Abstract: The present invention is directed to a plasma processor, and more specifically, to an apparatus to reduce or eliminate plasma lighting inside a gas line in a strong RF field in the plasma processor. More particularly, the present invention uses shielding and gas flow restricting to reduce or eliminate plasma lighting in a gas line used to deliver gas to cool the work piece in the plasma processor.

Abstract: A plasma chamber defining an evacuated interior environment for processing a substrate includes a substrate support, an apertured gas distribution plate in spaced facing relationship to the substrate support, and adapted to flow process gases into the chamber interior environment adjacent the substrate support, the gas distribution plate and substrate support defining a substrate processing region therebetween, a hollow reentrant conduit having respective ends opening into the substrate processing region on opposite sides of the gas distribution plate, with the interior of said conduit sharing the interior environment. The conduit is adapted to accept irradiation of processing gases within the conduit to sustain a plasma in a path extending around the conduit interior and across the substrate processing region within the chamber interior environment.

Abstract: The invention provides a system and a method for dynamic RF inductive and capacitive coupling control to improve plasma substrate processing, as well as for achieving contamination and defect reduction. A plasma reactor includes a substrate support disposed in a chamber. An RF coil is disposed adjacent the chamber for inductively coupling RF energy into the chamber. An electrode is disposed adjacent the chamber and has a voltage for capacitively coupling energy into the chamber. The electrode is spaced from the substrate support and the RF coil. An electrode adjusting member is coupled with the electrode for dynamically adjusting the voltage in the electrode to vary the capacitive coupling for improved plasma ignition and plasma stability. A Faraday shield may be placed between the RF coil and the plasma process region in the chamber to suppress capacitive coupling of the RF coil.

Abstract: An antenna adapted to apply a uniform electromagnetic field to a volume of gas and including an input terminal for receiving electrical energy into the antenna and an array of radiating elements connected to the input terminal thereof. In the illustrative embodiment, the antenna has four radiating elements. Each radiating element is a conductor wound in a rectangular spiral shape. Each radiating element is connected to the input terminal on one end and an output terminal on a second end thereof. The input terminal is equidistant from first, second, third and fourth output terminals connected to the first, second, third and fourth radiating elements, respectively. The inventive antenna affords a novel method for plasma processing a device including the steps of: mounting the device within a chamber; providing a gas the chamber; and applying an electromagnetic field to the gas via an array of antenna elements disposed relative to the gas to generate a uniform distribution of the plasma.

Abstract: A multi-chamber system for processing semiconductor wafers with inductively coupled plasma comprises an inductive coil arrangement for plasma generation disposed on dielectric windows of a reaction chamber, in which the inductive coil arrangement includes a plurality of coil units in parallel to each other with a current flowing through in a direction opposite to that of adjacent coil units and a metal ring disposed above each of the coil units to meet a specific impedance. The inductive coil arrangement for plasma generation reduces the capacitive coupling between the inductive coil arrangement and the produced plasma, thereby decreasing the sheath voltage thereof and damages to the wafers during the process with the plasma. In the multi-chamber system, a plurality of working platforms are provided on a susceptor in the reaction chamber such that a plurality of small-size wafers can be simultaneously processed.

Abstract: A spiral-like multi-turn coil excites a plasma for treating a workpiece in a vacuum plasma processor. In one embodiment two of the turns have a discontinuity. Each discontinuity has a capacitor connected across it. An RF source drives the coil via a matching network, an inductor connected to one coil excitation terminal and a capacitor connected to another coil excitation terminal. The impedances of the inductors and the capacitors at the RF source frequency and the discontinuity locations are such as to cause a standing wave voltage of the coil to have (1) equal and opposite values at the coil terminals, (2) sudden amplitude and slope changes, slope reversals and polarity reversals at each of the discontinuities, and (3) three gradual standing wave voltage polarity reversals, spaced from each other by 120°. Two of the gradual polarity reversals are azimuthally aligned with the discontinuities. In a second embodiment, one turn has a discontinuity having a series capacitor connected across it.

Abstract: In certain embodiments a plasma is supplied from a plasma chamber 10 into a reaction chamber 18 of a plasma CVD apparatus. An electrode 22 is disposed in the reaction chamber 18. A semiconductor wafer on which a thin film is to be formed is placed on the electrode 22. A radio-frequency wave is generated by a radio-frequency wave generator 28 and supplied to the electrode 22 via a radio-frequency matching network 30, a blocking capacitor 32, and an RF probe 34 so as to control the plasma in the plasma chamber 10. A judgment device 38 is electrically connected to the RF probe 34. The voltage and current are be measured by the RF probe and the judgment device 38 is used to judge the state of the plasma in the plasma chamber 10.

Abstract: A persistent ionization plasma generator is described that forms a plasma in a cavity that persists for a time after termination of the exciting RF electric field. The plasma generator includes a RF cavity that is in fluid communication with a source of ionizing gas. The RF cavity can be at substantially atmospheric pressure. An RF power source that generates an RF electric field is electromagetically coupled to the RF cavity. An ultraviolet light source is positioned in optical communication to the cavity. An antenna is positioned within the cavity adjacent to the ultraviolet light source. A chamber for confining the plasma can be positioned in the cavity around the antenna.

Abstract: There is provided by this invention a novel inductively coupled plasma source apparatus that utilizes a transformer to induce closed path secondary plasma currents in a hollow metal housing that is directly cooled by a fluid. This plasma source apparatus is particularly useful for generating a high charged particle density source of ions, electrons, and chemically active species to serve various plasma related processes that may require high power densities. A hollow metal vacuum chamber is coupled to and electrically insulated from a metal vacuum process chamber by means of dielectric gaps that are well shielded from direct exposure to the plasma body. Electrons, photons and excited gaseous species are generated within the metal hollow chamber and process chamber to serve a wide variety of material, surface and gas processing applications. There is also provided by this invention a means of ganging together several hollow metal vacuum chamber assemblies about a single vacuum process chamber.

Abstract: A plasma processing apparatus for performing plasma processing of an article, comprising: a central electrode; a tubular outer electrode which is provided so as to surround the central electrode; a tubular reaction pipe which is disposed between the central electrode and the outer electrode so as to electrically insulate the central electrode and the outer electrode from each other; a gas supply device for supplying a plasma producing gas to a discharge space defined between the central electrode and the outer electrode in the reaction pipe; an AC power source for applying an AC voltage between the central electrode and the outer electrode; wherein not only the plasma producing gas is supplied to the discharge space by the gas supply device but the AC voltage is applied between the central electrode and the outer electrode by the AC power source so as to generate a glow discharge in the discharge space under atmospheric pressure such that a plasma jet is blown to the article from a blow-off outlet of the reac

Abstract: A plasma apparatus separately measures multiple plasma jets upstream of where the plasma jets converge into a combined plasma stream. The separate plasma jets can be separately adjusted to place the separate jets in a configuration that provides the combined stream with desired properties for a plasma treatment. The system can include an injector for a neutral jet that becomes part of the combined plasma stream. With an injector, the positions of the plasma jets can be measured relative to the injector so that the plasma jets and the neutral jet are properly aligned to form a combine plasma stream having the properties desired.

Abstract: A toroidal plasma source (28) within a substrate processing chamber (10). The toroidal plasma source forms a poloidal plasma with theta symmetry. The poloidal plasma current is essentially parallel to a surface of the plasma generating structure, thus reducing sputtering erosion of the inner walls. The plasma current is similarly essentially parallel to a process surface (32) of a substrate (34) within the chamber. In a further embodiment, a shaped member (66) between the substrate and the plasma source controls the plasma density in a selected fashion to enhance plasma processing uniformity.

Abstract: A plasma processing system having a plasma source that efficiently couple radiofrequency energy to a plasma within a vacuum processing space of a vacuum chamber. The plasma source comprises a dielectric trough, an inductive element, and a pair of slotted deposition shields. A chamber wall of the vacuum chamber includes an annular opening that receives the dielectric trough. The trough projects into the vacuum processing space to immerse the inductive element within the plasma. The spatial distribution of the RF energy inductively coupled from the inductive element to the plasma may be tailored by altering the slots in the slotted deposition shields, the configuration of the inductive element, and the thickness or geometry of the trough. The efficient inductive coupling of radiofrequency energy is particularly effective for creating a spatially-uniform large-area plasma for the processing of large-area substrates.

Abstract: A plasma torch for vaporizing a molten salt containing a volatile component and a refractory component injects the molten salt into a device that includes a cylindrical shaped outer member and a cylindrical shaped inner member coaxially positioned inside the outer member to surround a chamber. An induction coil positioned between the inner and outer members generates r.f. power which is initially used to vaporize the volatile component of the molten salt to create a carrier gas having an elevated temperature. The carrier gas then heats the refractory component, under an increased vapor pressure from the carrier gas. This action, in turn, breaks down the refractory component of the molten salt into fine droplets. These fine droplets are maintained in the chamber until they also vaporize. In one embodiment, the plasma torch includes a nozzle for spraying droplets of the molten salt into said chamber.

Abstract: A method is described for lighting an inductive plasma in a plasma processing tool having a matching network, at pressures of about 20 mTorr and below. A matching condition for a capacitive plasma is determined, which then is used to define a match preset condition. When a plasma is started with the matching network in that preset condition, a capacitive plasma ignites and is maintained with a minimum of power. Excess power (power greater than that required to maintain the capacitive plasma) transfers the plasma to the inductive mode. The matching condition for the capacitive plasma may be determined by lighting a plasma, setting a power delivered thereto at not more than about 20 watts, and allowing the matching network to tune to the plasma. A capacitive plasma may be easily started at this preset condition. Current produced in the coil due to the excess power then causes the inductive plasma to light.

Abstract: An RF ICP source having a housing with a flanged cover. The interior of the housing serves for confining plasma generated by the plasma source. The cover has at least two openings which are connected by a hollow C-shaped bridge portion which is located outside the housing. The hollow C-shaped bridge portion is embraced by an annular ferrite core having a winding connected to an electric power supply source for generating a discharge current which flows through the bridge portion and through the interior of the housing. The discharge current is sufficient for inducing plasma in the interior of the housing which is supplied with a gaseous working medium. The power source operates on a relatively low frequency of 60 KHz or higher and has a power from several watt to several kilowatt. In order to provide a uniform plasma distribution and uniform plasma treatment, the cover may support a plurality of bridges. Individual control of the inductors on each bridge allows for plasma redistributing.

Abstract: The main purpose of the present invention is to suppress deposition of byproducts on an inner wall of a vacuum chamber during wafer processing using plasma generated by an inductive coupling antenna and an electrostatic capacitive coupling antenna which are connected in series at a connection point. Deposition of byproducts on the inner wall of the vacuum chamber can be suppressed by grounding the connection point of the inductive coupling antenna and the electrostatic capacitive coupling antenna via a variable-impedance load and varying an impedance of the variable-impedance load, thereby controlling a ratio of plasma produced in the chamber by electrostatic capacitive coupling discharge.

Abstract: An improved toroidal low-field plasma source allows plasma ignition within a wider range of gas conditions than permitted by prior art plasma sources. Power efficiency of the plasma source is improved by automatically adjusting the power delivered to the plasma based on the load to the power supply. The plasma source can be operated over a wider pressure range than allowed by prior art plasma sources. The plasma source can be operated so as to increase the output of atomic species from the source. The plasma source can be operated to increase the etch rate of organic materials. The plasma source can efficiently remove hazardous gas compounds from effluent gas streams by converting them into scrubbable products.

Abstract: A high power radio frequency power method of amplifications described in which a variety of amplifiers (60 & 86) may be used to reduce the stress any one amplifier experiences. The power leads (64 & 65) may be arranged in a series to power each amplifier at potentials which are lower than the total potential. Outputs (63) may then be connected in a parallel fashion to combine the power output by the system. A variety of unique stabilization, drive, division, combination, and supply configurations are presented as well as the possibility of utilization and adaptation of the designs for a plasma processing system. An aspect of tiered combining is included such as may be especially appropriate for larger numbers of devices which may include switchmode amplifiers and the like.

Abstract: The present invention generally provides a substrate processing system having a thermally conductive and electrically insulative member coupled to a heated member that provides for heat dissipation from the heated member. In a preferred embodiment, the present invention provides for heat dissipation through thermal conductance of an electrically insulated coil in an IMP reaction chamber.

Abstract: The present invention generally provides a method for processing a semiconductor substrate, wherein the method includes positioning a substrate in a processing chamber having at least a first and second coils positioned above the substrate and supplying a first electrical current to the first coil. The method further includes supplying a second current to the second coil and regulating a current ratio of electrical current supplied to the first and second coils with a power distribution network in communication with the first and second coils and a single power supply.

Abstract: An ion implanting architecture (60). The architecture comprises an arc chamber (64) having an interior area (64i). The architecture also comprises a plurality of electron sources (66, 68) disposed at least partially within the interior area. Each of the plurality of sources comprises a conductive plate (72, 80) operable to emit electrons into the interior area and a heating element (70, 78)for transferring heat to the conductive plate.

Abstract: A device for generating a plasma includes an enclosed chamber and an antenna positioned adjacent the wall of the chamber. A ceramic shield is mounted on the wall, with the antenna located between the wall and the ceramic shield. There is also a barrier that is mounted on the wall with the ceramic shield being between the barrier and the antenna element. An alternating voltage source is provided to energize the antenna element to generate a plasma in the chamber. In operation, the ceramic shield isolates the antenna from the plasma in the chamber, and the barrier prevents the deposition of material components from the plasma on the ceramic shield.

Abstract: A plasma system which is to be coupled to a power source, the plasma system including a chamber defining an internal cavity in which a plasma is generated during operation; a coil which during operation couples power from the power source into the plasma within the chamber, the coil having first and second terminals; a first capacitor which is coupled between the first terminal and a reference potential; and a second capacitor connected to the second terminal and through which the power source is coupled to the second terminal.

Abstract: In a plasma deposition system for depositing a film of sputtered target material on a substrate, the output of an RF generator coupled to a coil for generating a plasma can be varied during the deposition process so that heating and sputtering of the RF coil can be more uniform by “time-averaging” RF voltage distributions along the RF coil.

Abstract: A plasma treatment apparatus having the capability of uniformly treating an object with plasma at a high treatment speed and a plasma treatment method are provided. This apparatus comprises a tubular vessel having a laterally elongated cross section, a pair of electrodes arranged such that electric flux lines develop substantially in an axial direction of the tubular vessel when one of an AC voltage and a pulse voltage is applied between the electrodes, a gas supply for supplying a streamer generation gas into the tubular vessel, a power source for applying the voltage between the electrodes to generate plural streamers of the gas in the tubular vessel, and a plasma uniform means for making the plural streamers uniform in a lateral direction of the laterally elongated cross section of the tubular vessel to provide the plasma from one end of the tubular vessel.

Abstract: A discharge tube (11) made of a dielectric material extends through a hole (3) of a rectangular waveguide (1) and through a coaxial microwave cavity (4) so as to be coaxial with the central axis of the cavity (4). This discharge tube (11) has a double-tube structure including an outer tube (12) and an inner tube (13). The sectional area of an annular gap formed between the outer tube (12) and the inner tube (13) is held constant over the entire length of the inner tube (13). This allows the generation of a stable thermal plasma when a reaction gas containing an organic halide and water vapor is supplied into the outer tube through the annular gap with a microwave transmitted from the rectangular waveguide (1) into the cavity (4).

Abstract: A plasma density information measuring method capable of easily measuring the plasma density information over the long term, a probe for measuring the plasma density information, and a plasma density information measuring apparatus are disclosed. A measuring probe is set such that a tip end of a glass tube of the measuring probe is brought into contact with plasma PM to be measured. High-frequency power sent through a coaxial cable is supplied to the plasma PM from a loop antenna through a wall of the tube, and reflection power of the high-frequency power is received by the loop antenna to obtain a counter frequency variation of reflection coefficient of the high-frequency power. In the obtained reflection coefficient, a portion thereof in which the reflection coefficient is largely reduced is a peak at which strong absorption of high-frequency power is caused due to the plasma density. The plasma density can be obtained from the plasma absorption frequency.

Abstract: An inductively-coupled-plasma-processing apparatus includes a main vessel which is partitioned into an antenna chamber and a process chamber by a partition structure. The antenna chamber includes an RF antenna and the process chamber includes a susceptor on which an LCD glass substrate is placed. The partition structure has a dielectric panel constituted of four segments supported by a cross-shaped supporting bracket. The supporting bracket is suspended from the ceiling of the main vessel by a plurality of suspenders. The supporting bracket is used as a case of a showerhead for supplying a process gas into the process chamber.

Abstract: In a high frequency oscillator system a series oscillator circuit includes a load coil inductively coupled with a plasma generator. A capacitance is in series with the coil between the drain and source terminals of a transistor. A capacitive or inductive feedback responsive to the oscillation is connected to the gate terminal of the transistor. In another embodiment two sections of a series circuit are connected by the load coil, each section including a separate transistor. A first capacitance is connected between the coil and the first transistor drain, and a second capacitance is connected between the coil and the second transistor drain. A first capacitive feedback is connected between the second section and the first transistor gate, and a second capactive feedback is connected between the first section and the second transistor gate.

Abstract: Arranging a linear antenna in a container, and connecting a condenser to a grounding side of the linear antenna, and/or between a plurality of linear antennas, and changing capacity of the condenser, thereby changing high-frequency voltage distribution on the linear antenna and/or on the plurality of linear antennas, and controlling electrostatic coupling between the plasma and the linear antenna and/or the plurality of linear antennas.

Abstract: A plasma processing apparatus for processing a substrate with a plasma is disclosed. The apparatus includes a first RF power source having a first RF frequency, and a process chamber. Further, the apparatus includes a substantially circular antenna operatively coupled to the first RF power source and disposed above a plane defined by the substrate when the substrate is disposed within the process chamber for processing. The substantially circular antenna being configured to induce an electric field inside the process chamber with a first RF energy generated by the first RF power source. The substantially circular antenna including at least a first pair of concentric loops in a first plane and a second pair of concentric loops in a second plane. The first pair of concentric loops and the second pair of concentric loops being substantially identical and symmetrically aligned with one another. The substantially circular antenna forming an azimuthally symmetric plasma inside the process chamber.

Abstract: A wafer processing system is provided. The system includes a wafer handling system for introducing semiconductor wafers into a processing chamber. An oscillator is operatively coupled to an antenna for igniting a plasma within the processing chamber. The plasma and antenna form a resonant circuit with the oscillator, and the oscillator varies an output characteristic associated therewith based on a load change in the resonant circuit during plasma ignition.

Abstract: A system and method for initiating and maintaining a plasma in a chamber, in accordance with the helicon dispersion relation, requires an antenna for radiating RF energy into the chamber. An interferometer, or some similar device, is used in the system to monitor the plasma density level in the chamber, as the plasma is being produced. The plasma density level is then used to control the variable characteristics of the RF energy in accordance with the helicon dispersion relation.

Abstract: A method and apparatus for generating a plasma by inductively coupling electromagnetic energy into the plasma. In one embodiment, first and second antenna coils are disposed about the circumference of the plasma containment area. The first and second antenna coils are relatively spaced along the longitudinal axis of the plasma containment area. A current is generated in the first and second antenna coils. A phase shift regulating network establishes a difference between the phase of the current in the first antenna and the phase of the current in the second antenna. The phase difference corresponds to the phase difference required to launch a helicon wave in the plasma. In a second embodiment, a chamber shield is made of a conductive material and is coupled to the RF source such that the shield functions as an RF antenna. The shield may be coupled in series to a coil surrounding the shield to increase the resultant flux density.

Abstract: A plasma source includes a magnetic field generating unit for generating within a plasma chamber a magnetic field B for electron cyclotron resonance, which has a direction crossing a direction in which the plasma is discharged through a plasma emission aperture. The plasma source is applied to an ion implanting apparatus.

Abstract: Plasma processing is carried out in an apparatus having improved stability and reliability for plasma ignition. The improved plasma ignition characteristics result from a modified RF induction coil. One or more nonresonant sections have been added to the RF power induction coil. The nonresonant sections generate enhanced electric fields for igniting the plasma.

Abstract: The invention relates to an antenna device of a low impedance for generating a large quantity of inductively coupled plasma to process a large size of a specimen with adjustment for a uniform distribution in the density of plasma, comprising: a high frequency power source; a first antenna for receiving the high frequency power supplied from the high frequency power source; and a second antenna connected in parallel with the first antenna for receiving the high frequency power supplied from the high frequency power source, wherein a resonant state is kept between the first and second antennas.

Abstract: A vacuum plasma processor for treating a workpiece with an RF plasma has a plasma excitation coil including interior, intermediate and peripheral portions. The interior and peripheral portions have turns connected to each other and arranged so the magnetic flux density coupled to the plasma by each of the interior and peripheral coil portions exceeds the magnetic flux density coupled to the plasma by the intermediate coil portion. The coil includes two electrically parallel, spiral like windings, each with an interior terminal connected to one output terminal of a matching network and an output terminal connected via a capacitor to another output terminal of the matching network. The capacitor values and the lengths of the windings relative to the plasma RF excitation wavelength are such that current flowing in the coil has maximum and minimum standing wave values in the peripheral and interior coil portions, respectively. The coil and workpiece peripheries have similar rectangular dimensions and geometries.

Abstract: An inductive plasma torch operating at atmospheric pressure is used for wafer or glass substrate processing. Said torch employs a linear type of plasma confinement. This linear torch is particularly suitable for photoresist etching and processes in which it has the advantages of high chemical isotropic etch rate and low plasma damage.

Abstract: A wafer processing chamber 11 includes a wafer support 12, a dielectyric window 13 and coaxial coils 15 and 16 located outside the dielectric window 13 for inducing a plasma within the chamber. A variety of coil/dielectric windows are described together with protocols for their control.

Abstract: In an RF plasma reactor including a reactor chamber with a process gas inlet, a workpiece support, an RF signal applicator facing a portion of the interior of the chamber and an RF signal generator having a controllable RF frequency and an RF signal output coupled to an input of the RF signal applicator, the invention tunes the RF signal generator to the plasma-loaded RF signal applicator by sensing an RF parameter at the RF signal generator or at the RF signal applicator and then adjusting the frequency of the RF signal generator so as to optimize the parameter. The invention further controls the RF signal generator output magnitude (power, current or voltage) by optimizing the value of the same RF parameter or another RF parameter. The reactor preferably includes a fixed tuning circuit between the RF signal generator and the RF signal applicator.

Abstract: A plasma generator is composed of a surface wave resonant cavity and a vacuum cavity. A microwave energy is introduced into the surface wave resonant cavity via a couple hole of the surface wave resonant cavity, thereby causing the surface wave resonant cavity to resonate to bring about an electromagnetic surface wave, which is then guided into the vacuum cavity via a large area quartz or ceramic couple window located at the top of the vacuum cavity, so as to result in the production of a large area planarized plasma by a low pressure gas contained in the vacuum cavity.

Abstract: Plasma processing apparatus frequently incorporates an antenna fed from a power supply and in this invention a power supply feeds a conventional matching circuit (10), which in turn is connected to the primary (11) of a transformer (12). The antenna (15) is coupled across the secondary winding (13) of the transformer (12) and that winding is tapped to ground at (16). This creates a virtual earth (17) near the mid point of the antenna (15) significantly reducing the variation, along the length of the antenna, in the power supplied to the plasma.

Abstract: The present invention provides a plasma source that maintains a low coil voltage in the vicinity of the plasma tube, thereby reducing the capacitive coupling between the coil and the plasma and significantly reducing the erosion from the internal surfaces of the plasma tube. The plasma source generally comprises a coil having a first coil segment and a second coil segment, an RF power source connected to the coil and an enclosure disposed between the first coil segment and the second coil segment. The invention also provides a method for generating a plasma, comprising: disposing an enclosure between a first coil segment and a second coil segment; introducing a gas into the enclosure; and supplying an RF power to the coil segments to excite the gas into a plasma state.

Abstract: A processing system for processing a substrate with a plasma comprises a processing chamber defining a processing space and including a substrate support therein for supporting a substrate in the processing space and a gas inlet for introducing a process gas into said processing space. A plasma source is operable for creating a plasma in the processing space from process gas introduced therein. The plasma source comprises a dielectric window which interfaces with the processing chamber proximate the processing space and an inductive element positioned outside of the chamber and proximate the dielectric window. The inductive element is operable for coupling electrical energy through the dielectric window and into the processing space to create a plasma therein and comprises a variety of alternative designs for providing a dense, uniform plasma.

Abstract: An apparatus for producing a plasma with a direct current. A nonmetallic first electrode, having a first surface and a second surface, has pores formed between the first and second surfaces. A conductive liquid is dispersed within the pores of the nonmetallic first electrode. The conductive liquid provides direct current pathways through the nonmetallic first electrode. A second electrode also has a first surface and a second surface. A direct current source provides a first direct current electrical potential and second direct current electrical potential. A first conductive connector is electrically connected to the direct current source, and is disposed adjacent the first surface of the nonmetallic first electrode. The first conductive connector receives the first direct current electrical potential from the direct current source and provides the first direct current electrical potential to the nonmetallic first electrode.

Abstract: A coil for exciting an r.f. plasma in a vacuum plasma processing chamber includes plural radially and circumferentially extending turns connected between a pair of r.f. excitation terminals. In one embodiment, a drive mechanism varies r.f. field coupling coefficients between different radial and circumferential portions of the coil and the plasma. The drive mechanism includes plural drive shafts which drive different portions of the coil toward and away from the plasma. In a second embodiment, the drive mechanism drives an r.f. shield having at least one moving part for intercepting a portion of an r.f. plasma excitation field derived by the coil.

Abstract: An induction plasma source for integrated circuit fabrication includes an induction coil which defines a generally convex surface. The convex surface may be in the form of a spherical section less than a hemisphere, a paraboloid, or some other smooth convex surface. The windings of the induction coil may be spaced at different intervals in different sections of the coil and may be in multiple layers in at least a portion of the coil. Varying the shape of the coil and the distribution of the coil windings allows the plasma to be shaped in a desired manner.

Abstract: A plasma processing reactor includes a helical resonator including a top plate and a helical coil, the helical coil is made of a metal with a length of &lgr;/4, wherein n is an integer and &lgr; is a wavelength of rf frequency applied to the helical coil. The reactor also includes a plasma process chamber including a wafer holder arranged at a lower position therein and a wafer to be processed is loaded on the wafer holder. The helical resonator has a vertical bar for introducing a gas, the vertical bar is fixed to the top plate of the helical resonator and is connected to a gas inlet port. A partition wall separates the helical resonator and the plasma process chamber. The partition wall includes an outer metal ring, a circular central metal plate, and a doughnut-shaped dielectric plate between the outer metal ring and the central metal plate, the doughnut-shaped dielectric plate having an inner diameter and an outer diameter.