions of the contact area through a short length.

Abstract: Disclosed are a bonding method for a semiconductor chip, which employs an ultrasonic bonding scheme that prevents wear-out of the top surface of a mount tool and ensures both high reliability and high productivity, and a bonding apparatus which is used to carry out the method. The bonding apparatus and method are provided with means for suppressing generation of a sliding friction. The apparatus and method execute a bonding process by controlling vibration-axial directional holding force and inertial force based on information given from control management means to thereby maintain a relationship of (vibration-axial directional holding force)>(die shear strength)+(inertial force) while applying an ultrasonic vibration to a region which is subjected to bonding.

Abstract: A method of bonding flying leads produces reliable bonds between the flying leads and substrate pads and can efficiently bond a plurality of flying leads and a plurality of substrate pads using a bonding tool. Flying leads are respectively aligned with a plurality of substrate pads disposed in parallel and a bonding tool applies ultrasonic vibration to the flying leads to bond the respective substrate pads and the flying leads. Bonding is carried out using a bonding tool in which (at least one contact member) a plurality of contact members that contact(s) the flying leads and apply (applies) the ultrasonic vibration thereto are (is) rotatably supported.

Abstract: Disclosed herein are methods and devices for stimulating soldering of a substrate with a component during a reflow process. In an exemplified embodiment, the method involves placing a substrate/component combination into a reflow oven; directing the substrate/component combination to the heating zone of said reflow oven; and vibrating the substrate/component combination while said substrate/component combination is in said heating zone. The vibrating of the substrate/component combination occurs at a predetermined amplitude and frequency such that formation of a complete solder joint is stimulated without displacing said substrate and said component relative to each other.

Abstract: An electrical contact device is provided for electrically grounding an uninsulated end-portion of insulated wire stored on a spool driven by a device comprises the following. An electrical connector fixes to the spool and is configured to receive an electrical connection with the uninsulated end-portion of said insulated wire. A stationary electrical contact is provided for connecting to a ground. The stationary electrical contact is further configured to be placed about the shaft. A conductive bearing is also provided. The conductive bearing is configured to be placed about the shaft and between the electrical connector and the electrical contact. The conductive bearing electrically couples the electrical connector to said stationary electrical contact, thereby providing said ground to said uninsulated end-portion of said insulated bond wire. A wire-bonder including such a contact device and a method for making such a wire-bonder are also provided.

Abstract: The present disclosure describes embodiments of bipolar plate electrode structures for use in an electrochemical battery assembly and a bipolar battery assembly utilizing the bipolar electrode plate structure as a fundamental building block. An exemplary bipolar electrode assembly can have an electrically isolated mechanical supporting plate sandwiched between two electrically conducting electrode substrate plates which are mechanically and electrically connected through holes in the supporting plate. Vapor and liquid tight sealing can be accomplished with an internal sealing ring placed in compression between and thermally bonded to the two conducting electrode substrates. The exposed metallic edges of the electrode supports and substrates can provide improved heat removal from the bipolar battery assembly. Associated construction methods are also described.

Abstract: The present invention provides an improved method and apparatus for manufacturing communication devices. A cover is attached to a surface of a faceplate that includes at least one opening, to provide enhanced device protection and sound quality. In one embodiment of the present invention, ultrasonic energy is used to cleanly and efficiently attach a cover to an inner surface of the faceplate. Advantageously, the present invention provides for improved manufacturing consistency and efficiency while also improving product quality.

Abstract: The method is capable of securely mounting an electronic component on a circuit board by applying ultrasonic vibration. The method comprises the step of applying ultrasonic vibrations to the electronic component so as to flip-chip-bond the electronic component to the circuit board having electrodes. Portions of the circuit board, which correspond to peaks of amplitude of vibrations transmitted to the circuit board, are pressed when the ultrasonic vibrations are applied to the electronic component.

Abstract: Bonding of flip-chip mounted light emitting devices having an irregular configuration is provided. Light emitting diodes having a shaped substrate are bonded to a submount by applying forces to the substrate an a manner such that shear forces within the substrate do not exceed a failure threshold of the substrate. Bonding a light emitting diode to a submount may be provided by applying force to a surface of a substrate of the light emitting diode that is oblique to a direction of motion of the light emitting diode to thermosonically bond the light emitting diode to the submount. Collets for use in bonding shaped substrates to a submount and systems for bonding shaped substrates to a submount are also provided.

Abstract: An ultrasonic welding apparatus and method for detaching or effecting release of an ultrasonic welding tool stuck or attached to a weldment. The method includes the step of utilizing a mechanism mounted adjacent to the ultrasonic welding tool to hold the weldment in position during welding and/or while the ultrasonic welding tool is withdrawn and, if necessary, using the mechanism to detach the weldment from the ultrasonic welding tool. The method contemplates providing a twist, rotary or axial motion to one of the ultrasonic welding tool or weldment to effect release of the ultrasonic welding tool. The apparatus may include a clamp member having a distinct clamping area or pad located adjacent to the sonotrode or anvil of the ultrasonic welding tool. The clamp mechanism provides vibration control, noise mitigation, and a more uniform boundary condition during welding and facilitates part release upon the completion of the welding process.

Abstract: An assembly line for manufacturing filter canisters is disclosed. The method for assembling filter canisters provides a unique serial number for each canister and a database that associates the component lot numbers, activated charcoal weight, and quality assurance test results with the serial number for the filter canister. The manufacturing method can be adapted for assembly of canisters with activated charcoal and an aerosol HEPA filter, canisters with activated charcoal only, and canisters with an aerosol HEPA filter only. Some embodiments can also enable different testing conditions and specifications, activated charcoal loading requirements, labeling specifications, and packaging requirements.

Abstract: A wire bonding tool includes a first cylindrical portion having a first outside diameter and a second cylindrical portion adjacent the first cylindrical portion. The second cylindrical portion has a second outside diameter, the second outside diameter being less than the first outside diameter. The wire bonding tool also includes a tapered portion adjacent the second cylindrical portion. The tapered portion has a third outside diameter at an end adjacent the second cylindrical portion, the third outside diameter being less than the first outside diameter.

Abstract: An apparatus and method for detecting the oscillation amplitude of a bonding tool includes a sensing unit disposed adjacent to and at a distance from the bonding tool. The sensing unit includes a pair of electrodes, a piezoelectric sensing layer located between the pair of electrodes, and a membrane associated with the piezoelectric sensing layer. The piezoelectric sensing layer becomes sensitive to ultrasonic vibrations and generates electrical voltage signals after being activated by a poling process. An optional pre-amplifier is used to amplify the signals generated from the sensing unit, and an oscilloscope is used to further process the signals.

Abstract: An ultrasonic welder includes a housing having an ultrasonic transducer, a horn mounted to one end of the housing, a motor having a shaft, and a mounting assembly having a fastener such as a threaded screw. One screw end is coupled to the motor shaft to rotate as the motor shaft is being driven. The other screw end extends into a threaded screw receiver running within the housing. Upon rotating in one direction, the screw engages more threads of the screw receiver such that the housing with the horn move upward. Upon rotating in the other direction, the screw engages less threads of the screw receiver such that the housing with the horn mover downward. A linear transducer extends from the mounting assembly into the housing to monitor the horn position. A pair of guide shafts extend from the mounting assembly into the housing to stabilize the horn positioning.

Abstract: A wire bonding method and a wire bond formed from the method are provided to improve shear strength of a wire that is connected to a bonding surface. The wire bond includes a bonded wire having a base in contact with the bonding surface, a recessed portion formed substantially at an edge of the bonded wire wherein at least a portion of an underside of the recessed portion is in contact with the bonding surface, and a length of wire extending from the recessed portion.

Abstract: A tool for attaching fine preformed probes to a substrate for use with a vacuum source is disclosed. The apparatus comprises a body portion; a tip portion disposed at one end of the body portion; a first orifice extending from a first end of the body portion to the working tip; and at least one second orifice extending from an outer portion of the working tip and communicating with the first orifice, wherein the vacuum source is coupled to the body portion so that a vacuum generated by the vacuum source is provided to the at least one second orifice.

Abstract: This invention improves upon existing approaches by providing a method for improving the uniformity of additive manufacturing processes of the type wherein material increments are consolidated to produce a three-dimensional object. According to one aspect of the invention, the method comprises the steps of tacking an increment during the method to minimize creep, then fully consolidating that increment to the underlying material. According to a different aspect of the invention, the method includes a step of steering the welding head or the feeding of the increments to ensure that the relative orientation of the contact line of the welding head as defined by the lowest surface is parallel to the central axis. As yet a further aspect of the invention, a different method includes a step of placing the increment so as to minimize the ratio of deformed to undeformed material. Such placement may be carried out manually over automatically.

Abstract: A bonding apparatus including a front link whose lower end is rotatably connected to a bonding arm and upper portion is rotatably connected to bonding head, and a rear link whose lower end is rotatably connected to the rear end of the bonding arm and upper portion is rotatably connected to the bonding head; and a hypothetical rotational center of capillary of the bonding arm is on a bonding surface and set to be the intersection of a line that connects upper and lower rotational centers of the front link and a line that connects upper and lower rotational centers of the rear link, wherein the immovable element of motor is fastened to the bonding head, and the rotational element of the motor is attached to the upper end of the rear link so that the rotational element rotates about the upper rotational center of the rear link.

Abstract: A vibration welding apparatus and a method for executing vibration welding of three or more work pieces made of a thermoplastic material to make them integral in a sandwich shape, comprises an upper tool means supporting a first work piece so as to apply a lateral motion to it by a vibration means, a lower tool means capable of supporting a plurality of second work pieces to be welded to at least both surfaces of the first work piece, and a means capable of actuating the lower tool means in such a manner as to move the second work pieces vertically by an elevating means so as to align with the first work piece, and move the second work pieces toward the first work piece laterally by a slide actuating means so as to bring them into contact with the first work piece.

Abstract: Disclosed are systems or apparatuses and methods for forming a junction between conductive fibers that are incorporated into a fabric. Briefly, one method includes the steps of removing insulation from two intersecting individually insulated conductive fibers to expose the individually conductive fibers, bringing the exposed individually conductive fibers into contact with each other at a junction point, and forming a molecular bond between the conductive fibers at the junction point. Also disclosed are systems for forming a junction between conductive fibers that are incorporated into a fabric.

Abstract: A method is provided for reworking a head gimbal assembly (HGA). An ultrasonic probe is used to stress the connection between the slider component of an HGA to remove the slider from its mounting position.

Abstract: Disclosed are interconnect structures and methods which utilize a bonding surface comprising copper nitride. The interconnect structures include a bonding surface comprising copper nitride which is effective at preventing oxidation and/or other unwanted corrosion of the underlying conductive material while providing the basis for a high conductivity bond. The copper nitride bonding surface provides a relatively non-conductive, corrosion-resistant bonding surface while at the same time being readily transformed into a conductive layer at or just prior to the time of bonding.

Abstract: In a mounting method for mounting a bump-equipped electronic component 5 with a plurality of metallic bumps 6 on a substrate 2 with a plurality of electrodes 3, during the process of connecting the metallic bumps 6 to the electrodes 3 by aligning the metallic bumps with the electrodes 3 with thermosetting resin 4 intervening between the electronic component 5 and substrate 2 and by pressing the electronic component 5 to the substrate 2 while exerting ultrasonic oscillation, heat and applied pressure on the electronic component 5, all of the metallic bumps 6 are brought into contact with the electrodes so that they are electrically connected to each other, and when some of the metallic bumps are metallic-bonded to the electrodes, ultrasonic oscillation is stopped. Thus, it is possible to prevent occurrence of damage owing to the excessive exertion of ultrasonic oscillation on the metallic bumps which have precedently started their metallic-bonding.

Abstract: In an ultrasonic joining method for joining a flange portion of a first member to a portion of a second member, a first horn and a second horn are arranged on the flange portion on a side opposite to the second member, and the first horn is vibrated in a condition that the second horn is biased against the first horn and the first horn and the second horn are pressed against the flange portion such that the flange portion is vibrated while being pressed against the portion of the second member. Because the first horn is vibrated in a condition that the first horn and the second horn are pressed against each other at press-contact portions thereof, vibration of the first horn is transferred to the second horn through the press-contact portions.

Abstract: An improved method of bonding an insulated wire (14) that has one end connected to a first bond pad (16) to a second bond pad (18) includes moving a tip of a capillary (20) holding the bond wire (14) over the surface of the second bond pad (18) such that the bond wire (14) is rubbed between the capillary tip (20) and the second bond pad (18), which tears the bond wire insulation so that at least a portion of a metal core of the wire (14) contacts the second bond pad (18). The wire (14) is then bonded to the second pad (18) using thermocompression bonding. The tip of the capillary (20) is roughened to enhance the tearing of the bond wire insulation.

Abstract: A bonding tool for bonding a wire to a substrate. The bonding tool has a cylindrical body portion formed from a first material and a conical tip portion separately formed from a second material. The conical tip portion is coupled to one end of the body portion.

Abstract: An ultrasonic welding probe power supply for powering more than one ultrasonic welding probe with power is provided. The power supply is adapted to provide power only to one welding probe at a time. A ringdown period is monitored between termination of provision of power to a first probe and the initiation of provision of power to a second probe during which provision of power to the second probe is disabled. Circuitry is provided within an ultrasonic welding probe controller to monitor probe activity and to control the interval between termination of provision of power to one probe and the initiation of provision of power to a second probe so that efficient and safe switching is made among ultrasonic probes.

Abstract: Component (3) is pressed onto a circuit board (4) so that their respective metal interconnects (5), (6) are in close contact with each other, and ultrasonic vibration is applied to the suction nozzle (14) holding the component (3). Friction is thereby generated between metal interconnects (5), (6) whereby the component (3) is bonded on circuit substrate. Suction nozzle (14) for handling components is made of stainless steel and has a working face (14a) provided with a hardened layer (14b), or alternatively, suction nozzle (14) may have a suction head (14c) having a working face (14a) made of cemented carbide. Working face (14a) of suction nozzle (14) is refined by polishing as required during the mounting operation.

Abstract: After respective one ends of lead wires are fixed to a printed circuit board, the lead wires are bent, the printed circuit board is brought into a case and the other ends of the lead wires are bonded to terminals of the case. Since the lead wires are processed before the substrate is brought into the case, this eliminates the necessity to perform formation of the bent portions of the lead wires and fixing of the lead wires to the substrate in a narrow space of the case and allows simplification of bonding operation. Thus provided is a lead wire bonding method for bonding lead wires with bent portions to the substrate, which simplifies a bonding operation.

Abstract: A method of measuring a thickness of a ball bonded to a pad is disclosed. The method includes: taking an image of the pad and the ball at each step position through an image taking means being shifted in a vertical direction at predetermined step intervals; obtaining luminance variations at an edge portion of the pad in each taken image to determine an in-focus height of the pad based on an image taking height position at which the taken image has the largest luminance variation at the edge portion of the pad; obtaining luminance variations on an upper surface of the ball in each taken image to determine an in-focus height of the upper surface of the ball based on an image taking height position at which the taken image has the largest luminance variation on the upper surface of the ball; and calculating the thickness of the ball by finding a difference between the obtained in-focus heights of the pad and the upper surface of the ball.

Abstract: A flat electrical cable and a modular rotary anvil for assembling a flat electrical cable wherein the flat cable includes an upper and lower layer. The upper layer has ribs protruding along its length that are substantially parallel to one another, and continuous substantially parallel and adjacent seams formed therebetween. Conductors are placed between the upper and lower layers adjacent the seams. The present invention may have upper and lower polyester layers having copper conductors therebetween and the seams ultrasonically welded in order to provide a flat electrical cable for various applications such as incorporation in an automobile clockspring. The modular rotary anvil includes multiple removable and interchangeable segments or inserts which provide the ability to impart a smooth or knurled textured surface pattern to the work-piece. piece. Other inserts include cutting inserts which provide for a seam on the work-piece while a the same time cuts the work-piece along a seam.

Abstract: When an RFID-tag is formed by joining a semiconductor chip (RFID chip) to an antenna consisting of a rolled metal foil or the like using ultrasonic waves, the pressure impressed to the semiconductor chip is suppressed to avoid the damage of the semiconductor chip. For this purpose, the present invention provides an RFID-tag 1 wherein gold bumps are joined to the metal foil by pressing the gold bumps formed on the semiconductor chip against an antenna member, and impressing ultrasonic waves; and the RFID-tag wherein a matte surface having a low glossiness is formed on the metal foil, or a surface having shallow rolling streaks is formed on the metal foil, and gold bumps are joined to the surface.

Abstract: A method of forming a conductive bump is provided. The method includes depositing a conductive bump on a bonding location using a bonding tool such that a junction exists between (1) a length of wire extending at least partially within the bonding tool and (2) the deposited conductive bump. The method also includes moving the bonding tool to contact the conductive bump such that a location of the junction is moved with respect to the bonding location.