Abstract: A ball forming device and method used in a bonding apparatus, including a bonding arm, a capillary attached to the bonding arm, an electronic flame off prove for forming a ball at the tip of a wire passing through the capillary, and a gas atmosphere forming unit for bringing the vicinity of the tip end of the wire into a gas atmosphere. The gas atmosphere forming unit is made of an inner wall element and an outer wall element with a hollow space section in between. The bonding arm side of the inner wall element has an inside open space which is wider than the portion of the bonding arm where the capillary is attached, and gas ejection ports are formed in the inner wall element. A gas supply pipe is connected to the outer wall element to supply, for instance, a reducing gas into the hollow space section.

Abstract: A flow path structure is provided with: a first flow path member having a plurality of through grooves, the through grooves being disposed adjacent to each other; a second flow path member having a fitting portion, in the fitting portion the first flow path member being fitted; a third flow path member covering the fitting portion so as to be sealed, the third flow path member being provided on the second flow path member; an inflow port to receive a fluid; an outflow port to exhaust an exhaust fluid; and a flow path formed in the fitting portion along the first flow path member, the flow path linking the inflow port and the outflow port and running through the through grooves.

Abstract: In an ultrasonic joining method for joining a flange portion of a first member to a portion of a second member, a first horn and a second horn are arranged on the flange portion on a side opposite to the second member, and the first horn is vibrated in a condition that the second horn is biased against the first horn and the first horn and the second horn are pressed against the flange portion such that the flange portion is vibrated while being pressed against the portion of the second member. Because the first horn is vibrated in a condition that the first horn and the second horn are pressed against each other at press-contact portions thereof, vibration of the first horn is transferred to the second horn through the press-contact portions.

Abstract: A ball forming device and method used in a bonding apparatus, including a bonding arm, a capillary attached to the bonding arm, an electronic flame off probe for forming a ball at the tip of a wire passing through the capillary, and a gas atmosphere forming unit for bringing the vicinity of the tip end of the wire into a gas atmosphere. The gas atmosphere forming unit is made of an inner wall element and an outer wall element with a hollow space section in between. The bonding arm side of the inner wall element has an inside open space which is wider than the portion of the bonding arm where the capillary is attached, and gas ejection ports are formed in the inner wall element. A gas supply pipe is connected to the outer wall element to supply, for instance, a reducing gas into the hollow space section.

Abstract: Connecting elements and methods for the electrical connection between a light-weight metal conductor and an electrical contact, in particular for use in motor vehicles are disclosed. A metal sleeve is cold welded to the conductor. A contact element is connected to the metal sleeve in an electrically conductive manner and can be connected to the contact. A hardenable liquid seals, in a gas-tight manner, a contact element-side opening in the metal sleeve cold welded to the light-weight metal conductor.

Abstract: A low profile semiconductor package is disclosed including at least first and second stacked semiconductor die mounted to a substrate. The first semiconductor die may be electrically coupled to the substrate with a plurality of stitches in a forward ball bonding process. The second semiconductor die may in turn be electrically coupled to the first semiconductor die using a second set of stitches bonded between the die bond pads of the first and second semiconductor die. The second set of stitches may each include a lead end having a stitch ball that is bonded to the bond pads of the second semiconductor die. The tail end of each stitch in the second set of stitches may be wedge bonded directly to lead end of a stitch in the first set of stitches.

Abstract: The invention relates to a multifunctional printed circuit board comprising at least one additional functional element in the form of a round or rectangular conductor which is at least partially fastened on an electrically conducting strip conductor structure by ultrasound or friction welding in a mechanical and electrical and thermally conducting and planar manner and in such a fashion that an intermetal compound is formed. The invention also relates to a method for producing said printed circuit board, to its use as a wiring element for complex structures that is suitable for high current conduction and to uses for a specific thermal management.

Abstract: A thermal management device suitable for use as an electronic chassis includes a monolithic, monocoque body having integrally formed channels for carrying thermal energy away from a heat source, such as electronic components. The device may be fabricated using additive/subtractive manufacturing processes such as ultrasonic consolidation.

Abstract: An improved member for use in welding seamed flexible belts to produce smoother seams having reduced seam thickness. The improved member has a unique configuration, that includes a ridge defined at an end of the member and further includes a V-shape groove or cut defined in the ridge, which helps facilitate welding of the seam overlap region.

Abstract: An ultrasonic welding member for use in welding seamed flexible belts to produce smoother seams having reduced seam thickness. The ultrasonic welding member has a unique configuration, that includes an increased tip surface formed in such a manner that more energy from the horn is dispersed over the seam overlap region for a longer duration of time to produce a smoother and thinner weld.

Abstract: Cell frame for high-pressure water electrolyzer and method of manufacturing the same. According to one embodiment, radial openings in a water electrolyzer frame are provided by laminating half-frames, one or both of which contains grooves that may be formed by molding, machining or die-cutting. Another to another embodiment, radial openings are provided by laminating three or more thin frame portions, the center piece of which may include transverse slots that may be made by molding, machining or die-cutting. According to yet another embodiment, two or more frame portions are provided, at least one of which includes a recess for receiving a porous structure. The frames of the present invention can be additionally laminated to the membrane and electrode assembly, as well as the bipolar separator plate in the perimeter or seal area, comprised of the same or similar material as the frame, to form unitized electrolyzer stack subassemblies or full assemblies.

Abstract: A method of ultrasonic brazing metal matrix composite, which forms a reinforced composite bond without filling welding wire with reinforcement or adding alloy element to generate ceramic phase, includes the steps of setting a filler metal; introducing ultrasonic vibration to braze in air; dissolving the base materials, and introducing ultrasonic wave again. The method performs the aluminum brazing at low temperature. The periodic time of brazing is shorter and the cost is lower than the conventional brazing methods. The strength, service temperature and dimensional stability of the joint are close to the base article.

Abstract: A ball-bump bonded ribbon-wire interconnect has a ball-bump attached to an integrated circuit's bond pad. A ribbon-wire has one end attached to the ball-bump and its opposing end attached to a substrate's metallized surface. The ribbon-wire may be wider than the ball-bump, and the ball-bump may separate the ribbon-wire from the integrated circuit's surface. The ribbon-wire may interconnect multiple integrated circuits, each of which has a ball-bump or a suitably wide metallized surface, to a substrate's metallized surface. The present invention also includes a method of electrically connecting an electronic component to a substrate.

Abstract: There is provided an electronic component mounting apparatus including: a component holder which holds an electronic component; a pressing unit which applies pressure to the held electronic component through the component holder; and an ultrasonic transducer which applies ultrasonic vibration to the held electronic component through the component holder. The component holder includes a horn at one end of which is mounted the ultrasonic transducer and a holding tool which is fixed to the other end of the horn by using bolts and holds the electronic component. The horn has a surface A1 and a surface A2 at the other end and the holding tool has a surface B1 in intimate contact with the surface A1 and a surface B2 in intimate contact with the surface A2.

Abstract: A bonding apparatus comprising a bond arm and a wire bonding tool mounted to the bond arm is provided with thermal insulation in the form of a thermal shield substantially enclosing the bonding tool for insulating the bonding tool from ambient heat.

Abstract: A joining component is joined to a joint component. The joining component includes an insertion hole and two fitting holes. The joint component includes a fusible shaft at a position corresponding to the insertion hole and two protrusions at positions corresponding to the fitting holes. The joining component is placed on the joint component such that the fusible shaft is inserted into the insertion hole, and the protrusions fit into the fitting holes. The fusible shaft is then fused by using ultrasonic vibrations.

Abstract: The invention concerns a method for welding electric conductors using ultrasound, whereby the conductors (32) are introduced into a compression chamber (30) that is bounded by at least two boundary elements and are welded after the compression chamber is closed, whereby ultrasound is applied via a sonotrode (16) and the conductors to be welded are pressurized, preferably via a counter electrode. In order to be able to check the quality of the welding site using simple measures, it is proposed that after welding (32) the conductors, the compression chamber (30) is decompressed and then an ultrasound pulse is applied to the welded conductors with simultaneous application of pressure to these, and subsequently the spacing difference between the sonotrode (16) and the counter electrode (18) is measured.

Abstract: The invention concerns an ultrasonic welding device, which is more fully integrated by adjacent components of coupling surface. In order to permit a adequately fixed connection between the components, while, at the same time simplifying the mounting, it is suggested that at least some of the integrated components (30, 34) are structured in their coupling surfaces (40, 42), which lie on top of each another, for the achievement of a form closure.

Abstract: One aspect relates to a bonding apparatus for producing a bonding connection between a bonding wire and a bonding partner. The bonding apparatus includes a heel shaper, which is provided for avoiding damage to the bonding wire in the heel region during the bonding operation. One aspect relates to a method for producing a bonding connection by means of a bonding apparatus having a heel shaper and a bonding stamp. The heel shaper is situated relative to the bonding stamp in a first active position or can be moved into such a first active position. In the first active position, the heel shaper ensures that the bonding wire runs in a permissible region in the heel region.

Abstract: A bonding tool for bonding a fine wire to a substrate, said bonding tool comprising an at least substantially cylindrical portion having a concentric capillary therein through which the fine wire runs; a working tip portion formed at an end of the cylindrical portion being tapered towards the tip thereof, said working tip portion having an annular chamfer at the tip thereof; wherein the concentric capillary opens into the annular chamfer of the working tip, and wherein the diameter of the cylindrical portion decreases consecutively at a plurality of discrete intervals along the length of the cylindrical portion towards the working tip portion.

Abstract: The semiconductor device bonding apparatus 1 of the present invention includes: a pressing member 15 that presses the semiconductor device 10 toward the substrate 11 side in a state where a bump 14 is provided between the semiconductor device 10 and the substrate 11; an ultrasonic vibration applying member 16 that vibrates the semiconductor device 10 and the substrate 11 relatively by applying an ultrasonic vibration to at least one of the semiconductor device 10 and the substrate 11; a time measuring member 17 that measures a required time period from a time when starting to apply the ultrasonic vibration to a time when the semiconductor device 10 is pressed a predetermined distance; and a controlling member 18 that controls an output of an ultrasonic vibration during subsequent bonding, based on the time period measured by the time measuring member 17.

Abstract: The present invention provides a bonding method in which a bonded portion having a sufficient bonding strength can be obtained at a relatively low temperature, for example, in die bonding a semiconductor chip. A metal paste 20 was applied to a semiconductor chip 10, the metal paste 20 consisting of metal powder of one or more kinds selected from gold powder, silver powder, platinum powder, and palladium powder having a purity not lower than 99.9 wt % and an average particle diameter of 0.005 ?m to 1.0 ?m and an organic solvent. After being applied, the metal paste 20 was dried in a vacuum in a dryer. The chip was heated at 230° C. for 30 minutes to sinter the metal paste, by which a metal powder sintered compact 21 was formed. Next, a nickel plate 30 was placed on the semiconductor chip 10, and bonded to the semiconductor chip 10 by heating and pressurization.

Abstract: The invention relates to method for producing a connecting passage node or end node which has a rectangular shape in cross section and consists of electrical conductors. The nodes are produced by compacting and subsequent welding of the conductors by means of ultrasound in a compression chamber of the ultrasound welding machine of which the height and width can be adjusted and which has a rectangular shape in cross section, wherein opposite delimitation surfaces of the compression chamber form sections of a sonotrode and an opposite counter electrode, respectively. To connect electrical conductors which are difficult to weld to an end node and/or connecting passage node, the conductors (50, 52, 54) are brought into a sleeve and, subsequently, the sleeve (62, 65) is welded with the conductors in the compression chamber to form the end node and/or connecting passage node (49) having a rectangular cross section.

Abstract: A tool head for attaching an electrical conductor on the contact surface of a substrate, comprising a vibration exciter for generating linear ultrasonic vibrations; a bonding tool that is able to contact the contact surface and/or the conductor, a contact pressure being able to be applied to the conductor in the direction of the contact point via the bonding tool, and the conductor is able to be welded onto the contact point with the aid of the ultrasonic vibrations able to be transmitted to the contact point and/or the conductor in this manner; and a vibration conductor absorbing the linear ultrasonic vibrations of the vibration exciter; a converter being provided between the vibration conductor and the bonding tool to convert the linear vibrations into radial vibrations in such a way that the bonding tool is able to be incited to rotary vibrations.

Abstract: A wire-bonding method for a wire-bonding apparatus is provided. The wire-bonding apparatus includes at least a first wire-bonder and a second wire-bonder for respectively bonding at least several first chips in a first region and several second chips in a second region on a substrate simultaneously. The wire-bonding method includes following steps. First, initial position coordinates of the first region and the second region are obtained. Next, it is determined whether a space between the first region and the second region is greater than a predetermined space. When the space between the first region and the second region is greater than the predetermined space, the first wire-bonder and the second wire-bonder respectively bond the first chips and the second chips simultaneously.

Abstract: A horn-holder pivot type bonding apparatus including a horn holder for holding an ultrasonic horn, and a motor for driving the horn holder to pivot, with an imaginary pivot point of the horn holder being positionally fixed on a bonding surface. The motor is provided substantially in the center of the upper portion of the horn holder. The horn holder is formed with circular arc sections in the forward and rearward portions with respect to the imaginary pivot point; and a bonding head has, at portions corresponding to the circular arc sections of the horn holder, forward and rearward cams so that the cams are pivotable by supporting shafts. The forward and rearward cams have circular arc sections that contact the circular arc sections of the horn holder, the circular arc shape of the circular arc sections of the forward and rearward cams being centered on the supporting shafts.

Abstract: An example of the invention is a method of manufacturing a semiconductor device including, pressing a part of the connection conductor having a plate-like shape or a belt-like shape against a lead terminal which is formed on a lead frame, is formed into a thin and long plate-like shape, and is supported only at one end in a longitudinal direction of the terminal, in such a manner that the part of the conductor is brought into contact with the lead terminal, and applying ultrasonic vibration substantially in the longitudinal direction in a plane perpendicular to the pressing direction to the connection conductor in the state where the part of the connection conductor is pressed against the lead terminal.

Abstract: The invention relates to a method of producing electrical connections for an electrical energy storage unit (10), said unit employing at least one electrical energy storage element (70) placed inside a casing (20?), said casing having at least one cover (30, 40) containing the electrical energy storage element (70) in a main body (20) of the casing, said element (70) and said cover (30, 40) each having a current collector means, which method is characterized in that it includes at least one step of depositing gallium on one or other of the current collector means and a step of assembling two current collector means separated by the gallium coating followed by a diffusion brazing step carried out by the disposition and the pressing of a mass heated to a given temperature on the unit formed by two current collector means, the unit being brazed for a given time in order to produce the electrical connection for the electrical energy storage unit.

Abstract: A substrate is electrically connected with an electrical device mounted on the substrate. A ball bond is formed between a first end of a wire and a bonding pad of the substrate. A reverse-motion loop is formed within the wire. A bond is formed between a second end of the wire and a bonding pad of the electrical device.

Abstract: The present invention relates to a device for ultrasound welding of at least two overlapping sheets, comprising: at least one sonotrode for emitting ultrasound, at least one reaction part disposed at least partially facing the sonotrode, at least one intermediate wall other than a roller, movable relative to the at least one sonotrode and the reaction part, said intermediate wall at least partially defining a gap in which the sheets to be welded are inserted so as to execute at least one seal weld extending parallel in the direction of movement of the intermediate wall at the gap. At least one of the intermediate wall and the sonotrode has a transverse section comprising at least one relief projecting toward the gap.

Abstract: Apparatus for use in welding a pour spout fitment (22) to a container (32) comprises an ultrasonic welding horn (18) formed with a recess (20) at one end for receiving part of the fitment (22), an anvil (2) between an annular surface portion of which and that one end of the horn (18) are vibratingly pressed a wall off the container (32) and the flange (28) to each other, a head (14) at the opposite end of the head (14) for maintaining an annular, radially inner portion of the flange (28) spaced axially outwards from the annular surface portion of the anvil (2), the outer periphery of the ring (16) being radially dimensioned to be received in the recess (20).

Abstract: An ultrasonic stir welding device provides a method and apparatus for elevating the temperature of a work piece utilizing at least one ultrasonic heater. Instead of relying on a rotating shoulder to provide heat to a workpiece an ultrasonic heater is utilized to provide ultrasonic energy to the workpiece. A rotating pin driven by a motor assembly performs the weld on the workpiece. A handheld version can be constructed as well as a fixedly mounted embodiment.

Abstract: In an bonding apparatus, a piezoelectric element 4 being built into the vicinity of the capillary attachment portion of a bonding arm 1 so that the capillary 3 can be caused to vibrate in the axial direction of the bonding arm 1. The preparatory pressure application device that applies a preparatory pressure to the piezoelectric element 4 includes two wedge-form attachment bases 5 and 6 which are disposed to the rear of or behind the piezoelectric element 4, and a preparatory pressure bolt 7 which is screwed into the wedge-form attachment base 6 from the outside of the bonding arm 1; and a preparatory pressure is applied to the piezoelectric element 4 by the movement of the wedge-form attachment base 5 in the axial direction of the bonding arm 1 caused by the rotation of the preparatory pressure bolt 7.

Abstract: A device for printing at least one web that is driven continuously through said device, in addition to a method for printing said web. At least one unit is integrated into the device for the continuous transfer of individual transponders or transponder parts, which operate according to the radio frequency identification principle, from at least one continuous carrier belt to the web. During said process, the running speed of the carrier belt is adapted to the running speed of the web, the latter speed being predetermined by the printing process. A connection device connects the transponders or transponder parts to the web in a predetermined section of the carrier belt and the web, when the speeds have been synchronised.

Abstract: An apparatus and method for automatically controlling a clamp gap between clamping arms of a wire clamp is provided wherein a motor generates an actuation force for moving the clamping arms relative to each other. A resilient member is positioned such that the actuation force acts upon and flexes the resilient member to an extent that is proportional to the clamp gap, and the clamp gap is controlled by adjusting the amount of actuation force according to a predetermined relationship between the actuation force and the clamp gap.

Abstract: Component 3 is pressed onto a circuit board 4 so that their respective metal interconnects 5, 6 are in close contact with each other, and ultrasonic vibration is applied to the suction nozzle 14 holding the component 3. Friction is thereby generated between metal interconnects 5, 6 whereby the component 3 is bonded on circuit substrate. Suction nozzle 14 for handling components is made of stainless steel and has a working face 14a provided with a hardened layer 14b, or alternatively, suction nozzle 14 may have a suction head 14c having a working face 14a made of cemented carbide. Working face 14a of suction nozzle 14 is refined by polishing as required during the mounting operation.

Abstract: The invention refers to a procedure for consolidating and sealing a tube, whereby the tube is positioned between a sonotrode and an associated anvil of an ultrasonic welding device, the sonotrode being activated and displaced relative to the counter electrode for consolidating and sealing the tube. In order to enable automatic consolidating and sealing of a tube without individually entering the data of the tube into an ultrasonic welding device in advance, the following steps are proposed: positioning the tube and fixing it between the sonotrode and counter electrode, determining a characteristic variable of the tube with the tube being fixed between the sonotrode and counter electrode, retrieving stored welding parameters on the basis of the characteristic variable and activating the sonotrode and moving the sonotrode and counter electrode in relation towards each other for consolidating and sealing the tube.

Abstract: According to an aspect of an embodiment, a wire bonding method includes vibrating a capillary of a bonding head, the capillary having a heater attached thereto at a position corresponding to a node of vibration of the capillary generated by the vibration heating the capillary with the heater and performing a wire bonding operation while heating the capillary with the heater.

Abstract: A method of manufacturing an ultrasonic welding-based microfluidic device, the method including: forming a bottom board having two welding stoppers formed right and left and having a certain height and a certain interval; forming a top board having two energy directors formed with an interval greater than the interval between the two welding stoppers; putting the top board on the bottom board to locate the energy directors at the outside of welding stoppers, respectively; and welding the top board to the bottom board by using ultrasonic welding, wherein a channel is formed between the two welding stoppers without additional energy directors. Accordingly, it is possible to prevent a phenomenon that a fluid irregularly flows due to an uneven surface formed on a side of the channel while the energy directors are melted.

Abstract: A bonding apparatus such as an ultrasonic transducer is provided that comprises an oscillation amplification device having a longitudinal axis and a substantially triangular cross-sectional area on a plane that is orthogonal to the longitudinal axis. An ultrasonic driver is coupled to the oscillation amplification device at a first position along the longitudinal axis and a bonding tool is mounted to the oscillation amplification device at a second position along the longitudinal axis spaced from the first position.

Abstract: A bonding device and method for producing a bonding connection is disclosed. One embodiment provides a bonding stamp and an ultrasonic generator coupled thereto. The ultrasonic frequency and an effective length, which is given by the distance between the lower end of the bonding stamp and the coupling location of the ultrasonic generator at the bonding stamp in the vertical direction, are coordinated with one another in such a way that the following holds true: 0.9 · n · c 2 · l ? f ? 1.1 · n · c 2 · l where c is the speed of the ultrasound in the bonding stamp at the frequency f, and n=1 or 2 or 3 or 4.

Abstract: One aspect relates to a bonding apparatus for producing a bonding connection between a bonding wire and a bonding partner. The bonding apparatus includes a heel shaper, which is provided for avoiding damage to the bonding wire in the heel region during the bonding operation. One aspect relates to a method for producing a bonding connection by means of a bonding apparatus having a heel shaper and a bonding stamp. The heel shaper is situated relative to the bonding stamp in a first active position or can be moved into such a first active position. In the first active position, the heel shaper ensures that the bonding wire runs in a permissible region in the heel region.

Abstract: An ultrasonic welding method and an ultrasonic welding device are provided to join a first member having a substantial pipe shape and a second member at a joining surface by pressure-applying and vibration-exciting. In an arranging process, each of a first horn member and a second horn member is slantways arranged in such a manner that a part of a pressure-applying surface thereof which is nearer to a division surface thereof becomes nearer to the joining surface, according to deformation in a joining process. Thus, in the joining process, the pressure-applying surfaces are disposed substantially parallel to the joining surface due to a pressure-applying reaction force, so that the first horn member and the second horn member can be pressed against each other at the division surfaces thereof.

Abstract: A joining method of the present invention includes conducting friction-stir-welding of members to be joined, to form a joint; and then conducting melt-welding or resistance-welding of the joint, wherein the friction-stir-welding of members to be joined is conducted while flowing an inert shielding gas, or the melt-welding or resistance-welding of the joint is conducted while applying an ultrasonic wave.

Abstract: An automatic chamber evacuating method, system, and apparatus are disclosed, which include a nest, wherein a region or chamber, such as for example the reference chamber of an absolute pressure sensor, may be placed. A switch is used to initiate an automatic process whereby an air operated chuck seals to a tubular region protruding from the chamber via compressed air. An evacuating device connected to the tubular region by the chuck then applies a vacuum which evacuates the chamber. When the chamber has been sufficiently evacuated a message is sent to a programmable logic controller which then outputs a signal to an ultrasonic welding apparatus. The ultrasonic welder crimps and seals the tubular region thereby quickly and efficiently creating a permanent vacuum in the chamber.

Abstract: An auxiliary control apparatus mechanically couples forces exerted on a manually operable auxiliary hand control knob to an input member of a micro-manipulator of the type used to move a point of an object such as an ultrasonic bonding tool tip relative to a workpiece in scaled ratios of motions at an end of the micro-manipulator input member. The apparatus includes a 4-bar parallelogram linkage which is mounted to a structural support member of a micro-manipulator, and which includes a rear laterally disposed lateral linkage bar pivotably connected to inner and outer parallel longitudinally disposed linkage bars which are pivotably coupled at front ends thereof to a front laterally disposed linkage bar.

Abstract: A sonotrode (33) for machining workpieces and a method for the operation of the sontotode. The sonotrode enables workpieces to be cut (1) and welded (5) simultaneously in a single work process. This results in substantially higher quality machined workpieces in comparison with the prior art. Cutting and welding occur in parallel in a single process.

Abstract: A substrate is electrically connected with an electrical device mounted on the substrate. A ball bond is formed between a first end of a wire and a bonding pad of the substrate. A reverse-motion loop is formed within the wire. A bond is formed between a second end of the wire and a bonding pad of the electrical device.

Abstract: A semiconductor manufacturing apparatus operable to simultaneously apply supersonic vibration to two bonding sites located at different heights to simultaneously perform bonding of the two bonding sites, the apparatus includes: a cylindrical body; a first protrusion provided on an outer peripheral surface of the cylindrical body and receiving supersonic vibration propagated through the cylindrical body; and a second protrusion provided on the outer peripheral surface of the cylindrical body and receiving supersonic vibration propagated through the cylindrical body. A distance between an axial center of the cylindrical body and the tip of the first protrusion is generally equal to the distance between the axial center of the cylindrical body and the tip of the second protrusion. A tip surface of the first protrusion and a tip surface of the second protrusion are on different planes, respectively.

Abstract: A packaging method includes ultrasonically bonding a semiconductor device and a substrate together via bumps that include gold as a main component thereof. A contact surface of a primary bump on a surface of an aluminum pad on one side of the substrate contacts and is ultrasonically bonded to a distal end surface of each opposed secondary bump on one side of the semiconductor device. An area of the contact surface is larger than that of the opposed distal end surface. By this method, damage to the substrate from the ultrasonic can be reduced without using a reinforcing layer.