Abstract: The present invention provides an apparatus for laser cutting that comprises a rigid support table frame having a X-axis and a Y-axis, and one or more bridge rail modules running across the Y-axis of the table frame, each bridge rail module comprising at least one hold-down device module. The present invention further provides a process for laser cutting a metal plate using this apparatus.

Abstract: A wet-etching jig, which is a wet-etching jig that holds a plate workpiece when the workpiece is wet-etched, includes: a holding unit configured to include a suction unit in which a suction port is formed for absorbing the air and a first close contact unit that is provided to surround the suction unit and that can closely contact a first surface of the workpiece to surround a predetermined region of the first surface; an exhaust path that communicates with the suction port; and a check valve that is provided in the exhaust path to intercept a flow of the air in a direction toward the suction unit and to permit a flow of the air from the suction unit.

Abstract: A secondary battery, a jig suitable for fabrication of the secondary battery, and a method for producing a secondary battery constructed with a case accommodating the electrode assembly. The case includes a front portion terminated along opposite edges by a first wing portion and a second wing portion, and a back portion positioned opposite to the front portion, with insulating film bent along a length of a junction between the front portion and each of the first wing portion and the second wing portion, a pair of holes in the insulating film are held in parallel alignment with respect to the length of the junction, with the insulating film adhering to and covering the front portion and a corresponding one of the first wing portion and the second wing portion, in order to prevent leakage of electrolyte, and resulting corrosion of the electrically conducting metal components of the secondary battery.

Abstract: A drawing apparatus which performs a drawing process on a substrate includes a holding plate having a holding surface configured to be opposed a back surface of the substrate, a vacuum suction port formed in the holding surface and configured to attract the substrate to the holding surface by vacuum suction, and a plurality of Bernoulli suction ports formed in the holding surface and configured to attract the substrate to the holding surface by Bernoulli suction. The holding surface includes a circular region disposed concentrically with the center of the holding surface, and an annular region disposed concentrically with the circular region. At least one of the Bernoulli suction ports is disposed in the circular region, and at least one of the Bernoulli suction ports is disposed in the annular region.

Abstract: A liquid crystal coating apparatus includes a liquid crystal spraying head for coating a liquid crystal material on a color filter (CF) substrate with a sealant to allow the liquid crystal material to be coated within an area surrounded by the sealant; and a supporting stage for accommodating and fixing the CF substrate. The supporting stage is provided with a vibrating mechanism for driving the CF substrate to mechanically vibrate continuously so that the liquid crystal material can become uniformly diffused quickly. In the present disclosure, the vibrating mechanism is activated after coating of the liquid crystal material is completed to drive the CF substrate to mechanically vibrate continuously; and is deactivated once the liquid crystal material is diffused uniformly. Therefore, the liquid crystal material can become uniformly diffused quickly, which guarantees the displaying performance of the final products and improves the production efficiency.

Abstract: A support unit for moving an object may include an elongated member, at least one suction device coupled to the elongated member for attaching to an object, a lifting mechanism for raising and lowering the elongated member and an attached object, and a rotating member for moving the support unit and the attached object from a departure location to a destination location.

Abstract: Embodiments of the invention provide a thermal processing system and methods for uniformly heating and/or cooling a semiconductor wafer. Embodiments of the invention may be applied to provide a more uniform temperature profile when processing 300 mm and larger wafers having different curvature profiles that occur at the same and/or different points in a manufacturing cycle. Wafer curvature can be dependent on the number and thickness of the metal layers.

Abstract: Methods and systems, in one embodiment, are described related to a chuck with a plurality of vacuum grooves on a surface. Each single vacuum groove of the plurality of vacuum grooves has a single port connected with a single vacuum line coupled to a vacuum source. The single vacuum line is not shared with another groove and a restriction is applied to the single vacuum line in order to isolate each single vacuum groove.

Abstract: A non-contact holding device (1) attached to a parallel mechanism robot (100) has a square plate-like base member (10), a Bernoulli chuck (20) attached to the center on a rear surface of the base member (10), and eight pin-like guide members (30) that are disposed facing each other with the Bernoulli chuck (20) therebetween and that are provided on the rear surface of the base member (10) in a protruding manner. The guide members (30) facing each other are configured to be able to move away from each other. These guide members (30) move away from each other along inner surfaces of guide holes (72) of a workpiece mounting tray (70, 71) as the Bernoulli chuck (20) approaches a workpiece mounting surface (75) of the workpiece mounting tray (70, 71).

Abstract: Apparatus for treating a workpiece has first and second regions at least partially enclosed by a casing and in communication via a passage, and support means for a carrier holding the workpiece in the first region for treatment. Pressure difference between the regions forces the workpiece toward the carrier and guides a flow of media from the first to the second region through the passage, at least partly, to create said pressure difference. Method for treating at least one workpiece holds the workpiece by forcing it toward the carrier with a created pressure difference between two regions. Holding also guides a flow of media from the first region to the second region through the passage in order to, at least partly, create said pressure difference. The treatment may comprise blasting, rinsing or drying. The workpiece may comprise cutting inserts, electronic components, small sized machined or formed components or parts.

Abstract: In one embodiment, a substrate frame suction apparatus includes a body having at least one top-side opened chamber, a suction plate to cover a top of the at least one chamber, and a pressure adjustment device connected to the at least one chamber and configured to adjust a pressure in the at least one chamber.

Abstract: The present invention provides a component supporting device which has: a platform, a vacuum system, a gas supply system and a discharger system. The platform has a supporting surface, a bottom surface and at least one through hole, and the through hole passes through the supporting surface and the bottom surface. The vacuum system provides a vacuum suction to the through hole. The gas supply system is used to output at least one type of gas to the through hole. The discharger system ionizes the gas into an ion fluid. Thus, the through hole can be used to provide the vacuum suction for supporting and sucking a component, or to provide the ion fluid when releasing the vacuum suction for more efficiently, uniformly and rapidly removing static electricity on a surface of the component.

Abstract: An apparatus and method for presenting a substrate/print media having favorable surface conditions and optimum spatial orientation for printing purposes. The apparatus/method includes a mechanism for maintaining the substrate/print media in a substantially orthogonal spatial orientation relative to the direction of ink deposition, and a pressurization device for developing a pressure differential across a face surface of the substrate/print media such that positive pressure is applied to a surface opposing the face surface. The pressurization device provides a cushion of air to support the substrate/print media during ink deposition. The apparatus/method may further include a system for transporting the substrate/print media beneath or across a print head assembly for in-line printing on a mailpiece.

Abstract: There is provided a vacuum tray including a pocket part; a seating part being stepped downwardly from a bottom surface of the pocket part and having a light emitting device seated therein; and a cavity part being stepped downwardly from edges of the seating part and having an electrode terminal of the light emitting device accommodated therein. The pocket part may include a plurality of pocket parts having a matrix structure, such that the plurality of pocket parts are arranged in columns and rows.

Abstract: A three piece vacuum cup is made from rubber to resist damage and facilitates reconfiguring when badly damaged or for specific applications. The vacuum cup includes top, center, and bottom parts. The top is easily and inexpensively replaceable. A flexible lip seal surrounds the top edge of the top to seal against irregular surfaces and damage to the lip seal may be addressed by inserting a cord seal into slots in the top to form a second seal. Part of the top may be cut away to use with small parts and sealed using the cord seal. The center includes a family of passages which may be selectively blocked to permit use of partial tops. A bar pattern on the top has bars aligned in perpendicular directions to better hold material in all cutting directions.

Abstract: A system which includes a sacrificial board such as a cement board and containment support lid, sometimes referred to as a saw cup, is provided for use with a vacuum hold down support to allow cutting on top of normal suction cups by providing a temporary scorable surface in an assembly that is easily installed and removed, inexpensive to own, use and handle and which enables a user to go directly back to using a CNC machine for final edging and processing of the material without having to go to another location for sawing and without having to deal with heavy and unwieldy plates. The dimensions of the cement board and containment lid are such that any penetration of the cutting blade is intentional and will result in controlled scarring of the cement board which does not disable continued use of the saw cup. A one-piece molded saw cup is also illustrated.

Abstract: The invention is a clamping plate used to stiffen and hold a large, thin workpiece having low inherent stiffness. The clamping plate has a back layer, an intermediate layer and a contact layer. A plurality of grooves, which serve as air channels, is provided in the contact layer and the intermediate layer impart flexibility to the clamping plate. The clamping plate has sufficient flexibility to adapt to the specified contour of the workpiece. The contact layer is placed against the workpiece and vacuum apparatus provides suction through the air channels, which are in flow communication with each other between the two layers, to hold the workpiece against the clamping plate. One or more seals defines a holding area on the contact layer and prevent loss of suction.

Abstract: The present invention relates to a vacuum gripper and in particular to a vacuum gripper for gently gripping work-pieces having sensitive surfaces, such as solar cells, wafers, or panels for flat screens, and for gripping heavy glass plates or plates made of other material having a very smooth surface that are stacked on top of each other and should be removed from above, wherein the vacuum gripper has the following characteristics: a straight or curved gripper plate (2), at least one suction opening (3; 3a), which is provided in the gripper plate (2), wherein a workpiece throttle surface (6) is formed around the suction opening (3), at least one recess (4), which is provided in the side of the gripper plate (2) facing the workpiece, outside of the workpiece throttle surface (6) relative to the suction opening (3), and at least one ventilation hole (5), which is provided within each recess (4).

Abstract: Embodiments of the invention provide a thermal processing system and methods for uniformly heating and/or cooling a semiconductor wafer. Embodiments of the invention may be applied to provide a more uniform temperature profile when processing 300 mm and larger wafers having different curvature profiles that occur at the same and/or different points in a manufacturing cycle. Wafer curvature can be dependent on the number and thickness of the metal layers.

Abstract: In the course of a method for handling a workpiece having at least one through-opening, at least one suction element and the workpiece are placed against each other to form a suction chamber. A vacuum is generated in the suction chamber in order to fix the workpiece and the suction element to each other with a holding force for subsequent manipulation of the workpiece. The workpiece and the suction element are fixed to each other with a holding force by at least partially providing at least one through-opening of the workpiece opening into the suction chamber with a covering in order to reduce the flow of air through the through-opening to the suction chamber after the vacuum has been generated. A workpiece handling system is used to carry out the above-mentioned method.

Abstract: The present invention is a method for using a universal support consisting of one or more modules having a deformable enclosure (3) connected to a vacuum source (5) through an orifice. Said enclosure is of concave shape forming a chamber (6) provided with a flexible body (7). The method consists in the following series of steps: applying a vacuum to the chamber (6) so that the deformable enclosure (3) collapses; positioning the part which is to be supported; breaking the vacuum in the chamber (6); and applying a vacuum inside the deformable enclosure (3).

Abstract: The present invention concerns a device for transporting substrates through vacuum chambers, especially coating machines with a substrate carrier on or at which the substrates can be arranged, wherein the substrate carrier has at least one guide rail which extends along at least one side of the substrate carrier, and wherein the guide rail is kept spaced apart from the substrate carrier by one or just a few spaced bearings.

Abstract: An electrode transporter is provided comprising a transporter frame, a plurality of transitional support elements, and a plurality of flipside support elements. The flipside support elements are configured to immobilize an electrode along a gravitational force vector normal to a major face of an electrode positioned in an electrode accommodating space defined by the transitional support elements and the flipside support elements. The transitional support elements are configured to transition back and forth from a secured state, where the electrode is further immobilized along an opposing force vector opposite the gravitational force vector, to an unsecured state where the electrode is relatively mobile along the opposing force vector. Additional embodiments relate to the use of a transporter tripod and an electrode removal puck and lifting fork to remove an electrode from the transporter frame.

Abstract: A wafer holding vacuum for a wafer polishing system and the wafer suction device for CMP (Chemical Mechanical Polishing) by utilizing existing resources provided by the rotating polishing post is provided. The device introduces a channel configured in the wafer suction device. One end of the channel is exposed at downside of the holding block, and another end of the tube is exposed at lateral side of the holding block. By aforementioned configuration, the channel can suck gas and/or liquid between the wafer and the device, and can discharge them to the outer environment at the lateral side using centrifugal force naturally provided by the polishing post.

Abstract: A substrate backing device 3 places and holds a rigid substrate 6 thereon and receives, from therebelow, a pressing force during operations for thermocompressively bonding a flexible substrate 8 thereto. The substrate backing device 3 includes a plate-shaped backing plate 4 provided with a backing support surface 4a adapted to come into contact with the lower surface of the rigid substrate 6 for supporting it. The backing support surface 4a is provided with an opening portion 4d having a planar opening shape encompassing the area of the rigid substrate 6 to be compressively bonded to the flexible substrate 8.

Abstract: The present invention is a substrate holding device including: a transfer arm body having a suction path; a pad body including a suction part having a suction surface and a suction port for holding the substrate by vacuum suction, and a cylindrical attachment part in which a suction hole communicating with the suction port is formed; a pad holding member provided with an insertion hole into which the attachment part of the pad body is loosely insertable and a communication path communicating with the suction hole and the suction path, and fixed to the transfer arm body; and an elastically deformable annular airtightness maintaining member with a circular cross-section interposed between an outer peripheral groove in an arc shape formed in the attachment part of the pad body and an inner peripheral groove in an arc shape formed at the insertion hole of the pad holding member.

Abstract: The invention relates to a holding device (1), especially for fixing a glass substrate during a cutting process. The holding device comprises a housing (2) and a plunger (3) which can be axially displaced in relation to the housing (2). The plunger has a first and a second end section (4, 5), the first end section (4) projecting from the housing (2) and having a suction element (6). The aim of the invention is inter alia to improve a known holding device in such a manner that the substrate can be approached and fixed almost without the application of force. The holding device (1) according to the invention is characterized in that the plunger (3) is received in the housing (2) by a pneumatic spring. A holding system (20) comprising a plurality of holding devices (1) is protected in a support plate (24), the support plate (24) having a vacuum channel collector (21) which is connected to vacuum channels (13) and which is connected to a common vacuum pump (14).

Abstract: A pneumatically actuated area vacuum gripper for gripping and, if necessary, separating workpieces is provided by the present disclosure. In particular, the vacuum gripper is used with thin, flexible workpieces, and has a suction chamber, which has a suction wall with perforations, to be placed on the workpiece. An ejector nozzle has a connection and an outlet, the ejection nozzle being connected to the suction chamber via its connection, and the outlet of the ejector nozzle opening to the outside or into an exhaust air duct, and the suction inlet of the ejector nozzle empties into the suction chamber, whereby the direction of the air stream in the connection coming from the suction chamber corresponds to the direction of the main air conveyance in the ejector nozzle.

Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.

Abstract: A chuck with triaxial construction comprises a receiving surface for a test substrate and arranged below the receiving surface: an electrically conductive first surface element, an electrically conductive second surface element electrically insulated therefrom, and an electrically conductive third surface element electrically insulated therefrom, and, between the first and the second surface element, a first insulation element and, between the second and the third surface element, a second insulation element.

Abstract: A wafer chucking apparatus for a plasma process includes a lower plate, on which a plurality of wafers are loaded, and an upper plate, which is coupled to an upper portion of the lower plate and fixes the loaded wafers. The upper plate is made of one of Teflon, ceramic and metal, and the lower plate is made of aluminum or ceramic. The lower plate includes a drilled gas feed hole through which gas is fed so as to uniformly maintain temperature of each wafer during the plasma process. One of more of an isothermal sheet and an isothermal coating layer is formed between the wafers and the lower plate so as to maintain temperature uniformity of the wafers. Thereby, the wafer chucking apparatus can improve uniformity of plasma-etched patterns at an edge zone of each wafer during the plasma process.

Abstract: A device (1) for positioning cutting particles (2a-c), including a receiver (4) that has a first receiving opening (5a) to receive a first cutting particle (2a), and a second receiving opening (5b) to receive a second cutting particle (2b), and comprising a unit or generator (7) for generating a holding force that affixes the cutting particles (2a; 2b) in the receiving openings (5a, 5b), and the holding force that affixes the first cutting particle (2a) in the first receiving opening (5a) can be adjusted independently of the holding force that affixes the second cutting particle (2b) in the second receiving opening (5b).

Abstract: Non-contact manipulating devices and methods can include a fluid distribution member including a first fluid port configured to dispense fluid and create a Bernoulli effect to attract an article to be manipulated by the manipulating device while maintaining a gap between the article and the fluid distribution member. The fluid distribution member can further include a second fluid port configured to dispense fluid to assist in maintaining the gap. The non-contact manipulating devices and methods can further include a controller configured to control a fluid flow through at least the second fluid port to help maintain the gap.

Abstract: A coating apparatus includes a driving unit configured to rotate a substrate holding member about a vertical axis to spread a coating liquid supplied on a front side central portion of a substrate toward a front side peripheral portion of the substrate by a centrifugal force. The apparatus is provided with a wobble damping mechanism including a gas delivery port and a suction port both disposed to face a back side of the substrate and configured to damp a wobble of the substrate being rotated by delivering a gas from the delivery port and sucking the gas into the suction port.

Abstract: A part mounting apparatus of the invention comprises: a pickup head having a pickup tool for picking up a part; a pickup head supporting unit for supporting the pickup head; a pickup head supporting arm having one end portion where the pickup head is disposed and an other end portion rotatably mounted to the pickup head supporting unit; a pickup head inverting unit for vertically inverting the pickup head with respect to the pickup head supporting unit; and a pickup tool rotating unit for rotating the pickup tool about a rotational axis of the pickup tool, wherein the pickup tool rotating unit includes driving force generating unit and driving force transmitting unit for transmitting a driving force of the driving force generating unit as a rotational force of the pickup tool, and the driving force generating unit is disposed on the pickup head supporting unit.

Abstract: Embodiments of the invention provide a thermal processing system and methods for uniformly heating and/or cooling a semiconductor wafer. Embodiments of the invention may be applied to provide a more uniform temperature profile when processing 300 mm and larger wafers having different curvature profiles that occur at the same and/or different points in a manufacturing cycle. Wafer curvature can be dependent on the number and thickness of the metal layers.

Abstract: A support section (28) for supporting a wafer (1) is convexly formed in the center of a receiving section (26) of a support groove (25) of a boat 21. At the time of boat loading of the boat (21), in which wafers (1) respectively received by the supporting sections (28) are aligned, from a standby chamber (33) to a processing chamber (14), the pressure in the standby chamber (33) and processing chamber (14) is set to 200 pascals or more, and 3000 pascals or less. By supporting the wafer upwards from the receiving section with use of the support section, even if peeling of the film on the wafer occurs from a large frictional force between the supported surface of the wafer and the support section under a reduced pressure, the particles from the peeling are caught by the receiving section and therefore particles are prevented from adhering to the IC fabrication surface of the wafer directly below the receiving section.

Abstract: A machine cell for the forming and joining of a first sheet material to a second sheet material includes an upper gate and a lower nest. The lower nest includes a vacuum pad having a recessed channel defined therein. A vacuum system is fluidly connected to the recessed channel to hold the first sheet material to the lower nest during the joining of the first and second sheet materials. The machine cell further includes an arrangement for aligning the first sheet material to the second sheet material.

Abstract: A workholding fixture for holding flat semiconductor substrates with a carrier, a holding body which is fixed or which can be fixed on the carrier with a holding side which faces away from the carrier and at least one negative pressure channel which penetrates the holding body with one suction end on the holding side, the holding side having a defined suction structure of soft material.

Abstract: A method of processing a substrate, including supporting a substrate using an air bearing produced via an air bearing assembly, the air bearing assembly having: an upper portion having a plurality of air supply and vacuum holes therethrough; a lower portion; and a plurality of spacers disposed between and maintaining the upper and lower portions in spaced relation, wherein a density of the air supply and vacuum holes is high enough to provide an air bearing for a substrate, but low enough such that at least one of: (i) a sufficient number of the spacers are employed, and (ii) the spacers are located in close enough proximity, to maintain a substantially uniform flatness of the upper portion relative to the lower portion.

Abstract: A separating device according to the present invention separates a support plate (14) from a substrate (12) of a laminate (10) including the substrate (12) and the support plate (14) bonded to each other. The separating device includes: a first storing section (20) for storing the laminate (10); a plurality of first processing sections (30) for reducing adhesive force of an adhesive (13) applied between the substrate (12) and the support plate (14); and a first carrying section (50) which is capable of moving in the first direction and carries the laminate (10) from the first storing section (20) to the first processing section (30) while holding the laminate (10). With the first carrying section (50), it is possible to provide a separating device (100) which moves straightly so as to carry the laminate (10).

Abstract: An exemplary lens holding apparatus includes a pipe, a number of hollow lens holding units, and an air pump. The pipe has an airtight end and an air vent end. The lens holding units each are in communicate with the pipe and each include a number of first portions and a number of second portions. The first and second portions are alternately arranged and each have an inner space for communicating each other. The second portions each have a top wall and a bottom wall. The top wall has a first through hole defined therein and in communicate with the inner space of the second portion. The air pump is connected to the air vent end and configured for pumping air from the pipe, such that lenses received in the first through holes are releasably held in position.

Abstract: The support system and method enables exact and preferably machine assisted manual location and height placement of a vacuum operated hold down with rigid pre-set support on a conventional working table. A height adjustable jack screw support with angularly flexible hold down enables a holding support engaging the bottom of a work piece even where a lower surface of the work piece has an irregular shape due to the ability of the upper cup support to passively tilt to engage the work piece.

Abstract: It is an object to provide a fixing jig which can unmovably suction a chip group produced by segmenting a semiconductor wafer into pieces, and can suction one chip by detaching the chip selectively and reliably from the chip group. A fixing jig 3 is composed of a jig base 30 and an contact layer 31. A concave part 2 is formed on one side of the jig base 30. The concave part 2 is sectioned into small chambers 15 by a partition 12 having a height almost equivalent to that of a sidewall 35. The contact layer 31 is disposed on the upper edge of the sidewall 35 and the partition 12 for covering the concave part 2. A through hole 17 that is communicated with the outside is formed in each small chamber 15.

Abstract: A holding unit for a panel transmitting device provided with a robot of an articulated joint type to hold a panel of various types and transmit between processes includes a supporting means and a plurality of moving means. An end of the supporting means is movably supported and fixed to the robot and the other end of which extends along a width direction of the panel. Each of the moving means is provided with a moving bar an end of which is provided at a side of the supporting means and is able to rotate and slide in a thickness direction and a width direction of the panel so that the other end thereof may hold the panel. With the unit, precise position adjustment can be achieved in a cost-effective manner.

Abstract: A diced wafer adaptor that includes: a cylindrical shaped inner portion, adapted to support and hold an annular frame and a membrane suspended within the annular frame and to apply vacuum to an outer portion of the membrane; wherein an inner portion of the membrane supports a diced wafer and is surrounded by the outer portion of the membrane; and an outer portion having a perimeter shaped substantially as a perimeter of a non-diced wafer.

Abstract: A chuck apparatus for holding a substrate is the disclosed. The chuck apparatus includes a first surface portion on which the substrate is to be held and a second surface portion adjacent to the first surface portion and extending at least partially around an edge of the first surface portion and which, in use, is arranged to deflect gas over the first surface portion and thus the substrate that is to be held on the first surface portion.

Abstract: A dunnage platform is in the general shape of a rectangular slab with legs extending form one side. The dunnage platform is made from an expanded polystyrene core. A chemical combination process is used to chemically combine portion of the core proximal to its surface with high impact polystyrene. In a first of two parts of the combination process, the core is placed in a forming mold with one of its two sides and two thirds of its thickness extending therefrom. A heated sheet of high impact polystyrene is brought into contact with the portion of the core extending from the mold. In a similar manner, the other of the two sides of the core is made to extend from the forming mold for contact with a heated sheet of high impact polystyrene.

Abstract: The present invention relates to a level compensator in a vacuum system including a fixing tube fixed to a structure, a hollow slider disposed in the fixing tube so as to move in a vertical direction, and a spring disposed between the fixing tube and the slider so as to elastically support the slider, in which a vacuum pump having an inflow port at one end, an outflow port at the other end, and an inhalation hole in a side wall thereof is mounted inside the slider. When compressed air guided to an upper opening in the slider passes between the inflow port and the outflow port and is discharged through a discharging port formed on the side wall of the slider, air is induced to the space inside the slider from the lower portion of the slider, and is discharged along with the compressed air.

Abstract: A vacuum hold down table includes a surface sheet having perforations arranged so as to reduce surface cracking when the surface sheet is subject to forces during use of the table; the perforations may also be arranged to that a greater hold down force is produced in that portion of the table where the workpiece will be located, this may be accompanied by varying the hole diameter and/or hole spacing.